Processing method for improving half-hole burrs of circuit board

Abstract

The invention relates to the technical field of circuit boards, in particular to a processing method for improving half-hole burrs of a circuit board, which comprises the following steps of: optimizing pattern transfer data of a half-hole Ring ring on the surface of the circuit board when the pattern transfer data of the circuit board is manufactured, removing two regions of a half-hole Ring ring pattern, and dividing the half-hole Ring ring into a first ring body and a second ring body, a first non-metal area and a second non-metal area are formed in the positions, corresponding to the two removed areas, of the circuit board after pattern transfer, and in the board milling process, a milling cutter passes through the first non-metal area and the second non-metal area between the first ring body and the second ring body. According to the method, after the pattern transfer data is optimized, the contact between the milling cutter and metal is less in the milling process, so that the resistance borne by the milling cutter is reduced, the advancing process of the milling cutter is smoother, and burrs and burrs are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a processing method for improving the flash of a half hole of a circuit board. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. Common circuit boards include single-sided, double-sided, and multi-layer boards. In the production of circuit boards, according to design requirements, some circuit board products need to make metallized holes or half holes to facilitate local interconnection between layers or connection of electronic components on different layers. After the circuit board is formed, it needs to be grouted. When the circuit board with half holes is grouted, the grouted knife is easy to roll up the copper of the hole ring and the hole wall when passing through the area where the hole is located, forming burrs and burrs. In severe cases, there may even be no copper in the hole, affecting the quality of the circuit board. In traditional processing, the circuit board is inspected after the grouted is completed, and the circuit board with half holes with burrs is screened out, and then manually processed by the staff. This method is time-consuming and labor-intensive, and due to the different proficiency of different personnel, it is easy to cause damage to the circuit board during the processing of burrs, and in severe cases, the circuit board may even be scrapped. Summary of the invention

[0003] In order to solve the above problems, the present invention provides a processing method for improving the flash of half holes of a circuit board.

[0004] The present invention is implemented by the following scheme: A processing method for improving the flash of a half hole in a circuit board. When making the pattern transfer data of the circuit board, the pattern transfer data of the half hole ring on the surface of the circuit board is optimized, two areas of the half hole ring pattern are removed, and the half hole ring is divided into a first ring body and a second ring body, so that two first non-metallic areas and a second non-metallic area are formed at the positions of the two areas removed from the circuit board after the pattern transfer. In the gong process, the gong knife passes through the first non-metallic area and the second non-metallic area between the first ring body and the second ring body.

[0005] Furthermore, the first non-metallic area and the second non-metallic area overlap with a half-hole forming line of the circuit board.

[0006] Furthermore, the center line of the first non-metallic area overlaps with the half-hole forming line, and the center line of the second non-metallic area overlaps with the half-hole forming line.

[0007] Furthermore, during the rouging process, the moving path of the center line of the rouging knife overlaps with the half-hole forming line.

[0008] Furthermore, the widths of the first non-metallic area and the second non-metallic area are both 1 to 1.2 mm.

[0009] Further, the following steps are included: S1, preparing pattern transfer data according to the circuit board design data, optimizing the pattern transfer data of the half-hole ring on the surface of the circuit board, removing two areas of the half-hole ring pattern, dividing the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; S2, cutting; S3, drilling, drilling according to the circuit board design data; S4, chemical copper deposition to metallize the hole wall; S5, creating graphics according to the optimized graphics transfer data; S6, pattern plating; S7, tinning on the gong plate surface; S8, gong plate, in the gong plate process, the path of the gong knife passes through the first non-metallic area and the second non-metallic area; S9, film removal; S10, etching, etching the multilayer board after film stripping to remove the metal layer of the half-hole wall; S11, target removal and tin stripping; S12, post-processing.

