Circuit board and electronic equipment

Abstract

The invention provides a circuit board and electronic equipment, and belongs to the technical field of electronics. The circuit board comprises a substrate and a first conducting layer, the first conducting layer is located on one side face of the substrate, the first conducting layer comprises a first conducting part and a first reinforcing part which are distributed at intervals, the first conducting part is used for transmitting current, the first reinforcing part is arranged in a floating mode, the first conducting part and the first reinforcing part are insulated from each other, and the first reinforcing part is arranged on the first conducting part. The first conductive part and the first reinforcing part are both located on one side face of the substrate. The strength of the circuit board can be improved, and the problem that the circuit board is prone to cracks is solved.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a circuit board and an electronic device. Background Art

[0002] Printed Circuit Board (PCB) is an important component of electronic devices, used to carry electronic components and realize electrical connections between electronic components. Printed circuit boards usually include high-density interconnect (HDI) circuit boards and integrated circuits (ICS) boards.

[0003] In the related art, a printed circuit board generally includes: a substrate and conductive layers located on opposite sides of the substrate. The substrate is generally made of resin, which has poor rigidity and is prone to cracks or even breakage after impact. Summary of the invention

[0004] The embodiments of the present disclosure provide a circuit board and an electronic device, which can improve the strength of the circuit board and improve the problem that the circuit board is prone to cracks. The technical solution is as follows:

[0005] An embodiment of the present disclosure provides a circuit board, which includes: a substrate and a first conductive layer, wherein the first conductive layer is located on one side of the substrate, the first conductive layer includes a first conductive portion and a first reinforcement portion that are spaced apart, the first conductive portion is used to transmit current, the first reinforcement portion is floating, the first conductive portion and the first reinforcement portion are insulated from each other, and the first conductive portion and the first reinforcement portion are both located on one side of the substrate.

[0006] In one implementation of the embodiment of the present disclosure, the circuit board has a first side and a second side opposite to each other, and the first conductive portion and the first reinforcing portion are both located on the first side; the circuit board also includes a second conductive layer, the second conductive layer includes a second conductive portion and a second reinforcing portion distributed at intervals, the second conductive portion is used to transmit current, the second reinforcing portion is floating, the second conductive portion and the second reinforcing portion are insulated from each other, and the second conductive portion and the second reinforcing portion are both located on the second side.

[0007] In another implementation manner of the embodiment of the present disclosure, the orthographic projection of the first reinforcing portion on the second side surface at most partially overlaps with the orthographic projection of the second reinforcing portion on the second side surface.

[0008] In another implementation of the embodiment of the present disclosure, the first reinforcement portion and the second reinforcement portion respectively include a plurality of reinforcement blocks arranged at intervals.

[0009] In another implementation of the embodiment of the present disclosure, the shape of the orthographic projection of the reinforcement block on the first side surface is a polygon or a circle.

[0010] In another implementation of the embodiment of the present disclosure, a plurality of the reinforcing blocks located on the same side are arranged in an array, and a distance between two adjacent reinforcing blocks is 1016 μm to 1270 μm.

[0011] In another implementation of the embodiment of the present disclosure, the maximum width of the reinforcement block is 508 μm to 1016 μm, and the width direction of the reinforcement block is parallel to the first side surface.

[0012] In another implementation of the embodiment of the present disclosure, the substrate includes a photosensitive material layer or a resin layer.

[0013] In another implementation of the embodiment of the present disclosure, the circuit board also includes a first insulating layer and a plurality of first connecting strips, the first insulating layer is located in the gap of the first reinforcement part and covers the first conductive part, the plurality of first connecting strips are located on the surface of the first insulating layer and the first reinforcement part away from the substrate, any two adjacent first reinforcement parts correspond to one first connecting strip, and the two ends of each first connecting strip are respectively connected to the corresponding two adjacent first reinforcement parts; the circuit board also includes a second insulating layer and a plurality of second connecting strips, the second insulating layer is located in the gap of the second reinforcement part and covers the second conductive part, the plurality of second connecting strips are located on the surface of the second insulating layer and the second reinforcement part away from the substrate, any two adjacent second reinforcement parts correspond to one second connecting strip, and the two ends of each second connecting strip are respectively connected to the corresponding two adjacent second reinforcement parts.

[0014] An embodiment of the present disclosure provides an electronic device, wherein the electronic device includes the circuit board as described above.

