Cooling device and single crystal furnace

Abstract

The invention relates to a cooling device and a single crystal furnace, the cooling device comprises a main body part, the main body part comprises a cavity, the cavity comprises a plurality of flow channels in the height direction of the cooling device, a partition plate is arranged between every two adjacent flow channels, and a plurality of through holes are formed in each partition plate to communicate the flow channels; the cooling liquid in the cavity can penetrate through the through holes to flow among the multiple flow channels, the flowing path of the cooling liquid in the cavity is reduced, and then the temperature uniformity of the cooling liquid in the cavity is improved. The cooling device further comprises a liquid inlet part and a liquid outlet part, a plurality of liquid inlets are formed in the part, located in the cavity, of the liquid inlet part and used for introducing cooling liquid into the cavity, the multiple liquid inlets are arranged at intervals in the height direction of the cooling device, and the temperature difference of the cooling liquid at different positions in the cavity can be reduced; the uniformity of the heat dissipation effect of the cooling liquid on crystals at different positions is improved, the improvement of the uniformity of the crystal silicon quality is facilitated, the liquid outlet piece comprises the liquid outlet, and the cooling liquid in the cavity is discharged from the liquid outlet.

Description

Technical Field

[0001] The present application relates to the technical field of single crystal silicon production, and in particular to a cooling device and a single crystal furnace. Background Art

[0002] When preparing single crystal silicon, polycrystalline silicon is placed in a quartz crucible, and the silicon raw material is melted using a heater in a single crystal furnace. Then, a seed crystal fixed on the seed crystal axis is inserted into the melt surface. After the seed crystal and the melt are fully melted, the seed crystal is slowly pulled upward, and the crystal grows at the lower end of the seed crystal. A cooling device is provided on the single crystal furnace to control the temperature of the crystal during the crystal growth process. The temperature of the coolant at different positions in the existing cooling device is quite different. During the growth of large-sized crystalline silicon, the uneven heat distribution can easily lead to uneven quality of the crystalline silicon. Summary of the invention

[0003] In view of this, the present application provides a cooling device and a single crystal furnace to solve the problem that the temperature of the coolant at different positions in the cooling device is greatly different. During the growth process of large-size silicon crystals, the uneven heat distribution easily leads to uneven quality of the silicon crystals.

[0004] In a first aspect, the present application provides a cooling device, the cooling device comprising:

[0005] A main body, the main body comprising a cavity, along the height direction of the cooling device, the cavity comprising a plurality of flow channels, a partition is provided between adjacent flow channels, and a plurality of through holes are provided on the partition to connect the plurality of flow channels;

[0006] A liquid inlet and a liquid outlet, wherein at least part of the liquid inlet is located in the cavity, and the part of the liquid inlet located in the cavity is provided with a plurality of liquid inlets for introducing cooling liquid into the cavity, and the plurality of liquid inlets are arranged at intervals along the height direction of the cooling device; the liquid outlet includes a liquid outlet, and the cooling liquid flows out of the cavity from the liquid outlet.

[0007] In a possible embodiment, a plurality of the through holes are arranged at intervals on the partition plate; and along the horizontal direction, the through holes on adjacent partition plates are staggered.

[0008] In a possible embodiment, the diameter of the through hole is 5 mm to 10 mm.

[0009] In a possible embodiment, the liquid inlet member includes at least two liquid inlets, one of which is located at the bottom of the cavity.

[0010] In a possible embodiment, when the liquid inlet member includes two liquid inlets, along the height direction of the cooling device, the other liquid inlet is located at 1 / 2 of the cavity.

[0011] In a possible embodiment, when the liquid inlet member includes more than two liquid inlets, the distances between adjacent liquid inlets gradually decrease in the direction from the bottom to the top of the cavity.

[0012] In a possible embodiment, the liquid inlet component includes a liquid inlet pipe, and the plurality of liquid inlets are arranged at intervals on a side wall of the liquid inlet pipe.

[0013] In a possible embodiment, the cooling device includes a control component, which is connected to the liquid inlet component to control the temperature of the cooling liquid and the pressure in the liquid inlet component.

