Control method and control equipment for gas flow in cavity in attaching machine, silicon wafer and attaching machine

Abstract

The embodiment of the invention relates to the technical field of semiconductor manufacturing, and discloses a cavity gas flow control method and control equipment in an attaching machine, a silicon wafer and the attaching machine. In the silicon wafer attaching process, the method comprises the steps that in the operation process of an attaching machine, a first draught fan filtering unit, a second draught fan filtering unit and a third draught fan filtering unit are turned on, so that a second cavity is in a micro-positive pressure state relative to a third cavity, and the second cavity is in a micro-positive pressure state relative to a first cavity; and a sixth fan filtering unit and a seventh fan filtering unit are closed, so that the condition of gas turbulence in the third cavity is avoided. By the adoption of the scheme, stable gas flow can be formed in the cavity in the attaching machine, gas turbulence is avoided, the cleanliness in the attaching machine can be improved, and the problem of shallow pits caused by particle attachment is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a chamber gas flow control method, control equipment, silicon wafer and bonding machine in a bonding machine. Background Art

[0002] In recent years, with the rapid development of Internet technology, the field of semiconductor manufacturing has developed rapidly.

[0003] During the preparation of silicon wafers, polishing is required to remove the tiny bumps and damage layers on the surface of the silicon wafer to ensure the uniformity of the thickness and surface smoothness of the silicon wafer and obtain good flatness. Before polishing the semiconductor silicon wafer, the back of the silicon wafer must be attached to the ceramic disk. The process we adopt is wax attachment. If there are large particles on the back of the silicon wafer during attachment, the vacuum treatment and pressure will cause protrusions on the surface of the silicon wafer. During the polishing process, the surface will be smoothed and the protrusions will be removed to make the silicon wafer thinner at that position. After the silicon wafer is peeled off, the stress will recover and small pits will appear on the original protrusions, commonly known as shallow pits. Therefore, the defects on the back are reflected on the front and shallow pit defects are formed. Before attachment, we will clean the silicon wafer and remove the particles on the surface of the silicon wafer as much as possible. After the silicon wafer enters the attachment machine, if the internal environment of the attachment machine is not clean enough, resulting in more particles settling on the back of the silicon wafer, especially large particles, it is very likely to cause shallow pit defects in subsequent processes. Summary of the invention

[0004] One purpose of the present application is to provide a chamber gas flow control method, control equipment, silicon wafer and laminating machine in a laminating machine, at least to solve the problem of shallow pits caused by particle contamination during the polishing process of silicon wafers. In the present application, the laminating machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the laminating machine are arranged above the second chamber to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the laminating machine are arranged below the second chamber to make the gas flow out of the second chamber. By adopting this scheme, a stable gas flow can be formed in the chamber inside the laminating machine to avoid gas turbulence, improve the cleanliness inside the laminating machine, and reduce the problem of shallow pits caused by particle attachment.

[0005] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0006] In the first aspect, some embodiments of the present application further provide a method for controlling chamber gas flow in a pasting machine, wherein the pasting machine includes a first chamber, a second chamber, and a third chamber, wherein the first fan filter unit, the second fan filter unit, and the third fan filter unit of the pasting machine are arranged above the second chamber, and are used to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber, and are used to make the gas flow out of the second chamber; the sixth fan filter unit and the seventh fan filter unit of the pasting machine are arranged above the third chamber, and are used to make the gas flow to the third chamber; the method comprises:

[0007] During the operation of the laminating machine, the first fan filter unit, the second fan filter unit and the third fan filter unit are turned on, so that the second chamber forms a slightly positive pressure state relative to the third chamber, and the second chamber forms a slightly positive pressure state relative to the first chamber;

[0008] The sixth fan filter unit and the seventh fan filter unit are closed to prevent gas turbulence from occurring in the third chamber.

[0009] In a second aspect, some embodiments of the present application further provide a control device, wherein the control device is used to execute the chamber gas flow control method in the laminating machine as described above.

[0010] In a third aspect, some embodiments of the present application further provide a silicon wafer, which is obtained by using the chamber gas flow control method in the pasting machine as described above.

