Liquid cooling module and projection device

By using liquid-cooling method of liquid-cooling modules in the projection device to cool the lighting module, the reduction of heat dissipation efficiency and noise caused by the increase in heat energy inside the projection device is solved, and good heat dissipation efficiency and volume reduction are achieved.

CN119644659APending Publication Date: 2025-03-18CORETRONIC CORPORATION
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Patent Information

Application Number
CN202311191292.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

While the existing projection devices pursue high brightness and high resolution, they lead to increased internal heat energy, reduced heat dissipation efficiency, and increased fan speed lead to noise problems.

Method used

The liquid-cooling module is adopted, including a first cooling unit, a second cooling unit, a heat dissipation assembly and a pipeline assembly. The heat dissipation medium is transported through the pipeline assembly, and the liquid-cooling cooling lighting module is realized, reducing the fan speed and improving the heat dissipation efficiency.

Benefits of technology

The good heat dissipation performance of the projection device is achieved, the fan noise is reduced, and the volume of the projection device is reduced.

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Abstract

A liquid cooling module is used for cooling a lighting module. The liquid cooling module comprises a first cooling unit, a second cooling unit, a heat dissipation assembly and a pipeline assembly. The first cooling unit comprises a first communication surface and a first cooling surface opposite to the first communication surface, and the first cooling surface is connected with a first heat source of the lighting module. The second cooling unit comprises a top surface, a second communication surface and a second cooling surface. The top surface is perpendicular to the first communication surface and opposite to a second cooling surface connected to a second heat source of the lighting module. The heat dissipation assembly is used for dissipating heat of the heat dissipation medium. And the heat dissipation medium flows in the pipeline assembly. The pipeline assembly comprises a first pipeline, a second pipeline and a third pipeline. The first pipeline is connected with the radiating assembly and the first communication surface, the second pipeline is connected with the first communication surface and the second communication surface, and the third pipeline is connected with the second communication surface and the radiating assembly. In addition, the projection device is also provided. The liquid cooling module and the projection device have good heat dissipation efficiency.
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Description

Technical Field

[0001] The invention relates to a heat dissipation module and a display device, and in particular to a liquid cooling module and a projection device comprising the liquid cooling module. Background Art

[0002] Today's projection devices pursue high brightness and high resolution, which will lead to an increase in the wattage of the light source of the projection device, an increase in the heat energy emitted by the heating element, and an increase in the number of lenses in the lens module, which will increase the internal heat energy of the projection device. In addition, the internal space of the projection device is reduced, which in turn compresses the heat dissipation space of the projection device. This will reduce the heat dissipation efficiency of the projection device and make the projection device prone to overheating. In addition, in order to solve the problem of increased heat energy inside the projection device, multiple fans will be set up, and the speed of the fans will be increased to enhance heat dissipation, but this will increase the noise problem. Summary of the invention

[0003] The invention provides a liquid cooling module and a projection device, which have good heat dissipation performance and reduce the noise generated by the rotation speed of a fan.

[0004] Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

[0005] To achieve one or part or all of the above purposes or other purposes, the liquid cooling module of the present invention is used to cool a lighting module. The liquid cooling module includes a first cooling unit, a second cooling unit, a heat dissipation assembly and a pipeline assembly. The first cooling unit includes a first connecting surface and a first cooling surface relative to the first connecting surface, and the first cooling surface is connected to a first heat source of the lighting module. The second cooling unit includes a top surface, a second connecting surface and a second cooling surface. The top surface is perpendicular to the first connecting surface and relative to the second cooling surface, and the second cooling surface is connected to a second heat source of the lighting module. The heat dissipation assembly is used to dissipate heat from a heat dissipation medium. The heat dissipation medium flows in the pipeline assembly. The pipeline assembly includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the heat dissipation assembly and the first connecting surface, the second pipeline connects the first connecting surface and the second connecting surface, and the third pipeline connects the second connecting surface and the heat dissipation assembly.

[0006] To achieve one or part or all of the above purposes or other purposes, the projection device of the present invention includes an illumination module, a light valve module, a lens module and a liquid cooling module. The illumination module is used to provide an illumination beam, and the illumination module includes a first heat source and a second heat source. The light valve module is arranged on the transmission path of the illumination beam to convert the illumination beam into an image beam. The lens module is arranged on the transmission path of the image beam to project the image beam. The liquid cooling module includes a first cooling unit, a second cooling unit, a heat dissipation assembly and a pipeline assembly. The first cooling unit includes a first connecting surface and a first cooling surface opposite to each other, and the first cooling surface is connected to the first heat source. The second cooling unit includes a top surface, a second connecting surface and a second cooling surface. The top surface is perpendicular to the first connecting surface and opposite to the second cooling surface, and the second cooling surface is connected to the second heat source. The heat dissipation assembly is used to dissipate heat from the heat dissipation medium. The heat dissipation medium flows in the pipeline assembly, and the pipeline assembly includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the heat dissipation assembly and the first connecting surface, the second pipeline connects the first connecting surface and the second connecting surface, and the third pipeline connects the second connecting surface and the heat dissipation assembly.

