Four-in-one lamp bead and preparation method thereof

Abstract

The invention relates to the technical field of photoelectricity, and discloses a preparation method of a four-in-one lamp bead, which comprises the following steps of: providing lamp beads, fixing the four lamp beads on a substrate to obtain a lamp bead substrate assembly, and taking one surface of the lamp bead substrate assembly, which is provided with the lamp beads, as a front surface; preparing a waterproof layer on the front surface of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly; and the first lamp bead substrate assembly and epoxy resin are both placed in a mold, an epoxy resin packaging layer is formed outside the waterproof layer after compression molding, and the four-in-one lamp bead is formed after cutting. According to the four-in-one lamp bead provided by the invention, the manufacturing consistency can be improved, and the air tightness of the manufactured lamp bead is good.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic technology, and in particular to a four-in-one lamp bead and a preparation method thereof. Background Art

[0002] Compared with outdoor lamp beads, indoor lamp beads do not have a tensile structure, so the air tightness is worse. At the same time, after the client is mounted, the outdoor display will use potting glue to seal the pins to improve the air tightness of the outdoor display. Indoor display screens cannot be sealed with potting glue because the indoor lamp beads are not stretched, the height of the lamp beads is low, and the dot spacing of the indoor display screen is small, which causes the moisture of the indoor display screen to easily invade the inside of the lamp beads along the lamp bead pins, causing the lamp beads to burn out or string light and other undesirable phenomena, affecting the appearance of the display screen. Moreover, because the pins of the lamp beads are formed by bending, the pins on both sides of the lamp beads are prone to form a height difference, and the lamp beads will also be uneven when mounted on the client; at the same time, because the lamp bead encapsulation glue is formed by dispensing, the glue surface will also form different height differences, and the lamp beads will also be uneven when mounted on the client; resulting in poor consistency of the display screen. At the same time, most of the indoor lamp beads are single-lamp structures, which affects the efficiency of the client patch. Even the four-in-one lamp beads still have the same problems as single lamps, especially the consistency of the lamp beads is worse. To achieve high-standard display screens, the lamp bead yield will inevitably be low. At the same time, during the packaging and die bonding process of the indoor four-in-one, since the chip is randomly bonded, the differences between the four groups of indoor four-in-one chips may be very different, resulting in very large differences in optoelectronic parameters, affecting the display effect of the display screen. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for preparing a four-in-one lamp bead, which has high manufacturing quality consistency and good air tightness of the prepared lamp bead.

[0004] The technical problem to be solved by the present invention is also to provide a four-in-one lamp bead with good air tightness.

[0005] In order to solve the above technical problems, the present invention provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0006] Provide lamp beads, and fix four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the side of the lamp bead substrate assembly provided with the lamp beads is the front side;

[0007] A waterproof layer is prepared on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly;

[0008] The first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin packaging layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

[0009] In some embodiments, fixing the four lamp beads on a substrate includes:

[0010] The lamp beads are lamp beads that have been sorted by spectroscopy. The lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate.

[0011] In some embodiments, a through hole is provided on the substrate, and the integrated circuit structure of the four lamp beads is electrically connected to the pins of the lamp beads through the through hole.

[0012] In some embodiments, the waterproof layer includes a first silicon oxide layer, an aluminum oxide layer, and a second silicon oxide layer stacked in sequence.

[0013] In some embodiments, the thickness of the first silicon oxide layer is 10 nm to 20 nm;

[0014] The thickness of the aluminum oxide layer is 10nm to 20nm;

[0015] The thickness of the second silicon oxide layer is 10 nm to 20 nm.

[0016] In some embodiments, the first silicon oxide layer is prepared by the following method:

[0017] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 300° C. to 700° C.

[0018] In some embodiments, the aluminum oxide layer is prepared by the following method:

[0019] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at a temperature of 200° C. to 400° C.

[0020] In some embodiments, the second silicon oxide layer is prepared by the following method:

[0021] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 300° C. to 700° C.

[0022] In some embodiments, the compression molding pressure is 10 MPa to 30 MPa and the temperature is 120° C. to 170° C.;

[0023] The compression molding has a compression time of 5 to 15 minutes and a curing time of 45 to 75 minutes.

[0024] Correspondingly, the present invention provides a four-in-one lamp bead, and the four-in-one lamp bead is manufactured using the preparation method of the four-in-one lamp bead.

