Testing method of vapor chamber

Abstract

The invention discloses a method for testing a vapor chamber, and the method comprises the steps: adjusting the parameters of a first heat dissipation end based on a preset heat dissipation demand, and enabling the heat dissipation capability of the first heat dissipation end to be matched with the heat dissipation demand; the first heat dissipation end or the second heat dissipation end with the heat dissipation capacity matched with the heat dissipation requirement is used for conducting thermal resistance testing on the vapor chamber, and the second heat dissipation end and the first heat dissipation end have the same specification and have the same parameter setting. According to the embodiment of the invention, based on the test of the first heat dissipation end or the second heat dissipation end, the test effect of the uniform temperature plate can be ensured, and the uniform temperature plate meeting the heat dissipation requirement is obtained; therefore, the situation that the temperature-uniforming plate is welded with other parts of the module for testing, then the temperature-uniforming plate with a poor effect is detached from the module, and the temperature-uniforming plate is tested and welded again based on a new temperature-uniforming plate can be avoided, the testing cost is effectively reduced, and the development progress is accelerated.

Description

Technical Field

[0001] The present application relates to the technical field of temperature averaging boards, and in particular to a testing method for temperature averaging boards. Background Art

[0002] The module's heat dissipation capacity is achieved through heat transfer and heat exchange through the temperature vapor chamber (VC), heat pipes, heat dissipation fins (Fin) and fans, and the heat dissipation capacity is certain.

[0003] In order to ensure the heat dissipation capacity of the module, it is necessary to conduct a thermal resistance test on the vapor chamber. A common test method is to use a liquid cooling plate, fix the liquid inlet temperature and flow rate, obtain the thermal resistance curve of the vapor chamber at different powers, and then compare the thermal resistance curves of different vapor chamber samples to select the vapor chamber sample that meets the requirements.

[0004] After selecting the temperature-averaging board sample, the temperature-averaging board sample is welded to other parts of the module to form the entire module to test the thermal resistance of the module, and then reversely infer the adjustment direction of the temperature-averaging board.

[0005] The above test method has the following disadvantages: On the one hand, when a liquid cooling plate is used instead of a module composite heat spreader for testing, when the heat dissipation capacity of the liquid cooling plate does not match the heat dissipation capacity of the module actually used, the test data of the heat spreader will be distorted. There is a situation where the test effect of the liquid cooling plate is excellent, but the effect is not as expected when applied to the module. On the other hand, after the heat spreader is welded to the other parts of the module for testing, if the test results are not satisfactory, it is necessary to remove the heat spreader from the module, readjust the new heat spreader, and then weld it to the other parts of the module for testing. The test cost is high and time-consuming. Summary of the invention

[0006] The embodiment of the present application provides a method for testing a temperature vapor chamber, which can effectively avoid the situation where the temperature vapor chamber has a poor effect when being applied to a module for testing, and can effectively reduce testing costs and improve development progress.

[0007] In view of this, an embodiment of the present application provides a method for testing a temperature vapor chamber, comprising:

[0008] Adjusting the parameters of the first heat dissipation end based on a preset heat dissipation requirement so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement;

[0009] The first heat sink or the second heat sink whose heat dissipation capacity matches the heat dissipation requirement is used to perform a thermal resistance test on the temperature vapor chamber, and the second heat sink has the same specification and the same parameter setting as the first heat sink.

[0010] Optionally, the testing method further comprises: using the first heat dissipation ends with different structures and / or materials to respectively adjust parameters to obtain the first heat dissipation ends whose heat dissipation capabilities match the heat dissipation requirements.

[0011] Optionally, the heat dissipation requirement includes a given heating power, a given heating temperature and a test environment temperature.

[0012] Optionally, adjusting the parameters of the first heat dissipation end based on a preset heat dissipation requirement so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement includes:

[0013] The first temperature averaging plate is attached to the first heating element, and the first heat dissipation end is attached to the first temperature averaging plate;

[0014] The first heating element is made to generate heat at the given heating power, and the test environment temperature is set by using the first heat dissipation end;

[0015] The parameters of the first heat dissipation end are adjusted so that the temperature of the first heating element is substantially stabilized at the given heating temperature.

