Circuit board assembly disassembling device

Abstract

The invention belongs to the technical field of circuit board disassembling, and particularly relates to a circuit board assembly disassembling device which comprises a workbench, a support is movably arranged on the workbench, a tin removing mechanism used for removing soldering tin on a circuit board is arranged on the support, and the tin removing mechanism comprises a containing disc rotationally arranged on the support; the plurality of solder suckers are annularly and uniformly distributed on the storage tray, each solder sucker comprises a barrel body and a solder sucker head, and one solder sucker head is lower than the other solder sucker heads; by arranging the rotatable storage disc and the multiple solder suckers, the solder suckers in the non-working state are higher than the solder suckers in the working state, the circuit board assembly is subjected to tin removal decomposition through the solder suckers, the storage disc is rotated, the heights of the solder suckers are adjusted up and down, the solder suckers to be cleaned are disassembled and cleaned, and normal tin removal decomposition work is not affected; the function of cleaning the tin storage cavity without shutdown can be achieved, and the working efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of circuit board disassembly, in particular to a circuit board component disassembly device. Background Art

[0002] Components such as capacitors in circuit board assemblies are mostly fixed on circuit boards by welding. When producing circuit board assemblies, a soldering device is used to solder the connections between the pins in the components and the circuit boards. Therefore, when disassembling the circuit board assemblies, the solder needs to be removed. In the existing operation method, a solder sucker is used to remove the solder on the circuit board, and then the components can be disassembled and removed from the circuit board. The solder sucker is generally composed of a cylinder and a solder sucker head. Some solder suckers are also equipped with a heating device. The solder is heated by the heating device to melt the solder, and then the solder sucker head sucks the molten solder into the tin storage cavity in the cylinder.

[0003] A patent document with publication number CN210285888U discloses an automatic tin-absorbing device for a printed circuit board, including a base plate, a vertical plate, a horizontal plate, an X-axis module and a Y-axis module; a tin-absorbing component is provided on the Y-axis module, and a pipe, a solenoid valve and a tin-absorbing port are provided on the tin-absorbing component, and a filter is provided in the pipe. When the solenoid valve is opened, the liquefied tin is automatically sucked away, thereby reducing manual labor intensity and improving work efficiency.

[0004] The above technical solution still has some problems in actual use. After the solder sucker has been used for a period of time, a certain amount of solder will accumulate in the tin storage chamber. In order to avoid affecting the normal suction force of the solder sucker, the tin storage chamber needs to be cleaned. The solder sucker head is generally tightened on the cylinder body by a threaded connection. Therefore, when cleaning the tin storage chamber, it is necessary to stop the disassembly work first, stop the solder sucker, and then rotate and unscrew the solder sucker head to clean the tin storage chamber. The cleaning work requires shutdown, which affects the decomposition efficiency of the circuit board assembly.

[0005] To this end, the present invention provides a circuit board assembly disassembly device. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a circuit board assembly disassembly device described in the present invention includes a workbench, a bracket is movably provided on the workbench, a tin removal mechanism for removing solder on the circuit board is provided on the bracket, the tin removal mechanism includes: a placement tray rotatably arranged on the bracket; a plurality of tin suckers evenly distributed on the placement tray in an annular shape, the tin sucker includes a cylinder and a tin sucker head, the cylinder is slidably arranged on the placement tray, a cylindrical tin storage cavity is provided inside the cylinder, the tin sucker head is threadedly connected to the bottom end of the cylinder, the tin sucker is located above the workbench, and one of the tin suckers is lower than the other tin suckers.

[0008] Preferably, the tin removal mechanism also includes: an edge plate fixedly connected to the cylinder; a top plate fixedly connected to the bracket, the side wall of the top plate is provided with a slope, and during the rotation of the placement plate, after the edge plate contacts the top plate, the top plate pushes the edge plate upward; a first spring arranged on the placement plate for driving the cylinder to move downward.

[0009] Preferably, it also includes a disassembly and assembly mechanism for disassembling the desoldering head, and the disassembly and assembly mechanism includes: a lifting plate slidably arranged on the bracket; a clamping seat rotatably arranged on the lifting plate; and a plurality of clamping plates slidably inserted on the clamping seat, and the clamping plates are used to clamp the desoldering head.

