OSFP packaging high-speed optical module structure

Abstract

The invention, which relates to the technical field of the optical module structure, discloses an OSFP packaging high-speed optical module structure comprising a fixing assembly, a connecting assembly, a positioning assembly, a heat dissipation assembly, a receiving end photoelectric chip, and a transmitting end photoelectric chip. The fixing assembly is used as a basic supporting structure of the optical module; the shell is of a cuboid structure and serves as an external protection shell of the optical module, the bottom face of the shell is placed on an external installation face and provides stable support for the whole optical module, the circuit board is a cuboid, is fixedly connected to the inner bottom wall of the shell and is used for connecting and supporting electronic elements, the heat conduction pad is a cuboid, and the heat conduction pad is fixedly connected to the inner bottom wall of the shell and is used for connecting and supporting the electronic elements. And the heat exchanger is tightly attached to the top of the circuit board and is used for efficiently transferring the generated heat to the heat dissipation assembly. According to the invention, the heat dissipation assembly is optimized, all-directional heat dissipation support of the optical module is realized, and the optical module is ensured to stably operate under different temperature conditions from low-temperature starting to high-temperature operation.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module structures, and in particular to an OSFP packaged high-speed optical module structure. Background Art

[0002] With the rapid development of electronic technology, the chip density on the circuit board is getting higher and higher, and the power consumption is also getting higher and higher, which leads to a sharp increase in the heat generated by the chip during operation. When the chip temperature is too high, the performance of its internal components will be affected, and may even cause the chip to fail. The traditional heat dissipation shell has poor heat dissipation effect in a high temperature environment, which makes the chip stay in a high temperature state for a long time, increasing the risk of failure. In order to ensure the normal operation of the chip, the heat must be dissipated in time. The traditional heat dissipation shell is usually made of metal material, and the heat generated by the chip is transferred to the surface of the shell by heat conduction, and then the heat is dissipated into the air by natural convection or forced air cooling. However, this method often does not work well in a high temperature environment because the high temperature environment will slow down the air flow speed and affect the heat dissipation effect. Summary of the invention

[0003] The embodiment of the present application provides an OSFP packaged high-speed optical module structure. In the present invention, the heat dissipation component is optimized to achieve all-round heat dissipation support for the optical module, from low-temperature startup to high-temperature operation, ensuring that the optical module can operate stably under different temperature conditions.

[0004] The embodiment of the present application provides an OSFP packaged high-speed optical module structure, including a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving end optoelectronic chip, and a transmitting end optoelectronic chip; The fixing assembly serves as a basic supporting structure of the optical module; The fixing assembly includes a housing, a circuit board, a thermal pad and a cover plate; The housing is a rectangular parallelepiped structure, serving as the outer protective shell of the optical module, and is made of high-strength, high-thermal-conductivity aluminum alloy material, having excellent corrosion resistance and wear resistance; The bottom surface of the housing is placed on the external mounting surface to provide stable support for the entire optical module. The circuit board is a rectangular body, fixedly connected to the inner bottom wall of the housing, used to connect and support electronic components, and adopts high-performance epoxy resin glass fiber cloth board (FR-4), which has excellent electrical performance and heat resistance; The thermal pad is a rectangular body, which fits tightly on the top of the circuit board and is used to efficiently transfer the generated heat to the heat dissipation component. It is made of high thermal conductivity silicone material and has excellent thermal conductivity and softness. The cover plate is a rectangular body, which is fixedly connected to the top of the housing by screws or other fastening methods, and is used to seal the internal structure of the optical module to prevent dust and moisture from invading. It is made of stainless steel material with high strength and good rust resistance; The heat dissipation component adopts a multi-layer capsule structure; The heat dissipation component includes a first capsule, which is an ellipsoidal body and is filled with calcium chloride hexahydrate as a heat absorption and heat dissipation medium.

