Production and manufacturing process of high-temperature reflow soldering jig

Abstract

The invention discloses a production and manufacturing process of a high-temperature reflow soldering jig. The production and manufacturing process comprises the steps that S1, a metal base is selected, wherein the proper metal base is selected or manufactured; s2, spraying a high-temperature-resistant ceramic layer: spraying a layer of high-temperature-resistant ceramic particles on the surface of the metal base; s3, sintering for the first time: sintering the metal base sprayed with the high-temperature-resistant ceramic particles at the high temperature of 1000-1700 DEG C, so that the high-temperature-resistant ceramic particles are fused, permeated and adsorbed on the surface of the metal base; s4, glazing: coating a layer of glaze on the surface of the metal base subjected to primary sintering; s5, secondary sintering is conducted, specifically, the glazed metal base is sintered at the high temperature of 800-1200 DEG C; and S6, discharging and cooling a finished product.

Description

Technical field:

[0001] The invention relates to the technical field of high-temperature reflow soldering, and in particular to a production process for a high-temperature reflow soldering fixture. Background technology:

[0002] High-temperature reflow soldering is a welding process that uses high temperature to melt solder and form a strong joint. It is widely used in the fields of electronic manufacturing and thermal management. As a key thermal management component in electronic equipment, the heat dissipation module needs to achieve efficient thermal conductivity and reliable mechanical connection. The radiator has a complex structure and contains fins, copper tubes and other components. The welding quality directly affects the product performance. In order to ensure the precise positioning and connection quality of components during the welding process, high-temperature reflow soldering fixtures play an important role.

[0003] During the high-temperature reflow soldering process, the fixture is mainly responsible for positioning, fixing and supporting the soldered parts to ensure that the soldering position and posture of each part are correct. The design of the fixture can make the production process more efficient and stable and ensure the quality of the final product. Its role is reflected in the following aspects:

[0004] 1. Precise positioning: High-temperature reflow soldering requires that the fins, copper tubes and other welding parts maintain precise alignment during the soldering process. The fixture is customized to ensure that the positions of the various parts do not shift during soldering, thereby ensuring the stability of the soldering effect. In particular, the docking position requirements for the fins and copper tubes are extremely high, and any deviation may lead to uneven heat conduction, thereby affecting the heat dissipation effect.

[0005] 2. Maintain welding stability: During high-temperature reflow soldering, the solder becomes more fluid when it reaches the melting temperature. The fixture can ensure close contact between the fin and the copper tube during soldering to prevent insufficient solder flow or cold soldering. The fixing function of the fixture can effectively reduce the error during soldering and ensure that the strength and thermal conductivity of the solder joints meet the design requirements.

[0006] 3. Uniformity of heat distribution: During the heating stage of reflow soldering, the material selection of the fixture is crucial. The fixture is made of materials with good thermal conductivity to help the welding area to be heated evenly, avoid local overheating or overcooling, and maintain the temperature consistency of the welding area, thereby ensuring uniform flow and solidification of the solder.

[0007] At present, most of the common high-temperature reflow soldering fixtures on the market are made of a single metal material, such as stainless steel, aluminum alloy, etc. These fixtures have been widely used in the production process of high-temperature reflow soldering due to the high strength, easy processing and durability of metal materials. However, as the requirements for precision, thermal stability and long life of the welding process continue to increase, the shortcomings of traditional single metal material fixtures are gradually emerging. For example:

[0008] 1. Thermal expansion affects accuracy: The thermal expansion coefficient of metal materials is relatively high (for example, the thermal expansion coefficient of aluminum is 23.1×10 -6 / ℃, stainless steel is 16×10 -6 / ℃), during high-temperature reflow soldering, when the ambient temperature reaches 250℃ to 280℃, the fixture may experience significant thermal expansion. This thermal expansion will cause slight changes in the size and shape of the fixture, which will affect the precise positioning of the fins and copper tubes, and may cause soldering offset or uneven solder flow.

[0009] 2. Uneven heat distribution: Although traditional metal fixtures have good thermal conductivity, the thermal conductivity may not be uniform on fixtures with complex shapes, especially in large-sized fixtures or designs with uneven local thickness. Some areas may be overheated, while other areas may not be hot enough. This uneven heat distribution will directly affect the welding effect, resulting in reduced welding strength or poor solder joints.