[0010] Preferably, the disassembly and assembly mechanism also includes: an adjustment ring fixedly connected to the bracket, the top section of the adjustment ring is conical, and the lower section of the adjustment ring is cylindrical; a second spring provided on the clamp seat for pushing the clamp plate outward, and the end of the clamp plate abuts against the inner wall of the adjustment ring.

[0011] Preferably, a notch is provided on the side wall of the adjusting ring for the desoldering device to pass through, and an arc section is provided at the end of the clamping plate, and the arc length of the arc section is greater than the width of the notch.

[0012] Preferably, it also includes a cleaning mechanism, which includes: a slide plate slidably arranged on the bracket, and a through hole for the slide plate to pass through is provided on the side wall of the adjustment ring; a swivel ring rotatably arranged on the slide plate; and a cleaning brush slidably arranged on the swivel ring, and the bottom end of the cleaning brush is a telescopic structure.

[0013] Preferably, the cleaning mechanism also includes: a first magnetic block fixedly connected to the cleaning brush; a plurality of groups of magnetic plate groups fixedly connected to the bottom end of the storage tray, the magnetic plate group including annularly evenly distributed magnetic plates, and when the rotating ring rotates below the storage tray, the cleaning brush reciprocates up and down under the action of the magnetic plate group and the first magnetic block.

[0014] Preferably, it also includes a control mechanism, which includes: rotating a driving shaft arranged on the lifting plate, wherein the driving shaft and the clamping seat are transmitted via a first chain belt; rotating a driven shaft arranged on the slide plate, wherein the driven shaft and the swivel are transmitted via a second chain belt; a connecting piece movably inserted in the driven shaft, wherein the bottom end of the connecting piece is provided with an assembly groove corresponding to the driven shaft, and when the connecting piece moves downward and the assembly groove is sleeved on the outside of the driven shaft, the driven shaft rotates and drives the driven shaft to rotate.

[0015] Preferably, the control mechanism further includes: a third spring provided on the driven shaft for pushing the connecting member downward; and a push plate fixedly connected to the bracket for driving the connecting member upward, wherein the end of the push plate is provided with a bevel.

[0016] Preferably, the control mechanism also includes: a tension spring arranged on the bracket for driving the slide plate away from the adjustment ring; a second magnetic block fixedly connected to the slide plate; and a magnetic attraction plate fixedly connected to the lifting plate, and after the lifting plate moves downward, the magnetic attraction plate is aligned with the second magnetic block and drives the slide plate to move into the adjustment ring.

[0017] The beneficial effects of the present invention are as follows: 1. The circuit board assembly disassembly device described in the present invention is provided with a rotatable storage tray and a plurality of solder suckers, wherein the solder suckers in a non-working state are higher than the solder suckers in a working state, and the circuit board assembly is detinned and decomposed by the solder suckers. The storage tray is rotated and the height of the solder suckers is adjusted up and down, and the solder suckers to be cleaned are disassembled and cleaned without affecting the normal detinning and decomposition work, and the function of cleaning the tin storage cavity without stopping the machine can be realized, thereby improving work efficiency.

[0018] 2. The circuit board assembly disassembly device described in the present invention has a cleaning brush arranged on a movable rotating ring. After the desoldering head is removed, the rotating ring moves between the cylinder body and the desoldering head. During the rotation of the rotating ring, the cleaning brush is driven up and down by magnetic force, so that the tin storage cavity and the desoldering head can be wiped and cleaned at the same time, thereby improving the cleaning efficiency.

