Fixture of PBGA product and bonding, dispensing and loading three-process application method thereof

By designing the fixtures for PBGA products, using the combination of base plate, PCB plate, pressure plate and conveying device, the problem of PCB damage caused by manual operation in the prior art is solved, and a higher yield rate and lower damage probability are achieved.

CN119603882APending Publication Date: 2025-03-11ZHEJIANG DAGUI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411788644.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-06
Publication Date
2025-03-11

AI Technical Summary

Technical Problem

In the semiconductor packaging construction process, manual operation is required in the prior art, which can easily lead to damage to the wire-tightening point of the PCB surface and affect the product yield.

Method used

A fixture for PBGA products is designed, including a base plate, PCB plate, press plate and conveying device. The PCB plate and press plate are positioned through positioning parts, and they are placed in the wire drawing machine for wire drawing. After the wire drawing is completed, it is directly taken out from the wire drawing machine and placed in the wire dispensing machine for dispensing, and a heat sink is installed.

Benefits of technology

It reduces direct contact between staff and PCB board, reduces the probability of damage to PCB board during processing, and improves the product yield rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a jig of a PBGA product and a bonding, dispensing and loading three-process application method of the jig, and relates to the technical field of PBGA processing equipment. The key points of the technical scheme are as follows: the PCB comprises a bottom plate, the surface of the bottom plate is provided with a PCB, the surface of the PCB is provided with a pressing plate, the pressing plate is provided with a plurality of routing ports, each routing port is internally provided with a cooling fin, the cooling fins are fixedly connected to the surface of the PCB, the bottom plate is also provided with a positioning piece for positioning the PCB and the pressing plate, and the PCB and the pressing plate are fixedly connected with the PCB. And the conveying device is used for conveying the bottom plate. The invention aims to provide a jig of a PBGA product and a bonding, dispensing and loading three-process application method of the jig.
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Description

Technical Field

[0001] The present invention relates to the technical field of PBGA processing equipment, and more specifically, to a fixture for PBGA products and a three-step application method thereof of bonding, gluing and laminating. Background Art

[0002] During the semiconductor packaging construction process, a wire bonding machine is required to bond and electrically connect the semiconductor chip and the packaging substrate.

[0003] In the prior art, it is necessary to manually send the PCB that needs to be wired into a wire bonding machine for wire bonding. After the wire bonding is completed, it is taken out of the wire bonding machine and put into a glue bonding machine for glue bonding and a heat sink is installed on the surface of the PCB. However, during this processing process, the wire bonding area on the PCB surface is easily damaged.

[0004] Therefore, a new technical solution is urgently needed to solve the above technical problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the object of the present invention is to provide a PBGA product fixture and a three-step application method thereof including bonding, gluing and lamination.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: a fixture for PBGA products, including a base plate, a PCB board is arranged on the surface of the base plate, a pressure plate is arranged on the surface of the PCB board, a plurality of wire bonding openings are opened on the pressure plate, a heat sink is arranged in each of the wire bonding openings, the heat sink is fixedly connected to the surface of the PCB board, a positioning member for positioning the PCB board and the pressure plate is also arranged on the base plate, and also includes a conveying device for conveying the base plate.

[0007] By adopting the above technical solution, the PCB board that needs to be wired is placed on the surface of the base plate, and the pressure plate is pressed on the surface of the PCB board so that the area that needs to be wired is located at the wire bonding port, and the PCB board and the pressure plate are positioned by the positioning piece, and the whole is placed in the wire bonding machine for wire bonding. After the wire bonding is completed, the jig and the PCB board can be directly taken out of the wire bonding machine, and the whole is placed in the glue dispensing machine for glue dispensing to install the heat sink, thereby reducing the direct contact between the staff and the PCB board, thereby reducing the probability of damage to the PCB board during the processing, so as to improve the product yield.

[0008] The present invention is further configured as follows: a plurality of grooves are provided on the surface of the bottom plate; the positioning member comprises positioning pins arranged in the grooves; and a plurality of positioning holes for inserting the positioning pins are provided on the PCB board and the pressure plate.

