Isolated power supply chip and power conversion equipment

Abstract

The invention provides an isolated power supply chip and power conversion equipment, the isolated power supply chip comprises a transformer, a transmitting module and a plurality of receiving modules, the transformer, the transmitting module and the plurality of receiving modules are packaged in the same shell, and the transformer comprises a primary side coil and a plurality of secondary side coils; the transmitting module is used for transmitting electric energy provided by a power supply to each secondary side coil through the primary side coil; and each receiving module is used for transmitting the electric energy to a load through the connected secondary coil. According to the invention, multiple paths of output ends satisfying electrical isolation can be provided, the space utilization rate is high, the integration level and applicability of equipment are improved, and the design cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of power electronics technology, and in particular to an isolated power supply chip and a power conversion device. Background Art

[0002] In the field of power electronics technology, a chip with an electrical isolation function (for example, an isolated power chip) is usually required to isolate the electrical connection between the power supply end and the load end. This chip with an electrical isolation function includes a device with an electrical isolation function such as a transformer, which can transmit energy through the primary coil and the secondary coil of the transformer, and can maintain isolation from the load end when the voltage at the power supply end is very high. The inventors of the present application found in the process of research and practice that in the prior art, the isolated voltage chip usually only provides one output end that meets the electrical isolation requirement. When multiple outputs are required, the layout area is large and the space utilization rate is low, which is not conducive to further realizing modular integration. Summary of the invention

[0003] The present application provides an isolated power supply chip and a power conversion device, which can provide multiple output terminals that meet electrical isolation requirements, have high space utilization, improve the integration and applicability of the device, and reduce design costs.

[0004] In a first aspect, the present application provides an isolated power supply chip, which may include a transformer, a transmitting module and a plurality of receiving modules. Here, the transformer, the transmitting module and the plurality of receiving modules are encapsulated in the same housing, and the transformer may include a primary coil and a plurality of secondary coils. Here, the input end of the transmitting module is used to connect to a power supply, the output end of the transmitting module is connected to the primary coil, the input end of each receiving module is respectively connected to a secondary coil, and the output end of each receiving module is used to connect to a load. The transmitting module here can be used to transmit the electric energy provided by the power supply to each secondary coil through the primary coil. Each receiving module here can be used to transmit the electric energy to the load through the connected secondary coil.

[0005] In the present application, the transformer in the isolated power supply chip includes a primary coil and multiple secondary coils. The transmitting module can transfer electric energy to multiple secondary coils through the primary coil in the transformer. The receiving modules corresponding to these secondary coils can respectively receive the electric energy transmitted by the transformer, and then transmit the electric energy to the load in multiple outputs. Here, when multiple secondary coils supply power to the load, the output voltage transmitted to the load can be the same or different, and the output current transmitted to the load can be the same or different. It can be understood that in the isolated power supply chip, due to the electrical isolation between the primary coil and the multiple secondary coils, the isolation capability with the load end can be maintained when the voltage at the power supply end is very high. While meeting the safety power supply requirements, multiple power outputs can be provided to the load respectively to adapt to different application scenarios, and to improve the integration of the chip, save board space, and reduce design costs.

[0006] In combination with the first aspect, in a first possible implementation, the plurality of receiving modules may include at least one feedback receiving module, the isolated power supply chip may further include an isolation module, and the feedback receiving module is connected to the transmitting module through the isolation module. The feedback receiving module here may also be used to generate a feedback signal based on the input current and / or input voltage of the secondary coil connected to the feedback receiving module, and transmit the feedback signal to the transmitting module through the isolation module. The transmitting module here may also be used to adjust the transmitting current and / or transmitting voltage of the primary coil based on the feedback signal. Here, the feedback receiving module in the receiving module may have a feedback function while receiving electric energy. The feedback receiving module here may generate a feedback signal based on input parameters such as the amplitude of the input current and / or the amplitude of the input voltage of the secondary coil connected thereto, and transmit the feedback signal to the transmitting module through the isolation module. Then the transmitting module or other control modules at the electric energy transmitting end may adjust the transmitting parameters such as the transmitting current or transmitting voltage of the primary coil based on the feedback signal. That is to say, the feedback receiving module here may generate a corresponding feedback signal through the input parameters of the secondary coil connected thereto, and then adjust the transmitting parameters of the primary coil based on the feedback signal, which may improve the power supply efficiency and the power supply stability while meeting the safety power supply requirements.

