Testing device of power semiconductor device

Abstract

The invention discloses a power semiconductor device testing device, which comprises a liquid supply assembly, a mounting rack, clamping plates and clamping assemblies, and is characterized in that the mounting rack is internally provided with at least two slidable clamping plates, and the left and right sides of the mounting rack are provided with the clamping assemblies; the clamping end of the clamping assembly movably penetrates into the mounting frame and abuts against the opposite clamping plates, and the multiple clamping plates are used for jointly clamping the power semiconductor device; a water tank is arranged in the clamping plate, the liquid supply assembly communicates with the water tank, and the liquid supply assembly is used for conveying cooling liquid or heating liquid to the water tank. The liquid supply assembly conveys the heating liquid and the cooling liquid to the clamping plate in sequence, so that the heating and cooling circulation process of the power semiconductor device in actual work is simulated, the bearable circulation times of the power semiconductor device are detected, and the problem that a traditional testing device for the power semiconductor device only has a single heating or cooling function, and the testing efficiency is low is solved. And the test precision is poor.

Description

Technical Field

[0001] The invention relates to the technical field of power semiconductor devices, in particular to a testing device for power semiconductor devices. Background Art

[0002] Power semiconductor devices, as the core power components in switching power supplies, play an important role in converting, controlling and regulating electrical energy. High temperatures, high voltage shocks and rapid changes in current during operation may damage the internal structure of power semiconductor devices, thereby shortening their service life.

[0003] Therefore, workers usually use power cycle testing to evaluate the switching life of power semiconductor devices. By simulating the heating and cooling cycle process of power semiconductor devices in actual work, the number of cycles they can withstand is detected.

[0004] However, the existing power semiconductor device test equipment only has a single heating function. During the test process, the power semiconductor device is in a high temperature environment for a long time, which not only easily affects the stability and reliability of the performance of the power semiconductor device, but also fails to fully simulate the actual working environment, making it difficult to accurately test the switching life of the power semiconductor device, and the test accuracy is poor. Summary of the invention

[0005] In view of the above-mentioned defects, the present invention proposes a testing device for power semiconductor devices, in which a liquid supply component sequentially transports heating liquid and cooling liquid to the clamping plate, thereby simulating the heating and cooling cycle process of the power semiconductor device in actual work to detect the number of cycles it can withstand, thereby solving the problem that the traditional power semiconductor device testing device has only a single heating or cooling function and the test accuracy is poor.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A testing device for a power semiconductor device comprises a liquid supply assembly, a mounting frame, a clamping plate and a clamping assembly, wherein at least two slidable clamping plates are arranged inside the mounting frame, and clamping assemblies are arranged on the left and right sides of the mounting frame;

[0008] The clamping end of the clamping assembly movably penetrates into the interior of the mounting frame and abuts against the opposite clamping plate, and the plurality of clamping plates are used to clamp the power semiconductor device together;

[0009] A water tank is provided inside the clamping plate, and the liquid supply component is connected to the water tank. The liquid supply component is used to transport cooling liquid or heating liquid to the water tank.

[0010] The liquid supply assembly includes a liquid supply machine, a first connecting pipe, a second connecting pipe and a third connecting pipe, wherein the input end of the first connecting pipe is connected to the output end of the liquid supply machine, the output end of the first connecting pipe is connected to the input end of the water tank of one of the clamping plates, the second connecting pipe connects two adjacent clamping plates, the input end of the third connecting pipe is connected to the output end of the water tank of another clamping plate, and the output end of the third connecting pipe is connected to the input end of the liquid supply machine;

[0011] The liquid supply machine is used for conveying cooling liquid or heating liquid.

[0012] The mounting frame comprises a base, a support frame and a limit rod, the support frames are vertically mounted on both the left and right sides of the base, the limit rod horizontally connects the two support frames, and the clamping plate is slidably connected to the limit rod;

[0013] A hollowed-out groove is provided in the middle of the support frame, and the hollowed-out groove horizontally penetrates the support frame. The clamping end of the clamping assembly movably penetrates the hollowed-out groove and abuts against the opposite clamping plate.

[0014] A temperature sensor is embedded inside the clamping plate. The temperature sensor is located at the center of the clamping plate. The temperature sensor is staggered with the water tank. The temperature sensor is electrically connected to the liquid supply machine.

[0015] The support frame is provided with a first slide groove at the top of the hollowed-out groove, and the support frame is provided with a second slide groove at the bottom of the hollowed-out groove, and the extension directions of the first slide groove and the second slide groove are both front-to-back directions;

[0016] The clamping assembly includes a screw and a connecting piece; the top of the connecting piece is slidably connected to the first slide groove, the bottom of the connecting piece is slidably connected to the second slide groove, the connecting piece is threadedly connected to the horizontal screw, and the end thread of the screw passes through the connecting piece and the hollowed groove in turn, and abuts against the clamping plate.