[0016] Optionally, the first heat dissipation end includes a liquid cooling plate, and the liquid cooling plate of the first heat dissipation end is attached to the first temperature averaging plate;

[0017] The step of setting the test environment temperature by using the first heat dissipation end includes:

[0018] The temperature of the liquid inlet of the liquid cooling plate of the first heat dissipation end is maintained at the test environment temperature.

[0019] Optionally, adjusting the parameters of the first heat dissipation end includes:

[0020] Adjust the flow rate of the liquid cooling plate at the first heat dissipation end.

[0021] Optionally, the first heat dissipation end further includes a heat sink disposed on its liquid cooling plate;

[0022] The adjusting the parameters of the first heat dissipation end includes:

[0023] The flow rate of the liquid cooling plate of the first heat dissipation end and at least one of the air volume and / or air pressure of the heat sink are adjusted.

[0024] Optionally, the first heat dissipation end includes a heat sink and a fan, the heat sink is attached to the first temperature averaging board, and the fan is used to discharge air to an air inlet end of the heat sink;

[0025] The step of setting the test environment temperature by using the first heat dissipation end includes:

[0026] The air inlet temperature of the radiator is maintained at the test environment temperature.

[0027] Optionally, if the temperature of the first heating element cannot be stabilized approximately at the given heating temperature by adjusting the parameters of the first heat dissipation end, the first heat dissipation end with a different structure and / or material is replaced and the operation of adjusting the parameters of the first heat dissipation end is re-executed.

[0028] Optionally, a second temperature homogenizing plate is attached to a second heating element to perform a thermal resistance test, and the second heating element is the first heating element or is the same as the first heating element;

[0029] When performing a thermal resistance test on the second temperature averaging board, the test environment temperature is set by using the second heat dissipation end or the first heat dissipation end attached to the second temperature averaging board.

[0030] Optionally, the thermal resistance test of the temperature vapor chamber includes:

[0031] (1) When the liquid injection amount of the second temperature equalizing plate is constant, the second heating element is caused to generate heat at a plurality of different heating powers within a given power range, wherein the given heating power is within the given power range;

[0032] (2) at each heating power, when the temperature of the second heating element is stable, calculating the thermal resistance of the second temperature vapor chamber based on the heating power, the current temperature of the second heating element and the test environment temperature;

[0033] (3) adjusting the liquid injection amount of the second temperature vapor chamber and repeating steps (1) and (2) to obtain thermal resistance data of the second temperature vapor chamber at different liquid injection amounts;

[0034] (4) Comparing the thermal resistance data of the second temperature equalizer at different liquid injection amounts to select the liquid injection amount of the second temperature equalizer, wherein the comparison rule includes: the heating power when the thermal resistance is the smallest is closest to the given heating power.

[0035] Optionally, the testing method further comprises:

[0036] Conducting thermal resistance tests on a plurality of second temperature vapor chambers of different structures and / or materials respectively, and obtaining the liquid injection volume selected for each second temperature vapor chamber;

[0037] The minimum thermal resistances of the second temperature equalizing plates at the respective selected liquid injection volumes are compared, and the second temperature equalizing plate with the smallest minimum thermal resistance is selected.

[0038] In an embodiment of the present application, before performing a thermal resistance test on the temperature equalizer, the parameters of the first heat sink are adjusted based on a preset heat dissipation requirement so that the heat dissipation capacity of the first heat sink matches the heat dissipation requirement. This can effectively avoid the situation where the test result based on the first heat sink or the second heat sink is good, but the result is poor when the temperature equalizer is applied to the module for testing. That is, the test based on the first heat sink or the second heat sink in the embodiment of the present application can ensure the test result of the temperature equalizer and obtain a temperature equalizer that meets the heat dissipation requirement. This can avoid the situation where the temperature equalizer is welded to other parts of the module for testing, then the temperature equalizer with poor result is removed from the module, and then re-tested and welded based on a new temperature equalizer, thereby effectively reducing the testing cost and improving the development progress. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a flow chart of a method for testing a temperature vapor chamber according to an embodiment of the present application.