[0025] The implementation of the present invention has the following beneficial effects:

[0026] 1. The integrated four-in-one lamp beads are formed by molding, so the surface of the lamp beads is also very flat, ensuring the consistency of the display screen while ensuring the consistency of the ink color of the display screen, improving the viewing effect of the display screen;

[0027] 2. The lamp beads are coated with a waterproof layer to improve the air tightness of the lamp beads, and are encapsulated with epoxy resin to further improve the air tightness of the lamp beads, improve the overall air tightness, and improve the reliability of the display screen;

[0028] 3. The integrated four-in-one lamp bead is equivalent to four lamp beads combined into one, which increases the anti-collision ability of the lamp bead and improves the client mounting efficiency. At the same time, it reduces the client PCB circuit layout and simplifies the PCB structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of a lamp bead substrate assembly in the method for preparing a four-in-one lamp bead provided by the present invention;

[0030] Figure 2 A schematic diagram of the structure of the lamp bead substrate assembly after a waterproof layer is prepared in the method for preparing the four-in-one lamp bead provided by the present invention;

[0031] Figure 3 This is a schematic structural diagram of the lamp bead substrate assembly after a waterproof layer and an epoxy resin layer are prepared in the preparation method of the four-in-one lamp bead provided by the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0033] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0038] In the present invention, "preferred" and "better" are only used to describe implementation methods or embodiments with better effects, and it should be understood that they do not constitute a limitation on the scope of protection of the present invention. In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features. In the present invention, when involving numerical ranges, unless otherwise specified, the two endpoints of the numerical range are included.

[0039] In order to solve the above problems, the present invention provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0040] (1) providing lamp beads, and fixing four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the side of the lamp bead substrate assembly provided with the lamp beads is the front side;

[0041] In some embodiments, Figure 1 As shown, four lamp beads are fixed on a substrate, including:

[0042] The lamp beads are lamp beads that have been sorted by light splitting, and the lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate. In some embodiments, the substrate is provided with through holes, and the integrated circuit structures of the four lamp beads and the pins of the lamp beads are electrically connected through the through holes.

[0043] Preferably, the substrate is a BT substrate, which is a copper-clad laminate made of a mixture of BT resin (Bismaleimide Triazine) and epoxy resin as a base material. The BT resin substrate has strong anti-discoloration ability and high reflectivity of LED light.

[0044] The present invention combines four lamp beads into one, thereby increasing the anti-collision capability of the lamp beads and improving the client mounting efficiency, while reducing the client PCB circuit layout and simplifying the PCB structure.

[0045] (2) Figure 2As shown, a waterproof layer is prepared on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly;

[0046] In some embodiments, the waterproof layer includes a first silicon oxide layer, an aluminum oxide layer, and a second silicon oxide layer stacked in sequence. Among them, the first silicon oxide layer serves as a preliminary waterproof layer, which can effectively resist the initial penetration of water. The aluminum oxide layer plays a key barrier role in the middle, and its dense characteristics further block the penetration of water. The second silicon oxide layer serves as the final waterproof layer, further enhancing the overall waterproof effect. Silicon oxide and aluminum oxide each have their own advantages in waterproofing, and the multilayer structure can make full use of these advantages to form a complementary effect. The aluminum oxide layer and the silicon oxide layer have good adhesion and can be tightly combined together to improve the overall structural stability of the waterproof layer.

[0047] In some embodiments, the thickness of the first silicon oxide layer is 10nm to 20nm; the thickness of the aluminum oxide layer is 10nm to 20nm; and the thickness of the second silicon oxide layer is 10nm to 20nm. Preferably, the thickness of the first silicon oxide layer is 12nm to 18nm; the thickness of the aluminum oxide layer is 12nm to 18nm; and the thickness of the second silicon oxide layer is 12nm to 18nm.

[0048] In some embodiments, the first silicon oxide layer is prepared by the following method:

[0049] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 300° C. to 700° C.

[0050] In some embodiments, the aluminum oxide layer is prepared by the following method:

[0051] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at a temperature of 200° C. to 400° C.

[0052] In some embodiments, the second silicon oxide layer is prepared by the following method:

[0053] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 300° C. to 700° C.

[0054] The waterproof film is coated with ALD, which has higher step coverage and more uniform film-forming ability. ALD technology can ensure that a dense, uniform and thickness-controlled thin film can be formed on any surface with complex morphology, thereby further ensuring the reliability of the waterproof film.

