Chip polishing head capable of being quickly disassembled and assembled

Abstract

The invention discloses a chip polishing head capable of being quickly disassembled and assembled. The chip polishing head comprises a bearing part and a polishing part. The upper part of the bearing part is a connecting shaft, and the lower part of the bearing part is a bearing main body; the polishing part comprises a body, a middle shaft plate, an air bag, a fixed template and a plug-in template, the body is provided with a connecting cavity, the air bag and the middle shaft plate are sequentially mounted in a central mounting hole in the bottom surface of the cavity, the bearing body is embedded into the connecting cavity and rotates synchronously, the side wall and the bottom surface of the bearing body are matched with corresponding parts of the connecting cavity, and a gap between the bottom surfaces of the bearing body and the connecting cavity is adjustable; the top of the middle shaft plate is embedded into the middle shaft hole in sealing fit. The center of a fixed template fixed on the bottom surface of the polishing part body is provided with a central clamping groove clamping connector template, and the connector template is provided with a clamping groove matched with a chip in appearance. The bearing part and the center shaft plate are respectively provided with a center guide hole and a center shaft guide hole which are communicated to supply vacuum or pressing air pressure to the air bag. According to the invention, the template can be conveniently dismounted and adjusted according to the specification of a processed chip, and the application is flexible.

Description

Technical Field

[0001] The invention relates to a grinding and polishing device, in particular to a chip polishing head which can be quickly disassembled and assembled. Background Art

[0002] During the CMP polishing process of semiconductor wafers, chemical mechanical polishing is required on the front or back of the wafer. The CMP polishing head is used to adsorb and fix the wafer and control the pressure of the wafer during the CMP process. The surface of the wafer after CMP treatment can achieve a certain amount of material removal, good surface finish, and good surface consistency.

[0003] The current CMP polishing head is aimed at large wafers with a diameter of 4 to 12 inches. It uses the pressure under the retaining ring and the multi-zone pressure control on the back of the wafer. The multi-zone airbag on the back of the wafer can directly control the pressure on the wafer. Some research institutes and universities in the R&D stage usually use small chips, such as square chips with a length and width of 10mm x10mm, 15mmx 15mm, 20mm x 20mm, etc., or 2-inch wafers. Small chips are easily contaminated and damaged by conventional polishing heads, or damage to components such as retaining rings, resulting in excessive costs. Summary of the invention

[0004] In view of the above-mentioned defects in the prior art, the task of the present invention is to provide a chip polishing head that can be quickly disassembled and assembled, which is suitable for CMP polishing of small chips and is easy to clean, maintain and replace.

[0005] The technical solution of the present invention is as follows: a chip polishing head that can be quickly disassembled and assembled comprises a bearing part and a polishing part, the upper part of the bearing part is a connecting shaft, the lower part of the bearing part is a bearing body, the bottom surface of the bearing body is provided with a central axis hole, the polishing part comprises a polishing part body, a central axis plate, an airbag, a fixed template and a plug-in template, the polishing part body is provided with a connecting cavity, the bottom surface of the connecting cavity is provided with a central mounting hole, the airbag and the central axis plate are detachably mounted in the central mounting hole in turn, the bearing body is embedded in the connecting cavity, the bearing part rotates synchronously with the polishing part, and the side of the bearing body The wall is sealed with the cavity wall of the connecting cavity, the gap between the bottom surface of the bearing body and the bottom surface of the connecting cavity is adjustable, the top of the central axis plate is embedded in the central axis hole, the side wall of the top of the central axis plate is sealed with the hole wall of the central axis hole, a fixed template is fixed to the bottom surface of the polishing part body, a central card slot is provided in the center of the fixed template for card-connecting the plug-in template, a chip card slot adapted to the chip shape is provided on the plug-in template, a central guide hole is provided on the bearing part, and a central axis plate is provided with a central axis guide hole, and the central guide hole is connected with the central axis guide hole to provide vacuum or downward pressure for the airbag.

[0006] Furthermore, a groove is provided on the outer periphery of the central mounting hole, the edge of the airbag is a sealing flange, and the central axis plate presses the sealing flange tightly into the groove, so that the airbag and the polishing part body can be disassembled and assembled more conveniently.