[0040] Figure 2 This is a flow chart of adjusting parameters of the first heat dissipation end based on preset heat dissipation requirements in an embodiment of the present application.

[0041] Figure 3 This is a flow chart of a thermal resistance test of a second temperature homogenizing plate according to an embodiment of the present application.

[0042] Figure 4 It is a structural schematic diagram of adjusting the flow of the liquid cooling plate based on the experimental platform in an embodiment of the present application.

[0043] Figure 5 It is a structural schematic diagram of adjusting fan parameters based on an experimental platform in an embodiment of the present application.

[0044] Figure 6 It is a structural schematic diagram of another perspective of adjusting fan parameters based on an experimental platform in an embodiment of the present application.

[0045] Figure 7 It is a structural schematic diagram of a thermal resistance test of a temperature equalizing plate based on an experimental platform in an embodiment of the present application.

[0046] Figure 8 It is a structural schematic diagram of another embodiment of the present application for performing thermal resistance testing on a temperature equalizing plate based on an experimental platform.

[0047] Fig. 9 Schematic diagram of the thermal resistance characteristic curve of the temperature equalizing plate in the embodiment of the present application. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0049] See also Figures 1 to 9 , the present application embodiment discloses a method for testing a temperature vapor chamber, comprising:

[0050] S1. Based on a preset heat dissipation requirement, adjust the parameters of the first heat dissipation end (parameters that can be changed in real time during testing, such as flow rate, air volume, etc.) so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement.

[0051] Specifically, the heat dissipation requirements include the given heating power, the given heating temperature and the test environment temperature. Accordingly, the thermal resistance of the module is equal to the difference between the given heating temperature and the test environment temperature divided by the given heating power. For example, if the given heating power is 150W, the given heating temperature is 70℃, and the test environment temperature is 20℃, then the thermal resistance of the module is 50 / 150, or 0.333.

[0052] It should be explained that the first heat sink can be attached to different temperature averaging boards, and thermal resistance test of the temperature averaging boards is performed, and there is no need to weld the first heat sink and the temperature averaging boards.

[0053] Please combine Figure 4 In some embodiments, the first heat dissipation end includes a liquid cooling plate 41, and the liquid cooling plate 41 can be attached to the first temperature averaging plate 42 to adjust the heat dissipation capacity, and can be attached to the first temperature averaging plate 42 through a thermal conductive adhesive 43. In the case where the first heat dissipation end includes the liquid cooling plate 41, the adjustable parameters of the first heat dissipation end may include the liquid flow of the liquid cooling plate 41.

[0054] More specifically, the first heat dissipation end may further include a heat sink (not shown), which is attached to the liquid cooling plate 41. In the case where the first heat dissipation end includes both the liquid cooling plate 41 and the heat sink, the adjustable parameters of the first heat dissipation end may include the liquid flow rate of the liquid cooling plate 41 and the air volume / air pressure of the heat sink, and at least one of the parameters may be adjusted during the adjustment.

[0055] Please combine Figure 5 and Figure 6In other embodiments, the first heat dissipation end includes a heat sink 47 and a fan 48. The heat sink 47 can be attached to the first temperature averaging board 42 to adjust the heat dissipation capacity. Specifically, it can be attached to the first temperature averaging board 42 through a thermal conductive adhesive 46. The fan 48 is used to discharge air to the air inlet end of the heat sink 47. In the case where the first heat dissipation end includes the heat sink 47 and the fan 48, the adjustable parameters of the first heat dissipation end may include the rotation speed and air volume of the fan 48.

[0056] Specifically, the heat sink 47 can adopt various solutions such as aluminum extrusion, fins, etc., and the present application does not limit this.