[0011] In the fourth aspect, some embodiments of the present application also provide a pasting machine, which includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the pasting machine are arranged above the second chamber to allow the gas to flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber to allow the gas to flow out of the second chamber.

[0012] Compared with the related art, the solution provided by the embodiment of the present application is that the interior of the pasting machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the pasting machine are arranged above the second chamber, and are used to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber, and are used to make the gas flow out of the second chamber. By adopting this solution, a stable gas flow can be formed in the chamber inside the pasting machine, and gas turbulence can be avoided, which can improve the cleanliness inside the pasting machine and reduce the problem of shallow pits caused by particle attachment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0014] Figure 1 An exemplary flow chart of a method for controlling chamber gas flow in a laminating machine according to some embodiments of the present application;

[0015] Figure 2 It is a structural schematic diagram of a pasting machine provided according to some embodiments of the present application;

[0016] Figure 3 Another schematic diagram of a pasting machine provided according to some embodiments of the present application;

[0017] Figure 4 A schematic diagram of the change in settlement before and after the transformation provided according to some embodiments of the present application;

[0018] Figure 5 A schematic diagram showing a comparison of the incidence of shallow pits before and after transformation according to some embodiments of the present application;

[0019] Figure 6 An exemplary structural diagram of the electronic device is disclosed. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] First embodiment

[0022] The first embodiment of the present application relates to a method for controlling the flow of gas in a chamber of a laminating machine. Figure 1As shown, the interior of the attaching machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the attaching machine are arranged above the second chamber, and are used to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the attaching machine are arranged below the second chamber, and are used to make the gas flow out of the second chamber; the sixth fan filter unit and the seventh fan filter unit of the attaching machine are arranged above the third chamber, and are used to make the gas flow to the third chamber; the method comprises:

[0023] The method may include the following steps:

[0024] Step S101, during the operation of the laminating machine, the first fan filter unit, the second fan filter unit and the third fan filter unit are turned on, so that the second chamber forms a slightly positive pressure state relative to the third chamber, and the second chamber forms a slightly positive pressure state relative to the first chamber;

[0025] Among them, the second chamber related fan filter units include the first, second and third fan filter units, which are arranged above the second chamber, and their function is to make the gas flow to the second chamber. In the actual operation of the laminating machine, the flow of gas may be of great significance for maintaining the environmental stability, temperature regulation, and preventing impurity pollution inside each chamber. While pushing the gas into the second chamber, these fan filter units may also filter the gas to remove dust, particles and other impurities to ensure the quality of the gas entering the second chamber, thereby providing a relatively clean and suitable gas environment for the operations of heating the ceramic plate, loading the silicon wafer, centrifugal wax coating, laminating, etc. in the chamber.

[0026] The fourth and fifth fan filter units are located below the second chamber, and their function is to allow the gas to flow out of the second chamber. This allows the waste gas and excess heat generated in the second chamber during a series of operations to be discharged smoothly, maintaining the dynamic balance of the gas inside the second chamber and preventing the accumulation of gas from causing excessive temperature and humidity changes that are not conducive to processing operations.

[0027] The third chamber related fan filter units include the sixth and seventh fan filter units, which are arranged above the third chamber and are used to make the gas flow to the third chamber. Similarly, while pushing the gas into the third chamber, the gas may also be filtered to provide a suitable gas environment for the operations such as pressing, cooling, and unloading in the third chamber, such as by adjusting the temperature and humidity of the incoming gas to ensure that these operations can be carried out under good conditions.

[0028] In one embodiment, the pasting machine consists of a loading section, a ceramic plate front cleaning section, a ceramic plate rear cleaning section, a drying section, a ceramic plate heating section, a silicon wafer loading section, a centrifugal wax coating section, a pasting section, a middle pressing section, a cooling section and a unloading section.

[0029] A laminating machine is a professional equipment widely used in semiconductor manufacturing and other related fields. It is mainly used to accurately laminate silicon wafers with other materials (such as ceramic plates, etc.).