[0007] Furthermore, a pressure plate hole is provided at the upper portion of the center mounting hole, a fixed pressure plate is detachably connected to the pressure plate hole, the pressure plate hole and the center mounting hole form a step hole, and the edge of the center axis plate is pressed against the end face of the center mounting hole by the fixed pressure plate.

[0008] Furthermore, the bearing portion is provided with a side guide hole communicating with the gap, and the side guide hole provides vacuum or air pressure to press down the polishing portion.

[0009] Furthermore, the bottom surface of the central axis plate is an adsorption surface, and the adsorption surface is provided with a plurality of adsorption holes, the number of the adsorption holes is the same as the number of the chip card slots on the plug-in template, and the positions of the adsorption holes are opposite to the positions of the chip card slots.

[0010] Furthermore, a pin column and a pin hole are provided between the bottom surface of the bearing body and the bottom surface of the connecting cavity, which cooperate with each other to facilitate alignment of the bearing part and the polishing part, and to enable the bearing part and the polishing part to rotate synchronously without other cooperation structures.

[0011] Furthermore, sealing rings are provided on the side walls of the bearing body and the hole walls of the central axis hole.

[0012] Furthermore, in order to facilitate the alignment and cooperation between the plug-in template and the fixed template, a notch is provided at the contour edge or corner position of the central slot, and a protrusion corresponding to the notch is provided on the side of the plug-in template.

[0013] Furthermore, a first material guide groove is provided on the surface of the fixed template, and a second material guide groove is provided on the surface of the plug-in template. The fixed template and the plug-in template have the same thickness, and the first material guide groove and the second material guide groove extend and dock with each other.

[0014] Furthermore, the first material guide groove and the second material guide groove extend radially outward from the center of the plug-in template.

[0015] The advantages of the present invention compared with the prior art are: The present invention can be easily and flexibly applied to the CMP polishing application of chips of various sizes by replacing accessories (plug-in template, airbag and central axis plate), and the cost is low. When the present invention is used for CMP polishing, the upper and lower chips of the chip are manually put in and taken out, and the detachable polishing part is installed or removed by manual lifting. During the whole process, the operator can more easily understand and grasp the overall adsorption state of the chip, as well as the surface state of the airbag and the polishing part, and can clean, maintain and replace them in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic cross-sectional structure diagram of a chip polishing head that can be quickly disassembled and assembled according to an embodiment.

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of the bearing part.

[0018] Figure 3 It is a schematic diagram of the cross-sectional structure of the polishing part.

[0019] Figure 4 Schematic diagram of the central shape of the airbag.

[0020] Figure 5 It is a schematic diagram of the structure of the central axis plate.

[0021] Figure 6 Schematic diagram of the bottom shape of the center axis plate.

[0022] Figure 7 This is a structural diagram of a fixed template.

[0023] Figure 8 This is a schematic diagram of the plug-in template structure.

[0024] Fig. 9 It is a schematic diagram of the state of the quickly detachable chip polishing head during vacuum adsorption according to the embodiment.

[0025] Fig.10 It is a schematic diagram of the state of the quickly detachable chip polishing head of the embodiment when the polishing part is pressed down.

[0026] Fig.11 It is a schematic diagram of the state of the quickly detachable chip polishing head of the embodiment when the airbag is pressed down. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the embodiments, but are not intended to limit the present invention.

[0028] Please combine Figure 1 , Figure 2As shown, the present embodiment involves a chip polishing head that can be quickly disassembled and assembled, including a bearing part 1 and a polishing part 2. The upper part of the bearing part 1 is a rotating shaft, which is used to connect with a motor (not shown), and the bearing part 1 can rotate under the drive of the motor. The lower part of the bearing part 1 is a bearing body 101. There is a central guide hole 102 and a side guide hole 103 in the bearing part 1. The side guide hole 103 includes a first section 103a located at the upper part of the bearing part 1 and a second section 103b located at the lower part of the bearing part 1, and the two are connected by an external pipe line to form an axial side pipeline. There is a central axis hole 104 in the middle of the bottom surface of the bearing body 101, which is connected to the central guide hole 102, and a sealing ring 105 is provided on the hole wall of the central axis hole 104. The side wall of the bearing body 101 is provided with a sealing ring 105, and the bottom of the bearing body 101 is provided with a pin 3 and a pin hole 4, which are used to cooperate with the polishing part 2 for synchronous rotation.