[0017] A vertical limiting groove is provided in the middle of the connecting member, the connecting member is slidably connected to a limiting block, the limiting block is slidably connected to the limiting groove, and the screw is threadedly connected to the limiting block;

[0018] The end of the screw rod close to the clamping plate is provided with a rubber pressing block.

[0019] Both sides of the clamping plate are provided with silicone thermal pads.

[0020] The water tank is U-shaped or S-shaped.

[0021] The technical solution provided by the embodiments of the present application may have the following beneficial effects:

[0022] 1. The liquid supply component delivers heating liquid and cooling liquid to the clamping plate in turn, thereby simulating the heating and cooling cycle process of the power semiconductor device in actual work to detect the number of cycles it can withstand, thereby solving the problem that the test device of traditional power semiconductor devices has only a single heating or cooling function and the test accuracy is poor.

[0023] 2. A water tank is provided inside the clamping plate, and the liquid supply assembly is connected to the water tank inside the clamping plate, so that the liquid supply assembly can transport cooling liquid or heating liquid to the water tank, thereby heating up or cooling down the clamped power semiconductor device. The heating liquid exchanges heat with the clamping plate in the water tank, so that the clamping plate can quickly absorb the heat of the heating liquid, which can effectively reduce the heat loss. Similarly, when the coolant is in the water tank, the coolant can quickly absorb and take away the heat on the clamping plate, improve the heat dissipation effect of the clamping plate, and thus shorten the cooling time of the power semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of a testing device according to one embodiment of the present invention;

[0025] Figure 2 is a schematic diagram of a testing device according to one embodiment of the present invention;

[0026] Figure 3 is a cross-sectional view of a clamping plate according to one embodiment of the present invention;

[0027] Figure 4 is a schematic diagram of a mounting frame according to one embodiment of the present invention;

[0028] Figure 5 is a schematic diagram of a clamping assembly according to one embodiment of the present invention;

[0029] Figure 6 is a schematic diagram of a silicone thermal pad according to one embodiment of the present invention;

[0030] Among them, 1. liquid supply component; 11. liquid supply machine; 12. first connecting pipe; 13. second connecting pipe; 14. third connecting pipe; 2. mounting frame; 21. limiting rod; 22. base; 23. support frame; 24. hollowed-out groove; 27. first slide groove; 28. second slide groove; 3. clamping plate; 31. water tank; 32. temperature sensor; 33. silicone thermal pad; 4. clamping component; 41. screw; 42. connector; 43. limiting groove; 44. rubber pressure block; 45. limiting block. DETAILED DESCRIPTION

[0031] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0032] In the description of the present invention, it is necessary to understand that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means more than two.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "splicing" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Combine the following Figures 1 to 6 , describing a testing device for a power semiconductor device according to an embodiment of the present invention.

[0036] A testing device for a power semiconductor device comprises a liquid supply assembly 1, a mounting frame 2, a clamping plate 3 and a clamping assembly 4, wherein at least two slidable clamping plates 3 are arranged inside the mounting frame 2, and the clamping assemblies 4 are arranged on the left and right sides of the mounting frame 2;

[0037] The clamping end of the clamping assembly 4 movably penetrates into the interior of the mounting frame 2 and abuts against the opposite clamping plate 3. The plurality of clamping plates 3 are used to clamp the power semiconductor device together.

[0038] A water tank 31 is provided inside the clamping plate 3 , and the liquid supply assembly 1 is connected to the water tank 31 . The liquid supply assembly 1 is used to transport cooling liquid or heating liquid to the water tank 31 .

[0039] In the present solution, a test device for a power semiconductor device is provided with at least two clamping plates 3 inside a mounting frame 2, and clamping components 4 are provided on the left and right sides of the mounting frame 2. The clamping end of the clamping component 4 can pass through the mounting frame 2 and then abut against the clamping plate 3, so that multiple clamping plates 3 are close to each other, thereby clamping one or more power semiconductor devices. Preferably, in the present solution, two clamping plates 3 are provided on the mounting frame 2, and the two clamping plates 3 move inside the mounting frame 2 and clamp the power semiconductor device together.

[0040] A water tank 31 is provided inside the clamping plate 3 , and the liquid supply assembly 1 is connected to the water tank 31 inside the clamping plate 3 , so that the liquid supply assembly 1 can transport cooling liquid or heating liquid to the water tank 31 , thereby heating or cooling the clamped power semiconductor device.