[0007] In combination with the first aspect or the first possible implementation manner of the first aspect, in a second possible implementation manner, the primary coil and the multiple secondary coils of the transformer may be planar coils. Here, the coils in the transformer are planar coils and may be arranged in one plane or multiple planes, which may further improve the integration of the chip, save board space, and reduce design costs.

[0008] In combination with the first aspect or any possible implementation of the first aspect, in a third possible implementation, the primary coil and the multiple secondary coils are arranged on the same plane. Here, when the plane is a circuit board or other plate-type structure with a front and back side, the primary coil and the secondary coil in the transformer can be arranged on the front or back side of the plane, or on the front and back sides of the plane. Here, the multiple secondary coils can be arranged symmetrically with the primary coil as the center, or arranged based on the corresponding coupling coefficient obtained based on the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs.

[0009] In combination with the first aspect or any possible implementation manner of the first aspect, in a fourth possible implementation manner, the primary coil may be arranged on one plane, and multiple secondary coils may be arranged on another plane. In the present application, the primary coil may be arranged on a layer of circuit board or a certain plate-type structure, and multiple secondary coils may be arranged on another layer of circuit board or other plate-type structures. It can be understood that multiple secondary coils may be arranged on the front or back side of the plane where the secondary coil is located, or on the front and back sides of this plane. Here, multiple secondary coils may be arranged symmetrically with the projection of the primary coil as the center, or may be arranged based on the corresponding coupling coefficient obtained based on the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs.

[0010] In combination with the first aspect or any possible implementation of the first aspect, in a fifth possible implementation, the primary coil may be arranged in a plane, one or more of the secondary coils may be arranged in multiple other planes, and each of the multiple other planes may be arranged with one or more secondary coils. That is to say, if the number of secondary coils in the transformer is n, then k of the n secondary coils may be arranged on k layers of circuit boards or k plate structures, respectively, where k is less than or equal to n. When k is less than n, the other nk secondary coils may be arranged on j layers of circuit boards or j layers of plate structures, where any layer of the j layers of circuit boards or j plate structures includes at least two secondary coils. Here, the center point of the secondary coil on the k layers of circuit boards or k plate structures may be arranged to coincide with the center point of the projection of the primary coil, and the secondary coil on the j layers of circuit boards or j plate structures may be arranged symmetrically with the projection of the primary coil as the center, or the corresponding coupling coefficient may be obtained based on the application scenario for arrangement, which may further improve the integration of the chip, save board space, and reduce design costs.

[0011] In combination with the first aspect or any possible implementation manner of the first aspect, in a sixth possible implementation manner, the transformer may further include a magnetic core, which may be arranged around the primary coil and the plurality of secondary coils. Here, the magnetic core is arranged around the primary coil and the secondary coil, which can prevent the magnetic field in the coil from leaking out, thereby further improving the efficiency of power transmission.

[0012] In combination with the first aspect or any possible implementation of the first aspect, in the seventh possible implementation, the magnetic core here can be a magnetic core of an integral structure or a magnetic core composed of a combination of multiple partial structures. Here, the magnetic core can select a corresponding one-piece magnetic core or a magnetic core composed of a combination of multiple partial structures according to different specifications such as the coil size arrangement method. Here, the outer surface of the magnetic core can be a plane or a curved surface, or a combination of a plane and a curved surface, which can be specifically set based on the application scenario to enhance applicability.

[0013] In combination with the first aspect or any possible implementation manner of the first aspect, in an eighth possible implementation manner, the isolation module may include at least one of a transformer, an optical coupling element, or a capacitor. Here, the isolation module may provide electrical isolation between the feedback receiving module and the transmitting module when the feedback receiving module transmits a feedback signal to the transmitting module, thereby ensuring power supply safety.