[0029] Please combine Figures 2 to 6 As shown, the polishing part 2 mainly includes a polishing part body 5, a central axis plate 6, an airbag 7, a fixed template 8 and an insert template 9. A connecting cavity 501 is provided on the polishing part body 5, and the shape of the connecting cavity 501 is adapted to the shape of the bearing body 101. A pin 3 and a pin hole 4 are also provided on the bottom surface of the connecting cavity 501, which correspond to the pin 3 and the pin hole 4 at the bottom of the bearing body 101. When the bearing body 101 is installed in the connecting cavity 501, the pin 3 at the bottom of the bearing body 101 and the pin hole 4 at the bottom of the connecting cavity 501 are plugged together, and the pin hole 4 at the bottom of the bearing body 101 and the pin 3 at the bottom of the connecting cavity 501 are plugged together. When the bearing part 1 rotates, the polishing part 2 can be driven to rotate synchronously through the pin 3 and the pin hole 4. The sealing ring 105 on the side wall of the bearing body 101 cooperates with the side wall of the connecting cavity 501 to seal.

[0030] A central mounting hole is provided at the center of the bottom surface of the connecting cavity 501, and the upper part of the central mounting hole is a pressure plate hole, and the pressure plate hole and the central mounting hole form a stepped hole structure. The central axis plate 6 and the airbag 7 are installed in the central mounting hole, and a groove 502 is provided on the stepped surface of the stepped hole at the periphery of the central mounting hole. Figures 4 to 6 As shown, the edge of the airbag 7 is a ring-shaped sealing flange 701, and the middle part 702 of the airbag 7 is a circle or square with the same shape as the bottom surface 602 of the central axis plate 6. Figure 4 As shown in (a) in FIG. 1 , the corresponding center axis plate 6 is as shown in FIG. Figure 6 In (a) and (b), the center is a square airbag 7 ( Figure 4 As shown in (b) in FIG. 1 , the corresponding center axis plate 6 is as shown in FIG. Figure 6 (c) (d) The central axis plate 6 has a disc structure, and the annular fixed pressure plate 10 is connected in the pressure plate hole, pressing the disc structure of the central axis plate 6 and pressing the sealing flange 701 of the airbag 7 in the groove 502. The top of the central axis plate 6 is a shaft-shaped structure. When the bearing body 101 is installed in the connecting cavity 501, the top of the central axis plate 6 is inserted into the central axis hole 104, and the sealing ring 105 of the central axis hole 104 is sealed with the central axis hole 104. A central axis guide hole 601 is opened in the central axis plate 6, and the central guide hole 102 is connected with the central axis guide hole 601 after the bearing part 1 and the polishing part 2 are connected and installed.

[0031] Please combine Figure 7 , Figure 8 As shown, the bottom of the polishing part 2 is a fixed template 8 and a plug-in template 9. The fixed template 8 and the plug-in template 9 are made of corrosion-resistant and wear-resistant Peek or epoxy glass fiber board and other materials. The thickness of the fixed template 8 is consistent with that of the plug-in template 9 and is slightly larger than the thickness of the chip to be processed. The fixed template 8 is fixed to the bottom of the polishing part body 5 by screws or adhesive bonding. A center card slot 801 is provided in the center of the fixed template 8 for plug-in template 9 to be connected. The shape of the center card slot 801, the shape of the plug-in template 9 and the shape of the middle part of the airbag 7 correspond to each other. In order to facilitate the alignment of the plug-in template 9 and the fixed template 8, a notch 802 is provided at the contour edge or corner position of the center card slot 801, and a protrusion 901 corresponding to the notch 802 is provided on the side of the plug-in template 9. As shown Figure 7 In (a), Figure 8 As shown in (a) and (b) in the figure, the central slot 801, the plug-in template 9 and the middle of the airbag 7 are all circular. Correspondingly, a notch 802 is set at each of the four equal positions of the contour edge of the central slot 801, and four protrusions 901 are set on the side of the plug-in template 9. When the plug-in template 9 is installed, the protrusions 901 are inserted into the notches 802. Or as Figure 7 (b) in the above equation, Figure 8 As shown in (c) and (d) in the figure, the central slot 801, the plug-in template 9 and the middle of the airbag 7 are all square. A notch 802 is provided at each corner of the central slot 801, and a protrusion 901 is provided at each corner of the square plug-in template 9.

