Wafer clamping device of single wafer cleaning equipment

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a wafer clamping device of single wafer cleaning equipment. The clamping assembly is arranged on the cleaning platform; the clamping assembly comprises a plurality of movable pins rotationally arranged on the cleaning platform, clamps arranged at the top ends of the movable pins and rotating magnets fixedly arranged on the movable pins. The rotating magnet is arranged on the cleaning platform, the fixed magnet is fixedly arranged on the cleaning platform and is opposite to the rotating magnet, the lifting magnet is arranged below the cleaning platform and is corresponding to the rotating magnet, and the rotating magnet rotates in different rotating directions by changing the resultant force of all magnetic forces on the rotating magnet. Therefore, the wafer is fixed and released by the clamp.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning, and in particular to a wafer clamping device for single-wafer cleaning equipment. Background Art

[0002] Before cleaning the wafer, the wafer needs to be placed on a cleaning platform, and during cleaning, the wafer on the rotating cleaning platform is cleaned by a cleaning liquid. During this process, the wafer needs to be fixed on the cleaning platform.

[0003] The existing method is to place the wafer on the cleaning platform and then set multiple claws to move until they are fixed, so that the wafer is limited between the multiple claws. However, in this method, there may be a gap between the claws and the wafer. When the wafer rotates with the cleaning platform and the rotation speed is high, there is a risk that the wafer will be partially subjected to excessive force and cause fragmentation. Summary of the invention

[0004] Therefore, the present invention aims to overcome the technical problems that need to be solved in the prior art, thereby providing a wafer clamping device for a single-wafer cleaning equipment.

[0005] The present invention provides a wafer clamping device for a single-wafer cleaning device, comprising:

[0006] Cleaning platform;

[0007] A clamping assembly is arranged on the cleaning platform, and the clamping assembly includes a plurality of movable pins rotatably arranged on the cleaning platform, a clamp arranged on the top of the movable pin, a rotating magnet fixedly arranged on the movable pin, a fixed magnet fixedly arranged on the cleaning platform and arranged opposite to the rotating magnet, and a lifting magnet arranged below the cleaning platform and corresponding to the rotating magnet;

[0008] Among them, the lifting magnet has a high position state and a low position state. When the lifting magnet is in the high position state, the magnetic force of the lifting magnet on the rotating magnet is greater than the magnetic force of the fixed magnet on the rotating magnet, and the rotating magnet drives the movable pin to rotate in a first direction, so that the clamp is separated from the wafer; when the lifting magnet is in the low position state, the magnetic force of the lifting magnet on the rotating magnet is less than the magnetic force of the fixed magnet on the rotating magnet, and the rotating magnet drives the movable pin to rotate in a second direction, so that the wafer is set on the clamp, and the first direction and the second direction are opposite.

[0009] Furthermore, the cleaning platform is arranged horizontally.

[0010] Furthermore, the cleaning platform is provided with a plurality of vertical holes, the movable pins are rotatably arranged in the vertical holes, and the vertical holes correspond to the movable pins one by one, and the top ends of the movable pins extend above the cleaning platform.

[0011] Furthermore, the rotating magnet is arranged at an inner side of the bottom end of the movable pin, and the fixed magnet corresponds to the rotating magnet one by one.

[0012] Furthermore, the fixture comprises:

[0013] A boss is arranged at the top of the movable pin, the projection of the boss to the top of the movable pin is located inside the top of the movable pin, and there is a gap between the boss and the edge of the movable pin for supporting the wafer;

[0014] A fixing claw, arranged on the side wall of the boss and located at the top end of the boss;

[0015] When clamping the wafer, the fixed claw follows the movable pin and rotates until the wafer is located between the top of the movable pin and the fixed claw;

[0016] The wafer is released, and the fixed claw follows the movable pin to rotate until the fixed claw leaves the top of the wafer.

[0017] Furthermore, the boss is an eccentric structure;

[0018] When the wafer is clamped, the boss follows the movable pin and rotates until the side wall of the boss abuts against the side wall of the wafer;

[0019] The wafer is released, and the boss follows the movable pin to rotate until the boss is separated from the wafer.

