Novel centering degree calibration mechanism after film pasting of semiconductor wafer

Abstract

The invention relates to the technical field of semiconductor equipment, and provides a novel centering degree calibration mechanism and method for a semiconductor wafer after film pasting, and the mechanism comprises a film paper conveying guide device, a film pasting platform, and a film pasting concentricity automatic calibration device. The functions of full-automatic pre-cutting of special film paper, automatic checking of concentricity of the film paper and a wafer, film pasting and the like are achieved; a film paper pre-cutting scheme in a rolling mode is adopted, a visual system is matched with the combination of a servo motor and a precise lead screw, and a one-stop solution with high automation, high efficiency, high yield and high cost performance is provided from raw material feeding to finished product discharging.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor equipment, and in particular to a novel semiconductor wafer post-filming centering calibration mechanism. Background Art

[0002] The present invention relates to the field of semiconductor wafer packaging, specifically a packaging sub-field in advanced packaging, and a front-end process in the process flow of wafer-level chip packaging technology (WLCSP). Specifically, after the wafer bump manufacturing process (Bumping) and the process of cleaning and removing impurities, a special film paper is pasted on the back of the wafer, which can effectively prevent the occurrence of problems such as scratches, pollution and oxidation, thereby protecting the back of the wafer from damage and preparing for subsequent laser marking and slicing processes. During the film pasting process, it is difficult to check the concentricity of the film paper and the wafer, which can easily lead to film pasting deviation and affect the wafer quality. For this reason, we propose a novel semiconductor wafer post-film pasting centering calibration mechanism. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies of the prior art, the present invention provides a novel semiconductor wafer post-film lamination centering calibration mechanism, which overcomes the deficiencies of the prior art, has a reasonable design, a compact structure, and solves the problems raised in the background technology.

[0005] (II) Technical solution

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0007] A novel semiconductor wafer post-filming centering calibration mechanism comprises a film paper conveying guide device, a film pasting platform, and a film pasting concentricity automatic calibration device. The film paper conveying guide device installed on one side of the film pasting platform transfers the film after processing to the film pasting concentricity automatic calibration device for centering processing. The feature is that the film paper conveying guide device pre-cuts the special film paper on it and cooperates with the film pasting concentricity automatic calibration device on the film pasting platform;

[0008] The automatic calibration device for film concentricity includes a visual inspection device for monitoring the status of pre-cut special film paper and a concentricity calibration device for fine-tuning the wafer. The cutting marks collected by the visual inspection device are judged with the system preset cutting trajectory, and the concentricity calibration device automatically fine-tunes the wafer position;

[0009] The visual inspection device includes a camera module mounting substrate, an industrial camera for collecting pre-cut cutting marks, and an industrial camera. The camera module mounting substrate is connected to a connecting portion that slides along the X and Y directions through a bidirectional slide table, and the industrial camera installed on the connecting portion is matched with a slide rail and a slide groove and is controlled by bolts to slide and position along the Z direction;

[0010] The concentricity calibration device includes a wafer positioning device and a wafer driving device;

[0011] The circular positioning device includes a Z-direction upper substrate and a Z-direction lower substrate connected at both ends thereof through cylindrical guide rails. The wafer fixing plate connected to the Z-direction substrate is used to fix the wafer through a plurality of vacuum suction cups.

[0012] The wafer driving device includes an X-direction motor and an X-direction linear guide rail, wherein the output end of the X-direction motor is connected to the X-direction ball screw and drives the X-direction and Y-direction substrates to slide along the direction of the X-direction linear guide rail;

[0013] The Y-direction motor installed on the X- and Y-direction substrate drives the Y-direction ball screw, and the Y-direction ball screw is connected to the Y-direction cylindrical guide rail on the Z-direction lower substrate, so that the Z-direction lower substrate slides along the direction of the Y-direction cylindrical guide rail;

[0014] The Z-direction motor installed on the bottom of the base plate in the Z direction is used to control the lifting and lowering of the circular positioning device through a synchronous wheel mechanism and a Z-direction ball screw.

[0015] (III) Beneficial effects

[0016] The embodiment of the present invention provides a novel semiconductor wafer post-filming centering calibration mechanism, which has the following beneficial effects:

[0017] 1. Provide a new type of fully automatic wafer film laminating device, which can realize the functions of fully automatic pre-cutting of special film paper, automatic verification of the concentricity of film paper and wafer, and film laminating; adopt the film paper pre-cutting solution of roller pressing method, the combination of visual system with servo motor and precision screw, from raw material loading to finished product unloading, to achieve highly automated, high efficiency, high yield and high cost performance to provide a one-stop solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the film paper supply and pre-cutting device of the present invention;

[0020] Figure 3 It is a schematic diagram of the film paper supply device of the present invention;

[0021] Figure 4 This is a schematic diagram of a film paper pre-cutting device of the present invention;

[0022] Figure 5 This is a schematic diagram of the working diagram of the special pre-cutting knife of the present invention;

[0023] Figure 6 This is a schematic diagram of the membrane paper structure of the present invention;

[0024] Figure 7 This is a schematic diagram of the film paper pre-guiding device of the present invention;

[0025] Figure 8 This is a schematic diagram of the film paper conveying guide device of the present invention;

[0026] Fig. 9 It is a schematic diagram of the film paper conveying device of the present invention;

[0027] Fig.10 It is a schematic diagram of the film paper guiding device of the present invention;

[0028] Fig.11 This is a schematic diagram of the film pasting platform of the present invention;

[0029] Fig.12 This is a schematic diagram of a membrane paper recycling device of the present invention;

[0030] Fig.13 This is a schematic diagram of the membrane paper recycling mechanism of the present invention;

