Packaging mold for coupling optical fiber and F-P cavity silicon optical device and application of packaging mold

Abstract

The invention discloses a packaging mold, a coupling packaging method and a coupling packaging structure for coupling an optical fiber and an F-P cavity silicon optical device, the packaging mold comprises a seat body, the seat body is provided with a first surface and a second surface which are adjacent to each other, the first surface is provided with an accommodating groove penetrating into the seat body, the first surface is provided with a first alignment structure, and the second surface is provided with a second alignment structure; a through hole communicated with the accommodating groove is formed in the second surface; an optical fiber limiting hole is formed in the cover body in a penetrating mode, the optical fiber limiting hole and the containing groove are arranged correspondingly, and a second alignment structure matched with the first alignment structure is arranged on the cover body; and when the cover body and the seat body are mutually limited through the first alignment structure and the second alignment structure, the optical fiber limiting hole corresponds to the central area of the accommodating groove. According to the method, additional observation instruments and complex clamp equipment are not needed, and coupling of one or more F-P cavity silicon optical devices and the optical fiber is achieved through gas-liquid interface regulation and control.

Description

Technical Field

[0001] The present invention belongs to the technical field of micro-nano equipment, and specifically relates to a packaging mold for coupling optical fiber and FP cavity silicon optical device, an optical fiber FP cavity silicon optical device coupling packaging method and an optical fiber FP cavity silicon optical device coupling packaging structure. Background Art

[0002] Fiber FP cavity silicon photonic sensing technology senses the change in cavity length or refractive index caused by the measured parameter acting on the FP cavity. FP cavity silicon photonic devices are the core sensitive components of fiber optic sensors, and can be divided into intrinsic fiber FP sensors and extrinsic fiber FP sensors according to different FP cavity construction methods.

[0003] The FP cavity of the intrinsic fiber FP sensor is the fiber itself, which is susceptible to multi-parameter cross-sensitivity problems such as temperature, strain, and pressure. The FP cavity of the extrinsic fiber FP sensor is no longer the fiber itself, but air or other media, which has the advantages of high measurement sensitivity, large dynamic range, and fast response time, but requires the micron-scale FP cavity silicon optical device to be coupled with the optical fiber.

[0004] The existing coupling methods are: using a three-axis fiber clamp to achieve alignment coupling between the optical fiber and the FP medium cavity; or using an optical coupler to achieve docking between the device and the optical fiber in an end-face coupling manner.

[0005] However, the above scheme has low coupling efficiency. Manual alignment under a microscope results in low centering accuracy, which affects the intensity of the optical signal and the overall stability of the device.

[0006] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0007] The purpose of the present invention is to provide a packaging mold, a coupling packaging method and a coupling packaging structure for coupling optical fiber and FP cavity silicon optical device, which do not require additional observation instruments and complex fixture equipment, and can achieve coupling of single or multiple FP cavity silicon optical devices and optical fibers through gas-liquid interface regulation.

[0008] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0009] A packaging mold for coupling an optical fiber and an FP cavity silicon optical device, comprising:

[0010] The seat body has a first surface and a second surface adjacent to each other, the first surface is provided with a receiving groove extending deep into the seat body, the first surface is provided with a first alignment structure, and the second surface is provided with a through hole communicating with the receiving groove;

[0011] A cover body, on which a fiber limiting hole is provided, the fiber limiting hole is provided corresponding to the containing groove, and the cover body is provided with a second alignment structure matched with the first alignment structure;

[0012] Wherein, when the cover body and the seat body are mutually limited by the first alignment structure and the second alignment structure, the optical fiber limiting hole corresponds to the central area of ​​the accommodating groove.

[0013] In one or more embodiments of the present invention, a plurality of the accommodating grooves are arranged in an array on the base body, and the plurality of the accommodating grooves are interconnected.

[0014] In one or more embodiments of the present invention, a plurality of the optical fiber limiting holes are arranged in an array on the cover body, and one optical fiber limiting hole is arranged corresponding to one accommodating groove.

[0015] In one or more embodiments of the present invention, the receiving groove is configured as an axisymmetric structure or a centrally symmetrical structure; and / or,

[0016] The optical fiber limiting hole is configured as a polygonal structure.