[0015] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0016] The circuit board provided in the embodiment of the present disclosure has a first conductive layer on one side of the substrate, and the first conductive layer includes a first conductive part and a first reinforcement part that are spaced apart. The first conductive part is used to transmit current, and the first reinforcement part is floating, that is, the first reinforcement plate is not energized and is an idle structure on the substrate, so that the first conductive part and the first reinforcement part are insulated from each other. In this way, the first reinforcement part is arranged on one side of the substrate, and the impact force of the circuit board caused by the collision is shared by the first reinforcement part, thereby avoiding the problem of cracks on the substrate being easily formed, and improving the rigidity and strength of the substrate.

[0017] Moreover, the first reinforcement part and the first conductive part both belong to a part of the first conductive layer, that is, the first reinforcement part and the first conductive part are in the same layer structure, so during the preparation and processing, the first reinforcement part and the first conductive part can be formed by a single patterning process to improve the preparation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a cross-sectional schematic diagram of a circuit board provided by an embodiment of the present disclosure;

[0020] Figure 2 is a projection relationship diagram of a reinforcement portion on a second side surface provided by an embodiment of the present disclosure;

[0021] Figure 3 is a projection relationship diagram of a reinforcement portion on a second side surface provided by an embodiment of the present disclosure;

[0022] Figure 4 It is a cross-sectional schematic diagram of a circuit board provided in an embodiment of the present disclosure.

[0023] The descriptions of the marks in the figure are as follows:

[0024] 10. Substrate;

[0025] 11. first side surface; 12. second side surface; 13. through hole;

[0026] 20. a first conductive layer;

[0027] 21. a first conductive portion; 22. a first reinforcing portion;

[0028] 30. a second conductive layer;

[0029] 31. second conductive portion; 32. second reinforcing portion;

[0030] 41. a first insulating layer; 42. a second insulating layer;

[0031] 51. first connecting strip; 52. second connecting strip;

[0032] 60. Reinforcement parts. DETAILED DESCRIPTION

[0033] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0034] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons with ordinary skills in the field to which the present disclosure belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", "top", "bottom" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0035] Figure 1 is a schematic cross-sectional view of a circuit board provided by an embodiment of the present disclosure. Figure 1 As shown, the circuit board includes: a substrate 10 and a first conductive layer 20 . The first conductive layer 20 is located on one side of the substrate 10 . The first conductive layer 20 includes a first conductive portion 21 and a first reinforcing portion 22 that are spaced apart.

[0036] The first conductive portion 21 is used to transmit current, the first reinforcement portion 22 is floating, the first conductive portion 21 and the first reinforcement portion 22 are insulated from each other, and both the first conductive portion 21 and the first reinforcement portion 22 are located on one side of the substrate 10 .

[0037] In the embodiment of the present disclosure, the first reinforcement portion is floating, which means that the first reinforcement portion is not energized and belongs to an idle area in the first conductive layer, and the first reinforcement portion is insulated from the first conductive portion.

[0038] The circuit board provided in the embodiment of the present disclosure has a first conductive layer on one side of the substrate, and the first conductive layer includes a first conductive part and a first reinforcement part that are spaced apart. The first conductive part is used to transmit current, and the first reinforcement part is floating, that is, the first reinforcement plate is not energized and is an idle structure on the substrate, so that the first conductive part and the first reinforcement part are insulated from each other. In this way, the first reinforcement part is arranged on one side of the substrate, and the impact force of the circuit board caused by the collision is shared by the first reinforcement part, thereby avoiding the problem of cracks on the substrate being easily formed, and improving the rigidity and strength of the substrate.

[0039] Moreover, the first reinforcement part and the first conductive part both belong to a part of the first conductive layer, that is, the first reinforcement part and the first conductive part are in the same layer structure, so during the preparation and processing, the first reinforcement part and the first conductive part can be formed by a single patterning process to improve the preparation efficiency.

[0040] Alternatively, if Figure 1 As shown, the circuit board has a first side surface 11 and a second side surface 12 opposite to each other, and the first conductive portion 21 and the first reinforcement portion 22 are both located on the first side surface 11 .

