Optical module shielding case structure embedded with diamond and preparation method of optical module shielding case structure

Abstract

The invention provides an optical module shielding case structure embedded with diamond and a preparation method thereof, and relates to the field of electronic components. The shielding cover is positioned above an optical chip of a PCB (Printed Circuit Board) in the optical module. And performing opening treatment on the shielding cover, embedding the diamond heat dissipation block according to the size, and packaging the diamond heat dissipation block and the optical chip together. Due to the fact that diamond has good heat dissipation performance, the diamond block is adopted to be embedded above the shielding cover, heat dissipation is conducted on the chip under the condition that the electromagnetic shielding effect is not affected, internal and external electromagnetic interference can be shielded for the optical chip in the optical module, and the heat dissipation efficiency of the optical chip can be improved.

Description

Technical Field

[0001] The invention relates to the field of electronic components, and in particular to a diamond-embedded optical module shielding cover structure and a preparation method thereof. Background Art

[0002] The optical chip shield is a device located on the optical module PCB board to protect the optical chip in the optical module. Its specific function is to provide a stable working environment for the optical chip, protect it from internal and external electromagnetic waves, and play a role in shielding electromagnetic signal interference. However, the shield and the optical chip are not closely connected. The air gap in the middle will cause a temperature step, which will produce thermal resistance. When the shield is used, the operating temperature of the optical module chip rises by about 1.6°C compared to when the shield is not used. The temperature difference between the shield and the optical module chip is as high as 20°C. Heat retention will affect the performance of the chip, its working efficiency will be reduced, and the service life of the chip will be shortened. The existing shield on the market will have holes on the top to enhance the heat dissipation effect, but due to the closed internal environment, the heat dissipation capacity can only be enhanced by about 10%. Diamond has good thermal conductivity, and its thermal conductivity coefficient is about 2000W / (m·K). If diamond is embedded in the shield, the heat dissipation performance of the shield can be greatly improved.

[0003] However, the existing shielding covers on the market have the following problems: 1. The closed internal space of the optical module means that even if the shielding cover has holes, it cannot prevent the temperature from accumulating in the internal chip, affecting the performance of the chip. 2. Choosing to use a shielding cover makes it difficult to further improve the heat dissipation performance, which limits the replacement and iteration of product solutions.

[0004] In summary, it is necessary to design a shielding cover that is beneficial to the heat dissipation of the chip. Summary of the invention

[0005] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a diamond-embedded optical module shielding cover structure and a preparation method thereof, which can conduct the temperature inside and outside the shielding cover more efficiently by virtue of the good heat dissipation performance of diamond, reduce the temperature inside the shielding cover, reduce the loss of the product, improve the heat dissipation efficiency of the optical module and extend the service life of the chip. The shielding cover is connected to the diamond heat dissipation block through the design of the card slot and the buckle, and can be installed, removed and replaced separately more easily and efficiently according to the requirements of the product solution, effectively improving the flexibility of the product solution.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A diamond-embedded optical module shielding cover structure comprises: a shielding cover for an optical chip in an optical module and a diamond heat sink embedded on the shielding cover; the shielding cover is designed and manufactured according to the size and dimensions of the optical chip in the optical module, a heat dissipation hole is provided on the top of the shielding cover; a groove for the diamond heat sink to be embedded is provided at the heat dissipation hole; the diamond heat sink is designed and manufactured according to a preset product solution and heat dissipation requirements; a buckle is provided on the diamond heat sink for the shielding cover to be embedded; the diamond heat sink and the groove are connected by pressing and rotating.

[0008] Preferably, the heat dissipation hole is obtained by drilling the shielding cover according to preset product requirements; and the heat dissipation hole is circular.

[0009] Preferably, the shielding cover is made of nickel silver or zinc-tin-nickel alloy.

[0010] Preferably, the shielding cover has a thickness of 0.15 mm.

[0011] Preferably, the diameter of the heat dissipation hole is 0.01 mm to 0.02 mm.

