Film forming device and method

Abstract

The invention discloses a film forming device and method, which is used for evaporating an evaporation material and evaporating the evaporation material on a film forming surface of a rotating substrate, and the film forming device comprises a vacuum evaporator and a slide rail assembly, an evaporation source assembly opposite to the film forming surface of the substrate is arranged in the vacuum evaporator; the sliding rail assembly is arranged on the side, away from the base plate, of the evaporation source assembly, the evaporation source assembly comprises at least one evaporation source, and the sliding rail assembly is used for moving the evaporation source to the center area of the vacuum evaporator. According to the embodiment of the invention, the evaporation source is moved to the central area of the vacuum evaporator by arranging the sliding rail assembly, so that the uniformity of the coating thickness at the edge of the substrate can be improved, and the shadow effect at the edge of a device is reduced.

Description

Technical Field

[0001] The present invention relates to the field of vacuum coating technology, and in particular to a film forming device and method. Background Art

[0002] At present, during the vacuum evaporation process, when the molecules of the evaporation source form a deposition layer on the substrate, edge shadows often occur due to the thickness of the mask between the two and the deposition direction of the thermally excited molecules. This phenomenon can cause uneven coating thickness at the edge of the substrate, such as shadows at the edge of the effective light-emitting area in silicon-based OLEDs, which in turn affects the quality and performance of the final product.

[0003] In the prior art, the shadow effect is usually reduced by adjusting the angle of the evaporation source, changing the position of the substrate, or using a complex mask device, but these methods have certain limitations. Summary of the invention

[0004] The present invention provides a film forming device and method, which can improve the uniformity of the coating thickness at the edge of a substrate, thereby reducing the shadow effect at the edge of a device.

[0005] In a first aspect, an embodiment of the present invention provides a film forming device for evaporating a deposition material and depositing the evaporated material onto a film forming surface of a rotating substrate, the film forming device comprising: a vacuum deposition machine and a slide rail assembly; the vacuum deposition machine is provided with an evaporation source assembly disposed opposite to the film forming surface of the substrate;

[0006] The slide rail assembly is disposed on a side of the evaporation source assembly away from the substrate, the evaporation source assembly includes at least one evaporation source, and the slide rail assembly is used to move the evaporation source to a central area of ​​the vacuum evaporation machine.

[0007] Optionally, as the evaporation source moves from the edge area of ​​the vacuum evaporation machine to the center area, the angle between the molecular deposition direction of the evaporation material of the evaporation source and the normal line of the substrate gradually decreases.

[0008] Optionally, the evaporation source assembly includes at least two evaporation sources;

[0009] The evaporation materials of at least two of the evaporation sources are different, and at least two of the evaporation sources are respectively moved to the central area of ​​the vacuum evaporation machine through the corresponding slide rail assemblies.

[0010] Optionally, the slide rail assembly includes a circular rail centered on the rotation axis of the substrate, and a straight rail connected to the circular rail at one end; the straight rail is arranged in the radial direction of the circular rail, and an extension line of the straight rail passes through the center of the circular rail;

[0011] The straight rail is used to move the evaporation source onto the circular rail, and the circular rail is used to drive the evaporation source to rotate along the rotation axis of the substrate in the central area of ​​the vacuum evaporation machine.

[0012] Optionally, the evaporation source assembly includes at least two evaporation sources;

[0013] The evaporation materials of at least two of the evaporation sources are different, and at least two of the evaporation sources are moved to the circular track through different straight tracks respectively.

[0014] Optionally, the rotation speed of the substrate is configured as a first rotation speed, and the rotation speed of the evaporation source on the circular track is configured as a second rotation speed;

[0015] The first speed and the second speed satisfy:

[0016] Wherein, ω1 is the first rotational speed, ω2 is the second rotational speed, and the value of k is 1-5.

[0017] Optionally, the slide rail assembly is made of heat-resistant material.

[0018] Optionally, the evaporation source is mounted on the slide rail assembly via a bracket; the slide rail assembly includes an electric drive device and a control device;

[0019] The electric drive device is used to drive the evaporation source to move on the slide rail assembly, and the control device is used to control the electric drive device to drive the evaporation source to move.

