Thermal strain simulation modeling method, device and equipment of foil strain gauge and medium

Abstract

The embodiment of the invention discloses a thermal strain simulation modeling method, device and equipment of a foil strain gauge and a medium. The method comprises the following steps: constructing a simulation software model of the foil type strain gauge according to parameters of the foil type strain gauge, and extracting simulation application parameters of the foil type strain gauge according to the simulation software model; according to the simulation application parameters and the calibration application parameters of the foil type strain gauge, adjusting the structural information of the foil type strain gauge; outputting the parameters of the foil type strain gauge after the structural information is adjusted so as to construct a thermal-mechanical coupling hardware model of the foil type strain gauge in combination with the thermal strain application parameters of the foil type strain gauge; and acquiring a simulation strain value of the thermal-mechanical coupling hardware model as a final strain value of the foil strain gauge. According to the method, simulation modeling is carried out on the foil type strain gauge, the structure of the foil type strain gauge is adjusted so that the foil type strain gauge can reach the calibration condition, the actual strain value of the foil type strain gauge can be consistent with the simulation result under the special scene such as the high-temperature condition, and the accuracy of the foil type strain gauge is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a thermal strain simulation modeling method, device, equipment and medium for a foil strain gauge. Background Art

[0002] Foil strain gauges are widely used in stress and strain measurement of bridges, building structures, and mechanical parts. Pasting foil strain gauges on the surface of the object to be monitored can monitor the deformation of the object in real time, which is of great significance for ensuring structural safety and improving product quality.

[0003] Since foil strain gauges have a small lateral effect and are more accurate in measuring the strain of small objects, foil strain gauges are also widely used in precision measurement. For example, in printed circuit board assembly (PCBA), wire resistance strain gauges have been gradually replaced by foil resistance strain gauges to achieve chip accuracy.

[0004] However, in the actual thermal strain test measurement, due to the influence of various factors (such as the effect of pasting) in certain scenarios such as high temperature, the actual measured strain value deviates greatly from the simulation result, resulting in poor accuracy of the foil strain gauge measurement result. Therefore, it is urgent to provide a thermal strain simulation modeling method for foil strain gauges to ensure the strain accuracy of foil strain gauges in PCBA. Summary of the invention

[0005] The present invention provides a thermal strain simulation modeling method, device, equipment and medium for a foil strain gauge to improve the strain accuracy of the foil strain gauge in special scenarios.

[0006] According to one aspect of the present invention, a thermal strain simulation modeling method for a foil strain gauge is provided, the method comprising:

[0007] According to the foil strain gauge parameters, construct a simulation software model of the foil strain gauge, and extract simulation application parameters of the foil strain gauge according to the simulation software model;

[0008] Adjusting the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge;

[0009] Output the foil strain gauge parameters adjusted by the structural information, and build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge;

[0010] The simulated strain value of the thermal-mechanical coupling hardware model is obtained as the final strain value of the foil strain gauge.

[0011] According to another aspect of the present invention, a thermal strain simulation modeling device for a foil strain gauge is provided, the device comprising:

[0012] A simulation application parameter determination module, used to construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract the simulation application parameters of the foil strain gauge according to the simulation software model;

[0013] A structural information adjustment module, used for adjusting the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge;

[0014] An information output module is used to output the foil strain gauge parameters after the structural information is adjusted, so as to build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge;

[0015] The final strain value determination module is used to obtain the simulated strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge.

[0016] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0017] at least one processor; and

[0018] a memory communicatively connected to the at least one processor; wherein,

[0019] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the thermal strain simulation modeling method of the foil strain gauge described in any embodiment of the present invention.

[0020] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the thermal strain simulation modeling method of a foil strain gauge according to any embodiment of the present invention when executed.

[0021] According to another aspect of the present invention, a computer program product is provided, comprising a computer program, wherein when the computer program is executed by a processor, the method for thermal strain simulation modeling of a foil strain gauge according to any embodiment of the present invention is implemented.

[0022] The technical solution of the embodiment of the present invention is to construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract the simulation application parameters of the foil strain gauge according to the simulation software model; adjust the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge; output the foil strain gauge parameters after the structural information adjustment, and construct a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge; obtain the simulation strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge, thereby solving the problem of inaccurate strain value of the foil strain gauge in PCBA application, and by simulating and modeling the foil strain gauge, adjusting the structure of the foil strain gauge to achieve the calibration state, so that the actual strain value of the foil strain gauge in special scenarios such as high temperature conditions can be consistent with the simulation result, thereby improving the accuracy of the foil strain gauge.