[0012] Preferably, the heat dissipation hole spacing is 0.02 mm.

[0013] Preferably, the slots of the heat dissipation holes are opened in different directions.

[0014] Preferably, the shielding cover is welded on the PCB board of the optical module by using welding technology.

[0015] A method for preparing a diamond-embedded optical module shielding cover structure, comprising:

[0016] Design and plan the size and material of the shield;

[0017] Design and select the size and thickness of metal sheets and determine the processing process;

[0018] According to the size of the shielding cover and the size and thickness of the metal sheet, marking and cutting are performed on the metal sheet;

[0019] After planning and determining the size of the heat dissipation holes required for the shielding cover according to the preset product solution and the heat dissipation requirements of the shielding cover, use a drilling machine to drill on the top of the shielding cover;

[0020] Plan and determine the heat dissipation holes that need to be slotted and the connection method based on the preset product solution and the heat dissipation requirements of the shielding cover;

[0021] Design and plan the bending method and smoothness of the shielding cover according to the preset product solution and the heat dissipation requirements of the shielding cover;

[0022] Design the size and shape of the diamond heat sink block according to the preset product solution, the heat dissipation requirements of the shielding cover, and the size and shape of the heat dissipation holes;

[0023] Determine the size, dimensions and quantity of the required diamond heat dissipation columns and make them according to the preset product solution and the heat dissipation requirements of the shielding cover;

[0024] Connect the shielding cover and the diamond heat sink block according to the connection method designed in the preset product solution;

[0025] The shielding cover covers the optical chip, is placed in a reserved position, and is welded on the PCB board.

[0026] Preferably, the processing procedures include cutting, drilling, bending, welding and surface treatment.

[0027] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0028] The present invention provides a shielding cover structure of an optical module embedded with diamond and a preparation method thereof, the structure comprising: a shielding cover of an optical chip in an optical module and a diamond heat sink embedded on the shielding cover; the shielding cover is designed and manufactured according to the size and dimensions of the optical chip in the optical module, a heat dissipation hole is provided on the top of the shielding cover; a groove for the diamond heat sink to be embedded is provided at the heat dissipation hole; the diamond heat sink is designed and manufactured according to a preset product solution and heat dissipation requirements; a buckle is provided on the diamond heat sink for the shielding cover to be embedded; the diamond heat sink and the groove are connected by pressing and rotating. The present invention has good heat dissipation performance by means of diamond, conducts the temperature inside and outside the shielding cover more efficiently, reduces the temperature inside the shielding cover, reduces the loss of the product, improves the heat dissipation efficiency of the optical module and prolongs the service life of the chip. The shielding cover is connected to the diamond heat sink by the design of the slot and the buckle, and can be installed, removed and replaced separately more simply and efficiently according to the requirements of the product solution, effectively improving the flexibility of the product solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 A schematic diagram of the specific position of the shielding cover provided in an embodiment of the present invention;

[0031] Figure 2 A model diagram provided for an embodiment of the present invention;

[0032] Figure 3 A schematic diagram of the connection between the diamond column and the shielding cover provided in an embodiment of the present invention;

[0033] Description of reference numerals:

[0034] 1-internal shell, 2-shielding cover, 3-optical module chip, 4-PCB board, 5-optical module device, 6-heat dissipation hole, 7-diamond heat dissipation block. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] The purpose of the present invention is to provide a diamond-embedded optical module shielding cover structure and a preparation method thereof, which can conduct the temperature inside and outside the shielding cover more efficiently by virtue of the good heat dissipation performance of diamond, reduce the temperature inside the shielding cover, reduce the loss of the product, improve the heat dissipation efficiency of the optical module and extend the service life of the chip. The shielding cover is connected to the diamond heat dissipation block by the design of the slot and the buckle, and can be installed, removed and replaced separately more simply and efficiently according to the requirements of the product solution, which effectively improves the flexibility of the product solution.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] like Figures 1 to 3As shown, the present invention provides a diamond-embedded optical module shielding cover structure, which is arranged in the internal shell 1 of the optical module, and uses nickel silver material. According to the size of the optical module chip 3, an optical chip shielding cover 2 in the optical module is designed and manufactured, with a size of 3.2mm*0.7mm*1.5mm and a thickness of 0.15mm. Nickel silver is selected as the material. The optical chips in different optical modules can be designed and manufactured according to the specific size of the actual optical chips. According to the product plan and heat dissipation requirements, heat dissipation holes 6 are opened on the shielding cover 2. The diameters of the heat dissipation holes 6 are 0.02mm and 0.1mm, and the minimum hole spacing is set to 0.02mm. The positions and quantities of shielding covers 2 of different sizes should be designed and planned according to the designed size and shape. The connection mode between the diamond heat sink 7 and the shielding cover 2 is designed. In order to ensure that the diamond column and the shielding cover 2 can be closely connected to avoid the diamond heat sink 7 from falling and facilitate subsequent installation and replacement, the connection mode is designed to be a detachable press-rotate interlocking connection, and a card slot is opened at the heat dissipation hole 6. The diamond heat sink 7 and the card slot are press-rotate connected. The card slot is designed to be 0.025mm long in the vertical track and 0.025mm long in the horizontal track. The interlocking mode is designed to enter the horizontal rotation vertically to fix, and the card slot diameter is designed to be a hemispherical type of 0.05mm. The specific size, shape and direction of the card slot can be designed according to the size and shape of the specific shielding cover 2. The card slot should be the same size as the buckle shape and opened in different directions. The diameter of the diamond heat sink 7 is the same as the diameter of the heat dissipation hole 6, the height is 4mm, and a buckle is provided at the connection. The diamond heat sink 7 is interlocked in the heat dissipation hole 6 of the shielding cover 2. The shielding cover 2 with the diamond heat sink 7 interlocked is welded to the PCB board 4 of the optical module. The heat dissipation holes 6 of the shielding cover 2 and the diamond heat dissipation block 7 embedded in the shielding cover 2 described in the present invention can be designed and manufactured according to the requirements of the product solution and the need for heat dissipation, and the detachable design of the diamond heat dissipation block 7 allows it to be disassembled and replaced by itself, which can improve the flexibility of the product. Diamond has good thermal conductivity, can better conduct the temperature inside the optical module shielding cover 2, and can expand the heat dissipation area after the diamond heat dissipation block 7 is embedded, can better improve the heat accumulation inside the shielding cover 2, transfer heat from the diamond heat dissipation column to the outside, strengthen the overall heat dissipation capacity of the optical module chip 3 and the shielding cover 2, stabilize the working state of the optical module device 5, reduce the power consumption and loss of the optical module operation, and extend its service life. Demonstration, the shielding cover 2 is located above the optical module chip 3, welded on the PCB board 4, connected and assembled with other optical module devices 5, and then put on the shell for packaging, wherein the diamond heat dissipation block 7 is embedded and connected with the heat dissipation holes 6 of the shielding cover 2.

[0039] Specifically, the material of the shielding cover 2 is nickel silver or zinc-tin-nickel alloy. The thickness of the shielding cover 2 is 0.15 mm. The processing flow of the shielding cover 2 is cutting, drilling, bending, welding and surface treatment. The specific size of the shielding cover 2 is designed and manufactured according to the size and shape of the optical chip in the specific optical module.

[0040] Optionally, the diameter of the heat dissipation hole 6 is 0.01mm to 0.02mm. The spacing between the heat dissipation holes 6 is about 0.02mm. The shielding cover 2 is cut using a cutting machine. The specific distribution of the heat dissipation holes 6 should be designed and opened according to the product solution and heat dissipation requirements. The shape of the heat dissipation holes 6 can be designed and opened according to the shape of the shielding cover 2 and the requirements of the product solution. The heat dissipation holes 6 are opened using drilling technology.