[0057] Please combine Figures 4 to 6 Specifically, in order to adjust the parameters of the first heat sink so that the heat dissipation capacity of the first heat sink matches the heat dissipation requirements, the first temperature equalizing plate 42 (which can be through the thermal conductive adhesive 44) can be placed on the first heating element 45, and the first heating element 45 can be controlled to generate heat at a given heating power. At the same time, the first heat sink can be used to set the test ambient temperature, and then the parameters of the first heat sink are adjusted. When the temperature of the first heating element 45 is roughly stable at the given heating temperature, it can be regarded that the heat dissipation capacity of the first heat sink matches the heat dissipation requirements, and the parameters of the first heat sink at this time are recorded.

[0058] Please combine Figure 2 More specifically, adjusting the parameters of the first heat dissipation end based on the preset heat dissipation requirement so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement includes:

[0059] S11 , attaching the first temperature averaging plate 42 to the first heating element 45 , and attaching the first heat dissipation end to the first temperature averaging plate 42 .

[0060] S12, making the first heating element 45 generate heat at a given heating power, and setting the test environment temperature by using the first heat dissipation end.

[0061] S13, adjusting the parameters of the first heat dissipation end so that the temperature of the first heating element 45 is roughly stabilized at a given heating temperature.

[0062] When the first heat dissipation end includes a liquid cooling plate 41 , setting the test environment temperature by using the first heat dissipation end includes: maintaining the liquid inlet temperature of the liquid cooling plate 41 of the first heat dissipation end at the test environment temperature.

[0063] Specifically, when the first heat dissipation end includes a liquid cooling plate 41 , the parameter adjustment can be achieved by adjusting the flow rate of the liquid cooling plate 41 of the first heat dissipation end.

[0064] If the first heat dissipation end also includes a heat sink disposed on the liquid cooling plate 41, then the parameters of the first heat dissipation end may be adjusted by only adjusting the flow of the liquid cooling plate 41, or by only adjusting the air volume and / or air pressure of the heat sink, or by adjusting the flow of the liquid cooling plate 41 and the air volume and / or air pressure of the heat sink at the same time.

[0065] When the first heat dissipation end includes a heat sink 47 and a fan 48, setting the test environment temperature by using the first heat dissipation end includes: maintaining the air inlet temperature of the heat sink 47 at the test environment temperature.

[0066] Specifically, when the first heat dissipation end includes a heat sink 47 and a fan 48 , the parameter adjustment can be achieved by adjusting the rotation speed and air volume of the fan 48 .

[0067] In order to obtain a first heat sink whose heat dissipation capacity matches the heat dissipation requirement, first heat sinks of different structures and / or materials may be used to perform parameter adjustment respectively. Specifically, one first heat sink may be used to perform parameter adjustment first, and if the heat dissipation capacity of the first heat sink matches the heat dissipation requirement after parameter adjustment, then other first heat sinks may no longer be used to perform parameter adjustment.

[0068] For example, when the first heat dissipation end only includes the liquid cooling plate 41, if the heat dissipation capacity of the first heat dissipation end cannot be matched to the heat dissipation requirement after the parameter (flow) adjustment, a different liquid cooling plate 41 (with different structure / material, etc.) can be replaced for parameter adjustment, or the liquid cooling plate 41 can be added with a heat sink and then the parameter adjustment is performed, which is also regarded as replacing a new first heat dissipation end; when the first heat dissipation end includes both the liquid cooling plate 41 and the heat sink, if the heat dissipation capacity of the first heat dissipation end cannot be matched to the heat dissipation requirement after the parameter adjustment (such as the adjustment of the flow, air volume, and air pressure), at least one of the liquid cooling plate 41 and the heat sink can be replaced and then the parameter adjustment is performed; in addition, it can also be changed to a different type of first heat dissipation end, for example, the liquid cooling plate 41 can be replaced with a radiator 47 plus a fan 48; when the first heat dissipation end includes the radiator 47 and the fan 48, if the heat dissipation capacity of the first heat dissipation end cannot be matched to the heat dissipation requirement after the parameter (wind speed, air volume, etc.) adjustment, the radiator 47 with different structure and / or material can be replaced, or it can be changed to a liquid cooling plate 41; and so on, and the present application does not impose any restrictions on this.

