Batch test method for charging management chips

By controlling the relay and accessing specific resistors on the test board in the batch testing method of the charging management chip, simulating the working state of the chip and measuring the average voltage output from the BAT port, the problem of long test time and easy breakdown of the chip in the traditional test method is solved, and fast and accurate chip qualification judgment and improved product quality are achieved.

CN119619799APending Publication Date: 2025-03-14ZHEJIANG FENGHUA CHUANGXIN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202411734492.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

In traditional testing methods, the test circuit cannot effectively protect the chip, resulting in a long test time and easy breakdown of the chip, and it is impossible to accurately and quickly determine whether the chip is qualified.

Method used

It provides a batch testing method for charging management chips. By controlling the relay on the test board and connecting a specific resistor, it simulates the working status of the charging management chip, and determines whether the chip is qualified by measuring the average voltage output from the BAT port.

Benefits of technology

It realizes a quick and accurate judgment of whether the chip is qualified, avoids abnormal functions and improves product quality, and the test method is safe and reliable, and will not cause damage to the chip.

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Abstract

The invention relates to the technical field of chip testing, and particularly discloses a batch testing method for charging management chips, which comprises the following steps: after a plurality of charging management chips are placed on a plurality of testing stations on a testing board, sending a test starting signal; wherein each test station corresponds to one charging management chip and a peripheral device thereof; after the test machine receives the test starting signal, performing batch test on the plurality of charging management chips on the test board to obtain a batch test result of the plurality of charging management chips; and outputting batch test results of the plurality of charging management chips. According to the batch test method for the charging management chips, the production efficiency and quality can be improved, and loss caused by abnormal chip functions is effectively prevented; and the testing method is safe and reliable, and the chip cannot be damaged in the testing process.
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Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and more specifically, to a batch testing method for a charging management chip. Background Art

[0002] The test circuit in the traditional test method cannot effectively protect the chip, the test time is long and the chip is easy to be broken down. Summary of the invention

[0003] In view of the above-mentioned problems existing in the prior art, the present invention provides a batch testing method for a charging management chip, which can accurately and quickly determine whether a chip is qualified during batch production, and can quickly screen out chips with abnormal functions to avoid the outflow of chips with abnormal functions, thereby improving product quality.

[0004] As a first aspect of the present invention, a batch testing method for a charging management chip is provided, and the batch testing method for the charging management chip comprises the following steps: Step S1: After multiple charging management chips are placed on multiple test stations on the test board, a test start signal is sent; wherein each test station corresponds to a charging management chip and its peripheral devices; Step S2: After the test machine receives the start test signal, a batch test is performed on the multiple charging management chips on the test board to obtain batch test results of the multiple charging management chips; Step S3: outputting batch test results of the plurality of charging management chips.

[0005] Furthermore, the testing process of each charging management chip includes: (1) The test machine controls the relays K1, K2, K3, K4, K5, K6 and K7 on the test board to be closed, so that the CHRG port of the charge management chip is connected to a 5.1K pull-up resistor, the PROG port is connected to a 3.3K pull-down resistor, the VDD port is connected to two 10uF capacitors, and the BAT port is connected to a 10nF capacitor and a 100ohm resistor; (2) Apply a 5V voltage to the VDD port through the test machine, and limit the current to 400mA, and then continue for 5ms to ensure that the charging management chip can work normally after being stably powered on; (3) The test machine uses the V2 power supply to supply a 4V voltage to the BAT port, and then disconnects the V2 power supply after 5ms, so that the charging management chip enters the constant current charging mode; (4) After the charging management chip enters the constant current charging mode, the tester waits for 10ms, and then the tester uses the V1 power supply to measure the average voltage output by the BAT port within the subsequent 20ms. When the average voltage is between 4.165-4.235V, the tester determines that the charging management chip is qualified, otherwise it is judged to be unqualified; (5) The test machine first disconnects the relays K1, K2, K3, K4, K5, K6 and K7 on the test board, disconnects the charging management chip from its peripheral devices, and sets each port to 0V; then the test machine turns off the power supply channel, and the test ends; The testing machine performs batch testing on the multiple charging management chips on the testing board according to the above-mentioned testing process.