[0041] Furthermore, the shielding cover 2 is bent using a bending machine and surface treated using a polishing machine.

[0042] Furthermore, the connection method of this embodiment is a detachable slot-and-buckle connection. The opening connection of the shielding cover 2 is provided with a slot to connect the diamond heat sink 7. The heat dissipation holes 6 are opened in different directions.

[0043] Optionally, the material of the diamond heat sink 7 is diamond. The diameters of the heat dissipation holes 6 and the diamond heat sink 7 can be designed according to different product solutions and heat dissipation requirements. A buckle is provided at the connection of the diamond heat sink 7 to connect the shielding cover 2. The height of the diamond heat sink 7 can be designed according to different product solutions and heat dissipation requirements. The shielding cover 2 is welded to the PCB board 4 of the optical module using welding technology.

[0044] As an optional embodiment, the present invention provides a preparation process for a diamond-embedded optical module shielding cover structure, which is a heat sink made of diamond embedded in the optical module shielding cover 2. A card slot is provided in the heat dissipation hole 6 of the shielding cover 2, and a diamond heat dissipation column is provided with a buckle, and the two are pressed and connected. Diamond has good heat dissipation ability and can show excellent thermal conductivity inside the closed optical module device 5. It can effectively conduct the internal temperature of the shielding cover 2 to the shielding cover 2 and the outside of the shielding cover 2 and increase the heat dissipation area, which can effectively alleviate the problem of heat accumulation of the chip inside the shielding cover 2, improve the stability of the working state of the internal device, reduce the power consumption of the product, extend the product life, and reduce the cost of maintenance and replacement. At the same time, the diamond column is easy to disassemble, which is conducive to secondary use and cost saving. The shielding cover 2 itself can shield the electromagnetic interference and electromagnetic signals inside and outside the chip, provide a stable working environment for the chip, improve the performance of the chip, and extend its service life.

[0045] The specific working process of the preparation process is as follows:

[0046] Step 1: Design and plan the size and material of the shielding cover. Different optical module devices can be designed and manufactured according to the size and size of the specific optical chip. Specifically, according to the size of the SPF optical chip of the general optical module, a shielding cover is designed and manufactured with a size of 3.2mm*0.7mm*1.5mm, a thickness of 0.15mm, and a material of nickel silver.

[0047] Step 2: Design and select the size and thickness of the metal plate and determine the processing flow. According to the size and size of the shielding cover of the optical chip in the optical module determined in step 1, select the size and processing technology of the metal plate. Specifically, a 6.5mm*4mm*0.15mm nickel silver metal plate is selected to process and make the shielding cover. The processing flow is cutting, drilling, bending, welding and surface treatment.

[0048] Step 3: Score and cut the selected metal plate. Score and cut the metal plate according to the size and dimensions of the required shielding cover determined in steps 1 and 2. Specifically, draw a 6.4mm*3.9mm rectangle on the metal plate and remove the 1.5mm*1.5mm squares at the four corners. Use a cutting machine to cut the metal plate into the required shape. Considering the errors caused by cutting and bending, reserve an error of about 0.1mm when marking. The specific reserved value should be reserved according to the size of the actual required shielding cover and the accuracy of the cutting technology.

[0049] Step 4: Drill holes in the shielding cover. After planning and determining the size of the heat dissipation holes required for the shielding cover according to the product solution and the heat dissipation requirements of the shielding cover, use a drilling machine to drill holes on the top of the shielding cover. With the same cross-sectional area, the surface area of ​​the cylinder is larger, which can maximize the heat dissipation area, so a cylindrical diamond block is selected as the heat dissipation block. Specifically, according to the size determined in step one, a machine tool is used to open circular holes in the shielding cover. The diameters of the holes are divided into 0.2mm and 0.1mm, and the minimum spacing of the holes is set to 0.02mm. Take the long side of the shielding cover as the x-axis, the short side as the y-axis, and one corner as the origin, and open heat dissipation holes with a diameter of 0.2mm at (0.12, 0.12), (0.12, 0.65), (3.02, 0.12), (3.02, 0.65), (0.34, 0.12), (0.34, 0.65), (0.46, 0.12), and (0.46, 0.65) as the origin, and open heat dissipation holes with a diameter of 0.1mm at (0.12, 0.29), (0.12, 0.41), (3.02, 0.29), (3.02, 0.41), (1, 0.12), (2.2, 0.12), (1, 0.65), and (2.2, 0.65) as the center of the circle. The openings can increase the air circulation area, open up the closed environment where the chip is located, and allow the heat inside the chip to be transferred to the air, avoiding excessive heat retention.