[0019] 3. The circuit board assembly disassembly device described in the present invention, through the cooperation of the disassembly mechanism, the cleaning mechanism and the control mechanism, can realize the disassembly and assembly of the desoldering head and the movement of the cleaning brush only through one active shaft, eliminating the trouble of setting up multiple sets of electrical drive devices, simplifying the structure, and having a high degree of automation, and is suitable for automated assembly line production. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 is a three-dimensional diagram of the first embodiment of the present invention; Figure 2 It is a three-dimensional diagram of the structure in the bracket; Figure 3 This is an exploded view of the storage tray, top plate and desoldering machine; Figure 4 It is a three-dimensional diagram of the coordination status of the desoldering device, the disassembly and assembly mechanism, and the cleaning mechanism; Figure 5 It is an exploded view of the slide plate, swivel and connector; Figure 6 This is an exploded view of the lifting plate and clamping seat; Figure 7 This is an exploded view of the adjustment ring, clamp seat and clamp plate; Figure 8 This is the bottom view of the desoldering machine and the cleaning brush; In the figure: 1. workbench; 2. bracket; 3. tin removal mechanism; 31. storage tray; 32. tin absorber; 321. cylinder; 322. tin absorber head; 323. tin storage chamber; 33. edge plate; 34. top plate; 35. first spring; 4. disassembly and assembly mechanism; 41. lifting plate; 42. clamping seat; 43. clamping plate; 44. adjustment ring; 45. second spring; 5. cleaning mechanism; 51. slide plate; 52. swivel; 53. cleaning brush; 54. first magnetic block; 55. magnetic sheet group; 6. control mechanism; 61. driving shaft; 611. first chain belt; 62. driven shaft; 621. second chain belt; 63. connecting piece; 631. assembly groove; 64. third spring; 65. push plate; 66. tension spring; 67. second magnetic block; 68. magnetic suction plate. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] Embodiment 1 like Figure 1-8 As shown, a circuit board assembly disassembly device described in an embodiment of the present invention includes a workbench 1, a bracket 2 is movably provided on the workbench 1, a tin removal mechanism 3 for removing solder on the circuit board is provided on the bracket 2, and the tin removal mechanism 3 includes: a placement tray 31 rotatably arranged on the bracket 2; a plurality of tin suckers 32 annularly evenly distributed on the placement tray 31, the tin suckers 32 include a cylinder 321 and a tin sucker head 322, the cylinder 321 is slidably arranged on the placement tray 31, a cylindrical tin storage cavity 323 is provided inside the cylinder 321, the tin sucker head 322 is threadedly connected to the bottom end of the cylinder 321, the tin sucker 32 is located above the workbench 1, and one of the tin suckers 322 is lower than the other tin suckers 322.

[0024] Specifically, the tin sucker 32 adopts the existing electric tin sucking device, and a vacuum pump is provided in the cylinder 321. The vacuum pump is used to generate suction to suck the molten solder into the tin storage cavity 323. The tin sucker 32 is provided with a heating unit for heating and melting the solder. The heating unit adopts an electric heating method. Of course, a heating unit can also be provided on the bracket 2 to cooperate with the tin sucker 32. The storage tray 31 rotates on a horizontal plane, and the cylinder 321 can move up and down relative to the storage tray 31. Take the bracket 2 as an example to illustrate that two tin suckers 32 are provided. Initially, the tin sucker 32 on the left is in a working state, and the tin sucker 32 on the right is in a non-working state. The tin sucker 32 on the right is higher than the tin sucker 32 on the left. When removing tin, only the tin sucker 32 on the left contacts the circuit board assembly, and the tin sucker 32 on the right is away from the circuit board assembly to avoid affecting the normal tin removal work.

[0025] The components in the circuit board assembly are fixed on the circuit board by soldering. When the circuit board assembly is subjected to solder decomposition, the circuit board assembly is placed on the workbench 1, and the bracket 2 is moved by a robot or manual operation so that the tin suction head 322 in the left tin suction device 32 contacts the solder on the circuit board assembly. The tin suction device 32 and the heating unit are started, and after the solder is melted, the tin suction head 322 quickly sucks the molten solder into the tin storage cavity 323. This process is repeated until the solder on the solder joint is removed. After the circuit board assembly is taken out from the workbench 1, the components can be removed from the circuit board, thereby completing the tin removal and decomposition of the circuit board assembly.

[0026] After the solder sucker 32 on the left has worked for a period of time, a large amount of tin is stored in the tin storage cavity 323, and the tin storage cavity 323 needs to be cleaned. At this time, the placement plate 31 is started to rotate, so that the positions of the two solder suckers 32 are swapped, and the solder sucker 32 to be cleaned moves to the right, and then the positions of the two solder suckers 32 are adjusted by moving up and down, the solder sucker 32 on the left moves down, and the solder sucker 32 on the right moves up. While the solder sucker 32 on the left continues to remove tin, the solder sucking head 322 in the solder sucker 32 on the right can be rotated and unscrewed to clean the tin storage cavity 323, thereby realizing the function of non-stop cleaning and improving work efficiency.

[0027] like Figure 2-3 As shown, the tin removal mechanism 3 also includes: an edge plate 33 fixedly connected to the cylinder 321; a top plate 34 fixedly connected to the bracket 2, and the side wall of the top plate 34 is provided with a slope. During the rotation of the placement plate 31, after the edge plate 33 contacts the top plate 34, the top plate 34 pushes the edge plate 33 to move upward; a first spring 35 arranged on the placement plate 31 for driving the cylinder 321 to move downward.