[0041] The heated liquid exchanges heat with the clamping plate 3 in the water tank 31, so that the clamping plate 3 can quickly absorb the heat of the heated liquid, which can effectively reduce the heat loss. Similarly, when the coolant is in the water tank 31, the coolant can quickly absorb and take away the heat on the clamping plate 3, improve the heat dissipation effect of the clamping plate 3, and thus shorten the cooling time of the power semiconductor device.

[0042] At this time, the liquid supply component 1 sequentially delivers heating liquid and cooling liquid to the clamping plate 3, thereby simulating the heating and cooling cycle process of the power semiconductor device in actual work to detect the number of cycles it can withstand, thereby solving the problem that the traditional power semiconductor device test device has only a single heating or cooling function and the test accuracy is poor.

[0043] The liquid supply assembly 1 includes a liquid supply machine 11, a first connecting pipe 12, a second connecting pipe 13 and a third connecting pipe 14, wherein the input end of the first connecting pipe 12 is connected to the output end of the liquid supply machine 11, the output end of the first connecting pipe 12 is connected to the input end of the water tank 31 of one of the clamping plates 3, the second connecting pipe 13 connects two adjacent clamping plates 3, the input end of the third connecting pipe 14 is connected to the output end of the water tank 31 of another clamping plate 3, and the output end of the third connecting pipe 14 is connected to the input end of the liquid supply machine 11;

[0044] The liquid supply machine 11 is used to deliver cooling liquid or heating liquid.

[0045] Among them, the liquid supply machine 11 can deliver cooling liquid or heating liquid to the water tank 31 inside the clamping plate 3. When the power semiconductor device needs to be heated, the liquid supply machine 11 delivers the heating liquid to the first connecting tube 12. Under the guidance of the first connecting tube 12, the heating liquid flows to the water tank 31 connected to the first connecting tube 12, and the heating liquid exchanges heat with the clamping plate 3 in the water tank 31. The heating liquid continues to flow, and under the guidance of the second connecting tube 13, it flows to the water tank 31 connected to the output end of the second connecting tube 13, and the heating liquid exchanges heat with the clamping plate 3 in the water tank 31. At this time, the clamped power semiconductor device respectively exchanges heat with the two adjacent clamping plates 3, thereby achieving a heating effect on the power semiconductor device.

[0046] Similarly, when the power semiconductor device needs to be cooled, the liquid supply machine 11 delivers the coolant to the first connecting pipe 12, and the coolant flows through the first cooling plate, the second connecting pipe 13, the other cooling plate and the third connecting pipe 14 in sequence, and then flows back into the liquid supply machine 11. The coolant can cool the two clamping plates 3, and the cooled clamping plates 3 can cool the clamped power semiconductor device, thereby achieving a cooling effect on the power semiconductor device.

[0047] It is worth noting that the liquid supply assembly 1 of the present solution is a circulating water circuit structure, which helps to maintain the internal cleanliness of the liquid supply machine 11 and reduce the malfunction of the liquid supply machine 11 caused by dust.

[0048] The mounting frame 2 includes a base 22, a support frame 23 and a limiting rod 21. The support frames 23 are vertically installed on both sides of the base 22. The limiting rod 21 horizontally connects the two support frames 23. The clamping plate 3 is slidably connected to the limiting rod 21.

[0049] A hollowed-out groove 24 is provided in the middle of the support frame 23 . The hollowed-out groove 24 horizontally penetrates the support frame 23 . The clamping end of the clamping assembly 4 movably penetrates into the hollowed-out groove 24 and abuts against the opposite clamping plate 3 .

[0050] A hollowed-out groove 24 is provided in the middle of the support frame 23, and the clamping end of the clamping assembly 4 can pass through the support frame 23, thereby abutting against the clamping plate 3 inside the support frame 23. Multiple limit rods 21 are horizontally connected to the two left and right support frames 23, thereby increasing the overall rigidity of the mounting frame 2, making the mounting frame 2 more stable and less prone to deformation or shaking.

[0051] The clamping plate 3 is slidably connected to the plurality of limit rods 21, so that the limit rods 21 can disperse the force acting on the clamping plate 3, thereby preventing a single limit rod 21 from being subjected to excessive force and causing breakage. In addition, the plurality of limit rods 21 can also play a limiting role, limiting the left and right movement of the clamping plate 3 between the two support frames 23.

[0052] A temperature sensor 32 is embedded inside the clamping plate 3 . The temperature sensor 32 is located at the center of the clamping plate 3 . The temperature sensor 32 is staggered with the water tank 31 . The temperature sensor 32 is electrically connected to the liquid supply machine 11 .

