Diluent composition and method for treating substrate

Abstract

The invention provides a diluent composition and a substrate processing method. The diluent composition comprises a solvent (A) and a fluorine-containing additive (B). The fluorine-containing additive (B) includes a compound represented by formula (B-1), a polymer represented by formula (B-2), a polymer represented by formula (B-3), or a combination thereof. # imgabs0 # in formula (B-1), formula (B-2), and formula (B-3), the definitions of X1 to X10, R1 to R13, m, T, j, k, p, and q are the same as defined in the specification.

Description

Technical Field

[0001] The invention relates to a diluent composition, and in particular to a diluent composition and a substrate processing method. Background Art

[0002] With the rapid development of semiconductor devices, display devices or optical elements, in order to expand their application, the demand for performance and quality is gradually increasing. For example, in the manufacturing process of semiconductor devices, a photoresist composition is usually coated on a substrate to form a photoresist layer. However, the photoresist composition may form deposits of varying sizes on the surface of the substrate, causing problems such as focusing in the subsequent manufacturing process, thereby affecting the performance of the device produced. Summary of the invention

[0003] The invention provides a diluent composition capable of effectively removing protrusions at the edge of a substrate and a method for processing the substrate.

[0004] The present invention provides a diluent composition. The diluent composition includes a solvent (A) and a fluorine-containing additive (B). The fluorine-containing additive (B) includes a compound represented by the following formula (B-1), a polymer represented by the following formula (B-2), a polymer represented by the following formula (B-3), or a combination thereof:

[0005]

[0006] In formula (B-1), X 1 To X 7 Each represents hydrogen, fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms, and X 1 To X 7 At least one of them is fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms;

[0007]

[0008] In formula (B-2), R 1 and R 9 Each represents C y H 2y-3 O z , wherein y represents an integer from 4 to 25, and z represents an integer from 1 to 7,

[0009] R 2 , R 4 , R 5 , R 6 and R 8 each represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms,

[0010] R 3 and R 7 Each represents Cn H 2n-2 , where n represents an integer from 4 to 25,

[0011] X 8 represents a fluorinated alkyl group having 1 to 3 carbon atoms,

[0012] m represents an integer from 2 to 39,

[0013] When m is an integer greater than or equal to 3, multiple R 5 Same or different from each other, and multiple X 8 the same as or different from each other;

[0014]

[0015] In formula (B-3), X 9 and X 10 Each represents C r F 2r-1 , where r represents an integer from 2 to 15,

[0016] R 10 To R 13 each represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a hydroxyl group,

[0017] T represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a hydroxyl group, a carboxyl group, *-COOCH3, *-COOC2H5, an aldehyde group, an amine group, *-OSO3H, *-OSO3NH4, *-OSO3Na, *-OSO3K, wherein * represents a bonding position,

[0018] j and q each represent an integer from 2 to 30,

[0019] k represents an integer from 0 to 20,

[0020] p represents an integer from 1 to 9,

[0021] When j, k, p and q are each an integer greater than or equal to 2, multiple R 11 Same or different from each other, multiple R 12 Same or different from each other, multiple R 13 Same or different from each other, multiple X 10 The same or different from each other.

[0022] In one embodiment of the present invention, the solvent (A) includes propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, n-butyl acetate, N-methylpyrrolidone, isobutyl alcohol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol, butanol or a combination thereof.

[0023] In one embodiment of the present invention, the solvent (A) is a mixed solvent. The mixed solvent is a mixture of at least two different organic solvents.

[0024] In one embodiment of the present invention, the boiling point of the mixed solvent is 70° C. to 170° C., and the turbidity is less than or equal to 0.02 NTU.

[0025] In one embodiment of the present invention, the solvent (A) includes propylene glycol monomethyl ether, and further includes at least one of propylene glycol monomethyl ether acetate, n-butyl acetate, N-methylpyrrolidone, isobutyl alcohol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol and butanol.

[0026] In one embodiment of the present invention, the solvent (A) is a mixed solvent of propylene glycol monomethyl ether and n-butyl acetate, and the mixing ratio of propylene glycol monomethyl ether to n-butyl acetate is 5:95 to 45:55.