[0032] One or more chip slots 902 are provided on the plug-in template 9. When multiple chip slots 902 are provided, they are evenly distributed. The number of chip slots 902 on the plug-in template 9 is the same as the number of adsorption holes 603 on the central axis plate 6, and the positions are relative, such as Figure 6 The center axis plate 6 shown in (a) and (c) Figure 8 The plug-in template 9 shown in (a) and (c) corresponds to the following. Figure 6 The center axis plate 6 shown in (b) and (d) Figure 8The plug-in template 9 shown in (b) and (d) corresponds to the suction hole 603 and the central axis guide hole 601 of the central axis plate 6.

[0033] The surface of the fixed template 8 is provided with a first material guide groove 803, and the surface of the plug-in template 9 is provided with a second material guide groove 903. After the plug-in template 9 is installed on the fixed template 8, the first material guide groove 803 and the second material guide groove 903 are radially arranged to extend outward from the center of the plug-in template 9. In addition, a third material guide groove 904 in an annular shape or perpendicular to the second material guide groove 903 can be provided on the surface of the plug-in template 9 to discharge particles generated by grinding.

[0034] The specific method of using the quickly detachable chip polishing head of this embodiment is as follows: In the first step, the polishing part 2 is turned over and the bottom surface of the fixed template 8 is placed on the table. The plug-in template 9 matching the chip size is selected and inserted into the central card slot 801 of the fixed template 8. Then, clean water is dripped into the chip card slot 902 of the plug-in template 9, and then the square chip is placed into the corresponding chip card slot 902 with the polished surface facing up.

[0035] The second step is, Fig. 9 , turn over the polishing part 2 with the chip adsorbed, with the chip facing downward, align the center of the central axis plate 6 with the center of the central axis hole 104 of the receiving part, and then lift the polishing part 2 upward until the top of the central axis plate 6 is inserted into the central axis hole 104, then rotate the polishing part 2 to make the pin 3 fall into the pin hole 4, and continue to lift the polishing part 2 upward until the bottom surface of the receiving part body contacts the bottom surface of the connecting cavity 501. At this time, the vacuum of the central guide hole 102 and the side guide hole 103 is turned on, and the side guide hole 103 forms a vacuum in the gap between the bottom surface of the receiving part body and the bottom surface of the connecting cavity 501 to suck the polishing part 2 upward, and the vacuum generated by the central guide hole 102 sucks the chip.

[0036] In the third step, the bearing part 1 and the polishing part 2 move downward as a whole under the action of the motor, and stop when the fixed template 8 at the bottom of the polishing part 2 is at a certain height from the disk surface. At this time, the vacuum of the side guide hole 103 is switched to CDA pressure, and the polishing part 2 moves downward under the pressure until the surface of the fixed template 8 contacts the surface of the polishing disk (not shown) and generates a certain pressure. At this time, there is a certain gap between the bottom surface of the receiving part and the bottom surface of the connecting cavity 501, and its height is equal to the distance from the fixed template 8 to the surface of the polishing disk after the motor stops moving downward, as shown in FIG. Fig.10 Then the central guide hole 102 is switched from vacuum to CDA pressure, the airbag 7 is pressed down, pressing the plug-in template 9 while continuing to press the chip in the chip slot 902, so that it contacts the surface of the polishing disk and generates a certain pressure; at this time, the fixed template 8, the plug-in template 9, and the chip are all in contact with the polishing disk surface and generate pressure, and the chip is CMP polished at this time, as shown in FIG. Fig.11 .

[0037] In the fourth step, when the polishing time is up, the central guide hole 102 is switched to vacuum first, and the airbag 7 sucks the chip to keep it away from the disk surface. Then the side guide hole 103 is also switched to vacuum, so that the polishing part 2 moves upward under the action of vacuum, and the fixed template 8 and the chip are away from the polishing disk surface as a whole; at the same time, the bearing part 1 and the polishing part 2 move upward as a whole under the action of the motor, and are away from the disk surface as a whole.