[0014] In the second aspect, the present application provides a power conversion device, which may include an isolated power supply chip, a drive circuit and a power conversion circuit as in the first aspect or any possible implementation of the first aspect. Here, the output ends of the multiple receiving modules are used to connect the power conversion circuit through the drive circuit, and the output end of the power conversion circuit is used to connect the load. Here, the drive circuit can be used to receive the electric energy provided by the isolated power supply chip and drive the power conversion circuit to perform power conversion. Here, the isolated power supply chip can maintain the isolation capability from the drive circuit when the voltage at the power supply end is very high, and while meeting the safety power supply requirements, it can provide multiple drive voltages to the drive circuit respectively to adapt to different application scenarios and improve the integration of the chip. Then the drive circuit can transmit a corresponding drive signal to the power conversion circuit, so that the power conversion circuit performs a corresponding power conversion on the electric energy and then supplies power to the load. Here, the electric energy received by the power conversion circuit can be the electric energy directly provided by the power supply or the electric energy provided by other functional modules, or it can be the electric energy provided by other power supplies. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of an application scenario of the isolated power supply chip provided in an embodiment of the present application;

[0016] Figure 2 It is a structural schematic diagram of an isolated power supply chip provided in an embodiment of the present application;

[0017] Figure 3 is a structural schematic diagram of a transformer provided in an embodiment of the present application;

[0018] Figure 4 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0019] Figure 5 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0020] Figure 6 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0021] Figure 7 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0022] Figure 8 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0023] Fig. 9 is another structural schematic diagram of a transformer provided in an embodiment of the present application;

[0024] Fig.10 is another structural schematic diagram of the isolated power supply chip provided in an embodiment of the present application;

[0025] Fig.11 It is a structural schematic diagram of a power conversion device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0026] The isolated power supply chip provided in this application can be applied to various application fields such as the field of new energy power generation, the field of peak and frequency regulation of traditional power generation, and the field of power supply for important equipment. The specific application can be determined according to the actual application scenario and is not limited here. The power conversion equipment provided in this application can be applied to different scenarios such as large-scale photovoltaic power stations, industrial and commercial photovoltaic power generation, and household photovoltaic power generation, and is not limited here. The following will take the industrial and commercial power supply environment as an example of the application scenario of the isolated power supply chip, and will not be repeated below.

[0027] See also Figure 1 , Figure 1 Schematic diagram of the application scenario of the isolated power chip provided in the embodiment of the present application. Figure 1As shown, the power supply system includes a power supply 1, an isolated power supply chip 2 and a load 3. Here, the input end of the isolated power supply chip 2 can be used to connect the power supply 1, and the multiple output ends of the isolated power supply can be used to connect the load 3. In some feasible embodiments, the isolated power supply chip 2 can transmit the electric energy provided by the power supply 1 to the load 3 under the condition of satisfying electrical isolation, and convert the output parameters such as the voltage or current of the output electric energy into a size that matches the load 3. Here, the isolated power supply chip 2 may include a transformer 11, a transmitting module TX and multiple receiving modules RX. The transmitting module TX can transmit the electric energy input by the power supply 1 to multiple receiving modules RX such as receiving modules RXa to receiving modules RXn through the transformer 11 under the condition of satisfying electrical isolation. The multiple receiving modules RX such as receiving modules RXa to receiving modules RXn can receive the electric energy output by the transformer, and output the received electric energy in multiple ways to the load 3. It can be understood that the power supply 1 provided in the present application is suitable for powering base station equipment in remote areas where there is no mains electricity or the mains electricity is poor, or for powering household appliances (such as refrigerators, air conditioners, etc.) and other application scenarios for powering various types of electrical equipment. The specific application scenario can be determined according to the actual application scenario and is not limited here. It can be further understood that Figure 1 The load 3 in the figure may include power-consuming devices or power transmission devices such as transmission lines, power transfer stations, communication base stations or household appliances. The load 3 here is just an example of a power-consuming device or power-consuming circuit that can be connected to the output end of the isolated power chip 2. Different receiving modules RX can output power to different ports of a load 3, or they can output power to different loads in the load 3. The specific details can be determined according to the actual application scenario and are not limited here.

