Cleaning equipment for semiconductor processing

Abstract

The invention discloses a cleaning device for semiconductor processing, the cleaning device for semiconductor processing is used for cleaning wafers, the cleaning device for semiconductor processing comprises a machine body, a first cleaning assembly, a placing box, a clamping assembly and a second cleaning assembly, the first cleaning assembly is used for cleaning fine particles on the surfaces of the wafers, and the first cleaning assembly comprises a pair of mounting plates; the pair of mounting plates are symmetrically and fixedly connected to an upper panel of the machine body, rotating wheels are rotationally connected to the mounting plates, a first transmission belt is arranged on the rotating wheels, a plurality of fixing blocks are fixedly connected to the side wall of the first transmission belt, and wafers are placed on the pair of fixing blocks. Compared with the prior art, the cleaning equipment for semiconductor processing has the advantages that assembly line type cleaning of wafers can be achieved, the cleaning efficiency is greatly improved, the production time and cost are reduced, particles and organic pollutants on the surfaces of the wafers can be effectively removed at the same time, the cleaning quality is remarkably improved, and the service life of the wafers is prolonged. Therefore, the technical progress and development of the semiconductor industry are effectively promoted.

Description

Technical Field

[0001] The present invention belongs to the technical field of cleaning equipment for semiconductor processing, and in particular relates to cleaning equipment for semiconductor processing. Background Art

[0002] The main purpose of wafer cleaning is to remove contaminants on the surface and inside of the wafer to ensure high purity and quality. During the processing, forming and polishing of the wafer, the wafer will come into contact with various organic matter, particles and metals, which will affect the performance and reliability of the chip. Therefore, the cleaning process is essential to ensure the purity of the wafer and reduce the occurrence of defects.

[0003] Current wafer cleaning technologies mainly include dry cleaning and wet cleaning. Dry cleaning is suitable for removing particles on the surface of the wafer, but it is not effective in removing organic pollutants. Wet cleaning can effectively remove organic matter, but it has limited effect on removing fine particles and may form new pollution. At the same time, these two cleaning methods cannot clean the wafer in an assembly line, resulting in low cleaning efficiency, increased production costs and time consumption. The above-mentioned deficiencies not only affect the production and product quality of enterprises, but also restrict the further development of the semiconductor industry to a certain extent.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a cleaning equipment for semiconductor processing.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] The purpose of the present invention is to provide a cleaning equipment for semiconductor processing, which can realize assembly-line cleaning of wafers, not only greatly improving the cleaning efficiency and reducing production time and cost, but also can effectively remove particles and organic pollutants on the surface of the wafer at the same time, significantly improving the cleaning quality, thereby effectively promoting technological progress and development of the semiconductor industry.

[0007] In order to achieve the above-mentioned object, a specific embodiment of the present invention provides a semiconductor processing cleaning device for cleaning wafers. The semiconductor processing cleaning device includes a body and further includes:

[0008] A first cleaning assembly, the first cleaning assembly is used to clean fine particles on the surface of the wafer, the first cleaning assembly includes a pair of mounting plates, the pair of mounting plates are symmetrically fixedly connected to the upper panel of the body, the mounting plates are rotatably connected to a rotating wheel, the rotating wheel is provided with a first transmission belt, a plurality of fixed blocks are fixedly connected to the side wall of the first transmission belt, the wafer is placed on the pair of fixed blocks, the pair of mounting plates are rotatably connected to a pair of cleaning wheels, and the pair of cleaning wheels are arranged on the upper and lower sides of the fixed blocks;

[0009] A placement box, wherein there are multiple placement boxes, and multiple partitions are provided on the placement box, and the partitions divide the placement box into multiple spaces for placing wafers;

[0010] A clamping assembly, the clamping assembly is used to take the wafers on the pair of fixed blocks, and the clamping assembly can take the wafers on the pair of fixed blocks into the placement space on the placement box;

[0011] The second cleaning component comprises an ultrasonic cleaning machine, and the ultrasonic cleaning machine is provided with a cleaning box matching the placement box.

[0012] In one or more embodiments of the present invention, placement grooves are provided on the fixing block, the wafer is placed in a pair of placement grooves, and the groove walls of the placement grooves are wrapped with cleaning cloths.

[0013] In one or more embodiments of the present invention, a cleaning brush is integrally formed on the cleaning wheel, the cleaning brush is inclined to the axis of the cleaning wheel, and the rotation speed and rotation direction of a pair of cleaning wheels are different.