[0041] like Figure 1 As shown, the circuit board also includes a second conductive layer 30, the second conductive layer 30 includes a second conductive portion 31 and a second reinforcement portion 32 distributed at intervals, the second conductive portion 31 is used to transmit current, the second reinforcement portion 32 is floating, the second conductive portion 31 and the second reinforcement portion 32 are insulated from each other, and the second conductive portion 31 and the second reinforcement portion 32 are both located on the second side 12.

[0042] In the embodiment of the present disclosure, the second reinforcement portion is floating, which means that the second reinforcement portion is not energized and belongs to an idle area in the second conductive layer, and the second reinforcement portion is insulated from the second conductive portion.

[0043] The first side 11 of the substrate 10 of the circuit board provided in the embodiment of the present disclosure is provided with a first conductive layer 20, and the second side 12 of the substrate 10 is provided with a second conductive layer 30. Among them, the second conductive layer 30 includes a second conductive portion 31 and a second reinforcing portion 32 that are spaced apart, and the second conductive portion 31 and the second reinforcing portion 32 are both located on the second side 12. In this way, the second reinforcing portion 32 is provided on the second side 12 of the substrate 10, and the impact force generated by the collision of the circuit board is shared by the second reinforcing portion 32, thereby avoiding the problem of cracks easily appearing on the substrate 10, and improving the rigidity and strength of the position where the second side 12 of the substrate 10 is located. In this way, conductive layers are provided on both sides of the substrate, and the strength and rigidity of the two sides of the substrate are enhanced by the reinforcing portions in the conductive layer, thereby improving the stability of the substrate.

[0044] Moreover, the second reinforcing portion 32 and the second conductive portion 31 both belong to a partial area of ​​the second conductive layer 30, that is, the second reinforcing portion 32 and the second conductive portion 31 are a same-layer structure. In this way, during the preparation and processing, the second reinforcing portion 32 and the second conductive portion 31 can be formed by a single composition process to improve the preparation efficiency.

[0045] Optionally, the orthographic projection of the first reinforcing portion 22 on the second side surface 12 and the orthographic projection of the second reinforcing portion 32 on the second side surface 12 at most partially overlap.

[0046] The at most partial overlap of the two orthographic projections means that there is partial overlap of the two orthographic projections, or the two orthographic projections do not overlap at all.

[0047] In one implementation, Figure 2 1 is a projection diagram of a reinforcement portion on the second side surface 12 provided by an embodiment of the present disclosure. Figure 2 As shown, the first reinforcement portion 22 and the second reinforcement portion 32 are both rectangular, and the corner of the first reinforcement portion 22 coincides with the corner of the second reinforcement portion 32 .

[0048] In another implementation, the orthographic projection of the first reinforcing portion 22 on the second side surface 12 is outside the orthographic projection of the second reinforcing portion 32 on the second side surface 12 , that is, the two orthographic projections do not overlap.

[0049] In the above implementation, complementary reinforcement is achieved by making the majority of the regions of the reinforcement portions located on the first side surface 11 and the second side surface 12 not opposite to each other. That is, the first reinforcement portion 22 is provided in a part of the region of the first side surface 11 to reinforce a part of the region of the first side surface 11, and the second reinforcement portion 32 is provided in a part of the region of the second side surface 12 to reinforce a part of the region of the second side surface 12, and the reinforced regions on the first side surface 11 and the second side surface 12 are complementary, that is, the combination of the reinforced regions can cover a complete side surface of the substrate 10. In this way, while the side surface of the substrate 10 is fully protected, the number of reinforcement portions provided on the side surface of the substrate 10 can be effectively reduced, thereby reserving more regions on the side surface of the substrate 10 to form the conductive portion.

[0050] Alternatively, if Figure 2 As shown, the first reinforcement portion 22 and the second reinforcement portion 32 respectively include a plurality of reinforcement blocks arranged at intervals.

[0051] In the disclosed embodiment, the reinforcement block may also be a dummy electrode, which is an area in the conductive layer that is not used for conduction, that is, the dummy electrode is not energized during the use of the circuit board and is an idle area in the conductive layer.

[0052] The first reinforcement part 22 and the second reinforcement part 32 are set as plate-shaped reinforcement blocks, and the reinforcement blocks are arranged at intervals to form enough gaps. Since the conductive layer in the conductive part is used to transmit current, the reinforcement blocks are arranged at intervals to form enough gaps, which is conducive to the arrangement of the conductive part on the side of the substrate 10.