[0007] Based on the above, the first cooling unit of the liquid cooling module of the present invention and the projection device using the same is used to cool the first heat source, the second cooling unit is used to cool the second heat source, and the second pipeline of the pipeline assembly is connected to the first connecting surface of the first cooling unit and the second connecting surface of the second cooling unit. The first connecting surface and the second connecting surface do not affect each other, and the first connecting surface is perpendicular to the top surface of the second cooling unit. The heat dissipation medium is transported through the pipeline assembly, and the liquid cooling module and the projection device can cool the lighting module by liquid cooling, and have good heat dissipation performance, and can reduce the volume of the liquid cooling module and the projection device.

[0008] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a schematic diagram of a projection device according to an embodiment of the present invention.

[0010] Figure 2 yes Figure 1 A schematic top view of a projection device.

[0011] Figure 3 yes Figure 2 Schematic diagram of a liquid cooling module of a projection device.

[0012] Figure 4 yes Figure 3 A partial enlarged view of the liquid cooling module.

[0013] Figure 5 yes Figure 1 Schematic diagram of the projection device at another viewing angle.

[0014] Figure 6 is a schematic diagram of a projection device according to another embodiment of the present invention.

[0015] Description of reference numerals:

[0016] C: Airflow

[0017] G: direction of gravity

[0018] M: heat dissipation medium

[0019] S1: First Space

[0020] S2: Second Space

[0021] S3: The Third Space

[0022] 100, 100a: Projection device

[0023] 110: Lighting module

[0024] 112: The first heat source

[0025] 114: Second Heat Source

[0026] 116: Light-combining components

[0027] 120: Chassis

[0028] 122: Air inlet

[0029] 124: Air outlet

[0030] 125: Top

[0031] 126: Bottom

[0032] 130: Intake fan

[0033] 140: Exhaust fan

[0034] 150: Light valve module

[0035] 160: Lens module

[0036] 170: Power module

[0037] 200, 200a: Liquid cooling module

[0038] 210: First cooling unit

[0039] 212: First connected surface

[0040] 214: First cooling surface

[0041] 216: First water inlet

[0042] 217: First water outlet

[0043] 220: Second cooling unit

[0044] 222, 222a: second connecting surface

[0045] 223: Top

[0046] 224: Second cooling surface

[0047] 225, 225a, 225b: Side

[0048] 226: Second water inlet

[0049] 227: Second water outlet

[0050] 230: Heat dissipation components

[0051] 232: Radiator

[0052] 233, 235: Bottom surface

[0053] 234: Water tank

[0054] 236: Fin structure

[0055] 240: Pipeline components

[0056] 241: First pipeline

[0057] 242: First sub-pipeline

[0058] 243: Second pipeline

[0059] 244, 244a: Second pipeline

[0060] 245: Third pipeline

[0061] 246: The third sub-pipeline

[0062] 247: The fourth sub-pipeline

[0063] 250: The third cooling unit

[0064] 252: The third connected surface

[0065] 254: Third cooling surface

[0066] 255a, 255b: Side surface

[0067] 256: The third water inlet

[0068] 257: The third outlet

[0069] 260: Pump

[0070] 300: Illumination beam

[0071] 400: Image Beam

[0072] 502, 504: light beam. DETAILED DESCRIPTION

[0073] The above-mentioned other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only the directions with reference to the accompanying drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0074] Figure 1 is a schematic diagram of a projection device according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic top view of a projection device. Figure 3 yes Figure 2 Schematic diagram of a liquid cooling module of a projection device. Figure 4 yes Figure 3 A partial enlarged view of the liquid cooling module. Figure 5 yes Figure 1 A schematic diagram of the projection device at another viewing angle. Figure 5 The projection device 100 has two exhaust fans 140 , but one exhaust fan 140 is omitted here to avoid shielding components inside the projection device 100 .

[0075] See also Figures 1 to 5 The projection device 100 includes a housing 120, a lighting module 110, a light valve module 150, a lens module 160, and a liquid cooling module 200. The liquid cooling module 200, the lighting module 110, the light valve module 150, and the lens module 160 are located in the housing 120. The liquid cooling module 200 is used to cool the lighting module 110 and the light valve module 150. The lighting module 110 is used to provide an illumination beam 300. The light valve module 150 is disposed on the transmission path of the illumination beam 300 to convert the illumination beam 300 into an image beam 400. The lens module 160 is disposed on the transmission path of the image beam 400 to project the image beam 400 out of the projection device 100.

