Wafer data analysis method and device, electronic equipment and storage medium

Abstract

The invention provides a wafer data analysis method and device, electronic equipment and a storage medium, and the method comprises the steps: responding to a first touch operation which aims at a coordinate point corresponding to a target wafer on a wafer parameter analysis chart, displaying an on-chip data editing sub-region in a chart configuration region, the on-chip data editing sub-region at least comprises an on-chip statistical position editing box; in response to a second touch operation sent for the on-chip statistical position edit box, a statistical position list of the on-chip statistical position edit box is unfolded, and the statistical position list comprises statistical position entries corresponding to all statistical positions of the target wafer; and determining a to-be-analyzed statistical position to be analyzed at present, and recalculating the analysis value of each wafer based on the data of the chip corresponding to the to-be-analyzed statistical position so as to update the wafer parameter analysis chart. The method is used for providing more comprehensive monitoring data for semiconductor producers so as to improve the production quality.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method, device, electronic device and storage medium for analyzing wafer data. Background Art

[0002] In existing SPC systems, in order to support semiconductor manufacturers to view the data distribution pattern at specific locations, many systems have displayed data distribution through graphical interfaces, allowing users to intuitively understand the changing trends of data. However, existing technologies have certain limitations and can only display chart data at fixed collection point locations, which is not conducive to monitoring and adjusting semiconductor production equipment. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a wafer data analysis method, a wafer data analysis method, an electronic device and a computer-readable storage medium, so as to provide semiconductor manufacturers with more comprehensive monitoring data to improve production quality.

[0004] In a first aspect, the present invention provides a method for analyzing wafer data. The Zone Site interface includes a chart display area and a chart configuration area. The chart display area is used to display a wafer parameter analysis chart. The horizontal axis of the wafer parameter analysis chart is the mark value of the wafer, and the vertical axis of the wafer parameter analysis chart is the standard value of the wafer. The standard value is calculated based on the full statistical position of each wafer. The method includes responding to a first touch operation issued for a coordinate point corresponding to a target wafer on the wafer parameter analysis chart, displaying an on-chip data editing sub-area in the chart configuration area, the on-chip data editing sub-area including at least an on-chip statistical position editing box; responding to a second touch operation issued for the on-chip statistical position editing box, expanding a statistical position list of the on-chip statistical position editing box, the statistical position list including statistical position entries corresponding to all statistical positions of the target wafer; determining the statistical position to be analyzed currently to be analyzed, and recalculating the analysis value of each wafer based on the data of the chip corresponding to the statistical position to be analyzed, so as to update the wafer parameter analysis chart.

[0005] In an optional embodiment, the on-chip statistical position edit box is an on-chip statistical position drop-down box, and the step of expanding the statistical position list of the on-chip statistical position edit box in response to a second touch operation issued to the on-chip statistical position edit box specifically includes: responding to a click operation on the on-chip statistical position drop-down box, expanding the statistical position list of the on-chip statistical position edit box, the statistical position list including statistical position entries and check boxes corresponding to all statistical positions of the target wafer and a confirmation control.

[0006] In an optional implementation, the statistical position to be analyzed is determined in the following manner: responding to a click operation on a check box corresponding to a target statistical position to determine the selection state of the check box; and determining the statistical position to be analyzed based on the selection states of the check boxes corresponding to all statistical positions.

[0007] In an optional implementation, the analysis value of each wafer is recalculated in the following manner: the target parameter values ​​corresponding to all the statistical positions to be analyzed of each wafer are determined; and the mean value among all the target parameter values ​​is calculated as the analysis value.

[0008] In an optional embodiment, the wafer parameter analysis chart is updated in the following manner: for each wafer, the standard value of the wafer on the vertical axis is replaced with the corresponding analysis value to display a new wafer parameter analysis chart in the chart display area.

[0009] In an optional embodiment, the wafer parameter analysis chart is updated in the following manner: the first wafer parameter analysis chart and the second wafer parameter analysis chart are compared and displayed in the same area, wherein the vertical coordinate of the first wafer parameter analysis chart is the standard value of the wafer, and the vertical coordinate of the second wafer parameter analysis chart is the analysis value of the wafer.