[0010] 3. Limited high temperature resistance: Although metal materials can withstand high temperatures, they may suffer from thermal fatigue, oxidation or deformation in a long-term high temperature welding environment (such as continuous reflow soldering). For example, stainless steel may lose some of its mechanical strength at high temperatures, and even suffer from surface oxidation and corrosion, which will affect the service life of the fixture.

[0011] 4. Susceptible to chemical corrosion: During the high-temperature reflow soldering process, the flux and welding flux may contain certain chemical corrosiveness. Long-term use may cause corrosion on the surface of the metal fixture or peeling of the coating, further affecting its durability and welding effect.

[0012] In view of this, the inventor proposes the following technical solution. Summary of the invention:

[0013] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a production process for a high-temperature reflow soldering fixture.

[0014] In order to solve the above technical problems, the present invention adopts the following technical solution: a production process of a high-temperature reflow soldering fixture, comprising:

[0015] S1, select metal base: select or make a suitable metal base;

[0016] S2, spraying a high temperature resistant ceramic layer: spraying a layer of high temperature resistant ceramic particles on the surface of the metal base;

[0017] S3, first sintering: sintering the metal base sprayed with high temperature resistant ceramic particles at a high temperature of 1000°C-1700°C, so that the high temperature resistant ceramic particles are fused and infiltrated and adsorbed on the surface of the metal base;

[0018] S4, glazing: applying a layer of glaze on the surface of the metal base after the primary sintering;

[0019] S5, second sintering: sintering the glazed metal base at a high temperature of 800°C-1200°C;

[0020] S6, finished product is taken out of the oven and cooled.

[0021] Furthermore, in the above technical solution, the material of the metal base is one of iron, stainless steel, copper, or an alloy of two or more, and the surface of the metal base is formed with a plurality of positioning grooves for positioning by wire cutting.

[0022] Furthermore, in the above technical solution, the high temperature resistant ceramic particles and glaze are sprayed on the positioning groove to increase the high temperature resistance, wear resistance and corrosion resistance of the positioning groove, and can make the surface of the positioning groove smoother to facilitate the disassembly and assembly of the workpiece.

[0023] Furthermore, in the above technical solution, during the first sintering, the metal base sprayed with high-temperature resistant ceramic particles is transferred to a high-temperature sintering furnace and sintered at a high temperature of 1000°C-1700°C for more than 24 hours.

[0024] Furthermore, in the above technical solution, the high temperature resistant ceramic particles include but are not limited to any one of aluminum oxide particles, zirconium oxide particles, silicon nitride particles, silicon carbide particles, magnesium oxide particles, and silicate particles, or a mixture of two or more thereof, and the particle size of the high temperature resistant ceramic particles is 0.5 μm-50 μm, and the specific surface area is 1-20 m 2 / g, density is 2.5g / cm 3 -6.0g / cm 3 .

[0025] Furthermore, in the above technical solution, the glaze composition includes 50-60% calcium borate glass powder, 20-30% feldspar, 10-20% quartz, and 1-3% zinc oxide.

[0026] Furthermore, in the above technical solution, the glaze is sprayed on the surface of the high temperature resistant ceramic layer, and the metal base is transferred to a high temperature furnace, sintered at 950℃-1100℃ for 30-60min, and cooled for 8-12h.

[0027] After adopting the above technical scheme, the present invention adopts a method of first coating a layer of high-temperature resistant ceramic particles on the metal base by spraying, and sending the metal base coated with the high-temperature resistant ceramic particle layer into a high-temperature furnace for sintering, so that the high-temperature resistant ceramic particles melt and adhere to the metal base, and utilize the smooth wear-resistant properties of the ceramic to improve the smoothness of the clamping of the heat sink fins, and the high-temperature resistant ceramic particle layer can improve the high-temperature resistance, wear resistance, corrosion resistance and other properties of the metal base, and then spray a layer of glaze on the high-temperature resistant ceramic particle layer, and send the metal base coated with the glaze layer into a high-temperature furnace for secondary high-temperature sintering, so that the glaze is completely attached to the high-temperature resistant ceramic particle layer, and the high-temperature resistant ceramic particle layer is completely wrapped for protection, so that the high-temperature resistant ceramic particle layer meets the requirements of high-temperature resistance, strong acid and alkali resistance, corrosion resistance, wear resistance, etc., realizes the long-term stability of the fixture performance during high-temperature reflow soldering, and reduces the wear between the fixture and the heat sink fins when clamping, thereby greatly improving the yield rate of the radiator module. Description of the drawings:

[0028] Figure 1 It is a structural schematic diagram of the present invention. Specific implementation method:

[0029] The present invention is further described below in conjunction with specific embodiments and drawings.