[0009] The present invention is further configured as follows: the positioning pin includes a connecting portion arranged in the groove, and a positioning portion extending out of the groove is arranged on the top of the connecting portion.

[0010] The present invention is further configured as follows: four positioning feet are evenly arranged along the circumference of the heat sink, and the four positioning feet are fixedly connected to the PCB board by adhesive.

[0011] The present invention is further configured as follows: a plurality of mounting holes are evenly opened on the lower surface of the bottom plate, magnets are installed in the mounting holes, the pressing plate is made of magnetic metal, and the magnets are fixed by filling the mounting holes with glue.

[0012] The present invention is further configured as follows: the conveying device includes two horizontally arranged guide rails, the tops of the relative surfaces of the two guide rails are provided with guide grooves running through both ends along their length directions, guide plates passing through and slidably connected to the guide grooves are provided on both sides of the base plate, and a driving member for driving the base plate is also provided on the guide rails.

[0013] The present invention is further configured as follows: the driving member includes a driving roller rotatably connected between two guide rails, the top of the driving roller abuts against the lower surface of the bottom plate, two driving rollers are provided and are arranged at both ends of the guide rails, a motor for driving the driving roller is provided on one side of the guide rail, and the inner side wall of the guide groove is rotatably connected to a plurality of guide wheels, and the bottom of the guide wheel abuts against the surface of the guide plate.

[0014] The present invention is further configured as follows: a surface of the sealing plate is slidably connected with an abutment plate in a vertical direction, and further comprises an electric cylinder for driving the abutment plate to rise and fall.

[0015] The present invention is further configured as follows: a sealing plate is arranged between the two ends of the two guide rails, and a plurality of adsorption holes are provided on the surface of the bottom plate below each wire punching opening.

[0016] A three-step application method of bonding, dispensing and laminating applied to the above-mentioned fixture comprises the following steps:

[0017] S1. Place the PCB on the surface of the base plate and position the PCB using positioning pieces;

[0018] S2, placing the pressing plate on the surface of the PCB board, and positioning the pressing plate simultaneously by means of the positioning piece;

[0019] S3, conveying the workpiece in step S2 to a designated position of a wire bonding machine through a conveying assembly and performing wire bonding;

[0020] S4. After the wire bonding is completed, the workpiece is taken out of the wire bonding machine and put into the glue bonding machine. After the conveying component transports it to the designated position of the glue bonding machine, glue is applied at the four corners of the wire bonding port on the PCB surface.

[0021] S5. After the gluing is completed, take the workpiece out of the glue machine, install a heat sink at each wire opening, and fix the positioning foot to the PCB board through the glue points applied by the glue machine.

[0022] The present invention has the following beneficial effects: by placing a PCB board that needs to be wired on the surface of a bottom plate, and pressing the surface of the PCB board by a pressing plate, the area that needs to be wired is located at the wire bonding opening, and then the PCB board and the pressing plate are positioned by a positioning member, and the whole is placed in a wire bonding machine for wire bonding. After the wire bonding is completed, the jig and the PCB board can be directly taken out of the wire bonding machine, and the whole is placed in a glue dispensing machine for glue dispensing to install a heat sink, thereby reducing direct contact between the staff and the PCB board, thereby reducing the probability of damage to the PCB board during the processing, and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the three-dimensional structure of this embodiment;

[0024] Figure 2 It is a partial structural exploded schematic diagram of this embodiment;

[0025] Figure 3 This is a schematic diagram of the structure of the positioning pin of this embodiment;

[0026] Figure 4 is a schematic structural diagram of the heat sink of this embodiment;

[0027] Figure 5 Schematic diagram of the bottom structure of the bottom plate of this embodiment;

[0028] Figure 6 Schematic diagram of the structure of the conveying device of this embodiment.