[0031] Fig.14 It is a schematic diagram of the bottom film conveying device of the present invention;

[0032] Fig.15 It is a schematic diagram of the bottom film guiding device of the present invention;

[0033] Fig.16 It is a schematic diagram of the automatic calibration device for film concentricity of the present invention;

[0034] Fig.17 It is a schematic diagram of the visual inspection device of the present invention;

[0035] Fig.18 It is a schematic diagram of the concentricity calibration device of the present invention;

[0036] Fig.19 Schematic diagram of the visual system fill light device of the present invention. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Refer to the attached Figure 1-19, a novel semiconductor wafer post-filming centering calibration mechanism, a film paper supply and pre-cutting device 1, wherein the film paper supply device 101 is a device for loading and supplying raw material film paper, wherein the film paper fixing shaft 10101 is an shaft for loading raw material film paper, the vacuum generator 10102 is used to adsorb and fix the raw material film paper reel inserted in the film paper fixing shaft 10101, the film paper reel installation reference 10103 is used as the installation reference of the raw material film paper, the film paper supply motor 10104 is used as the driving force of the film paper supply device, the active synchronous wheel 10105 is a synchronous wheel coaxially fixedly connected to the output shaft of the film paper supply motor 10104, the driven synchronous wheel 10107 is a synchronous wheel coaxially fixedly connected to the film paper fixing shaft 10101, and the synchronous belt 10106 is used to connect the active synchronous wheel. The synchronous wheel 10105 and the driven synchronous wheel 10107 finally transmit the output of the film paper supply motor 10104 to the film paper fixing shaft 10101, and make it rotate according to the setting; wherein, the special film paper 102 is a special film paper suitable for this device, specifically, the film paper is divided into three layers, wherein the first and third layers on the outside are the base film for protecting the middle layer, the middle layer is the film paper actually needed by the equipment and will eventually be attached to the back of the wafer, specifically, the viscosity between the first layer and the middle layer is relatively small, and the viscosity between the middle layer and the third layer is relatively large; wherein, the function of the film paper pre-cutting device 103 is to pre-cut the three layers of film paper, wherein the function of the pre-cutting roller 10301 is to pre-cut the film paper, specifically, the surface of the pre-cutting roller 10301 is a special blade layer with a specific pattern, and its microscopic morphology refers to the attached Figure 5As shown, the function of the pre-cutting roller 10302 is to cooperate with the pre-cutting roller 10301, squeeze and fix the special film paper 102 passing through the middle of the two, so that the film paper is cut in the process of being rolled by the pre-cutting roller 10301, specifically, the third layer of the bottom film and the second layer of the three-layer film paper are cut through by the blade, and the first layer of the bottom film is retained, wherein the left and right side adjustment mechanisms 10303 function to adjust the overall pressure between the pre-cutting roller 10302 and the pre-cutting roller 10301 and the pressure difference between the left and right ends, specifically to ensure that the force on the entire contact surface of the special film paper 102 is uniform; the function of the drive motor 103104 is to drive the pre-cutting roller 10301 to perform rolling cutting according to the control command. The function of the coupling 10305 is to coaxially connect the drive motor 103104 and the pre-cutting roller 10301, and serve as a connecting piece to transmit power from the output end to the working end. The film paper pre-guiding device 104 is used to limit and guide the conveying path and trajectory of the film paper. The guide roller 10401 is used to contact with the special film paper 102 and guide its conveying path. The surface of the film paper is provided with an anti-sticking coating. The front and rear ends are provided with film paper limiting blocks 10402. The function of the film paper is to prevent the film paper from changing its position during the conveying process and improve the stability of the film paper during the entire conveying process. Specifically, the film paper limiting block 10402 is an adjustable mechanism. The specific position of the adjuster can be adjusted according to the size of the film paper. It can be applied to the specifications of 8-inch, 12-inch and other wafers. The function of the ball bearing 10403 is to reduce rolling friction. Specifically, two groups of ball bearings 10403 are installed at both ends of the guide roller 10401 to reduce the friction as much as possible when it rotates, which is beneficial to the stability of the conveying process of the special film paper 102. The mounting substrate 105 is used as the mounting base of the above-mentioned functional unit.

[0039] Membrane paper conveying guide device 2, wherein the function of the membrane paper conveying device 201 is to convey the membrane paper that has been pre-cut in the front device to the next process link, wherein the function of the membrane paper conveying roller 20101 is to utilize the high friction between the rubber-coated shaft on the surface of the membrane paper conveying roller 20101 and the membrane paper, and to convey the membrane paper to the next process link by rotation, wherein the function of the membrane paper conveying driven shaft 20102 is to cooperate with the membrane paper conveying roller 20101, squeeze the membrane paper between the membrane paper conveying roller 20101 and the membrane paper conveying roller 20101, and utilize the friction force to convey the membrane paper to the next process link, wherein the function of the membrane paper conveying cylinder 20103 is to press the membrane paper conveying driven shaft 20102 downward, so that a pressure driving mechanism is generated between the membrane paper conveying roller 20101 and the membrane paper conveying roller 20101, wherein the function of the three cylinder guide shafts 20107 is to linearly guide the membrane paper conveying driven shaft 20102 to move up and down. The function of the bearing 20104 is to reduce the friction force of the film paper conveying roller 20101 in the rolling process as much as possible, so as to improve the stability of the film paper conveying and reduce the load of the driving mechanism, wherein the function of the driving motor 20105 is to serve as the driving power for the rotation of the film paper conveying roller 20101, wherein the coupling 20106 is a transmission device coaxially fixedly connected with the film paper conveying roller 20101 and the output shaft of the driving motor 20105, and transmits the output of the driving motor 20105 to the film paper conveying roller 20101; wherein the function of the film paper guide device 202 is to guide the transmission direction of the film paper, wherein the guide roller 20201 is a rolling shaft with an anti-sticking treatment on the surface, and its function is to guide the conveying direction of the film paper, wherein the function of the guide bearing 20202 is to reduce the resistance of the guide roller 20201 in the rolling process as much as possible, so as to improve the stability of the film paper conveying and reduce the load of the driving mechanism.