[0069] In a specific example, the heat dissipation capacity of the first heat dissipation end cannot match the heat dissipation requirements, which means that the temperature of the first heating element 45 cannot be roughly stabilized at the given heating temperature. If the temperature of the first heating element 45 cannot be roughly stabilized at the given heating temperature after adjusting the parameters of the first heat dissipation end, the first heat dissipation end with a different structure and / or material can be replaced and the operation of adjusting the parameters of the first heat dissipation end can be re-executed.

[0070] S2. Use the first heat sink or the second heat sink whose heat dissipation capacity matches the heat dissipation requirement to perform a thermal resistance test on the second temperature vapor chamber 52. The second heat sink has the same specifications and the same parameter settings as the first heat sink.

[0071] When the heat dissipation capacity of the first heat dissipation end is determined (matching the heat dissipation requirements), the first heat dissipation end can be directly used to perform a thermal resistance test on the second temperature equalizing plate 52. Of course, the second heat dissipation end can also be used to perform a thermal resistance test on the second temperature equalizing plate 52. The second heat dissipation end needs to have the same specifications and the same parameter settings as the first heat dissipation end to have the same heat dissipation capacity, and the same test can be performed.

[0072] Specifically, the heat dissipation capacity of the first heat dissipation end that matches the heat dissipation demand is determined by adjusting parameters based on the actual heat dissipation of the experimental platform. When the thermal resistance test of the second temperature averaging plate 52 is performed, the test can be performed based on the same experimental platform, and the object of adjustment becomes the second temperature averaging plate 52. Of course, the thermal resistance test of the second temperature averaging plate 52 can also be performed based on different experimental platforms, as long as the interaction between the experimental platform and the second temperature averaging plate 52 is consistent under the same heating power.

[0073] Specifically, the second temperature equalizing plate 52 may include the first temperature equalizing plate 42. In this case, the thermal resistance test can be performed directly based on the experimental platform for adjusting the parameters of the first heat sink, the first temperature equalizing plate 42 and the first heat sink without dismantling them. If other temperature equalizing plates need to be tested, the temperature equalizing plates can be replaced, or other experimental platforms can be used.

[0074] Please combine Figure 7 and Figure 8 In a specific example, the second temperature equalizing plate 52 is attached (via a thermal conductive adhesive 54 ) to the second heating element 55 for thermal resistance testing, and the second heating element 55 is the first heating element 45 or is the same as the first heating element 45 .

[0075] When performing a thermal resistance test on the second temperature averaging plate 52, the test environment temperature is set using the second heat dissipation end or the first heat dissipation end attached to the second temperature averaging plate 52. How to set the test environment temperature is the same as the aforementioned test environment temperature setting method when adjusting parameters to match the heat dissipation capacity of the first heat dissipation end with the heat dissipation requirements. Specifically, if the second heat dissipation end is used to perform a thermal resistance test on the second temperature averaging plate 52, when the second heat dissipation end includes a liquid cooling plate 51, the liquid inlet temperature of the liquid cooling plate 51 of the second heat dissipation end can be maintained at the test environment temperature to set the test environment temperature, and the liquid cooling plate 51 of the second heat dissipation end can be attached to the second temperature averaging plate 52 by means of a thermal conductive adhesive 53 (such as Figure 7When the second heat dissipation end includes a heat sink 57 and a fan 58, the air inlet temperature of the heat sink 57 can be maintained at the test environment temperature to set the test environment temperature. The heat sink can be attached to the second temperature averaging plate 52 by means of a thermally conductive adhesive 56 (as shown in FIG. Figure 8 shown).

[0076] It should be noted that the second heating element 55 is the same as the first heating element 45 , which does not mean that they are completely the same, but means that the interaction between the two and the second temperature uniform plate 52 is consistent when generating heat with the same power.