[0076] The light valve module 150 includes, for example, one of the reflective light modulators such as a Liquid Crystal On Silicon panel (LCoSpanel) and a Digital Micro-mirror Device (DMD). In some embodiments, the light valve module 150 may also include one of the transmissive light modulators such as a Transparent Liquid Crystal Panel, an Electro-Optical Modulator, a Magneto-Optic Modulator, and an Acousto-Optic Modulator (AOM). The present case does not limit the type and kind of the light valve module 150. The detailed steps and implementation methods of the method for the light valve module 150 to convert the illumination light beam 300 into the image light beam 400 can be sufficiently taught, suggested, and implemented by the common knowledge in the relevant technical field, and thus will not be repeated. In this embodiment, the number of the light valve module 150 is one, for example, the projection device 100 uses a single digital micromirror device, but in other embodiments, the number of the light valve module 150 may be multiple, and the present invention is not limited thereto.

[0077] The lens module 160 includes, for example, a combination of one or more optical lenses with refractive power, such as various combinations of non-planar lenses such as biconcave lenses, biconvex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses. In one embodiment, the lens module 160 may also include a planar, concave, or convex optical lens to project the image beam 400 onto a projection target (e.g., a wall or a projection screen) in a reflective manner. The present case does not limit the type and type of the lens module 160.

[0078] like Figure 1 and Figure 2 As shown, the lighting module 110 includes a first heat source 112, a second heat source 114 and a light combining component 116, but is not limited thereto. The first heat source 112 and the second heat source 114 of the present embodiment are both light source devices, and the first heat source 112 is used to provide at least one light beam 502. The second heat source 114 is used to provide at least one light beam 504. The light source device may include a laser diode or a light emitting diode (LED). The first heat source 112 may include red, green and blue laser diodes (RGB laser diodes) and another green laser diode, and the second heat source 114 may include red, green and blue laser diodes, but is not limited thereto.

[0079] The light combining component 116 is composed of, for example, at least one dichroic mirror, but is not limited thereto. The light combining component 116 is located at a position for receiving the multiple light beams 502 and 504. The light combining component 116 is used to guide the multiple light beams 502 and 504 to form the illumination light beam 300. The light combining component 116 of this embodiment can also be used in conjunction with other optical elements (e.g., lenses) to guide the multiple light beams 502 and 504.

[0080] like Figure 2 and Figure 3 As shown, the liquid cooling module 200 includes a first cooling unit 210, a second cooling unit 220, a heat dissipation assembly 230, a pipe assembly 240 and a pump 260. The first cooling unit 210 and the second cooling unit 220 are used to dissipate heat from the first heat source 112 and the second heat source 114 of the lighting module 110, respectively. The pipe assembly 240 is used to connect the components of the liquid cooling module 200 (the first cooling unit 210, the second cooling unit 220, the third cooling unit 250, the pump 260 and the heat dissipation assembly 230), and the heat dissipation medium M flows in the pipe assembly 240. The heat dissipation medium M exchanges heat with the first heat source 112 and the second heat source 114 in the first cooling unit 210 and the second cooling unit 220 by heat conduction. The heat dissipation assembly 230 dissipates heat from the heat dissipation medium M by heat convection. The pump 260 is used to assist the heat dissipation medium M to flow in the pipe assembly 240.

[0081] The liquid cooling module 200 of the present embodiment can also be used to cool the light valve module 150. The liquid cooling module 200 further includes a third cooling unit 250. The third cooling unit 250 is used to dissipate heat for the light valve module 150. The pipe assembly 240 is connected to the third cooling unit 250 to transport the heat dissipation medium M to the third cooling unit 250. The heat dissipation medium M exchanges heat with the light valve module 150 in the third cooling unit 250 by heat conduction. The first cooling unit 210, the second cooling unit 220, and the third cooling unit 250 are, for example, cooling plates having a flow path therein.

[0082] like Figure 2 and Figure 3As shown, the first cooling unit 210 includes a first connecting surface 212 and a first cooling surface 214 opposite to the first connecting surface 212. The first cooling surface 214 is connected to the first heat source 112 of the lighting module 110, and is used to conduct the heat generated by the first heat source 112 to the first cooling surface 214, so as to dissipate the heat of the first heat source 112. The first connecting surface 212 is connected to the pipe assembly 240. The second cooling unit 220 includes a top surface 223, a second connecting surface 222 and a second cooling surface 224. The top surface 223 is perpendicular to the first connecting surface 212 and opposite to the second cooling surface 224. The second cooling surface 224 is connected to the second heat source 114 of the lighting module 110, and is used to conduct the heat generated by the second heat source 114 to the second cooling surface 224, so as to dissipate the heat of the second heat source 114. The second connecting surface 222 is connected to the pipe assembly 240.