[0014] In a possible embodiment, the liquid outlet member includes a liquid outlet pipe, the liquid outlet pipe and the liquid inlet member are symmetrically arranged about the axis of the main body, and the liquid outlet is located at the top of the cavity.

[0015] In a second aspect, an embodiment of the present application further provides a single crystal furnace, which includes a cooling device, wherein the cooling device is any one of the cooling devices described above, wherein the main body includes a accommodating space for accommodating the crystal, and the cavity is arranged around the accommodating space.

[0016] The present application relates to a cooling device and a single crystal furnace. The cooling device includes a main body, which includes a cavity. Along the height direction of the cooling device, the cavity includes a plurality of flow channels, and a partition is provided between adjacent flow channels. The partition is provided with a plurality of through holes to connect the plurality of flow channels, so that the coolant in the cavity can flow between the plurality of flow channels through the through holes, reducing the flow path of the coolant in the cavity, thereby improving the uniformity of the temperature of the coolant in the cavity. The cooling device also includes a liquid inlet and a liquid outlet. The portion of the liquid inlet located in the cavity is provided with a plurality of liquid inlets for introducing the coolant into the cavity. Along the height direction of the cooling device, the plurality of liquid inlets are arranged at intervals, which can reduce the temperature difference of the coolant at different positions in the cavity, improve the uniformity of the heat dissipation effect of the coolant on the crystals at different positions, and is conducive to improving the uniformity of the quality of the crystalline silicon. The liquid outlet includes a liquid outlet, and the coolant in the cavity is discharged from the liquid outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of the structure of a cooling device provided in an embodiment of the present application;

[0019] Figure 2A cross-sectional view of a cooling device provided in an embodiment of the present application;

[0020] Figure 3 A cross-sectional view of the cooling device provided in an embodiment of the present application from another angle;

[0021] Figure 4 A schematic diagram of the flow of cooling liquid in a cavity in a cooling device of the prior art;

[0022] Figure 5 A schematic diagram of the flow of cooling liquid in a cavity in a cooling device provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of the structure of the partition provided in an embodiment of the present application.

[0024] Reference numerals:

[0025] 1-Main body;

[0026] 11- flow channel;

[0027] 12- Accommodation space;

[0028] 2-partition;

[0029] 21-through hole;

[0030] 22-avoidance hole;

[0031] 3-Liquid inlet parts;

[0032] 31-liquid inlet;

[0033] 311-first liquid inlet;

[0034] 312-second liquid inlet;

[0035] 32-liquid inlet pipe;

[0036] 4-Liquid outlet;

[0037] 41-liquid outlet;

[0038] 42-Liquid outlet pipe. DETAILED DESCRIPTION

[0039] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0040] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0041] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0042] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0043] When preparing single crystal silicon, it is necessary to first put the raw materials into the crucible of the single crystal furnace, and then heat the crucible through a heater to melt the raw materials, and then insert a seed crystal fixed on the seed crystal axis into the melt surface. After the seed crystal and the melt are fully fused, slowly pull the seed crystal upward, and the crystal will grow at the lower end of the seed crystal. The crystal growth process is divided into four stages: seeding, shouldering, equal diameter, and finishing. In order to increase the growth rate of the crystal, a cooling device that can surround the crystal is provided above the crucible to reduce the temperature of the crystal. A spiral flow channel 11 is provided in the cooling device in the related art, and the coolant flows in from the bottom of the spiral flow channel 11 and flows out from the top of the spiral flow channel 11. The coolant flows in the cooling device for a long path and a long residence time, so that the temperature difference of the coolant at different positions in the cooling device is large, resulting in different cooling effects at different positions of the crystal, which easily leads to uneven quality of crystalline silicon.

