Resonator structure for small constant temperature crystal oscillator and resonator

Abstract

The embodiment of the invention provides a resonator structure for a small constant temperature crystal oscillator and a resonator. In one embodiment, the resonator comprises: a thermally conductive resonator base; a copper laying window is formed in the heat conduction resonator base, and a quartz vibrator erected on the heat conduction resonator base is arranged above the copper laying window; a second bonding pad, a fourth bonding pad and a connecting bonding pad are arranged on the side, away from the copper laying window, of the heat conduction resonator base. The second bonding pad is in heat conduction connection with the fourth bonding pad through the connecting bonding pad; the heat conduction resonator base further comprises a first metal wire and a second metal wire, the second bonding pad is in heat conduction connection with the copper laying window through the first metal wire, and the fourth bonding pad is in heat conduction connection with the copper laying window through the second metal wire. The embodiment is high in heat conduction efficiency and high in heat conduction speed. In the temperature control process of the resonator structure disclosed by the invention, only one power tube is needed for heating, so that the influence of thermal gradient is reduced to a great extent. Therefore, the constant-temperature crystal oscillator formed by the constant-temperature crystal oscillator is smaller in size.

Description

Technical Field

[0001] The present disclosure relates to the field of crystal component design and production, and more specifically, to a resonator structure and a resonator for a small-sized constant temperature crystal oscillator. Background Art

[0002] At present, the constant temperature crystal oscillator is a crystal oscillator that uses a constant temperature tank to keep the temperature of the quartz crystal resonator in the crystal oscillator constant, thereby reducing the change in the oscillator output frequency caused by the ambient temperature change to a minimum.

[0003] However, the existing constant temperature crystal oscillator arranges multiple heating components on the same layer of the resonator. When heating, the heat generated by the multiple heating components is unevenly distributed, and the thermal gradient phenomenon affects the working stability of the resonator. In this method, when the heater is heating, the heater needs to first radiate heat to the air between the resonator and the heater, and heat the resonator through air heat conduction to further heat the quartz resonator in the resonator. This heating method not only takes a long time for heat conduction, but also because the quartz resonator in the resonator is far away from the heater, there is a large deviation between the heating temperature of the quartz resonator and the temperature of the heater, which directly leads to a deviation between the ideal heating temperature of the quartz resonator and the actual heating temperature, and poor temperature control performance. In addition, the flat design between the heater and the resonator causes the entire constant temperature crystal oscillator to occupy a large area, which is not conducive to the design needs of miniaturization of the oscillator. Summary of the invention

[0004] The object of the present disclosure is to provide a resonator structure and a resonator for a small oven-controlled crystal oscillator with high heating efficiency, so as to solve at least one of the problems existing in the prior art.

[0005] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0006] The present disclosure provides a resonator structure for a small-sized oven-controlled crystal oscillator, comprising:

[0007] A thermally conductive resonator base;

[0008] A copper-plated window is provided on the thermal resonator base, and a quartz resonator mounted on the thermal resonator base is arranged above the copper-plated window;

[0009] A second pad, a fourth pad and a connecting pad are provided on a side of the heat-conducting resonator base away from the copper-plated window; the second pad is thermally connected to the fourth pad via the connecting pad;

[0010] The thermally conductive resonator base further includes a first metal wiring and a second metal wiring, the second pad is thermally conductively connected to the copper-poured window through the first metal wiring, and the fourth pad is thermally conductively connected to the copper-poured window through the second metal wiring.

[0011] Furthermore, a first pad and a third pad are provided on the side of the thermally conductive resonator base away from the copper-plated window; and a first circuit electrode and a second circuit electrode are provided on the side of the thermally conductive resonator base where the copper-plated window is provided;

[0012] The first pad is electrically connected to the first circuit electrode;

[0013] The third pad is electrically connected to the second circuit electrode.