[0023] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a flow chart of a thermal strain simulation modeling method of a foil strain gauge provided in an embodiment of the present invention;

[0026] Figure 2 It is a schematic diagram of a plane structure of a sensitive grid of a foil-type resistance strain gauge provided in an embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of an application structure of a foil resistance strain gauge provided in an embodiment of the present invention;

[0028] Figure 4 is a flow chart of another thermal strain simulation modeling method of a foil strain gauge provided according to an embodiment of the present invention;

[0029] Figure 5 is a structural schematic diagram of a thermal strain simulation modeling device for a foil strain gauge provided according to an embodiment of the present invention;

[0030] Figure 6 It is a structural schematic diagram of an electronic device for implementing the thermal strain simulation modeling method of a foil strain gauge according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] Figure 1 This is a flow chart of a thermal strain simulation modeling method for a foil strain gauge according to an embodiment of the present invention. This embodiment can be applied to the situation of improving the strain accuracy of the foil strain gauge in PCBA thermal stress measurement. The method can be executed by a thermal strain simulation modeling device for a foil strain gauge. The thermal strain simulation modeling device for a foil strain gauge can be implemented in the form of hardware and / or software. The thermal strain simulation modeling device for a foil strain gauge can be configured in an electronic device such as a computer. Figure 1 As shown, the method includes:

[0034] Step 110: construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract simulation application parameters of the foil strain gauge according to the simulation software model.

[0035] Among them, the foil strain gauge parameters can be the parameters of the foil strain gauge structure itself. In PCBA applications, foil strain gauges can specifically refer to foil resistance strain gauges. Foil resistance strain gauges are mainly composed of substrates, foil grids (sensitive grids), adhesives, lead wires, and covering layers.

[0036] For example, Figure 2 FIG. 1 is a schematic diagram of a plane structure of a foil resistance strain gauge sensitive grid provided according to an embodiment of the present invention. Figure 2As shown, 101 and 102 are lead electrodes of the foil resistance strain gauge, which are used for test line connection. 103 and 104 are test lines, such as silver-plated copper wires, with a diameter ф in the range of [0.2mm, 2mm]. 105 and 106 are sensitive grid units. The entire sensitive grid of the foil strain gauge is composed of several 106 sensitive grid units and two 105 sensitive grid units. The total resistance value of each sensitive grid unit is 120ohm. Figure 2 In the embodiment, the sensitive gate structure is made of constantan (Cu55 / Ni45) material, with a resistivity of ρ = 0.45-0.52ohm-mm2 / m, a resistance temperature coefficient α = ±20e-6 / °C, and a linear expansion coefficient β = 15e-6 / °C. The thickness of the sensitive gate structure is 20um-50um, and the specific thickness is obtained by slice measurement.

[0037] Figure 3 Schematic diagram of an application structure of a foil resistance strain gauge provided according to an embodiment of the present invention. Figure 3 As shown, 201 is a plan view of the object to be measured, 202 is a foil resistance strain gauge, which contains adhesive. The foil resistance strain gauge 202 is set on the object to be measured 201. 207 is a cross-sectional view of the object to be measured. 203 is a foil resistance strain gauge cover layer, 204 is a sensitive grid, 205 is a substrate, and 206 is an adhesive. Among them, the foil resistance strain gauge cover layer 203 and the substrate 205 can be made of polyamide material, the sensitive grid 204 is a constantan material, and the adhesive 206 is polyamide or other commonly used materials.

[0038] In PCBA, a foil resistance strain gauge computer-aided design (CAD) structure for PCBA thermal stress measurement can be established by slice measurement, thereby obtaining foil strain gauge parameters. According to the foil strain gauge parameters, a simulation software model of the foil strain gauge can be constructed based on electrical simulation software. The embodiment of the present invention does not limit the electrical simulation software.