[0005] The heat dissipation component further includes a second capsule, a third capsule, a fourth capsule, a fifth capsule and a sixth capsule, each capsule is an ellipsoid, and is wrapped layer by layer to form a multi-level heat dissipation structure; The second capsule, the third capsule, the fourth capsule, the fifth capsule and the sixth capsule are respectively filled with sodium sulfate decahydrate, sodium carbonate decahydrate, copper sulfate pentahydrate, ferrous sulfate heptahydrate and sodium acetate trihydrate. Each capsule absorbs or releases heat through the chemical substances inside it when the temperature changes, thereby enhancing the heat dissipation effect. The capsule is made of a high-strength and high-sealing polymer material, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes while preventing leakage of internal chemical substances; The heat dissipation component also includes thermally conductive silica gel; A thermally conductive silicone is connected between the thermal pad and the first capsule. The thermally conductive silicone is cylindrical and has high thermal conductivity and excellent thermal conductivity and softness. Nickel-titanium memory metal is arranged inside the thermally conductive silicone. The thermally conductive silicone evenly conducts the heat generated inside the optical module to the capsule. The connection component is responsible for signal transmission between the optical module and the external device; The connection components include a mounting board, an electrode array, a high-speed line, a main board and a gold finger terminal; The mounting plate is a rectangular body, which is fixed to the top of the cover plate by screws, and serves as the basic supporting structure of the connecting components. It is made of high-quality aluminum alloy material and has excellent thermal conductivity and mechanical strength; The electrode array is a circular hole array, which is opened on one side of the top of the mounting board and is used to connect with the electrodes of the external device. It is composed of a plurality of gold-plated copper contacts arranged in a circular hole array; The high-speed line is a rectangular body, one end of which is connected to the electrode array, and the other end is connected to the mainboard through internal wiring, which is used to achieve high-speed signal transmission. It uses a low-loss, high-frequency response coaxial cable and has excellent signal transmission performance; The main board is a rectangular body, fixedly connected to the top of the mounting board, on which are arranged complex circuits and components for processing and amplifying the transmitted signals, and is composed of multiple layers of copper foil and glass fiber cloth boards, with a complex circuit and component layout; The gold finger end is arranged on one side of the top of the mainboard, and is used to connect with the slot of the external device to achieve stable signal transmission. It is made of gold-plated copper sheet and has good conductivity and wear resistance. The positioning component is responsible for the transmission and positioning of optical signals inside the optical module; The positioning assembly includes an electrical connection box, a first cavity, a second cavity, an electrode hole, an optical fiber, a connection end and an optical interface; The electrical connection box is a rectangular body, provides internal connection and support for the optical module, is made of high-strength plastic or metal, and has excellent insulation performance and mechanical strength; The first cavity and the second cavity are both opened on one side of the top of the electrical connection box and are rectangular structures, and the electrode hole is opened through the other side of the electrical connection box; The optical fiber is a cylindrical body, one end of which is fixedly connected to the electrical connection box, and the other end is connected to the optical interface through the connection end to form a transmission channel for optical signals. The single-mode or multi-mode optical fiber made of high-purity silica material has excellent transmission performance and anti-bending performance; The connecting end and the optical interface are the connecting end as an extension of the optical fiber, connected to the optical interface through a specific connection method, made of ceramic or metal, and having good optical properties and mechanical strength; The optical interface is a boss-shaped structure used to connect with the optical fiber of external equipment. It is made of precision-machined metal or plastic and has a standardized interface shape and size. The array electrode holes of the electrical connection component box are aligned with the positions of the electrode array, and are connected by welding to achieve conduction of the internal circuit; The first cavity and the second cavity have the same size, and a receiving end optoelectronic chip and a transmitting end optoelectronic chip are connected to the first cavity and the second cavity respectively. The receiving end optoelectronic chip and the transmitting end optoelectronic chip are both made of high-performance optoelectronic conversion materials, and can convert optical signals into electrical signals or convert electrical signals into optical signals, thereby realizing the receiving and transmitting functions of optical signals; The electrical connection box is clamped between the mounting board and the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a three-dimensional structural schematic diagram of an OSFP encapsulated high-speed optical module structural fixing component of the present invention; Figure 2 It is a three-dimensional structural schematic diagram of an OSFP encapsulated high-speed optical module structural connection component of the present invention; Figure 3 It is a three-dimensional structural schematic diagram of an OSFP packaged high-speed optical module structural positioning component of the present invention; Figure 4It is a three-dimensional structural schematic diagram of an OSFP packaged high-speed optical module structure receiving end optoelectronic chip and a transmitting end optoelectronic chip; Figure 5 It is a three-dimensional structural schematic diagram of an OSFP encapsulated high-speed optical module structural housing of the present invention; Figure 6 A schematic diagram of the three-dimensional structure of a heat dissipation component of an OSFP packaged high-speed optical module structure of the present invention; Figure 7 This is a schematic diagram of the bent state structure of the nickel-titanium memory metal of an OSFP packaged high-speed optical module structure of the present invention.