[0010] In an optional embodiment, before the step of updating the wafer parameter analysis chart, the method further includes responding to a third touch operation on a determined control.

[0011] In a second aspect, the present invention provides a wafer data analysis device, wherein the Zone Site interface includes a chart display area and a chart configuration area, wherein the chart display area is used to display a wafer parameter analysis chart, wherein the horizontal axis of the wafer parameter analysis chart is a marked value of the wafer, and the vertical axis of the wafer parameter analysis chart is a standard value of the wafer, wherein the standard value is calculated based on the full statistical position of each wafer, and the device includes:

[0012] A first response module is used to respond to a first touch operation issued to a coordinate point corresponding to a target wafer on a wafer parameter analysis chart, and to display an on-chip data editing sub-area in a chart configuration area, wherein the on-chip data editing sub-area includes at least an on-chip statistical position editing box;

[0013] A second response module is used to respond to a second touch operation issued to the on-chip statistical position edit box, expand a statistical position list of the on-chip statistical position edit box, and the statistical position list includes statistical position entries corresponding to all statistical positions of the target wafer;

[0014] The third response module is used to determine the statistical position to be analyzed currently, and recalculate the analysis value of each wafer based on the data of the chip corresponding to the statistical position to be analyzed, so as to update the wafer parameter analysis chart.

[0015] In a third aspect, the present invention provides an electronic device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through the bus, and the processor executes the machine-readable instructions to perform the steps of the wafer data analysis method as described in any of the aforementioned embodiments.

[0016] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the wafer data analysis method in any of the aforementioned embodiments are executed.

[0017] The present application provides a method for analyzing wafer data, the Zone Site interface includes a chart display area and a chart configuration area, the chart display area is used to display a wafer parameter analysis chart, the horizontal axis of the wafer parameter analysis chart is the wafer mark value, the vertical axis of the wafer parameter analysis chart is the standard value of the wafer, and the standard value is calculated based on the full statistical position of each wafer, the method includes responding to the first touch operation issued for the coordinate point corresponding to the target wafer on the wafer parameter analysis chart, displaying the on-chip data editing sub-area in the chart configuration area, the on-chip data editing sub-area at least includes the on-chip statistical position editing box; responding to the second touch operation issued for the on-chip statistical position editing box, expanding the statistical position list of the on-chip statistical position editing box, and the statistical position list includes statistical position entries corresponding to all statistical positions of the target wafer; determining the statistical position to be analyzed currently to be analyzed, and based on the data of the chip corresponding to the statistical position to be analyzed, recalculating the analysis value of each wafer to update the wafer parameter analysis chart. By providing semiconductor manufacturers with a choice of statistical positions on the wafer, and then displaying the corresponding wafer parameter analysis chart, it helps semiconductor manufacturers understand the situation of production equipment and improve processing capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of a process flow of a wafer data analysis method provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of a Zone Site interface provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structure of a wafer data analysis device provided in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] First, the application scenario of the present application is described. The technical solution of the present application is applicable to the Chart function setting in the SPC system in semiconductor production.

[0024] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0025] Figure 1 A flowchart of a wafer data analysis method provided in an embodiment of the present application. Figure 2 A schematic diagram of a Zone Site interface provided in an embodiment of the present application. Figure 2 As shown, the Zone Site interface includes a chart display area and a chart configuration area. The chart display area is used to display the wafer parameter analysis chart. The horizontal axis of the wafer parameter analysis chart is the marked value of the wafer, and the vertical axis of the wafer parameter analysis chart is the standard value of the wafer. The standard value is calculated based on the full statistical position of each wafer.

[0026] It should be noted that the wafer parameter analysis charts here include but are not limited to X Chart, Sigma Chart, Range Chart and other Charts. For example, in the X Chart here, the horizontal coordinate of each coordinate point is a corresponding wafer, and the vertical coordinate of each coordinate point is the average value calculated from the parameter values ​​collected at all statistical positions of the wafer. In the Sigma Chart here, the horizontal coordinate of each coordinate point is a corresponding wafer, and the vertical coordinate of each coordinate point is the standard deviation value calculated from the parameter values ​​collected at all statistical positions of the wafer. In the Range Chart here, the horizontal coordinate of each coordinate point is a corresponding wafer, and the vertical coordinate of each coordinate point is the range value calculated from the parameter values ​​collected at all statistical positions of the wafer.