[0053] Optionally, the shape of the orthographic projection of the reinforcement block on the first side surface 11 is a polygon or a circle.

[0054] For example, Figure 2 As shown, the shape of the orthographic projection of the reinforcement block on the first side surface 11 is a square.

[0055] For example, Figure 3 : is a projection relationship diagram of a reinforcement portion on the second side surface provided by an embodiment of the present disclosure. Figure 3As shown, the shape of the orthographic projection of the reinforcement block on the first side surface 11 is a circle.

[0056] Compared with a square, when the reinforcing block is set to a circle, under the premise of the same width, the circle occupies a smaller area. Therefore, setting the reinforcing block to a circle can help provide more arrangement space for the conductive part.

[0057] Alternatively, if Figure 2 , 3 As shown, a plurality of reinforcing blocks located on the same side are arranged in an array, and a distance H between two adjacent reinforcing blocks is 1016 μm to 1270 μm.

[0058] In the embodiment of the present disclosure, the distance between two adjacent reinforcement blocks refers to: the distance between the two sides of the two reinforcement blocks that are closest to each other in the arrangement direction of the two reinforcement blocks, that is, the minimum distance between the two reinforcement blocks.

[0059] For example, Figure 2 As shown, the distance between two adjacent reinforcement blocks is the distance between the opposite sides of two square reinforcement blocks.

[0060] In some other embodiments, the distance between two adjacent reinforcement blocks may also refer to: the distance between two points on the two reinforcement blocks that are farthest apart in the arrangement direction of the two reinforcement blocks, that is, the maximum distance between the two reinforcement blocks.

[0061] In some other implementations, the distance between two adjacent reinforcement blocks may also refer to: the average value of the maximum distance and the minimum distance in the arrangement direction of the two reinforcement blocks, that is, the average distance between the two reinforcement blocks.

[0062] In the above implementation, setting the distance between two adjacent reinforcement blocks within this range can avoid the distance between the two reinforcement blocks being too narrow to provide sufficient space for setting the conductive part, and can also avoid the distance between the reinforcement blocks being too large to fully improve the side strength of the substrate 10.

[0063] Exemplarily, the distance between two adjacent reinforcement blocks is 1100 μm.

[0064] Optionally, the maximum width L of the reinforcement block is 508 μm to 1016 μm, and the width direction of the reinforcement block is parallel to the first side surface 11 .

[0065] Exemplarily, when the reinforcement block is rectangular, the maximum width of the reinforcement block is the length of the diagonal of the rectangle.

[0066] Exemplarily, when the reinforcement block is circular, the maximum width of the reinforcement block is the diameter of the circle.

[0067] By setting the maximum width of the reinforcing block within the above range, it is possible to avoid setting the width of the reinforcing block too small, so that the area where the reinforcing block is attached to the side of the substrate 10 is small, and the purpose of fully protecting the substrate 10 is not achieved.

[0068] Exemplarily, the maximum width of the reinforcement block is 1000 μm.

[0069] Optionally, the thickness of the substrate 10 is not greater than 100 μm. By controlling the thickness of the substrate 10 to be less than 100 μm, the thickness of the circuit board can be effectively reduced, the materials used in the preparation of the circuit board can be reduced, and the circuit board can be made lighter.

[0070] Exemplarily, the thickness of the substrate 10 is 50 μm.

[0071] Optionally, the thickness of the first conductive layer 20 is not greater than 100 μm. By controlling the thickness of the first conductive layer 20 to be less than 100 μm, the thickness of the circuit board can be effectively reduced, the manufacturing materials used in the preparation of the circuit board can be reduced, and the circuit board can be made lighter; at the same time, the thickness of the conductive layer in the circuit board is smaller, which is conducive to heat dissipation and improves the reliability of the circuit board.

[0072] Exemplarily, the thickness of the first conductive layer 20 may be 30 μm.

[0073] Optionally, the thickness of the second conductive layer 30 is not greater than 100 μm. By controlling the thickness of the second conductive layer 30 to be less than 100 μm, the thickness of the circuit board can be effectively reduced, the manufacturing materials used in the preparation of the circuit board can be reduced, and the circuit board can be made lighter; at the same time, the thickness of the conductive layer in the circuit board is smaller, which is conducive to heat dissipation and improves the reliability of the circuit board.

[0074] Exemplarily, the thickness of the second conductive layer 30 may be 30 μm.