[0030] See Figure 1 As shown, it is a structural schematic diagram. In the present invention, a layer of high-temperature resistant ceramic particles is sprayed on the metal base 1. The high-temperature resistant ceramic particles can be sprayed several times, and the specific number of times can be appropriately adjusted according to the base material and the composition of the ceramic particles. Then, the metal base 1 sprayed with a layer of high-temperature resistant ceramic particles is transferred to a high-temperature furnace, and sintered at 800℃-1200℃, so that the high-temperature resistant ceramic particles are fused to the surface of the metal base 1, and a layer of high-temperature resistant ceramic layer 2 is formed. The surface of the high-temperature resistant ceramic layer 2 is smooth and has tiny protrusions, so that the heat sink fins can slide in the positioning groove of the metal base 1, reducing the wear on the heat sink fins. Finally, a layer of glaze is applied to the surface of the high-temperature resistant ceramic layer 2, and it is transferred to a high-temperature furnace for sintering at 800℃-1200℃, so that the glaze layer 3 is completely attached to the high-temperature resistant ceramic layer 2. The glaze layer 3 can improve the surface wear resistance, protect the high-temperature resistant ceramic layer 2 from damage, and prevent the high-temperature resistant ceramic layer 2 from falling off, thereby improving the service life of the fixture.

[0031] Specifically, the production of fixtures includes the following processes:

[0032] S1, choose a metal base: For high-temperature reflow soldering within 800℃, the base can be made of ordinary iron, stainless steel, copper and other conventional materials. For high-temperature reflow soldering at 800℃ or even higher, ordinary iron foundations are difficult to meet the requirements of long-term use. High-temperature stainless steel is usually used instead, such as 310S and 316Ti stainless steel, which can withstand high temperatures of about 1000℃, have excellent oxidation resistance and creep resistance, and are suitable for medium and high temperature welding environments. Alternatively, nickel-based alloys, such as Inconel718 and Inconel625, still have high strength and stability at high temperatures of 800℃-1000℃, and also have high oxidation resistance and corrosion resistance. Of course, for higher temperature working requirements, chromium-aluminum-iron alloys (working temperatures can reach 1200℃), molybdenum alloys (working temperatures can reach 2000℃, and need to be used in vacuum or protective atmosphere), etc. can also be used.

[0033] After selecting the metal base, it is necessary to form multiple positioning grooves for positioning the heat sink fins on the surface of the metal base through wire cutting and other methods. During welding, at least two fixtures are used to buckle and hold the heat sink fins and the heat sink copper tube to form a heat sink module.

[0034] S2, spraying a high temperature resistant ceramic layer: spraying a layer of high temperature resistant ceramic particles on the surface of the metal base; the high temperature resistant ceramic particles include but are not limited to any one of aluminum oxide particles, zirconium oxide particles, silicon nitride particles, silicon carbide particles, magnesium oxide particles, and silicate particles, or a mixture of two or more thereof; the particle size of the high temperature resistant ceramic particles is 0.5 μm-50 μm, and the specific surface area is 1-20 m 2 / g, density is 2.5g / cm 3 -6.0g / cm 3 .

[0035] Specifically, the selection of high temperature resistant ceramic particles should be based on the actual use conditions and the properties of different high temperature resistant ceramic particles, as described below:

[0036] Alumina particles (Al 2 O 3 ): Temperature resistance range 1200℃-1600℃, high hardness and excellent wear resistance.

[0037] Zirconia particles (ZrO 2 ): Temperature range is about 2000℃, and thermal shock resistance is good.

[0038] Titanium oxide particles (TiO 2 ): Temperature resistance range is 1000℃-1500℃, with good adhesion, suitable for composite coating.

[0039] Aluminum silicate particles (Al 2 SiO 5): Has excellent high temperature resistance and corrosion resistance.