[0027] In one embodiment of the present invention, the solvent (A) is a mixed solvent of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, wherein the mixing ratio of propylene glycol monomethyl ether to propylene glycol monomethyl ether acetate is 50:50 to 90:10.

[0028] In one embodiment of the present invention, based on 100 parts by weight of the diluent composition, the amount of the fluorine-containing additive (B) is 0.001 parts by weight to 3 parts by weight.

[0029] A substrate processing method of the present invention includes applying the above-mentioned diluent composition to the surface of the substrate.

[0030] In one embodiment of the present invention, the diluent composition is applied to the edge of the substrate surface.

[0031] In one embodiment of the present invention, a photoresist composition has been coated on the surface of the substrate, and the diluent composition removes protrusions on the edge of the surface of the photoresist composition.

[0032] Based on the above, the diluent composition of the present invention includes a fluorine-containing additive (B) having a specific structure, so that when the diluent composition is used in a method for treating a substrate, the protrusions on the edge of the substrate can be removed well.

[0033] In order to make the above features and advantages of the present invention more obvious and easy to understand, embodiments are specifically described in detail below. DETAILED DESCRIPTION

[0034] <Diluent composition>

[0035] The present invention provides a diluent composition, comprising a solvent (A) and a fluorine-containing additive (B). In addition, the diluent composition of the present invention may include other suitable additives as needed. The above-mentioned various components will be described in detail below.

[0036] Solvent (A)

[0037] The solvent (A) is not particularly limited, and an appropriate solvent can be selected according to the requirements. For example, the solvent (A) can include propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, n-butyl acetate, N-methyl pyrrolidone, isobutyl alcohol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol, butanol, combinations thereof, or other suitable solvents.

[0038] In the present embodiment, the solvent (A) is preferably a mixed solvent. The mixed solvent may be a mixture of at least two different organic solvents. The boiling point of the mixed solvent may be 70°C to 170°C, preferably 80°C to 150°C. The turbidity of the mixed solvent may be less than or equal to 0.02NTU, preferably 0.001NTU to 0.01NTU. The solvent (A) may preferably be mixed with propylene glycol monomethyl ether and other solvents to form a mixed solvent. For example, the solvent (A) may include propylene glycol monomethyl ether, and may further include propylene glycol monomethyl ether acetate, n-butyl acetate, N-methylpyrrolidone, isobutanol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol and at least one of butanol. In this embodiment, the solvent (A) is preferably a mixed solvent of propylene glycol monomethyl ether and n-butyl acetate or a mixed solvent of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.

[0039] In the mixed solvent of propylene glycol monomethyl ether and n-butyl acetate, the mixing ratio of propylene glycol monomethyl ether to n-butyl acetate can be 5:95 to 45:55, preferably 10:90 to 40:60. For example, when the mixing ratio of propylene glycol monomethyl ether to n-butyl acetate is 20:80, the turbidity is about 0.003 NTU. When the mixing ratio of propylene glycol monomethyl ether to n-butyl acetate is 40:60, the turbidity is about 0.003 NTU.

[0040] In the mixed solvent of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, the mixing ratio of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate can be 50:50 to 90:10, preferably 60:40 to 80:20. For example, when the mixing ratio of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate is 70:30, the turbidity is about 0.003 NTU.

[0041] When the diluent composition includes the solvent (A), the diluent composition can have an appropriate viscosity, so that it can be well applied to the surface of the substrate and well remove the protrusions on the edge of the substrate.

[0042] Fluorinated additives (B)

[0043] The fluorine-containing additive (B) includes a compound represented by the following formula (B-1), a polymer represented by the following formula (B-2), a polymer represented by the following formula (B-3), or a combination thereof. The fluorine-containing additive (B) may further include other suitable fluorine-containing additives.

[0044]

[0045] In formula (B-1),

[0046] X 1 To X 7 Each represents hydrogen, fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms, preferably fluorine, difluoromethyl or fluoromethyl; and

[0047] X 1 To X 7 At least one of them is fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms, and preferably at least five of them are fluorine, difluoromethyl or fluoromethyl.