[0020] In a second aspect, an embodiment of the present invention further provides a film forming method, which is implemented by using the film forming device as described in any embodiment of the first aspect, comprising:

[0021] Providing a substrate, wherein a film forming surface of the substrate is arranged opposite to an evaporation source component of the film forming device;

[0022] Controlling the substrate to rotate at a first speed;

[0023] The control rail assembly drives the evaporation source to move to the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is evaporated onto the film forming surface of the substrate.

[0024] Optionally, the slide rail assembly includes a straight rail and a circular rail; and the control of the slide rail assembly to move the evaporation source to the central area of ​​the vacuum evaporation machine so that the evaporation material evaporates and is evaporated onto the film forming surface of the substrate includes:

[0025] Controlling the straight track to drive at least two of the evaporation sources to move to the circular track;

[0026] The circular track is controlled to drive at least two evaporation sources to rotate at a second speed along the rotation axis of the substrate in the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is deposited onto the film forming surface of the substrate.

[0027] The embodiment of the present invention provides a film forming device and method for evaporating a deposition material and depositing it onto a film forming surface of a rotating substrate, the film forming device comprising: a vacuum deposition machine and a slide rail assembly; an evaporation source assembly disposed opposite to the film forming surface of the substrate in the vacuum deposition machine; the slide rail assembly is disposed on a side of the evaporation source assembly away from the substrate, the evaporation source assembly comprises at least one evaporation source, and the slide rail assembly is used to move the evaporation source to the central area of ​​the vacuum deposition machine. The embodiment of the present invention arranges the slide rail assembly to move the evaporation source to the central area of ​​the vacuum deposition machine, which can improve the uniformity of the coating thickness at the edge of the substrate, thereby reducing the shadow effect at the edge of the device.

[0028] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of film formation in the prior art;

[0031] Figure 2 A schematic diagram of an edge shadow caused by film formation using the prior art;

[0032] Figure 3 A schematic structural diagram of a film forming device provided by an embodiment of the present invention;

[0033] Figure 4 A schematic structural diagram of another film forming device provided by an embodiment of the present invention;

[0034] Figure 5 A schematic structural diagram of another film forming device provided by an embodiment of the present invention;

[0035] Figure 6 A flow chart of a film forming method provided by an embodiment of the present invention;

[0036] Figure 7 A flow chart of another film forming method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0039] Figure 1 It is a film forming schematic diagram of the prior art. Figure 2 A schematic diagram of an edge shadow caused by film formation using the prior art, referring to Figure 1 and Figure 2 In the prior art, when the evaporation source 300 forms a deposition layer on the substrate 100, there is an angle θ between the deposition direction of the thermally excited molecules and the normal of the substrate 100. Due to the deposition direction of the thermally excited molecules and the thickness of the mask 200, the coating thickness at the edge of the substrate 100 is uneven, and a large area of ​​edge shadow A will appear. In order to solve the problems in the prior art, the present invention provides a film forming device and method, which are as follows:

[0040] Figure 3 Schematic diagram of the structure of a film forming device provided in an embodiment of the present invention, the film forming device is used to evaporate the evaporation material and evaporate it onto the film forming surface of the rotating substrate 100, with reference to Figure 3 The film forming device includes: a vacuum evaporation machine (not shown in the figure) and a slide rail assembly 400; the vacuum evaporation machine is provided with an evaporation source assembly arranged opposite to the film forming surface of the substrate 100; the slide rail assembly 400 is arranged on the side of the evaporation source assembly away from the substrate 100, the evaporation source assembly includes at least one evaporation source 300, and the slide rail assembly 400 is used to move the evaporation source 300 to the central area B of the vacuum evaporation machine.

[0041] The length and moving range of the slide rail assembly 400 can be adjusted according to specific evaporation requirements, as long as the evaporation source 300 can be accurately moved to the central area B of the vacuum evaporation machine, so that the angle θ between the molecular deposition direction of the evaporation material of the evaporation source 300 and the normal of the substrate 100 can be adjusted to reduce the edge shadow A. For example, when the substrate is used to prepare a silicon-based OLED, the shadow effect at the edge of the effective light-emitting area in the silicon-based OLED can be reduced.