[0040] Composite ceramic particles: mixed alumina particles, zirconium oxide particles, aluminum silicate particles, etc. to improve comprehensive performance.

[0041] Among them, the particle size of ceramic particles is generally 15μm-75μm, and the specific particle size is adjusted according to the spraying process and coating thickness requirements. Commonly used spraying methods are as follows:

[0042] Plasma spraying: Ceramic particles are quickly melted by high-temperature plasma arc, and sprayed onto the metal surface through high-speed airflow to form a coating. The temperature can reach 10,000°C, which is suitable for high melting point materials (such as alumina and zirconia). The coating has good density and is resistant to high temperature and wear. The spraying distance is generally 80mm-150mm. The particle size is 15μm-75μm. In addition, the metal base usually needs to be preheated to 200℃-400℃ before spraying to improve adhesion.

[0043] High-speed flame spraying: By burning gas (such as acetylene) and oxygen, a high-speed high-temperature airflow is generated to accelerate the ceramic particles and spray them onto the metal surface. The airflow temperature is 2800℃-3200℃, which is suitable for medium and high melting point ceramic materials. The spraying speed is generally 500-700m / s. The particle size is 10μm-60μm. The coating thickness is generally 50μm-200μm.

[0044] Flame spraying: The heat generated by the combustion of oxygen and fuel gas (such as propane, acetylene) is used to heat the ceramic powder to a semi-molten state and spray it onto the metal surface. The temperature range is generally 2,000℃-3,000℃. The spraying distance is generally 100mm-200mm. The particle size is 20μm-80μm. The coating thickness is generally 50μm-500μm.

[0045] Cold spraying: Use high-pressure gas (usually helium or nitrogen) to spray ceramic particles at high speed onto the metal surface to achieve mechanical bonding under high kinetic energy impact. The spraying speed is generally 600-1200m / s. The gas pressure is 2MPa-4MPa. The particle size is 5μm-50μm.

[0046] The specific spraying method can be found in the following table:

[0047] Way Temperature range Coating density Bonding strength Plasma spraying 10000℃ high Medium to high High velocity flame spraying 2800℃-3200℃ high high Flame spraying 2000℃-3000℃ medium medium Cold spray <1000℃ Medium-low Medium-low

[0048] S3, first sintering: sintering the metal base sprayed with high temperature resistant ceramic particles at a high temperature of 1000°C-1700°C, so that the high temperature resistant ceramic particles are fused and infiltrated and adsorbed on the surface of the metal base;

[0049] For different types of high temperature resistant ceramic particles, there are specific parameter requirements during sintering, which depend on the chemical properties of the ceramic material, the particle size and the expected coating performance. The following table shows the parameter requirements for sintering and adhesion of several common high temperature resistant ceramic particles:

[0050]

[0051] Note:

[0052] 1. Pretreatment to ensure particle purity and uniformity of dispersion. If necessary, use sintering aids to reduce the sintering temperature.

[0053] 2. Atmosphere control: Different materials are sensitive to the atmosphere, so appropriate protective gas or vacuum environment must be selected.

[0054] 3. Cooling rate: Select the cooling rate according to the thermal expansion characteristics of the material to avoid cracking or deformation caused by internal stress.

[0055] S4, glazing: a layer of glaze is applied to the surface of the metal base after the primary sintering; wherein the glaze is sprayed on the side of the metal base where the barcode or QR code is printed. The glazing process can improve the wear resistance, corrosion resistance and waterproof performance of the high temperature resistant ceramic particle layer. The glaze composition includes 50-60% calcium borate glass powder, 20-30% feldspar, 10-20% quartz and 1-3% zinc oxide.

[0056] Of course, depending on the usage scenario, the specific composition of the glaze is also different, and the corresponding sintering temperature, sintering time, cooling time and other parameters are also different. According to the different usage environments, it can be roughly divided into the following types:

[0057]

[0058] S5, second sintering: the glazed metal base is sintered at 800℃-1200℃; in the oil sintering process, factors such as sintering temperature, heating rate, holding time, cooling rate, etc. are crucial. In one embodiment, the metal base is transferred to a high temperature furnace, sintered at 950℃-1100℃ for 30-60min, and cooled for 8-12h.