[0048]

[0049] In formula (B-2),

[0050] R 1 and R 9 Each represents C y H 2y-3 O z , wherein y represents an integer of 4 to 25, preferably an integer of 5 to 15; z represents an integer of 1 to 7, preferably an integer of 1 to 4;

[0051] R 2 , R 4 , R 5 , R 6 and R 8 Each represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, preferably hydrogen, methyl, ethyl, methoxy, or ethoxy;

[0052] R 3 and R 7 Each represents C n H 2n-2 , wherein n represents an integer of 4 to 25, preferably an integer of 5 to 19;

[0053] X 8represents a fluorinated alkyl group having 1 to 3 carbon atoms, preferably trifluoromethyl, difluoroethyl, trifluoroethyl, tetrafluoroethyl, pentafluoroethyl or pentafluoropropyl;

[0054] m represents an integer of 2 to 39, preferably an integer of 3 to 29;

[0055] When m is an integer greater than or equal to 3, multiple R 5 Same or different from each other, and multiple X 8 The same or different from each other.

[0056] In this embodiment, R 1 and R 9 Preferred are oxyalkylene groups (e.g., 1,3-butadienylethoxy, 1,4-pentadienylmethoxy), esteralkylene groups (e.g., ethyl acrylate, methyl crotonate, propyl vinylate), or cycloalkylene groups (e.g., cyclohexanonemethoxy, cyclopentanoneethoxy). 3 and R 7 Each includes a ring or an unsaturated bond (such as a cycloalkyl group, an alkenyl group, a cycloalkylene group or an alkenylene group), and preferably includes a cycloalkyl group or a cycloalkylene group. 3 and R 7 Preferred are alkenyl (e.g. ) or a cycloalkylene group (e.g. ).

[0057]

[0058] In formula (B-3),

[0059] X 9 and X 10 Each represents C r F 2r-1 , wherein r represents an integer of 2 to 15, preferably an integer of 3 to 12;

[0060] R 10 To R 13 Each represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a hydroxyl group, preferably hydrogen, methyl, ethyl, methoxy, or ethoxy;

[0061] T represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a hydroxyl group, a carboxyl group, *-COOCH3, *-COOC2H5, an aldehyde group, an amine group, *-OSO3H, *-OSO3NH4, *-OSO3Na, *-OSO3K, wherein * represents a bonding position, preferably hydrogen, methyl, ethyl, methoxy, ethoxy, hydroxyl or carboxyl group;

[0062] j represents an integer of 2 to 30, preferably an integer of 2 to 20;

[0063] q represents an integer of 2 to 30, preferably an integer of 2 to 20;

[0064] k represents an integer of 0 to 20, preferably an integer of 2 to 13;

[0065] p represents an integer of 1 to 9, preferably an integer of 1 to 5;

[0066] When j, k, p and q are each an integer greater than or equal to 2, multiple R 11 Same or different from each other, multiple R 12 Same or different from each other, multiple R 13 Same or different from each other, multiple X 10 The same or different from each other.

[0067] In this embodiment, X 9 and X 10 Each includes a ring or an unsaturated bond (such as a cycloalkyl group, an alkenyl group, a cycloalkylene group or an alkenylene group), and preferably includes an alkenyl group or an alkenylene group. 9 and X 10 Preferably, it is a fluorinated cycloalkyl group (e.g., 1-(1,1,1-trifluoromethyl)-1,2,2,3,3,4,5,5,6,6-decafluorocyclohexane-4,4-difluoromethyl, 1,2,2,3,4,5,5-heptafluorocyclopentane-3,4-bistrifluoromethyl-1-(1,1,2,2,3,3-hexafluoropropyl), 1,2,2,3,4,4,5,6,6-nonafluorocyclohexane-3,5-bistrifluoromethyl-1-(1,1,2,2,3,3-hexafluoropropyl) or a fluorinated alkenyl group (e.g., 4-perfluoroisopropyl-2,5-bistrifluoromethyl-1,1,1,2,5,6,6,6-octafluoro-3-hexenyl, 3-perfluoropropyl-5-trifluoromethyl-1,1,1,4,4,5,6,6,6- 1,1,2,2,5,6,6,6-nonafluoro-3-hexenyl, 3-perfluoroethyl-4-difluoromethyl-1,1,2,3,4,5,5,6,6,6-decafluoro-1-hexenyl, 3-perfluoroethyl-1,1,1,4,4,5,5,6,6-decafluoro-2-hexenyl) or fluorine-containing alkenyl (for example, 3,4-perfluoroethyl-1,1,1,2,2,5,6,6,7,7,7-undecafluoro-3-heptenyl, 3,4-perfluoroethyl-1,1,1,2,2,5,6,6,6-nonafluoro-3-hexenyl, 3-perfluoroethyl-4-difluoromethyl-1,1,2,3,4,5,5,6,6,6-decafluoro-1-hexenyl, 3-perfluoroethyl-1,1,1,2,2,4,5,5,6,6-decafluoro-3-hexenyl).