[0044] like Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present application provides a cooling device, including a main body 1, the main body 1 includes a cavity, along the height direction of the cooling device, the cavity includes a plurality of flow channels 11, a plurality of partitions 2 are arranged between adjacent flow channels 11 to separate adjacent flow channels 11, and a plurality of through holes 21 are arranged on the partitions 2 to interconnect the plurality of flow channels 11. The cooling device also includes a liquid inlet 3 and a liquid outlet 4, at least part of the liquid inlet 3 is located in the cavity, the portion of the liquid inlet 3 located in the cavity is provided with a plurality of liquid inlets 31, along the height direction Z of the cooling device, the plurality of liquid inlets 31 are arranged at intervals, the coolant enters the cavity from the liquid inlet 31, the liquid outlet 4 includes a liquid outlet 41, and the coolant in the cavity is discharged from the liquid outlet 41.

[0045] The cooling device is arranged around the crystal to reduce the temperature of the crystal and increase the growth rate of the crystal. The cooling liquid is introduced into the cavity of the cooling device, and the cooling liquid is introduced into the cavity from the liquid inlet 31, which can absorb the heat of the crystal, and then flows out from the liquid outlet 41, which can take the heat out of the cavity. A plurality of flow channels 11 are arranged in the cavity, and a plurality of through holes 21 are arranged on the partition 2 between adjacent flow channels 11, and the cooling liquid in the cavity can flow between the plurality of flow channels 11 through the through holes 21. Compared with the spiral flow channel 11 design in the related scheme, the flow channel 11 design in this scheme enables the cooling liquid to flow in the cavity in a vertical direction, reduces the flow path of the cooling liquid in the cavity, reduces the heat absorbed by the cooling liquid in the cavity, and thus reduces the temperature difference of the cooling liquid at the liquid inlet 31 and the liquid outlet 41, improves the uniformity of the temperature of the cooling liquid at different positions in the cooling device, and in the process of large-size crystalline silicon growth, the heat dissipation effect on the crystals at different positions is relatively small, improves the uniformity of the heat distribution of the crystal, and is conducive to improving the uniformity of the quality of crystalline silicon.

[0046] After the coolant flows into the cavity from the liquid inlet 31, the temperature of the coolant gradually rises as the time it stays in the cavity increases. The portion of the liquid inlet 3 located in the cavity is provided with a plurality of liquid inlets 31, and the plurality of liquid inlets 31 are spaced apart along the height direction of the cooling device, so that the coolant flows into the cavity from different positions, which can reduce the temperature difference of the coolant at different positions in the cavity, improve the uniformity of the heat dissipation effect of the coolant on the crystals at different positions, and is beneficial to improving the uniformity of the quality of crystalline silicon.

[0047] like Figure 4 and Figure 5As shown, in the related art, a liquid inlet 31 is provided in the cavity, and a spiral flow channel 11 is provided in the cavity. The flow path of the coolant in the cavity is spiral. In the process of the coolant flowing to the liquid outlet 41, as the residence time of the coolant in the cavity increases, the temperature of the coolant gradually rises. Taking the initial temperature of the coolant introduced into the cavity as 25.3°C as an example, when the coolant flows to the liquid outlet 41, the temperature of the coolant is 37.4°C, resulting in a large temperature difference of the coolant in the cavity, uneven cooling effect on the crystal, and affecting the uniformity of the crystal quality. In the embodiment of the present application, the coolant flows in each flow channel 11 along the vertical direction through the through hole 21, which increases the flow rate of the coolant in the cavity and reduces the residence time of the coolant in the cavity. Taking the liquid inlet 3 including the first liquid inlet 311 and the second liquid inlet 312 as an example, after the coolant at 25.3°C is passed into the cavity, when it flows from the position of the first liquid inlet 311 to the position of the second liquid inlet 312, the temperature of the coolant rises to 27.1°C, and the coolant at 25.3°C is also passed into the second liquid inlet 312, which can reduce the temperature of the coolant at the second liquid inlet 312 to 26.2°C. When the coolant flows to the liquid outlet 41, the temperature of the coolant is 33.4°C, which reduces the temperature difference of the coolant in the cavity, improves the uniformity of the cooling effect on the crystal, and is beneficial to improving the uniformity of the crystal quality.

[0048] like Figure 6 As shown, in a possible embodiment, a plurality of through holes 21 are arranged at intervals on the partition plate 2, and along the horizontal direction, the through holes 21 on two adjacent partition plates 2 are staggered.