[0053] When the clamping plate 3 is used to clamp the power semiconductor device, the power semiconductor device is usually placed in the middle part of the clamping plate 3, which can ensure that the power semiconductor device is evenly stressed during the test and avoid problems such as stress concentration caused by improper positioning.

[0054] Temperature sensors 32 are provided inside the plurality of clamping plates 3, wherein the plurality of temperature sensors can monitor the temperature of the clamping plates 3 at all times. The temperature sensor 32 is located at the center of the clamping plate 3, and can obtain the operating temperature of the power semiconductor device in real time and accurately. In addition, the temperature sensor 32 is staggered with the water tank 31, which effectively avoids the influence of the liquid in the water tank 31 on the accuracy of the temperature sensor 32.

[0055] If the temperature sensor 32 senses that the temperature of the clamping plate 3 is higher than a specific temperature, the signal can be transmitted to the liquid supply machine 11, and the liquid supply machine 11 can continue to supply cooling liquid to the clamping plate 3 to reduce the temperature of the clamping plate 3, thereby cooling the functional device.

[0056] If the temperature sensor 32 senses that the temperature of the clamping plate 3 is lower than a specific temperature, the temperature sensor 32 transmits the signal to the liquid supply machine 11, and the liquid supply machine 11 can provide heated liquid supply to the clamping plate 3 so that the temperature of the clamping plate 3 is within a specific temperature range.

[0057] The liquid supply machine 11 repeatedly delivers the heated liquid and the cooling liquid, and can detect the number of cycles that the power semiconductor device can withstand in actual work.

[0058] The support frame 23 is provided with a first slide groove 27 at the top of the hollowed-out groove 24, and the support frame 23 is provided with a second slide groove 28 at the bottom of the hollowed-out groove 24, and the extension directions of the first slide groove 27 and the second slide groove 28 are both front-to-back directions;

[0059] The clamping assembly 4 includes a screw 41 and a connecting piece 42; the top of the connecting piece 42 is slidably connected to the first slide groove 27, and the bottom of the connecting piece 42 is slidably connected to the second slide groove 28. The connecting piece 42 is threadedly connected to the horizontal screw 41, and the end thread of the screw 41 passes through the connecting piece 42 and the hollow groove 24 in turn, and abuts against the clamping plate 3.

[0060] Since the top of the support frame 23 is provided with a first slide groove 27 and the bottom of the support frame 23 is provided with a second slide groove 28, the top of the connecting member 42 is connected to the first slide groove 27 and the bottom of the connecting member 42 is connected to the second slide groove 28, so that the connecting member 42 can slide horizontally on the support frame 23. Then, the screw rod 41 is rotated so that the end of the screw rod 41 moves through the hollowed groove 24 and then abuts against the clamping plate 3.

[0061] By synchronously adjusting the screw rods 41 on the left and right sides of the mounting frame 2, adjacent support plates can be brought closer to each other and clamp the power semiconductor device together.

[0062] When replacing the power semiconductor device, the screw rod 41 is rotated in the opposite direction so that the end of the screw rod 41 is away from the clamping plate 3. At this time, the screw rod 41 loses its pressing force on the clamping plate 3, and the staff can move the clamping plates 3 horizontally so that the adjacent clamping plates 3 are away from each other, thereby releasing the clamping effect on the power semiconductor device.

[0063] A vertical limiting groove 43 is formed in the middle of the connecting member 42, the connecting member 42 is slidably connected to a limiting block 45, the limiting block 45 is slidably connected to the limiting groove 43, and the screw rod 41 is threadedly connected to the limiting block 45;

[0064] The end of the screw rod 41 close to the clamping plate 3 is provided with a rubber pressing block 44 .

[0065] The limit block 45 is slidably connected to the limit groove 43, so that the limit block 45 drives the screw rod 41 to move vertically in the limit groove 43, thereby adjusting the height of the screw rod 41. A rubber pressing block 44 is provided at the end of the screw rod 41 close to the clamping plate 3. When the screw rod 41 is rotated, the rubber pressing block 44 contacts the side wall of the clamping plate 3 and squeezes the small gap between the rubber and the clamping plate 3, thereby achieving a tight fit. This tight fit not only enhances the force between the rubber and the clamping plate 3, but also ensures the stability and reliability between the two, effectively reducing the slippage of the screw rod 41 during the clamping process.

[0066] Since the power semiconductor devices are of different shapes and sizes, the staff can adjust the height of the screw 41 according to the shape of the current power semiconductor device to ensure that the adjacent clamping plates 3 can firmly clamp the power semiconductor device.

