Liquid cooling type efficient host heat dissipation device
Through the liquid-cooled high-efficiency host heat dissipation device, the cooling liquid circulation and airflow of the fan body are used to solve the problem that air-cooled heat dissipation is difficult to quickly take away heat under high load conditions, achieving a more efficient heat dissipation effect and maintaining the stable operation of the host.
Patent Information
- Application Number
- CN202411873675.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-03-14
AI Technical Summary
The existing air-cooled heat dissipation technology is difficult to quickly take away a large amount of heat under high load conditions, resulting in an increase in system temperature and affecting the performance of the host.
The liquid-cooled high-efficiency main engine heat dissipation device is adopted, including the shell, fan body, connector and heat absorption metal block, which removes heat through the cooling liquid circulation, and further dissipates heat by using the airflow of the heat dissipation wings and the fan body.
It realizes the faster and more efficient removal of heat generated by the heat source, keeping the main unit running stably, especially under high load conditions, and quickly removing heat to prevent the system from overheating.
Smart Images

Figure CN119620838A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of host heat dissipation, and in particular to a liquid cooling type high-efficiency host heat dissipation device. Background Art
[0002] The host, also known as the server, is a general term for computer hardware and software, usually used to store, process or transmit data. It is a key device in the network environment, responsible for performing various tasks such as data storage, network communication, data processing, etc. The electronic components inside the host will generate a lot of heat when working. If this heat cannot be dissipated in time, the temperature of the components will continue to rise, which may cause its performance to decline, unstable operation or even damage. Therefore, heat dissipation is the key to ensuring the stable operation of the host.
[0003] Common host cooling mechanisms generally use air cooling. Although air cooling technology is mature and low-cost, air cooling mainly uses fans to drive air convection to remove heat. However, the thermal conductivity of air is relatively low. Especially under high load conditions, air cooling may not be able to quickly remove a large amount of heat, causing the system temperature to rise and affecting the performance of the host. Summary of the invention
[0004] The object of the present invention is to provide a liquid cooling type high-efficiency host heat dissipation device to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a liquid-cooled high-efficiency host heat dissipation device, comprising a shell, a fan body, a connector and a heat-absorbing metal block, a first water channel is arranged inside the shell, a connector is arranged on one side of the shell, a heat-absorbing metal block is arranged on one side of the connector, and a second water channel is arranged inside the connector, the two ends of the first water channel are respectively connected to the two ends of the second water channel through a water inlet pipe and a water outlet pipe, a water pump is arranged on the water inlet pipe, heat dissipation fins are evenly distributed on both sides of the shell, and two groups of reserved grooves are arranged on both sides of one end of the shell, and the fan body is arranged inside the reserved groove.
[0006] Preferably, fan blades are evenly distributed on the outer side of the fan body, and the fan blades are arranged in 8 groups.
[0007] Preferably, the heat dissipation fins are all in a trapezoidal structure, and the heat dissipation fins are distributed at equal intervals.
[0008] Preferably, the first water channel and the second water channel both have an "S"-shaped structure, and the inner walls of the first water channel and the second water channel are uniformly coated with Teflon coating.
[0009] Preferably, mounting plates are provided at both ends of both sides of the connecting head, and a chamber is provided on one side of the mounting plate, a pull rod vertically passes through the central position of the chamber, and a handle is provided at one end of the pull rod, a limit block is provided at the end of the pull rod away from the handle, and a built-in magnet is embedded in the inside of the limit block.
[0010] Preferably, the heat-absorbing metal block is made of copper alloy, and the surface of the heat-absorbing metal block is evenly coated with heat-dissipating silicone grease.
[0011] Preferably, movable plates are provided on both sides of the chamber via return springs, and one end of the movable plates is connected to the pull rod.