[0040] The film pasting platform 301 is used as a substrate for wafer film pasting. Specifically, the upper surface of the film pasting platform 301 is provided with an anti-sticking coating. After the film paper is transported to the film pasting platform 301, the wafer is transported from bottom to top by a special mechanism to the height of the film pasting platform 301, and then the film paper is pasted by a special device. The main substrate 303 is the mounting substrate of each functional unit of the device. The four connecting brackets 302 are used to connect the film pasting platform 301 and the main substrate 303 to ensure that the two are parallel to each other. The function of the two film pasting platform in-place sensors 304 is to detect the assembly position of the film pasting platform 301. Specifically, in order to adapt to wafer sizes of different specifications, the film pasting platform 301 is installed in a quick-installation manner. Therefore, the installation position needs to be detected after each replacement of the film pasting platform 301. The function of the film paper sensor 305 is to detect the position of the film paper to be pasted. Specifically, the film paper should be at the same height and parallel to the film pasting platform 301 in the waiting state to ensure the stability of the film pasting process.

[0041] The film paper recycling device 4, wherein the function of the film paper recycling mechanism 401 is to recycle the remaining waste film paper that has been pasted with the film, wherein the film paper recycling shaft 40101 is a rotating shaft for installing and fixing the waste base film, and the function of the waste film paper fixing clamp 40102 is to fix the flying film paper that has been pasted with the film, specifically, the film head of the waste film paper is fixed by the waste film paper fixing clamp 40102, so that the waste film paper is rolled up and recycled onto the film paper recycling shaft 40101 through the rotation of the film paper recycling shaft 40101, wherein the function of the driving motor 40103 is to provide power for the rotation of the film paper recycling shaft 40101, wherein the output synchronous wheel 40104 and the output shaft of the driving motor 40103 are coaxially fixedly connected, and the driven synchronous wheel 40104 is 106 is coaxially fixedly connected with the film paper recovery mechanism 401, wherein the function of the output synchronous belt 40105 is to finally transmit the output of the driving motor 40103 to the film paper recovery shaft 40101, so as to realize the recovery of waste film paper, wherein the function of the rotary damper 40109 is to prevent the film paper recovery shaft 40101 from rotating in the opposite direction in the absence of driving force, so as to avoid the recovery of waste film paper from falling off, wherein the damper synchronous wheel 40108 is coaxially fixedly connected with the rotary damper 40109, and the function of the damper synchronous belt 40107 is to connect the damper synchronous wheel 40108 and the driven synchronous wheel 40106, specifically to suppress the free rotation of the film paper recovery shaft 40101 in the absence of driving force. ; Among them, the function of the bottom film conveying device 402 is to pull back the discarded film paper that has been pasted with the film, wherein the function of the film drawing roller 40201 is to utilize the high friction between the rubber-coated shaft on the surface of the film drawing roller 40201 and the film paper, and to convey the film paper to the next process link by rotation, wherein the function of the film paper conveying driven shaft 40202 is to cooperate with the film drawing roller 40201, squeeze the film paper between the film drawing roller 40201 and the film paper conveying driven shaft 40202, and utilize the friction force to convey the film paper to the next process link, wherein the function of the film paper conveying cylinder 40204 is to press the film paper conveying driven shaft 40202 downward, and drive the pressure generated between the film drawing roller 40201 and the film paper conveying driven shaft 40202. Mechanism, the function of bearing 40203 is to reduce the friction force of the film-drawing roller shaft 40201 during rolling as much as possible, so as to improve the stability of film paper transportation and reduce the load of the driving mechanism, wherein the function of the driving motor 40205 is to serve as the driving power for the rotation of the film-drawing roller shaft 40201, wherein the output synchronous wheel 40206 is a transmission device coaxially fixedly connected to the output shaft of the driving motor 40205, the driven synchronous wheel 40208 is coaxially fixedly connected to the film-drawing roller shaft 40201, and the function of the synchronous belt 40207 is to connect the output synchronous wheel 40206 and the driven synchronous wheel 40208 to finally transmit the output of the driving motor 40205 to the film-drawing roller shaft 40201, so as to realize the supply of film paper;Among them, the two bottom film guide devices 403 are used to limit and guide the conveying direction of the waste film paper, among which, the waste film paper guide shaft 40301 is used to guide the conveying direction of the film paper, among which, the ball bearings 40302 are installed at both ends of the waste film paper guide shaft 40301, and their function is to reduce the rolling resistance of the waste film paper guide shaft 40301, specifically to improve the stability of the film paper guide and the film pulling load of the driving mechanism; among which, the waste film paper 405 is the remaining film paper that has been pasted with the film, and is the film paper that needs to be discarded; the recycling base plate 404 is the installation base of the above-mentioned functional devices. ;