[0014] In one or more embodiments of the present invention, the clamping assembly includes a walking frame, which is fixedly connected to a pair of mounting plates, a slide rail is fixedly connected to the upper plate of the walking frame, an electronic slider is slidably connected to the slide rail, a second cylinder is fixedly connected to the electronic slider, and a manipulator is installed on the second cylinder.

[0015] In one or more embodiments of the present invention, a second transmission belt is installed on the upper panel of the body, an opening matching the second transmission belt is opened on the body, a third cylinder is installed on the body, and a pair of plugs are slidably connected to the third cylinder.

[0016] In one or more embodiments of the present invention, a pair of guide blocks are installed on opposite sides of the second transmission belt, and slots matching with the insert blocks are formed on the guide blocks, and the insert blocks pass through the slots.

[0017] In one or more embodiments of the present invention, the ultrasonic cleaning machine is installed in a machine body, and the ultrasonic cleaning machine matches an opening on the machine body.

[0018] In one or more embodiments of the present invention, a fourth cylinder is installed in the ultrasonic cleaning machine, and the fourth cylinder passes through the ultrasonic cleaning machine and the cleaning box. A support plate is fixedly connected to one end of the fourth cylinder passing through the cleaning box, and the size of the support plate matches the distance between a pair of plug blocks.

[0019] In one or more embodiments of the present invention, a first conveyor belt and a first cylinder are installed in the machine body, the heights of the first conveyor belt and the first cylinder are flush with the upper end surface of the cleaning box, and a push plate is fixedly connected to the first cylinder, and the push plate matches the placement box.

[0020] In one or more embodiments of the present invention, a filter and a pressure pump are installed in the ultrasonic cleaning machine, a first liquid guide tube is installed on the filter, and an end of the first liquid guide tube away from the filter is connected to the cleaning box, a second liquid guide tube and a third liquid guide tube are installed on the pressure pump, an end of the second liquid guide tube away from the pressure pump is connected to the filter, and an end of the third liquid guide tube away from the pressure pump is connected to the cleaning box.

[0021] Compared with the prior art, the cleaning equipment for semiconductor processing of the present invention can realize assembly-line cleaning of wafers, which not only greatly improves the cleaning efficiency and reduces production time and cost, but also can effectively remove particles and organic pollutants on the surface of the wafer at the same time, significantly improving the cleaning quality, thereby effectively promoting technological progress and development of the semiconductor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic structural diagram of a semiconductor processing cleaning device according to an embodiment of the present invention;

[0024] Figure 2 A partial cross-sectional view of a first cleaning component and a clamping component of a semiconductor processing cleaning device according to an embodiment of the present invention;

[0025] Figure 3 A top view of a fixing block of a semiconductor processing cleaning device according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic structural diagram of a cleaning wheel for semiconductor processing cleaning equipment according to an embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of the installation of a third cylinder and a second transmission belt of a semiconductor processing cleaning device in one embodiment of the present invention;

[0028] Figure 6 for Figure 5 The structural diagram at A in the middle;

[0029] Figure 7 A partial cross-sectional view of a semiconductor processing cleaning device in use according to an embodiment of the present invention;

[0030] Figure 8 for Figure 7 Schematic diagram of the structure at B in the middle;

[0031] Fig. 9 The cross-sectional view is a semiconductor processing cleaning device of an ultrasonic cleaning machine according to an embodiment of the present invention.

[0032] Description of main reference numerals:

[0033] 1. Machine body; 101. opening; 11. first conveyor belt; 12. first cylinder; 121. push plate; 2. mounting plate; 21. rotating wheel; 22. first transmission belt; 23. cleaning wheel; 231. cleaning brush; 24. fixing block; 241. placement slot; 242. cleaning cloth; 3. walking frame; 31. slide rail; 32. electronic slider; 33. second cylinder; 34. manipulator; 4. second transmission belt; 41. guide block; 411. slot; 5. third cylinder; 51. insert block; 6. placement box; 61. partition; 7. ultrasonic cleaning machine; 71. cleaning box; 72. fourth cylinder; 721. support plate; 73. filter; 731. first liquid guide tube; 74. pressure pump; 741. second liquid guide tube; 742. third liquid guide tube. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] like Figures 1 to 8As shown, a semiconductor processing cleaning device in one embodiment of the present invention is used for cleaning wafers. The semiconductor processing cleaning device includes a body 1, on which a first cleaning component, a placement box 6, a clamping component and a second cleaning component are installed. Among them, the first cleaning component is used to clean fine particles on the surface of the wafer. The first cleaning component includes a pair of mounting plates 2, and the pair of mounting plates 2 are symmetrically welded on the upper panel of the body 1. A rotating wheel 21 is rotatably connected to the mounting plate 2, and a first transmission belt 22 is provided on the rotating wheel 21. A plurality of fixed blocks 24 are integrally formed on the side wall of the first transmission belt 22. The wafer is placed on a pair of fixed blocks 24, and a pair of cleaning wheels 23 are rotatably connected to a pair of mounting plates 2. A pair of cleaning wheels 23 are arranged on the upper and lower sides of the fixed block 24.