[0083] The third cooling unit 250 includes a third connecting surface 252 and a third cooling surface 254. The third cooling surface 254 of the third cooling unit 250 is connected to the light valve module 150 to conduct heat generated by the light valve module 150 to the third cooling surface 254 to dissipate heat from the light valve module 150. The third connecting surface 252 is connected to the pipe assembly 240.

[0084] Figure 3 Arrows are used to schematically illustrate the direction in which the heat dissipation medium M flows in the pipe assembly 240. The heat dissipation medium M is, for example, water or cooling liquid. Figure 3 As shown, the heat dissipation medium M flows from the heat dissipation component 230 to the pump 260, the first cooling unit 210, the second cooling unit 220 and the third cooling unit 250 in sequence, and then flows back to the heat dissipation component 230. The pipeline component 240 includes a first pipeline 241, a second pipeline 244 and a third pipeline 245. The first pipeline 241 connects the heat dissipation component 230 and the first connecting surface 212 of the first cooling unit 210. The second pipeline 244 connects the first connecting surface 212 and the second connecting surface 222 of the second cooling unit 220, and the third pipeline 245 connects the second connecting surface 222 and the heat dissipation component 230.

[0085] The first pipeline 241 includes a first sub-pipeline 242 and a second sub-pipeline 243. The first sub-pipeline 242 is connected to the heat dissipation assembly 230 and the pump 260, and the second sub-pipeline 243 is connected to the pump 260 and the first connecting surface 212 of the first cooling unit 210. The third pipeline 245 includes a third sub-pipeline 246 and a fourth sub-pipeline 247, the third sub-pipeline 246 is connected to the second cooling unit 220 (for example, the second connecting surface 222) and the third cooling unit 250 (for example, the third connecting surface 252), and the fourth sub-pipeline 247 is connected to the third cooling unit 250 and the heat dissipation assembly 230.

[0086] like Figure 3 , Figure 4 and Figure 5As shown, the heat dissipation assembly 230 includes a radiator 232 and a water tank 234, and the radiator 232 is connected to the water tank 234. The radiator 232 and the water tank 234 of this embodiment are integrally formed, but not limited thereto. The radiator 232 may include fins, but not limited thereto. The radiator 232 is used to dissipate heat from the heat dissipation medium M. The heat dissipation medium M after heat dissipation by the radiator 232 flows into and is stored in the water tank 234. In addition, the water inlet of the radiator 232 is connected to the fourth sub-pipeline 247, and the water outlet of the radiator 232 is connected to the water inlet of the water tank 234. The water inlet of the radiator 232 and the water outlet of the radiator 232 are arranged on the same side of the radiator 232 to reduce the space required for the pipeline assembly 240. Furthermore, the bottom surface 233 of the radiator 232 and the bottom surface 235 of the water tank 234 are staggered in the gravity direction G to form a first space S1. In other words, the first space S1 is formed between the bottom 126 of the housing 120 and the bottom surface 235 of the water tank 234. A portion of the third pipeline 245 (for example, a portion of the fourth sub-pipeline 247) passes through the first space S1 and is connected to the radiator 232. In detail, in the gravity direction G, a portion of the fourth sub-pipeline 247 is located between the bottom surface 235 of the water tank 234 and the bottom 126 of the housing 120. In addition, the first sub-pipeline 242 of the first pipeline 241 is connected to the water tank 234, and is used to guide the heat dissipation medium M to flow into the pump 260.

[0087] like Figure 2 and Figure 5 As shown, the projection device 100 further includes a power module 170. In the gravity direction G, the power module 170 is located between the lens module 160 and the bottom 126 of the housing 120, thereby further reducing the total volume of the projection device 100. The projection device 100 further includes at least one intake fan 130 and at least one exhaust fan 140. In this embodiment, the number of intake fans 130 is two, and the number of exhaust fans 140 is two. The intake fan 130 and the exhaust fan 140 are located in the housing 120, and the housing 120 includes at least one air inlet 122 and at least one air outlet 124. The intake fan 130 and the exhaust fan 140 are used to form an air flow C, and the heat sink 232 of the heat dissipation component 230 is located between the air inlet 122 and the intake fan 130, and is located on the path of the air flow C. The heat sink 232 of the heat dissipation component 230 is used to perform heat exchange with the air flow C to dissipate the heat energy of the heat dissipation medium M. On the flow path of the airflow C, the exhaust fan 140 is located between the air outlet 124 and the lens module 160. The airflow C enters the housing 120 from the air inlet 122, flows through the heat sink 232, the air intake fan 130, the power module 170, the lens module 160, the exhaust fan 140, and leaves the housing 120 from the air outlet 124.