[0039] For example, using Figure 2The foil resistance strain gauge sensitive grid shown in the figure is sliced ​​and measured, and the obtained foil strain gauge parameters include but are not limited to: the foil resistance strain gauge is made of constantan material, with a nominal resistance range of 120±1ohm and a nominal sensitivity factor (K factor) of 2±0.1; the foil resistance strain gauge sensitive grid length is 0.25-1mm and a thickness of 20um-50um; the base length is 1.0mm-3mm, the base width is 1.0-3mm, and the thickness is 10um-30um; the covering layer length is 1.0mm-3mm, the covering layer width is 1.0-3mm, and the thickness is 10um-30um. The adhesive used for pasting the foil resistance strain gauge is 1.5mm-5mm long after curing, 1.5mm-5mm wide after curing, and 10um-20um thick. According to the foil strain gauge parameters obtained by the above-mentioned slice measurement, a simulation software model of the foil strain gauge can be constructed based on the electrical simulation software.

[0040] In practical applications, since adhesives have a significant impact on the strain value of foil strain gauges, adhesives and lead wires may not be included in the foil strain gauge parameters when performing simulation software models. That is, adhesives and lead wires are not included in the simulation software model. However, adhesives and lead wires need to be included in practical applications. That is, adhesives and lead wires are included in the thermal-mechanical coupling hardware model of foil strain gauges.

[0041] In an embodiment of the present invention, the simulation application parameter may be a parameter of the established simulation software model of the foil strain gauge when performing thermal strain simulation. The simulation application parameter may be directly extracted from the simulation software model of the foil strain gauge. The simulation application parameter includes but is not limited to a resistance value, a sensitivity coefficient (K value), and a thermal output curve. Specifically, the simulation application parameter may be one of the resistance value, the sensitivity coefficient (K value), and the thermal output curve, or a combination of multiple thereof.

[0042] For example, the strain grid simulation resistance value of the foil strain gauge can be extracted according to the electrical coupling model in the simulation software model. The simulation sensitivity coefficient of the foil strain gauge can be extracted according to the thermo-mechanical coupling basic model in the simulation software model. Based on the simulation software model, a thermo-mechanical coupling application model of the foil strain gauge can be further constructed. In the thermo-mechanical coupling application model, the strain value is extracted by changing the temperature to obtain a simulated thermal output curve.

[0043] Step 120: Adjust the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge.

[0044] The main function of this step is to adjust the structural information of the foil strain gauge so that the simulation application parameters are consistent with the calibration application parameters, or within a certain error range. Exemplarily, by adjusting the first structural information of the foil strain gauge, the strain grid simulation resistance value can reach the calibrated resistance value of the foil strain gauge. By adjusting the second structural information of the foil strain gauge, the simulation sensitivity coefficient can reach the calibrated sensitivity value of the foil strain gauge. By adjusting the third structural information of the foil strain gauge, the simulation thermal output curve can reach the calibrated thermal output curve of the foil strain gauge.

[0045] In an optional implementation of the embodiment of the present invention, a simulation software model of the foil strain gauge is constructed according to the foil strain gauge parameters, and simulation application parameters of the foil strain gauge are extracted according to the simulation software model, including: constructing an electrical coupling model of the foil strain gauge according to the foil strain gauge parameters; and obtaining a strain grid simulation resistance value of the foil strain gauge according to the electrical coupling model; adjusting structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge, including: performing a first structural information adjustment on the foil strain gauge according to the strain grid simulation resistance value and the calibration resistance value of the foil strain gauge.

[0046] Among them, the electrical coupling model is an electrical simulation model constructed by electrical simulation software based on the parameters of the foil strain gauge. The electrical coupling model is mainly used to verify the consistency between the resistance value of the foil resistance strain gauge and the nominal value of the product. That is, the electrical coupling model mainly performs resistance simulation on the foil resistance strain gauge. The embodiment of the present invention does not limit the electrical simulation software used. For example, the electrical coupling model can be constructed by a three-dimensional simulation tool. The strain grid simulation resistance value of the foil strain gauge can be directly extracted in the electrical coupling model.

[0047] The first structural information of the foil strain gauge can be adjusted according to the strain grating simulation resistance value of the foil strain gauge, so that the strain grating simulation resistance value is consistent with the calibrated resistance value of the foil strain gauge, or is within a certain error range.

[0048] Optionally, adjusting the first structural information of the foil strain gauge according to the strain grating simulation resistance value and the calibrated resistance value of the foil strain gauge includes: adjusting the strain grating thickness of the foil strain gauge according to the strain grating simulation resistance value and the calibrated resistance value of the foil strain gauge. By adjusting the strain grating thickness of the foil strain gauge, the strain grating simulation resistance value can be made consistent with the calibrated resistance value of the foil strain gauge, or within a certain error range, so as to improve the resistance accuracy of the foil strain gauge in actual application, thereby improving the strain accuracy.