[0042] The film concentricity automatic calibration device 5, wherein the function of the visual inspection device 501 is to transmit the pre-cut image signal of the film paper to be inspected to the image processing system, and convert the image signal into a digital signal by analyzing the pixel distribution, brightness, color and other information. The image processing system operates on these signals to extract the characteristics of the target, and controls the action of the relevant device according to the judgment result. Among them, the function of the camera module mounting base plate 50101 is to connect the equipment frame and the camera module, and is the mounting frame reference of the camera module. The function of the two-way slide 50102 is to serve as a fine-tuning platform for the camera module, which can be fine-tuned in the left and right X direction and the front and back Y direction. The function of the camera bracket 50103 is to fix the camera module, which can be There are slide rails and grooves in the upper and lower Z directions, which are positioned by bolts and have a certain amount of adjustment space, which is convenient for equipment debugging. The function of the industrial camera 50104 is to collect the cutting marks of the pre-cut film paper, specifically to compare the collected cutting marks with the system preset cutting trajectory, and then control the special device to automatically fine-tune the wafer position according to the comparison result. The function of the camera lens 50105 is to image the target object on the photosensitive surface of the image sensor, thereby realizing image acquisition; the function of the concentricity calibration device 502 is a device for fine-tuning the position of the wafer according to the result of the visual inspection device 501. The wafer 50201 is the wafer to be filmed, and the specifications are 8 inches, 12 inches, etc. The wafer fixing plate 50202 The function is to place and fix the wafer. Specifically, the wafer fixing plate 50202 is distributed with a number of vacuum suction cups. When the wafer is placed on the wafer fixing plate 50202, the vacuum generator is turned on to generate negative pressure on the suction cup, thereby completing the fixation of the wafer. Among them, the substrate 50203 in the Z direction is the installation base for the functional devices such as the wafer fixing plate 50202. Specifically, the cylindrical guide rail 50204 connects and positions the lower substrate 50206 in the Z direction and the substrate 50203 in the Z direction. It is also a guide device for the up and down movement of the wafer fixing plate 50202 in the Z direction. The function of the Z-direction ball screw 50205 is to transmit the drive generated by the power device installed on the lower substrate 50206 in the Z direction to the substrate 50203 in the Z direction. On the wafer fixing plate 50202 on the wafer fixing plate 50202, the X and Y direction substrate 50208 is a power device installation substrate for installing and controlling the movement of the wafer fixing plate 50202 in the two horizontal directions of X and Y, wherein the Y direction linear guide 50213 is a guiding device connecting the X and Y direction substrate 50208 and the Z direction lower substrate 50206, and its function is to guide the movement of the Z direction lower substrate 50206 in the Y direction, and the function of the X direction linear guide 50209 is to guide the movement of the X and Y direction substrate 50208 in the X direction, wherein the function of the Y direction motor 50222 is to drive the movement of the wafer fixing plate 50202 in the Y direction, and the Y direction motor synchronous wheel 50218 is a synchronous wheel coaxially fixedly connected to the Y direction motor 50222,The Y-direction ball screw 50221 is a device for transmitting the drive generated by the power device to the wafer fixing plate 50202. The Y-direction driven wheel 50219 is a synchronous wheel coaxially fixedly connected to the Y-direction ball screw 50221. The Y-direction synchronous belt 50220 is a synchronous belt connecting the Y-direction motor synchronous wheel 50218 and the Y-direction driven wheel 50219. Its function is to finally transmit the driving force generated by the Y-direction motor 50222 to the wafer fixing plate 50202 through the synchronous wheel mechanism and the Y-direction ball screw 50221. Among them, the Z-direction motor 50217 is a driving wheel for the wafer fixing plate 50202. The fixed plate 50202 is a power device for moving up and down in the Z direction. The Z-direction motor synchronous wheel 50215 is a synchronous wheel coaxially fixedly connected to the Z-direction motor 50217. The Z-direction driven wheel 50214 is a synchronous wheel coaxially fixedly connected to the Z-direction ball screw 50205. The Z-direction synchronous belt 50216 is a synchronous belt connecting the Z-direction motor synchronous wheel 50215 and the Z-direction driven wheel 50214. Its function is to finally transmit the driving force generated by the Z-direction motor 50217 to the wafer fixed plate 50202 through the synchronous wheel mechanism and the Z-direction ball screw 50205. The motor 50212 is a power device that drives the wafer fixing plate 50202 to move left and right in the X direction. The X-axis coupling 50211 is a coupling that is coaxially fixedly connected to the output shaft of the X-axis motor 50212. The X-axis ball screw 50210 is a device that finally transmits the drive generated by the X-axis motor 50212 to the wafer fixing plate 50202. Among them, the function of the visual system fill light device 503 is to provide lighting fill light for the visual inspection device 501. Among them, the function of the light-emitting panel 50301 is to provide a light source when the visual inspection device 501 performs visual inspection on the pre-cut film paper. The light-emitting panel provides a fill-in light function. The light-emitting panel bracket 50302 is used to fix and support the light-emitting panel 50301. The panel X-direction positioning buckle 50303 is used to position the light-emitting panel 50301 when filling light. The light-emitting panel cylinder 50306 is used to drive the light-emitting panel 50301 to move left and right in the X direction. The light-emitting panel guide rail 50304 is a limit device that guides the light-emitting panel 50301 to move left and right, and is composed of two mutually parallel guide rails. The guide rail bracket 50305 is used to support and fix the light-emitting panel guide rail 50304.

[0043] The workflow is as follows:

[0044] Load the film paper raw material reel onto the film paper fixing shaft 10101, with the inner side of the film paper raw material reel close to the film paper reel installation base 10103, turn on the vacuum generator 10102 to make the air nozzle generate negative pressure, and adsorb and fix the film paper raw material reel; the controller sends a signal, and the output shaft of the film paper supply motor 10104 starts to rotate according to the set direction, speed and other parameters according to the instruction, driving the active synchronous wheel 10105 coaxially connected thereto, thereby driving the matching synchronous belt 10106 and the driven synchronous wheel 10107, so that the output of the film paper supply motor 10104 is transmitted to the film paper fixing shaft 10101, and the fixed film paper raw material reel is driven to start rotating according to the setting to start supplying film paper.