[0017] In one or more embodiments of the present invention, an annular groove structure is provided on the first surface, the containing groove is located in an annular region of the annular groove structure, and the containing groove is connected to the annular groove structure.

[0018] In one or more embodiments of the present invention, the through hole is connected to the annular groove structure; and / or,

[0019] The through hole is connected to the accommodating groove through the annular groove structure.

[0020] In one or more embodiments of the present invention, one of the first alignment structure and the second alignment structure is an alignment hole, and the other is an alignment cone or an alignment column.

[0021] In one or more embodiments of the present invention, the material of the base and the cover includes one or more of glass, steel, aluminum, titanium, 3D printing polymer, polydimethylsiloxane, polypropylene, polyvinyl chloride, polystyrene, nylon, polytetrafluoroethylene, acrylate, polyethyl methacrylate, thermoplastic polyurethane and combinations thereof; and / or,

[0022] The shape of the receiving groove includes one or more of a cylindrical shape, a cubic shape, a rectangular parallelepiped shape and a right prism shape.

[0023] A method for coupling and packaging a fiber FP cavity silicon optical device, comprising:

[0024] Providing the above-mentioned packaging mold for coupling optical fiber and FP cavity silicon optical device;

[0025] Placing the FP cavity silicon optical device in the receiving groove of the base body;

[0026] Inserting the optical fiber provided with the curing liquid into the optical fiber limiting hole of the cover body;

[0027] The cover body and the base body are mutually limited, and the optical fiber extends into the containing groove;

[0028] Introducing fluid into the containing groove to adjust the floating height of the FP cavity silicon optical device until it is coupled with the optical fiber;

[0029] The curing liquid is cured to obtain a fiber FP cavity silicon optical device coupling packaging structure.

[0030] A fiber FP cavity silicon optical device coupling packaging structure is packaged by using the fiber FP cavity silicon optical device coupling packaging method.

[0031] Compared with the prior art, the packaging mold, coupling packaging method and coupling packaging structure for coupling optical fiber and FP cavity silicon optical device of the present invention can realize the simultaneous coupling of single or multiple FP cavity silicon optical devices with optical fiber through gas-liquid interface regulation.

[0032] The packaging mold for coupling optical fiber and FP cavity silicon optical device, coupling packaging method and coupling packaging structure of the present invention have a simple packaging mold structure, and the FP cavity silicon optical device is controlled to move up and down by regulating the gas-liquid interface, replacing manual alignment under a microscope, and has high reliability. The gas-liquid interface regulation can effectively avoid mechanical damage to the surface of the FP cavity silicon optical device, thereby achieving lossless coupling.

[0033] The packaging mold for coupling optical fiber and FP cavity silicon optical device, the coupling packaging method and the coupling packaging structure of the present invention do not need to be observed under a microscope, solve the problem of curing glue overflow obstructing the line of sight, and achieve precise centering coupling between arrayed FP cavity silicon optical device and optical fiber through packaging mold design.

[0034] The optical fiber FP cavity silicon optical device coupling packaging structure of the present invention can be applied to multi-point or planar area temperature sensing, temperature imaging and other scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a schematic diagram of the three-dimensional structure of a packaging mold for coupling an optical fiber and a FP cavity silicon optical device in one embodiment of the present invention;

[0037] Figure 2 A three-dimensional structural diagram of a base body of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0038] Figure 3 A top view of a base of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0039] Figure 4 A side view of a base body of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0040] Figure 5 A front view of a base body of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0041] Figure 6 A three-dimensional structural diagram of a cover of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0042] Figure 7 A top view of a cover of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention;

[0043] Figure 8 It is a side view of a cover of a packaging mold for coupling an optical fiber and an FP cavity silicon optical device in one embodiment of the present invention. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0045] As mentioned in the background technology, the existing coupling methods of non-intrinsic FP cavity silicon optical devices and optical fibers have certain defects. For example, when using a three-axis optical fiber clamp or an optical coupler for coupling, the three-dimensional position needs to be manually controlled and continuously adjusted under a microscope, and only a single assembly can be performed at the same time. The entire process relies on manual labor with low reliability and low efficiency. UV-curing glue is generally used for vertical bonding. During bonding, some of the UV-curing glue will overflow, which will obstruct the line of sight under a microscope and make precise alignment impossible. Moreover, the use of mechanical structures for clamping and alignment can easily cause damage to the surface of the silicon optical device.

