Display substrate and manufacturing method thereof, liquid crystal display panel and display device

Abstract

The invention provides a display substrate and a manufacturing method thereof, a liquid crystal display panel and a display device, and belongs to the technical field of display. The display substrate comprises a substrate body and a driving circuit layer arranged on the substrate body, and the driving circuit layer comprises a gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer and a second electrode which are sequentially arranged. The driving circuit layer further comprises at least one layer of conductive function pattern, the conductive function pattern is used for achieving a heating function or a touch control function, and the conductive function pattern and at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode are arranged in the same layer and made of the same material. According to the technical scheme, the manufacturing process of the display substrate can be simplified.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, a liquid crystal display panel, and a display device. Background Art

[0002] At present, nematic liquid crystal is mainly used in liquid crystal displays, that is, liquid crystal displays can only work within the temperature range where the liquid crystal material is in the nematic phase, and the working range of liquid crystal displays is the existence range of the nematic phase. The transition temperature between the smectic phase and the nematic phase of liquid crystal is usually represented by Tsn; the temperature at which the nematic phase changes to liquid is the clearing point temperature of the liquid crystal, represented by Tni. When the operating temperature of the liquid crystal display is lower than Tsn, the liquid crystal is in the smectic phase or solid (non-nematic phase), which exceeds the operating temperature range of the liquid crystal display (Tni~Tsn), and the liquid crystal display cannot operate normally. It is necessary to use heating wires to heat the liquid crystal in the box to solve the technical problem that the liquid crystal display cannot operate normally when the ambient temperature is lower than Tsn.

[0003] In addition to introducing heating wires into the liquid crystal box to heat the liquid crystal in the box, a metal layer can also be introduced into the liquid crystal box as a touch function layer. The heating wires and the touch function layer are collectively referred to as a metal function layer. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a display substrate and a manufacturing method thereof, a liquid crystal display panel, and a display device, which can simplify the manufacturing process of the display substrate.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] On the one hand, a display substrate is provided, comprising a base substrate and a driving circuit layer arranged on the base substrate, the driving circuit layer comprising a gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer and a second electrode arranged in sequence, the driving circuit layer also comprising at least one layer of conductive functional pattern, the conductive functional pattern being used to realize a heating function or a touch function, the conductive functional pattern being arranged in the same layer and with the same material as at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode.

[0007] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, and the conductive functional patterns and the gate metal layer patterns are provided in the same layer and with the same material.

[0008] In some embodiments, the driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern and the source / drain metal layer pattern are provided in the same layer and with the same material.

[0009] In some embodiments, the driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern is provided in the same layer and with the same material as the first electrode.

[0010] In some embodiments, the driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern and the second electrode are provided in the same layer and with the same material.

[0011] In some embodiments, the conductive functional pattern includes a transparent conductive layer and a metal layer which are stacked, and the transparent conductive layer is located on a side of the metal layer close to the base substrate.

[0012] In some embodiments, the orthographic projection of the conductive functional pattern on the base substrate is located within the orthographic projection of the gate line or the data line of the display substrate on the base substrate.

[0013] An embodiment of the present invention further provides a liquid crystal display panel, comprising the display substrate as described above.

[0014] An embodiment of the present invention further provides a display device, comprising the liquid crystal display panel as described above.

[0015] An embodiment of the present invention further provides a method for manufacturing a display substrate, comprising:

[0016] providing a substrate base plate;

[0017] A gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer, and a second electrode are sequentially formed on the base substrate, and the method further comprises:

[0018] While forming at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode, at least one layer of conductive functional pattern is formed through the same patterning process, and the conductive functional pattern is used to realize a heating function or a touch function.

[0019] The embodiments of the present invention have the following beneficial effects:

[0020] In the above scheme, the conductive functional pattern of the display substrate is arranged in the same layer and the same material as the gate metal layer pattern, the source and drain metal layer pattern, the first electrode and the second electrode, which can simplify the structure of the display substrate, and the conductive functional pattern can be prepared by the same patterning process as the gate metal layer pattern, the source and drain metal layer pattern, the first electrode and the second electrode, which can simplify the production process of the display substrate and save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of an existing display substrate;

[0022] Figure 2-Figure 6 FIG. 1 is a schematic structural diagram of a display substrate according to an embodiment of the present invention.