[0028] In some application scenarios, the load end may need an isolated power supply chip 2 to provide multiple power outputs to the load end while meeting the requirements of electrical isolation. The output parameters of the multiple output power can be the same or different. For example, on a charging pile of a new energy vehicle, multiple charging guns can be arranged to charge different vehicles respectively, and the output parameters of the power output by different charging guns can be the same or different. For another example, in the power management system within a new energy vehicle, it is usually necessary to provide power with different output voltages or different output currents to functional circuits for detecting vehicle performance and circuits with different functions such as drive circuits for power driving. Traditional chips with isolation functions usually only provide one output terminal that meets the requirements of electrical isolation. When multiple outputs are required, the board area is large and the space utilization rate is low, which is not conducive to further realizing modular integration. In order to solve this problem, the present application provides an isolated power supply chip with multiple outputs. For details, please refer to Figure 2 , Figure 2 Schematic diagram of a structure of an isolated power supply chip provided in an embodiment of the present application. Figure 2As shown, the isolated power chip 2 may include a transformer 11, a transmitting module TX, and multiple receiving modules RX, such as receiving modules RXa to RXn. Here, the transformer 11, the transmitting module TX, and the multiple receiving modules RX are packaged in the same housing, and the transformer 11 may include a primary coil 101 and multiple secondary coils 102, such as secondary coils 102a to 102n, and the multiple secondary coils 102 correspond to the multiple receiving modules RX one by one. Here, the input end of the transmitting module TX can be used to connect the power supply 1, the output end of the transmitting module TX can be connected to the primary coil 101, the output end of each receiving module RX can be used to connect the load 3, and the input end of each receiving module RX can be connected to the secondary coil 102 corresponding to each receiving module RX. The transmitting module TX here can be used to transmit the power provided by the power supply to each secondary coil 102 through the primary coil 101. Each receiving module RX here can be used to transmit power to the load 3 through the connected secondary coil 102, and the specific power transmission direction can be shown as the black arrow in the figure. In some application scenarios, the load end can also transmit information or energy to the isolated power chip 2. The direction of information or power transmission can be as shown by the gray arrow in the figure, which can be determined based on the application scenario and is not limited here.

[0029] In the present application, the transformer 11 in the isolated power supply chip 2 includes a primary coil 101 and a plurality of secondary coils 102 such as secondary coils 102a to 102n. The transmitting module TX can transfer electric energy to the plurality of secondary coils 102 through the primary coil 101 in the transformer 11. The receiving modules RX corresponding to these secondary coils 102 can respectively receive the electric energy transmitted by the transformer 11, and then transmit the electric energy to the load 3 in multiple outputs. Here, when the plurality of secondary coils 102 supply power to the load 3, the output voltage transmitted to the load 3 can be the same or different, and the output current transmitted to the load 3 can be the same or different. It can be understood that in the isolated power supply chip 2, since there is electrical isolation between the primary coil 101 and the plurality of secondary coils 102, the isolation capability with the load end can be maintained when the voltage at the power supply end is very high, and while meeting the safety power supply requirements, multiple electric energy outputs can be provided to the load 3 respectively, so as to be applicable to different application scenarios, and improve the integration of the chip, save board space, and reduce design costs.

[0030] In some feasible implementations, the primary coil 101 and the multiple secondary coils 102 of the transformer 11 may be planar coils, which may be arranged in one plane or multiple planes, which may further improve the chip integration, save board space, and reduce design costs. Figures 3 to 9 The structure of the transformer in the isolated power chip provided in the present application is illustrated by way of example.

[0031] For some possible implementations, see Figure 3 , Figure 3 Schematic diagram of a transformer provided in an embodiment of the present application. Figure 3 As shown, the primary coil 101 and the secondary coils 102a to 102n can be arranged on the same plane. Here, the plane where the primary coil 101 and the secondary coils 102a to 102n are located can be a layer of circuit board or other plate-shaped structure with front and back sides. The primary coil 101 and the secondary coils 102a to 102n in the transformer 11 can all be arranged on the front side of this plane or all be arranged on the back side of this plane; or part of the coils can be arranged on the front side of this plane and the other part of the coils can be arranged on the back side of this plane. Here, the secondary coils 102a to 102n can be arranged symmetrically with the primary coil 101 as the center, that is, the angle between two adjacent secondary coils 102 about the center of the primary coil 101 is 360 / n, where n is the number of secondary coils. Here, the secondary coils 102a to 102n may also be arranged based on corresponding coupling coefficients obtained based on application scenarios, which can further improve the integration of the chip, save board space, and reduce design costs.