[0055] The lamp beads of the present invention are coated with a waterproof layer, which improves the air tightness of the lamp beads and improves the reliability of the display screen.

[0056] (3) Figure 3 As shown, the first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin packaging layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

[0057] In some embodiments, the compression molding pressure is 10MPa to 30MPa, the temperature is 120°C to 170°C, the compression molding time is 5min to 15min, and the curing time is 45min to 75min. Preferably, the compression molding pressure is 15MPa to 25MPa, the temperature is 130°C to 160°C, the compression molding time is 6min to 12min, and the curing time is 50min to 70min.

[0058] The integrated four-in-one lamp beads are formed by molding, so the surface of the lamp beads is also very flat, which ensures the consistency of the display screen while ensuring the consistency of the ink color of the display screen, improving the viewing effect of the display screen.

[0059] Correspondingly, the present invention provides a four-in-one lamp bead, and the four-in-one lamp bead is manufactured using the preparation method of the four-in-one lamp bead.

[0060] The present invention is further described below with specific embodiments:

[0061] Example 1

[0062] This embodiment provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0063] (1) providing lamp beads, fixing four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the lamp bead substrate assembly has a side provided with the lamp beads as a front side, and specifically comprises:

[0064] The lamp beads are lamp beads that have been subjected to spectroscopic sorting, and the lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate. The substrate is provided with through holes, and the integrated circuit structures of the four lamp beads and the pins of the lamp beads are electrically connected through the through holes.

[0065] (2) preparing a waterproof layer on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly;

[0066] Wherein, the waterproof layer comprises a first silicon oxide layer, an aluminum oxide layer and a second silicon oxide layer stacked in sequence;

[0067] The first silicon oxide layer is prepared by the following method:

[0068] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 350°C.

[0069] In some embodiments, the aluminum oxide layer is prepared by the following method:

[0070] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at 250°C.

[0071] In some embodiments, the second silicon oxide layer is prepared by the following method:

[0072] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 400°C.

[0073] (3) The first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin encapsulation layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

[0074] The compression molding pressure is 20 MPa, the temperature is 150° C., the compression molding time is 10 min, and the curing time is 30 min.

[0075] Example 2

[0076] This embodiment provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0077] (1) providing lamp beads, fixing four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the lamp bead substrate assembly has a side provided with the lamp beads as a front side, and specifically comprises:

[0078] The lamp beads are lamp beads that have been subjected to spectroscopic sorting, and the lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate. The substrate is provided with through holes, and the integrated circuit structures of the four lamp beads and the pins of the lamp beads are electrically connected through the through holes.

[0079] (2) preparing a waterproof layer on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly;

[0080] Wherein, the waterproof layer comprises a first silicon oxide layer, an aluminum oxide layer and a second silicon oxide layer stacked in sequence;

[0081] The first silicon oxide layer is prepared by the following method:

[0082] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 400°C.

[0083] In some embodiments, the aluminum oxide layer is prepared by the following method:

[0084] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at 250°C.

[0085] In some embodiments, the second silicon oxide layer is prepared by the following method:

[0086] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 500°C.

[0087] (3) The first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin encapsulation layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

[0088] The compression molding pressure is 20 MPa, the temperature is 150° C., the compression molding time is 10 min, and the curing time is 30 min.

[0089] Example 3

[0090] This embodiment provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0091] (1) providing lamp beads, fixing four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the lamp bead substrate assembly has a side provided with the lamp beads as a front side, and specifically comprises:

[0092] The lamp beads are lamp beads that have been subjected to spectroscopic sorting, and the lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate. The substrate is provided with through holes, and the integrated circuit structures of the four lamp beads and the pins of the lamp beads are electrically connected through the through holes.

[0093] (2) preparing a waterproof layer on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly;

[0094] Wherein, the waterproof layer comprises a first silicon oxide layer, an aluminum oxide layer and a second silicon oxide layer stacked in sequence;

[0095] The first silicon oxide layer is prepared by the following method:

[0096] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 450°C.

[0097] In some embodiments, the aluminum oxide layer is prepared by the following method:

[0098] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at 300°C.

[0099] In some embodiments, the second silicon oxide layer is prepared by the following method:

[0100] The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 550° C.