[0045] The raw film paper supplied by the film paper supply device 101 is transported to the film paper pre-cutting device 103, and the film paper passes between the pre-cutting hob 10301 and the pre-cutting roller 10302. The bolts on both sides are adjusted to control the height of the mounting seat of the pre-cutting roller 10302, and the pressure between the pre-cutting hob 10301 and the pre-cutting roller 10302 reaches an appropriate size. The driving motor 103104 starts to rotate in the set direction and speed according to the controller instructions, driving the coupling 10305 coaxially fixedly connected thereto, and then driving the pre-cutting hob 10301 and the pre-cutting roller 10302 to actively press the film paper roll between the two to the subsequent process to complete the pre-cutting. The pre-cut pattern is in line with the size of 8-inch and 12-inch wafers.

[0046] The pre-cut membrane paper is transported to the membrane paper pre-guide device 104, and guided by it, the membrane paper is transported to the membrane paper conveying device 201, and the membrane paper passes between the membrane paper conveying roller 20101 and the membrane paper conveying driven shaft 20102, and is pushed out of the piston rod of the membrane paper conveying cylinder 20103 connected to the membrane paper conveying driven shaft 20102, so that the membrane paper conveying driven shaft 20102 is pressed tightly against the membrane paper conveying roller 20101, and the high friction silicone rubber on the surface of the membrane paper conveying roller 20101 and the membrane paper conveying driven shaft 20102 is used to fix the membrane paper, and the driving motor 20105 rotates in the set direction, speed and other layers under the command of the controller, thereby driving the coupling 20106 and the membrane paper conveying roller 20101 coaxially fixed thereto, and conveying the membrane paper to the next process link.

[0047] The film paper conveyed by the film paper conveying device 201 and guided by the film paper guiding device 202 is conveyed to the film pasting platform 301, and the visual inspection device 501 performs visual inspection on the pre-cut film paper. Specifically, before the visual inspection device 501 determines the pre-cutting traces of the film paper, the visual system fill light device 503 moves from left to right, specifically, through the driving of the light-emitting panel cylinder 50306 and the guidance of the light-emitting panel guide rail 50304, the panel X-direction positioning buckle 50303 is stopped under the positioning of the panel X-direction positioning buckle 50303. 03 stays directly below the visual inspection device 501, and the light-emitting panel 50301 is powered on to emit light, and the light passes through the film paper from below the pre-cut film paper, increasing the contrast of the knife mark on the film paper, making it easier for the visual inspection device 501 to capture features during inspection; wherein, a wafer position is preset in the system, and then the pre-cut knife mark on the film paper is compared with the preset wafer position through the combination of industrial camera 50104 and camera lens 50105, and the difference is fine-tuned by the concentricity calibration device 502. Specifically, in the X direction, the controller drives the X-direction motor 50212 to rotate according to the set parameters based on the difference between the shooting result and the preset position, and drives the X-direction coupling 50211 and the X-direction ball screw 50210 coaxially connected thereto to rotate, and the X-direction ball screw 50210 converts the output of the X-direction motor 50212 into linear motion, which is guided by the X-direction linear guide 50209 to make the X, Y direction substrate 50208 move linearly in the X direction, thereby driving the Z direction lower substrate 50206 fixedly connected thereto in the X direction to move in the X direction, thereby driving the Z direction substrate 50203 connected thereto through the cylindrical guide 50204 to move, and finally controlling the wafer fixing plate 50202 together with the Z direction substrate 50203 to move linearly in the X direction according to the judgment result; in the Y direction, the shooting result is compared with The controller drives the Y-direction motor 50222 to rotate according to the set parameters and the specified direction and speed according to the difference in the comparison, driving the Y-direction motor synchronous wheel 50218 coaxially fixed thereto, driving the Y-direction synchronous belt 50220 and the Y-direction driven wheel 50219 matched thereto, thereby driving the Y-direction ball screw 50221 coaxially connected to the Y-direction driven wheel 50219 to rotate, and the Y-direction ball screw 50221 converts the output of the Y-direction motor 50222 into linear motion, which is guided by the Y-direction linear guide 50213 and the Y-direction cylindrical guide 50207, so that the Z-direction lower substrate 50206 moves linearly in the Y direction, thereby driving the Z-direction substrate 50203 connected through the cylindrical guide 50204 to move, and finally controlling the wafer fixing plate 50202 together with the Z-direction substrate 50203 to move linearly in the Y direction according to the judgment result;After fine-tuning the position in the X and Y directions, the concentricity of the wafer and the pre-cut film paper is adjusted, and the visual system fill light device 503 moves from right to left. Specifically, it is driven by the light-emitting panel cylinder 50306 and guided by the light-emitting panel guide rail 50304, and the panel X-direction positioning buckle 50303 moves from the right positioning position to the left initial position and returns to the left standby position; in the Z direction, after fine-tuning in the X and Y directions, the center degree of the wafer and the pre-cut film paper is calibrated, and the Z-direction motor 50217 drives the Z-direction motor synchronous wheel 50215 coaxially fixed thereto to rotate according to the controller instruction, driving the Z-direction synchronous belt 50216 and the Z-direction driven wheel 50214 matched thereto to rotate synchronously, thereby driving the Z-direction ball screw 5 coaxially fixed thereto and the Z-direction driven wheel 50214 0205 rotates, the Z-direction lower substrate 50206 is connected to the Z-direction ball screw 50205, so that the Z-direction ball screw 50205 converts the output of the Z-direction motor 50217 into a Z-direction linear motion, and under the guidance of the cylindrical guide rail 50204, drives the Z-direction lower substrate 50206 to move linearly upward in the Z direction, drives the Z-direction upper substrate 50203 connected to the cylindrical guide rail 50204 to move linearly upward in the Z direction, and finally drives the wafer fixing plate 50202 fixed on the Z-direction substrate 50203 to move upward to the film-mounting platform 301 with the wafer, and the wafer is combined with the film paper adhesive layer to complete the wafer film-mounting process; the wafer after film-mounting is moved downward in the Z direction to the set position by the concentricity calibration device 502, and then the wafer robot completes the unloading process of the wafer after film-mounting. ;

