Ultra-wideband low-profile multi-beam active phased-array antenna

Abstract

The invention discloses an ultra-wide-band low-profile multi-beam active phased-array antenna which comprises an ultra-wide-band array antenna, a radio frequency multifunctional board and a comprehensive control board. The antenna array surface of the ultra-wideband array antenna adopts a low-profile structure, and the radio frequency multifunctional board is integrated with a plurality of multifunctional active IP cores; the radio frequency multifunctional board, the comprehensive control board and the heat conduction reinforcing board are arranged in the box body, the ultra wide band array antenna is arranged at the top of the box body, an external connector is arranged on the outer side of the box body, the ultra wide band array antenna is connected with the radio frequency multifunctional board through a radio frequency KK connector, and the radio frequency multifunctional board is connected with the comprehensive control board. The ultra-wideband, low-profile and lightweight active phased array structure with the working bandwidth exceeding five octaves and the number of instantaneously formed beams not less than four is realized.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to an ultra-wideband low-profile multi-beam active phased array antenna. Background Art

[0002] Phased array antennas are composed of multiple coherently fed antenna units. By adjusting the phase or delay of each antenna unit, a collimated radiation beam can be formed at a given angle in space. Active phased array antennas are widely used in radar and communication systems because of their ability to quickly switch beams, cover a large area of ​​space, and track and monitor multiple targets simultaneously.

[0003] Active phased array antennas can be divided into two structures: "brick" and "tile" according to the integrated architecture. Limited by the material and process manufacturing level, the various active components of the "brick-type" active phased array antenna are large in size and low in integration; to avoid the appearance of grating lobes when the phased array scans at a large angle, the antenna unit spacing is generally set to half the wavelength of the highest operating frequency; because there is not enough space for the various active components to be arranged in the plane parallel to the aperture of the phased array antenna, they can only be stacked vertically, and cables are mostly used to interconnect the components; therefore, the "brick-type" antenna array has a high profile height after assembly and a heavy overall weight. With the development of materials and the improvement of process level, the antenna array architecture has transitioned to a "tile-type" architecture. Compared with the "brick-type" antenna array, the component integration in the "tile-type" antenna array is further improved and the size is smaller. Therefore, the cross-sectional height of the antenna array is reduced and the weight is further reduced; but the "tile-type" phased array is still designed based on a modular concept. The antenna array surface, T / R components, beamforming network, beam control and power supply are all separate modules. The modules are electrically connected through vertical interconnection or various connectors, and each module has a high degree of independence; the existing "tile-type" active phased array antenna architecture is mainly used in narrowband and single-beam applications. When ultra-wideband and multiple independent beams are required, the amount of component equipment will increase exponentially, and the space in the direction parallel to the phased array antenna aperture is difficult to meet the "tile-type" architecture layout, so it has to be stacked vertically, and the cross-sectional size and weight are also significantly increased.

[0004] The use of multiple connectors in "brick" or "tile" active phased array antennas will, on the one hand, bring about large insertion losses and cause energy loss; on the other hand, the electrical interconnection achieved by the connectors also restricts the stability and reliability of the system and increases the probability of failure. Flat-panel phased arrays use a large number of high-density integrated chips, which significantly reduces the length of electrical connections and can effectively reduce the size of the phased array in both the horizontal and vertical dimensions. For example, patent CN110380231B discloses a flat active phased array antenna for meteorological radar, which vertically stacks and interconnects microstrip radiation arrays, temperature averaging boards, T / R component arrays, and backplanes, thereby reducing the cross-sectional dimensions of the phased array; patent CN107425280B introduces a millimeter-wave flat phased array antenna structure, which integrates multiple functional components such as antenna arrays, RF transceiver modules, wave control, power supplies, and channel processing inside the antenna shell, thereby reducing the overall thickness of the phased array; patent CN112448172B introduces a surface-mounted flat active phased array antenna system architecture, which uses system-level packaging (SIP) technology to reduce the cross-sectional height of the phased array. However, the above-mentioned existing low-profile phased array antenna technology has a narrow working bandwidth and can only form a single beam instantaneously. Summary of the invention

[0005] To solve the above problems, the present invention provides an ultra-wideband, low-profile, multi-beam active phased array antenna, which adopts a flat-panel phased array architecture. The ultra-wideband antenna array, a radio frequency multi-function board, an integrated control board and other components are vertically stacked. Its operating bandwidth exceeds 5 times the frequency band, and the number of beams formed instantaneously is not less than 4, realizing an ultra-wideband, low-profile and lightweight design.

[0006] The present invention provides an ultra-wideband low-profile multi-beam active phased array antenna, and the specific technical solution is as follows:

[0007] Including ultra-wideband array antenna, radio frequency multi-function board and integrated control board;

[0008] The antenna array of the ultra-wideband array antenna adopts a low-profile structure, and the radio frequency multi-function board integrates a number of multi-function active IP cores;

[0009] The RF multi-function board, integrated control board and thermal conductive reinforcement board are arranged in a box body, the ultra-wideband array antenna is arranged on the top of the box body, an external connector is provided on the outside of the box body, the ultra-wideband array antenna is connected to the RF multi-function board through a RF KK connector, and the RF multi-function board is connected to the integrated control board.