[0068] The molecular weight of the compound represented by formula (B-3) is 1,000 to 10,000, preferably 2,000 to 5,000.

[0069] Based on 100 parts by weight of the diluent composition, the amount of the fluorine-containing additive (B) is 0.001 parts by weight to 3 parts by weight, preferably 0.01 parts by weight to 1.0 parts by weight.

[0070] When the diluent composition includes a fluorine-containing additive (B) having a specific structure, the diluent composition can be used in a method for treating a substrate to effectively remove protrusions at the edge of the substrate. For example, when a photoresist composition is coated on the surface of the substrate and there are protrusions at the edge of the surface of the photoresist composition, the fluorine-containing additive (B) having a specific structure can reduce the intermolecular forces in the photoresist composition, thereby reducing the phenomenon of protrusions at the edge of the surface of the photoresist formed by the photoresist composition, and thus effectively removing the protrusions from the edge of the substrate.

[0071] <Method for preparing diluent composition>

[0072] The preparation method of the diluent composition is not particularly limited. For example, the solvent (A) and the fluorine-containing additive (B) are placed in a stirrer and stirred to uniformly mix them into a solution state. If necessary, other suitable additives may be added. After uniform mixing, a liquid diluent composition can be obtained.

[0073] <Method of Substrate Processing>

[0074] An exemplary embodiment of the present invention provides a method of processing a substrate including applying the diluent composition to a surface of the substrate.

[0075] For example, the method for processing a substrate may include: coating a photoresist composition on a substrate surface, and forming protrusions at the edge of the substrate surface; applying a diluent composition to the substrate surface, especially the edge of the substrate surface; and removing the protrusions at the edge of the surface.

[0076] In this embodiment, the substrate surface may be coated with a photoresist composition first, and then the diluent composition is applied to the surface of the photoresist composition. For example, when the photoresist composition is coated on the substrate surface, the photoresist composition is likely to form a protrusion at the edge of the substrate surface, that is, a protrusion formed at the edge of the photoresist surface. Therefore, the diluent composition is preferably applied to the edge of the substrate surface or the edge of the photoresist surface.

[0077] The substrate may be a wafer, a glass substrate, a plastic base material (such as a polyethersulfone (PES) board, a polycarbonate (PC) board or a polyimide (PI) film) or other light-transmitting substrates, and the type thereof is not particularly limited.

[0078] The photoresist composition may be a positive photoresist composition or a negative photoresist composition. The positive photoresist composition may include a resin, a photosensitizer, a monomer, a solvent or other suitable additives. The negative photoresist composition may include a resin, a photoinitiator, a monomer, a solvent or other suitable additives.

[0079] The method of applying the photoresist composition to the surface of the substrate is not particularly limited, but spray coating, roll coating, spin coating or the like may be used, and generally, spin coating is widely used.

[0080] The method of applying the diluent composition to the surface of the substrate or the surface of the photoresist composition is not particularly limited, and generally, a spraying method is widely used.

[0081] Hereinafter, the present invention will be described in detail with reference to examples. The following examples are provided for describing the present invention, and the scope of the present invention includes the scope described in the following claims and its substitutes and modifications, and is not limited to the scope of the examples.