[0012] Preferably, three groups of ribs are provided on the fan blades, and the ribs gradually increase in size along the extension direction of the fan blades.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the liquid-cooled high-efficiency host heat dissipation device is installed with a shell, a connector, a heat-absorbing metal block, a first water channel, a second water channel, a metal pipe, a water outlet pipe, a water pump and a fan body. By connecting the connector to the electronic components in the host that need heat dissipation, the heat-absorbing metal block absorbs the heat generated when the electronic components are working, and at the same time the water pump sucks the coolant in the first water channel into the second water channel through the water inlet pipe. During the circulation process, the heat absorbed by the heat-absorbing metal block is taken away and circulated back to the first water channel in the shell through the water outlet pipe. Heat dissipation fins are evenly distributed on the outside of the shell, and the heat of the coolant will be transferred to the heat sink. The heat fins then dissipate the heat into the air through the airflow generated by the fan body, thereby improving the efficiency of the entire cooling system. The heat-absorbing metal block on the connector is directly fitted with the electronic components in the host, and the high specific heat capacity and high thermal conductivity of the coolant are utilized to more quickly and efficiently remove the heat generated by the heat source, which helps to maintain the stable operation of the host. The first water channel and the second water channel are both "S"-shaped structures, which are beneficial to increase the time the coolant passes through and improve the heat exchange effect. At the same time, they cooperate with the fan body to reduce the temperature of the coolant and realize the recycling of the coolant. Even under high load conditions, they can quickly remove heat to prevent the system from overheating. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0015] Figure 1 It is a front view structural schematic diagram of the present invention.
[0016] Figure 2 It is a schematic diagram of the front cross-sectional structure of the present invention.
[0017] Figure 3 It is a schematic diagram of the cross-sectional structure of the connector of the present invention when viewed from above.
[0018] Figure 4 For the present invention Figure 3 Enlarged structural diagram at A in the middle.
[0019] Figure 5 It is a schematic diagram of the fan main body structure of the present invention.
[0020] In the figure: 1. Shell; 2. Reserved groove; 3. Fan body; 4. Heat dissipation fins; 5. First water channel; 6. Water pump; 7. Water inlet pipe; 8. Connector; 9. Heat-absorbing metal block; 10. Mounting plate; 11. Water outlet pipe; 12. Second water channel; 13. Handle; 14. Chamber; 15. Pull rod; 16. Reset spring; 17. Movable plate; 18. Limit block; 19. Built-in magnet; 20. Fan blades; 21. Ribs. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] See also Figure 1-5 An embodiment of the present invention is as follows: a liquid-cooled high-efficiency host heat dissipation device, comprising a shell 1, a fan body 3, a connector 8 and a heat-absorbing metal block 9, wherein a first water channel 5 is arranged inside the shell 1, a connector 8 is arranged on one side of the shell 1, and a heat-absorbing metal block 9 is arranged on one side of the connector 8; mounting plates 10 are arranged on both ends of both sides of the connector 8, and a chamber 14 is arranged on one side of the mounting plate 10, a pull rod 15 is vertically passed through the central position of the chamber 14, and a handle 13 is arranged at one end of the pull rod 15, and a limit block 18 is arranged at the end of the pull rod 15 away from the handle 13; movable plates 17 are arranged on both sides of the chamber 14 through reset springs 16, and one end of the movable plate 17 is connected to the pull rod 15.
[0023] By connecting the connector 8 to the electronic components in the host that need heat dissipation, the handle 13 is first pulled to the pull rod 15 during connection, so that the movable plate 17 squeezes the reset spring 16 and then contracts the limit block 18. After the heat-absorbing metal block 9 contacts the electronic component, the handle 13 is released, and the limit block 18 is stuck in the preset limit groove on the outside of the electronic component under the reset action of the reset spring 16.
[0024] It is convenient to fix the connector 8 on the surface of the electronic component, not easy to slide and shift, and convenient to disassemble and assemble. The inside of the limit block 18 is embedded with a built-in magnet 19, which is conducive to adsorption connection and increased firmness. The magnetic strength of the built-in magnet 19 is low to avoid affecting the normal operation of the host.