[0020] Furthermore, a limiter assembly is also included, including:

[0021] A guide groove provided on the side wall of the movable pin and a positioning pin provided on the cleaning platform;

[0022] or, a positioning pin provided on the side wall of the movable pin and a fixed guide groove provided on the cleaning platform;

[0023] Wherein, the positioning pin is inserted into the guide groove, and the guide groove is arranged between the fixed magnet and the lifting magnet.

[0024] Further, a pick-and-place assembly is included, including:

[0025] There are a plurality of lifting pins, which are arranged on the cleaning platform and are suitable for lifting relative to the cleaning platform;

[0026] When the lifting pin is at the highest stroke, the top of the lifting pin is higher than the top of the boss; when the lifting pin is at the lowest stroke, the top of the lifting pin is lower than the top of the movable pin.

[0027] Furthermore, the pick-and-place assembly further includes:

[0028] A return spring is connected and arranged between the lifting pin and the cleaning platform, and is sleeved on the lifting pin.

[0029] Furthermore, the movable pins are evenly distributed at the edge of the cleaning platform.

[0030] The technical solution of the present invention has the following advantages:

[0031] The present invention provides a wafer clamping device for a single-wafer cleaning device, which enables the rotating magnet to rotate in different directions by changing the combined force of all magnetic forces on the rotating magnet, so that the clamp can fix and release the wafer.

[0032] The present invention provides a wafer clamping device for a single-wafer cleaning device, wherein the cleaning platform is arranged horizontally, so that the wafer can be conveniently placed and fixed.

[0033] The present invention provides a wafer clamping device for a single-wafer cleaning device, wherein a vertical hole can limit the rotation of a movable pin, so that the rotation axis of the movable pin is parallel to the rotation axis of the cleaning platform.

[0034] The present invention provides a wafer clamping device for a single-wafer cleaning device. When clamping the wafer, the fixed claws can limit the wafer in a direction perpendicular to the cleaning platform.

[0035] The present invention provides a wafer clamping device for single-wafer cleaning equipment. When clamping the wafer, the boss can limit the wafer in the horizontal direction.

[0036] The present invention provides a wafer clamping device for a single-wafer cleaning device, wherein a guide groove and a positioning pin can limit the rotation range of a movable pin, so that the clamp can swing back within a certain range.

[0037] The present invention provides a wafer clamping device for a single-wafer cleaning device. When the lifting pins are at the highest stroke, the wafer can be placed on the lifting pins. As the lifting pins descend, the wafer can be placed on the top of the movable pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 It is a schematic diagram of the structure of the present invention;

[0040] Figure 2 This is a schematic diagram of the structure of the clamping assembly of the present invention;

[0041] Figure 3 This is a comparison diagram of the magnetic forces among the rotating magnet, the fixed magnet and the lifting magnet of the present invention.

[0042] Description of reference numerals;

[0043] 1. Cleaning platform; 2. Movable pin; 3. Rotating magnet; 4. Fixed magnet; 5. Lifting magnet; 6. Wafer; 7. Boss; 8. Fixed claw; 11. Lifting pin. DETAILED DESCRIPTION

[0044] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0048] Example

[0049] like Figures 1 to 3 A specific implementation of a wafer clamping device for a single-wafer cleaning device is shown, and the wafer clamping device for a single-wafer cleaning device comprises:

[0050] A cleaning platform 1, wherein the cleaning platform 1 remains stationary when the wafer 6 is placed and taken, and rotates around its center position when cleaning, the cleaning platform 1 may be disc-shaped, and the rotation of the cleaning platform 1 may be driven by a motor, or by a motor and a transmission shaft disposed on the motor, wherein the transmission shaft is connected to the center position of the cleaning platform 1;

[0051] A clamping assembly is arranged on the cleaning platform 1, and the clamping assembly includes a plurality of movable pins 2 rotatably arranged on the cleaning platform 1, a clamp arranged at the top of the movable pin 2, a rotating magnet 3 fixedly arranged on the movable pin 2, a fixed magnet 4 fixedly arranged on the cleaning platform 1 and arranged opposite to the rotating magnet 3, and a lifting magnet 5 arranged below the cleaning platform 1 and corresponding to the rotating magnet 3; the movable pin 2 is distributed on the cleaning platform 1 with the center position of the cleaning platform 1 as the center, so that the movable pin 2 can be located at the edge position of the wafer 6. The lifting magnet 5 can be lifted and lowered by a telescopic cylinder, and a support plate can be arranged at the bottom end of the lifting magnet 5. The lifting magnet 5 can be an integral ring, concentric with the cleaning platform 1, or a multi-point independent magnet corresponding to the movable pin 2 one by one. The present application can also include a controller for controlling the motor driving the cleaning platform 1 to rotate, so that the lifting magnet 5 is just opposite to the rotating magnet 3 every time the cleaning platform 1 stops rotating. The lifting magnet 5 may not rotate with the cleaning platform 1.