[0088] like Figure 2 and Figure 3As shown, the heat dissipation medium M exchanges heat with the airflow C through the radiator 232 to dissipate the heat energy of the heat dissipation medium M. After the heat dissipation, the heat dissipation medium M with low heat energy flows into the water tank 234. Then, the pump 260 extracts the heat dissipation medium M in the water tank 234, so that the heat dissipation medium M with low heat energy flows from the water tank 234 into the first sub-pipeline 242 (first pipeline 241) and flows into the second sub-pipeline 243 through the pump 260. The heat dissipation medium M with low heat energy flows into the first cooling unit 210 through the second sub-pipeline 243.

[0089] The first cooling unit 210 includes a first water inlet 216 and a first water outlet 217, and the first water inlet 216 and the first water outlet 217 are located on the first connecting surface 212. The first water inlet 216 is connected to the first pipeline 241 (the second sub-pipeline 243), and the first water outlet 217 is connected to the second pipeline 244. The heat dissipation medium M flows into the internal flow channel of the first cooling unit 210 from the first water inlet 216, and leaves the first cooling unit 210 from the first water outlet 217. The first water inlet 216 and the first water outlet 217 are staggered in the gravity direction G. In this embodiment, in the gravity direction G, the first water inlet 216 is disposed between the first water outlet 217 and the bottom 126 of the housing 120, so that the heat dissipation medium M can flow more evenly in the internal flow channel of the first cooling unit 210, thereby making the temperature of the first cooling surface 214 more uniform, and the first heat source 112 can be evenly cooled.

[0090] After the heat dissipation medium M exchanges heat with the first heat source 112 through the first cooling surface 214 , the heat dissipation medium M flows into the second pipe 244 through the first water outlet 217 . The heat dissipation medium M flows to the second connecting surface 222 of the second cooling unit 220 through the second pipe 244 .

[0091] like Figure 2 and Figure 5 As shown, the second cooling unit 220 of the present embodiment includes a side surface 225. The second connecting surface 222 is the side surface 225. The housing 120 has a top 125 and a bottom 126 opposite to each other, and the bottom 126 is located below the top 125 in the gravity direction G. In the gravity direction G, a second space S2 is formed between the first cooling unit 210 and the second cooling unit 220 and the bottom 126. Part of the second pipeline 244 is arranged in the second space S2, and the second pipeline 244 passes through the second space S2 and is connected to the second connecting surface 222 (side surface 225). Since the second connecting surface 222 (side surface 225) is connected between the top surface 223 and the second cooling surface 224, and the second connecting surface 222 (side surface 225) is far away from the first connecting surface 212, the length of the second pipeline 244 connected to the first connecting surface 212 and the second connecting surface 222 is longer.

[0092] The longer second pipe 244 can effectively reduce the stress caused by the heat dissipation medium M on the second pipe 244, so as to prevent the second pipe 244 from pulling the first cooling unit 210 and the second cooling unit 220, thereby causing the first cooling unit 210 and the second cooling unit 220 to shift relative to each other, that is, to prevent the light path shift of the light beam 502 of the first heat source 112 (light source device) and the light path shift of the light beam 504 of the second heat source 114 (light source device). In this way, the first cooling surface 214 of the present embodiment can be perpendicular to the second cooling surface 224 to ensure that the first heat source 112 and the second heat source 114 are arranged perpendicular to each other.

[0093] like Figure 2 and Figure 3 As shown, the second cooling unit 220 also includes a second water inlet 226 and a second water outlet 227. The second water inlet 226 and the second water outlet 227 are located on the side 225 (the second connecting surface 222). The second water inlet 226 is connected to the second pipeline 244, and the second water outlet 227 is connected to the third pipeline 245 (the third sub-pipeline 246). The heat dissipation medium M flows into the internal flow channel of the second cooling unit 220 from the second water inlet 226, and leaves the second cooling unit 220 from the second water outlet 227.

[0094] The second water inlet 226 and the second water outlet 227 are staggered in the gravity direction G, so that the heat dissipation medium M can flow more evenly in the second cooling unit 220, and can evenly cool the second heat source 114. After the heat dissipation medium M exchanges heat with the second heat source 114 through the second cooling surface 224, the heat dissipation medium M flows into the third sub-pipeline 246 through the second water outlet 227, and flows to the third cooling unit 250.

[0095] In this embodiment, the distance (shortest distance) between the first cooling unit 210 and the lens module 160 is smaller than the distance between the second cooling unit 220 and the lens module 160 .