[0030] The laminating machine is a complex equipment composed of multiple components with different functions, including the loading section, ceramic plate front cleaning section, ceramic plate rear cleaning section, drying section, ceramic plate heating section, silicon wafer loading section, centrifugal wax coating section, laminating section, middle pressing section, cooling section and unloading section.

[0031] In one embodiment, the first chamber includes a loading section, a ceramic plate front cleaning section, a ceramic plate rear cleaning section and a drying section; the second chamber includes a ceramic plate heating section, a silicon wafer loading section, a centrifugal wax coating section and a pasting section; the third chamber includes a central pressing section, a cooling section and a unloading section.

[0032] The first chamber includes a loading section, a ceramic plate front cleaning section, a ceramic plate rear cleaning section and a drying section.

[0033] Loading department: It is probably used to load the raw materials to be processed (such as ceramic plates and other related materials) into the laminating machine. It is the starting link of the entire processing flow and is responsible for providing the initial processing object.

[0034] Ceramic plate pre-cleaning section: Its function is to clean the ceramic plate before subsequent processing operations to remove dust and impurities that may exist on the surface of the ceramic plate to ensure the quality and effect of subsequent processing, such as ensuring the cleanliness of the surface during bonding, which is conducive to better adhesion.

[0035] Ceramic plate post-cleaning section: Corresponding to the pre-cleaning section, it is to clean the ceramic plate again after it has gone through some intermediate processing steps to further remove dirt that may have been contaminated during the processing, so that the ceramic plate can enter the subsequent links in a better state.

[0036] Drying Department: After the ceramic plate is washed, it is responsible for removing moisture and other liquids on its surface to make it dry. This is very important for subsequent operations such as heating, waxing, and pasting, because the presence of moisture may affect the effects of these processing steps, such as causing uneven heating and poor adhesion of the wax layer.

[0037] The second chamber includes a ceramic plate heating part, a silicon wafer loading part, a centrifugal wax coating part and a pasting part.

[0038] Ceramic plate heating section: It heats the ceramic plate that has been previously processed (washed, dried, etc.). The purpose of heating may be various, such as changing the physical properties of the ceramic plate to make it easier for subsequent processing (such as making the surface more active to better combine with wax or silicon wafers), or to meet the temperature conditions under specific process requirements.

[0039] Wafer loading unit: used to load the silicon wafer into the laminating machine so that the silicon wafer can be laminated with the ceramic plate that has been heated and other treatments in the subsequent steps. It is a component that provides another key processing object.

[0040] Centrifugal wax coating part: After the ceramic plate is heated, this component will coat a layer of wax on the surface of the ceramic plate through centrifugal action and other methods. The role of wax coating may be to lubricate, protect, enhance bonding strength and other effects. For example, it makes the ceramic plate and silicon wafer easier to fit and fit more tightly during the bonding process. At the same time, the wax layer may also protect the surface of the ceramic plate from being damaged during subsequent processing to a certain extent.

[0041] Laminating unit: This is one of the core components of the entire laminating machine. It is responsible for laminating the ceramic plate and silicon wafer that have undergone a series of previous treatments (ceramic plate heating, wax coating, silicon wafer loading, etc.), combining the two tightly together to complete the main laminating process.

[0042] The third chamber includes a middle pressing part, a cooling part and a discharge part.

[0043] Middle pressing department: Although the specific function is not very clear, it is speculated that after the ceramic plate and silicon wafer are attached, some degree of pressing and reinforcement operations are performed on the bonding parts to further ensure the firmness of the attachment and make the combination between the two closer, which may be achieved by applying a certain amount of pressure.

[0044] Cooling department: After the bonding and possible intermediate pressing operations are completed, the ceramic plates and silicon wafers that have been bonded together are cooled to restore them to normal temperature from the high temperature state in the previous processing process. The purpose of cooling may be to stabilize the physical properties of the product and prevent deformation and performance changes caused by excessive temperature. It also facilitates subsequent unloading operations.