[0028] Specifically, a slope is provided on the left side of the top plate 34, and the top end of the top plate 34 is horizontal. The two ends of the first spring 35 are respectively connected to the edge plate 33 and the storage tray 31. The top plate 34 is located in the right half of the storage tray 31. Initially, the left solder sucker 32 is at the bottom end of its moving range under the pull of the first spring 35. The top plate 34 lifts the right solder sucker 32 upward and blocks it under the edge plate 33 of the right solder sucker 32 to prevent the right solder sucker 32 from moving downward.

[0029] like Figure 2-7 As shown, it also includes a disassembly and assembly mechanism 4 for disassembling and assembling the desoldering head 322, and the disassembly and assembly mechanism 4 includes: a lifting plate 41 slidably arranged on the bracket 2; a clamping seat 42 rotatably arranged on the lifting plate 41; and a plurality of clamping plates 43 slidably inserted on the clamping seat 42, and the clamping plates 43 are used to clamp the desoldering head 322.

[0030] Specifically, the lifting plate 41 moves up and down relative to the bracket 2, the clamp seat 42 rotates on the horizontal plane, and the clamp plate 43 moves back and forth on the horizontal plane relative to the clamp seat 42; the number of clamp plates 43 is preferably but not limited to two, the right side desoldering device 32 is coaxial with the clamp seat 42, the two clamp plates 43 are started to move inward, the desoldering head 322 in the right side desoldering device 32 is clamped, and then the clamp seat 42 rotates and the lifting plate 41 moves down, the desoldering head 322 can be rotated and unscrewed, so that the cylinder 321 and the desoldering head 322 are separated up and down; conversely, after cleaning the tin storage cavity 323, the clamp plate 43 holds the desoldering head 322 and rotates in the opposite direction and the lifting plate 41 moves up, and the desoldering head 322 can be reinstalled on the cylinder 321.

[0031] like Figure 2-7 As shown, the disassembly and assembly mechanism 4 also includes: an adjusting ring 44 fixedly connected to the bracket 2, the top section of the adjusting ring 44 is conical, and the lower section of the adjusting ring 44 is cylindrical; a second spring 45 is arranged on the clamp seat 42 for pushing the clamp plate 43 outward, and the end of the clamp plate 43 is against the inner wall of the adjusting ring 44.

[0032] like Figure 2-7 As shown, a notch is provided on the side wall of the adjusting ring 44 for the solder sucker 32 to pass through, and an arc section is provided at the end of the clamping plate 43, and the arc length of the arc section is greater than the width of the notch.

[0033] Specifically, an area for the solder sucker 32 to pass through is reserved between the two clamping plates 43. Figure 3During the counterclockwise rotation of the storage tray 31, the edge plate 33 on the solder sucker 32 first contacts the slope on the left side of the top plate 34 and moves upward until the edge plate 33 contacts the top of the top plate 34. At this time, the solder sucker head 322 passes through the gap into the inside of the clamp seat 42 and the solder sucker head 322 is located between the two clamping plates 43. When the position of the solder sucker 32 is swapped next time, the storage tray 31 continues to rotate, the edge plate 33 in the right solder sucker 32 is separated from the top plate 34, and then the right solder sucker 32 can be moved down and reset.

[0034] The two ends of the second spring 45 are respectively connected to the clamp seat 42 and the clamp plate 43. The top outer diameter of the cone shape in the adjusting ring 44 is larger than the bottom outer diameter. Initially, the lifting plate 41 is located at the top of its moving range. At this time, the clamp plate 43 is located in the upper range of the adjusting ring 44. The second spring 45 pushes the clamp plate 43 to move outward, and the two clamp plates 43 move away from each other so that the desoldering head 322 can move between the two clamp plates 43; after the lifting plate 41 moves down, the adjusting ring 44 squeezes the clamp plate 43 to move inward, so that the clamp plate 43 clamps the desoldering head 322.