[0042] In the embodiment of the present invention, the slide rail assembly 400 is provided to move the evaporation source 300 to the central area B of the vacuum evaporation machine, which can improve the uniformity of the coating thickness at the edge of the substrate 100, thereby reducing the shadow effect at the edge of the device. In other embodiments, by real-time monitoring of the coating thickness distribution on the substrate 100, the position of the evaporation source 300 can be further adjusted to minimize the edge shadow A.

[0043] Optionally, based on the above embodiment, as the evaporation source 300 moves from the edge area to the center area of ​​the vacuum evaporation machine, the angle θ between the molecular deposition direction of the evaporation material of the evaporation source 300 and the normal line of the substrate 100 gradually decreases.

[0044] It is understandable that, during the evaporation process, the evaporation source 300 is moved from the initial position to the central area of ​​the substrate 100, so that the evaporation source 300 is aligned with the substrate 100. As the evaporation source 300 moves from the edge area to the central area of ​​the vacuum evaporation machine, the molecular deposition direction of the evaporation material of the evaporation source 300 can gradually reduce the angle θ between the deposition direction of the thermally excited molecules and the normal direction of the substrate 100. At this time, the direction of the deposited molecules gradually approaches to being perpendicular to the normal direction of the substrate 100, thereby reducing the area of ​​the edge shadow A of the edge area of ​​the substrate 100.

[0045] Figure 4 A schematic diagram of another film forming device provided in an embodiment of the present invention. Optionally, based on the above embodiment, refer to Figure 4 The evaporation source assembly includes at least two evaporation sources 300. The evaporation materials of the at least two evaporation sources 300 are different, and the at least two evaporation sources 300 are respectively moved to the central area B of the vacuum evaporation machine through the corresponding slide rail assembly 400.

[0046] It can be understood that by moving different evaporation sources 300 to the central area B of the vacuum evaporation machine through the slide rail assembly 400, co-doping of multiple materials can be achieved, thereby improving the functionality and performance of the evaporated layer.

[0047] Figure 5 A schematic diagram of another film forming device provided in an embodiment of the present invention. Optionally, based on the above embodiment, refer to Figure 5The slide rail assembly 400 includes a circular rail 410 centered on the rotation axis of the substrate 100, and a straight rail 420 connected to the circular rail 410 at one end; the straight rail 420 is arranged in the radial direction of the circular rail 410, and the extension line of the straight rail 420 passes through the center of the circular rail 410; the straight rail 420 is used to move the evaporation source 300 to the circular rail 410, and the circular rail 410 is used to drive the evaporation source 300 to rotate along the rotation axis of the substrate 100 in the central area B of the vacuum evaporation machine.

[0048] It can be understood that during the entire evaporation process, while the substrate 100 rotates, the straight rail 420 moves the evaporation source 300 to the central area B of the vacuum evaporation machine to rotate, so that the molecules of the evaporation source 300 can evenly cover the substrate 100. On the premise that the rotation of the substrate 100 improves the uniformity of the film thickness, the circular rail 410 drives the evaporation source 300 to rotate to further ensure the uniform deposition of the evaporation material, effectively improving the uniformity of the coating on the substrate 100, especially the coating quality of the edge area of ​​the substrate 100.

[0049] Optionally, based on the above embodiment, continue to refer to Figure 5 The evaporation source assembly includes at least two evaporation sources 300 ; the evaporation materials of the at least two evaporation sources 300 are different, and the at least two evaporation sources 300 are moved to the circular rail 410 through different straight rails 420 .

[0050] In the embodiment of the present invention, the design of the straight rail 420 in the slide rail assembly 400 allows at least two evaporation sources 300 to quickly move to the central area B of the vacuum evaporation machine during operation and align with the substrate 100. By moving different evaporation sources 300 to the central area through the straight rail 420, co-doping of multiple materials can be achieved, thereby improving the functionality and performance of the evaporated layer.

[0051] Optionally, based on the above embodiment, the rotation speed of the substrate 100 is configured as a first rotation speed, and the rotation speed of the evaporation source 300 on the circular track 410 is configured as a second rotation speed; the first rotation speed and the second rotation speed satisfy: Wherein, ω1 is the first rotation speed, ω2 is the second rotation speed, and the value of k is 1-5.