[0045] Unloading Department: Responsible for taking out the finished products from the pasting machine after a series of processing (pasting, cooling, etc.), completing the last step of the entire product processing flow.

[0046] Figure 2 Schematic diagram of the structure of the application machine provided according to some embodiments of the present application. Figure 2As shown, the first fan filter unit ①, the second fan filter unit ② and the third fan filter unit ③ are arranged above the second chamber, the fourth fan filter unit ④ and the fifth fan filter unit ⑤ are arranged below the second chamber, and the sixth fan filter unit ⑥ and the seventh fan filter unit ⑦ are arranged above the third chamber.

[0047] Step S102, closing the sixth fan filter unit and the seventh fan filter unit to prevent gas turbulence from occurring in the third chamber.

[0048] In this solution, the sixth fan filter unit and the seventh fan filter unit can be closed while the first fan filter unit, the second fan filter unit and the third fan filter unit are opened. In this way, gas turbulence can be avoided in the third chamber, thereby achieving control of gas flow, carrying particulate dust out of the pasting machine, and improving the cleanliness level inside the pasting machine.

[0049] The solution provided in this embodiment is that the interior of the pasting machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the pasting machine are arranged above the second chamber, and are used to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber, and are used to make the gas flow out of the second chamber. By adopting this solution, a stable gas flow can be formed in the chamber inside the pasting machine, and gas turbulence can be avoided, which can improve the cleanliness inside the pasting machine and reduce the problem of shallow pits caused by particle attachment.

[0050] In one embodiment, the method further comprises:

[0051] The first fan filter unit is turned off, and the fourth fan filter unit is turned off to prevent gas turbulence from occurring in the second chamber.

[0052] In the second chamber, closing the first fan filter unit and the fourth fan filter unit can avoid turbulence in the laminating part in the second chamber, thereby improving the cleanliness of the silicon wafer laminating process and avoiding the influence of particles on the silicon wafer polishing.

[0053] In one embodiment, the method further comprises:

[0054] The baffle plate of the gas outlet of the third chamber is arranged to be installed at an angle.

[0055] Figure 3 FIG. 2 is another schematic diagram of a pasting machine provided according to some embodiments of the present application. Figure 3As shown, the baffle of the gas outlet of the third chamber is arranged to be installed at an angle, and the airflow blown to the unloading area is guided out of the pasting machine by the diversion effect, which can avoid the gas turbulence in the third chamber caused by the vertical installation, thereby improving the cleanliness in the third chamber.

[0056] Among the relevant technical requirements, the existing technical requirements for the laminating machine are:

[0057] In order to ensure that the entire laminating machine (including the 1st, 2nd and 3rd chambers) forms a slightly positive pressure state relative to the outside world, 7 FFUs (Fan Filter Units) are installed on the top of the laminating machine. The FFU generates power through the built-in fan to suck the surrounding air into the equipment, and then passes through the primary and high-efficiency filters to remove dust, particles, bacteria and other pollutants in the air, and finally outputs clean air and evenly discharges it into the laminating machine, thereby forming gas flow in the laminating machine, and a slightly positive pressure state relative to the outside world;

[0058] The second chamber forms a slightly positive pressure state relative to the first and third chambers. Because the cleanliness of the pasting part is particularly important during the entire pasting process, the slightly positive pressure of the second chamber can keep the airflow direction from the middle pasting part to the first and third chambers on both sides, thereby preventing too many particles from being brought into the pasting part by the airflow;

[0059] In principle, particles larger than 1.0 μm are not allowed to exist in the pasting part, because such particles can easily cause shallow pits;

[0060] The dust control standard inside the laminating machine is less than 100 particles of 0.3μm.

[0061] The present invention combines the use of FFU, the airflow direction in the pasting machine, and the structure of the pasting machine to make corresponding adjustments to the use of 7 FFUs inside the pasting machine, optimize the airflow direction, reduce the number of large particles in the pasting part, and reduce the dust fall, so as to improve the particles inside the pasting machine and reduce the incidence of shallow pits.