[0036] Specifically, the fixing block 24 is provided with a placement groove 241, and the wafer is placed in a pair of placement grooves 241. The groove wall of the placement groove 241 is wrapped with a cleaning cloth 242. A cleaning brush 231 is integrally formed on the cleaning wheel 23, and the cleaning brush 231 is inclined to the axis of the cleaning wheel 23. The rotation speed of the pair of cleaning wheels 23 is different.

[0037] Specifically, in order to clean the particles on the surface of the wafer, when cleaning the surface of the wafer, the wafer is placed in the placement groove 241 on the pair of fixed blocks 24, and the wafer gradually enters the pair of cleaning wheels 23 as the rotating wheel 21 rotates. When the wafer is in the middle position of the pair of cleaning wheels 23, the pair of cleaning wheels 23 rotates, and the cleaning brushes 231 on the cleaning wheels 23 can sweep away the particles on the upper and lower surfaces of the wafer.

[0038] It is worth noting that, since a portion of the lower surface of the wafer contacts the bottom wall of the placement groove 241, when the cleaning wheel 23 at the bottom rotates, the portion of the lower surface of the wafer blocked by the placement groove 241 cannot contact the cleaning brush 231. In order to solve this problem, 231 is tilted to the axis of the cleaning wheel 23, and the rotation speed and rotation direction of the pair of cleaning wheels 23 are different.

[0039] Specifically, when the pair of cleaning wheels 23 rotates, due to the friction between the cleaning brush 231 and the surface of the wafer, the tilted cleaning brush 231 can rotate the wafer in the placement slot 241, so that the part of the wafer blocked by the bottom wall of the placement slot 241 can be rotated out, and the cleaning brush 231 can clean the lower end surface of the wafer. The rotation speed and direction of the pair of cleaning wheels 23 are different, so that the friction forces on the upper and lower surfaces of the wafer are in opposite directions, that is, the wafer can be rotated slowly in the pair of placement slots 241, and the friction between the upper and lower surfaces of the wafer and the cleaning brush 231 can be increased, which can better clean the particles firmly bonded to the surface of the wafer. In this way, even if the rotation speed of the pair of cleaning wheels 23 is accelerated, the rotation speed of the wafer in the placement slot 241 can be kept constant and will not rotate too fast.

[0040] When there are many particles on the wafer surface, or the particles are firmly bonded, the rotation speed of the pair of cleaning wheels 23 can be adjusted according to the situation to speed up the speed. When there are few particles on the wafer surface and it is easy to clean, the rotation speed of the pair of cleaning wheels 23 can be slowed down.

[0041] At the same time, the cleaning cloth 242 wrapped on the wall of the placement groove 241 can rub the side of the wafer during the rotation of the wafer. Furthermore, the rotating wheel 21 is a step-by-step rotation, which can make the wafer stay between a pair of cleaning wheels 23 for a set time. There is no need for multiple dry cleaning equipment, nor is there a need to flip the wafer. The particles on the upper and lower end faces and the side faces of the wafer can be cleaned at one time, greatly improving production efficiency.

[0042] In order to realize continuous production in an assembly line, the wafers cleaned by the pair of cleaning wheels 23 need to be transferred to a second cleaning assembly, and the organic pollutants on the surface of the wafers need to be removed by the second cleaning assembly.

[0043] like Figure 2 , Figure 3 , Figure 7 and Figure 8 As shown, there are multiple placement boxes 6, and multiple partitions 61 are provided on the placement box 6. The partitions 61 divide the placement box 6 into multiple spaces for placing wafers. The clamping assembly is used to take the wafers on a pair of fixed blocks 24, and the clamping assembly can take the wafers on a pair of fixed blocks 24 to the placement space on the placement box 6. Among them, the clamping assembly includes a walking frame 3, the walking frame 3 is welded on a pair of mounting plates 2, a slide rail 31 is welded on the upper panel of the walking frame 3, an electronic slider 32 is slidably connected to the slide rail 31, a second cylinder 33 is installed on the electronic slider 32, and a manipulator 34 is installed on the second cylinder 33.