[0082] Examples of diluent compositions

[0083] The following describes Examples 1 to 11 and Comparative Examples 1 to 3 of the diluent composition:

[0084] Example 1

[0085] 0.6 parts by weight of the fluorine-containing additive (B-1) was added to 99.4 parts by weight of the solvent (A-1) (a mixed solvent consisting of 80 parts by weight of n-butyl acetate (NBAC) and 20 parts by weight of propylene glycol monomethyl ether (PGME)), and the mixture was stirred evenly with a stirrer to obtain the diluent composition of Example 1.

[0086] Examples 2 to 11 and Comparative Examples 1 to 3

[0087] The diluent compositions of Examples 2 to 11 and Comparative Examples 1 to 3 were prepared in the same steps as Example 1, and the difference was that the types of components and the amounts used of the diluent compositions were changed (as shown in Table 1). The prepared diluent compositions were evaluated in the following evaluation methods, and the results are shown in Table 2.

[0088] [Table 1]

[0089]

[0090]

[0091] [Table 2]

[0092]

[0093] [Table 2] (Continued)

[0094]

[0095] <Evaluation method>

[0096] Bump removal

[0097] The prepared diluent composition is sprayed through the nozzle of a coating device (model MK8, manufactured by Tokyo Electric Co., Ltd.) to the surface edge of a substrate (e.g., a semiconductor wafer) on which a photoresist composition has been applied. Then, the photoresist is obtained by baking at a temperature of 220°C for 60 seconds. Then, the wafer surface is scanned by a pointed probe of a film thickness profile measuring instrument (α-step) (model 138370, manufactured by Veeco). When the probe scanning track passes through the wafer surface, a sensor is used to record the vertical movement change of the probe. The signal generated by the vertical movement change of the probe can display the one-dimensional profile of the wafer surface, and the morphology and uniformity of the ups and downs of the wafer surface after the photoresist is applied can be known through the profile, thereby determining the height of the photoresist protrusions on the edge of the wafer. Compared with the height of the protrusions on the edge of the substrate surface sprayed with a conventional wafer processing liquid, the more the height of the protrusions on the edge of the substrate surface prepared by spraying the diluent composition of the embodiment / comparative example is reduced, the diluent composition has good protrusion removal performance.

[0098] The evaluation criteria for protrusion removal are as follows:

[0099] : 95% ≦ The height reduction ratio of the protrusions on the edge of the substrate surface;

[0100] ○: 75% ≦ The height reduction ratio of the protrusions on the edge of the substrate surface is less than 95%;

[0101] : 50% ≦ The height reduction ratio of the protrusions on the edge of the substrate surface is less than 75%;

[0102] ╳: The height reduction ratio of the protrusions on the edge of the substrate surface is less than 50%.

[0103] <Evaluation Results>

[0104] As can be seen from Table 2, the embodiment in which the diluent composition includes the fluorine-containing additive (B) having a specific structure has good protrusion removal performance when used in the method for treating a substrate, and is applicable to the manufacturing process of a semiconductor device, a display device or an optical element. In contrast, the comparative example in which the diluent composition does not include the fluorine-containing additive (B) having a specific structure has poor protrusion removal performance when used in the method for treating a substrate.

[0105] In addition, based on 100 parts by weight of the diluent composition, compared with the diluent composition in which the amount of the fluorine-containing additive (B) is not in the range of 0.001 parts by weight to 3 parts by weight (Comparative Example 1), the diluent composition in which the amount of the fluorine-containing additive (B) is 0.001 parts by weight to 3 parts by weight (Examples 1 to 11) has better protrusion removal performance when used in the method for substrate processing.

[0106] In addition, compared with the diluent composition in which the fluorine-containing additive (B) does not include the polymer represented by formula (B-3) (Examples 1 to 2 and 9), the diluent composition in which the fluorine-containing additive (B) includes the polymer represented by formula (B-3) (Examples 3 to 8 and 10 to 11) has better protrusion removal performance when used in the method for substrate processing.