[0062] The main improvements include the following:

[0063] First, the airflow originally blown from the second chamber to the third chamber intersects with the airflow output by FFU at ⑥ and ⑦. The intersection of horizontal and vertical airflows easily leads to turbulence in the third chamber, so FFU at ⑥ and ⑦ are closed first;

[0064] Secondly, close the FFU at ④ and ① to reduce the airflow from the second chamber to the pasting part and reduce the turbulence in the pasting part;

[0065] Secondly, the baffle in the unloading area was originally installed vertically, which easily blocked the baffle blowing toward the unloading area and caused the air to blow in the opposite direction toward the second chamber. The baffle in the unloading area was modified from a vertical installation to an inclined installation, and the airflow blowing toward the unloading area was guided out of the pasting machine by the diversion effect to avoid the generation of turbulence.

[0066] Specifically, before any modification, the wind speed in the unloading area was measured to be 0.9m / s, and the airflow direction was from the inside of the pasting machine to the outside. After closing FFUs ⑥ and ⑦, the wind speed in the unloading area was measured to be 0.75m / s, and the airflow direction was from the inside of the pasting machine to the outside, which met the micro-positive pressure requirements of the pasting machine.

[0067] Close FFU at ④ and ①, and measure that the second chamber is slightly positive pressure relative to the third chamber, and the airflow at the attached part is flowing toward the first and third chambers, which meets the requirements, and there is no turbulence;

[0068] The baffle in the discharge area was changed from vertical installation to inclined installation, and it was measured that there was no reverse airflow and turbulence in the third chamber.

[0069] The improvement effect test is as follows:

[0070] 1. Confirm the particles larger than 1.0μm in the pasting part:

[0071] Before and after the modification, a handheld particle counter was used to test the application area. The test was conducted three times before and after the modification. After the modification, the number of particles larger than 1.0 μm was 0.

[0072] See the table below:

[0073]

[0074] 2. Confirm the dust reduction in the laminating machine:

[0075] The dust reduction test was carried out in the laminating machine. ① The particles of all sizes were reduced; ② The 0.3μm particles were reduced from 79 to 49, which was an improvement;

[0076] See the table below:

[0077] Particle size Before renovation After transformation 0.12～0.16 352 208 0.16～0.2 234 138 0.2～0.3 145 95 0.3～0.5 79 49 0.5～0.7 35 11 0.7～1 12 7

[0078] Figure 4 This is a schematic diagram of the change in settlement before and after the transformation according to some embodiments of the present application.

[0079] 3. Confirm the incidence of shallow pits:

[0080] The incidence of shallow pits before and after the transformation was statistically analyzed, and the incidence of shallow pits decreased from 0.19% to 0.13%;

[0081] state Before renovation After transformation Shallow pit incidence 0.19％ 0.13％

[0082] Figure 5 Schematic diagram comparing the incidence of shallow pits before and after transformation according to some embodiments of the present application.

[0083] The technical solution involved in this patent is to modify the pasting machine and compare the particles larger than 1.0μm in the pasting part, the dust reduction of the pasting machine and the incidence of shallow pits before and after the modification, and all are improved.

[0084] Second embodiment

[0085] The second embodiment of the present application relates to a control device, which is used to execute the chamber gas flow control method in the laminating machine as described in the above embodiments.

[0086] It can be understood that the equipment protected by this solution has the corresponding beneficial effects of the chamber gas flow control method in the above-mentioned laminating machine, which will not be described in detail here.

[0087] Third embodiment

[0088] The third embodiment of the present application relates to a silicon wafer, which is obtained by using the chamber gas flow control method in the laminating machine as described in the above embodiments.

[0089] It can be understood that the silicon wafer protected by this solution has the corresponding beneficial effects of the chamber gas flow control method in the above-mentioned lamination machine, which will not be described in detail here.

[0090] Fourth embodiment

[0091] The fourth embodiment of the present application relates to a pasting machine. The pasting machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the pasting machine are arranged above the second chamber to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber to make the gas flow out of the second chamber.

[0092] Furthermore, the sixth fan filter unit and the seventh fan filter unit of the pasting machine are arranged above the third chamber, and are continuously in a closed state during the operation of the pasting machine.