[0032] It can be understood that the primary coil 101 and the secondary coil 102 here can also be multi-layer planar coils, and one or several layers of the multi-layer planar coil can be arranged on the front side of the plane where the coil is located, and another layer or several layers of the multi-layer planar coil can be arranged on the reverse side of the plane where the coil is located. It can be further understood that the coil in the transformer mentioned in the present application can be a single-layer planar coil or a multi-layer planar coil. In the present application, only a single-layer planar coil is used as an example to illustrate the coil structure in the transformer. It can be specifically set according to the application scenario, and will not be repeated here. At the same time, in the present application, only a square coil is used as an example to introduce the positional relationship of each coil in the transformer. Each coil in the transformer mentioned in the present application can be a square planar coil, a circular planar coil, or a planar coil of other shapes, or a part can be a certain planar coil and the other part can be other planar coils. It can be specifically set based on the application scenario, and will not be repeated here. At the same time, it can be understood that the front and back sides of a certain plane, a certain circuit board or a certain planar structure mentioned here are only one side and the other side of the plane, the circuit board or the planar structure, which can be set specifically according to the application scenario and will not be elaborated below.

[0033] For some possible implementations, see Figure 4 , Figure 4 is another schematic diagram of the structure of the transformer provided in the embodiment of the present application. Figure 4As shown, the primary coil 101 can be arranged on one plane, and the secondary coils 102a to 102n can be arranged on another plane. In the present application, the primary coil 101 can be arranged on a layer of circuit board or a certain plate-type structure, and the secondary coils 102a to 102n can be arranged on another layer of circuit board or other plate-type structures. It can be understood that the secondary coils 102a to 102n can be arranged on the front or back of a plane at the same time, or a part of the secondary coils 102 can be arranged on the front of this plane, and the other part of the secondary coils 102 can be arranged on the back of this plane. Here, the secondary coils 102a to 102n can be arranged symmetrically with the primary coil 101 as the center, that is, the angle between two adjacent secondary coils 102 about the center of the primary coil 101 is 360 / n, where n is the number of secondary coils. The secondary coils 102a to 102n can also be arranged based on corresponding coupling coefficients obtained based on application scenarios, which can further improve the integration of the chip, save board space, and reduce design costs.

[0034] For some possible implementations, see Figure 5 , Figure 5 is another schematic diagram of the structure of the transformer provided in the embodiment of the present application. Figure 5 As shown, the primary coil 101 can be arranged on a plane, and each secondary coil 102 in the secondary coils 102a to 102n can be arranged on n other planes, and the n other planes correspond to the multiple secondary coils 102 one by one, where n is the number of secondary coils. In the present application, the primary coil 101 can be arranged on a layer of circuit board or a certain plate-type structure, and the secondary coils 102a to 102n can be arranged on other n layers of circuit boards or other n plate-type structures. Here, the center point of each secondary coil 102 in the secondary coils 102a to 102n can be arranged to coincide with the center point of the projection of the primary coil 101 on the plane where the secondary coil 102 is located, or the corresponding coupling coefficient is obtained based on the application scenario for arrangement, which can further improve the integration of the chip, save board space, and reduce design costs.