[0048] The remaining film paper that has completed film pasting is transported to the film paper recycling mechanism for automatic recycling of waste film paper. The bottom film conveying device 402 pulls the waste film paper back from the film pasting platform 301, and the waste film paper is clamped between the film drawing roller 40201 and the film paper conveying driven shaft 40202. The piston rod of the film paper conveying cylinder 40204 pushes out to press the film paper conveying driven shaft 40202 connected thereto and the film drawing roller 40201, and at the same time, the friction force of the silicone rubber on the surface of the two shafts is used to fix the film paper. The driving motor 40205 rotates according to the set parameters according to the controller instruction, driving the output synchronous wheel 40206 coaxially fixed thereto to rotate, driving the driven synchronous wheel 40208 and the synchronous belt 40207 matched with the output synchronous wheel 40206, and driving the driving motor 402 The output of 05 is transmitted to the film-drawing roller shaft 40201 which is coaxially fixedly connected with the driven synchronous wheel 40208, thereby driving the waste film paper to be transported to the subsequent process; after passing through the limiting guidance of the two bottom film guide devices 403, the waste film paper is transported to the film paper recovery mechanism 401, and the film head of the waste film paper is clamped by the waste film paper fixing clamp 40102 and fixed on the film paper recovery shaft 40101, and the driving motor 40103 rotates according to the setting, driving the output synchronous wheel 40104 coaxially fixedly connected thereto to rotate synchronously, thereby driving the driven synchronous wheel 40106 and the output synchronous belt 40105 which cooperate with the output synchronous wheel 0104, and transmitting the output of the driving motor 40103 to the film paper recovery shaft 40101, so that it rotates according to the setting, and the waste film paper is wound up and automatically recovered.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A novel semiconductor wafer post-filming centering calibration mechanism, comprising a film paper conveying guide device (2), a film pasting platform (3), and a film pasting concentricity automatic calibration device (5), wherein the film paper conveying guide device (2) installed on one side of the film pasting platform (3) transfers the film after processing to the film pasting concentricity automatic calibration device (5) for centering processing, and is characterized in that: The film paper conveying guide device (2) pre-cuts the special film paper (102) thereon and cooperates with the film pasting concentricity automatic calibration device (5) on the film pasting platform (3); The film laminating concentricity automatic calibration device (5) comprises a visual inspection device (501) for monitoring the state of the pre-cut special film paper (102), and a concentricity calibration device (502) for fine-tuning the wafer (50201); the cutting marks collected by the visual inspection device (501) are judged against the system preset cutting trajectory, and the concentricity calibration device (502) automatically fine-tunes the position of the wafer (50201); The visual inspection device (501) comprises a camera module mounting substrate (50101), an industrial camera (50104) for collecting cutting marks of the pre-cut (102), the industrial camera (50104), the camera module mounting substrate (50101) is connected to a connecting portion that slides along the X and Y directions via a bidirectional slide (50102), and the industrial camera (50104) installed on the connecting portion is matched with a slide rail and a slide groove and is controlled by bolts to slide and position along the Z direction; The concentricity calibration device (502) comprises a wafer positioning device and a wafer driving device; The circular positioning device comprises a Z-direction upper substrate (50203) and a Z-direction lower substrate (50206) connected at both ends thereof through a cylindrical guide rail (50204); a wafer fixing plate (50202) connected to the Z-direction substrate (50203) is used to fix the wafer through a plurality of vacuum suction cups. The wafer driving device comprises an X-direction motor (50212) and X-direction linear guide rails (50209) and (50210); the output end of the X-direction motor (50212) is connected to the X-direction ball screw (50210) and drives the X- and Y-direction substrates (50208) to slide along the direction of the X-direction linear guide rail (50209); A Y-direction motor (50222) installed on an X- and Y-direction substrate (50208) drives a Y-direction ball screw (50221), and the Y-direction ball screw (50221) is connected to a Y-direction cylindrical guide rail (50207) on a Z-direction lower substrate (50206), so that the Z-direction lower substrate (50206) slides along the direction of the Y-direction cylindrical guide rail (50207); The Z-direction motor (50217) installed on the bottom of the Z-direction lower substrate (50206) is used to control the lifting and lowering of the circular positioning device through a synchronous wheel mechanism and a Z-direction ball screw (50205).

2. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: The film sticking concentricity automatic calibration device (5) further comprises a visual system fill light device (503) for providing illumination fill light to the visual detection device (501); The visual system light-filling device (503) comprises a light-emitting panel (50301) for visual inspection of the pre-cutting (102), a light-emitting panel cylinder (50306) and a light-emitting panel guide rail (50304) installed on the film-sticking platform (3), and the output end of the light-emitting panel cylinder (50306) is connected to the light-emitting panel (50301) so that it slides along the light-emitting panel guide rail (50304); The film sticking platform (3) is also connected to a light-emitting panel bracket (50302) for supporting the light-emitting panel (50301), and the light-emitting panel bracket (50302) is also connected to a panel X-direction positioning buckle (50303) for fixing and supporting the light-emitting panel (50301).

3. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: Also included is a film paper supply and pre-cutting device (1) including a mounting substrate (105), and (101) and (104) mounted on the mounting substrate (105); The film paper supply device (101) comprises a film paper fixing shaft (10101) and a vacuum generator (10102). The film paper fixing shaft (10101) is coaxially provided with a film paper supply motor (10104) to provide driving force thereto. The vacuum generator (10102) is arranged inside the film paper fixing shaft (10101) and is used for adsorbing and fixing the raw film paper reel inserted into the film paper fixing shaft (10101). The end of the film paper fixing shaft (10101) is also provided with a film paper reel installation reference (10103) to provide a reference for the installation of the raw film paper. The film paper pre-guiding device (104) comprises a guide roller (10401) with an anti-stick coating on its surface, film paper limit blocks (10402) for limiting the special film paper (102) are provided at both ends of the guide roller (10401), and the guide roller (10401) uses bearings to reduce friction and improve the stability of the special film paper (102) conveying process.

4. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: The mounting substrate (105) is also connected to a film paper pre-cutting device (103), and the special film paper (102) is divided into three layers, the viscosity between the first layer and the middle layer is relatively small, and the viscosity between the middle layer and the third layer is relatively large; The film paper pre-cutting device (103) comprises a pre-cutting roller (10302) driven by a driving motor (103104) and a pre-cutting roller (10301) arranged on the surface of the pre-cutting roller (10302) for cutting the special film paper (102); The blade of the pre-cutting roller (10301) is located on the surface of the drum and is also provided with flanges extending horizontally to both sides, and the flanges have a smooth transition with the drum surface, so that the special film paper (102) is rolled by the pre-cutting roller (10301) to form a third layer of base film and the second layer of film paper is cut through by the blade, and the first layer of base film is retained; The adjustment mechanism (10303) arranged at the end side of the pre-cutting roller (10301) is used to control the uniform force on the entire contact surface of the special film paper (102).

5. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: The film paper conveying guide device (2) comprises a film paper conveying device (201) for conveying the pre-cut film paper to the next process. The film paper conveying device (201) comprises a film paper conveying roller (20101) with high friction and a film paper conveying cylinder (20103), and the film paper conveying cylinder (20103) drives the corresponding film paper conveying driven shaft (20102) to cooperate.

6. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 5, characterized in that: The film paper conveying device (201) comprises a driving motor (20105), and the driving motor (20105) drives the film paper conveying roller (20101) to rotate and corresponds to the film paper conveying driven shaft (20102); The bearing (20104) is nested on the film paper conveying roller (20101) to reduce friction; The guide roller (20201) is an anti-sticking rolling shaft and a nested guide bearing (20202), which are used to improve the stability of film paper transportation and reduce the load of the driving mechanism.

7. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: The film pasting platform (3) comprises a film pasting platform (301) and a main substrate (303), wherein the film pasting platform (301) and the main substrate (303) are connected via a connecting bracket (302), and the film pasting platform (301) is also connected to a film pasting platform position sensor (304) and a film paper sensor (305) for detecting the position of the film paper to be pasted.

8. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 1, characterized in that: It also includes a film paper recovery device (4) including a recovery substrate (404) and a film paper recovery mechanism (401) installed on the recovery substrate (404); The membrane paper recovery mechanism (401) comprises a driving motor (40103) and a membrane paper recovery shaft (40101) installed at the output end of the driving motor (40103); a membrane paper fixing clamp (40102) connected to the membrane paper recovery shaft (40101) fixes the membrane head of the waste membrane paper; the driving motor (40103) drives the membrane paper recovery shaft (40101) to recover the remaining waste membrane paper after the membrane has been applied; It also includes a rotary damper (40109), which is synchronously driven with the film paper recovery shaft (40101) through a damper synchronous belt (40107) to suppress the free rotation of the film paper recovery shaft (40101) in the absence of driving force.

9. A novel semiconductor wafer post-filming centering calibration mechanism as claimed in claim 8, characterized in that: The film paper recovery device (4) further comprises a bottom film conveying device (402) for pulling back the discarded film paper on which the film has been pasted; The bottom film conveying device (402) comprises a film-drawing roller (40201), a film-paper conveying driven shaft (40202), a film-paper conveying cylinder (40204), and a driving motor (40205). The driving motor (40205) drives the film-drawing roller (40201) to rotate, and the film-paper conveying cylinder (40204) drives the film-paper conveying driven shaft (40202) to abut against the film-drawing roller (40201).