[0029] Description of the drawings: 1. Base plate; 2. PCB board; 3. Pressing plate; 4. Wire punching port; 5. Heat sink; 6. Positioning pin; 7. Positioning hole; 8. Connecting part; 9. Positioning part; 10. Positioning foot; 11. Through hole; 12. Magnet; 13. Guide rail; 14. Guide groove; 15. Guide plate; 16. Driving roller; 17. Motor; 18. Guide wheel; 19. Sealing plate; 20. Adsorption hole; 21. Abutment plate; 22. Electric cylinder. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0031] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively. Specific embodiment 1:

[0033] As shown in the figure, a fixture for PBGA products includes a base plate 1, a PCB board 2 is arranged on the surface of the base plate 1, a pressing plate 3 is arranged on the surface of the PCB board 2, a plurality of wire holes 4 are opened on the pressing plate 3, a heat sink 5 is arranged in each wire hole 4, and the heat sink 5 is fixedly connected to the surface of the PCB board 2. A positioning member for positioning the PCB board 2 and the pressing plate 3 is also arranged on the base plate 1, and also includes a conveying device for conveying the base plate 1.

[0034] The PCB board 2 that needs to be wired is placed on the surface of the base plate 1, and the pressure plate 3 is pressed on the surface of the PCB board 2, so that the area that needs to be wired is located at the wire bonding port 4, and then the PCB board 2 and the pressure plate 3 are positioned by the positioning piece, and the whole is placed in the wire bonding machine for wire bonding. After the wire bonding is completed, the jig and the PCB board 2 can be directly taken out of the wire bonding machine, and the whole is placed in the glue dispensing machine for glue dispensing to install the heat sink 5, thereby reducing the direct contact between the staff and the PCB board 2, thereby reducing the probability of damage to the PCB board 2 during the processing, so as to improve the product yield.

[0035] The surface of the bottom plate 1 is provided with a plurality of grooves, the positioning member includes a positioning pin 6 disposed in the groove, the PCB board 2 and the pressing plate 3 are provided with a plurality of positioning holes 7 for inserting the positioning pin 6, the positioning pin 6 includes a connecting portion 8 disposed in the groove, the top of the connecting portion 8 is provided with a positioning portion 9 extending out of the groove, and the top of the positioning portion 9 is hemispherical. When the PCB board 2 and the pressing plate 3 are placed on the bottom plate 1, the top of the positioning portion 9 is hemispherical, so that the positioning portion 9 can be smoothly inserted into the corresponding positioning hole 7, thereby positioning the PCB board 2 and the pressing plate 3, facilitating loading and unloading, and ensuring the stability of the PCB board 2 during wire bonding, so as to improve the wire bonding accuracy of the wire bonding machine on the surface of the PCB board 2.

[0036] Four positioning feet 10 are evenly arranged along the circumference of the heat sink 5. The four positioning feet 10 are fixedly connected to the PCB board 2 by adhesive. Through holes 11 are opened at the positioning feet 10, through which the adhesive can enter the through holes 11 to improve the connection strength between the heat sink 5 and the PCB board 2. The four positioning feet 10 are respectively placed at the four corners of the wire punching port 4, which can conveniently place the heat sink 5 in the wire punching port 4, ensure the accuracy of its installation position, and further reduce the damage to the surface of the PCB board 2.

[0037] A plurality of mounting holes are evenly arranged on the lower surface of the base plate 1, and magnets 12 are installed in the mounting holes. The pressing plate 3 is made of magnetic metal, and the magnets are fixed by filling the mounting holes with glue. The magnets 12 can adsorb the pressing plate 3, so that it can be stably pressed on the surface of the PCB board 2, thereby further enhancing its protective effect on the PCB board 2.

[0038] The conveying device includes two horizontally arranged guide rails 13. The tops of the opposite surfaces of the two guide rails 13 are provided with guide grooves 14 running through both ends along their length directions. Guide plates 15 penetrating and slidably connected to the guide grooves 14 are provided on both sides of the base plate 1. A driving member for driving the base plate 1 is also provided on the guide rails 13.

[0039] By setting a conveying device in the wire bonding machine and the glue dispensing machine, during processing, the base plate 1 with the PCB board 2 and the pressure plate 3 is inserted from one end of the guide rail 13, and the base plate 1 can be driven by the driving member to move to the specified position to perform wire bonding or glue dispensing on the PCB board 2, thereby further reducing the direct contact between the staff and the PCB board 2.