[0025] The heat-absorbing metal block 9 is made of copper alloy and can absorb the heat generated by the electronic components when they are working. The surface of the heat-absorbing metal block 9 is evenly coated with heat-dissipating silicone grease to fill the tiny gap between the electronic components and the heat-absorbing metal block 9, thereby improving the heat conduction efficiency. A second water channel 12 is arranged inside the connector 8, and the two ends of the first water channel 5 are respectively connected to the two ends of the second water channel 12 through a water inlet pipe 7 and a water outlet pipe 11, and a water pump 6 is arranged on the water inlet pipe 7.
[0026] The water pump 6 sucks the coolant in the first water channel 5 into the second water channel 12 through the water inlet pipe 7, takes away the heat absorbed by the heat-absorbing metal block 9 during the circulation process and circulates back to the first water channel 5 in the shell 1 through the water outlet pipe 11; heat dissipation fins 4 are evenly distributed on both sides of the shell 1, and the heat dissipation fins 4 are distributed at equal intervals. The heat of the coolant will be transferred to the heat dissipation fins 4. The heat dissipation fins 4 are of a trapezoidal structure, and the sizes of the upper and lower bases thereof can be adjusted to achieve a larger heat dissipation area in a limited space, thereby improving the heat dissipation efficiency.
[0027] Two groups of reserved grooves 2 are arranged on both sides of one end of the shell 1, and a fan body 3 is arranged inside the reserved grooves 2. Fan blades 20 are evenly distributed on the outside of the fan body 3, and 8 groups of fan blades 20 are arranged; the airflow generated by the fan blades 20 driven by the operation of the fan body 3 further dissipates heat into the air, thereby improving the efficiency of the entire heat dissipation system, and three groups of ribs 21 are arranged on the fan blades 20, and the ribs 21 gradually increase along the extension direction of the fan blades 20, which can generate surrounding airflow during rotation to reduce the impact of noise.
[0028] The heat-absorbing metal block 9 on the connector 8 is directly attached to the electronic components in the main unit, and the high specific heat capacity and high thermal conductivity of the coolant are utilized to more quickly and efficiently remove the heat generated by the heat source, which helps to maintain the stable operation of the main unit; the first water channel 5 and the second water channel 12 are both in an "S"-shaped structure, which is conducive to increasing the time for the coolant to pass through and improving the heat exchange effect. At the same time, the fan body 3 is used to reduce the temperature of the coolant and realize the recycling of the coolant. Even under high load conditions, heat can be quickly removed to prevent the system from overheating. The inner walls of the first water channel 5 and the second water channel 12 are evenly coated with Teflon coating, which is not easy to produce scale. The specific model and specifications of the water pump 6 need to be determined according to the selection calculation of the specification parameters of the device. The selection calculation method is a prior art, so it will not be described in detail.
[0029] About the working situation of this device: by connecting the connector 8 with the electronic components in the host that need heat dissipation, first pull the handle 13 to the pull rod 15 during connection, so that the movable plate 17 squeezes the reset spring 16 and then shrinks the limit block 18. After the heat-absorbing metal block 9 contacts the electronic component, release the handle 13. The limit block 18 is stuck in the preset limit groove on the outside of the electronic component under the reset action of the reset spring 16, which is conducive to fixing the connector 8 on the surface of the electronic component, not easy to slide and shift, and convenient for disassembly and assembly. The heat-absorbing metal block 9 is made of copper alloy, which can absorb the heat generated when the electronic component is working. At the same time, the water pump 6 pumps the coolant in the first water channel 5 through the water inlet The pipe 7 sucks the second water channel 12, and during the circulation process, the heat absorbed by the heat-absorbing metal block 9 is taken away and circulated back to the first water channel 5 in the shell 1 through the outlet pipe 11. The outer side of the shell 1 is evenly distributed with heat-dissipating fins 4, and the heat of the coolant will be transferred to the heat-dissipating fins 4. The heat-dissipating fins 4 are trapezoidal structures, and the sizes of the upper and lower bottoms can be adjusted to achieve a larger heat dissipation area in a limited space, thereby improving the heat dissipation efficiency. At the same time, the airflow generated by the fan blades 20 driven by the operation of the fan body 3 further dissipates the heat into the air, thereby improving the efficiency of the entire heat dissipation system, and the heat-absorbing metal block 9 on the connector 8 is directly fitted with the electronic components in the host.