[0052] Among them, the lifting magnet 5 has a high position state and a low position state. When the lifting magnet 5 is in the high position state, the magnetic force of the lifting magnet 5 on the rotating magnet 3 is greater than the magnetic force of the fixed magnet 4 on the rotating magnet 3, and the rotating magnet 3 drives the movable pin 2 to rotate in the first direction, so that the clamp is separated from the wafer 6; when the lifting magnet 5 is in the low position state, the magnetic force of the lifting magnet 5 on the rotating magnet 3 is less than the magnetic force of the fixed magnet 4 on the rotating magnet 3, and the rotating magnet 3 drives the movable pin 2 to rotate in the second direction, so that the wafer 6 is set on the clamp, and the first direction and the second direction are opposite.

[0053] When the lifting magnet 5 is in a high position, the lifting magnet 5 is close to the rotating magnet 3; when the lifting magnet 5 is in a low position, the lifting magnet 5 is away from the rotating magnet 3, so that the magnetic force of the lifting magnet 5 on the rotating magnet 3 changes. When the wafer 6 is fixed, the clamp fixes the wafer 6 on the cleaning platform 1 through magnetic force, so that there is no gap between the clamp and the wafer 6 to avoid breakage.

[0054] It should be noted that the fixed magnet 4 and the lifting magnet 5 can be respectively arranged on both sides of the rotating magnet 3, the lifting magnet 5 can be arranged on the side of the rotating magnet 3 close to the center position of the cleaning platform 1, and the fixed magnet 4 can be arranged on the side of the rotating magnet 3 away from the lifting magnet 5, and the fixed magnet 4 can be offset relative to the rotating magnet 3.

[0055] Figure 3 This is a comparison diagram of the magnetic forces among the rotating magnet, the fixed magnet and the lifting magnet of the present invention. Figure 3 In the embodiment, when there is no lifting magnet, the fixed magnet causes the rotating magnet to rotate in a first direction. When there is a lifting magnet, the magnetic force between the lifting magnet and the rotating magnet is greater than the magnetic force between the fixed magnet and the rotating magnet, and the lifting magnet causes the rotating magnet to rotate in a second direction.

[0056] The controller can also control the telescopic cylinder so that before cleaning, the lifting magnet 5 reaches a high position, suitable for placing the wafer 6 on the top of the movable pin 2; when cleaning starts, the lifting magnet 5 reaches a low position, and the clamp fixes the wafer 6; after cleaning is completed, the lifting magnet 5 reaches a high position, suitable for taking away the wafer 6.

[0057] The clamp may be a U-shaped claw with an opening and a horizontal arrangement. When the wafer 6 is fixed, the U-shaped claw rotates so that the wafer 6 is clamped on the inner side of the U-shaped claw, and the circumferential surface of the wafer 6 abuts against the bottom end of the U-shaped claw.

[0058] By changing the combined force of all magnetic forces on the rotating magnet 3 , the rotating magnet 3 is rotated in different directions, so that the clamp can fix and release the wafer 6 .

[0059] Furthermore, the cleaning platform 1 is horizontally arranged, so that the wafer 6 can be conveniently placed and fixed.

[0060] Furthermore, the cleaning platform 1 is provided with a plurality of vertical holes, in which the movable pins 2 are rotatably arranged, and the vertical holes correspond to the movable pins 2 one by one, and the top of the movable pins 2 extends above the cleaning platform 1. The vertical holes can limit the rotation of the movable pins 2, so that the rotation axis of the movable pins 2 is parallel to the rotation axis of the cleaning platform 1. The positioning pins can be rotatably arranged in the vertical holes through bearings.