[0035] It should be noted that when there are multiple clamping plates 43, the desoldering head 322 may collide with the clamping plate 43 during the rotation of the storage tray 31. In order to further ensure that the desoldering head 322 can move to the range surrounded by the multiple clamping plates 43, a step can also be provided at the top of the top plate 34. Figure 3 In the figure, the left section and the right section of the top of the top plate 34 form a step. During the counterclockwise rotation of the placement tray 31, the edge plate 33 on the tin sucker 32 first contacts the slope on the left side of the top plate 34 and moves upward. After the edge plate 33 contacts the left section of the top of the top plate 34, the tin sucking head 322 moves to the top. At this time, the tin sucking head 322 passes through the notch into the inside of the clamp seat 42 and the tin sucking head 322 is located above the clamp plate 43. As the placement tray 31 continues to rotate, the edge plate 33 moves down and contacts the right section of the top of the top plate 34. At this time, the tin sucking head 322 can move down between multiple clamp plates 43.

[0036] like Figure 2-8 As shown, it also includes a cleaning mechanism 5, which includes: a slide plate 51 slidably arranged on the bracket 2, and a through hole for the slide plate 51 to pass through is provided on the side wall of the adjustment ring 44; a swivel 52 rotatably arranged on the slide plate 51; a cleaning brush 53 slidably arranged on the swivel 52, and the bottom end of the cleaning brush 53 is a telescopic structure.

[0037] Specifically, the slide plate 51 can move left and right relative to the bracket 2, the shape of the bottom end of the cleaning brush 53 and the number of the cleaning brushes 53 can be selected according to the specific situation, and the bristles at the bottom end of the cleaning brush 53 can also be set to a ring shape corresponding to the desoldering head 322. For ease of understanding, in the embodiment, only one cleaning brush 53 is drawn on the rotating ring 52. The cleaning brush 53 can move up and down relative to the rotating ring 52, the bottom end of the cleaning brush 53 can be extended and retracted up and down and can be automatically reset, the side wall and the bottom end of the cleaning brush 53 are provided with flexible bristles, and the rotating ring 52 is provided with a limit block, which is used to limit the initial position of the cleaning brush 53.

[0038] Initially, the slide plate 51 is located on the right side of the clamp seat 42. After the positions of the two desoldering devices 32 are swapped and the desoldering device 32 to be cleaned is moved into the clamp seat 42, the clamp plate 43 clamps the desoldering head 322 and rotates downward to remove the desoldering head 322. At this time, the desoldering head 322 is located below the cleaning brush 53, and the cylinder 321 is located above the cleaning brush 53. Then the slide plate 51 is started to move left, and the slide plate 51 passes through the opening and enters the inside of the clamp seat 42 until the swivel 52 and the cylinder 321 are aligned. The shaft is then started, and the rotating ring 52 is rotated and the cleaning brush 53 is moved up and down. After the cleaning brush 53 moves up and down, the top end of the cleaning brush 53 is inserted into the tin storage cavity 323 and contacts the inner wall of the tin storage cavity 323, and the bottom end of the cleaning brush 53 contacts the tin suction head 322. In this way, the cleaning brush 53 can wipe and clean the tin storage cavity 323 and the tin suction head 322 at the same time, and the brushed tin falls onto the bracket 2. Of course, a debris box for collecting the fallen tin can also be set on the bracket 2. It should be noted that the cleaning mechanism 5 and the debris box are always located above the circuit board assembly and do not contact the circuit board assembly. The disassembly and cleaning work does not affect the normal desoldering work.

[0039] like Figure 5-8 As shown, the cleaning mechanism 5 also includes: a first magnetic block 54 fixedly connected to the cleaning brush 53; a plurality of groups of magnetic sheet groups 55 fixedly connected to the bottom end of the storage tray 31, the magnetic sheet group 55 includes annularly evenly distributed magnetic sheets, and when the rotating ring 52 rotates below the storage tray 31, the cleaning brush 53 reciprocates up and down under the action of the magnetic sheet group 55 and the first magnetic block 54.

[0040] Specifically, for a single group of magnetic sheets 55, the bottom ends of two adjacent magnetic sheets have opposite magnetic properties. During the rotation of the rotating ring 52, the first magnetic block 54 contacts each magnetic sheet in turn and attracts or repels each magnetic sheet respectively. The magnetic force drives the cleaning brush 53 to reciprocate up and down.