[0093] Furthermore, the baffle of the gas outlet of the third chamber of the laminating machine is arranged to be installed at an angle.

[0094] The laminating machine is used to execute the chamber gas flow control method in the laminating machine as described in the above embodiments.

[0095] It can be understood that the laminating machine protected by this solution has the corresponding beneficial effects of the chamber gas flow control method in the above-mentioned laminating machine, which will not be described in detail here.

[0096] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital assistant, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0097] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 6 An exemplary structural diagram of the electronic device is disclosed. Figure 6 As shown, the electronic device includes: one or more processors 601, memory 602, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0098] The electronic device may further include: an input device 603 and an output device 604. The processor 601, the memory 602, the input device 603 and the output device 604 may be connected via a bus or other means. Figure 6 The example of connecting through bus is taken in the following.

[0099] The input device 603 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 604 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0100] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0101] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0102] The memory 602 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 601 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 602, so as to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0103] The memory 602 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 602 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory 602 may optionally include a memory remotely arranged relative to the processor 601, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0104] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0105] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0106] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet).

[0107] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0108] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive so lid state di sk (SSD)), etc.

[0109] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0110] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0111] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A method for controlling the gas flow in a chamber of a laminating machine, characterized in that: The inside of the attaching machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the attaching machine are arranged above the second chamber, and are used to make the gas flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the attaching machine are arranged below the second chamber, and are used to make the gas flow out of the second chamber; the sixth fan filter unit and the seventh fan filter unit of the attaching machine are arranged above the third chamber, and are used to make the gas flow to the third chamber; the method comprises: During the operation of the laminating machine, the first fan filter unit, the second fan filter unit and the third fan filter unit are turned on, so that the second chamber forms a slightly positive pressure state relative to the third chamber, and the second chamber forms a slightly positive pressure state relative to the first chamber; The sixth fan filter unit and the seventh fan filter unit are closed to prevent gas turbulence from occurring in the third chamber.

2. The method according to claim 1, characterized in that The method further comprises: The first fan filter unit is closed, and the fourth fan filter unit is closed to prevent gas turbulence from occurring in the second chamber.

3. The method according to claim 1, characterized in that The method further comprises: The baffle plate of the gas outlet of the third chamber is arranged to be installed at an angle.

4. The method according to claim 1, characterized in that The pasting machine consists of a loading section, a ceramic plate front cleaning section, a ceramic plate rear cleaning section, a drying section, a ceramic plate heating section, a silicon wafer loading section, a centrifugal wax coating section, a pasting section, a middle pressing section, a cooling section and a discharging section.

5. The method according to claim 4, characterized in that The first chamber includes a loading section, a ceramic plate front cleaning section, a ceramic plate rear cleaning section and a drying section; the second chamber includes a ceramic plate heating section, a silicon wafer loading section, a centrifugal wax coating section and a pasting section; the third chamber includes a central pressing section, a cooling section and a unloading section.

6. A control device, characterized in that: The control device is used to execute the chamber gas flow control method in the laminating machine as described in any one of claims 1-5.

7. A silicon wafer, characterized in that: The silicon wafer is obtained by using the chamber gas flow control method in a bonding machine as described in any one of claims 1-5.

8. A laminating machine, characterized in that: The interior of the pasting machine includes a first chamber, a second chamber and a third chamber, wherein the first fan filter unit, the second fan filter unit and the third fan filter unit of the pasting machine are arranged above the second chamber to allow the gas to flow to the second chamber; the fourth fan filter unit and the fifth fan filter unit of the pasting machine are arranged below the second chamber to allow the gas to flow out of the second chamber.

9. The attaching machine according to claim 8, characterized in that: The sixth fan filter unit and the seventh fan filter unit of the laminating machine are arranged above the third chamber, and are continuously in a closed state during the operation of the laminating machine.

10. The attaching machine according to claim 8, characterized in that: The baffle plate of the gas outlet of the third chamber of the laminating machine is arranged to be installed at an angle.

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