[0010] Furthermore, the processing method for improving the half-hole flash of the circuit board comprises the following steps: A1, prepare pattern transfer data according to the circuit board design data, optimize the pattern transfer data of the half-hole ring on the surface of the circuit board, remove two areas of the half-hole ring pattern, divide the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; A2, make inner layer board after cutting; A3, lamination, pressing discrete inner layer boards and PP sheets into multilayer boards; A4, drilling, drilling holes in multilayer boards according to the circuit board design data; A5, chemical copper deposition, metallization of the hole wall; A6, outer layer graphics production, produce outer layer graphics according to optimized graphics transfer data; A7, tin-plated on the gong plate surface; A8, gong plate, in the gong plate process, the path of the gong knife passes through the first non-metallic area and the second non-metallic area; A9, film removal; A10, etching, etching the multilayer board after film stripping to remove the metal layer of the half-hole wall; A11, target removal and tin stripping; A12, post-processing.

[0011] Further, the post-processing comprises the following steps: B1, water washing, washing the circuit board after desoldering; B2, drying, drying the washed circuit board; B3, electrical testing, electrical testing of the circuit board after drying.

[0012] Compared with the prior art, the present invention has the following beneficial effects: The present invention optimizes the pattern transfer data and removes two parts of the Ring of the half hole, so that after the pattern transfer, the Ring on the surface of the circuit board is disconnected to form a first non-metallic area and a second non-metallic area. During the gong process, the gong cutter passes through the first non-metallic area and the second non-metallic area, and the gong cutter has less contact with the metal, thereby reducing the resistance of the gong cutter, making the gong cutter move more smoothly, and reducing the generation of burrs and burrs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of an optimized Ring structure in a processing method for improving half-hole flash on a circuit board provided by the present invention.

[0014] Included in the picture are: A first non-metallic area 1, a second non-metallic area 2, and a forming line 3. DETAILED DESCRIPTION

[0015] To facilitate those skilled in the art to understand the present invention, the present invention will be further described in detail below in conjunction with specific embodiments and drawings.

[0016] Example 1 Reference Figure 1 The present invention provides a processing method for improving the half-hole flashing of a circuit board. When making the circuit board pattern transfer data, the pattern transfer data of the half-hole ring on the surface of the circuit board is optimized, two areas of the half-hole ring pattern are removed, and the half-hole ring is divided into a first ring body and a second ring body, so that two first non-metallic areas and a second non-metallic area are formed at the positions of the two areas removed from the circuit board after the pattern transfer. During the gong process, the gong knife passes through the first non-metallic area and the second non-metallic area between the first ring body and the second ring body.

[0017] The first non-metallic area and the second non-metallic area overlap with the half-hole forming line of the circuit board.

[0018] The center line of the first non-metallic area overlaps with the half-hole forming line, and the center line of the second non-metallic area overlaps with the half-hole forming line. Since the center lines of the two non-metallic areas overlap with the forming line, the first ring body and the second ring body are two symmetrical parts. Specifically, in this embodiment, the forming line of the half hole overlaps with the diameter of the Ring ring, and the first non-metallic area and the second non-metallic area are at two positions where the forming line and the R ring intersect.

[0019] In the gong process of this embodiment, the moving path of the center line of the gong knife overlaps with the half-hole forming line.

[0020] The widths of the first non-metallic area and the second non-metallic area are both 1-1.2 mm. In this embodiment, the width is 1 mm. In specific implementations, the widths of the first non-metallic area and the second non-metallic area can be determined based on the product size and the size of the gong cutter.

[0021] The processing method for improving the flash of half-hole of the circuit board comprises the following steps: S1, preparing pattern transfer data according to the circuit board design data, optimizing the pattern transfer data of the half-hole ring on the surface of the circuit board, removing two areas of the half-hole ring pattern, dividing the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; S2, cutting; S3, drilling, drilling according to the circuit board design data; S4, chemical copper deposition to metallize the hole wall; S5, making a pattern according to the optimized pattern transfer data. Specifically, in the pattern made according to the optimized pattern transfer data, the originally complete Ring is divided into two parts by the first non-metallic area and the second non-metallic area, namely, a first ring body and a second ring body; S6, pattern plating; S7, tinning on the gong plate surface; S8, gong plate, in the gong plate process, the path of the gong cutter passes through the first non-metallic area and the second non-metallic area, that is, the gong cutter will not contact the optimized metal part of the Ring (the first ring body and the second ring body), the resistance of the gong cutter is reduced, and the movement is smoother, thereby reducing the generation of burrs and burrs; S9, film stripping. After the film stripping is completed, it is necessary to focus on checking whether the independent lines with smaller spacing are stripped cleanly; S10, etching, etching the multilayer board after film stripping, removing the metal layer of the half-hole wall, and checking whether there is any residue after etching; S11, target removal and tin stripping. After tin stripping is completed, the tin stripping status needs to be checked. If there is any abnormality, the tin stripping speed should be adjusted in time; S12, post-processing.