[0075] Optionally, the substrate 10 includes a photosensitive material layer or a resin layer.

[0076] In some implementations, the substrate 10 may be a photosensitive material layer. Since the first conductive layer 20 located on the first side 11 of the substrate 10 and the second conductive layer 30 located on the second side 12 of the circuit board need to be connected, a through hole 13 connecting the first side 11 and the second side 12 is usually provided on the substrate 10, so that the first circuit board and the second circuit board can be connected through the through hole 13.

[0077] Since the photosensitive material layer can directly form a through hole 13 on the photosensitive material layer by exposure and development, without the need to prepare the through hole 13 by pressing, mechanical drilling and laser drilling, the process flow of opening the through hole 13 on the substrate 10 can be effectively simplified, thereby improving the preparation efficiency of the circuit board.

[0078] Exemplarily, the photosensitive material layer is 50 μm to 100 μm.

[0079] Optionally, the cross-sectional shape of the through hole 13 is circular, polygonal, elliptical or an irregular closed shape.

[0080] Exemplarily, the cross-sectional shape of the through hole 13 is triangular. Thus, the cross-sectional shape of the portion of the first conductive portion 21 located in the through hole 13 is also triangular, and the portion of the first conductive portion 21 in the through hole 13 is not prone to rotation and loosening in the through hole 13 due to the restriction of the side wall of the through hole 13.

[0081] Exemplarily, the cross-sectional shape of the through hole 13 is a rectangle. Compared with a triangle, when the shape of the through hole 13 is set to a rectangle, the area of ​​the rectangular through hole 13 is larger than the area of ​​the triangular through hole 13 when the maximum length is the same. Therefore, when the shape of the through hole 13 is set to a rectangle, more materials for making the first conductive part 21 can be filled in the through hole 13, which is conducive to the transmission of current from the first conductive part 21 to the second conductive part 31.

[0082] Exemplarily, the cross-sectional shape of the through hole 13 is circular. The sidewall of the circular through hole 13 is an arc surface. Compared with the polygonal through hole 13, the sidewall of the polygonal through hole 13 has a folded corner, and the material of the first conductive part 21 is not easy to fill the folded corner during the deposition process, while the sidewall of the circular through hole 13 is smoother. When the first conductive part 21 is deposited in the through hole 13, the material of the first conductive part 21 is more likely to fill each corner of the through hole 13, thereby improving the connection reliability between the first conductive part 21 and the second conductive part 31.

[0083] In some implementations, the substrate 10 may be a resin layer.

[0084] Exemplarily, the substrate 10 may be an epoxy resin layer.

[0085] When the substrate 10 is made of resin, the resin layer can provide support for the first conductive layer 20 and the second conductive layer 30 . When drilling holes on the substrate 10 , the resin material can also reduce the resistance of the drilling process.

[0086] Optionally, the substrate 10 is a resin layer filled with glass fibers.

[0087] By filling the resin layer with glass fiber, the strength of the resin layer can be effectively enhanced to improve the impact resistance of the resin layer.

[0088] In some other implementations, the substrate 10 may include a first resin layer, a glass fiber layer, and a second resin layer stacked in sequence, that is, a composite layer is formed by sandwiching a glass fiber layer between two resin layers.

[0089] Compared with the method of filling glass fibers in the resin layer, directly inserting a whole layer of glass fibers in the middle of the resin layer can enhance the strength of the substrate 10 to a greater extent, making it less likely for the substrate 10 to crack under impact.

[0090] Illustratively, the substrate 10 may include a plurality of resin layers and a plurality of glass fiber layers alternately stacked.

[0091] The number of the resin layer and the glass fiber layer can be determined according to the required thickness of the substrate 10 .

[0092] In this implementation, multiple glass fiber layers can be inserted into the resin layer, and each glass fiber layer is configured with a resin layer as a support layer for the glass fiber layer, so that the glass fiber layer distribution in the thickness direction of the substrate 10 is more uniform, thereby ensuring the consistent strength of each area of ​​the substrate 10 and improving the impact resistance of the substrate 10.