[0040] The driving member includes a driving roller 16 rotatably connected between the two guide rails 13, the top of the driving roller 16 abuts against the lower surface of the bottom plate 1, two driving rollers 16 are provided and arranged at both ends of the guide rails 13, and a motor 17 for driving the driving roller 16 is provided on one side of the guide rail 13. A plurality of guide wheels 18 are rotatably connected to the inner side wall of the guide groove 14, and the bottom of the guide wheel 18 abuts against the surface of the guide plate 15.

[0041] The surface of the driving roller 16 is provided with a rubber sleeve (not shown in the figure). After the base plate 1 is inserted between the two guide rails 13, the rubber sleeve abuts against the lower surface of the base plate 1, and the guide wheel 18 abuts against the upper surface of the guide plate 15. Driven by the motor 17, the base plate 1 is smoothly driven to slide along the guide rail 13 and finally moves to the specified position. After the processing is completed, under the action of another driving roller 16 and the motor 17, the base plate 1 is driven to slide along the guide rail 13, which is convenient for the staff to remove it.

[0042] A sealing plate 19 is provided between the two ends of the two guide rails 13, and a plurality of adsorption holes 20 are provided on the surface of the bottom plate 1 below each wire punching opening 4. When the bottom plate 1 moves to a specified position, a closed space is formed between the guide rails 13, the sealing plate 19 and the bottom of the bottom plate 1. Under the operation of the vacuum equipment, the PCB board 2 can be stably adsorbed on the surface of the bottom plate 1, thereby further improving the stability of the PCB board 2 during processing.

[0043] The surface of a sealing plate 19 is slidably connected to an abutment plate 21 in the vertical direction, and also includes an electric cylinder 22 for driving the abutment plate 21 to rise and fall. The abutment plate 21 is driven to rise by the electric cylinder 22, and the driving roller 16 drives the bottom plate 1 to move, so that the abutment plate 21 plays an abutment and positioning role on the bottom plate 1, ensuring the accuracy of the processing position of the bottom plate 1 in the wire bonding machine or the glue dispensing machine. After the processing is completed, the electric cylinder drives the abutment plate 21 to descend, and the driving roller 16 can drive the abutment plate 21 to slide out of the guide rail. Specific embodiment 2:

[0045] 1 A three-step application method of bonding, dispensing and laminating applied to the above-mentioned fixture comprises the following steps:

[0046] S1, placing the PCB board 2 on the surface of the bottom plate 1, so that the positioning part of the positioning pin 6 is inserted into the positioning hole 7 of the PCB board 2;

[0047] S2, placing the pressing plate 3 on the surface of the PCB board 2, so that the positioning part of the positioning pin 6 is inserted into the positioning hole 7 of the pressing plate 3, and under the action of the magnet, it is adsorbed on the surface of the PCB board 2;

[0048] S3, the workpiece in step S2 is transported to the designated position of the wire bonding machine through the conveying assembly and the wire bonding work is performed. After the bottom plate 1 is inserted into the guide rail, the motor 17 drives the driving roller 16 to rotate, so as to drive the bottom plate 1 to move along the guide rail and reach the designated position of the wire bonding machine;

[0049] S4, after the wire bonding is completed, the motor works to make the other end of the movable guide rail of the bottom plate 1 slide out, take the workpiece out of the wire bonding machine, and then put it into the guide rail of the glue bonding machine. After the motor works to transport it to the designated position of the glue bonding machine, glue is applied at four corners of the wire bonding port 4 on the PCB surface;

[0050] S5. After the gluing is completed, the workpiece is taken out from the gluing machine, and a heat sink 5 is installed at each wire opening 4. The positioning pins are fixedly connected to the PCB board 2 through the glue dots applied by the gluing machine.