[0030] By utilizing the high specific heat capacity and high thermal conductivity characteristics of the coolant, the heat generated by the heat source can be taken away more quickly and efficiently, which helps to maintain the stable operation of the host. The first water channel 5 and the second water channel 12 are both in an "S"-shaped structure, which is beneficial to increase the time the coolant passes through and improve the heat exchange effect. At the same time, the fan body 3 is used to reduce the temperature of the coolant and realize the recycling of the coolant. Even under high load conditions, heat can be quickly taken away to prevent the system from overheating. Ribs 21 are provided on the fan blades 20, which can generate surrounding airflow during rotation to reduce the impact of noise.
Claims
1. A liquid-cooled high-efficiency host heat dissipation device, characterized in that: The invention comprises a shell (1), a fan body (3), a connector (8) and a heat-absorbing metal block (9); a first water channel (5) is arranged inside the shell (1); a connector (8) is arranged on one side of the shell (1); a heat-absorbing metal block (9) is arranged on one side of the connector (8); a second water channel (12) is arranged inside the connector (8); two ends of the first water channel (5) are respectively connected to two ends of the second water channel (12) through a water inlet pipe (7) and a water outlet pipe (11); a water pump (6) is arranged on the water inlet pipe (7); heat dissipation fins (4) are evenly distributed on both sides of the shell (1); two groups of reserved grooves (2) are arranged on both sides of one end of the shell (1); and the fan body (3) is arranged inside each of the reserved grooves (2).
2. The liquid-cooled high-efficiency host heat dissipation device according to claim 1, characterized in that: The fan blades (20) are evenly distributed on the outside of the fan body (3), and the fan blades (20) are provided in 8 groups.
3. The liquid-cooled high-efficiency host heat dissipation device according to claim 1, characterized in that: The heat dissipation fins (4) are all in a trapezoidal structure, and the heat dissipation fins (4) are distributed at equal intervals.
4. The liquid-cooled high-efficiency host heat dissipation device according to claim 1, characterized in that: The first water channel (5) and the second water channel (12) both have an "S"-shaped structure, and the inner walls of the first water channel (5) and the second water channel (12) are uniformly coated with a Teflon coating.
5. The liquid-cooled high-efficiency host heat dissipation device according to claim 1, characterized in that: Both ends of the connecting head (8) are provided with mounting plates (10), and one side of the mounting plate (10) is provided with a chamber (14), a pull rod (15) vertically passes through the center of the chamber (14), and one end of the pull rod (15) is provided with a handle (13), and a limit block (18) is provided at the end of the pull rod (15) away from the handle (13), and a built-in magnet (19) is embedded in the inside of the limit block (18).
6. The liquid-cooled high-efficiency host heat dissipation device according to claim 1, characterized in that: The heat absorbing metal block (9) is made of a copper alloy material, and the surface of the heat absorbing metal block (9) is evenly coated with heat dissipation silicone grease.
7. The liquid-cooled high-efficiency host heat dissipation device according to claim 5, characterized in that: Both sides of the chamber (14) are provided with movable plates (17) via return springs (16), and one end of the movable plates (17) is connected to the pull rod (15).
8. The liquid-cooled high-efficiency host heat dissipation device according to claim 2, characterized in that: The fan blades (20) are each provided with three groups of ribs (21), and the ribs (21) gradually increase in size along the extension direction of the fan blades (20).