[0093] Alternatively, if Figure 3 As shown, the circuit board also includes a first insulating layer 41 and a plurality of first connecting strips 51. The first insulating layer 41 is located in the gap of the first reinforcement portion 22 and covers the first conductive portion 21. The plurality of first connecting strips 51 are located on the surface of the first insulating layer 41 and the first reinforcement portion 22 away from the substrate 10. Any two adjacent first reinforcement portions 22 correspond to a first connecting strip 51, and the two ends of each first connecting strip 51 are respectively connected to the corresponding two adjacent first reinforcement portions 22.

[0094] The first insulating layer 41 is filled in the gap of the first reinforcement part 22 to isolate the first reinforcement part 22 and the first conductive part 21, thereby preventing the current from being transmitted from the first conductive part 21 to the first reinforcement part 22. At the same time, the first connecting strip 51 can be overlapped on the top of the first insulating layer 41, that is, it spans the first conductive part 21 to connect the two first reinforcement parts 22 located on both sides of the first conductive part 21. In this way, by providing a plurality of first connecting strips 51 to connect two adjacent first conductive cloths, all the first reinforcement parts 22 are connected together to form a mesh structure.

[0095] When the circuit board generates heat during operation, the first reinforcement portion 22 at any position on the substrate 10 can absorb the heat. Since the first reinforcement portion 22 is connected by the first connecting strip 51, the heat can be transferred to any area of ​​the mesh structure through the first connecting strip 51, which is beneficial to conduct the heat to the edge of the circuit board and improve the heat dissipation effect of the circuit board.

[0096] like Figure 3As shown, the circuit board also includes a second insulating layer 42 and a plurality of second connecting strips 52. The second insulating layer 42 is located in the gap of the second reinforcement portion 32 and covers the second conductive portion 31. The plurality of second connecting strips 52 are located on the surface of the second insulating layer 42 and the second reinforcement portion 32 away from the substrate 10. Any two adjacent second reinforcement portions 32 correspond to a second connecting strip 52, and the two ends of each second connecting strip 52 are respectively connected to the corresponding two adjacent second reinforcement portions 32.

[0097] The second insulating layer 42 is filled in the gap of the second reinforcing portion 32 to isolate the second reinforcing portion 32 and the second conductive portion 31, thereby preventing the current from being transmitted from the second conductive portion 31 to the first reinforcing portion 22. At the same time, the second connecting strip 52 can be overlapped on the top of the second insulating layer 42, that is, it spans the second conductive portion 31 to connect the two second reinforcing portions 32 located on both sides of the second conductive portion 31. In this way, by providing a plurality of second connecting strips 52 to connect two adjacent second conductive cloths, all the second reinforcing portions 32 are connected together to form a mesh structure.

[0098] When the circuit board generates heat during operation, the second reinforcement portion 32 at any position on the substrate 10 can absorb the heat. Since the second reinforcement portion 32 is connected by the second connecting strip 52, the heat can be transferred to any area of ​​the mesh structure through the second connecting strip 52, which is beneficial to conduct the heat to the edge of the circuit board and improve the heat dissipation effect of the circuit board.

[0099] Optionally, Figure 4 is a schematic cross-sectional view of a circuit board provided by an embodiment of the present disclosure. Figure 4 As shown, the substrate 10 has a through hole 13 connecting the first conductive portion 21 and the second conductive portion 31 .

[0100] Alternatively, if Figure 4 As shown, the circuit board further includes a reinforcement member 60 , and the reinforcement member 60 is located in the through hole 13 .

[0101] The stiffness of the reinforcement member 60 is higher than that of the substrate 10 . Thus, the reinforcement member 60 is arranged in the through hole 13 , which can effectively compensate for the weakening of the stiffness of the substrate 10 caused by the opening of the through hole 13 , thereby improving the reliability of the circuit board.

[0102] Exemplarily, the reinforcement member 60 may be an insulating material, for example, the reinforcement member 60 may be a ceramic member.

[0103] Optionally, the first conductive part 21 in the through hole 13 covers the reinforcement 60, and the ratio of the volume of the first conductive part 21 in the through hole 13 to the volume of the reinforcement 60 is not less than 2 / 3. In this way, the reinforcement 60 can be prevented from occupying a large space in the through hole 13, so that the material of the first conductive part 21 in the through hole 13 is less, which is not conducive to improving the connection reliability of the first conductive part 21 and the second conductive part 31.