[0023] Reference numerals

[0024] 01 Substrate

[0025] 02 Gate insulation layer

[0026] 03 Active layer

[0027] 04 Source and drain metal layer

[0028] 05 Buffer layer

[0029] 06 Organic insulation layer

[0030] 07 First passivation layer

[0031] 08 Second passivation layer

[0032] 09 The third passivation layer

[0033] 10 Pixel Electrode

[0034] 11 Gate Metal Layer

[0035] 12 Metal functional layer

[0036] 13 Common electrode

[0037] 21. Substrate

[0038] 22. First inorganic insulating layer

[0039] 23 Active layer

[0040] 24 Source and drain metal layer

[0041] 25. Second inorganic insulating layer

[0042] 26 Organic insulation layer

[0043] 27 Third inorganic insulating layer

[0044] 28 Second electrode

[0045] 29 Gate metal layer

[0046] 30 First electrode

[0047] 31 Conductive functional graphics

[0048] 281, 301, 311 transparent conductive layer

[0049] 282, 302, 312 metal layers DETAILED DESCRIPTION

[0050] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0051] In the related art, when making Figure 1 The display substrate including the metal functional layer as shown includes the following steps:

[0052] Step 1: forming a gate metal layer 11 on the base substrate 01, and forming a pattern of the gate metal layer 11 through a patterning process;

[0053] Step 2: deposit a layer of SiNx film on the gate metal layer 11, which is called the gate insulating layer (GI) 02, to isolate the gate metal layer 11 from the active layer (Active) 03.

[0054] Step 3: Form a layer of semiconductor material, and form the pattern of the active layer 03 through a patterning process.

[0055] Step 4, forming a source-drain metal layer 04, and forming a pattern of the source-drain metal layer 04 through a patterning process;

[0056] Step 5: Form a layer of SiNx film on the source-drain metal layer 04 as a buffer layer 05 to increase the adhesion between the source-drain metal layer 04 and the organic insulating layer 06 .

[0057] Step 6, forming an organic insulating layer 06, and forming the pattern of the organic insulating layer 06 through thin film deposition, photoresist coating, exposure, development, etching and stripping processes. The dielectric constant ε of the organic insulating layer 06 is 3.2, while the dielectric constant of SiNx is 5 to 8. The thickness d of the organic insulating layer 06 can be made relatively large, exceeding the maximum thickness of the SiNx layer. The capacitance is inversely proportional to the thickness of the insulating layer and proportional to the dielectric constant of the insulating layer. Therefore, using the organic insulating layer 06 instead of SiNx as the insulating layer material can effectively reduce the overlap capacitance between the metal functional layer and the source and drain metal layer 04, thereby reducing the coupling effect between the two and reducing the risk of poor display.

[0058] Step 7: Form a SiNx film as the first passivation layer 07. Since the organic insulating layer 06 has poor adhesion to the metal, the metal is easily peeled off and the film peeling (peeling) occurs. Therefore, after forming the organic insulating layer 06, a SiNx film is formed to prevent the metal from peeling from the organic insulating layer 06.

[0059] Step 8: forming a metal film layer, and patterning the metal film layer to form a metal functional layer 12 . The metal functional layer 12 can realize heating or touch control functions.

[0060] Step 9: forming a SiNx film as the second passivation layer 08 to prevent the metal functional layer 12 from being short-circuited with the common electrode 13 .

[0061] Step 10: forming a common electrode 13. The common electrode 13 may be formed by stacking transparent conductive patterns and metal patterns. The metal pattern may help reduce the resistance of the common electrode 13 of the display substrate, improve the stability of the common electrode 13, and reduce the risk of display defects such as afterimages.