[0006] Furthermore, the test machine uses the V1 power supply to measure the average voltage output by the BAT port within the subsequent 20ms, including: The test machine uses the V1 power supply to continuously measure the voltage output by the BAT port 100 times within the subsequent 20 ms, and calculates the average voltage output by the BAT port within the subsequent 20 ms based on the voltages obtained by the 100 measurements.

[0007] Furthermore, the CHRG port of the charging management chip is a charging indication port, which is in a high impedance state when not charging. When charging, the port is pulled to a low level internally, and a 5.1K resistor is connected to the VDD terminal during testing; The VDD port of the charging management chip is a power port. During the test, a 5V voltage is input and a current limit of 400mA is set. The BAT port of the charging management chip is a charging output port. After power-on, the supply voltage of the BAT port is detected, and the charging management chip enters different working modes according to different supply voltages; wherein, when the supply voltage of the BAT port is 2-2.5V, the charging management chip enters a trickle charging mode, and when the supply voltage of the BAT port is above 2.5V, the charging management chip enters a constant current charging mode; during the test, the BAT port outputs a voltage of about 4.2V; The PROG port of the charging management chip is a charging current setting port, and the PROG port controls the charging current output by the BAT port by connecting different pull-down resistors R2; wherein, When the BAT port outputs the charging current I BAT When the current is less than or equal to 300mA, use formula (1) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT (1) When the BAT port outputs the charging current I BATWhen the current is greater than 300mA, use formula (2) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT × (1.3-I BAT ) (2) In this test, the BAT port outputs a charging current of 300 mA, so in this test, a 3.3K pull-down resistor R2 is connected to the PROG port.

[0008] Furthermore, the test board is an integrated board, and all pins are connected using Kelvin.

[0009] The batch testing method of a charging management chip provided by the present invention has the following beneficial effects: it can improve production efficiency and quality, and effectively prevent losses caused by abnormal chip functions; and the testing method is safe and reliable, and will not cause damage to the chip during the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation of the present invention.

[0011] Figure 1 This is a flow chart of the batch testing method of the charging management chip provided by the present invention.

[0012] Figure 2 This is a test process diagram of each charging management chip provided by the present invention.

[0013] Figure 3 This is a test schematic diagram of a charging management chip provided by the present invention. DETAILED DESCRIPTION

[0014] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of a batch testing method of a charging management chip proposed by the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0016] In this embodiment, a batch testing method for a charging management chip is provided. Figure 1 As shown, the batch testing method of the charging management chip includes the following steps: Step S1: After multiple charging management chips are placed on multiple test stations on the test board, a test start signal is sent; wherein each test station corresponds to a charging management chip and its peripheral devices; Step S2: After the test machine receives the start test signal, a batch test is performed on the multiple charging management chips on the test board to obtain batch test results of the multiple charging management chips; Step S3: outputting batch test results of the plurality of charging management chips.

[0017] Preferably, if Figure 2-3 As shown, the test process of each charging management chip includes: (1) The test machine controls the relays K1, K2, K3, K4, K5, K6 and K7 on the test board to be closed, so that the CHRG port of the charge management chip is connected to a 5.1K pull-up resistor, the PROG port is connected to a 3.3K pull-down resistor, the VDD port is connected to two 10uF capacitors, and the BAT port is connected to a 10nF capacitor and a 100ohm resistor; It should be noted that during the test, a 10nF capacitor was connected to the BAT port to simulate a battery, and a 100 ohm resistor was connected to the BAT port to GND to simulate a charging load to ensure stable output.