[0104] In the embodiment of the present disclosure, the reinforcement member on the circuit board may be located only on a portion of the surface of the substrate. Figure 4 As shown, the left side of the substrate has dummy metal retained when making the conductive layer. The dummy metal serves as a reinforcement to improve the strength of the substrate surface. However, the right side of the substrate does not retain the dummy metal, which can provide a larger area for making the conductive layer.

[0105] In some other implementations, the reinforcement members on the circuit board may also be located on the entire surface of the substrate to maximize the strength of the substrate surface.

[0106] An embodiment of the present disclosure provides an electronic device, and the electronic device includes the circuit board as described above.

[0107] Exemplarily, the electronic device may be any electronic device including a circuit board, such as a server, a mobile phone, a computer, a television, a game console, an electronic watch, or the like.

[0108] The above does not limit the present disclosure in any form. Although the present disclosure has been disclosed as above through the embodiments, it is not used to limit the present disclosure. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure still falls within the scope of the technical solution of the present disclosure.

Claims

1. A circuit board, characterized in that: The circuit board comprises: a substrate (10) and a first conductive layer (20), wherein the first conductive layer (20) is located on one side of the substrate (10), the first conductive layer (20) comprises a first conductive portion (21) and a first reinforcement portion (22) which are spaced apart, the first conductive portion (21) is used to transmit current, the first reinforcement portion (22) is floating, the first conductive portion (21) and the first reinforcement portion (22) are insulated from each other, and the first conductive portion (21) and the first reinforcement portion (22) are both located on one side of the substrate (10).

2. The circuit board according to claim 1, characterized in that: The circuit board has a first side surface (11) and a second side surface (12) opposite to each other, and the first conductive portion (21) and the first reinforcing portion (22) are both located on the first side surface (11); The circuit board further comprises a second conductive layer (30), the second conductive layer (30) comprising a second conductive portion (31) and a second reinforcement portion (32) which are spaced apart from each other, the second conductive portion (31) being used to transmit current, the second reinforcement portion (32) being floating, the second conductive portion (31) and the second reinforcement portion (32) being insulated from each other, and the second conductive portion (31) and the second reinforcement portion (32) being both located on the second side surface (12).

3. The circuit board according to claim 2, characterized in that: The orthographic projection of the first reinforcing portion (22) on the second side surface (12) and the orthographic projection of the second reinforcing portion (32) on the second side surface (12) at most partially overlap.

4. The circuit board according to claim 2 or 3, characterized in that: The first reinforcement part (22) and the second reinforcement part (32) respectively include a plurality of reinforcement blocks arranged at intervals.

5. The circuit board according to claim 4, characterized in that: The shape of the orthographic projection of the reinforcement block on the first side surface (11) is a polygon or a circle.

6. The circuit board according to claim 4, characterized in that: The plurality of reinforcing blocks located on the same side are arranged in an array, and the distance between two adjacent reinforcing blocks is 1016 μm to 1270 μm.

7. The circuit board according to claim 4, characterized in that: The maximum width of the reinforcement block is 508 μm to 1016 μm, and the width direction of the reinforcement block is parallel to the first side surface (11).

8. The circuit board according to any one of claims 1 to 3 and claims 5 to 7, characterized in that: The substrate (10) comprises a photosensitive material layer or a resin layer.

9. The circuit board according to any one of claims 2 to 3 and claims 5 to 7, characterized in that: The circuit board further comprises a first insulating layer (41) and a plurality of first connecting strips (51); the first insulating layer (41) is located in a gap of the first reinforcing portion (22) and covers the first conductive portion (21); the plurality of first connecting strips (51) are located on a surface of the first insulating layer (41) and the first reinforcing portion (22) away from the substrate (10); any two adjacent first reinforcing portions (22) correspond to one first connecting strip (51); and two ends of each first connecting strip (51) are respectively connected to the corresponding two adjacent first reinforcing portions (22); The circuit board further comprises a second insulating layer (42) and a plurality of second connecting strips (52); the second insulating layer (42) is located in a gap of the second reinforcing portion (32) and covers the second conductive portion (31); the plurality of second connecting strips (52) are located on a surface of the second insulating layer (42) and the second reinforcing portion (32) away from the substrate (10); any two adjacent second reinforcing portions (32) correspond to one second connecting strip (52); and two ends of each second connecting strip (52) are respectively connected to the corresponding two adjacent second reinforcing portions (32).

10. An electronic device, characterized in that: The electronic device comprises the circuit board according to any one of claims 1 to 9.

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