[0096] like Figure 3 As shown, the third cooling unit 250 also includes a third water inlet 256 and a third water outlet 257. The third connecting surface 252 of this embodiment is specifically the two side surfaces 255a and 255b of the third cooling unit 250, and the third connecting surface 252 (side surfaces 255a and 255b) is connected to the third cooling surface 254, but is not limited thereto. The third water inlet 256 is located on the side surface 255a, and the third water outlet 257 is located on the side surface 255b, and the two side surfaces 255a and 255b are opposite to each other. The heat dissipation medium M flows into the internal flow channel of the third cooling unit 250 through the third sub-pipeline 246. After the heat dissipation medium M exchanges heat with the light valve module 150 through the third cooling surface 254, the heat dissipation medium M flows into the fourth sub-pipeline 247 of the third pipeline 245 through the third water outlet 257.

[0097] The heat dissipation medium M flows into the heat dissipation assembly 230 (radiator 232) through the fourth sub-pipeline 247, so that the heat dissipation medium M is cooled by the radiator 232, and the heat dissipation medium M flows into the water tank 234. At this point, the heat dissipation medium M completes a heat dissipation cycle. During a heat dissipation cycle, the heat dissipation medium M sequentially exchanges heat with the first heat source 112, the second heat source 114 and the light valve module 150. In other words, the heat energy of the heat dissipation medium M in the first cooling unit 210 is less than the heat energy of the heat dissipation medium M in the second cooling unit 220, and the heat energy of the heat dissipation medium M in the second cooling unit 220 is less than the heat energy of the heat dissipation medium M in the third cooling unit 250.

[0098] Therefore, the first heat source 112 is connected to the first cooling unit 210, so that the heat dissipation medium M first exchanges heat with the first heat source 112 in each heat dissipation cycle to ensure that the first heat source 112 can be cooled to the target temperature. After the first heat source 112 is cooled to the target temperature, the heat dissipation medium M then cools the second heat source 114 and the light valve module 150 in sequence, so that the second heat source 114 and the light valve module 150 are cooled to the target temperature.

[0099] In this embodiment, the airflow C formed by the heat dissipation assembly 230 and the intake fan 130 and the exhaust fan 140 can effectively cool the heat dissipation medium M and also cool the components inside the projection device 100, thereby reducing the number of fans (the intake fan 130 and the exhaust fan 140) required for the projection device 100 and reducing the speed of the fans, thereby reducing the size of the projection device 100 and reducing the noise generated by the fans.

[0100] In this embodiment, the target temperature of the first heat source 112 is about 44 degrees Celsius (°C), the target temperature of the second heat source 114 is about 46 degrees Celsius, and the target temperature of the light valve module 150 is about 47 degrees Celsius. According to actual test results, when the heat loading of the first heat source 112 is about 124 watts (W), the heat loading of the second heat source 114 is about 79 watts, and the heat loading of the light valve module 150 is about 40 watts, the liquid cooling module 200 can cool the first heat source 112 to about 43 degrees Celsius, the second heat source 114 to about 43 degrees Celsius, and the light valve module 150 to about 43 degrees Celsius. It can be seen that the liquid cooling module 200 can effectively cool the first heat source 112, the second heat source 114, and the light valve module 150 to the target temperature, and the liquid cooling module 200 and the projection device 100 have good heat dissipation performance.

[0101] Compared with the conventional projection device, the total volume of the projection device 100 of the present embodiment is reduced by 6%, and the noise generated by the intake fan 130 and the exhaust fan 140 is reduced by about 2-3 dB, thereby achieving a noise reduction effect.

[0102] In addition, the pump 260 of the liquid cooling module 200 generates vibrations during the operation, and the vibrations of the pump 260 are transmitted through the pipe assembly 240 and absorbed by the pipe assembly 240. In order to prevent the light valve module 150 from being affected by the vibrations and causing pixel shift, that is, the projected image is shaken, the light valve module 150 of this embodiment is connected to the third cooling unit 250, and the vibrations of the pump 260 are absorbed by the first pipe 241, the second pipe 244 and the third sub-pipe 246 during the transmission through the pipe assembly 240, thereby preventing the vibrations of the pump 260 from being transmitted to the third cooling unit 250 and affecting the light valve module 150.

[0103] In addition, if Figure 3 As shown, the shell of the water tank 234 may include a fin structure 236, and the heat dissipation medium M stored in the water tank 234 may further dissipate heat energy through the fin structure 236 to improve the cooling efficiency of the heat dissipation component 230 and the heat dissipation efficiency of the liquid cooling module 200. Since the heat energy of the heat dissipation medium M is reduced, the rotation speed of the intake fan 130 and the exhaust fan 140 can be reduced to further reduce the noise of the intake fan 130 and the exhaust fan 140. In addition, the temperature of the heat dissipation medium M can also be reduced, the problem of the heat dissipation of the heat dissipation medium M due to the pipeline is improved (that is, the evaporation rate is improved), and the service life of the liquid cooling module 200 is improved.