[0067] Both sides of the clamping plate 3 are provided with silicone thermal pads 33. The silicone thermal pads 33 have excellent thermal conductivity and can quickly and effectively heat up or cool down the power semiconductor device. The silicone thermal pads 33 also have excellent elasticity and good adhesion. During the clamping process, the silicone thermal pads 33 can closely adhere to the surface of the power semiconductor device to form a soft buffer layer. This buffer layer effectively reduces the direct friction and impact caused by the clamping force, thereby greatly reducing the wear of the power semiconductor device during the clamping process.

[0068] The water tank 31 is U-shaped or S-shaped. The curved shape inside the S-shaped water tank 31 can not only slow down the flow rate of the heated liquid or the cooling liquid, but also increase the contact area between the clamping plate 3 and the heated liquid or the cooling liquid, thereby better transferring or absorbing heat, improving the efficiency of heat exchange, and reducing energy consumption.

[0069] The preferred embodiment of the present invention is a U-shaped water tank 31. The U-shaped water tank 31 structure reduces the difficulty of cleaning and maintaining the clamping plate 3, and can conveniently remove accumulated dirt and impurities, thereby maintaining the unobstructed flow and heat dissipation effect of the water tank 31. Moreover, the simple water path of the U-shaped water tank 31 allows the water to flow smoothly, thereby improving the efficiency of heat exchange and reducing energy consumption.

[0070] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A testing device for a power semiconductor device, characterized in that: It includes a liquid supply component, a mounting frame, a clamping plate and a clamping component, wherein at least two slidable clamping plates are provided inside the mounting frame, and clamping components are provided on the left and right sides of the mounting frame; The clamping end of the clamping assembly movably penetrates into the interior of the mounting frame and abuts against the opposite clamping plate, and the plurality of clamping plates are used to clamp the power semiconductor device together; A water tank is provided inside the clamping plate, and the liquid supply component is connected to the water tank. The liquid supply component is used to transport cooling liquid or heating liquid to the water tank.

2. A power semiconductor device testing device according to claim 1, characterized in that: The liquid supply assembly includes a liquid supply machine, a first connecting pipe, a second connecting pipe and a third connecting pipe, wherein the input end of the first connecting pipe is connected to the output end of the liquid supply machine, the output end of the first connecting pipe is connected to the input end of the water tank of one of the clamping plates, the second connecting pipe connects two adjacent clamping plates, the input end of the third connecting pipe is connected to the output end of the water tank of another clamping plate, and the output end of the third connecting pipe is connected to the input end of the liquid supply machine; The liquid supply machine is used for conveying cooling liquid or heating liquid.

3. A power semiconductor device testing device according to claim 1, characterized in that: The mounting frame comprises a base, a support frame and a limit rod, the support frames are vertically mounted on both the left and right sides of the base, the limit rod horizontally connects the two support frames, and the clamping plate is slidably connected to the limit rod; A hollowed-out groove is provided in the middle of the support frame, and the hollowed-out groove horizontally penetrates the support frame. The clamping end of the clamping assembly movably penetrates the hollowed-out groove and abuts against the opposite clamping plate.

4. A power semiconductor device testing device according to claim 2, characterized in that: A temperature sensor is embedded inside the clamping plate. The temperature sensor is located at the center of the clamping plate. The temperature sensor is staggered with the water tank. The temperature sensor is electrically connected to the liquid supply machine.

5. The power semiconductor device testing device according to claim 3, characterized in that: The support frame is provided with a first slide groove at the top of the hollowed-out groove, and the support frame is provided with a second slide groove at the bottom of the hollowed-out groove, and the extension directions of the first slide groove and the second slide groove are both front-to-back directions; The clamping assembly includes a screw and a connecting piece; the top of the connecting piece is slidably connected to the first slide groove, the bottom of the connecting piece is slidably connected to the second slide groove, the connecting piece is threadedly connected to the horizontal screw, and the end thread of the screw passes through the connecting piece and the hollowed groove in turn, and abuts against the clamping plate.

6. A power semiconductor device testing device according to claim 5, characterized in that: A vertical limiting groove is provided in the middle of the connecting member, the connecting member is slidably connected to a limiting block, the limiting block is slidably connected to the limiting groove, and the screw is threadedly connected to the limiting block; The end of the screw rod close to the clamping plate is provided with a rubber pressing block.

7. The power semiconductor device testing device according to claim 1, characterized in that: Both sides of the clamping plate are provided with silicone thermal pads.

8. The power semiconductor device testing device according to claim 1, characterized in that: The water tank is U-shaped or S-shaped.

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