[0062] Step 11: forming a SiNx film as a third passivation layer 09 to isolate the common electrode 13 and the pixel electrode 10 .

[0063] Step 12: deposit a metal film for making a pixel electrode, and form a pattern of the pixel electrode 10 through a patterning process.

[0064] The above display substrate has the following problems:

[0065] Problem (1): The metal functional layer 12 is made on the organic insulating layer 06, and has poor adhesion to the organic insulating layer 06. It is necessary to add a first passivation layer 07 to improve the adhesion, and then add a second passivation layer 08 to isolate the common electrode. In this way, the first passivation layer 07 and the second passivation layer 08 need to be introduced, which increases the structural complexity of the display substrate. In addition, at a temperature greater than or equal to 230 degrees Celsius, the organic insulating layer 06 is prone to overflowing gas, which will induce the first passivation layer 07 and the second passivation layer 08 to open, and multiple film layers are stacked, the stress increases, and it is easy to cause the organic insulating layer 06 and the film layers above the organic insulating layer 06 to crack, open, and fall off.

[0066] Problem (2): The common electrode 13 is raised by the first passivation layer 07 and the second passivation layer 08 due to the introduction of the metal functional layer 12. During the via-hole etching process, the common electrode 13 at the highest position is prone to burning.

[0067] Problem (3): Multilayer non-metallic structures are stacked to form a relatively thick layer. When forming metal transfer holes, it is necessary to perform ultra-deep hole etching on the buffer layer 05, the first passivation layer 07, the second passivation layer 08 and the third passivation layer 09. The depths of different types of metal transfer holes are inconsistent. Multiple types of metal transfer holes are etched at one time, resulting in a large amount of over-etching of some metal transfer holes.

[0068] Problem (4): At the welding lead between the gate line and the metal functional layer, multiple layers of non-metallic structures are stacked, and stress increases, causing the buffer layer 05 and the first passivation layer 07 to crack easily, which in turn causes the welding lead to fall off easily.

[0069] Embodiments of the present invention provide a display substrate and a manufacturing method thereof, a liquid crystal display panel, and a display device, which can simplify the manufacturing process of the display substrate.

[0070] An embodiment of the present invention provides a display substrate, including a base substrate and a driving circuit layer arranged on the base substrate, the driving circuit layer including a gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer and a second electrode arranged in sequence, the driving circuit layer also includes at least one layer of conductive functional pattern, the conductive functional pattern is used to realize a heating function or a touch function, and the conductive functional pattern is arranged in the same layer and the same material as at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode.

[0071] In this embodiment, the conductive functional pattern of the display substrate is arranged in the same layer and the same material as the gate metal layer pattern, the source and drain metal layer pattern, the first electrode and the second electrode. This can simplify the structure of the display substrate, and the conductive functional pattern can be prepared through the same patterning process as the gate metal layer pattern, the source and drain metal layer pattern, the first electrode and the second electrode. At least one, so can simplify the production process of the display substrate and save costs.

[0072] In this embodiment, the display substrate may include a layer of conductive functional graphics or multiple layers of conductive functional graphics. The conductive functional graphics can realize the heating function. When the liquid crystal display cannot work in a low temperature environment, the liquid crystal can be heated in the box to solve the technical problem that the liquid crystal display cannot operate normally when the ambient temperature is lower than Tsn. The conductive functional graphics can also be used as a touch function layer to realize the touch function.

[0073] When the display substrate includes a layer of conductive functional patterns, the conductive functional patterns can be arranged in the same layer and material as any one of the gate metal layer patterns, the source-drain metal layer patterns, the first electrode and the second electrode. When the display substrate includes multiple layers of conductive functional patterns, each layer of conductive functional patterns can be arranged in the same layer and material as any one of the gate metal layer patterns, the source-drain metal layer patterns, the first electrode and the second electrode.