[0018] (2) Apply a 5V voltage to the VDD port through the test machine and limit the current to 400mA (to enable the chip to work normally, and the current limiting can protect the chip from burning out), and then continue for 5ms to ensure that the charging management chip can work normally after being stably powered on; (3) The test machine uses the V2 power supply to supply a 4V voltage to the BAT port, and then disconnects the V2 power supply after 5ms, so that the charging management chip enters the constant current charging mode; (4) After the charging management chip enters the constant current charging mode, wait for 10ms, and then the test machine uses the V1 power supply to measure the average voltage output by the BAT port within the next 20ms (the voltage output by the BAT port will fluctuate slightly, so the average voltage within 20ms is taken). The V1 power supply is used to measure the output voltage of the BAT port to prevent the output current from running to the test machine end. The current gear selects the minimum gear and limits the current to 0. The voltage gear selects the 5V gear. When the average voltage is between 4.165-4.235V, the test machine determines that the charging management chip is qualified, otherwise it is judged as unqualified; Specifically, the test machine uses the V1 power supply to measure the average voltage output by the BAT port within the subsequent 20ms, including: The test machine uses the V1 power supply to continuously measure the voltage output by the BAT port 100 times within the subsequent 20 ms, and calculates the average voltage output by the BAT port within the subsequent 20 ms based on the voltages obtained by the 100 measurements.

[0019] (5) The test machine first disconnects the relays K1, K2, K3, K4, K5, K6 and K7 on the test board, disconnects the charging management chip from its peripheral devices, and sets each port to 0V; then the test machine turns off the power supply channel, and the test ends; The testing machine performs batch testing on the multiple charging management chips on the testing board according to the above-mentioned testing process.

[0020] Specifically, Figure 3 As shown, after the charging management chip 4054 powers on the VDD port with 5V, the PROG port is connected to a 3.3K pull-down resistor. After the BAT port inputs a 4V voltage for 5ms, the BAT port will output a voltage of about 4.2V, and the output current is about 300mA.

[0021] In the embodiment of the present invention, the test machine can test up to 4 charging management chips simultaneously.

[0022] Specifically, Figure 3 As shown, each port of the charging management chip simulates the working state of the charging management chip 4054 in the application circuit, wherein the CHRG port of the charging management chip is a charging indication port, which is in a high impedance state when not charging, and is pulled to a low level internally when charging. A 5.1K resistor is connected to the VDD terminal during testing; The VDD port of the charging management chip is the power port. During the test, a 5V voltage is input and a current limit of 400mA is set. The current limit can prevent the internal diode from being broken down due to excessive instantaneous current of the chip. The BAT port of the charging management chip is a charging output port. After power-on, the supply voltage of the BAT port is detected, and the charging management chip enters different working modes according to different supply voltages; wherein, when the supply voltage of the BAT port is 2-2.5V, the charging management chip enters a trickle charging mode, and when the supply voltage of the BAT port is above 2.5V, the charging management chip enters a constant current charging mode; during the test, the BAT port outputs a voltage of about 4.2V; The PROG port of the charging management chip is a charging current setting port, and the PROG port controls the charging current output by the BAT port by connecting different pull-down resistors R2; wherein, When the BAT port outputs the charging current I BAT When the current is less than or equal to 300mA, use formula (1) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT (1) When the BAT port outputs the charging current I BAT When the current is greater than 300mA, use formula (2) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT × (1.3-I BAT ) (2) In this test, the BAT port outputs a charging current of 300 mA, so in this test, a 3.3K pull-down resistor R2 is connected to the PROG port.

[0023] It should be noted that the test board adopts an integrated board, and all pins use Kelvin connections, which can effectively reduce interference.

[0024] The batch testing method of the charging management chip provided in the embodiment of the present invention can improve production efficiency and quality, and effectively prevent losses caused by abnormal chip functions; and the testing method is safe and reliable, and will not cause damage to the chip during the test.