[0027] like Figure 1 As shown, the present application provides a wafer data analysis method, which specifically includes:

[0028] S1. In response to a first touch operation issued to a coordinate point corresponding to a target wafer on a wafer parameter analysis chart, an in-chip data editing sub-area is displayed in a chart configuration area, wherein the in-chip data editing sub-area includes at least an in-chip statistical position editing box.

[0029] In one embodiment, the user can lock the target wafer by clicking a coordinate point on the Chart, thereby causing the chart configuration area to display an on-chip data editing sub-area, which includes at least an on-chip statistics position editing box.

[0030] The intra-chip data editing sub-area is used for the user to configure the data collection position for generating the Chart. The intra-chip statistics position editing box may be a intra-chip statistics position drop-down box.

[0031] S2. In response to a second touch operation issued to the on-chip statistical position edit box, expand a statistical position list of the on-chip statistical position edit box, wherein the statistical position list includes statistical position entries corresponding to all statistical positions of the target wafer.

[0032] Step S2 specifically includes:

[0033] In response to a click operation on the on-chip statistical position drop-down box, a statistical position list of the on-chip statistical position edit box is expanded. The statistical position list includes statistical position entries and check boxes corresponding to all statistical positions of the target wafer and a confirmation control.

[0034] Each statistical position indicates a location where wafer data is collected. Exemplarily, the statistical position may be a full statistical position, a full outer circle statistical position, a full inner circle statistical position, or an Nth circle statistical position.

[0035] Specifically, the statistical position to be analyzed can be determined in the following ways:

[0036] In response to a click operation on a check box corresponding to a target statistical position, a selection state of the check box is determined. Based on the selection states of the check boxes corresponding to all statistical positions, a statistical position to be analyzed is determined.

[0037] The analysis values ​​for each wafer are recalculated by:

[0038] Determine the target parameter values ​​corresponding to all statistical positions to be analyzed for each wafer. Calculate the mean value between all target parameter values ​​as the analysis value.

[0039] Users can check the positions where statistics need to be performed according to actual needs. For example, the current statistical position to be analyzed can be the full inner circle statistical position, and when the Chart is the average length value of the wafer, it is necessary to collect the length values ​​of all inner circle chips of each wafer, calculate the average value as the analysis value, and form an X Chart.

[0040] S3. Determine the statistical position to be analyzed currently, and recalculate the analysis value of each wafer based on the data of the chip corresponding to the statistical position to be analyzed, so as to update the wafer parameter analysis chart.

[0041] In a specific embodiment, the user can configure the statistical position to be analyzed by checking or unchecking the check box corresponding to the statistical position in the statistical position list.

[0042] Before the step of updating the wafer parameter analysis chart, the method further includes responding to a third touch operation on the confirmation control. The user may click the confirmation control, which may trigger step S3 to update the wafer parameter analysis chart displayed in the chart display area.

[0043] Specifically, the analysis value of each wafer can be recalculated in the following way:

[0044] Determine the target parameter values ​​corresponding to all statistical positions to be analyzed for each wafer. Calculate the mean value between all target parameter values ​​as the analysis value.

[0045] Taking X Chart as an example, an X Chart can be regenerated based on the target parameter value corresponding to each wafer.

[0046] This makes it easy for users to view production quality trends and analysis data for semiconductor production equipment. In this way, users can quickly switch between different locations, obtain business-related chart information, and analyze this data to determine any unstable patterns or abnormalities.

[0047] In another embodiment of the present application, the wafer parameter analysis chart may also be updated in the following manner:

[0048] The first wafer parameter analysis chart and the second wafer parameter analysis chart are compared and displayed in the same area, wherein the ordinate of the first wafer parameter analysis chart is the standard value of the wafer, and the ordinate of the second wafer parameter analysis chart is the analysis value of the wafer.