[0010] Furthermore, the antenna array of the ultra-wideband array antenna is composed of a 12*12 dual-polarized antenna, the antenna adopts a tightly coupled balanced toe-slot line antenna, and the operating frequency band of the ultra-wideband array antenna is not less than 5 times the bandwidth.

[0011] Furthermore, the cross-sectional size of the antenna array surface of the ultra-wideband array antenna is less than 0.11 times the maximum wavelength.

[0012] Furthermore, the integrated control board is arranged below the radio frequency multifunctional board, and a heat conductive reinforcement plate is also arranged between the radio frequency multifunctional board and the integrated control board.

[0013] Furthermore, the box body is made of magnesium-aluminum alloy material, and the exterior of the box body is coated with a heat control radiation layer.

[0014] Furthermore, a detachably connected rear cover is provided at the bottom of the box body, and the rear cover encapsulates the radio frequency multi-function board and the integrated control board in the box body.

[0015] Furthermore, the ultra-wideband array antenna is mounted on the top of the box body by pins and screws.

[0016] Furthermore, the ultra-wideband array antenna and the radio frequency multi-function board are interconnected in a one-to-one blind plug manner via a radio frequency KK connector.

[0017] Furthermore, the external connector includes an external RF connector, and four external RF connectors are provided.

[0018] Furthermore, the integrated control board controls the instantaneous formation of four independent output beams, and outputs them accordingly through the external RF connector.

[0019] The beneficial effects of the present invention are as follows:

[0020] The present invention adopts a flat-plate phased array architecture, and vertically stacks an ultra-wideband antenna array, a radio frequency multifunctional board, and an integrated control board. The antenna array adopts a low-profile structure, and the antenna array is a 12*12 dual-polarized antenna. The antenna adopts a tightly coupled balanced toe-slot line antenna, thereby achieving an ultra-wideband, low-profile, and lightweight structure with a working bandwidth exceeding 5 times the frequency band and a number of beams formed instantaneously greater than 4. The multifunctional component is chip-encapsulated in an IP core, and a radio frequency multifunctional board is formed by secondary integration using BGA solder balls and a multifunctional PCB substrate. The box body is made of magnesium-aluminum alloy material, which greatly reduces the weight, power consumption, and volume of the phased array. A heat conductive reinforcement plate is also provided between the radio frequency function board and the integrated control board, so that the heat generated by the active devices in the multifunctional radio frequency board is efficiently exported to the end face of the heat sink, thereby providing an efficient heat dissipation path for the active components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the phased array antenna of the present invention.

[0022] Figure 2 It is a schematic diagram of the design structure of the phased array antenna of the present invention.

[0023] Figure 3 It is a schematic diagram of the structure of the phased array antenna of the present invention.

[0024] Explanation of the accompanying drawings: 1-ultra-wideband array antenna, 2-RF KK connector, 3-box body, 4-external connector, 5-multi-function IP core, 6-RF multi-function board, 7-thermal reinforcement board, 8-integrated control board, 9-back cover. DETAILED DESCRIPTION

[0025] The following description clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the description of the embodiments of the present invention, it should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the invention product is usually placed when in use, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship in which the invention product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Example 1

[0029] Embodiment 1 of the present invention discloses an ultra-wideband low-profile multi-beam active phased array antenna, the specific structure of which is as follows:

[0030] like Figure 1 As shown, it includes an ultra-wideband array antenna 1, a radio frequency multifunctional board 6, a thermal conductive reinforcement board 7 and an integrated control board 8;

[0031] The antenna array of the ultra-wideband array antenna 1 adopts a low-profile structure, and the radio frequency multi-function board 6 integrates a number of multi-function active IP cores;

[0032] As a preferred embodiment, the antenna array of the ultra-wideband array antenna 1 is composed of a 12*12 dual-polarized antenna, the antenna adopts a tightly coupled balanced toe-slot line antenna, and the operating frequency band of the ultra-wideband array antenna 1 is not less than 5 times the bandwidth;

[0033] As a preferred embodiment, the cross-sectional size of the antenna array surface of the ultra-wideband array antenna 1 is less than 0.11 times the maximum wavelength;

[0034] Based on this layout structure, the array antenna realizes beam scanning without grating lobes within a wide angle range of ±60°, that is, the phased array has beam agility capability within the ±60°×±60° airspace.

[0035] The radiation sheet is printed and etched on the multi-layer dielectric board to achieve a lightweight design.

[0036] The RF multifunctional board 6 is integrated by a digital-analog hybrid PCB, and a multifunctional active IP core is integrated. Specifically, the multifunctional chip and the electronic components are directly surface mounted on the multifunctional PCB board, and the active multifunctional chip is integrated inside the IP core, which improves the system functional density, reduces the interconnection length, and reduces the types and number of functional devices; the IP core is directly integrated on the digital-analog hybrid multifunctional PCB board, realizing efficient signal interconnection, forming a low-profile, lightweight, ultra-wideband RF multifunctional board 6, reducing the overall cost of the phased array, and improving the reliability of the phased array;

[0037] The radio frequency multifunctional board 6 realizes functions such as low-noise amplification, filtering, multi-beam forming and phase shifting of broadband signals, and also realizes functions such as signal timing management, power management, and health status management and reporting.