[0022] The post-processing comprises the following steps: B1, water washing, washing the circuit board after desoldering; B2, drying, drying the washed circuit board; B3, electrical testing, electrical testing of the circuit board after drying.

[0023] Example 2 Reference Figure 1 The present embodiment provides a processing method for improving the half-hole flashing of a circuit board. When making the circuit board pattern transfer data, the pattern transfer data of the half-hole ring on the surface of the circuit board is optimized, two areas of the half-hole ring pattern are removed, and the half-hole ring is divided into a first ring body and a second ring body, so that two first non-metallic areas and a second non-metallic area are formed at the positions of the two areas removed from the circuit board after the pattern transfer. During the gong process, the gong knife passes through the first non-metallic area and the second non-metallic area between the first ring body and the second ring body.

[0024] The first non-metallic area and the second non-metallic area overlap with the half-hole forming line of the circuit board.

[0025] The center line of the first non-metallic area overlaps with the half-hole forming line, and the center line of the second non-metallic area overlaps with the half-hole forming line. Since the center lines of the two non-metallic areas overlap with the forming line, the first ring body and the second ring body are two symmetrical parts. Specifically, in this embodiment, the forming line of the half hole overlaps with the diameter of the Ring ring, and the first non-metallic area and the second non-metallic area are at two positions where the forming line and the R ring intersect.

[0026] In the gong process of this embodiment, the moving path of the center line of the gong knife overlaps with the half-hole forming line.

[0027] The widths of the first non-metallic area and the second non-metallic area are both 1-1.2 mm. In this embodiment, the width is 1 mm. In specific implementation, the widths of the first non-metallic area and the second non-metallic area can be determined according to the product size and the size of the gong cutter.

[0028] The processing method for improving the flash of half-hole of the circuit board comprises the following steps: A1, prepare pattern transfer data according to the circuit board design data, optimize the pattern transfer data of the half-hole ring on the surface of the circuit board, remove two areas of the half-hole ring pattern, divide the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; A2, making an inner layer board according to the steps in Example 1; A3, lamination, pressing discrete inner layer boards and PP sheets into multilayer boards; A4, drilling, drilling holes in multilayer boards according to the circuit board design data; A5, chemical copper deposition, metallization of the hole wall; A6, outer layer pattern production, the outer layer pattern is produced according to the optimized pattern transfer data. Specifically, in the pattern produced according to the optimized pattern transfer data, the originally complete Ring is divided into two parts by the first non-metallic area and the second non-metallic area, namely, the first ring body and the second ring body; A7, tin-plated on the gong plate surface; A8, gong plate, during the gong plate process, the path of the gong cutter passes through the first non-metallic area and the second non-metallic area, that is, the gong cutter will not contact the optimized metal part of the Ring (the first ring body and the second ring body), the resistance of the gong cutter is reduced, and the movement is smoother, thereby reducing the generation of burrs and burrs; A9, film stripping. After film stripping is completed, it is necessary to focus on checking whether the independent lines with smaller spacing are stripped cleanly; A10, etching, etching the multilayer board after film stripping to remove the metal layer of the half-hole wall; A11, target removal and tin stripping. After tin stripping is completed, the tin stripping status needs to be checked. If there is any abnormality, the tin stripping speed should be adjusted in time; A12, post-processing.

[0029] The post-processing comprises the following steps: B1, water washing, washing the circuit board after desoldering; B2, drying, drying the washed circuit board; B3, electrical testing, electrical testing of the circuit board after drying.