[0050] Step 5: Slot the shielding cover. According to the product plan and the heat dissipation requirements of the shielding cover, plan and determine the heat dissipation holes that need to be slotted and determine their connection methods, and open a slot for the diamond heat dissipation column to be embedded in the side wall of the circular hole of the shielding cover. Specifically, this solution selects four heat dissipation blocks with a diameter of 0.2mm, (0.12, 0.12), (0.12, 0.65), (3.02, 0.12), and (3.02, 0.65) and two heat dissipation holes with a diameter of 0.1mm, (1, 0.12) and (2.2, 0.12) using a drilling machine for slotting, and determine that the diamond heat dissipation column and the slot are press-rotate connections. The slot is designed to be vertical and horizontal, with a vertical track length of 0.025mm and a horizontal track length of 0.025mm. The slot is hemispherical in shape with a diameter designed to be 0.05mm. The buckle enters the horizontal direction and rotates to fix it. Since the optical module is pluggable, the inside of the optical module will be squeezed during the plugging and unplugging process. It is necessary to calculate the connection area and method between the diamond column and the slot and buckle in the shielding cover to ensure that the diamond column and the shielding cover can be tightly connected to avoid the diamond column falling during use.

[0051] Step 6: Bend and surface treat the shielding cover. According to the product solution requirements, design and plan the bending method and smoothness of the shielding cover. Specifically, use a bending machine to mechanically bend the shielding cover, fix the bent shielding cover on a polishing machine, apply an appropriate amount of polishing liquid, and use a polishing machine to polish.

[0052] Step seven: Design the size and shape of the diamond heat sink. Design the size and shape of the diamond heat sink according to the heat dissipation requirements of the product solution and the size and shape of the shielding cover holes. Specifically, according to steps four and five, two diamond heat sink columns are designed with diameters of 0.2mm and 0.1mm and a length of 0.5mm. Reserve a clip on the heat sink column. To ensure that the diamond column and the shielding cover can be tightly connected, the clip diameter is designed to be 0.05mm, the shape is hemispherical, and the position is reserved on the busbar of the diamond heat sink column.

[0053] Step 8: Prepare diamond heat dissipation columns. Determine the size, dimensions and quantity of the required diamond heat dissipation columns according to the product plan and heat dissipation requirements and make them. Specifically, according to steps 4, 5 and 6, make 4 diamond heat dissipation columns with a diameter of 0.2mm and 2 diamond heat dissipation columns with a diameter of 0.1mm. Use laser cutting to cut the diamond block into the required size and shape, and use the designed hemispherical buckle during the cutting process.

[0054] Step 9: Fit the shielding cover and the diamond heat sink. Connect the shielding cover and the diamond heat sink according to the connection method designed in the product solution. Specifically, the shielding cover slot and the diamond heat sink buckle cut and reserved in this solution are pressed and rotated to connect the two. The detachable structure is designed to facilitate the installation and disassembly of the diamond heat sink and subsequent recycling.

[0055] Step 10: Solder the shielding cover to the panel. Cover the optical chip with the shielding cover, place it in the reserved position, and solder it to the PCB.