[0041] Embodiment 2 like Figure 2-8As shown, compared with Example 1, another implementation of the present invention is: it also includes a control mechanism 6, and the control mechanism 6 includes: a driving shaft 61 rotated on the lifting plate 41, and the driving shaft 61 and the clamp seat 42 are transmitted through a first chain belt 611; a driven shaft 62 rotated on the slide plate 51, and the driven shaft 62 and the rotating ring 52 are transmitted through a second chain belt 621; a connecting member 63 movably inserted in the driven shaft 62, and the bottom end of the connecting member 63 is provided with an assembly groove 631 corresponding to the driven shaft 62, and when the connecting member 63 moves downward and the assembly groove 631 is sleeved on the outside of the driven shaft 62, the driven shaft 62 rotates and drives the driven shaft 62 to rotate.

[0042] Specifically, the driving shaft 61 is driven to rotate and move up and down by a motor or the like. When the driving shaft 61 moves up and down, it drives the lifting plate 41 to move up and down synchronously. The motor is installed on the bracket 2. The slide plate 51 and the lifting plate 41 are both provided with through grooves. When cleaning the tin storage cavity 323, the clamp seat 42, the adjustment ring 44 and the rotating ring 52 are coaxial. The brushed tin passes through the through groove and falls onto the bracket 2 or into the glove box. The motor is staggered with the tin sucker 32 on the right to avoid contact with the brushed tin.

[0043] Initially, the connecting piece 63 and the driving shaft 61 are staggered in the height direction, so that after the slide plate 51 moves to the left, the connecting piece 63 can move to the top of the driving shaft 61. When cleaning the tin storage cavity 323, the driving shaft 61 is started to rotate and move downward, and the driving shaft 61 drives the clamp seat 42 to rotate and the lifting plate 41 to move downward. The clamp plate 43 in the clamp seat 42 clamps the tin suction head 322 and then moves downward. After the tin suction head 322 is screwed off, the driving shaft 61 no longer moves downward, and the slide plate 51 is started to move to the left, so that The connecting piece 63 is moved to the top of the driving shaft 61. At this time, the connecting piece 63, the driven shaft 62 and the driving shaft 61 are coaxial. The connecting piece 63 is started to move downward, so that the driving shaft 61 is inserted into the assembly groove 631. The driving shaft 61 and the assembly groove 631 are frictionally matched to drive the connecting piece 63 and the driven shaft 62 to rotate. The driven shaft 62 drives the swivel 52 to rotate, and the cleaning brush 53 rotates along the inner wall of the tin storage cavity 323 to clean the tin storage cavity 323 and the tin suction head 322.

[0044] like Figure 2-8 As shown, the control mechanism 6 also includes: a third spring 64 provided on the driven shaft 62 for pushing the connecting member 63 downward; a push plate 65 fixedly connected to the bracket 2 for driving the connecting member 63 upward, and the end of the push plate 65 is provided with a bevel.

[0045] Specifically, the left side of the push plate 65 is provided with a bevel. Initially, the slide plate 51 is located on the right side of its moving range. At this time, the push plate 65 pushes the connecting member 63 upward, so that the connecting member 63 is located above the driving shaft 61 in the height direction. When cleaning the tin storage cavity 323, the slide plate 51 moves to the left, the connecting member 63 separates from the push plate 65 and moves to the top of the driving shaft 61, and then the third spring 64 pushes the connecting member 63 downward, so that the connecting member 63 and the driving shaft 61 are assembled together; after cleaning, the slide plate 51 moves to the right, and the bevel on the left side of the push plate 65 contacts the connecting member 63 and pushes the connecting member 63 upward to reset. It should be noted that the downward stroke of the connecting member 63 is greater than the downward stroke of the driving shaft 61 to ensure that the connecting member 63 can be assembled with the driving shaft 61.

[0046] like Figure 4-6 As shown, the control mechanism 6 also includes: a tension spring 66 arranged on the bracket 2 for driving the slide plate 51 away from the adjustment ring 44; a second magnetic block 67 fixedly connected to the slide plate 51; and a magnetic attraction plate 68 fixedly connected to the lifting plate 41. After the lifting plate 41 moves downward, the magnetic attraction plate 68 is aligned with the second magnetic block 67 and drives the slide plate 51 to move into the adjustment ring 44.

[0047] Specifically, the tension spring 66 is used to pull the slide plate 51 to move right, and the magnetic plate 68 can be made of magnetic metal material or a magnet. Initially, the magnetic plate 68 is located below the second magnetic block 67. After the lifting plate 41 moves down, the magnetic plate 68 moves down to be horizontally aligned with the second magnetic block 67. The magnetic plate 68 and the second magnetic block 67 are attracted to each other, thereby driving the slide plate 51 to move left.