[0007] Figure 8 This is a schematic diagram of the vertical structure of the nickel-titanium memory metal of an OSFP package high-speed optical module structure of the present invention. Fig. 9 This is a schematic diagram of the three-dimensional structure of the heat dissipation component of the OSFP package high-speed optical module structure of the present invention, which includes thermally conductive silicone, nickel-titanium memory metal, and a thermally conductive pad. In the figure: 110, housing; 120, circuit board; 130, thermal pad; 140, cover plate; 210, mounting board; 211, electrode array; 212, high-speed line; 220, main board; 221, gold finger end; 310, electrical connection box; 320, first cavity; 330, second cavity; 340, electrode hole; 350, optical fiber; 360, connection end; 370, optical interface; 410, first capsule; 411, calcium chloride hexahydrate; 420, second capsule; 421, sodium sulfate decahydrate; 430, third capsule; 431, sodium carbonate decahydrate; 440, fourth capsule; 441, copper sulfate pentahydrate; 450, fifth capsule; 451, ferrous sulfate heptahydrate; 460, sixth capsule; 461, sodium acetate trihydrate; 470, thermal conductive silicone; 471, nickel-titanium memory metal; 500, receiving end optoelectronic chip; 600. Transmitter optoelectronic chip. DETAILED DESCRIPTION

[0008] To facilitate the understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0009] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation method.