[0046] Based on this, the present invention provides a packaging mold, a coupling packaging method and a coupling packaging structure for coupling optical fiber and FP cavity silicon optical device. The packaging mold has a simple structure, and the FP cavity silicon optical device is controlled to move up and down by regulating the gas-liquid interface, replacing manual alignment under a microscope, and has high reliability. The gas-liquid interface regulation can effectively avoid mechanical damage to the surface of the FP cavity silicon optical device, thereby achieving lossless coupling.

[0047] like Figure 1 As shown, a packaging mold for coupling optical fiber and FP cavity silicon optical device in an embodiment of the present invention includes a base body 10 and a cover body 20.

[0048] The seat body 10 is configured as a column structure. The seat body 10 has a first surface 11 and a second surface 12 disposed adjacent to each other. Preferably, the first surface 11 and the second surface 12 are both planes.

[0049] like Figures 2 to 5 As shown, a receiving groove 13 is vertically opened on the first surface 11 of the seat body 10 along the height direction of the seat body 10 and penetrates into the seat body 10. The receiving groove 13 is not set through the seat body 10. The receiving groove 13 is set as an axisymmetric structure or a central symmetric structure, and the material of the inner wall of the receiving groove 13 is a hydrophilic material, so that when the fluid is injected into the receiving groove 13, due to the surface tension of the inner wall, the fluid will form a concave meniscus in the receiving groove 13, and the central area of ​​the receiving groove 13 is the lowest point of the meniscus. In this way, when the FP cavity silicon optical device is placed in the receiving groove 13, the FP cavity silicon optical device will be located in the central area of ​​the receiving groove 13.

[0050] The number of the accommodating grooves 13 may be one or more. When there are more than one accommodating grooves, the plurality of accommodating grooves 13 are arranged in an array on the base 10, and the plurality of accommodating grooves 13 are interconnected. The arrangement of the plurality of accommodating grooves 13 may be 2*4, 1*8 or other multi-row and multi-column forms.

[0051] Preferably, the shape of the receiving groove 13 includes one or more of a cylindrical shape, a cubic shape, a rectangular parallelepiped shape and a right prism shape.

[0052] A through hole 14 is provided on the second surface 12 of the seat body 10 and communicates with the accommodating groove 13. The through hole 14 is used to inject fluid into the accommodating groove 13 and extract fluid from the accommodating groove 13. Preferably, the through hole 14 is connected to the lower part of the accommodating groove 13 (the side away from the first surface 11 is defined as the lower part).

[0053] In one embodiment, an annular groove structure 15 is further provided on the first surface 11 of the seat body 10. One or more accommodating grooves 13 are located in the annular region of the annular groove structure 15. The accommodating groove 13 is connected to the annular groove structure 15. The through hole 14 on the second surface 12 is connected to the annular groove structure 15, and the through hole 14 is connected to the accommodating groove 13 through the annular groove structure 15.

[0054] The annular groove structure 15 has a certain fluid buffering capacity, which can reduce the direct impact of the fluid on the receiving groove 13. The fluid entering the through hole 14 is buffered by the annular groove structure 15 and then injected into the receiving groove 13, which can improve the stability of the FP cavity silicon optical device located in the receiving groove 13.

[0055] like Figures 6 to 8 As shown, the cover body 20 is preferably a plate-like structure. A fiber limiting hole 21 is provided through the cover body 20 along the thickness direction. The fiber limiting hole 21 is provided corresponding to the receiving groove 13, and when the cover body 20 and the seat body 10 are mutually limited, the fiber limiting hole 21 corresponds to the central area position of the receiving groove 13. The fiber limiting hole 21 is used to accommodate and fix the optical fiber.

[0056] The number of the optical fiber limiting holes 21 is consistent with the number of the accommodating grooves 13, and can be one or more. When there are more than one optical fiber limiting holes 21, the plurality of optical fiber limiting holes 21 are arranged in an array on the cover body 20, and one optical fiber limiting hole 21 corresponds to one accommodating groove 13. The arrangement of the plurality of optical fiber limiting holes 21 can be 2*4, 1*8 or other multi-row and multi-column forms.