[0048] Working principle: When decomposing the solder of the circuit board assembly, the circuit board assembly is placed on the workbench 1, and the bracket 2 is moved by a robot or manual operation so that the tin suction head 322 in the left tin suction device 32 contacts the solder on the circuit board assembly, and the tin suction device 32 and the heating unit are started. After the solder is melted, the tin suction head 322 quickly sucks the molten solder into the tin storage cavity 323, and this process is repeated until the solder on the solder joint is removed. After the circuit board assembly is taken out from the workbench 1, the component can be removed from the circuit board, thereby completing the tin removal and decomposition work of the circuit board assembly.

[0049] After the left solder sucker 32 has worked for a period of time, a large amount of tin is stored in the tin storage cavity 323, and the tin storage cavity 323 needs to be cleaned. At this time, the placement plate 31 is started to rotate, so that the positions of the two solder suckers 32 are swapped, and the solder sucker 32 to be cleaned moves to the right side; During the rotation of the storage tray 31, the edge plate 33 in the tin sucker 32 to be cleaned contacts the top plate 34 and moves upward. Then, the tin sucking head 322 in the tin sucker 32 to be cleaned moves to the inside of the clamp seat 42 and is located between the two clamping plates 43. The driving shaft 61 is started to rotate and move downward. The driving shaft 61 drives the clamp seat 42 to rotate and the lifting plate 41 to move downward. After the clamping plate 43 in the clamp seat 42 moves downward relative to the adjusting ring 44, the adjusting ring 44 squeezes the clamping plate 43 to move inward, so that the clamping plate 43 clamps the tin sucking head 322. The clamping plate 43 clamps the tin sucking head 322 and moves downward, and the tin sucking head 322 is screwed off the cylinder 321. After the tin sucking head 322 is removed, the driving shaft 61 does not move downward any more. After the lifting plate 41 moves down, the magnetic plate 68 moves down to be horizontally aligned with the second magnetic block 67. The magnetic plate 68 and the second magnetic block 67 are attracted to each other, thereby driving the slide plate 51 to move left, so that the connecting member 63 moves to the top of the active shaft 61. At this time, the connecting member 63, the driven shaft 62 and the active shaft 61 are coaxial, and the connecting member 63 is separated from the push plate 65. The third spring 64 pushes the connecting member 63 to move down, so that the active shaft 61 is inserted into the assembly groove 631. The active shaft 61 and the assembly groove 631 are frictionally matched, driving the connecting member 63 and the driven shaft 62 to rotate, and the driven shaft 62 drives the swivel 52 to rotate. During the rotation of the swivel 52, the first magnetic plate 68 and the driven shaft 62 are attracted to each other, thereby driving the slide plate 51 to move left, so that the connecting member 63 moves to the top of the active shaft 61. Block 54 contacts each magnetic piece in turn, and attracts or repels each magnetic piece respectively, and the magnetic force drives the cleaning brush 53 to reciprocate up and down. The cleaning brush 53 rotates and moves up and down along the inner wall of the tin storage chamber 323 to clean the tin storage chamber 323 and the tin suction head 322. In this way, the function of cleaning the tin storage chamber 323 is realized without stopping the tin removal and decomposition work, thereby improving the work efficiency. The disassembly and assembly of the tin suction head 322 and the movement of the cleaning brush 53 can be realized through an active shaft 61, which saves the trouble of setting up multiple sets of electrical drive devices, simplifies the structure, and has a high degree of automation, which is suitable for automated assembly line production.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A circuit board assembly disassembly device, comprising a workbench (1), wherein a bracket (2) is movably provided on the workbench (1), and characterized in that: The bracket (2) is provided with a tin removal mechanism (3) for removing solder on the circuit board, and the tin removal mechanism (3) comprises: Rotating a storage tray (31) disposed on the bracket (2); A plurality of tin suckers (32) are evenly distributed in an annular shape on the storage tray (31), the tin suckers (32) comprising a cylinder (321) and a tin sucker head (322), the cylinder (321) being slidably disposed on the storage tray (31), a cylindrical tin storage cavity (323) being provided inside the cylinder (321), the tin sucker head (322) being threadedly connected to the bottom end of the cylinder (321), the tin sucker (32) being located above the workbench (1), one of the tin suckers (322) being lower than the other tin suckers (322).