[0049] The through holes 21 on the partition 2 are used to connect adjacent flow channels 11, so that the coolant can flow through the through holes 21 in multiple flow channels 11. Multiple through holes 21 are arranged at intervals on the partition 2, so that the coolant can pass through the partition 2 through the through holes 21. If the through holes 21 on two adjacent partitions 2 are arranged in alignment, the speed of the coolant flowing between the adjacent flow channels 11 is too fast, and the time for the coolant to stay in the flow channel 11 is too short, which reduces the heat dissipation effect of the coolant on the crystal. In this embodiment, the through holes 21 on the two adjacent partitions 2 are staggered, which increases the time for the coolant to stay in the flow channel 11, thereby increasing the heat absorbed by the coolant, which is conducive to improving the heat dissipation effect of the coolant on the crystal.

[0050] like Figure 6 As shown, in a possible embodiment, the diameter of the through hole 21 is 5 mm to 10 mm.

[0051] The coolant flows through the through hole 21 in the multiple flow channels 11. If the diameter of the through hole 21 is less than 5 mm, the speed of the coolant flowing in the multiple flow channels 11 is relatively low, resulting in the coolant staying in the flow channels 11 for a longer time and absorbing more heat, resulting in a large difference between the temperature of the coolant at the outlet 41 and the temperature of the coolant at the inlet 31, and a large difference in the cooling effect on different positions of the crystal, which ultimately leads to poor uniformity of the quality of the crystal at different positions; if the diameter of the through hole 21 is greater than 10 mm, the speed of the coolant flowing in the multiple flow channels 11 is too fast, resulting in a short time for the coolant to stay in the flow channels 11, and less heat can be absorbed, resulting in poor cooling effect of the coolant on the crystal. Therefore, the diameter of the through hole 21 can be 5 mm, 8 mm, 10 mm, etc., so that the coolant can have a better cooling effect on the crystal, and can also reduce the temperature difference of the coolant at the inlet 31 and the outlet 41, and improve the uniformity of the coolant temperature at different positions in the cavity.

[0052] like Figure 6 As shown, in a possible embodiment, a relief hole 22 is provided on the partition 2 to avoid the liquid inlet pipe 32 so that the liquid inlet pipe 32 can extend into the bottom of the cavity. At the same time, the relief hole 22 can also limit the position of the liquid inlet pipe 32 in the cavity, reduce the possibility of displacement of the liquid inlet pipe 32 during the flow of the coolant, and help improve the reliability of the cooling device.

[0053] like Figure 2 and Figure 3 As shown, in a possible embodiment, the liquid inlet member 3 includes at least two liquid inlets 31, and one of the liquid inlets 31 is located at the bottom of the cavity.

[0054] The liquid inlet 3 is located at one end of the cavity and extends to the bottom of the cavity. The liquid inlet 3 is provided with multiple liquid inlets 31, one of which is located at one end of the liquid inlet 3 extending into the bottom of the cavity, so that the coolant is passed from the bottom of the cavity, so that the liquid level of the coolant in the cavity gradually rises, so that the coolant can fill the cavity, and at the same time, it can also increase the residence time of the coolant in the cavity, thereby improving the cooling effect of the cooling device. The liquid inlet 3 includes at least two liquid inlets 31, and at least two liquid inlets 31 are arranged at intervals along the height direction Z of the cooling device, so that the coolant can flow into the cavity from different positions, which can improve the uniformity of the temperature of the coolant at different positions in the cavity.

[0055] like Figure 2 and Figure 3 As shown, in a possible embodiment, when the liquid inlet member 3 includes two liquid inlets 31, along the height direction Z of the cooling device, one of the liquid inlets 31 is located at the bottom of the cavity, and the other liquid inlet 31 is located at 1 / 2 of the cavity.