[0061] Furthermore, the rotating magnet 3 is arranged at the inner side of the bottom end of the movable pin 2, and the fixed magnet 4 corresponds to the rotating magnet 3. The center of gravity and the acting force are biased downward, so that the rotation of the movable pin 2 can be more stable.

[0062] Furthermore, the fixture comprises:

[0063] The boss 7 is arranged at the top of the movable pin 2, and the projection of the boss 7 to the top of the movable pin 2 is located on the inner side of the top of the movable pin 2, and there is a gap between the boss 7 and the edge of the movable pin 2 for supporting the wafer 6; when the wafer 6 is set on the cleaning platform 1, the edge of the wafer 6 is located on the plane at the edge of the boss 7 on each movable pin 2.

[0064] The fixing claw 8 is arranged on the side wall of the boss 7 and is located at the top of the boss 7. The fixing claw 8 can be regarded as a three-dimensional structure, which can be a cylinder, a cuboid, or other irregular structures. The present embodiment is not limited thereto.

[0065] When the wafer 6 is clamped, the fixed claw 8 rotates along with the movable pin 2 until the wafer 6 is located between the top of the movable pin 2 and the fixed claw 8;

[0066] The wafer 6 is released, and the fixing claw 8 follows the movable pin 2 to rotate until the fixing claw 8 leaves the top of the wafer 6 .

[0067] When the wafer 6 is clamped, the fixing claws 8 can limit the position of the wafer 6 in a direction perpendicular to the cleaning platform 1 .

[0068] Furthermore, the boss 7 is an eccentric structure;

[0069] When the wafer 6 is clamped, the boss 7 follows the movable pin 2 and rotates until the side wall of the boss 7 abuts against the side wall of the wafer 6;

[0070] The wafer 6 is released, and the boss 7 follows the movable pin 2 to rotate until the boss 7 is separated from the wafer 6 .

[0071] When the wafer 6 is clamped, the boss 7 can limit the wafer 6 in the horizontal direction.

[0072] Furthermore, a limiter assembly is also included, including:

[0073] A guide groove provided on the side wall of the movable pin 2 and a positioning pin provided on the cleaning platform 1;

[0074] Or, a positioning pin provided on the side wall of the movable pin 2 and a fixed guide groove provided on the cleaning platform 1;

[0075] The positioning pin is inserted into the guide groove, and the guide groove is arranged between the fixed magnet 4 and the lifting magnet 5.

[0076] The guide groove is opened along the circumferential direction of the side wall of the movable pin 2.

[0077] The guide groove and the positioning pin can limit the rotation range of the movable pin 2, so that the clamp can swing back within a certain range.

[0078] Further, a pick-and-place assembly is included, including:

[0079] There are a plurality of lifting pins 11, which are arranged on the cleaning platform 1 and are suitable for lifting relative to the cleaning platform 1;

[0080] When the lifting pin 11 is at the highest stroke, the top of the lifting pin 11 is higher than the top of the boss 7 ; when the lifting pin 11 is at the lowest stroke, the top of the lifting pin 11 is lower than the top of the movable pin 2 .

[0081] The lifting pin 11 can also be driven by a telescopic cylinder. The difference is that the lifting pin 11 is arranged on the cleaning platform 1, and the telescopic cylinder driving the lifting pin 11 should be connected to the cleaning platform 1 and rotate with the cleaning platform 1.

[0082] When the lifting pins 11 are at their highest stroke, the wafer 6 can be placed on the lifting pins 11 . As the lifting pins 11 descend, the wafer 6 can be placed on the top of the movable pins 2 .

[0083] Furthermore, the pick-and-place assembly further includes:

[0084] The return spring is connected between the lifting pin 11 and the cleaning platform 1, and is sleeved on the lifting pin 11. It should be noted that the telescopic cylinder driving the lifting pin 11 may not be connected to the lifting pin 11, that is, the telescopic cylinder can lift the lifting pin 11, and when the telescopic cylinder is retracted, the lowering of the lifting pin 11 can rely on its own gravity and the action of the return spring.

[0085] Furthermore, the movable pins 2 are evenly distributed at the edge of the cleaning platform 1, so that the force on the wafer 6 is relatively uniform.