[0014] Furthermore, the quartz oscillator includes a quartz wafer and a first oscillator electrode and a second oscillator electrode plated on the quartz wafer by a coating process;

[0015] The resonator also includes a conductive glue;

[0016] The first vibrator electrode is electrically connected to the first circuit electrode through the conductive glue;

[0017] The second vibrator electrode is electrically connected to the second circuit electrode through the conductive glue;

[0018] The frequency signal generated by the quartz oscillator is output through the first oscillator electrode and the second oscillator electrode;

[0019] The frequency signal outputted by the first vibrator electrode is outputted through the conductive adhesive, the first circuit electrode and the first pad in sequence;

[0020] The frequency signal outputted through the second vibrator electrode is outputted through the conductive adhesive, the second circuit electrode and the third pad in sequence.

[0021] Furthermore, a support block is provided on the side of the thermal resonator base where the copper-plated window is provided;

[0022] The quartz crystal resonator is mounted on the thermally conductive resonator base through the supporting block, the first circuit electrode, and the second circuit electrode.

[0023] Furthermore, a Kovar ring is installed on one side of the thermal conductive resonator base where the quartz resonator is arranged.

[0024] Furthermore, a cover plate is sealedly connected to the kovar ring, and an internal vacuum cavity is formed between the cover plate, the kovar ring and the thermal resonator base to encapsulate the quartz oscillator.

[0025] Furthermore, the second soldering pad and / or the fourth soldering pad are thermally connected to the cover plate.

[0026] Furthermore, the thermally conductive resonator base is made of ceramic material.

[0027] A second aspect of the present disclosure provides a resonator, comprising:

[0028] A resonator structure as described in any one of the first aspects, and a heater arranged near a connection pad of the resonator structure.

[0029] Furthermore, the heater includes a power tube.

[0030] The beneficial effects of the present disclosure are as follows:

[0031] The present invention conducts heat to the connecting pad through the heater, conducts heat to the second pad and the fourth pad respectively through the connecting pad, conducts heat to the copper window through the second pad through the first metal wiring, and conducts heat to the copper window through the fourth pad through the second metal wiring; the quartz resonator is quickly heated by the copper window; since the heat conduction path is all metal, the heat conduction efficiency is high and the heat conduction speed is fast. At the same time, when collecting the temperature data inside the resonator, the thermistor needs to be as close to the resonator as possible to quickly and accurately obtain the temperature closest to the inside of the resonator. Therefore, it is necessary to arrange multiple heating components and resonators on the same side of the heat-conducting resonator base, then the thermistor will be affected by the heating components, making the temperature measurement inaccurate. In the process of temperature control of the resonator structure disclosed in the present invention, only one power tube is required for heating, which greatly reduces the influence of thermal gradient. While effectively improving the temperature control accuracy, the number of components used is reduced, so that the constant temperature crystal oscillator composed of it is smaller in size.

[0032] On the other hand, the heat of the connection pad is also conducted to the thermal resonator base to heat the copper window on the side of the thermal resonator base away from the heater, and the quartz resonator is heated through the copper window. The quartz resonator is heated through multiple heat conduction paths. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The specific implementation methods of the present disclosure are further described in detail below with reference to the accompanying drawings.

[0034] Figure 1 A top view of a resonator of the present disclosure is shown.

[0035] Figure 2 A bottom view of a thermally conductive resonator base of the present disclosure is shown.

[0036] Figure 3 A top view of the quartz crystal resonator of the present disclosure is shown.

[0037] Figure 4 A top view of a kovar ring of the present disclosure is shown.

[0038] Figure 5 A top view of a thermally conductive resonator base of the present disclosure is shown.

[0039] Figure 6 A top view showing a quartz crystal resonator according to the present disclosure mounted on a thermally conductive resonator base.

[0040] Figure 7 A left side view of a packaged resonator of the present disclosure is shown.

[0041] Description of Figure Numbers

[0042] 1. Thermal resonator base; 11. First solder pad; 12. Second solder pad; 13. Third solder pad; 14. Fourth solder pad; 15. Connecting pad; 16. First circuit electrode; 17. Second circuit electrode; 18. Copper window; 19. First metal wiring; 110. Second metal wiring; 2. Quartz resonator; 21. Quartz wafer; 22. First resonator electrode; 23. Second resonator electrode; 3. Kovar ring; 4. Cover plate. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the present disclosure, the present disclosure is further described below in conjunction with the embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present disclosure.