[0035] For some possible implementations, see Figure 6 , Figure 6 is another schematic diagram of the structure of the transformer provided in the embodiment of the present application. Figure 6As shown, the primary coil 101 can be disposed in a plane, and one or several of the secondary coils 102a to 102n can be respectively disposed in one or more other planes, and any other plane can include one or several secondary coils 102. That is to say, if the number of secondary coils 102 in the transformer 11 is n, then k of the n secondary coils 102 (for example, secondary coils 102a to 102k) can be respectively disposed on k layers of circuit boards or k board-like structures, and the other n - k secondary coils 102 (for example, secondary coils 102i to 102n) can be disposed on j layers of circuit boards or j board-like structures. Here, any layer of the j layers of circuit boards or j board-like structures includes at least two secondary coils 102. Here, the center points of the secondary coils 102 on the k layers of circuit boards or k board-like structures can be disposed to coincide with the center point of the projection of the primary coil 101, and the secondary coils 102 on the j layers of circuit boards or j board-like structures can be symmetrically disposed with the projection of the primary coil 101 as the center, or be disposed based on the corresponding coupling coefficient obtained according to the application scenario, which can further improve the integration degree of the chip, save the board space, and reduce the design cost. It can be understood that the k layers of circuit boards or k board-like structures can be arbitrarily disposed above and / or below the plane where the primary coil 101 is located. At the same time, it can also be understood that the j layers of circuit boards or j board-like structures can be arbitrarily disposed above and / or below the plane where the primary coil 101 is located, and can be specifically set based on the application scenario and the coupling coefficient between the coils, which is not limited herein.

[0036] In some feasible embodiments, the transformer 11 may further include a magnetic core, and the magnetic core can be disposed around the primary coil 101 and multiple secondary coils 102. For details, please refer to Figure 7 , Figure 7 which is another structural schematic diagram of the transformer provided by the embodiment of the present application. As Figure 7 shown, the transformer 11 further includes a magnetic core 103, and the magnetic core 103 can be disposed around the primary coil 101 and multiple secondary coils 102. Here, the magnetic core 103 is disposed around the primary coil 101 and multiple secondary coils 102 in a "mouth" shape, which can prevent the magnetic field in the coil from leaking, and further improve the power transmission efficiency. Here, the shaded area represents the plane where the primary coil 101, secondary coils 102a to 102n are located, and the specific coil structure is not shown. It can be understood that in some application scenarios where it is necessary to further prevent the magnetic field in the coil from leaking, the magnetic core 103 can also be disposed at the cross-sectional sides of the "mouth" - shaped magnetic core in Figure 7 , and interfaces for each coil wiring are reserved, which can further enhance the magnetic shielding performance of the transformer.

[0037] In some possible implementations, the magnetic core in the transformer may also have other shapes, see Figure 8 , Figure 8 is another schematic diagram of the structure of the transformer provided in the embodiment of the present application. Figure 8 As shown, here, the magnetic core 103 is arranged in a "C" shape around the primary coil 101 and the plurality of secondary coils 102, which can prevent the magnetic field in the coil from leaking out and further improve the efficiency of power transmission. Here, the shadow represents the plane where the primary coil 101, the secondary coil 102a to the secondary coil 102n are located, and the specific coil structure is not shown.

[0038] In some possible implementations, the magnetic core in the transformer may also have other shapes, see Fig. 9 , Fig. 9 is another schematic diagram of the structure of the transformer provided in the embodiment of the present application. Fig. 9 As shown, here, the magnetic core 103 is arranged in a "two" shape around the primary coil 101 and the plurality of secondary coils 102, which can prevent the magnetic field in the coil from leaking out and further improve the efficiency of power transmission. Here, the shadow represents the plane where the primary coil 101, the secondary coil 102a to the secondary coil 102n are located, and the specific coil structure is not shown.

[0039] In some feasible implementations, the magnetic core 103 here can be a magnetic core of an integral structure or a magnetic core composed of a combination of multiple partial structures. Here, the magnetic core 103 can select a corresponding one-piece magnetic core or a magnetic core composed of a combination of multiple partial structures according to different specifications such as the coil size arrangement. Here, the outer surface of the magnetic core 103 can be a plane or a curved surface, or a combination of a plane and a curved surface, which can be specifically set based on the application scenario to enhance applicability.