[0074] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 2As shown, the display substrate includes a base substrate 21 and a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 arranged on the base substrate 21. The display substrate also includes a conductive functional pattern 31, and the conductive functional pattern 31 is arranged in the same layer and material as the pattern of the gate metal layer 29. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be arranged at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0075] In this embodiment, by providing the conductive functional pattern 31 and the gate metal layer 29 with the same layer and the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , two layers of inorganic insulating layers can be reduced, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the gate metal layer 29 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0076] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 3 As shown, the display substrate includes a base substrate 21 and a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 arranged on the base substrate 21. The display substrate also includes a conductive functional pattern 31, and the conductive functional pattern 31 is arranged in the same layer and material as the pattern of the source-drain metal layer 24. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the organic insulating layer 26 and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be arranged at the periphery of the display area of ​​the display substrate, and a signal can be input to the conductive functional pattern 31 through the signal line.

[0077] In this embodiment, by providing the conductive functional pattern 31 and the source / drain metal layer 24 with the same layer and the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the source and drain metal layer 24 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0078] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 4 As shown, the display substrate includes a base substrate 21 and a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 arranged on the base substrate 21. The display substrate also includes a conductive functional pattern 31, and the conductive functional pattern 31 is arranged in the same layer and material as the pattern of the first electrode 30. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the organic insulating layer 26 and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be arranged at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0079] In this embodiment, by providing the conductive functional pattern 31 and the first electrode 30 with the same layer and the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1, it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the first electrode 30 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0080] In this embodiment, in order to optimize the conductive performance of the first electrode 30 , the first electrode 30 is composed of a transparent conductive layer 301 and a metal layer 302 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0081] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 5 As shown, the display substrate includes a base substrate 21 and a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a second electrode 28, a third inorganic insulating layer 27 and a first electrode 30 arranged on the base substrate 21. The display substrate also includes a conductive functional pattern 31, and the conductive functional pattern 31 is arranged in the same layer and material as the pattern of the first electrode 30. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the organic insulating layer 26 and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be arranged at the periphery of the display area of ​​the display substrate, and a signal can be input to the conductive functional pattern 31 through the signal line.

[0082] In this embodiment, by providing the conductive functional pattern 31 and the first electrode 30 in the same layer and with the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1, it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the first electrode 30 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0083] In this embodiment, in order to optimize the conductive performance of the first electrode 30 , the first electrode 30 is composed of a transparent conductive layer 301 and a metal layer 302 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0084] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 6 As shown, the display substrate includes a base substrate 21 and a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 arranged on the base substrate 21. The display substrate also includes a conductive functional pattern 31, and the conductive functional pattern 31 is arranged in the same layer and material as the pattern of the second electrode 28. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be arranged at the periphery of the display area of ​​the display substrate, and a signal can be input to the conductive functional pattern 31 through the signal line.

[0085] In this embodiment, by providing the conductive functional pattern 31 and the second electrode 28 with the same layer and the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1, two layers of inorganic insulating layers can be reduced, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the second electrode 28 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0086] In this embodiment, in order to optimize the conductivity of the second electrode 28 , the second electrode 28 is composed of a transparent conductive layer 281 and a metal layer 282 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0087] In order to prevent the conductive functional pattern from affecting the aperture ratio of the display substrate, in some embodiments, the orthographic projection of the conductive functional pattern on the base substrate may be located within the orthographic projection of the gate line or data line of the display substrate on the base substrate.

[0088] An embodiment of the present invention further provides a liquid crystal display panel, comprising the display substrate as described above.

[0089] An embodiment of the present invention further provides a display device, comprising the liquid crystal display panel as described above.

[0090] The display device includes but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will appreciate that the structure of the above-mentioned display device does not constitute a limitation on the display device, and the display device may include more or less of the above-mentioned components, or a combination of certain components, or different component arrangements. In an embodiment of the present invention, the display device includes but is not limited to a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

[0091] The display device may be any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device further includes a flexible circuit board, a printed circuit board and a backplane.

[0092] An embodiment of the present invention further provides a method for manufacturing a display substrate, comprising:

[0093] providing a substrate base plate;

[0094] A gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer, and a second electrode are sequentially formed on the base substrate, and the method further comprises:

[0095] While forming at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode, at least one layer of conductive functional pattern is formed through the same patterning process, and the conductive functional pattern is used to realize a heating function or a touch function.