[0010] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0011] See also Figure 1, which is an OSFP packaged high-speed optical module structure of the present invention; the present application optimizes and improves the heat dissipation component of an OSFP packaged high-speed optical module structure in the prior art, and the first capsule contains calcium chloride hexahydrate. The first capsule serves as the initial heat dissipation unit of the heat dissipation component. The calcium chloride hexahydrate begins to absorb heat in a wide temperature range of 30-117°C, and provides a stable heat dissipation effect for the optical module through the dissolution process. Its low-temperature startup characteristic ensures that the optical module can obtain effective heat dissipation protection at the initial startup, which helps to extend the service life of the chip. The second capsule contains sodium sulfate decahydrate, which begins to absorb heat at 32.4°C, providing further heat dissipation support for the optical module. The heat absorption temperature of sodium sulfate decahydrate is moderate, and it can maintain stable heat dissipation performance when the optical module works in a lower temperature range, ensuring that the chip temperature will not rise excessively. The third capsule contains sodium carbonate decahydrate. Similar to the second capsule, sodium carbonate decahydrate begins to absorb heat at 33.5°C, providing additional heat dissipation support for the optical module. Its slightly higher heat absorption temperature enables the third capsule to continue to play a heat dissipation role when the optical module operates in a slightly higher temperature range, forming a relay with the second capsule to ensure the continuity of the heat dissipation effect. The fourth capsule contains copper sulfate pentahydrate, which begins to decompose and absorb heat in the range of 45-110°C, providing heat dissipation support for the optical module at medium and high temperatures. The wide heat absorption temperature range of copper sulfate pentahydrate enables the heat dissipation component to adapt to a variety of temperature environments, ensuring that the optical module can operate stably under different conditions. The fifth capsule contains ferrous sulfate heptahydrate, which begins to decompose and absorb heat at 56-64°C. It has a strong heat absorption capacity, so that ferrous sulfate heptahydrate can still provide effective heat dissipation when the optical module operates at a higher temperature, ensuring that the chip will not be damaged by overheating. The sixth capsule contains sodium acetate trihydrate as a high-temperature heat dissipation unit of the heat dissipation component. Sodium acetate trihydrate begins to decompose and absorb heat in the range of 58-120°C, providing the main heat dissipation support for the optical module at high temperature. Its high-temperature startup characteristics enable the heat dissipation component to maintain stable heat dissipation performance when the optical module works at extremely high temperatures, ensuring that the optical module can still work normally under high temperature limits. Thermally conductive silicone has excellent thermal conductivity and can quickly transfer the heat generated by the heating element to other heat dissipation components. The thermally conductive silicone is wrapped with nickel-titanium memory metal, which enables it to form a morphological change according to temperature changes, thereby driving the tightness of the attachment between each dielectric layer. The combination of the capsule, thermally conductive silicone and the chemical substances in the capsule realizes all-round heat dissipation support for the optical module. From low-temperature startup to high-temperature operation, each capsule plays its unique role, jointly ensuring that the optical module can operate stably under different temperature conditions. The wide applicable temperature range, efficient heat dissipation performance and stable working performance of the heat dissipation component provide a reliable heat dissipation method for OSFP packaged high-speed optical modules.