[0049] In an optional implementation of the embodiment of the present invention, a simulation software model of the foil strain gauge is constructed according to the foil strain gauge parameters, and simulation application parameters of the foil strain gauge are extracted according to the simulation software model, including: constructing a thermal-mechanical coupling basic model of the foil strain gauge according to the foil strain gauge parameters; and obtaining a simulation sensitivity coefficient of the foil strain gauge according to the thermal-mechanical coupling basic model; adjusting structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge, including: performing a second structural information adjustment on the foil strain gauge according to the simulation sensitivity coefficient and the calibration sensitivity value of the foil strain gauge.

[0050] The thermal-mechanical coupling basic model structure consists of a substrate, a sensitive grid, and a covering layer, and does not include leads and adhesives. The thermal-mechanical coupling basic model is mainly used to verify the consistency of the foil resistance strain gauge K factor and the thermal output characteristic curve with the actual foil resistance strain gauge average thermal output characteristic curve. The thermal-mechanical coupling basic model can be implemented by mechanical structure mechanics simulation software based on the foil strain gauge parameters. The embodiment of the present invention does not limit the mechanical structure mechanics simulation software used.

[0051] The sensitivity coefficient is defined as Wherein, ΔR is the resistance change value during thermal strain; R is the calibrated resistance value of the foil strain gauge, for example, 120 ohm or other standard values. ε is the axial strain value of the strain grid. The simulation sensitivity coefficient of the foil strain gauge can be calculated in the thermal-mechanical coupling basic model through the definition of the sensitivity coefficient. Before determining the simulation sensitivity coefficient of the foil strain gauge, the first structural information of the foil strain gauge can be adjusted so that the simulation resistance value of the strain grid reaches the calibrated resistance value of the foil strain gauge, which can improve the accuracy of the determination of the simulation sensitivity coefficient of the foil strain gauge.

[0052] According to the simulated sensitivity coefficient of the foil strain gauge, the foil strain gauge can be adjusted according to the second structural information to achieve the calibrated sensitivity value of the foil strain gauge, thereby improving the accuracy of the foil strain gauge in terms of sensitivity and further improving the strain accuracy.

[0053] Optionally, adjusting the second structural information of the foil strain gauge according to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge includes: adjusting the cover layer and the base material of the foil strain gauge according to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge. By adjusting the cover layer and the base material of the foil strain gauge, the simulation sensitivity coefficient can reach the calibrated sensitivity value of the foil strain gauge.

[0054] In an optional implementation of the embodiment of the present invention, a simulation software model of the foil strain gauge is constructed according to the foil strain gauge parameters, and the simulation application parameters of the foil strain gauge are extracted according to the simulation software model, including: constructing a thermal-mechanical coupling application model of the foil strain gauge according to the foil strain gauge parameters and the thermal strain application parameters of the foil strain gauge; obtaining the strain value of the thermal-mechanical coupling application model at different given temperatures to obtain a simulated thermal output curve; adjusting the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge, including: performing a third structural information adjustment on the foil strain gauge according to the simulation thermal output curve and the calibration thermal output curve of the foil strain gauge.

[0055] Among them, the thermo-mechanical coupling application model structure is composed of a substrate, a sensitive grid, a covering layer, an adhesive and a lead. The thermo-mechanical coupling application model can be constructed on the basis of the thermo-mechanical coupling basic model in combination with the actual pasting process (thermal strain application parameters). The thermal strain application parameters may include but are not limited to the specific parameter information of the PCBA board, the adhesive and the lead. Among them, the adhesive may correspond to the calibrated sensitivity value of the foil strain gauge. The thermo-mechanical coupling application model can also be constructed using mechanical structure mechanics simulation software. When constructing the thermo-mechanical coupling application model, the foil strain gauge can be first adjusted for the first structural information so that the strain grid simulation resistance value reaches the calibrated resistance value of the foil strain gauge; and the foil strain gauge can be adjusted for the second structural information so that the simulation sensitivity coefficient reaches the calibrated sensitivity value of the foil strain gauge; the accuracy of the simulated thermal output curve of the foil strain gauge can be improved.

[0056] Based on the foil strain gauge after the first structural information adjustment and the second structural information adjustment, a thermal-mechanical coupling application model can be constructed, and the strain value of the thermal-mechanical coupling application model can be obtained at different given temperatures to obtain a simulated thermal output curve. By adjusting the foil strain gauge for the third structural information, the simulated thermal output curve can reach the calibrated thermal output curve of the foil strain gauge to improve the strain accuracy of the foil strain gauge.