[0051] The specific embodiments are merely explanations of the present invention and are not limitations of the present invention. After reading this specification, those skilled in the art may make modifications to the embodiments without any creative contribution as needed. However, such modifications are protected by the patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A fixture for PBGA products, characterized by: The invention comprises a bottom plate (1), a PCB (2) being arranged on the surface of the bottom plate (1), a pressing plate (3) being arranged on the surface of the PCB (2), a plurality of wire punching openings (4) being provided on the pressing plate (3), a heat sink (5) being arranged in each of the wire punching openings (4), the heat sink (5) being fixedly connected to the surface of the PCB (2), a positioning member for positioning the PCB (2) and the pressing plate (3) being also arranged on the bottom plate (1), and a conveying device for conveying the bottom plate (1).

2. A fixture for PBGA products according to claim 1, characterized in that: The surface of the bottom plate (1) is provided with a plurality of grooves, the positioning member comprises a positioning pin (6) arranged in the groove, and the PCB board (2) and the pressure plate (3) are provided with a plurality of positioning holes (7) for the positioning pins (6) to be inserted.

3. A fixture for PBGA products according to claim 2, characterized in that: The positioning pin (6) comprises a connecting portion (8) arranged in the groove, and a positioning portion (9) extending out of the groove is arranged at the top of the connecting portion (8).

4. The fixture for PBGA products according to claim 3, characterized in that: The heat sink (5) is evenly provided with four positioning feet along its circumference, and the four positioning feet are fixedly connected to the PCB board (2) by means of adhesive.

5. The fixture for PBGA products according to claim 4, characterized in that: A plurality of mounting holes are evenly formed on the lower surface of the base plate (1), and magnets (12) are mounted in the mounting holes. The pressing plate (3) is made of magnetic metal, and the magnets (12) are fixed in the mounting holes by injecting glue.

6. A fixture for PBGA products according to claim 5, characterized in that: The conveying device comprises two horizontally arranged guide rails (13), the tops of the opposing surfaces of the two guide rails (13) are provided with guide grooves (14) penetrating both ends thereof along their length direction, guide plates (15) penetrating and slidably connected to the guide grooves (14) are provided on both sides of the base plate (1), and a driving member for driving the base plate (1) is also provided on the guide rails (13).

7. A fixture for PBGA products according to claim 6, characterized in that: The driving member comprises a driving roller (16) rotatably connected between two guide rails (13), the top of the driving roller (16) abuts against the lower surface of the bottom plate (1), two driving rollers (16) are provided and arranged at both ends of the guide rails (13), a motor for driving the driving roller (16) is provided on one side of the guide rail (13), and a plurality of guide wheels (18) are rotatably connected to the inner side wall of the guide groove (14), and the bottom of the guide wheel (18) abuts against the surface of the guide plate (15).

8. The fixture for PBGA products according to claim 7, characterized in that: A sealing plate (19) is provided between the two ends of the two guide rails (13), and a plurality of adsorption holes (20) are provided on the surface of the bottom plate (1) below each wire punching opening (4).

9. A fixture for PBGA products according to claim 8, characterized in that: The surface of one of the sealing plates (19) is slidably connected to an abutment plate (21) in a vertical direction, and also includes an electric cylinder (22) for driving the abutment plate (21) to rise and fall.

10. A three-step application method for bonding, dispensing and laminating of the above-mentioned fixture, characterized in that: The steps include: S1, placing the PCB board (2) on the surface of the base plate (1), and positioning the PCB board (2) using a positioning piece; S2, placing the pressing plate (3) on the surface of the PCB board (2), and positioning the pressing plate (3) simultaneously by means of a positioning member; S3, conveying the workpiece in step S2 to a designated position of a wire bonding machine through a conveying assembly and performing wire bonding; S4, after the wire bonding is completed, the workpiece is taken out of the wire bonding machine and then put into the glue bonding machine. After the conveying component transports it to the designated position of the glue bonding machine, glue is applied at fixed points on the four corners of the wire bonding opening (4) on the PCB surface; S5. After the gluing is completed, the workpiece is taken out of the gluing machine, a heat sink (5) is installed at each wire opening (4), and the positioning foot is fixedly connected to the PCB board (2) through the glue dots applied by the gluing machine.