[0056] The liquid outlet 41 is located at the top of the cavity. After the coolant enters the cavity from the liquid inlet 31, the liquid level in the cavity gradually rises, and then flows out of the cavity from the liquid outlet 41. When the liquid inlet 3 includes two liquid inlets 31, one liquid inlet 31 is located at the bottom of the cavity, and the coolant flows into the cavity from the bottom of the cavity. As the coolant continues to flow in, the liquid level of the coolant continues to rise. The liquid level of the coolant absorbs the heat of the crystal during the rising process, so that the temperature of the coolant continues to rise. Another liquid inlet 31 is provided at 1 / 2 of the cavity height, which can reduce the temperature of the coolant from 1 / 2 of the cavity to the top of the cavity, reduce the temperature difference of the coolant at the bottom and top of the cavity, make the temperature of the coolant in the cavity more uniform, improve the uniformity of the cooling effect on different positions of the crystal, and help to improve the uniformity of the crystal quality.

[0057] In a possible embodiment, when the liquid inlet member 3 includes more than two liquid inlets 31 , the distances between adjacent liquid inlets 31 gradually decrease along the direction from the bottom of the cavity to the top of the cavity.

[0058] In the direction from the bottom of the cavity to the top of the cavity, the heat absorbed by the coolant in the cavity gradually increases, causing the temperature of the coolant in the cavity to gradually increase, the spacing between adjacent liquid inlets 31 to gradually decrease, and the volume of the initial temperature coolant introduced to gradually increase, thereby improving the uniformity of the temperature of the coolant at different heights in the cavity, which is beneficial to improving the uniformity of the cooling effect on different positions of the crystal and the uniformity of the crystal quality.

[0059] In the direction from the bottom of the cavity to the top of the cavity, the cross-sectional area of ​​the cavity gradually increases, resulting in a gradual increase in the volume of the flow channel 11, a gradual decrease in the flow rate of the coolant, and a gradual decrease in the spacing between adjacent liquid inlets 31, which can increase the flow rate of the coolant near the top of the cavity and reduce the possibility of excessively high coolant temperature due to too slow a flow rate.

[0060] like Figure 2 and Figure 3 As shown, in a possible embodiment, the liquid inlet member 3 includes a liquid inlet pipe 32 , and a plurality of liquid inlets 31 are arranged at intervals on the side wall of the liquid inlet pipe 32 .

[0061] At least part of the liquid inlet pipe 32 is located in the cavity, and the end of the liquid inlet pipe 32 can extend into the bottom of the cavity. A liquid inlet port 31 is provided at one end of the liquid inlet pipe 32 located at the bottom of the cavity, so that the liquid inlet port 31 can be located at the bottom of the cavity, and other liquid inlets 31 are arranged at intervals on the side wall of the liquid inlet pipe 32, so that the liquid inlet ports 31 are located at different positions of the cavity. The liquid inlet pipe 32 needs to extend into the cavity, and multiple liquid inlets 31 are arranged on one liquid inlet pipe 32, which can reduce the space occupied by the liquid inlet pipe 32 in the cavity, increase the content of the coolant in the cavity, and help improve the cooling effect of the cooling device.

[0062] In a possible embodiment, the liquid inlet component 3 includes a plurality of liquid inlet pipes 32, all of which extend into the cavity, wherein one of the liquid inlet pipes 32 extends to the bottom of the cavity, and the depths of the remaining liquid inlet pipes 32 extending into the cavity gradually decrease, and the plurality of liquid inlets 31 are respectively located in different liquid inlet pipes 32.

[0063] The multiple liquid inlets 31 are respectively arranged in different liquid inlet pipes 32, and the temperature and pressure of the coolant in each liquid inlet pipe 32 can be individually controlled to control the temperature and flow rate of the coolant at each liquid inlet 31, so that the temperature of the coolant at each position in the cavity is more uniform. In the related art, the cooling effect of the coolant near the top of the cavity is poor. In the direction from the bottom of the cavity to the top of the cavity, the temperature of the coolant at different liquid inlets 31 can be gradually reduced, and the flow rate can be gradually increased to improve the cooling effect of the coolant near the top of the cavity, thereby improving the uniformity of the cooling effect at different positions of the cooling device.

[0064] like Figure 2 and Figure 3 As shown, in a possible embodiment, the liquid outlet 4 includes a liquid outlet pipe 42, and the liquid outlet 41 is arranged on the liquid outlet pipe 42. The liquid outlet pipe 42 and the liquid inlet pipe 32 are symmetrically arranged about the axis of the main body 1, and the liquid outlet 41 is located at the top of the cavity.