[0057] Optionally, adjusting the third structural information of the foil strain gauge according to the simulated heat output curve and the calibrated heat output curve of the foil strain gauge includes: adjusting the thickness of the adhesive of the foil strain gauge according to the simulated heat output curve and the calibrated heat output curve of the foil strain gauge. By adjusting the thickness of the adhesive of the foil strain gauge, the simulated heat output curve can reach the calibrated heat output curve of the foil strain gauge.

[0058] Among them, the fine-tuning adhesive thickness is due to the uneven structure of the adhesive layer in the actual process, and the corresponding simulation adhesive thickness is the equivalent average thickness of the adhesive in the bonding process. Then, the foil strain gauge is given different link heating temperatures, and the thermal-mechanical coupling simulation verification is carried out to obtain the thermal strain value of the strain grid under different ambient temperatures, draw the temperature-strain curve, and obtain the simulated thermal output curve to achieve the calibrated thermal output curve of the foil strain gauge. Among them, the thermal-mechanical coupling application model is under free thermal expansion conditions.

[0059] Step 130 : Output the foil strain gauge parameters after the structural information is adjusted, so as to construct a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge.

[0060] The thermo-mechanical coupling hardware model is a hardware simulation model constructed based on the actual simulation object, the adjusted foil strain gauge, and the adhesive. That is, in the thermo-mechanical coupling hardware model, the adjusted foil strain gauge needs to be pasted on the PCBA board through the adhesive to form the hardware simulation structure of the actual application.

[0061] When the foil strain gauge is subjected to the thermo-mechanical coupling hardware model, if the adhesive used is different, the foil strain gauge needs to be re-verified, that is, the third structure information is adjusted so that the simulated thermal output curve reaches the calibrated thermal output curve of the foil strain gauge.

[0062] Step 140 : Acquire the simulated strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge.

[0063] By combining the foil strain gauge parameters adjusted according to the structural information with the thermal strain application parameters of the foil strain gauge, a thermal-mechanical coupling hardware model of the foil strain gauge is constructed, and then the simulated strain value of the thermal-mechanical coupling hardware model is used as the final strain value of the foil strain gauge, which can improve the accuracy of determining the strain value of the foil strain gauge.

[0064] In practice, the inventors compared the actual strain value calculated by measuring the resistance of the foil strain gauge in actual applications in combination with the measured thermal output curve with the simulated strain value calibrated using the thermal strain simulation modeling method of the foil strain gauge mentioned above. The difference between the two is small, which can effectively solve the problems in the prior art such as fluctuations in the thermal output characteristics of the foil strain gauge, pasting adhesives, and pasting processes. In the thermal strain test of the foil strain gauge, especially under high temperature conditions, the strain value measured by the foil strain gauge often deviates greatly from the simulation result, making it difficult to determine the accuracy of the simulation modeling.

[0065] Figure 4 FIG. 1 is a flow chart of another method for thermal strain simulation modeling of a foil strain gauge according to an embodiment of the present invention. Figure 4As shown, a specific application example of the thermal strain simulation modeling method of foil strain gauge can be:

[0066] Step 410: construct an electrical coupling model of the foil strain gauge according to the foil strain gauge parameters; and obtain a strain grid simulation resistance value of the foil strain gauge according to the electrical coupling model.

[0067] Step 420 : adjusting the strain grid thickness of the foil strain gauge according to the strain grid simulation resistance value and the calibrated resistance value of the foil strain gauge.

[0068] Step 430: construct a thermal-mechanical coupling basic model of the foil strain gauge according to the foil strain gauge parameters; and obtain a simulation sensitivity coefficient of the foil strain gauge according to the thermal-mechanical coupling basic model.

[0069] Step 440: Adjust the cover layer and base material of the foil strain gauge according to the simulated sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge.

[0070] Step 450: construct a thermal-mechanical coupling application model of the foil strain gauge according to the foil strain gauge parameters and the thermal strain application parameters of the foil strain gauge.

[0071] Step 460: Under different given temperatures, obtain the strain value of the thermal-mechanical coupling application model to obtain a simulated thermal output curve.

[0072] Step 470: Adjust the adhesive thickness of the foil strain gauge according to the simulated heat output curve and the calibrated heat output curve of the foil strain gauge.