[0044] Specifically, the wafer in the placement groove 241 gradually moves to the rotating wheel 21 near one end of the walking frame 3 as the rotating wheel 21 rotates step by step. When the fixed block 24 is perpendicular to the horizontal line, the wafer in the placement groove 241 is also in a vertical state. Because the extension line of a pair of placement grooves 241 is circular, the wafer can be stuck in a pair of placement grooves 241 and will not fall off. At this time, the electronic slider 32 slides on the slide rail 31 to the top of the wafer in a vertical state, and the second cylinder 33 starts to extend. The manipulator 34 installed on the second cylinder 33 can clamp the wafer and then move it to the top of the placement box 6. The second cylinder 33 extends again to place the wafer in the placement space formed by the two partitions 61. Then the second cylinder 33 retracts, and the electronic slider 32 slides on the slide rail 31 again to the top of the next wafer in a vertical state. In this way, the first cleaning component and the clamping component can be seamlessly connected to improve production efficiency.

[0045] When the placement space on the placement box 6 is full, the placement box 6 needs to be transferred to the second cleaning component for cleaning. Figures 5 to 9 As shown, the machine body 1 is provided with an opening 101 matching with the second transmission belt 4, the machine body 1 is provided with a third cylinder 5, and a pair of inserting blocks 51 are slidably connected to the third cylinder 5. Specifically, the placement box 6 is placed in the opening 101, the pair of inserting blocks 51 on the third cylinder 5 slide out from the third cylinder 5, and the placement box 6 is placed on the pair of inserting blocks 51, so that the placement box 6 will not fall from the opening 101.

[0046] The second cleaning assembly includes an ultrasonic cleaning machine 7, which is installed in the machine body 1 and is located directly below the opening 101. The ultrasonic cleaning machine 7 is provided with a cleaning box 71 that matches the placement box 6. A fourth cylinder 72 is installed in the ultrasonic cleaning machine 7, and the fourth cylinder 72 passes through the ultrasonic cleaning machine 7 and the cleaning box 71. A support plate 721 is welded to one end of the fourth cylinder 72 that passes through the cleaning box 71, and the size of the support plate 721 matches the distance between the pair of plug blocks 51.

[0047] Specifically, when the placement space on the placement box 6 is full of wafers, the fourth cylinder 72 starts to lift upward. When the upper end surface of the support plate 721 is connected to the lower end surface of the placement box 6, it will also lift upward to separate the placement box 6 from the plug block 51. At this time, the third cylinder 5 is started, the plug block 51 shrinks into the third cylinder 5, and then the fourth cylinder 72 shrinks, and the support plate 721 carries the placement box 6 and moves downward to the cleaning box 71. The cleaning box 71 is filled with cleaning liquid, which can soak the wafers in the placement box 6 while the ultrasonic wave can also clean the organic pollutants on the surface of the wafer.

[0048] Furthermore, a second transmission belt 4 is installed on the upper panel of the machine body 1, and a pair of guide blocks 41 are installed on opposite sides of the second transmission belt 4. A slot 411 matching the insert block 51 is opened on the guide block 41, and the insert block 51 passes through the slot 411. Specifically, a plurality of placement boxes 6 are placed on the second transmission belt 4. When the placement box 6 in the opening 101 is carried by the pallet 721 to the cleaning box 71 for ultrasonic cleaning, the third cylinder 5 is started to withdraw the insert block 51 from the third cylinder 5, so that the insert block 51 is re-erected in the opening 101, and then the second transmission belt 4 is started, and the placement box 6 closest to the opening 101 on the second transmission belt 4 will be pushed into the opening 101 by the placement box 6 behind it and fall on the insert block 51. At this time, the wafer cleaned by the cleaning wheel 23 can be placed in the placement space on the placement box 6 through the clamping assembly. Flow line production is realized.

[0049] At the same time, because the guide blocks 41 are installed on both sides of the second transmission belt 4, they can guide the placement box 6, so that the placement box 6 on the second transmission belt 4 can accurately enter the opening 101. Furthermore, the bottom wall of the slots 411 provided on the pair of guide blocks 41 is in contact with the lower end surface of the insert block 51, which can support the insert block 51 and prevent the placement box 6 from being overweight after being filled with wafers, thereby extending the service life of the insert block 51.