[0044] The first embodiment of the present disclosure provides a resonator structure for a small oven-controlled crystal oscillator, such as Figure 1 , Figure 5 as well as Figure 6 As shown, it comprises: a heat-conducting resonator base 1; a copper-plated window 18 is provided on the heat-conducting resonator base 1, and a quartz resonator 2 is provided on the copper-plated window 18;

[0045] like Figure 2 As shown, the side of the thermal resonator base 1 away from the copper-plated window 18 is provided with a second pad 12, a fourth pad 14 and a connecting pad 15; the second pad 12 is thermally connected to the fourth pad 14 through the connecting pad 15;

[0046] The thermally conductive resonator base 1 further includes a first metal wiring 19 and a second metal wiring 110, the second pad 12 is thermally connected to the copper-plated window 18 through the first metal wiring 19, and the fourth pad 14 is thermally connected to the copper-plated window 18 through the second metal wiring 110. In a possible implementation, the thermally conductive resonator base 1 is further provided with a first pad 11 and a third pad 13 on a side away from the copper-plated window 18; and a first circuit electrode 16 and a second circuit electrode 17 are further provided on the side of the thermally conductive resonator base 1 where the copper-plated window 18 is provided;

[0047] The first pad 11 is electrically connected to the first circuit electrode 16;

[0048] The third pad 13 is electrically connected to the second circuit electrode 17 .

[0049] like Figure 3 As shown, the quartz oscillator 2 includes a quartz wafer 21 and a first oscillator electrode 22 and a second oscillator electrode 23 plated on the quartz wafer 21 by a coating process;

[0050] The resonator also includes a conductive glue;

[0051] The first vibrator electrode 22 is electrically connected to the first circuit electrode 16 through the conductive glue;

[0052] The second vibrator electrode 23 is electrically connected to the second circuit electrode 17 through the conductive glue;

[0053] The frequency signal generated by the quartz oscillator 2 is output through the first oscillator electrode 22 and the second oscillator electrode 23;

[0054] The frequency signal outputted by the first vibrator electrode 22 is outputted through the conductive adhesive, the first circuit electrode 16 and the first pad 11 in sequence;

[0055] The frequency signal outputted through the second vibrator electrode 23 is outputted through the conductive adhesive, the second circuit electrode 17 and the third pad 13 in sequence.

[0056] In a specific embodiment, a support block 111 is further provided on the side of the thermal resonator base 1 where the copper-plated window 18 is provided;

[0057] The quartz crystal resonator is mounted on the thermally conductive resonator base through the supporting block, the first circuit electrode, and the second circuit electrode.

[0058] In a specific embodiment, the material of the first vibrator electrode 22 and the second vibrator electrode 23 is selected from one of gold, silver and chromium.

[0059] In the present disclosure, in actual application, the thermal conductive resonator base 1 needs to be connected to multiple pads by soldering on the side close to the heater, and a good electrical connection can be formed between the quartz resonator 2 and the pads, and the frequency signal generated by the resonator is output through the first pad 11 and the third pad 13 to provide a stable frequency source.

[0060] In one possible implementation, Figure 4 and Figure 7 As shown,

[0061] A Kovar ring 3 is installed on one side of the thermal resonator base 1 where the quartz resonator 2 is arranged.

[0062] The kovar ring 3 is sealed with a cover plate 4 , and an internal vacuum cavity is formed between the cover plate 4 , the kovar ring 3 and the thermal resonator base 1 to encapsulate the quartz resonator 2 .

[0063] The Kovar ring 3 is a ring-shaped product formed by stamping a composite metal strip through a precision-grade mold. It is an inlay that must be used in the base of a quartz crystal resonator. Its function is to be brazed around the heat-conducting resonator base 1 and to form a sealed cavity with the metal cover plate 4 by surface parallel welding and vacuuming. The cover plate 4 performs a sealing and pressing operation on the resonator after the vacuum chamber of the equipment is automatically evacuated to a predetermined vacuum degree.

[0064] In a specific embodiment, the second pad 12 and / or the fourth pad 14 are thermally connected to the cover plate 4. The heat of the heater is transferred to the cover plate 4 through the second pad 12 and / or the fourth pad 14, and the quartz resonator 2 is heated by the heat radiation of the cover plate 4, so that the quartz resonator 2 is heated more evenly.