[0073] Step 480: Output the foil strain gauge parameters after the structural information is adjusted, so as to build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge.

[0074] Step 490: Acquire the simulated strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge.

[0075] The technical solution of the embodiment of the present invention is to construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract the simulation application parameters of the foil strain gauge according to the simulation software model; adjust the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge; output the foil strain gauge parameters after the structural information adjustment, and construct a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge; obtain the simulation strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge, thereby solving the problem of inaccurate strain value of the foil strain gauge in PCBA application, and by simulating and modeling the foil strain gauge, adjusting the structure of the foil strain gauge to achieve the calibration state, so that the actual strain value of the foil strain gauge in special scenarios such as high temperature conditions can be consistent with the simulation result, thereby improving the accuracy of the foil strain gauge.

[0076] Figure 5 1 is a schematic diagram of the structure of a thermal strain simulation modeling device for a foil strain gauge provided according to an embodiment of the present invention. Figure 5 As shown, the device includes: a simulation application parameter determination module 510, a structure information adjustment module 520, an information output module 530 and a final strain value determination module 540.

[0077] in:

[0078] A simulation application parameter determination module 510 is used to construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract the simulation application parameters of the foil strain gauge according to the simulation software model;

[0079] The structural information adjustment module 520 is used to adjust the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge;

[0080] The information output module 530 is used to output the foil strain gauge parameters after the structural information is adjusted, so as to build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge;

[0081] The final strain value determination module 540 is used to obtain the simulated strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge.

[0082] Optionally, the simulation application parameter determination module 510 includes:

[0083] The simulation resistance value determination unit is used to construct an electric coupling model of the foil strain gauge according to the foil strain gauge parameters; and obtain the strain grid simulation resistance value of the foil strain gauge according to the electric coupling model;

[0084] Optionally, the structure information adjustment module 520 includes:

[0085] The first structure information adjustment unit is used to adjust the first structure information of the foil strain gauge according to the strain grid simulation resistance value and the calibrated resistance value of the foil strain gauge.

[0086] Optionally, the simulation application parameter determination module 510 includes:

[0087] A simulation sensitivity coefficient determination unit is used to construct a thermal-mechanical coupling basic model of the foil strain gauge according to the parameters of the foil strain gauge; and obtain a simulation sensitivity coefficient of the foil strain gauge according to the thermal-mechanical coupling basic model;

[0088] Optionally, the structure information adjustment module 520 includes:

[0089] The second structural information adjustment unit is used to adjust the second structural information of the foil strain gauge according to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge.

[0090] Optionally, the simulation application parameter determination module 510 includes:

[0091] A thermal-mechanical coupling application model building unit is used to build a thermal-mechanical coupling application model of the foil strain gauge according to the foil strain gauge parameters and the thermal strain application parameters of the foil strain gauge;

[0092] A simulation heat output curve determination unit is used to obtain the strain value of the thermal-mechanical coupling application model at different given temperatures to obtain a simulation heat output curve;

[0093] Optionally, the structure information adjustment module 520 includes:

[0094] The third structural information adjustment unit is used to adjust the third structural information of the foil strain gauge according to the simulated thermal output curve and the calibrated thermal output curve of the foil strain gauge.

[0095] Optionally, the first structure information adjustment unit is specifically used to adjust the strain grid thickness of the foil strain gauge according to the strain grid simulation resistance value and the calibrated resistance value of the foil strain gauge.

[0096] Optionally, the second structure information adjustment unit is specifically used to adjust the covering layer and base material of the foil strain gauge according to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge.

[0097] Optionally, the third structure information adjustment unit is specifically used to adjust the adhesive thickness of the foil strain gauge according to the simulated thermal output curve and the calibrated thermal output curve of the foil strain gauge.

[0098] The thermal strain simulation modeling device of the foil strain gauge provided in the embodiment of the present invention can execute the thermal strain simulation modeling method of the foil strain gauge provided in any embodiment of the present invention, and has the functional modules and beneficial effects corresponding to the execution method.

[0099] Figure 6 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0100] like Figure 6 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0101] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0102] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the thermal strain simulation modeling method of the foil strain gauge.

[0103] In some embodiments, the thermal strain simulation modeling method of the foil strain gauge may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the thermal strain simulation modeling method of the foil strain gauge described above may be executed. Alternatively, in other embodiments, the processor 11 may be configured to execute the thermal strain simulation modeling method of the foil strain gauge in any other appropriate manner (e.g., by means of firmware).