[0050] Furthermore, the first conveyor belt 11 and the first cylinder 12 are installed in the machine body 1, and the heights of the first conveyor belt 11 and the first cylinder 12 are flush with the upper end surface of the cleaning box 71. The push plate 121 matches the placement box 6. Specifically, after the wafers in the cleaning box 71 are cleaned, the fourth cylinder 72 is started to lift the placement box 6 in the cleaning box 71 upward until it is flush with the upper end surface of the cleaning box 71. At this time, the first cylinder 12 is started to push the placement box 6 on the support plate 721 onto the first conveyor belt 11, and the first conveyor belt 11 is transported to the drying process for drying.

[0051] Furthermore, a push plate 121 is integrally formed on the first cylinder 12. Because when the first cylinder 12 is started, the push plate 121 can clamp the opposite side wall of the placement box 6, so that the placement box 6 can remain parallel to the first conveyor belt 11 when it is pushed onto the first conveyor belt 11, preventing the placement box 6 from falling when being transported on the first conveyor belt 11.

[0052] When the placement box 6 on the support plate 721 is pushed onto the first conveyor belt 11, the first cylinder 12 retracts, and the push plate 121 moves away from the top of the support plate 721. At this time, the placement box 6 in the opening 101 has been loaded with wafers, and the fourth cylinder 72 starts to extend upward, so that the support plate 721 lifts the placement box 6 in the opening 101 again, and the insert block 51 retracts. The new placement box 6 is again carried by the support plate 721 to the cleaning box 71 for cleaning. In this way, both the wafer can be cleaned thoroughly and the wafer can be cleaned in an assembly line manner.

[0053] It is worth noting that, since the cleaning box 71 contains cleaning liquid, when the ultrasonic cleaning machine 7 cleans the placement box 6 in the cleaning box 71, the support plate 721 and the placement box 6 are both immersed in the cleaning liquid. When the fourth cylinder 72 starts to lift upward, the support plate 721 and the placement box 6 are all in the cleaning liquid. When the fourth cylinder 72 moves upward to lift the placement box 6 on the cleaning box 71, the cleaning liquid on the support plate 721 and the placement box 6 will be carried out, and the cleaning liquid will be spilled in the machine body 1, which will not only waste the cleaning liquid but also cause short circuit damage to the electrical components in the machine body 1.

[0054] In order to solve the above problems, Figure 8 and Fig. 9As shown, a filter 73 and a pressure pump 74 are installed in the ultrasonic cleaning machine 7, a first liquid guide tube 731 is installed on the filter 73, and an end of the first liquid guide tube 731 away from the filter 73 is connected to the cleaning box 71, a second liquid guide tube 741 and a third liquid guide tube 742 are installed on the pressure pump 74, an end of the second liquid guide tube 741 away from the pressure pump 74 is connected to the filter 73, and an end of the third liquid guide tube 742 away from the pressure pump 74 is connected to the cleaning box 71.

[0055] Specifically, after the wafers in the cleaning box 71 are cleaned, the filter 73 starts to extract the cleaning liquid in the cleaning box 71, so that all the cleaning liquid in the cleaning box 71 enters the filter 73. In this way, only a small amount of cleaning liquid remains on the support plate 721 and the placement box 6, and will not spill into the machine body 1.

[0056] Furthermore, when the placement box 6 loaded on the support plate 721 enters the cleaning box 71, the pressure pump 74 is started to extract the filtered cleaning liquid from the filter 73 and discharge it into the cleaning box 71. This can prevent the placement box 6 and the support plate 721 from carrying too much cleaning liquid, and can also maintain the cleanliness of the cleaning liquid in the cleaning box 71. It is worth noting that a sealing ring is encapsulated at the contact point between the cleaning box 71 and the fourth cylinder 72, which can prevent leakage at the connection point between the fourth cylinder 72 and the cleaning box 71.

[0057] When using, Figures 1 to 9 As shown, the wafers to be cleaned are placed one by one in a pair of placement grooves 241 manually or mechanically, and the rotating wheel 21 rotates to transport the wafers in the placement grooves 241 one by one to between a pair of cleaning wheels 23. The pair of cleaning wheels 23 can clean the particles on the upper and lower end surfaces and side walls of the wafers.

[0058] The wafer cleaned by the cleaning wheel 23 is transported to the placement space on the placement box 6 through the clamping assembly, and then transported into the cleaning box 71 through the fourth cylinder 72. The ultrasonic cleaning machine 7 is started to clean the organic pollutants on the wafer. The cleaned wafer is transported to the next process through the first conveyor belt 11.