[0077] Please combine Figure 3 In this example, the second temperature vapor chamber 52 is subjected to a thermal resistance test, including:

[0078] S21, when the amount of liquid injected into the second temperature equalizing plate 52 is constant, the second heating element 55 is made to generate heat at a plurality of different heating powers within a given power range, wherein the given heating power is within the given power range.

[0079] Specifically, the heat generation given power is located in the middle area of ​​the given power range.

[0080] Specifically, the given heating power is one of a plurality of heating powers for performing heating tests.

[0081] S22 , at each heating power, when the temperature of the second heating element 55 is stable, the thermal resistance of the second temperature vapor chamber 52 is calculated based on the heating power, the current temperature of the second heating element 55 and the test environment temperature.

[0082] It needs to be explained that the thermal resistance of the second temperature equalizing plate 52 calculated here is not limited to the thermal resistance of the second temperature equalizing plate 52 alone. The thermal resistance of the entire module (including the second heat dissipation end and thermal conductive adhesive, etc.) can be regarded as the thermal resistance of the second temperature equalizing plate 52. Because at this time, except for the second temperature equalizing plate 52, the thermal resistance of other parts in the module is determined. The change in thermal resistance of the second temperature equalizing plate 52 can be reflected by calculating the change in thermal resistance of the entire module. Specifically, the thermal resistance of the module can be obtained by dividing the difference between the current temperature of the second heating element 55 and the test environment temperature by the corresponding heating power.

[0083] Specifically, the temperature of the second heating element 55 may be detected in real time by a temperature sensor.

[0084] S23, adjusting the liquid injection amount of the second temperature equalizing plate 52 and repeating steps S21 and S22 to obtain thermal resistance data of the second temperature equalizing plate 52 at different liquid injection amounts.

[0085] In order to obtain a better liquid filling amount of the second temperature equalizing plate 52, the second temperature equalizing plate 52 can be tested multiple times with different liquid filling amounts, and the second temperature equalizing plate 52 with the best liquid filling amount can be determined based on the thermal resistance data of the second temperature equalizing plate 52 with different liquid filling amounts.

[0086] S24, comparing the thermal resistance data of the second temperature equalizing plate 52 at different liquid injection amounts to select the liquid injection amount of the second temperature equalizing plate 52, wherein the comparison rule includes: the heating power when the thermal resistance is the smallest is closest to the heating given power.

[0087] The thermal resistance of the vapor chamber is different at different heating powers. The heating power with the minimum thermal resistance refers to the heating power with the minimum thermal resistance when the heating power is different and other test conditions are the same. It can be defined as Qmax. When it is equal to or basically equal to the given heating power, the overall heat dissipation performance is the best.

[0088] For the convenience of comparison, a thermal resistance characteristic curve can be output based on the thermal resistance data of the second temperature equalizing plate 52 at each liquid injection amount. For details, please refer to Fig. 9 , the heating power can be defined as the horizontal axis, the thermal resistance can be defined as the vertical axis, and the coordinate points (one heating power and corresponding thermal resistance define one coordinate point) can be connected in sequence to form a thermal resistance characteristic curve.

[0089] In order to make it easier to understand the thermal resistance test of the second temperature vapor chamber 52 based on the second heat dissipation end or the first heat dissipation end, the following example is given:

[0090] Assuming that the liquid inlet temperature of the liquid cooling plate 51 or the air inlet temperature of the radiator 57 is maintained at 20°C, the given heating power is 150W, and the given power range is defined as 70W to 220W. Then, when the liquid injection amount of the second temperature equalizing plate 52 is A, the second heating element 55 is made to heat at 70W, 90W, 110W, 130W, 150W, 170W, 190W, 200W, and 220W respectively.

[0091] Assuming that the heating power is 130 W, when the temperature of the second heating element 55 is stable, for example, stable at 70° C., the thermal resistance calculation result can be obtained by (70-20) / 130.

[0092] For other heating powers, the thermal resistance calculation results can also be obtained in the above manner. Then, the thermal resistance characteristic curve can be output based on the thermal resistance calculation results under different heating powers, such as Fig. 9 shown.