[0012] Embodiment 1 like Figures 1 to 5As shown, the embodiment of the present application provides an OSFP packaged high-speed optical module structure, including a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving end optoelectronic chip 500, and a transmitting end optoelectronic chip 600; The fixing assembly serves as a basic supporting structure of the optical module; The fixing assembly includes a housing 110 , a circuit board 120 , a thermal pad 130 , and a cover plate 140 ; The housing 110 is a rectangular parallelepiped structure, serving as an outer protective shell of the optical module, and is made of a high-strength, high-thermal-conductivity aluminum alloy material, having excellent corrosion resistance and wear resistance; The bottom surface of the housing 110 is placed on the external mounting surface to provide stable support for the entire optical module. The circuit board 120 is a rectangular body, fixedly connected to the inner bottom wall of the housing 110, used to connect and support electronic components, and adopts high-performance epoxy resin glass fiber cloth board (FR-4), which has excellent electrical performance and heat resistance; The thermal pad 130 is a rectangular body, which fits tightly on the top of the circuit board 120 and is used to efficiently transfer the generated heat to the heat dissipation component, and has excellent thermal conductivity and softness; The cover plate 140 is a rectangular body, fixedly connected to the top of the housing 110 by screws or other fastening methods, and is used to seal the internal structure of the optical module to prevent dust and moisture from invading. It is made of stainless steel material with high strength and good rust resistance; The heat dissipation component adopts a multi-layer capsule structure; The heat dissipation component includes a first capsule 410, which is an ellipsoidal body. The first capsule 410 is filled with calcium chloride hexahydrate 411 as a heat absorption and heat dissipation medium. The capsule is made of a high-strength and high-sealing polymer material, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes and prevent leakage of internal chemicals; The connection component is responsible for signal transmission between the optical module and the external device; The connection assembly includes a mounting board 210, an electrode array 211, a high-speed line 212, a main board 220 and a gold finger end 221; The mounting plate 210 is a rectangular body, which is fixedly connected to the top of the cover plate 140 by screws, and serves as the basic support structure of the connection assembly. It is made of high-quality aluminum alloy material and has excellent thermal conductivity and mechanical strength; The electrode array 211 is a circular hole array, which is opened on one side of the top of the mounting board 210 and is used to connect with the electrodes of the external device. It is composed of a plurality of gold-plated copper contacts arranged in a circular hole array; The high-speed line 212 is a rectangular body, one end of which is connected to the electrode array 211, and the other end is connected to the main board 220 through internal wiring, and is used to achieve high-speed signal transmission. It uses a low-loss, high-frequency response coaxial cable and has excellent signal transmission performance; The main board 220 is a rectangular body, fixedly connected to the top of the mounting board 210, and is provided with complex circuits and components for processing and amplifying the transmitted signals. It is composed of multiple layers of copper foil and glass fiber cloth board, and has a complex circuit and component layout; The gold finger end 221 is arranged on one side of the top of the mainboard 220, and is used to connect with the slot of the external device to achieve stable signal transmission. It is made of gold-plated copper sheet and has good conductivity and wear resistance; The positioning component is responsible for the transmission and positioning of optical signals inside the optical module; The positioning assembly includes an electrical connection box 310, a first cavity 320, a second cavity 330, an electrode hole 340, an optical fiber 350, a connection end 360 and an optical interface 370; The electrical connection box 310 is a rectangular body, providing internal connection and support for the optical module, and is made of high-strength plastic or metal, with excellent insulation performance and mechanical strength; The first cavity 320 and the second cavity 330 are both opened on one side of the top of the electrical connection box 310 and are rectangular structures. The electrode hole 340 is opened through the other side of the electrical connection box 310. The optical fiber 350 is a cylindrical body, one end of which is fixedly connected to the electrical connection box 310, and the other end is connected to the optical interface 370 through the connection end 360 to form a transmission channel for optical signals. It is made of high-purity silica material and has excellent transmission performance and bending resistance. The connection end 360 and the optical interface 370 are the connection end 360 as an extension of the optical fiber 350, connected to the optical interface 370 by a specific connection method, made of ceramic or metal, and having good optical properties and mechanical strength; The optical interface 370 is a boss-shaped structure, used for docking with the optical fiber 350 of the external device, and is made of precision-machined metal or plastic, with standardized interface shape and size; The array electrode holes 340 of the electrical connection assembly box are aligned one by one with the positions of the electrode array 211, and are connected by welding to achieve conduction of the internal circuit; The first cavity 320 and the second cavity 330 are of the same size. A receiving-end optoelectronic chip 500 and a transmitting-end optoelectronic chip 600 are respectively connected to the first cavity 320 and the second cavity 330. The receiving-end optoelectronic chip 500 and the transmitting-end optoelectronic chip 600 are both made of high-performance photoelectric conversion materials and can convert optical signals into electrical signals or convert electrical signals into optical signals, thereby realizing the functions of receiving and transmitting optical signals. The electrical connection box 310 is clamped between the mounting board 210 and the main board 220.

[0013] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: The first capsule 410 is a packaging structure, and its main function is to package and protect the calcium chloride hexahydrate 411 inside. It provides a closed environment to prevent the calcium chloride hexahydrate 411 from directly contacting the external environment, thereby preventing it from being contaminated or physically damaged. The first capsule 410 is closely attached to the chip or component that needs to dissipate heat to ensure heat conduction efficiency. The first capsule 410 has good thermal conductivity and can quickly transfer the heat generated by the chip to the calcium chloride hexahydrate 411, which helps to speed up the heat absorption process of the calcium chloride hexahydrate 411 and improve the heat dissipation efficiency. The calcium chloride hexahydrate 411 will gradually begin to lose its crystal water at about 30°C. This process is an endothermic process. When the optical module is working, the heat generated by the chip will be transferred to the calcium chloride hexahydrate 411, causing it to gradually lose its crystal water and absorb a large amount of heat. The phase change endothermic method can effectively reduce the temperature of the chip and prevent it from overheating. Since the phase change temperature of calcium chloride hexahydrate 411 is relatively low (about 30°C), it can effectively absorb heat within the normal operating temperature range of the optical module. The temperature regulation mechanism helps to maintain the internal temperature of the optical module stable and improve the reliability and stability of the system. After losing its crystal water, the calcium chloride hexahydrate 411 can be restored to its crystalline hydrate state by heating or other means, thereby realizing recycling. The heat dissipation component can be used for a long time without frequent material replacement, reducing maintenance costs.