[0065] The liquid outlet pipe 42 and the liquid inlet pipe 32 are symmetrically arranged about the axis of the main body 1, and the liquid outlet 41 on the liquid outlet pipe 42 is located at the top of the cavity, and at least one of the multiple liquid inlets 31 is arranged at the bottom of the cavity, so that the coolant can first fill the cavity in the process of flowing from the liquid inlet 31 to the liquid outlet 41, reducing the possibility of the existence of cavities in the cavity, improving the heat absorption effect of the coolant, and thus helping to improve the cooling effect of the main body 1 on the crystal.

[0066] The liquid outlet 41 is arranged at the top of the cavity, which can reduce the speed of the coolant flowing out of the cavity under the action of gravity, increase the time the coolant stays in the cavity, increase the heat absorbed by the coolant, and thus improve the cooling effect of the cooling device.

[0067] In a possible embodiment, the cooling device further includes a control component, which is connected to the liquid inlet component 3 and can control the temperature of the coolant in the liquid inlet component 3 and the pressure of the coolant in the liquid inlet component 3 .

[0068] The cooling liquid can absorb the heat of the crystal to reduce the temperature of the crystal and increase the growth rate of the crystal. Crystal growth is mainly divided into four stages: seeding, shouldering, equal diameter and finishing. The temperature required for the crystal is different at different stages. Therefore, at different stages of crystal growth, the cooling device needs to adjust the cooling effect according to the different stages of crystal growth to increase the growth rate of the crystal. The cooling effect of the cooling device can be adjusted by adjusting the pressure in the liquid inlet 3 and the temperature of the cooling liquid. The greater the pressure in the liquid inlet 3, the greater the flow rate of the cooling liquid at the liquid inlet 31, and the stronger the cooling effect on the crystal; the lower the temperature of the cooling liquid in the liquid inlet 3, the stronger the cooling effect on the crystal.

[0069] In the seeding stage, the temperature required for crystal growth is relatively high, so the heat absorption capacity of the cooling device needs to be relatively low. By adjusting the control component, the temperature of the coolant in the liquid inlet 3 can be 25°C to 33.4°C, and the pressure in the liquid inlet 3 can be 0.3MPa; from the seeding stage to the shouldering stage, the temperature required for crystal growth gradually decreases, so the heat absorption capacity of the cooling device needs to be gradually increased. By adjusting the control component, the temperature of the coolant in the liquid inlet 3 can be 23°C to 30°C, and the pressure in the liquid inlet 3 can be 0.31MPa, so that the heat absorption capacity of the coolant in the cooling device is gradually enhanced; from the shouldering stage to the equal diameter stage, the crystal growth The temperature required for crystal growth is further reduced, therefore, the heat absorption capacity of the cooling device needs to be further increased. Through the adjustment of the control component, the temperature of the coolant in the liquid inlet 3 can be 20°C to 28°C, and the pressure in the liquid inlet 3 can be 0.32MPa, so that the heat absorption capacity of the coolant in the cooling device is further enhanced; from the equal diameter stage to the final stage, the temperature required for crystal growth will gradually increase. Therefore, the heat absorption capacity of the cooling device needs to be reduced. Through the adjustment of the control component, the temperature of the coolant in the liquid inlet 3 can be 30°C to 32°C, and the pressure in the liquid inlet 3 can be 0.31MPa, so that the heat absorption capacity of the coolant in the cooling device is reduced.

[0070] At different stages of the crystal growth process, the heat absorption capacity of the cooling device is adjusted by controlling the liquid inlet 3 through the control component, as shown in the following table, thereby increasing the maximum pulling speed of the crystal at each stage and reducing the time required for each stage, thereby increasing the production rate of single crystal silicon rods.

[0071]

[0072] The embodiment of the present application also provides a single crystal furnace, wherein the main chamber of the single crystal furnace includes a crucible and a cooling device, wherein the cooling device is any of the cooling devices described above. The main body 1 of the cooling device also includes a receiving space 12, the receiving space 12 corresponds to the crucible and is used to receive the crystal, and the cavity is arranged around the receiving space 12.