[0104] Figure 6 1 is a schematic diagram of a projection device according to another embodiment of the present invention. It is worth mentioning that the projection device 100a has two exhaust fans 140, but one exhaust fan 140 is omitted here to avoid blocking the components inside the projection device 100a. Figure 5 and Figure 6 The projection device 100a of this embodiment is similar to the above-mentioned embodiment, and the difference between the two is that the diameter of the second pipeline 244a of this embodiment is different from the diameter of the first pipeline 241. The diameter of the second pipeline 244a is smaller than the diameter of the first pipeline 241, and the diameter of the second pipeline 244a is smaller than the diameter of the third pipeline 245. The second cooling unit 220 includes two side surfaces 225a and 225b, and the second connecting surface 222a is the two side surfaces 225a and 225b. The second water inlet 226 and the second water outlet 227 are located on the second connecting surface 222a (the two side surfaces 225a and 225b), the second water inlet 226 is located on the side surface 225a, and the second water outlet 227 is located on the side surface 225b.

[0105] like Figure 6 As shown, in the gravity direction G, a third space S3 is formed between the first cooling unit 210 and the second cooling unit 220 and the top 125 of the housing 120. Part of the second pipeline 244a is arranged in the third space S3, and the second pipeline 244a passes through the third space S3 and is connected to the second connecting surface 222a (side surface 225a). By reducing the diameter of the second pipeline 244a, the volume of the projection device 100a of this embodiment can be further reduced. Compared with the known projection device, the volume of the projection device 100a of this embodiment is reduced by 13%. The projection device 100a of this embodiment has the same effect as the above-mentioned embodiment, which will not be repeated here.

[0106] In summary, in the liquid cooling module and the projection device using the liquid cooling module of the present invention, the first cooling unit is used to cool the first heat source, the second cooling unit is used to cool the second heat source, and the second pipeline of the pipeline assembly is connected to the first connecting surface of the first cooling unit and the second connecting surface of the second cooling unit. The first connecting surface and the second connecting surface do not affect each other, and the first connecting surface is perpendicular to the top surface of the second cooling unit. The heat dissipation medium is transported through the pipeline assembly, and the liquid cooling module and the projection device can cool the lighting module by liquid cooling, and have good heat dissipation performance, and can reduce the volume of the liquid cooling module and the projection device.

[0107] However, the above is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the claims and the content of the invention of the present invention are still within the scope of the patent of the present invention. In addition, any embodiment or claim of the present invention does not need to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and title (invention name) are only used to assist in the retrieval of patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit on the number of elements.

Claims

1. A liquid cooling module for cooling a lighting module, characterized in that: The liquid cooling module includes a first cooling unit, a second cooling unit, a heat dissipation component and a pipeline component, wherein: The first cooling unit includes a first connecting surface and a first cooling surface opposite to the first connecting surface, and the first cooling surface is connected to a first heat source of the lighting module; The second cooling unit comprises a top surface, a second connecting surface and a second cooling surface, the top surface is perpendicular to the first connecting surface and opposite to the second cooling surface, and the second cooling surface is connected to a second heat source of the lighting module; The heat dissipation component is used to dissipate heat from the heat dissipation medium; and The heat dissipation medium of the pipeline assembly flows in the pipeline assembly, and the pipeline assembly includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the heat dissipation assembly and the first connecting surface, the second pipeline connects the first connecting surface and the second connecting surface, and the third pipeline connects the second connecting surface and the heat dissipation assembly.

2. The liquid cooling module according to claim 1, characterized in that: The first cooling unit includes a first water inlet and a first water outlet, the first water inlet and the first water outlet are located on the first connecting surface, the first water inlet and the first water outlet are staggered in the gravity direction, the first water inlet is connected to the first pipeline, and the first water outlet is connected to the second pipeline.

3. The liquid cooling module according to claim 1, characterized in that: The liquid cooling module also includes a pump, the first pipeline includes a first sub-pipeline and a second sub-pipeline, the first sub-pipeline is connected to the heat dissipation component and the pump, and the second sub-pipeline is connected to the pump and the first connecting surface of the first cooling unit.

4. The liquid cooling module according to claim 1, characterized in that: The liquid cooling module is also used to cool the light valve module. The liquid cooling module also includes a third cooling unit. The third pipeline includes a third sub-pipeline and a fourth sub-pipeline. The third sub-pipeline is connected to the second cooling unit and the third cooling unit. The fourth sub-pipeline is connected to the third cooling unit and the heat dissipation component. The third cooling unit is connected to the light valve module.