[0065] In a possible implementation, the thermally conductive resonator base 1 is made of ceramic material.

[0066] In the present disclosure, the ceramic material can withstand higher temperatures, and its thermal stability and thermal shock resistance are also very good, which can meet the use requirements in high-temperature working environments. Ceramic materials are not easily corroded by chemical substances and can meet the application requirements in corrosive environments such as strong acids and alkalis. In addition, ceramic materials are not prone to deformation, breakage and other problems during use, and have a long service life. On the other hand, some ceramic materials such as aluminum nitride (AlN) and silicon carbide (SiC) have high thermal conductivity, which can effectively conduct heat energy and improve heat exchange efficiency. The ceramic material itself does not store heat and directly dissipates heat, reducing the impact of the insulating layer on thermal efficiency. Ceramic materials have good insulation properties, can effectively isolate current, ensure the safe operation of the equipment, and can reduce electromagnetic interference and static electricity accumulation, thereby improving the stability and reliability of the equipment.

[0067] A second embodiment of the present disclosure provides a resonator, including:

[0068] A resonator structure as described in any one of the first embodiments; and a heater arranged near the connection pad 15 of the resonator structure.

[0069] In one possible implementation, the heater includes a power tube.

[0070] The present invention conducts heat to the connecting pad 15 through the heater, conducts heat to the second pad 12 and the fourth pad 14 through the connecting pad 15, conducts heat to the copper-plated window 18 through the second pad 12 via the first metal wiring 19, and conducts heat to the copper-plated window 18 through the fourth pad 14 via the second metal wiring 110; the quartz resonator 2 is quickly heated through the copper-plated window 18; since the heat conduction path is all metal, the heat conduction efficiency is high and the heat conduction speed is fast. At the same time, when collecting the temperature data inside the resonator, the thermistor needs to be as close to the resonator as possible in order to quickly and accurately obtain the temperature closest to the inside of the resonator. At the same time, the present invention can also heat the quartz oscillator 2 by heat radiation through the resonator cover 4, and has multiple heat conduction paths. The existing technical solution requires that multiple heating components and the resonator be arranged on the same side of the heat-conducting resonator base 1, then the thermistor will be affected by the heating components, making the temperature measurement inaccurate. During the temperature control process of the resonator structure disclosed in the present invention, only one power tube is required for heating, which greatly reduces the influence of thermal gradient. While effectively improving the temperature control accuracy, the number of components used is reduced, so that the constant temperature crystal oscillator composed of it is smaller in size.

[0071] On the other hand, the heat of the connection pad 15 is also conducted to the thermal resonator base 1 to heat the copper-plated window 18 on the side of the thermal resonator base 1 away from the heater, and the quartz resonator 2 is heated through the copper-plated window 18. In this embodiment, the quartz resonator 2 is heated through multiple heat conduction paths.

[0072] In a specific embodiment, the resonator structure provided by the present invention enables the constant temperature crystal oscillator to place the heating components on the back of the PCB board layer where the resonator is located when the internal PCB board, i.e., the heat-conducting resonator base, is laid out, which greatly reduces the number of components used and is conducive to the design and production of miniaturized products. At the same time, since the thermistor needs to be as close to the resonator as possible, the temperature closest to the inside of the resonator can be obtained quickly and accurately. If the heating components and the resonator are laid out on both sides of the thermistor according to the traditional solution, the thermistor will be affected by the heating components, resulting in inaccurate temperature measurement. The present invention can effectively avoid this problem.

[0073] The resonator structure provided by the present invention is connected to the PCB board through soldering by adding a pad (a connecting pad connecting the second pad and the fourth pad) which is not electrically connected at the bottom of the base, and the heating power tube directly heats the bottom of the resonator through the metal layer of the PCB board and the reserved via hole. The metal layer is exposed when the surface paint of the PCB board is peeled off. The metal has a high thermal conductivity, large heat capacity, good thermal conductivity, and fast heat transfer rate, which can effectively and quickly increase the internal temperature of the resonator. At the same time, since the heating power tube is located directly below the resonator, the thermal gradient caused by the unreasonable selection of the number of heating power tubes and the unreasonable layout of the traditional solution can be effectively avoided.