[0086] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A wafer clamping device for a single-wafer cleaning device, characterized in that: include: Cleaning platform (1); A gripping assembly is arranged on the cleaning platform (1), the gripping assembly comprising a plurality of movable pins (2) rotatably arranged on the cleaning platform (1), a clamp arranged at the top of the movable pin (2), a rotating magnet (3) fixedly arranged on the movable pin (2), a fixed magnet (4) fixedly arranged on the cleaning platform (1) and arranged opposite to the rotating magnet (3), and a lifting magnet (5) arranged below the cleaning platform (1) and corresponding to the rotating magnet (3); The lifting magnet (5) has a high position state and a low position state. When the lifting magnet (5) is in the high position state, the magnetic force of the lifting magnet (5) on the rotating magnet (3) is greater than the magnetic force of the fixed magnet (4) on the rotating magnet (3), and the rotating magnet (3) drives the movable pin (2) to rotate in a first direction, so that the clamp is separated from the wafer (6); when the lifting magnet (5) is in the low position state, the magnetic force of the lifting magnet (5) on the rotating magnet (3) is less than the magnetic force of the fixed magnet (4) on the rotating magnet (3), and the rotating magnet (3) drives the movable pin (2) to rotate in a second direction, so that the wafer (6) is set on the clamp, and the first direction and the second direction are opposite.

2. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: The cleaning platform (1) is arranged horizontally.

3. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: The cleaning platform (1) is provided with a plurality of vertical holes, the movable pins (2) are rotatably arranged in the vertical holes, and the vertical holes correspond to the movable pins (2) one by one, and the top ends of the movable pins (2) extend above the cleaning platform (1).

4. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: The rotating magnet (3) is arranged at the inner side of the bottom end of the movable pin (2), and the fixed magnet (4) corresponds to the rotating magnet (3) one by one.

5. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: The fixture comprises: a boss (7) disposed at the top end of the movable pin (2); a projection of the boss (7) onto the top end of the movable pin (2) being located inside the top end of the movable pin (2); and a gap for supporting the wafer (6) is provided between the boss (7) and the edge of the movable pin (2); A fixing claw (8) is arranged on the side wall of the boss (7) and is located at the top end of the boss (7); When the wafer (6) is clamped, the fixed claw (8) rotates along with the movable pin (2) until the wafer (6) is located between the top of the movable pin (2) and the fixed claw (8); The wafer (6) is released, and the fixed claw (8) rotates along with the movable pin (2) until the fixed claw (8) leaves the position just above the wafer (6).

6. The wafer clamping device for single-wafer cleaning equipment according to claim 5, characterized in that: The boss (7) is an eccentric structure; When the wafer (6) is clamped, the boss (7) follows the movable pin (2) and rotates until the side wall of the boss (7) abuts against the side wall of the wafer (6); The wafer (6) is released, and the boss (7) follows the movable pin (2) to rotate until the boss (7) is separated from the wafer (6).

7. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: Also includes limiter components, including: A guide groove arranged on the side wall of the movable pin (2) and a positioning pin arranged on the cleaning platform (1); Or, a positioning pin provided on the side wall of the movable pin (2) and a fixed guide groove provided on the cleaning platform (1); Wherein, the positioning pin is inserted into the guide groove, and the guide groove is arranged between the fixed magnet (4) and the lifting magnet (5).

8. The wafer clamping device for single-wafer cleaning equipment according to claim 5, characterized in that: Also included are pick and place components, including: A plurality of lifting pins (11) are disposed on the cleaning platform (1) and are suitable for lifting relative to the cleaning platform (1); When the lifting pin (11) is at its highest stroke, the top of the lifting pin (11) is higher than the top of the boss (7); when the lifting pin (11) is at its lowest stroke, the top of the lifting pin (11) is lower than the top of the movable pin (2).

9. The wafer clamping device for single-wafer cleaning equipment according to claim 8, characterized in that: The pick-and-place assembly also includes: A return spring is connected between the lifting pin (11) and the cleaning platform (1), and is sleeved on the lifting pin (11).

10. The wafer clamping device for single-wafer cleaning equipment according to claim 1, characterized in that: The movable pins (2) are evenly distributed at the edge of the cleaning platform (1).

Images