[0107] In summary, when the diluent composition of the present invention includes a fluorine-containing additive (B) having a specific structure, the diluent composition has good protrusion removal properties when used in a substrate processing method, and can be applied to the manufacturing process of semiconductor devices, display devices or optical elements, thereby improving the performance of the formed devices or elements.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A diluent composition, characterized in that: include: A solvent (A); and a fluorine-containing additive (B), wherein the fluorine-containing additive (B) comprises a compound represented by the following formula (B-1), a polymer represented by the following formula (B-2), a polymer represented by the following formula (B-3), or a combination thereof, In formula (B-1), X 1 To X 7 Each represents hydrogen, fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms, and X 1 To X 7 At least one of them is fluorine or a fluorinated alkyl group having 1 to 2 carbon atoms; In formula (B-2), R 1 and R 9 Each represents C y H 2y-3 O z , wherein y represents an integer from 4 to 25, and z represents an integer from 1 to 7, R 2 , R 4 , R 5 , R 6 and R 8 each represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, R 3 and R 7 Each represents C n H 2n-2 , where n represents an integer from 4 to 25, X 8 represents a fluorinated alkyl group having 1 to 3 carbon atoms, m represents an integer from 2 to 39, When m is an integer greater than or equal to 3, multiple R 5 Same or different from each other, and multiple X 8 the same as or different from one another; In formula (B-3), X 9 and X 10 Each represents C r F 2r-1 , where r represents an integer from 2 to 15, R 10 To R 13 each represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a hydroxyl group, T represents hydrogen, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a hydroxyl group, a carboxyl group, *-COOCH3, *-COOC2H5, an aldehyde group, an amine group, *-OSO3H, *-OSO3NH4, *-OSO3Na, *-OSO3K, wherein * represents a bonding position, j and q each represent an integer from 2 to 30, k represents an integer from 0 to 20, p represents an integer from 1 to 9, When j, k, p and q are each an integer greater than or equal to 2, multiple R 11 Same or different from each other, multiple R 12 Same or different from each other, multiple R 13 Same or different from each other, multiple X 10 The same or different from each other.

2. The diluent composition according to claim 1, wherein the solvent (A) comprises propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, n-butyl acetate, N-methylpyrrolidone, isobutyl alcohol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol, butanol or a combination thereof.

3. The diluent composition according to claim 1, wherein the solvent (A) is a mixed solvent, and the mixed solvent is a mixture of at least two different organic solvents. 4 . The diluent composition according to claim 3 , wherein the boiling point of the mixed solvent is 70° C. to 170° C., and the turbidity is less than or equal to 0.02 NTU.

5. The diluent composition according to claim 1, wherein the solvent (A) comprises propylene glycol monomethyl ether, and further comprises at least one of propylene glycol monomethyl ether acetate, n-butyl acetate, N-methylpyrrolidone, isobutyl alcohol, 4-methyl-2-pentanol, γ-butyrolactone, cyclohexanone, cyclohexanol, dimethyl sulfoxide, ethanol, methanol and butanol.

6. The diluent composition according to claim 1, wherein the solvent (A) is a mixed solvent of propylene glycol monomethyl ether and n-butyl acetate, and the mixing ratio of propylene glycol monomethyl ether to n-butyl acetate is 5:95 to 45:

55.

7. The diluent composition according to claim 1, wherein the solvent (A) is a mixed solvent of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, and the mixing ratio of propylene glycol monomethyl ether to propylene glycol monomethyl ether acetate is 50:50 to 90:

10. 8 . The diluent composition according to claim 1 , wherein an amount of the fluorine-containing additive (B) is 0.001 parts by weight to 3 parts by weight based on 100 parts by weight of the diluent composition.

9. A method for processing a substrate, characterized in that: include: The diluent composition according to any one of claims 1 to 8 is applied to a surface of a substrate.

10. The method of claim 9, wherein the diluent composition is applied to an edge of the substrate surface. 11 . The method for processing a substrate according to claim 9 , wherein a photoresist composition has been coated on the surface of the substrate, and the diluent composition removes protrusions on the edge of the surface of the photoresist composition.

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