[0104] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0105] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0106] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0107] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0108] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0109] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0110] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0111] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal strain simulation modeling method for foil strain gauges, characterized in that: include: According to the foil strain gauge parameters, a simulation software model of the foil strain gauge is constructed, and simulation application parameters of the foil strain gauge are extracted according to the simulation software model; Adjusting the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge; Output the foil strain gauge parameters adjusted by the structural information, and build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge; The simulated strain value of the thermal-mechanical coupling hardware model is obtained as the final strain value of the foil strain gauge.

2. The method according to claim 1, characterized in that According to the foil strain gauge parameters, a simulation software model of the foil strain gauge is constructed, and according to the simulation software model, simulation application parameters of the foil strain gauge are extracted, including: According to the foil strain gauge parameters, an electrical coupling model of the foil strain gauge is constructed; and according to the electrical coupling model, a strain grid simulation resistance value of the foil strain gauge is obtained; According to the simulation application parameters and the calibration application parameters of the foil strain gauge, adjusting the structural information of the foil strain gauge includes: The first structural information of the foil strain gauge is adjusted according to the strain grating simulation resistance value and the calibrated resistance value of the foil strain gauge.

3. The method according to claim 1, characterized in that According to the foil strain gauge parameters, a simulation software model of the foil strain gauge is constructed, and according to the simulation software model, simulation application parameters of the foil strain gauge are extracted, including: According to the parameters of the foil strain gauge, a thermal-mechanical coupling basic model of the foil strain gauge is constructed; and according to the thermal-mechanical coupling basic model, a simulation sensitivity coefficient of the foil strain gauge is obtained; According to the simulation application parameters and the calibration application parameters of the foil strain gauge, adjusting the structural information of the foil strain gauge includes: According to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge, second structural information adjustment is performed on the foil strain gauge.

4. The method according to claim 1, characterized in that: According to the foil strain gauge parameters, a simulation software model of the foil strain gauge is constructed, and according to the simulation software model, simulation application parameters of the foil strain gauge are extracted, including: According to the parameters of foil strain gauge and the thermal strain application parameters of foil strain gauge, a thermal-mechanical coupling application model of foil strain gauge is constructed; At different given temperatures, obtaining strain values ​​of the thermal-mechanical coupling application model to obtain a simulated thermal output curve; According to the simulation application parameters and the calibration application parameters of the foil strain gauge, adjusting the structural information of the foil strain gauge includes: The third structural information of the foil strain gauge is adjusted according to the simulated thermal output curve and the calibrated thermal output curve of the foil strain gauge.

5. The method according to claim 2, characterized in that: According to the strain grating simulation resistance value and the calibrated resistance value of the foil strain gauge, adjusting the first structural information of the foil strain gauge includes: The strain grid thickness of the foil strain gauge is adjusted according to the strain grid simulation resistance value and the calibrated resistance value of the foil strain gauge.

6. The method according to claim 3, characterized in that According to the simulation sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge, adjusting the foil strain gauge by second structural information includes: According to the simulated sensitivity coefficient and the calibrated sensitivity value of the foil strain gauge, the cover layer and the base material of the foil strain gauge are adjusted.

7. The method according to claim 4, characterized in that According to the simulated heat output curve and the calibrated heat output curve of the foil strain gauge, adjusting the third structural information of the foil strain gauge includes: The adhesive thickness of the foil strain gauge is adjusted according to the simulated heat output curve and the calibrated heat output curve of the foil strain gauge.

8. A thermal strain simulation modeling device for foil strain gauges, characterized in that: include: A simulation application parameter determination module, used to construct a simulation software model of the foil strain gauge according to the foil strain gauge parameters, and extract the simulation application parameters of the foil strain gauge according to the simulation software model; A structural information adjustment module, used for adjusting the structural information of the foil strain gauge according to the simulation application parameters and the calibration application parameters of the foil strain gauge; An information output module is used to output the foil strain gauge parameters after the structural information is adjusted, so as to build a thermal-mechanical coupling hardware model of the foil strain gauge in combination with the thermal strain application parameters of the foil strain gauge; The final strain value determination module is used to obtain the simulated strain value of the thermal-mechanical coupling hardware model as the final strain value of the foil strain gauge.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the thermal strain simulation modeling method of the foil strain gauge according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the thermal strain simulation modeling method of a foil strain gauge according to any one of claims 1 to 7 when executed.

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