[0057] The optical fiber limiting hole 21 is set to a polygonal structure, such as a triangle, square, pentagon, etc. When the optical fiber is placed in the optical fiber limiting hole 21, the optical fiber is tangent to at least two sides of the polygonal structure to determine the centering position, thereby achieving accurate positioning of the optical fiber.

[0058] In order to limit the position of the base 10 and the cover 20 , a first alignment structure 16 is provided on the first surface 11 of the base 10 , and a second alignment structure 22 matched with the first alignment structure 16 is provided on the cover 20 .

[0059] The first alignment structure 16 is disposed at the edge region of the first surface 11 of the base 10. The first alignment structure 16 is preferably an alignment column, an alignment cone or an alignment hole. The number of the first alignment structure 16 can be multiple.

[0060] The second alignment structure 22 is disposed at the edge area of ​​the cover body. The second alignment structure 22 is preferably an alignment hole or an alignment column or an alignment cone. The number of the second alignment structure 22 can be multiple.

[0061] The materials of the base 10 and the cover 20 may include one or more of glass, steel, aluminum, titanium, 3D printing polymer, polydimethylsiloxane, polypropylene, polyvinyl chloride, polystyrene, nylon, polytetrafluoroethylene, acrylate, polyethyl methacrylate, thermoplastic polyurethane and combinations thereof. The base 10 and the cover 20 may be formed by 3D printing or machining.

[0062] refer to Figure 1 As shown, the present invention also provides a method for coupling and packaging an optical fiber FP cavity silicon optical device using the above-mentioned packaging mold for coupling an optical fiber and an FP cavity silicon optical device, which specifically includes the following steps:

[0063] First, the extrinsic FP cavity silicon optical device A to be coupled is placed in the receiving groove 13 of the base body and is located at the bottom of the receiving groove 13 .

[0064] Next, the optical fiber B provided with the curing liquid is passed through the optical fiber limiting hole 21 of the cover 20. The end provided with the curing liquid is located below the cover 20, so as to facilitate the subsequent contact with the extrinsic FP cavity silicon optical device A.

[0065] The cover body 20 and the base body 10 are mutually limited by the alignment structure, and the optical fiber B extends into the receiving groove 13 and corresponds to the center position of the receiving groove 13 one by one.

[0066] The fluid is introduced into the annular groove structure 15 through the through hole 14 and flows into the containing groove 13. Due to the surface tension of the inner wall of the containing groove 13, the non-intrinsic FP cavity silicon optical device A will float at the lowest point of the meniscus of the containing groove 13. This ensures that each non-intrinsic FP cavity silicon optical device A is located in the central area of ​​the containing groove 13. By adjusting the flow rate of the introduced fluid, the floating height of the non-intrinsic FP cavity silicon optical device A is regulated until it is coupled with the optical fiber B.

[0067] After the whole is solidified, the fluid is extracted from the through hole 14 to lower the liquid level, and the optical fiber FP cavity silicon optical device coupling packaging structure is obtained.

[0068] Among them, the material of the extrinsic FP cavity silicon optical device can be germanium, silicon, silicon dioxide, silicon carbide, silicon nitride, zinc oxide and other silicon optical device materials.

[0069] The fluid can be water, or other polar solvents, oil, non-polar solvents, organic solvents, etc.

[0070] The structures of optical fibers include single-mode optical fibers, multi-mode optical fibers, gradient-index optical fibers, step-index optical fibers, special optical fibers, etc.; the materials of optical fibers include quartz optical fibers, plastic optical fibers, multi-component glass optical fibers, sapphire optical fibers, metal-coated optical fibers, polymer-coated optical fibers, etc.

[0071] The curing liquid includes UV glue and the like, and the curing method includes ultraviolet irradiation and the like.

[0072] Based on this, the present invention also provides a fiber FP cavity silicon optical device coupling packaging structure packaged by the above fiber FP cavity silicon optical device coupling packaging method.