[0052] It should be noted that k is a constant, which depends on the distance between the evaporation source 300 and the substrate 100, the size of the substrate 100, the evaporation rate and the physical properties of the material, and the specific value should be adjusted according to different experimental conditions.

[0053] It is understandable that in order to ensure the uniformity of the film, the rotation speeds of the evaporation source 300 and the substrate 100 need to be precisely controlled. If the rotation speeds of the two do not match, uneven film deposition will occur, affecting the optical and electrical properties of the film. The rotation speed of the evaporation source 300 controls the diffusion range of the evaporated substance. Proper configuration of the rotation speed of the evaporation source 300 can enhance the directionality of the evaporated substance, so that the evaporated substance is uniformly deposited on the surface of the substrate 100. The rotation speed of the substrate 100 controls the distribution speed of the evaporated substance on the surface of the substrate 100. Reasonable configuration of the rotation speed of the substrate 100 can prevent the evaporated substance from being retained on the substrate 100 and avoid excessive deposition in certain areas. Theoretical analysis shows that the rotation speed of the evaporation source 300 and the rotation speed of the substrate 100 should satisfy a specific proportional relationship, which can ensure that the synergistic effect of the two achieves the best film uniformity.

[0054] The first speed and the second speed of the embodiment of the present invention satisfy: The evaporated material is uniformly deposited on the surface of the substrate 100, and the evaporated material is prevented from being retained on the substrate 100, avoiding excessive deposition of the evaporated material in certain areas. In addition, the optimized rotation speed configuration can ensure that the evaporated material is evenly distributed on the surface of the substrate 100, reducing the deposition hot spots and cold spots, thereby obtaining a film of uniform thickness. The thickness consistency of the film is high, which is conducive to improving the optical and electrical properties of the film. Uniform deposition helps the crystal structure of the film to be more uniform, reduce internal defects of the film, improve the density and adhesion of the film, and thus improve the mechanical properties and durability of the film. For example, when the quality of the film in the optoelectronic device is improved, its conversion efficiency and service life are also improved. Reasonable rotation speed configuration can make the material utilization of the evaporation source 300 more efficient and reduce the waste of materials. Especially for precious materials (such as gold, platinum, etc.), improving material utilization and effectively reducing production costs. The rotation speed configuration of the embodiment of the present invention is applicable to a variety of different types of evaporation sources 300 and substrates 100, can adapt to the deposition process of various materials, and can be widely used in multiple fields such as electronics, optoelectronics, solar energy, sensors, etc. The method is simple and easy to implement and does not require a complex mask device.

[0055] Optionally, based on the above embodiment, the slide rail assembly 400 is made of heat-resistant material.

[0056] It is understandable that the slide rail assembly 400 can be made of high-temperature heat-resistant materials to ensure stable operation even under high-temperature conditions.

[0057] Optionally, based on the above embodiment, the evaporation source 300 is installed on the slide rail assembly 400 through a bracket; the slide rail assembly 400 includes an electric drive device and a control device; the electric drive device is used to drive the evaporation source 300 to move on the slide rail assembly 400, and the control device is used to control the electric drive device to drive the evaporation source 300 to move.

[0058] It is understandable that the evaporation source 300 is mounted on the slide rail assembly 400 through a bracket, which can ensure that the evaporation source 300 can still effectively transfer heat when heating the evaporation material and is not affected by the slide rail assembly 400. The circular rail 410 and the straight rail 420 in the slide rail assembly 400 are both equipped with an electric drive device, which is operated by a control device and can adjust the position of the evaporation source 300 according to real-time needs, ensuring the flexibility of the evaporation process and ensuring that the evaporation source 300 can be quickly and accurately moved to the circular rail 410 in the central area of ​​the vacuum evaporation machine for rotation.