[0073] A heating device is also provided in the main chamber to heat the crucible to melt the raw materials in the crucible. In the vertical direction, the cooling device is located above the crucible, and the receiving space 12 in the cooling device is aligned with the crucible. When the seed crystal is pulled upward, the crystal growing under the seed crystal can pass through the receiving space 12. The cavity surrounding the receiving space 12 can cool the crystal to increase the growth rate of the crystal.

[0074] The present application relates to a cooling device and a single crystal furnace. The cooling device includes a main body 1, which includes a cavity. Along the height direction of the cooling device, the cavity includes a plurality of flow channels 11. A partition 2 is provided between adjacent flow channels 11. The partition 2 is provided with a plurality of through holes 21 to connect the plurality of flow channels 11, so that the coolant in the cavity can flow between the plurality of flow channels 11 through the through holes 21, thereby reducing the flow path of the coolant in the cavity, thereby improving the uniformity of the coolant temperature in the cavity. The cooling device also includes a liquid inlet 3 and a liquid outlet 4. The portion of the liquid inlet 3 located in the cavity is provided with a plurality of liquid inlets 31 for introducing the coolant into the cavity. Along the height direction of the cooling device, the plurality of liquid inlets 31 are arranged at intervals, which can reduce the temperature difference of the coolant at different positions in the cavity, improve the uniformity of the heat dissipation effect of the coolant on the crystals at different positions, and help improve the uniformity of the quality of the crystalline silicon. The liquid outlet 4 includes a liquid outlet 41, and the coolant in the cavity is discharged from the liquid outlet 41.

Claims

1. A cooling device, characterized in that: The cooling device comprises: A main body, the main body comprising a cavity, along the height direction of the cooling device, the cavity comprising a plurality of flow channels, a partition is provided between adjacent flow channels, and a plurality of through holes are provided on the partition to connect the plurality of flow channels; A liquid inlet and a liquid outlet, wherein at least part of the liquid inlet is located in the cavity, and the part of the liquid inlet located in the cavity is provided with a plurality of liquid inlets for introducing cooling liquid into the cavity, and the plurality of liquid inlets are arranged at intervals along the height direction of the cooling device; the liquid outlet includes a liquid outlet, and the cooling liquid flows out of the cavity from the liquid outlet.

2. The cooling device according to claim 1, characterized in that: A plurality of through holes are arranged at intervals on the partition plates; along the horizontal direction, the through holes on adjacent partition plates are arranged in a staggered manner.

3. The cooling device according to claim 1, characterized in that: The diameter of the through hole is 5 mm to 10 mm.

4. The cooling device according to claim 1, characterized in that: The liquid inlet member comprises at least two liquid inlets, one of which is located at the bottom of the cavity.

5. The cooling device according to claim 4, characterized in that: When the liquid inlet member includes two liquid inlets, along the height direction of the cooling device, the other liquid inlet is located at 1 / 2 of the cavity.

6. The cooling device according to claim 4, characterized in that: When the liquid inlet member includes more than two liquid inlets, the distances between adjacent liquid inlets gradually decrease in the direction from the bottom to the top of the cavity.

7. The cooling device according to claim 1, characterized in that: The liquid inlet component comprises a liquid inlet pipe, and a plurality of liquid inlets are arranged at intervals on the side wall of the liquid inlet pipe.

8. The cooling device according to claim 1, characterized in that: The cooling device comprises a control component connected to the liquid inlet component to control the temperature of the cooling liquid and the pressure in the liquid inlet component.

9. The cooling device according to any one of claims 1 to 8, characterized in that: The liquid outlet member comprises a liquid outlet pipe, the liquid outlet pipe and the liquid inlet member are symmetrically arranged about the axis of the main body, and the liquid outlet is located at the top of the cavity.

10. A single crystal furnace, characterized in that: The single crystal furnace includes a cooling device, which is the cooling device according to any one of claims 1 to 9. The main body includes a receiving space for receiving the crystal, and the cavity is arranged around the receiving space.

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