[0038] Step 5: The motor stops moving upward, the central guide hole 102 is switched to the atmosphere, and the side guide hole 103 is switched to a certain CDA pressure. Hold the edge of the polishing part 2 with both hands and move the polishing part 2 downward until the top of the central axis plate 6 is out of the bearing part 1.

[0039] Step 6: Turn over the polishing part 2, use a water gun to rinse the fixed template 8, the plug-in template 9 and the chip surface, and manually remove the chip. After removing the chip, rinse the template surface and each card slot to clean and dry. After the chip is cleaned, measure and test it.

[0040] Through experimental verification, the chip polishing head capable of rapid disassembly and assembly of the present invention can realize rapid disassembly and assembly of the polishing head, and can also realize CMP polishing application of chips of various sizes and thicknesses. The surface finish and surface consistency of the chip after polishing all meet the application requirements. The operation is simple and the maintenance is convenient.

Claims

1. A chip polishing head that can be quickly disassembled and assembled, characterized in that: The invention comprises a bearing part and a polishing part, wherein the upper part of the bearing part is a connecting shaft, the lower part of the bearing part is a bearing body, the bottom surface of the bearing body is provided with a central axis hole, the polishing part comprises a polishing part body, a central axis plate, an airbag, a fixed template and a plug-in template, the polishing part body is provided with a connecting cavity, the bottom surface of the connecting cavity is provided with a central mounting hole, the airbag and the central axis plate are detachably mounted in the central mounting hole in sequence, the bearing body is embedded in the connecting cavity, the bearing part rotates synchronously with the polishing part, and the side wall of the bearing body is tightly connected with the cavity wall of the connecting cavity. The bottom surface of the bearing body and the bottom surface of the connecting cavity are sealed and matched, and the gap between them is adjustable. The top of the center axis plate is embedded in the center axis hole, and the side wall of the top of the center axis plate is sealed and matched with the hole wall of the center axis hole. A fixed template is fixed to the bottom surface of the polishing part body, and a center card slot is provided in the center of the fixed template for connecting the plug-in template. The plug-in template has a chip card slot adapted to the chip shape, a center guide hole is provided in the bearing part, and a center axis plate has a center axis guide hole. The center guide hole is connected to the center axis guide hole to provide vacuum or downward pressure for the airbag.

2. The quickly detachable chip polishing head according to claim 1, characterized in that: A groove is arranged on the outer periphery of the central mounting hole, the edge of the airbag is a sealing flange, and the central axis plate presses the sealing flange tightly into the groove.

3. The quickly detachable chip polishing head according to claim 2, characterized in that: A pressure plate hole is provided at the upper part of the central mounting hole, a fixed pressure plate is detachably connected to the pressure plate hole, the pressure plate hole and the central mounting hole form a stepped hole, and the edge of the central axis plate is pressed against the end face of the central mounting hole by the fixed pressure plate.

4. The quickly detachable chip polishing head according to claim 1, characterized in that: The bearing portion is provided with a side guide hole communicating with the gap, and the side guide hole provides vacuum or air pressure to press down the polishing portion.

5. The quickly detachable chip polishing head according to claim 1, characterized in that: The bottom surface of the central axis plate is an adsorption surface, and the adsorption surface is provided with a plurality of adsorption holes. The number of the adsorption holes is the same as the number of the chip card slots on the plug-in template, and the positions of the adsorption holes are opposite to the positions of the chip card slots.

6. The quickly detachable chip polishing head according to claim 1, characterized in that: A pin column and a pin hole that match each other are arranged between the bottom surface of the bearing body and the bottom surface of the connecting cavity.

7. The quickly detachable chip polishing head according to claim 1, characterized in that: The side wall of the bearing body and the hole wall of the central axis hole are provided with sealing rings.

8. The quickly detachable chip polishing head according to claim 1, characterized in that: A notch is provided at the contour edge or corner of the central slot, and a protrusion corresponding to the notch is provided at the side of the plug-in template.

9. The quickly detachable chip polishing head according to claim 1, characterized in that: A first material guide groove is provided on the surface of the fixed template, and a second material guide groove is provided on the surface of the plug-in template. The fixed template and the plug-in template have the same thickness, and the first material guide groove and the second material guide groove extend and dock with each other.

10. The quickly detachable chip polishing head according to claim 9, characterized in that: The first material guide groove and the second material guide groove extend radially outward from the center of the plug-in template.

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