[0059] In summary, the embodiment of the present invention sets the slide rail assembly 400 to move the evaporation source 300 to the central area B of the vacuum evaporation machine, which can improve the uniformity of the coating thickness at the edge of the substrate 100, thereby reducing the shadow effect at the edge of the device. By real-time monitoring the distribution of the coating thickness on the substrate 100, the position of the evaporation source 300 can be further adjusted, and the edge shadow A can be minimized. As the evaporation source 300 moves from the edge area to the central area of ​​the vacuum evaporation machine, the molecular deposition direction of the evaporation material of the evaporation source 300 can gradually reduce the angle θ between the deposition direction of the thermally excited molecules and the normal direction of the substrate 100. At this time, the direction of the deposited molecules gradually approaches to being perpendicular to the normal direction of the substrate 100, thereby reducing the area of ​​the edge shadow A of the edge area of ​​the substrate 100. During the entire evaporation process, while the substrate 100 rotates, the straight rail 420 moves the evaporation source 300 to the central area B of the vacuum evaporation machine to rotate, so that the molecules of the evaporation source 300 can evenly cover the substrate 100. Under the premise that the substrate 100 rotates to improve the uniformity of the film thickness, the circular track 410 drives the evaporation source 300 to rotate to further ensure the uniform deposition of the evaporated material, effectively improving the uniformity of the coating on the substrate 100, especially the coating quality of the edge area of ​​the substrate 100. By moving different evaporation sources 300 to the central area through the straight track 420, co-doping of multiple materials can be achieved, improving the functionality and performance of the evaporated layer. The first rotation speed and the second rotation speed meet: The evaporated material is uniformly deposited on the surface of the substrate 100, and the evaporated material is prevented from being retained on the substrate 100, avoiding excessive deposition of the evaporated material in certain areas. In addition, the optimized rotation speed configuration can ensure that the evaporated material is evenly distributed on the surface of the substrate 100, reducing the deposition hot spots and cold spots, thereby obtaining a film of uniform thickness. The thickness consistency of the film is high, which is conducive to improving the optical and electrical properties of the film. Uniform deposition helps the crystal structure of the film to be more uniform, reduce internal defects of the film, improve the density and adhesion of the film, and thus improve the mechanical properties and durability of the film. For example, when the quality of the film in the optoelectronic device is improved, its conversion efficiency and service life are also improved. Reasonable rotation speed configuration can make the material utilization of the evaporation source 300 more efficient and reduce the waste of materials. Especially for precious materials (such as gold, platinum, etc.), improving material utilization and effectively reducing production costs. The rotation speed configuration of the embodiment of the present invention is applicable to a variety of different types of evaporation sources 300 and substrates 100, can adapt to the deposition process of various materials, and can be widely used in multiple fields such as electronics, optoelectronics, solar energy, sensors, etc. The method is simple and easy to implement and does not require a complex mask device. The slide rail assembly 400 is made of high-temperature heat-resistant material, which can ensure stable operation under high temperature conditions. The evaporation source 300 is installed on the slide rail assembly 400 through a bracket, which can ensure that the evaporation source 300 can still effectively transfer heat when heating the evaporation material and is not affected by the slide rail assembly 400. The circular rail 410 and the straight rail 420 in the slide rail assembly 400 are equipped with an electric drive device, which is operated by a control device and can adjust the position of the evaporation source 300 according to real-time needs, ensuring the flexibility of the evaporation process and ensuring that the evaporation source 300 can be quickly and accurately moved to the circular rail 410 in the center area of ​​the vacuum evaporation machine for rotation.

[0060] Figure 6 A flow chart of a film forming method provided in an embodiment of the present invention, wherein the film forming method is implemented by using a film forming device in any of the above embodiments, Figure 6 , the method comprises the following steps:

[0061] S610, providing a substrate, wherein a film forming surface of the substrate is arranged opposite to an evaporation source component of a film forming device.

[0062] S620, controlling the substrate to rotate at a first speed.

[0063] S630, controlling the slide rail assembly to drive the evaporation source to move to the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is evaporated onto the film forming surface of the substrate.

[0064] In other embodiments, by real-time monitoring of the coating thickness distribution on the substrate, the position of the evaporation source can be further adjusted to minimize the edge shadow effect.

[0065] Figure 7This is a flow chart of another film forming method provided by an embodiment of the present invention. Optionally, based on the above embodiment, the slide rail assembly in this embodiment includes a straight rail and a circular rail. Figure 7 , the method comprises the following steps:

[0066] S710, providing a substrate, wherein a film forming surface of the substrate is arranged opposite to an evaporation source component of a film forming device.