[0040] In some feasible implementations, the receiving module in the isolated power chip also has a feedback function. For details, see Fig.10 , Fig.10 is another structural schematic diagram of the isolated power supply chip provided in the embodiment of the present application. Fig.10As shown, among the N receiving modules RX from the receiving module RXa to the receiving module RXn, at least one feedback receiving module RX may be included (for example, the receiving module RXa is a feedback receiving module, that is, the receiving module RXa is a receiving module with a feedback function). Here, the isolated power supply chip 2 may also include an isolation module 12, and the receiving module RXa may be connected to the transmitting module TX through the isolation module 12. The feedback receiving module RX here may also be used to generate a feedback signal based on the input current and / or input voltage of the secondary coil 102 connected to the feedback receiving module RX, and transmit the feedback signal to the transmitting module TX through the isolation module 12. The transmitting module TX here may also be used to adjust the transmitting current and / or transmitting voltage of the primary coil 101 based on the feedback signal. Here, the feedback receiving module RX in the receiving module RX may have a feedback function while receiving electric energy. The feedback receiving module RX here may generate a feedback signal based on input parameters such as the amplitude of the input current and / or the amplitude of the input voltage of the secondary coil 102 connected thereto, and transmit the feedback signal to the transmitting module TX through the isolation module 12. Then the transmitting module TX or other control modules of the electric energy transmitting end can adjust the transmitting parameters such as the transmitting current or transmitting voltage of the primary coil 101 based on the feedback signal. For example, when the input current and / or input voltage of the secondary coil 102a connected to the receiving module RXa is lower than the input current threshold or input voltage threshold required by the load 3 connected to the receiving module RXa, the receiving module RXa can generate a feedback signal and transmit it to the transmitting module TX through the isolation module 12. When the transmitting module receives the feedback signal, then the transmitting module TX or other control modules of the electric energy transmitting end can increase the transmitting parameters such as the transmitting current or transmitting voltage of the primary coil 101 based on the indication of the feedback signal. For another example, when the input current and / or input voltage of the secondary coil 102a connected to the receiving module RXa is higher than the input current threshold or input voltage threshold required by the load 3 connected to the receiving module RXa, the receiving module RXa can generate a feedback signal and transmit it to the transmitting module TX through the isolation module 12. When the transmitting module receives the feedback signal, the transmitting module TX or other control modules of the power transmitting end can reduce the transmitting parameters such as the transmitting current or transmitting voltage of the primary coil 101 based on the indication of the feedback signal. In other words, the feedback receiving module RX here can generate a corresponding feedback signal through the input parameters of the secondary coil 102 connected to it, and then adjust the transmitting parameters of the primary coil 101 based on the feedback signal, which can improve the power supply efficiency and power supply stability while meeting the safety power supply requirements.

[0041] In some feasible implementations, the isolation module 12 may include at least one of a transformer, an optical coupler, or a capacitor to achieve the function of electrical isolation. Here, the isolation module 12 may provide electrical isolation between the feedback receiving module RX and the transmitting module TX to ensure power supply safety when the feedback receiving module RX transmits a feedback signal to the transmitting module TX.

[0042] In the present application, the composition of the functional modules in the isolated power chip is diverse and flexible, which can adapt to different application scenarios, improve the diversity of application scenarios of the isolated power chip, and enhance the adaptability of the isolated power chip. Figures 1 to 10 Any of the isolated power supply chips shown can provide multiple output terminals that meet the electrical isolation requirements, with high space utilization, improved device integration and applicability, and reduced design costs. The present application also provides a power conversion device, which may include multiple Figures 1 to 10 Any isolated power chip shown.