[0093] Then, other conditions remain unchanged, the injection amount of the second temperature equalizing plate 52 is changed to B, and the same test is performed again to obtain the corresponding thermal resistance characteristic curve. In order to obtain better results, at least three different injection amounts can be tested separately, and then the thermal resistance characteristic curves can be compared to select the optimal injection amount of the second temperature equalizing plate 52. Assuming that when the injection amount is A, the heating power when the thermal resistance is the smallest is 170W, and the distance to the given heating power of 150W is 20W, when the injection amount is B, the heating power when the thermal resistance is the smallest is 160W, and the distance to the given heating power of 150W is 10W, when the injection amount is C, the heating power when the thermal resistance is the smallest is 155W, and the distance to the given heating power of 150W is 5W, then the injection amount C is selected as the optimal injection amount.

[0094] In this example, the test method also includes:

[0095] Thermal resistance tests are performed on a plurality of second temperature averaging plates 52 with different structures and / or materials to obtain the selected liquid injection volume of each second temperature averaging plate 52 .

[0096] The minimum thermal resistances of the second temperature equalizing plates 52 at the selected liquid injection volumes are compared, and the second temperature equalizing plate 52 with the smallest minimum thermal resistance is selected.

[0097] That is to say, in order to obtain the optimal second temperature averaging plate 52, second temperature averaging plates 52 with different structures and / or materials can be designed based on the heat dissipation requirements and the size of the second temperature averaging plate 52, and thermal resistance tests can be performed respectively to select the optimal second temperature averaging plate 52. Specifically, the above steps S21 to S24 are tested for each second temperature averaging plate 52 (with different structures and / or materials) to obtain the optimal liquid injection amount of the second temperature averaging plate 52, and then the minimum thermal resistance of each second temperature averaging plate 52 with the optimal liquid injection amount is compared, and the second temperature averaging plate 52 with the smallest minimum thermal resistance is selected.

[0098] Of course, when testing and comparing second temperature averaging plates 52 with different structures and / or materials, it is not limited to simply comparing the minimum thermal resistance. For example, the proximity of each second temperature averaging plate 52 to the given heat power at the minimum thermal resistance can also be considered simultaneously.

[0099] In an embodiment of the present application, before performing a thermal resistance test on the temperature equalizer, the parameters of the first heat sink are adjusted based on a preset heat dissipation requirement so that the heat dissipation capacity of the first heat sink matches the heat dissipation requirement. This can effectively avoid the situation where the test result based on the first heat sink or the second heat sink is good, but the result is poor when the temperature equalizer is applied to the module for testing. That is, the test based on the first heat sink or the second heat sink in the embodiment of the present application can ensure the test result of the temperature equalizer and obtain a temperature equalizer that meets the heat dissipation requirement. This can avoid the situation where the temperature equalizer is welded to other parts of the module for testing, then the temperature equalizer with poor result is removed from the module, and then re-tested and welded based on a new temperature equalizer, thereby effectively reducing the testing cost and improving the development progress.

[0100] The above disclosure is only a preferred example of the present application and cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application are all within the scope covered by the present application.

Claims

1. A method for testing a temperature equalizing plate, characterized in that: include: Adjusting the parameters of the first heat dissipation end based on a preset heat dissipation requirement so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement; The first heat sink or the second heat sink whose heat dissipation capacity matches the heat dissipation requirement is used to perform a thermal resistance test on the temperature vapor chamber, and the second heat sink has the same specification and the same parameter setting as the first heat sink.

2. The method for testing a temperature vapor chamber according to claim 1, characterized in that: Also includes: The first heat dissipation ends having different structures and / or materials are used to adjust parameters respectively to obtain the first heat dissipation ends whose heat dissipation capabilities match the heat dissipation requirements.

3. The method for testing a temperature vapor chamber according to claim 1, characterized in that: The heat dissipation requirements include a given heat power, a given heat temperature and a test environment temperature.