[0030] The present invention optimizes the pattern transfer data and removes two parts of the Ring of the half hole, so that after the pattern transfer, the Ring on the surface of the circuit board is disconnected to form a first non-metallic area and a second non-metallic area. During the gong process, the gong cutter passes through the first non-metallic area and the second non-metallic area, and the gong cutter has less contact with the metal, thereby reducing the resistance of the gong cutter, making the gong cutter move more smoothly, and reducing the generation of burrs and burrs.

[0031] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Although the present invention is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes according to the above content. Therefore, all such substitutions, improvements and changes are included in the scope of the appended claims.

Claims

1. A processing method for improving the flash of half-holes in a circuit board, characterized in that: When making the circuit board pattern transfer data, the pattern transfer data of the half-hole ring on the surface of the circuit board is optimized, two areas of the half-hole ring pattern are removed, and the half-hole ring is divided into a first ring body and a second ring body, so that two first non-metallic areas and a second non-metallic area are formed at the positions of the two areas corresponding to the removal of the circuit board after the pattern transfer. During the gong process, the gong knife passes through the first non-metallic area and the second non-metallic area between the first ring body and the second ring body.

2. The processing method for improving the flash of half-hole of a circuit board according to claim 1 is characterized in that: The first non-metallic area and the second non-metallic area overlap with the half-hole forming line of the circuit board.

3. The processing method for improving the flash of half-hole of a circuit board according to claim 2 is characterized in that: The center line of the first non-metallic area overlaps with the half-hole forming line, and the center line of the second non-metallic area overlaps with the half-hole forming line.

4. The method for improving the flash of half-holes in a circuit board according to claim 1, characterized in that: During the rouging process, the moving path of the center line of the rouging knife overlaps with the half-hole forming line.

5. The processing method for improving half-hole flash of a circuit board according to claim 1, characterized in that: The widths of the first non-metallic area and the second non-metallic area are both 1-1.2 mm.

6. The method for improving the flash of half-holes in a circuit board according to claim 1, characterized in that: The following steps are involved: S1, preparing pattern transfer data according to the circuit board design data, optimizing the pattern transfer data of the half-hole ring on the surface of the circuit board, removing two areas of the half-hole ring pattern, dividing the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; S2, cutting; S3, drilling, drilling according to the circuit board design data; S4, chemical copper deposition to metallize the hole wall; S5, creating graphics according to the optimized graphics transfer data; S6, pattern plating; S7, tinning on the gong plate surface; S8, gong plate, in the gong plate process, the path of the gong knife passes through the first non-metallic area and the second non-metallic area; S9, film removal; S10, etching, etching the multilayer board after film stripping to remove the metal layer of the half-hole wall; S11, target removal and tin stripping; S12, post-processing.

7. The processing method for improving half-hole flash of a circuit board according to claim 1, characterized in that: The processing method for improving the flash of half-hole of the circuit board comprises the following steps: A1, prepare pattern transfer data according to the circuit board design data, optimize the pattern transfer data of the half-hole ring on the surface of the circuit board, remove two areas of the half-hole ring pattern, divide the half-hole ring into a first ring body and a second ring body, so that the positions of the circuit board corresponding to the two removed areas after the pattern transfer form two first non-metallic areas and a second non-metallic area; A2, make inner layer board after cutting; A3, lamination, pressing discrete inner layer boards and PP sheets into multilayer boards; A4, drilling, drilling holes in multilayer boards according to the circuit board design data; A5, chemical copper deposition, metallization of the hole wall; A6, outer layer graphics production, produce outer layer graphics according to optimized graphics transfer data; A7, tin-plated on the gong plate surface; A8, gong plate, in the gong plate process, the path of the gong knife passes through the first non-metallic area and the second non-metallic area; A9, film removal; A10, etching, etching the multilayer board after film stripping to remove the metal layer of the half-hole wall; A11, target removal and tin stripping; A12, post-processing.

8. The method for improving the flash of half-holes in a circuit board according to claim 7, characterized in that: The post-processing comprises the following steps: B1, water washing, washing the circuit board after desoldering; B2, drying, drying the washed circuit board; B3, electrical testing, electrical testing of the circuit board after drying.

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