[0014] Embodiment 2 In order to further improve the applicability of the OSFP packaged high-speed optical module structure and the convenience of use, the heat dissipation component is optimized and improved in the embodiment of the present application, specifically: like Figure 6 As shown, the heat dissipation assembly further includes a second capsule 420, a third capsule 430, a fourth capsule 440, a fifth capsule 450 and a sixth capsule 460, each of which is an ellipsoidal body, which wraps each other layer by layer to form a multi-level heat dissipation structure; The second capsule 420, the third capsule 430, the fourth capsule 440, the fifth capsule 450 and the sixth capsule 460 are respectively filled with sodium sulfate decahydrate 421, sodium carbonate decahydrate 431, copper sulfate pentahydrate 441, ferrous sulfate heptahydrate 451 and sodium acetate trihydrate 461. Each capsule absorbs or releases heat through the chemical substances inside it when the temperature changes, thereby enhancing the heat dissipation effect. The capsule is made of a high-strength and high-sealing polymer material, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes while preventing leakage of internal chemical substances;

[0015] Through the synergistic effect of multiple capsules, efficient cooling of the continuously working chip is achieved. The heat dissipation component includes a second capsule 420, a third capsule 430, a fourth capsule 440, a fifth capsule 450 and a sixth capsule 460. Each capsule contains specific chemical substances. These substances will gradually absorb heat when reaching their lowest starting temperature, and together provide heat dissipation support for the optical module.

[0016] The second capsule 420 contains sodium sulfate decahydrate 421, which begins to absorb heat and dissolve at 32.4°C, providing initial heat dissipation support for the optical module. Its low-temperature startup characteristic ensures that the optical module can obtain effective heat dissipation effect at the initial startup, which helps to extend the service life of the chip.

[0017] The third capsule 430 contains sodium carbonate decahydrate 431, whose heat absorption starting temperature is 33.5°C, slightly higher than sodium sulfate decahydrate 421, so that the two can work together in a similar temperature range, enhancing the heat dissipation effect in the medium and low temperature range, ensuring that the temperature of the optical module will not rise excessively when it continues to work.

[0018] The fourth capsule 440 contains copper sulfate pentahydrate 441, which absorbs heat and decomposes in the range of 45-110°C, providing heat dissipation support for the optical module at medium and high temperatures. Its wide heat absorption temperature range enables the heat dissipation component to adapt to a variety of temperature environments, ensuring that the optical module can operate stably under different conditions.

[0019] The ferrous sulfate heptahydrate 451 in the fifth capsule 450 begins to decompose and absorb heat at 56-64°C, and has a strong heat absorption capacity. This characteristic enables the ferrous sulfate heptahydrate 451 to still perform excellent heat dissipation effects within a higher temperature range, forming a relay with the fourth capsule 440 to ensure that the optical module can obtain stable heat dissipation support even in the high temperature range.

[0020] The sixth capsule 460 contains sodium acetate trihydrate 461, which absorbs heat and decomposes in the range of 58-120°C, providing the main heat dissipation support for the optical module under high temperature. The high-temperature startup characteristics of sodium acetate trihydrate 461 enable the heat dissipation component to maintain stable heat dissipation performance when the optical module operates at extremely high temperatures, ensuring that the chip will not be damaged due to overheating.

[0021] Through coordinated use, all-round heat dissipation support for optical modules is achieved. From low-temperature startup to high-temperature operation, each capsule plays its unique role, jointly ensuring that the optical module can operate stably under different temperature conditions. The wide applicable temperature range, efficient heat dissipation performance and stable working performance of the heat dissipation components provide reliable heat dissipation effect for OSFP packaged high-speed optical modules.