[0059] Compared with the prior art, the cleaning equipment for semiconductor processing of the present invention can realize assembly-line cleaning of wafers, which not only greatly improves the cleaning efficiency and reduces production time and cost, but also can effectively remove particles and organic pollutants on the surface of the wafer at the same time, significantly improving the cleaning quality, thereby effectively promoting technological progress and development of the semiconductor industry.

[0060] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0061] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor processing cleaning device for cleaning wafers, the semiconductor processing cleaning device comprising a body, characterized in that: Also includes: A first cleaning assembly, the first cleaning assembly is used to clean fine particles on the surface of the wafer, the first cleaning assembly includes a pair of mounting plates, the pair of mounting plates are symmetrically fixedly connected to the upper panel of the body, the mounting plates are rotatably connected to a rotating wheel, the rotating wheel is provided with a first transmission belt, a plurality of fixed blocks are fixedly connected to the side wall of the first transmission belt, the wafer is placed on the pair of fixed blocks, the pair of mounting plates are rotatably connected to a pair of cleaning wheels, and the pair of cleaning wheels are arranged on the upper and lower sides of the fixed blocks; A placement box, wherein there are multiple placement boxes, and multiple partitions are provided on the placement box, and the partitions divide the placement box into multiple spaces for placing wafers; A clamping assembly, the clamping assembly is used to take the wafers on the pair of fixed blocks, and the clamping assembly can take the wafers on the pair of fixed blocks into the placement space on the placement box; The second cleaning component comprises an ultrasonic cleaning machine, and the ultrasonic cleaning machine is provided with a cleaning box matching the placement box.

2. A semiconductor processing cleaning device according to claim 1, characterized in that: The fixing block is provided with placement grooves, the wafers are placed in a pair of placement grooves, and the groove walls of the placement grooves are wrapped with cleaning cloths.

3. A semiconductor processing cleaning equipment according to claim 2, characterized in that: A cleaning brush is integrally formed on the cleaning wheel, and the cleaning brush is inclined to the axis of the cleaning wheel. The rotation speed and rotation direction of a pair of cleaning wheels are different.

4. A semiconductor processing cleaning device according to claim 1, characterized in that: The clamping assembly includes a traveling frame, which is fixedly connected to a pair of mounting plates, a slide rail is fixedly connected to the upper plate of the traveling frame, an electronic slider is slidably connected to the slide rail, a second cylinder is fixedly connected to the electronic slider, and a manipulator is installed on the second cylinder.

5. A semiconductor processing cleaning device according to claim 1, characterized in that: A second transmission belt is installed on the upper panel of the machine body, an opening matching the second transmission belt is opened on the machine body, a third cylinder is installed on the machine body, and a pair of plug blocks are slidably connected to the third cylinder.

6. A semiconductor processing cleaning device according to claim 5, characterized in that: A pair of guide blocks are installed on opposite sides of the second transmission belt. A slot matching the insert block is provided on the guide block, and the insert block passes through the slot.

7. A semiconductor processing cleaning device according to claim 5, characterized in that: The ultrasonic cleaning machine is installed in the machine body, and the ultrasonic cleaning machine matches the opening on the machine body.

8. A semiconductor processing cleaning device according to claim 7, characterized in that: A fourth cylinder is installed in the ultrasonic cleaning machine, and the fourth cylinder passes through the ultrasonic cleaning machine and the cleaning box. A support plate is fixedly connected to one end of the fourth cylinder passing through the cleaning box, and the size of the support plate matches the distance between a pair of plug blocks.

9. A semiconductor processing cleaning device according to claim 8, characterized in that: A first conveyor belt and a first cylinder are installed in the machine body. The heights of the first conveyor belt and the first cylinder are flush with the upper end surface of the cleaning box. A push plate is fixedly connected to the first cylinder, and the push plate matches the placement box.

10. A semiconductor processing cleaning device according to claim 9, characterized in that: A filter and a pressure pump are installed in the ultrasonic cleaning machine. A first liquid guide tube is installed on the filter, and an end of the first liquid guide tube away from the filter is connected to the cleaning box. A second liquid guide tube and a third liquid guide tube are installed on the pressure pump, and an end of the second liquid guide tube away from the pressure pump is connected to the filter, and an end of the third liquid guide tube away from the pressure pump is connected to the cleaning box.

Images