[0049] It is understandable that the first wafer parameter analysis chart and the second wafer parameter analysis chart can be displayed in different colors, so that the user can identify which areas of the semiconductor production equipment may have insufficient processing capacity by comparing processing data from different areas.

[0050] In a specific embodiment, the first wafer parameter analysis chart is calculated for the outer ring Site of the wafer, and the second wafer parameter analysis chart is calculated for the inner ring Site of the wafer. By comparing the data of the two charts, it is found that the outer ring deviation is large and exceeds the set deviation range. The value of the inner ring Site is compared with the process target value of this section. The error is within the set deviation allowable range. It can be concluded that the position processing of the outer ring Site is unstable. According to the conclusion, corresponding measures can be taken and relevant positions can be checked, such as adjusting machine parameters, performing maintenance or repairs, to improve processing capabilities and improve production efficiency.

[0051] Figure 3 A schematic diagram of the structure of a wafer data analysis device provided in an embodiment of the present application. Based on the same inventive concept, an analysis device for wafer data is also provided in an embodiment of the present application. The device 30 includes:

[0052] The first response module 310 is used to respond to the first touch operation issued to the coordinate point corresponding to the target wafer on the wafer parameter analysis chart, and display the on-chip data editing sub-area in the chart configuration area, where the on-chip data editing sub-area at least includes an on-chip statistics position editing box;

[0053] The second response module 320 is used to respond to the second touch operation issued to the on-chip statistical position edit box, expand the statistical position list of the on-chip statistical position edit box, and the statistical position list includes statistical position entries corresponding to all statistical positions of the target wafer;

[0054] The third response module 330 is used to determine the statistical position to be analyzed currently, and recalculate the analysis value of each wafer based on the data of the chip corresponding to the statistical position to be analyzed, so as to update the wafer parameter analysis chart.

[0055] In an optional embodiment, the second response module 320 is specifically used to respond to a click operation on the on-chip statistical position drop-down box, expand the statistical position list of the on-chip statistical position edit box, and the statistical position list includes statistical position entries and check boxes corresponding to all statistical positions of the target wafer and a confirmation control.

[0056] In an optional embodiment, the third response module 330 determines the statistical position to be analyzed currently in the following manner: responding to a click operation on a check box corresponding to a target statistical position to determine the selection state of the check box; and determining the statistical position to be analyzed currently based on the selection states of the check boxes corresponding to all statistical positions.

[0057] In an optional embodiment, the third response module 330 recalculates the analysis value of each wafer in the following manner: determining the target parameter values ​​corresponding to all the statistical positions to be analyzed of each wafer; and calculating the mean value among all the target parameter values ​​as the analysis value.

[0058] In an optional embodiment, the third response module 330 updates the wafer parameter analysis chart in the following manner: for each wafer, the standard value of the wafer on the vertical axis is replaced with the corresponding analysis value to display a new wafer parameter analysis chart in the chart display area.

[0059] In an optional embodiment, the third response module 330 updates the wafer parameter analysis chart by comparing the first wafer parameter analysis chart and the second wafer parameter analysis chart and displaying them in the same area, wherein the vertical coordinate of the first wafer parameter analysis chart is the standard value of the wafer, and the vertical coordinate of the second wafer parameter analysis chart is the analysis value of the wafer.

[0060] In an optional embodiment, before the step of updating the wafer parameter analysis chart, the third response module 330 is further configured to respond to a third touch operation on the determined control.

[0061] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 As shown in , the electronic device 400 includes a processor 410 , a memory 420 and a bus 430 .

[0062] The memory 420 stores machine-readable instructions executable by the processor 410. When the electronic device 400 is running, the processor 410 communicates with the memory 420 via the bus 430. When the machine-readable instructions are executed by the processor 410, the steps of a method for calculating the output torque of a vehicle in the above-mentioned method embodiment can be executed. The specific implementation method can be found in the method embodiment, which will not be repeated here.

[0063] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the computer program can execute the above-mentioned Figure 1 The steps of a method for calculating the output torque of a vehicle in the method embodiment shown are specifically implemented in accordance with the method embodiment and will not be described in detail here.