[0074] The resonator structure provided by the present invention uses a new metallized structure inside, which is on the same layer as the electrode in the original solution. Two pins that are not electrically connected are connected. When the power tube heats the bottom of the resonator, it first heats the package at the bottom of the base. Since the solder pad at the bottom of the base, the metallized structure inside the resonator, and the resonator shell are interconnected, heat conduction will be carried out in sequence between the three. Since the thermal conductivity of metal is relatively fast, the temperature inside the resonator can quickly reach the required temperature. The copper-plated window below the quartz chip heats the chip by close-range heat conduction, which is compared to the traditional solution of using a power tube to heat the resonator shell and then heating the quartz chip inside the resonator by thermal radiation. The new heating method has higher heating efficiency and faster speed, and can effectively improve the preheating time indicator.

[0075] In the description of the present disclosure, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, and it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0076] It should also be noted that, in the description of the present disclosure, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprise one..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0077] Obviously, the above embodiments of the present disclosure are merely examples for clearly illustrating the present disclosure, and are not limitations on the implementation methods of the present disclosure. For ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present disclosure are still within the protection scope of the present disclosure.

Claims

1. A resonator structure for a small oven-controlled crystal oscillator, characterized in that: include: A thermally conductive resonator base; A copper-plated window is provided on the thermal resonator base, and a quartz resonator mounted on the thermal resonator base is arranged above the copper-plated window; A second pad, a fourth pad and a connecting pad are provided on a side of the thermally conductive resonator base away from the copper-plated window; the second pad is thermally connected to the fourth pad via the connecting pad; The thermally conductive resonator base further includes a first metal wiring and a second metal wiring, the second pad is thermally conductively connected to the copper-poured window through the first metal wiring, and the fourth pad is thermally conductively connected to the copper-poured window through the second metal wiring.

2. The resonator structure according to claim 1, characterized in that A first solder pad and a third solder pad are also provided on the side of the thermally conductive resonator base away from the copper-plated window; and a first circuit electrode and a second circuit electrode are also provided on the side of the thermally conductive resonator base where the copper-plated window is provided; The first pad is electrically connected to the first circuit electrode; The third pad is electrically connected to the second circuit electrode.

3. The resonator structure according to claim 2, characterized in that The quartz oscillator comprises a quartz wafer and a first oscillator electrode and a second oscillator electrode plated on the quartz wafer by a coating process; The resonator also includes a conductive glue; The first vibrator electrode is electrically connected to the first circuit electrode through the conductive glue; The second vibrator electrode is electrically connected to the second circuit electrode through the conductive glue; The frequency signal generated by the quartz oscillator is output through the first oscillator electrode and the second oscillator electrode; The frequency signal outputted by the first vibrator electrode is outputted through the conductive adhesive, the first circuit electrode and the first pad in sequence; The frequency signal outputted through the second vibrator electrode is outputted through the conductive adhesive, the second circuit electrode and the third pad in sequence.

4. The resonator structure according to claim 3, characterized in that A support block is also provided on the side of the thermal resonator base where the copper-plated window is provided; The quartz crystal resonator is mounted on the thermally conductive resonator base through the supporting block, the first circuit electrode, and the second circuit electrode.

5. The resonator structure according to claim 1, characterized in that A Kovar ring is installed on one side of the heat-conducting resonator base where the quartz oscillator is arranged.

6. The resonator structure according to claim 5, characterized in that A cover plate is sealedly connected to the Kovar ring, and an internal vacuum cavity is formed between the cover plate, the Kovar ring and the thermal resonator base to encapsulate the quartz oscillator.

7. The resonator structure according to claim 6, characterized in that The second soldering pad and / or the fourth soldering pad are thermally connected to the cover plate.

8. The resonator structure according to claim 1, characterized in that The thermally conductive resonator base is made of ceramic material.

9. A resonator, characterized in that: include: A resonator structure as claimed in any one of claims 1 to 8, and a heater arranged near a connection pad of the resonator structure.

10. The resonator according to claim 9, characterized in that The heater includes a power tube.

Images