[0025] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A batch testing method for a charging management chip, characterized in that: The batch testing method of the charging management chip comprises the following steps: Step S1: After multiple charging management chips are placed on multiple test stations on the test board, a test start signal is sent; wherein each test station corresponds to a charging management chip and its peripheral devices; Step S2: After the test machine receives the start test signal, a batch test is performed on the multiple charging management chips on the test board to obtain batch test results of the multiple charging management chips; Step S3: outputting batch test results of the plurality of charging management chips.

2. A batch testing method for a charging management chip according to claim 1, characterized in that: The testing process of each charging management chip includes: (1) The test machine controls the relays K1, K2, K3, K4, K5, K6 and K7 on the test board to be closed, so that the CHRG port of the charge management chip is connected to a 5.1K pull-up resistor, the PROG port is connected to a 3.3K pull-down resistor, the VDD port is connected to two 10uF capacitors, and the BAT port is connected to a 10nF capacitor and a 100ohm resistor; (2) Apply a 5V voltage to the VDD port through the test machine, and limit the current to 400mA, and then continue for 5ms to ensure that the charging management chip can work normally after being stably powered on; (3) The test machine uses the V2 power supply to supply a 4V voltage to the BAT port, and then disconnects the V2 power supply after 5ms, so that the charging management chip enters the constant current charging mode; (4) After the charging management chip enters the constant current charging mode, the tester waits for 10ms, and then the tester uses the V1 power supply to measure the average voltage output by the BAT port within the subsequent 20ms. When the average voltage is between 4.165-4.235V, the tester determines that the charging management chip is qualified, otherwise it is judged to be unqualified; (5) The test machine first disconnects the relays K1, K2, K3, K4, K5, K6 and K7 on the test board, disconnects the charging management chip from its peripheral devices, and sets each port to 0V; then the test machine turns off the power supply channel, and the test ends; The testing machine performs batch testing on the multiple charging management chips on the testing board according to the above-mentioned testing process.

3. A batch testing method for a charging management chip according to claim 2, characterized in that: The test machine uses the V1 power supply to measure the average voltage output by the BAT port within the subsequent 20ms, including: The test machine uses the V1 power supply to continuously measure the voltage output by the BAT port 100 times within the subsequent 20 ms, and calculates the average voltage output by the BAT port within the subsequent 20 ms based on the voltages obtained by the 100 measurements.

4. A batch testing method for a charging management chip according to claim 2, characterized in that: The CHRG port of the charging management chip is a charging indication port. It is in high impedance state when not charging. When charging, the port is pulled to a low level internally. When testing, a 5.1K resistor is connected to the VDD terminal; The VDD port of the charging management chip is a power port. During the test, a 5V voltage is input and a current limit of 400mA is set. The BAT port of the charging management chip is a charging output port. After power-on, the supply voltage of the BAT port is detected, and the charging management chip enters different working modes according to different supply voltages; wherein, when the supply voltage of the BAT port is 2-2.5V, the charging management chip enters a trickle charging mode, and when the supply voltage of the BAT port is above 2.5V, the charging management chip enters a constant current charging mode; during the test, the BAT port outputs a voltage of about 4.2V; The PROG port of the charging management chip is a charging current setting port, and the PROG port controls the charging current output by the BAT port by connecting different pull-down resistors R2; wherein, When the BAT port outputs the charging current I BAT When the current is less than or equal to 300mA, use formula (1) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT (1) When the BAT port outputs the charging current I BAT When the current is greater than 300mA, use formula (2) to calculate the resistance of the pull-down resistor R2; R2=1000 / I BAT ×(1.3-I BAT )(2) In this test, the BAT port outputs a charging current of 300 mA, so in this test, a 3.3K pull-down resistor R2 is connected to the PROG port.

5. The batch testing method of a charging management chip according to claim 1, characterized in that: The test board is an integrated board, and all pins are connected using Kelvin.