[0022] Embodiment 3 In order to further improve the applicability of the OSFP packaged high-speed optical module structure and the convenience of use, the heat dissipation component is optimized and improved in the embodiment of the present application, specifically: like Figure 7-8 As shown, the heat dissipation assembly further includes thermally conductive silicone 470; A thermally conductive silicone 470 is connected between the thermally conductive pad 130 and the first capsule 410. The thermally conductive silicone 470 is cylindrical and has excellent thermal conductivity and softness. A nickel-titanium memory metal 471 is disposed inside the thermally conductive silicone 470. The thermally conductive silicone 470 evenly conducts the heat generated inside the optical module to the capsule. Thermally conductive silicone 470 has excellent thermal conductivity and can quickly transfer the heat generated by the heating element to other heat dissipation components. The thermally conductive silicone 470 is wrapped with nickel-titanium memory metal 471, which allows it to change shape according to temperature changes, thereby driving the tightness of adhesion between each dielectric layer, which helps to maintain the best heat dissipation effect at different temperatures. Thermally conductive silicone 470 also plays a sealing and protective role to prevent dust and other impurities from entering the optical module, while protecting the heating element from mechanical damage. Nickel-titanium memory metal 471 has a unique shape memory effect and can return to a preset shape at a specific temperature, so that the thermally conductive silicone 470 can automatically adjust its shape when the temperature changes, thereby optimizing the heat dissipation effect. The nickel-titanium memory metal 471 also has good superelasticity, can withstand large deformation and quickly return to its original shape after unloading, so that the thermal conductive silicone 470 can maintain stable performance when squeezed or stretched. As the temperature inside the optical module changes, the nickel-titanium memory metal 471 will change its shape. This change will drive the change in the tightness of the thermal conductive silicone 470 and the various dielectric layers in contact with it. When the temperature rises, the morphological change of the alloy may increase the contact area and tightness between the thermal conductive silicone 470 and the dielectric layer, thereby improving the heat conduction efficiency; when the temperature drops, the contact area and tightness may be reduced to reduce the heat conduction rate and prevent excessive cooling. The morphological change of the nickel-titanium memory metal 471 may also guide the airflow inside the optical module. When the temperature rises, the morphological change of the alloy may form an airflow channel that is more conducive to heat dissipation, thereby accelerating the dissipation of heat; when the temperature drops, the airflow may be reduced to maintain an appropriate temperature.

[0023] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An OSFP packaged high-speed optical module structure, characterized in that: It comprises a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving end optoelectronic chip (500), and a transmitting end optoelectronic chip (600); The fixing assembly serves as a basic supporting structure of the optical module; The fixing assembly comprises a housing (110), a circuit board (120), a thermal pad (130) and a cover plate (140); The shell (110) is a rectangular parallelepiped structure and serves as an external protective shell of the optical module. The bottom surface of the shell (110) is placed on an external mounting surface to provide stable support for the entire optical module. The circuit board (120) is a rectangular body and is fixedly connected to the inner bottom wall of the shell (110) and is used to connect and support electronic components. The thermal pad (130) is a rectangular body and is tightly fitted on the top of the circuit board (120) and is used to efficiently transfer the generated heat to the heat dissipation component. The cover plate (140) is a rectangular body and is fixedly connected to the top of the shell (110) by screws or other fastening methods, and is used to seal the internal structure of the optical module to prevent dust and moisture from intruding.

2. The OSFP packaged high-speed optical module structure according to claim 1, characterized in that: The heat dissipation component adopts a multi-layer capsule structure; The heat dissipation component comprises a first capsule (410), the first capsule (410) is an ellipsoidal body, and the first capsule (410) is filled with calcium chloride hexahydrate (411) as a heat absorption and heat dissipation medium.