[0073] Compared with the prior art, the packaging mold, coupling packaging method and coupling packaging structure for coupling optical fiber and FP cavity silicon optical device of the present invention can realize the simultaneous coupling of single or multiple FP cavity silicon optical devices with optical fiber through gas-liquid interface regulation.

[0074] The packaging mold for coupling optical fiber and FP cavity silicon optical device, coupling packaging method and coupling packaging structure of the present invention have a simple packaging mold structure, and the FP cavity silicon optical device is controlled to move up and down by regulating the gas-liquid interface, replacing manual alignment under a microscope, and has high reliability. The gas-liquid interface regulation can effectively avoid mechanical damage to the surface of the FP cavity silicon optical device, thereby achieving lossless coupling.

[0075] The packaging mold for coupling optical fiber and FP cavity silicon optical device, the coupling packaging method and the coupling packaging structure of the present invention do not need to be observed under a microscope, solve the problem of curing glue overflow obstructing the line of sight, and achieve precise centering coupling between arrayed FP cavity silicon optical device and optical fiber through packaging mold design.

[0076] The optical fiber FP cavity silicon optical device coupling packaging structure of the present invention can be applied to multi-point or planar area temperature sensing, temperature imaging and other scenarios.

[0077] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0078] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A packaging mold for coupling optical fiber and FP cavity silicon optical device, characterized in that: include: The seat body has a first surface and a second surface adjacent to each other, the first surface is provided with a receiving groove extending deep into the seat body, the first surface is provided with a first alignment structure, and the second surface is provided with a through hole communicating with the receiving groove; A cover body, on which a fiber limiting hole is provided, the fiber limiting hole is provided corresponding to the containing groove, and the cover body is provided with a second alignment structure matched with the first alignment structure; Wherein, when the cover body and the seat body are mutually limited by the first alignment structure and the second alignment structure, the optical fiber limiting hole corresponds to the central area of ​​the accommodating groove.

2. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 1, characterized in that: A plurality of the accommodating grooves are arranged in an array on the base body, and the plurality of the accommodating grooves are interconnected.

3. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 2, characterized in that: A plurality of optical fiber limiting holes are arranged in an array on the cover body, and one optical fiber limiting hole is arranged corresponding to one accommodating groove.

4. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 1, characterized in that: The receiving groove is configured as an axisymmetric structure or a centrally symmetrical structure; and / or, The optical fiber limiting hole is configured as a polygonal structure.

5. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 1, characterized in that: An annular groove structure is provided on the first surface, the containing groove is located in the annular region of the annular groove structure, and the containing groove is communicated with the annular groove structure.

6. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 5, characterized in that: The through hole is connected to the annular groove structure; and / or, The through hole is connected to the accommodating groove through the annular groove structure.

7. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 1, characterized in that: One of the first alignment structure and the second alignment structure is an alignment hole, and the other is an alignment cone or an alignment column.

8. The packaging mold for coupling optical fiber and FP cavity silicon optical device according to claim 1, characterized in that: The material of the base and the cover includes one or more of glass, steel, aluminum, titanium, 3D printing polymer, polydimethylsiloxane, polypropylene, polyvinyl chloride, polystyrene, nylon, polytetrafluoroethylene, acrylate, polyethyl methacrylate, thermoplastic polyurethane and combinations thereof; and / or, The shape of the receiving groove includes one or more of a cylindrical shape, a cubic shape, a rectangular parallelepiped shape and a right prism shape.

9. A method for coupling and packaging a fiber FP cavity silicon optical device, characterized in that: include: Providing a packaging mold for coupling an optical fiber and a FP cavity silicon optical device as described in any one of claims 1 to 8; Placing the FP cavity silicon optical device in the receiving groove of the base body; Inserting the optical fiber provided with the curing liquid into the optical fiber limiting hole of the cover body; The cover body and the base body are mutually limited, and the optical fiber extends into the containing groove; Introducing fluid into the containing groove to adjust the floating height of the FP cavity silicon optical device until it is coupled with the optical fiber; The curing liquid is cured to obtain a fiber FP cavity silicon optical device coupling packaging structure.

10. A fiber FP cavity silicon optical device coupling packaging structure, characterized in that: The optical fiber FP cavity silicon optical device is packaged by the optical fiber FP cavity silicon optical device coupling packaging method according to claim 9.

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