4. The method for testing a temperature homogenizing plate according to claim 3, characterized in that: The adjusting the parameters of the first heat dissipation end based on the preset heat dissipation requirement so that the heat dissipation capacity of the first heat dissipation end matches the heat dissipation requirement includes: The first temperature averaging plate is attached to the first heating element, and the first heat dissipation end is attached to the first temperature averaging plate; The first heating element is made to generate heat at the given heating power, and the test environment temperature is set by using the first heat dissipation end; The parameters of the first heat dissipation end are adjusted so that the temperature of the first heating element is substantially stabilized at the given heating temperature.

5. The method for testing a temperature homogenizing plate according to claim 4, characterized in that: The first heat dissipation end includes a liquid cooling plate, and the liquid cooling plate of the first heat dissipation end is attached to the first temperature averaging plate; The step of setting the test environment temperature by using the first heat dissipation end includes: The temperature of the liquid inlet of the liquid cooling plate of the first heat dissipation end is maintained at the test environment temperature.

6. The method for testing a temperature homogenizing plate according to claim 5, characterized in that: The adjusting the parameters of the first heat dissipation end includes: Adjust the flow rate of the liquid cooling plate at the first heat dissipation end.

7. The method for testing a temperature vapor chamber according to claim 5, characterized in that: The first heat dissipation end further includes a heat sink disposed on its liquid cooling plate; The adjusting the parameters of the first heat dissipation end includes: The flow rate of the liquid cooling plate of the first heat dissipation end and at least one of the air volume and / or air pressure of the heat sink are adjusted.

8. The method for testing a temperature homogenizing plate according to claim 4, characterized in that: The first heat dissipation end includes a heat sink and a fan, the heat sink is attached to the first temperature averaging board, and the fan is used to discharge air to the air inlet end of the heat sink; The step of setting the test environment temperature by using the first heat dissipation end includes: The air inlet temperature of the radiator is maintained at the test environment temperature.

9. The method for testing a temperature vapor chamber according to any one of claims 4 to 8, characterized in that: If the temperature of the first heating element cannot be stabilized substantially at the given heating temperature by adjusting the parameters of the first heat dissipation end, the first heat dissipation end with a different structure and / or material is replaced and the operation of adjusting the parameters of the first heat dissipation end is re-executed.

10. The method for testing a temperature vapor chamber according to claim 4, characterized in that: A second temperature equalizing plate is attached to a second heating element to perform a thermal resistance test, where the second heating element is the first heating element or is the same as the first heating element; When performing a thermal resistance test on the second temperature averaging board, the test environment temperature is set by using the second heat dissipation end or the first heat dissipation end attached to the second temperature averaging board.

11. The method for testing a temperature vapor chamber according to claim 10, characterized in that: The thermal resistance test of the temperature vapor chamber includes: (1) When the liquid injection amount of the second temperature equalizing plate is constant, the second heating element is caused to generate heat at a plurality of different heating powers within a given power range, wherein the given heating power is within the given power range; (2) at each heating power, when the temperature of the second heating element is stable, calculating the thermal resistance of the second temperature vapor chamber based on the heating power, the current temperature of the second heating element and the test environment temperature; (3) adjusting the liquid injection amount of the second temperature vapor chamber and repeating steps (1) and (2) to obtain thermal resistance data of the second temperature vapor chamber at different liquid injection amounts; (4) Comparing the thermal resistance data of the second temperature equalizer at different liquid injection amounts to select the liquid injection amount of the second temperature equalizer, wherein the comparison rule includes: the heating power when the thermal resistance is the smallest is closest to the given heating power.

12. The method for testing a temperature vapor chamber according to claim 11, characterized in that: Also includes: Conducting thermal resistance tests on a plurality of second temperature vapor chambers of different structures and / or materials respectively, and obtaining the liquid injection volume selected for each second temperature vapor chamber; The minimum thermal resistances of the second temperature equalizing plates at the respective selected liquid injection volumes are compared, and the second temperature equalizing plate with the smallest minimum thermal resistance is selected.

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