[0067] S720, controlling the substrate to rotate at a first speed.

[0068] S731, control the straight rail to drive at least two evaporation sources to move to the circular rail.

[0069] S732, control the circular track to drive at least two evaporation sources to rotate at a second speed along the rotation axis of the substrate in the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is deposited onto the film forming surface of the substrate.

[0070] Understandably, Figure 6 In the corresponding embodiment, step S630 may include step S731 and step S732.

[0071] The film forming method provided in the embodiment of the present invention is implemented by the film forming device provided in the above embodiment, and therefore has the same beneficial effects. For the contents not described in detail in the embodiment of the present invention, reference can be made to the film forming device provided in the above embodiment, and no further details will be given here.

[0072] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A film forming device, characterized in that: The film forming device is used to evaporate the evaporation material and deposit it onto the film forming surface of the rotating substrate, and the film forming device includes: a vacuum evaporation machine and a slide rail assembly; the vacuum evaporation machine is provided with an evaporation source assembly arranged opposite to the film forming surface of the substrate; The slide rail assembly is disposed on a side of the evaporation source assembly away from the substrate, the evaporation source assembly includes at least one evaporation source, and the slide rail assembly is used to move the evaporation source to a central area of ​​the vacuum evaporation machine.

2. The film forming device according to claim 1, characterized in that: The molecular deposition direction of the evaporation material of the evaporation source gradually decreases in angle with the normal line of the substrate as the evaporation source moves from the edge area to the center area of ​​the vacuum evaporation machine.

3. The film forming device according to claim 2, characterized in that: The evaporation source assembly includes at least two evaporation sources; The evaporation materials of at least two of the evaporation sources are different, and at least two of the evaporation sources are respectively moved to the central area of ​​the vacuum evaporation machine through the corresponding slide rail assemblies.

4. The film forming device according to claim 1, characterized in that: The slide rail assembly includes a circular rail centered on the rotation axis of the substrate, and a straight rail connected to the circular rail at one end; the straight rail is arranged in the radial direction of the circular rail, and the extension line of the straight rail passes through the center of the circular rail; The straight rail is used to move the evaporation source onto the circular rail, and the circular rail is used to drive the evaporation source to rotate along the rotation axis of the substrate in the central area of ​​the vacuum evaporation machine.

5. The film forming device according to claim 4, characterized in that: The evaporation source assembly includes at least two evaporation sources; The evaporation materials of at least two of the evaporation sources are different, and at least two of the evaporation sources are moved to the circular track through different straight tracks respectively.

6. The film forming device according to claim 4 or 5, characterized in that: The rotation speed of the substrate is configured as a first rotation speed, and the rotation speed of the evaporation source on the circular track is configured as a second rotation speed; The first speed and the second speed satisfy: Wherein, ω1 is the first rotational speed, ω2 is the second rotational speed, and the value of k is 1-5.

7. The film forming device according to claim 1, characterized in that: The slide rail assembly is made of heat-resistant material.

8. The film forming device according to claim 1, characterized in that: The evaporation source is installed on the slide rail assembly through a bracket; the slide rail assembly includes an electric drive device and a control device; The electric drive device is used to drive the evaporation source to move on the slide rail assembly, and the control device is used to control the electric drive device to drive the evaporation source to move.

9. A film forming method, implemented by using the film forming device according to any one of claims 1 to 8, characterized in that: include: Providing a substrate, wherein a film forming surface of the substrate is arranged opposite to an evaporation source component of the film forming device; Controlling the substrate to rotate at a first speed; The control rail assembly drives the evaporation source to move to the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is evaporated onto the film forming surface of the substrate.

10. The film forming method according to claim 9, characterized in that: The slide rail assembly includes a straight rail and a circular rail; the control slide rail assembly moves the evaporation source to the central area of ​​the vacuum evaporation machine so that the evaporation material evaporates and is evaporated onto the film forming surface of the substrate, including: Controlling the straight track to drive at least two of the evaporation sources to move to the circular track; The circular track is controlled to drive at least two evaporation sources to rotate at a second speed along the rotation axis of the substrate in the central area of ​​the vacuum evaporation machine, so that the evaporation material evaporates and is deposited onto the film forming surface of the substrate.

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