[0043] For details, please see Fig.11 , Fig.11 Schematic diagram of the structure of the power conversion device provided in the embodiment of the present application. Fig.11 As shown, the power conversion device 1000 may include Figures 1 to 10The isolated power chip 2, the drive circuit 4 and the power conversion circuit 5 in any possible implementation manner. Here, the input end of the isolated power chip 2 can be used to connect the power supply 1, the output end of the multiple receiving modules RX can be used to connect the power conversion circuit 5 through the drive circuit 4, and the output end of the power conversion circuit 5 can be used to connect the load 3. Here, the drive circuit 4 can be used to receive the electric energy provided by the isolated power chip 2, and drive the power conversion circuit 5 to perform power conversion. Here, the isolated power chip 2 can maintain the isolation capability with the drive circuit 4 when the voltage at the power supply end is very high. While meeting the safety power supply requirements, it can provide multiple drive voltages to the drive circuit 4 respectively to adapt to different application scenarios and improve the integration of the chip. Then the drive circuit 4 can transmit the corresponding drive signal to the power conversion circuit 5, so that the power conversion circuit 5 performs the corresponding power conversion on the electric energy and then supplies power to the load 3. Here, the electric energy received by the power conversion circuit 5 can be the electric energy directly provided by the power supply 1 or the electric energy provided by other functional modules, or it can be the electric energy provided by other power supplies. For example, the load 3 can be an electric car, and the isolated power chip 2 can convert the higher voltage provided by the power supply 1 (for example, the power grid) into a lower chip-level voltage, and provide some lower driving reference voltages for the drive circuit 4, which is used to provide the drive circuit 4 with the electric energy required by the drive circuit 4. Here, the drive circuit 4 can generate a drive signal, and then drive the power conversion circuit 5 through the drive signal, so that the power conversion circuit 5 can perform corresponding power conversion on the electric energy transmitted by the power supply 1 or other power sources according to the drive signal, and transmit the power-converted electric energy to the load 3, for example, to provide power for the electric car. It can be understood that the above examples are only some feasible implementation methods provided by the present application. The power conversion device 1000 and the isolated power chip 2 provided by the present application can be applied to any application scenario that needs to meet the electrical isolation requirements and requires multi-channel power output, and there is no limitation here.

[0044] In the present application, the isolated power supply chip can provide multiple output terminals that meet the electrical isolation requirements, have high space utilization, improve the integration and applicability of the equipment, and reduce design costs.

[0045] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An isolated power chip, characterized in that: The isolated power chip includes a transformer, a transmitting module and a plurality of receiving modules, wherein the transformer, the transmitting module and the plurality of receiving modules are packaged in the same housing, and the transformer includes a primary coil and a plurality of secondary coils; The input end of the transmitting module is used to connect to a power supply, the output end of the transmitting module is connected to the primary coil, the input end of each receiving module is respectively connected to one of the secondary coils, and the output end of each receiving module is used to connect to a load; The transmitting module is used to transmit the electric energy provided by the power supply to each of the secondary coils through the primary coil; Each of the receiving modules is used to transmit electrical energy to the load through the connected secondary coil.

2. The isolated power chip according to claim 1, characterized in that: The multiple receiving modules include at least one feedback receiving module, the isolated power chip also includes an isolation module, and the feedback receiving module is connected to the transmitting module through the isolation module; The feedback receiving module is further used to generate a feedback signal based on the input current and / or input voltage of the secondary coil connected to the feedback receiving module, and transmit the feedback signal to the transmitting module through the isolation module; The transmitting module is further used to adjust the transmitting current and / or transmitting voltage of the primary coil based on the feedback signal.

3. The isolated power chip according to claim 1 or 2, characterized in that: The primary coil and the plurality of secondary coils of the transformer are planar coils.

4. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil and the plurality of secondary coils are arranged on the same plane.

5. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil is arranged on one plane, and the plurality of secondary coils are arranged on another plane.

6. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil is arranged on one plane, and the plurality of secondary coils are arranged on a plurality of other planes respectively, and each of the plurality of other planes is arranged with one or more secondary coils.

7. The isolated power chip according to any one of claims 1 to 6, characterized in that: The transformer further includes a magnetic core, which is arranged on the periphery of the primary coil and the plurality of secondary coils.

8. The isolated power chip according to claim 7, characterized in that: The magnetic core is a magnetic core of an integral structure or a magnetic core composed of a plurality of partial structures.

9. The isolated power chip according to any one of claims 1 to 8, characterized in that: The isolation module includes at least one of a transformer, an optical coupler or a capacitor.

10. A power conversion device, characterized in that: The power conversion device comprises the isolated power supply chip, the drive circuit and the power conversion circuit according to any one of claims 1 to 9, the output ends of the plurality of receiving modules are used to connect the power conversion circuit through the drive circuit, and the output end of the power conversion circuit is used to connect the load; The driving circuit is used to receive the electric energy provided by the isolated power chip and drive the power conversion circuit to perform power conversion.

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