[0056] According to the optical module shielding cover with embedded diamond heat dissipation column of the present invention, with the help of diamond having good heat dissipation performance, the temperature inside and outside the shielding cover is conducted more efficiently, the temperature inside the shielding cover is reduced, the loss of the product is reduced, the heat dissipation efficiency of the optical module is improved, and the service life of the chip is extended. The shielding cover is connected to the diamond heat dissipation block through the design of the card slot and the buckle, and can be installed, removed and replaced separately more simply and efficiently according to the requirements of the product solution, which effectively improves the flexibility of the product solution.

[0057] The beneficial effects of the present invention are as follows:

[0058] The present invention uses the excellent thermal conductivity of diamond. Compared with the original opening, the embedded diamond heat sink can enhance the heat dissipation capacity to a greater extent. Under the premise that the temperature of the shielding cover chip is 20°C different from the temperature of the shielding cover, each embedded diamond heat sink column with a diameter of 0.2mm and a height of 0.5mm can improve the heat dissipation capacity of the original shielding cover by about 8.25%, thereby reducing product loss. The diamond heat sink block that can be independently disassembled and installed in the optical module shielding cover can be designed and embedded according to the needs of heat dissipation, making the heat dissipation solution of this shielding cover more convenient and efficient. By opening heat dissipation holes or installing on the original heat dissipation holes, the flexibility of the product solution is effectively improved and the cost is reduced.

[0059] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0060] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A diamond-embedded optical module shielding cover structure, characterized in that: include: A shielding cover for an optical chip in an optical module and a diamond heat sink embedded in the shielding cover; The shielding cover is designed and manufactured according to the size and dimensions of the optical chip in the optical module. A heat dissipation hole is provided on the top of the shielding cover. A groove is provided at the heat dissipation hole for the diamond heat dissipation block to be embedded. The diamond heat sink block is designed and manufactured according to a preset product solution and heat dissipation requirements; a buckle is provided on the diamond heat sink block for the shield cover to be engaged; the diamond heat sink block and the groove are connected by pressing and rotating.

2. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The heat dissipation hole is obtained by drilling the shielding cover according to preset product requirements; the heat dissipation hole is circular.

3. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The material of the shielding cover is nickel silver or zinc-tin-nickel alloy.

4. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The thickness of the shielding cover is 0.15 mm.

5. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The diameter of the heat dissipation hole is 0.01 mm to 0.02 mm.

6. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The heat dissipation hole spacing is 0.02mm.

7. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The slots of the heat dissipation holes are opened in different directions.

8. The optical module shielding cover structure embedded with diamond according to claim 1, characterized in that: The shielding cover is welded on the PCB board of the optical module by welding technology.

9. A method for preparing a diamond-embedded optical module shielding cover structure, characterized in that: include: Design and plan the size and material of the shield; Design and select the size and thickness of metal sheets and determine the processing process; According to the size of the shielding cover and the size and thickness of the metal sheet, marking and cutting are performed on the metal sheet; After planning and determining the size of the heat dissipation holes required for the shielding cover according to the preset product solution and the heat dissipation requirements of the shielding cover, use a drilling machine to drill on the top of the shielding cover; Plan and determine the heat dissipation holes that need to be slotted and the connection method based on the preset product solution and the heat dissipation requirements of the shielding cover; Design and plan the bending method and smoothness of the shielding cover according to the preset product solution and the heat dissipation requirements of the shielding cover; Design the size and shape of the diamond heat sink block according to the preset product solution, the heat dissipation requirements of the shielding cover, and the size and shape of the heat dissipation holes; Determine the size, dimensions and quantity of the required diamond heat dissipation columns and make them according to the preset product solution and the heat dissipation requirements of the shielding cover; Connect the shielding cover and the diamond heat sink block according to the connection method designed in the preset product solution; The shielding cover covers the optical chip, is placed in a reserved position, and is welded on the PCB board.

10. The method for preparing a diamond-embedded optical module shielding cover structure according to claim 9, characterized in that: The processing procedures include cutting, drilling, bending, welding and surface treatment.

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