[0064] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0065] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0066] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0067] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0068] It should be noted that if the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM) random access memory (RAM), disk or optical disk, and other media that can store program codes.

[0069] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0070] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for analyzing wafer data, wherein the Zone Site interface includes a chart display area and a chart configuration area, wherein the chart display area is used to display a wafer parameter analysis chart, wherein the horizontal axis of the wafer parameter analysis chart is a wafer mark value, and the vertical axis of the wafer parameter analysis chart is a standard value of the wafer, wherein the standard value is calculated based on the full statistical position of each wafer, and wherein: The method comprises: In response to a first touch operation issued on a coordinate point corresponding to a target wafer on a wafer parameter analysis chart, displaying an on-chip data editing sub-area in the chart configuration area, the on-chip data editing sub-area including at least an on-chip statistical position editing box; In response to a second touch operation issued to the on-chip statistical position edit box, expanding a statistical position list of the on-chip statistical position edit box, the statistical position list including statistical position entries corresponding to all statistical positions of the target wafer; The statistical position to be analyzed currently is determined, and based on the data of the chip corresponding to the statistical position to be analyzed, the analysis value of each wafer is recalculated to update the wafer parameter analysis chart.

2. The method according to claim 1, characterized in that The on-chip statistical position edit box is an on-chip statistical position drop-down box, and the step of expanding the statistical position list of the on-chip statistical position edit box in response to the second touch operation issued to the on-chip statistical position edit box specifically includes: In response to a click operation on the on-chip statistical position drop-down box, a statistical position list of the on-chip statistical position edit box is expanded, wherein the statistical position list includes statistical position entries and check boxes corresponding to all statistical positions of the target wafer and a confirmation control.

3. The method according to claim 2, characterized in that Determine the current statistical position to be analyzed by the following methods: Responding to a click operation on a check box corresponding to a target statistical position to determine a selection state of the check box; Based on the selection states of the check boxes corresponding to all statistical positions, the statistical position to be analyzed is determined.

4. The method according to claim 1, characterized in that The analysis values ​​for each wafer are recalculated by: Determine the target parameter values ​​corresponding to all statistical positions to be analyzed for each wafer; The mean among all target parameter values ​​is calculated as the analysis value.

5. The method according to claim 4, characterized in that Update the wafer parameter analysis chart by: For each wafer, the standard value of the wafer on the vertical axis is replaced with the corresponding analysis value to display a new wafer parameter analysis chart in the chart display area.

6. The method according to claim 4, characterized in that Update the wafer parameter analysis chart by: The first wafer parameter analysis chart and the second wafer parameter analysis chart are compared and displayed in the same area, wherein the ordinate of the first wafer parameter analysis chart is the standard value of the wafer, and the ordinate of the second wafer parameter analysis chart is the analysis value of the wafer.

7. The method according to claim 3, characterized in that Before the step of updating the wafer parameter analysis chart, the method further includes responding to a third touch operation on the determination control.

8. A wafer data analysis device, wherein the Zone Site interface includes a chart display area and a chart configuration area, wherein the chart display area is used to display a wafer parameter analysis chart, wherein the horizontal axis of the wafer parameter analysis chart is a wafer mark value, and the vertical axis of the wafer parameter analysis chart is a standard value of the wafer, wherein the standard value is calculated based on the full statistical position of each wafer, and wherein: The device comprises: A first response module, configured to respond to a first touch operation issued to a coordinate point corresponding to a target wafer on a wafer parameter analysis chart, and to display an on-chip data editing sub-area in the chart configuration area, wherein the on-chip data editing sub-area includes at least an on-chip statistical position editing box; A second response module is used to respond to a second touch operation issued to the on-chip statistical position edit box, and expand a statistical position list of the on-chip statistical position edit box, wherein the statistical position list includes statistical position entries corresponding to all statistical positions of the target wafer; The third response module is used to determine the statistical position to be analyzed currently, and recalculate the analysis value of each wafer based on the data of the chip corresponding to the statistical position to be analyzed, so as to update the wafer parameter analysis chart.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the memory via the bus, and the processor executes the machine-readable instructions to perform the steps of the wafer data analysis method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer data analysis method according to any one of claims 1 to 7 are executed.

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