[0059] As mentioned above, different process parameters are required according to different glaze components. The specific commonly used parameters are shown in the following table:

[0060]

[0061] S6, finished product is taken out of the oven and cooled.

[0062] To sum up, the present invention adopts a method of first coating a layer of high-temperature resistant ceramic particles on the metal base by spraying, and sending the metal base coated with the high-temperature resistant ceramic particle layer into a high-temperature furnace for sintering, so that the high-temperature resistant ceramic particles melt and adhere to the metal base, and utilize the smooth wear-resistant properties of the ceramic to improve the smoothness of the clamping of the heat sink fins, and the high-temperature resistant ceramic particle layer can improve the high-temperature resistance, wear resistance, corrosion resistance and other properties of the metal base, and then spray a layer of glaze on the high-temperature resistant ceramic particle layer, and send the metal base coated with the glaze layer into a high-temperature furnace for secondary high-temperature sintering, so that the glaze is completely attached to the high-temperature resistant ceramic particle layer, and the high-temperature resistant ceramic particle layer is completely wrapped for protection, so that the high-temperature resistant ceramic particle layer can meet the requirements of high-temperature resistance, strong acid and alkali resistance, corrosion resistance, wear resistance, etc., realize the long-term stability of the fixture performance during high-temperature reflow soldering, and reduce the wear between the fixture and the heat sink fins when clamping, thereby greatly improving the yield rate of the radiator module.

[0063] Unless otherwise specified, the reagents and equipment used in this example are all purchased from the market. The methods and conditions used in this example are all conventional methods and conditions unless otherwise specified.

[0064] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. All equivalent changes or modifications made according to the structure, characteristics and principles described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

Claims

1. A production process for a high-temperature reflow soldering fixture, characterized in that: include: S1, select metal base: select or make a suitable metal base; S2, spraying a high temperature resistant ceramic layer: spraying a layer of high temperature resistant ceramic particles on the surface of the metal base; S3, first sintering: sintering the metal base sprayed with high temperature resistant ceramic particles at a high temperature of 1000°C-1700°C, so that the high temperature resistant ceramic particles are fused and infiltrated and adsorbed on the surface of the metal base; S4, glazing: applying a layer of glaze on the surface of the metal base after the primary sintering; S5, second sintering: sintering the glazed metal base at a high temperature of 800°C-1200°C; S6, finished product is taken out of the oven and cooled.

2. The production process of a high temperature reflow soldering fixture according to claim 1, characterized in that: The material of the metal base is one of iron, stainless steel, copper, or an alloy of two or more thereof, and a plurality of positioning grooves for positioning are formed on the surface of the metal base by wire cutting.

3. The production process of a high temperature reflow soldering fixture according to claim 2, characterized in that: The high temperature resistant ceramic particles and glaze are sprayed on the positioning groove to increase the high temperature resistance, wear resistance and corrosion resistance of the positioning groove, and can make the surface of the positioning groove smoother, making it convenient for workpiece disassembly and assembly.

4. The production process of a high temperature reflow soldering fixture according to claim 1, characterized in that: During the first sintering, the metal base sprayed with high temperature resistant ceramic particles is transferred to a high temperature sintering furnace and sintered at a high temperature of 1000° C. to 1700° C. for more than 24 hours.

5. The production process of a high temperature reflow soldering fixture according to claim 4, characterized in that: The high temperature resistant ceramic particles include but are not limited to any one of aluminum oxide particles, zirconium oxide particles, silicon nitride particles, silicon carbide particles, magnesium oxide particles, and silicate particles, or a mixture of two or more thereof. The particle size of the high temperature resistant ceramic particles is 0.5 μm-50 μm, and the specific surface area is 1-20 m 2 / g, density is 2.5g / cm 3 -6.0g / cm 3 .

6. A production process for a high temperature reflow soldering fixture according to any one of claims 1 to 5, characterized in that: The glaze composition comprises 50-60% of calcium borate glass powder, 20-30% of feldspar, 10-20% of quartz and 1-3% of zinc oxide.

7. The production process of a high temperature reflow soldering fixture according to claim 6, characterized in that: The glaze is sprayed on the surface of the high temperature resistant ceramic layer, and the metal base is transferred to a high temperature furnace, sintered at 950° C.-1100° C. for 30-60 minutes, and cooled for 8-12 hours.

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