[0038] like Figure 2 and Figure 3 As shown, the RF multifunctional board 6, the integrated control board 8 and the thermal conductive reinforcement board 7 are arranged in the box body 3, the ultra-wideband array antenna 1 is installed on the top of the box body 3 by pins and screws, and an external connector 4 is provided on the outside of the box body 3; the ultra-wideband array antenna 1 is at the top of the box body 3.

[0039] Specifically, the ultra-wideband array antenna 1, the radio frequency multi-function board 6, the integrated control board 8 and other components are stacked vertically.

[0040] As a preferred embodiment, the integrated control board 8 is arranged below the RF multifunctional board 6 , mainly realizing functions such as beam control of the phased array. A thermal reinforcement plate 7 is also provided between the RF multifunctional board 6 and the integrated control board 8 .

[0041] The integrated control board 8 mainly receives the working parameter instructions issued by the system and sends them to the RF multi-function board 6 after parsing, and receives the data package reported by the RF multi-function board 6 and forwards it to the system. The integrated control board 8 is a key component for realizing functions such as beam agility and beam forming;

[0042] The thermally conductive reinforcing plate 7 is integrated with the supporting frame of the phased array antenna to realize the support of the phased array structure while providing an efficient heat dissipation path for the active components, and efficiently conducts the heat generated by the active components in the multifunctional RF board to the end surface of the heat sink;

[0043] Specifically, the multifunctional RF IP core has two heat dissipation paths. One is to directly export the heat to the box body 3 upward through the boss, and the second is to export the heat downward through the heat dissipation reinforcement plate to the box body 3. By optimizing the heat conduction path, the rapid export of phased array heat is achieved.

[0044] The ultra-wideband array antenna 1 is connected to the radio frequency multi-function board 6 via a radio frequency KK connector 2 , and the radio frequency multi-function board 6 is connected to the integrated control board 8 .

[0045] Specifically, the ultra-wideband array antenna 1 and the radio frequency multi-function board 6 are interconnected in a one-to-one blind plug manner through a radio frequency KK connector 2 .

[0046] As a preferred embodiment, the external connector 4 includes an external RF connector, and four external RF connectors are provided;

[0047] The integrated control board 8 controls the instantaneous formation of four independent output beams, and outputs them accordingly through the external RF connector.

[0048] As a preferred embodiment, the box body 3 is made of magnesium-aluminum alloy material, which reduces the overall weight of the phased array; the outer surface of the box body 3 is coated with a thermal control radiation layer, and specifically, the thermal radiation coefficient can be increased by spraying thermal control white paint to increase the radiation heat dissipation capacity;

[0049] A detachably connected rear cover plate 9 is provided at the bottom of the box body 3 , and the rear cover plate 9 encapsulates the radio frequency multifunctional board 6 and the integrated control board 8 in the box body 3 .

[0050] The present invention is not limited to the above-mentioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. An ultra-wideband low-profile multi-beam active phased array antenna, characterized in that: Including ultra-wideband array antenna, radio frequency multi-function board and integrated control board; The antenna array of the ultra-wideband array antenna adopts a low-profile structure, and the radio frequency multi-function board integrates a number of multi-function active IP cores; The RF multi-function board, integrated control board and thermal conductive reinforcement board are arranged in a box body, the ultra-wideband array antenna is arranged on the top of the box body, an external connector is provided on the outside of the box body, the ultra-wideband array antenna is connected to the RF multi-function board through a RF KK connector, and the RF multi-function board is connected to the integrated control board.

2. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The antenna array of the ultra-wideband array antenna is composed of a 12*12 dual-polarized antenna, and the antenna adopts a tightly coupled balanced toe-slot line antenna. The operating frequency band of the ultra-wideband array antenna is not less than 5 times the bandwidth.

3. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The cross-sectional size of the antenna array surface of the ultra-wideband array antenna is less than 0.11 times the maximum wavelength.

4. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The integrated control board is arranged below the radio frequency multifunctional board, and a heat conduction reinforcing plate is arranged between the radio frequency multifunctional board and the integrated control board.

5. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The box body is made of magnesium-aluminum alloy material, and the exterior of the box body is coated with a heat control radiation layer.

6. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 5, characterized in that: The bottom of the box body is provided with a detachably connected rear cover plate, and the rear cover plate encapsulates the radio frequency multifunctional board and the integrated control board in the box body.

7. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 6, characterized in that: The ultra-wideband array antenna is mounted on the top of the box body through pins and screws.

8. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The ultra-wideband array antenna and the radio frequency multi-function board are interconnected in a one-to-one blind plug manner via a radio frequency KK connector.

9. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 1, characterized in that: The external connector includes an external radio frequency connector, and four external radio frequency connectors are provided.

10. The ultra-wideband low-profile multi-beam active phased array antenna according to claim 9, characterized in that: The integrated control board controls the instantaneous formation of four independent output beams, and outputs them accordingly through the external RF connector.

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