2. A circuit board assembly disassembly device according to claim 1, characterized in that: The tin removal mechanism (3) further comprises: An edge plate (33) fixedly connected to the cylinder (321); A top plate (34) fixedly connected to the bracket (2), the side wall of the top plate (34) being provided with a slope, and when the storage tray (31) rotates, after the edge plate (33) contacts the top plate (34), the top plate (34) pushes the edge plate (33) to move upward; A first spring (35) is provided on the storage tray (31) and is used to drive the cylinder (321) to move downward.

3. A circuit board assembly disassembly device according to claim 2, characterized in that: It also includes a disassembly and assembly mechanism (4) for disassembling and assembling the desoldering head (322), the disassembly and assembly mechanism (4) comprising: A lifting plate (41) slidably disposed on the bracket (2); Rotating a clamping seat (42) disposed on the lifting plate (41); A plurality of clamping plates (43) are slidably plugged into the clamping seat (42), and the clamping plates (43) are used to clamp the desoldering head (322).

4. A circuit board assembly disassembly device according to claim 3, characterized in that: The disassembly and assembly mechanism (4) further comprises: an adjusting ring (44) fixedly connected to the bracket (2), wherein the top section of the adjusting ring (44) is in a conical shape, and the bottom section of the adjusting ring (44) is in a cylindrical shape; A second spring (45) is provided on the clamp seat (42) and is used to push the clamp plate (43) to move outward, and the end of the clamp plate (43) abuts against the inner wall of the adjustment ring (44).

5. A circuit board assembly disassembly device according to claim 4, characterized in that: A notch is provided on the side wall of the adjusting ring (44) for the solder sucker (32) to pass through, and an arc section is provided at the end of the clamping plate (43), wherein the arc length of the arc section is greater than the width of the notch.

6. A circuit board assembly disassembly device according to claim 5, characterized in that: It also includes a cleaning mechanism (5), wherein the cleaning mechanism (5) includes: A slide plate (51) slidably mounted on the bracket (2), wherein a through hole for the slide plate (51) to pass through is provided on a side wall of the adjustment ring (44); Rotating a rotating ring (52) provided on the slide plate (51); A cleaning brush (53) is slidably mounted on the rotating ring (52), and the bottom end of the cleaning brush (53) is a telescopic structure.

7. A circuit board assembly disassembly device according to claim 6, characterized in that: The cleaning mechanism (5) further comprises: A first magnetic block (54) fixedly connected to the cleaning brush (53); A plurality of groups of magnetic sheet groups (55) are fixedly connected to the bottom end of the storage tray (31), the magnetic sheet groups (55) comprising magnetic sheets evenly distributed in an annular shape, and when the rotating ring (52) rotates below the storage tray (31), the cleaning brush (53) reciprocates up and down under the action of the magnetic sheet groups (55) and the first magnetic block (54).

8. A circuit board assembly disassembly device according to claim 7, characterized in that: It also includes a control mechanism (6), wherein the control mechanism (6) includes: Rotating a driving shaft (61) disposed on the lifting plate (41), wherein transmission is performed between the driving shaft (61) and the clamping seat (42) via a first chain belt (611); Rotating a driven shaft (62) disposed on the slide plate (51), wherein transmission is performed between the driven shaft (62) and the rotating ring (52) via a second chain belt (621); A connecting piece (63) movably inserted into the driven shaft (62), wherein the bottom end of the connecting piece (63) is provided with an assembly groove (631) corresponding to the driven shaft (62); when the connecting piece (63) moves downward and the assembly groove (631) is sleeved on the outside of the driven shaft (62), the driven shaft (62) rotates and drives the driven shaft (62) to rotate.

9. A circuit board assembly disassembly device according to claim 8, characterized in that: The control mechanism (6) further comprises: a third spring (64) provided on the driven shaft (62) and used for pushing the connecting member (63) to move downward; A push plate (65) fixedly connected to the bracket (2) and used for driving the connecting member (63) to move upward, wherein an end of the push plate (65) is provided with a beveled edge.

10. A circuit board assembly disassembly device according to claim 9, characterized in that: The control mechanism (6) further comprises: A tension spring (66) disposed on the bracket (2) and used for driving the slide plate (51) away from the adjustment ring (44); A second magnetic block (67) fixedly connected to the slide plate (51); A magnetic attraction plate (68) is fixedly connected to the lifting plate (41); after the lifting plate (41) moves downward, the magnetic attraction plate (68) is aligned with the second magnetic block (67) and drives the slide plate (51) to move into the adjustment ring (44).

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