[0101] (3) The first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin encapsulation layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

[0102] The compression molding pressure is 20 MPa, the temperature is 150° C., the compression molding time is 10 min, and the curing time is 30 min.

[0103] Comparative Example 1

[0104] This comparative example provides a method for preparing a four-in-one lamp bead, comprising the following steps:

[0105] Provide lamp beads, fix four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the lamp bead substrate assembly has a side with lamp beads as the front side, and specifically includes: the lamp beads are lamp beads after spectroscopic sorting, the lamp beads are mounted on the substrate, the integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, the pins of the lamp beads are arranged on the back side of the substrate, the substrate is provided with through holes, and the integrated circuit structures of the four lamp beads and the pins of the lamp beads are electrically connected through the through holes.

[0106] The four-in-one lamp beads prepared in Examples 1 to 3 and Comparative Example 1 were subjected to air tightness tests and ink color consistency evaluations. The specific test results are shown in Table 1.

[0107] Table 1 Performance test results of four-in-one lamp beads prepared in Examples 1 to 3 and Comparative Example 1

[0108]

[0109] From the comparison data, it can be seen that the preparation method of the four-in-one lamp beads provided in Examples 1 to 3 of the present invention, the integrated four-in-one lamp beads are formed by molding, so the surface of the lamp beads is also very smooth, ensuring the consistency of the display screen while ensuring the consistency of the ink color of the display screen, improving the viewing effect of the display screen; the lamp beads are coated with a waterproof layer to improve the air tightness of the lamp beads, and are encapsulated with epoxy resin to further improve the air tightness of the lamp beads, improve the overall air tightness, and improve the reliability of the display screen; the integrated four-in-one lamp bead is equivalent to four lamp beads combined into one, which increases the anti-collision ability of the lamp bead, improves the client mounting efficiency, and at the same time reduces the client PCB circuit line layout and simplifies the PCB structure.

[0110] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0111] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. A method for preparing a four-in-one lamp bead, characterized in that: The following steps are involved: Provide lamp beads, and fix four of the lamp beads on a substrate to obtain a lamp bead substrate assembly, wherein the side of the lamp bead substrate assembly provided with the lamp beads is the front side; A waterproof layer is prepared on the front side of the lamp bead substrate assembly to obtain a first lamp bead substrate assembly; The first lamp bead substrate assembly and epoxy resin are placed in a mold, and an epoxy resin packaging layer is formed outside the waterproof layer after compression molding, and a four-in-one lamp bead is formed after cutting.

2. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: Fixing the four lamp beads on a substrate includes: The lamp beads are lamp beads that have been sorted by spectroscopy. The lamp beads are mounted on the substrate. The integrated circuit structures of the four lamp beads are arranged on the front side of the substrate, and the pins of the lamp beads are arranged on the back side of the substrate.

3. The method for preparing the four-in-one lamp bead according to claim 2, characterized in that: The substrate is provided with through holes, and the integrated circuit structures of the four lamp beads are electrically connected to the pins of the lamp beads through the through holes.

4. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: The waterproof layer includes a first silicon oxide layer, an aluminum oxide layer and a second silicon oxide layer stacked in sequence.

5. The method for preparing the four-in-one lamp bead according to claim 4, characterized in that: The thickness of the first silicon oxide layer is 10nm to 20nm; The thickness of the aluminum oxide layer is 10nm to 20nm; The thickness of the second silicon oxide layer is 10 nm to 20 nm.

6. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: The first silicon oxide layer is prepared by the following method: The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a first silicon oxide layer is grown at 300° C. to 700° C.

7. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: The aluminum oxide layer is prepared by the following method: The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, trimethylaluminum and oxygen are introduced, and an aluminum oxide layer is grown at a temperature of 200° C. to 400° C.

8. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: The second silicon oxide layer is prepared by the following method: The lamp bead substrate assembly is placed in a reaction chamber of an ALD deposition device, hexamethylsilane and oxygen are introduced, and a second silicon oxide layer is grown at 300° C. to 700° C.

9. The method for preparing the four-in-one lamp bead according to claim 1, characterized in that: The compression molding pressure is 10MPa to 30MPa and the temperature is 120°C to 170°C; The compression molding has a compression time of 5 to 15 minutes and a curing time of 45 to 75 minutes.

10. A four-in-one lamp bead, characterized in that: The four-in-one lamp bead is prepared by the preparation method of the four-in-one lamp bead as described in any one of claims 1 to 9.

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