10. A calibration method for a novel semiconductor wafer post-film attachment centering calibration mechanism as claimed in claim 1, comprising the following steps: S1. Load the film paper raw material reel onto the film paper fixing shaft (10101), with the inner side of the film paper raw material reel close to the film paper reel installation base (10103), and turn on the vacuum generator (10102) to make the air nozzle generate negative pressure to adsorb and fix the film paper raw material reel. S2. The controller sends a signal, and the output shaft of the film paper supply motor (10104) starts to rotate according to the set direction, speed and other parameters according to the command, driving the active synchronous wheel (10105) coaxially connected thereto, thereby driving the matching synchronous belt (10106) and the driven synchronous wheel (10107), thereby transmitting the output of the film paper supply motor (10104) to the film paper fixing shaft (10101), and the fixed film paper raw material reel starts to rotate according to the setting to start supplying film paper. S3. The raw film paper supplied by the film paper supply device (101) is transported to the film paper pre-cutting device (103), and the film paper passes between the pre-cutting hob (10301) and the pre-cutting roller (10302). The bolts on both sides are adjusted to control the height of the mounting seat of the pre-cutting roller (10302) so that the pressure between the pre-cutting hob (10301) and the pre-cutting roller (10302) reaches an appropriate size. S4, the driving motor (103104) starts to rotate in the set direction and speed according to the controller instructions, driving the coupling (10305) coaxially fixedly connected thereto, and then driving the pre-cutting hob (10301) and the pre-cutting roller (10302) to actively press the film paper roll between the two to the subsequent process to complete the pre-cutting. S5. The pre-cut membrane paper is transported to the membrane paper pre-guiding device (104). Guided by the pre-guiding device, the membrane paper is transported to the membrane paper conveying device (201), thereby fixing the membrane paper. The driving motor (20105) rotates in the set direction, speed and other layers under the command of the controller, thereby driving the coupling (20106) and the membrane paper conveying roller (20101) coaxially fixed thereto to convey the membrane paper to the next process link. S6. The film paper transported by the film paper transporting device (201) and guided by the film paper guiding device (202) is transported to the film pasting platform (301). The visual system fill light device (503) moves from left to right and stays directly below the visual inspection device (501). The visual inspection device (501) performs visual inspection on the pre-cut film paper. Light passes through the film paper from below the pre-cut film paper to increase the contrast of the knife mark on the film paper, making it easier for the visual inspection device (501) to capture features during inspection and compare the pre-cut knife mark on the film paper with the preset wafer position. S7, the difference is fine-tuned by the concentricity calibration device (502), specifically, in the X direction, the output of the X direction motor (50212) is converted into linear motion by the X direction ball screw (50210), and guided by the X direction linear guide (50209), so that the X and Y direction substrates (50208) move linearly in the X direction, and the Z direction substrate (50203) connected by the cylindrical guide (50204) moves, and finally the wafer fixing plate (50202) together with the Z direction substrate (50203) is controlled to move linearly in the X direction according to the determination result; In the Y direction, the controller compares the difference between the shooting result and the preset position, drives the Y direction motor (50222) according to the set parameters, and rotates in the specified direction and speed according to the comparison difference, drives the Y direction motor synchronous wheel (50218) coaxially fixedly connected thereto, drives the Y direction synchronous belt (50220) and the Y direction driven wheel (50219) matched thereto, thereby driving the Y direction ball screw (50221) coaxially connected to the Y direction driven wheel (50219) to rotate, and the Y direction ball screw (50221) is driven by the Y direction ball screw (50221) 221) converting the output of the Y-direction motor (50222) into linear motion, guiding the Y-direction linear guide (50213) and the Y-direction cylindrical guide (50207), so that the Z-direction lower substrate (50206) moves linearly in the Y-direction, thereby driving the Z-direction substrate (50203) connected by the cylindrical guide (50204) to move, and finally controlling the wafer fixing plate (50202) together with the Z-direction substrate (50203) to move linearly in the Y-direction according to the determination result; S8. After fine-tuning the positions in the X and Y directions, the concentricity of the wafer and the pre-cut film paper is adjusted, and the visual system fill light device (503) returns to the left standby position. In the Z direction, after fine-tuning the positions in the X and Y directions, the centerness of the wafer and the pre-cut film paper is calibrated, and the Z-direction motor (50217) drives the Z-direction motor synchronous wheel (50215) coaxially fixedly connected thereto to rotate according to the controller instruction, driving the coordinated Z-direction synchronous belt (50216) and the Z-direction driven wheel (50214) to rotate synchronously, thereby driving the Z-direction ball screw (50205) coaxially fixedly connected to the Z-direction driven wheel (50214) to rotate, and the Z-direction lower substrate (50206) is connected to the Z-direction ball screw (50205), so that the Z-direction The ball screw (50205) converts the output of the Z-direction motor (50217) into a linear motion in the Z direction, and under the guidance of the cylindrical guide rail (50204), drives the lower substrate (50206) in the Z direction to move linearly upward in the Z direction, drives the upper substrate (50203) in the Z direction connected to the cylindrical guide rail (50204) to move linearly upward in the Z direction, and finally drives the wafer fixing plate (50202) fixed on the substrate (50203) in the Z direction to move upward with the wafer to the film laminating platform (301), and the wafer is combined with the film paper adhesive layer to complete the wafer laminating process; the wafer that has completed the laminating process is moved downward in the Z direction to a set position by the concentricity calibration device (502), and then the wafer robot completes the unloading process of the wafer that has completed the laminating process. S9, the remaining film paper that has been film-laminated is transported to the film paper recycling mechanism for automatic recycling of the waste film paper, the bottom film conveying device (402) pulls the waste film paper back from the film-laminated platform (301), and the waste film paper is clamped between the film-pulling roller (40201) and the film-pulling driven shaft (40202), the piston rod of the film-pulling cylinder (40204) pushes out to press the film-pulling driven shaft (40202) and the film-pulling roller (40201) connected thereto, and at the same time, the film paper is fixed by the friction force of the silicone rubber on the surface of the two shafts, the driving motor (40205) rotates according to the set parameters according to the controller instruction, drives the output synchronous wheel (40206) coaxially fixedly connected thereto to rotate, drives the driven synchronous wheel (40208) and the synchronous belt (40207) matched with the output synchronous wheel (40206), and drives the driving motor (402 05) is transmitted to the film-drawing roller (40201) coaxially fixedly connected to the driven synchronous wheel (40208), thereby driving the waste film paper to be transported to the subsequent process; after passing through the limiting guidance of the two bottom film guide devices (403), the waste film paper is transported to the film paper recovery mechanism (401), and the film head of the waste film paper is clamped by the waste film paper fixing clamp (40102) and fixed on the film paper recovery shaft (40101), and the driving motor (40103) rotates according to the setting, driving the output synchronous wheel (40104) coaxially fixedly connected thereto to rotate synchronously, thereby driving the driven synchronous wheel (40106) and the output synchronous belt (40105) matched with 0104 (output synchronous wheel), and transmitting the output of the driving motor (40103) to the film paper recovery shaft (40101), so that it rotates according to the setting, and the waste film paper is wound up and automatically recovered.

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