[0096] In this embodiment, the conductive functional pattern can be prepared with at least one of the gate metal layer pattern, the source / drain metal layer pattern, the first electrode and the second electrode through the same patterning process, which can simplify the manufacturing process of the display substrate and save costs.

[0097] In this embodiment, the display substrate may include a layer of conductive functional patterns or multiple layers of conductive functional patterns. The conductive functional patterns may realize a heating function. When the liquid crystal display cannot work in a low temperature environment, the liquid crystal may be heated in the box to solve the technical problem that the liquid crystal display cannot operate normally when the ambient temperature is lower than Tsn. The conductive functional patterns may also be used as a touch function layer to realize a touch function.

[0098] When the display substrate includes a layer of conductive functional patterns, the conductive functional patterns can be prepared through the same patterning process with any one of the gate metal layer patterns, the source-drain metal layer patterns, the first electrode, and the second electrode. When the display substrate includes multiple layers of conductive functional patterns, each layer of conductive functional patterns can be prepared through the same patterning process with any one of the gate metal layer patterns, the source-drain metal layer patterns, the first electrode, and the second electrode.

[0099] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 2 As shown, when manufacturing the display substrate, a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 are sequentially formed on the base substrate 21. While forming the gate metal layer 29, a conductive functional pattern 31 is formed by the same patterning process. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be set at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0100] In this embodiment, the conductive functional pattern 31 and the gate metal layer 29 are provided in the same layer and with the same material, which can simplify the structure of the display substrate, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the gate metal layer 29 are prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0101] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 3 As shown, when manufacturing the display substrate, a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 are sequentially formed on the base substrate 21. While forming the source-drain metal layer 24, a conductive functional pattern 31 is formed by the same patterning process. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be set at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0102] In this embodiment, the conductive functional pattern 31 and the source / drain metal layer 24 are provided in the same layer and with the same material, which can simplify the structure of the display substrate, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1, it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the source and drain metal layer 24 are prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0103] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 4 As shown, when manufacturing the display substrate, a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 are sequentially formed on the base substrate 21. While forming the first electrode 30, a conductive functional pattern 31 is formed by the same patterning process. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be set at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0104] In this embodiment, the conductive functional pattern 31 and the pattern of the first electrode 30 are arranged in the same layer and the same material, which can simplify the structure of the display substrate, and there is no need to arrange multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the first electrode 30 are prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0105] In this embodiment, in order to optimize the conductive performance of the first electrode 30 , the first electrode 30 is composed of a transparent conductive layer 301 and a metal layer 302 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0106] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 5 As shown, when manufacturing the display substrate, a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a second electrode 28, a third inorganic insulating layer 27 and a first electrode 30 are sequentially formed on the base substrate 21. While forming the first electrode 30, a conductive functional pattern 31 is formed by the same patterning process. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the organic insulating layer 26 and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be set at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0107] In this embodiment, by providing the conductive functional pattern 31 and the first electrode 30 with the same layer and the same material, the structure of the display substrate can be simplified, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the first electrode 30 can be prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0108] In this embodiment, in order to optimize the conductive performance of the first electrode 30 , the first electrode 30 is composed of a transparent conductive layer 301 and a metal layer 302 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0109] In some embodiments, the driving circuit layer includes a layer of conductive functional patterns, such as Figure 6As shown, when manufacturing the display substrate, a gate metal layer 29, a first inorganic insulating layer 22, an active layer 23, a source-drain metal layer 24, a second inorganic insulating layer 25, an organic insulating layer 26, a first electrode 30, a third inorganic insulating layer 27, and a second electrode 28 are sequentially formed on the base substrate 21. While forming the second electrode 28, a conductive functional pattern 31 is formed by the same patterning process. Among them, the second electrode 28 is a pixel electrode, which is connected to the source-drain metal layer 24 through a via hole penetrating the third inorganic insulating layer 27, the organic insulating layer 26, and the second inorganic insulating layer 25, and the first electrode 30 is a common electrode. In this embodiment, a signal line leading out the conductive functional pattern 31 can be set at the periphery of the display area of ​​the display substrate, and a signal is input to the conductive functional pattern 31 through the signal line.