3. The OSFP packaged high-speed optical module structure according to claim 2, characterized in that: The heat dissipation component further comprises a second capsule (420), a third capsule (430), a fourth capsule (440), a fifth capsule (450) and a sixth capsule (460), each capsule being an ellipsoidal body, and being wrapped layer by layer to form a multi-layer heat dissipation structure; The second capsule (420), the third capsule (430), the fourth capsule (440), the fifth capsule (450) and the sixth capsule (460) are respectively filled with sodium sulfate decahydrate (421), sodium carbonate decahydrate (431), copper sulfate pentahydrate (441), ferrous sulfate heptahydrate (451) and sodium acetate trihydrate (461). Each capsule absorbs or releases heat through the chemical substances inside it when the temperature changes, thereby enhancing the heat dissipation effect. The heat dissipation component as a whole is tightly attached to the top of the thermal pad (130), ensuring efficient heat transfer.

4. The OSFP packaged high-speed optical module structure according to claim 3, characterized in that: The heat dissipation component adopts a multi-layer capsule structure; The heat dissipation component also includes thermally conductive silicone (470) A thermally conductive silica gel (470) is connected between the thermally conductive pad (130) and the first capsule (410); the thermally conductive silica gel (470) is cylindrical; nickel-titanium memory metal (471) is arranged inside the thermally conductive silica gel (470); the thermally conductive silica gel (470) evenly conducts heat generated inside the optical module to the capsule.

5. The OSFP packaged high-speed optical module structure according to claim 4, characterized in that: The connection component is responsible for signal transmission between the optical module and the external device; The connection component comprises a mounting board (210), an electrode array (211), a high-speed line (212), a main board (220) and a gold finger terminal (221); The mounting board (210) is a rectangular body, fixedly connected to the top of the cover plate (140) by screws, and serves as a basic support structure for connecting components. The electrode array (211) is a circular hole array, which is provided on one side of the top of the mounting board (210) and is used to connect with the electrodes of an external device. The high-speed line (212) is a rectangular body, one end of which is connected to the electrode array (211), and the other end of which is connected to the main board (220) through internal wiring to achieve high-speed signal transmission. The main board (220) is a rectangular body, which is fixedly connected to the top of the mounting board (210), and is provided with complex circuits and components for processing and amplifying the transmitted signals. The gold finger end (221) is provided on one side of the top of the main board (220) and is used to connect with the slot of the external device to achieve stable signal transmission.

6. The OSFP packaged high-speed optical module structure according to claim 1, characterized in that: The positioning component is responsible for the transmission and positioning of optical signals inside the optical module; The positioning assembly comprises an electrical connection box (310), a first cavity (320), a second cavity (330), an electrode hole (340), an optical fiber (350), a connection end (360), and an optical interface (370); The electrical connection box (310) is a rectangular body, providing internal connection and support for the optical module; the first cavity (320) and the second cavity (330) are both opened on one side of the top of the electrical connection box (310) and are rectangular structures; the electrode hole (340) is opened through the other side of the electrical connection box (310); the optical fiber (350) is a cylindrical body, one end of which is fixedly connected to the electrical connection box (310) and the other end is connected to the optical interface (370) through the connection end (360) to form a transmission channel for optical signals; the connection end (360) and the optical interface (370) are the connection end (360) as an extension of the optical fiber (350), connected to the optical interface (370) through a specific connection method; the optical interface (370) is a boss-shaped structure, used for docking with the optical fiber (350) of an external device.

7. The OSFP packaged high-speed optical module structure according to claim 6, characterized in that: The array electrode holes (340) of the electrical connection component box are aligned one by one with the positions of the electrode array (211), and are connected by welding to achieve conduction of the internal circuit.

8. The OSFP packaged high-speed optical module structure according to claim 6, characterized in that: The first cavity (320) and the second cavity (330) are of the same size, and a receiving end optoelectronic chip (500) and a transmitting end optoelectronic chip (600) are respectively connected to the first cavity (320) and the second cavity (330).

9. The OSFP packaged high-speed optical module structure according to claim 6, characterized in that: The electrical connection box (310) is clamped between the mounting board (210) and the main board (220).

Images