[0110] In this embodiment, the conductive functional pattern 31 and the second electrode 28 are provided in the same layer and the same material, which can simplify the structure of the display substrate, and there is no need to provide multiple inorganic insulating layers on the organic insulating layer 26. Figure 1 , it is possible to reduce two layers of inorganic insulating layers, thereby avoiding the problem of cracking, opening, and falling off of the film layer above the organic insulating layer 26; in addition, since the overall thickness of the non-metallic film layer of the display substrate is reduced, ultra-deep hole etching can be avoided, and then when etching various types of metal transfer holes, the over-etching amount of some metal transfer holes can be reduced, thereby improving the yield of the display substrate. In addition, in this embodiment, the first electrode 30 will not be raised due to the introduction of the metal functional layer 12, and the first electrode 30 is not prone to burning during the via etching process. Due to the reduction of the non-metallic structure of the display substrate, the stress of the display substrate is reduced, and the risk of the welding lead falling off can be avoided. Furthermore, the conductive functional pattern 31 and the pattern of the second electrode 28 are prepared by the same composition process, which can simplify the production process of the display substrate and save costs.

[0111] In this embodiment, in order to optimize the conductivity of the second electrode 28 , the second electrode 28 is composed of a transparent conductive layer 281 and a metal layer 282 stacked together. Similarly, the conductive functional pattern 31 is composed of a transparent conductive layer 311 and a metal layer 312 stacked together.

[0112] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0113] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0114] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0115] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0116] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that: It includes a base substrate and a driving circuit layer arranged on the base substrate, the driving circuit layer includes a gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer and a second electrode arranged in sequence, the driving circuit layer also includes at least one layer of conductive functional pattern, the conductive functional pattern is used to realize a heating function or a touch function, and the conductive functional pattern is arranged in the same layer and the same material as at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode.

2. The display substrate according to claim 1, characterized in that: The driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern and the gate metal layer pattern are arranged in the same layer and with the same material.

3. The display substrate according to claim 1, characterized in that: The driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern and the source-drain metal layer pattern are arranged in the same layer and with the same material.

4. The display substrate according to claim 1, characterized in that: The driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern is provided in the same layer and with the same material as the first electrode.

5. The display substrate according to claim 1, characterized in that: The driving circuit layer includes a layer of conductive functional pattern, and the conductive functional pattern and the second electrode are arranged in the same layer and with the same material.

6. The display substrate according to claim 4 or 5, characterized in that: The conductive functional pattern comprises a transparent conductive layer and a metal layer which are stacked, and the transparent conductive layer is located on a side of the metal layer close to the base substrate.

7. The display substrate according to claim 4 or 5, characterized in that: The orthographic projection of the conductive functional pattern on the base substrate is located within the orthographic projection of the gate line or the data line of the display substrate on the base substrate.

8. A liquid crystal display panel, characterized in that: The invention comprises a display substrate as claimed in any one of claims 1 to 7.

9. A display device, characterized in that: Comprising the liquid crystal display panel as claimed in claim 8.

10. A method for manufacturing a display substrate, characterized in that: include: providing a substrate base plate; A gate metal layer pattern, a first inorganic insulating layer, a semiconductor layer, a source-drain metal layer pattern, a second inorganic insulating layer, an organic insulating layer, a first electrode, a third inorganic insulating layer, and a second electrode are sequentially formed on the base substrate, and the method further comprises: While forming at least one of the gate metal layer pattern, the source-drain metal layer pattern, the first electrode and the second electrode, at least one layer of conductive functional pattern is formed through the same patterning process, and the conductive functional pattern is used to realize a heating function or a touch function.

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