5. The liquid cooling module according to claim 1, characterized in that: The heat dissipation component includes a radiator and a water tank, the radiator is connected to the water tank, the bottom surface of the radiator and the bottom surface of the water tank are offset in the direction of gravity to form a first space, part of the third pipeline is arranged in the first space and connected to the radiator, and the first pipeline is connected to the water tank.

6. The liquid cooling module according to claim 5, characterized in that: The radiator and the water tank are integrally formed.

7. The liquid cooling module according to claim 5, characterized in that: The water tank includes a fin structure.

8. The liquid cooling module according to claim 1, characterized in that: The second cooling unit includes a side surface, a second water inlet and a second water outlet, the second connecting surface is the side surface, the second water inlet and the second water outlet are located on the side surface, and the second water inlet and the second water outlet are staggered in the gravity direction.

9. The liquid cooling module according to claim 1, characterized in that: The second cooling unit includes two side surfaces, a second water inlet and a second water outlet, the second connecting surface is the two side surfaces, the second water inlet and the second water outlet are located on the second connecting surface, the second water inlet is located on one of the two side surfaces, and the second water outlet is located on the other of the two side surfaces.

10. The liquid cooling module according to claim 9, characterized in that: The diameter of the second pipeline is smaller than that of the first pipeline, and the diameter of the second pipeline is smaller than that of the third pipeline.

11. A projection device, characterized in that: The projection device comprises an illumination module, a light valve module, a lens module and a liquid cooling module, wherein: The lighting module is used to provide a lighting beam, and the lighting module includes a first heat source and a second heat source; The light valve module is disposed on the transmission path of the illumination light beam, and is used to convert the illumination light beam into an image light beam; The lens module is disposed on the transmission path of the image light beam to project the image light beam; and The liquid cooling module includes a first cooling unit, a second cooling unit, a heat dissipation component and a pipeline component, wherein: The first cooling unit comprises a first connecting surface and a first cooling surface opposite to each other, and the first cooling surface is connected to the first heat source; The second cooling unit comprises a top surface, a second connecting surface and a second cooling surface, the top surface is perpendicular to the first connecting surface and opposite to the second cooling surface, and the second cooling surface is connected to the second heat source; The heat dissipation component is used to dissipate heat from the heat dissipation medium; and The heat dissipation medium of the pipeline assembly flows in the pipeline assembly, and the pipeline assembly includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the heat dissipation assembly and the first connecting surface, the second pipeline connects the first connecting surface and the second connecting surface, and the third pipeline connects the second connecting surface and the heat dissipation assembly.

12. The projection device according to claim 11, characterized in that: The first cooling unit includes a first water inlet and a first water outlet, the first water inlet and the first water outlet are located on the first connecting surface, the first water inlet and the first water outlet are staggered in the gravity direction, the first water inlet is connected to the first pipeline, and the first water outlet is connected to the second pipeline.

13. The projection device according to claim 11, characterized in that: The liquid cooling module also includes a pump, the first pipeline includes a first sub-pipeline and a second sub-pipeline, the first sub-pipeline is connected to the heat dissipation component and the pump, and the second sub-pipeline is connected to the pump and the first connecting surface of the first cooling unit.

14. The projection device according to claim 11, characterized in that: The first heat source and the second heat source are both light source devices, and the first heat source and the second heat source are used to provide multiple light beams. The lighting module also includes a light combining component, which is located at a position to receive the multiple light beams, and the light combining component is used to guide the multiple light beams to form a lighting beam.

15. The projection device according to claim 14, characterized in that: The liquid cooling module also includes a third cooling unit, the third pipeline includes a third sub-pipeline and a fourth sub-pipeline, the third sub-pipeline is connected to the second cooling unit and the third cooling unit, the fourth sub-pipeline is connected to the third cooling unit and the heat dissipation component, and the third cooling unit is connected to the light valve module for cooling the light valve module.

16. The projection device according to claim 11, characterized in that: The heat dissipation component includes a radiator and a water tank, the radiator is connected to the water tank, the bottom surface of the radiator and the bottom surface of the water tank are offset in the direction of gravity to form a first space, part of the third pipeline is arranged in the first space and connected to the radiator, and the first pipeline is connected to the water tank.

17. The projection device according to claim 11, characterized in that: The second cooling unit includes a side surface, a second water inlet and a second water outlet, the second connecting surface is the side surface, the second water inlet and the second water outlet are located on the side surface, and the second water inlet and the second water outlet are staggered in the gravity direction.

18. The projection device according to claim 11, characterized in that: The second cooling unit includes two side surfaces, a second water inlet and a second water outlet, the second water inlet and the second water outlet are located on the second connecting surface, the second connecting surface is the two side surfaces, the second water inlet is located on one of the two side surfaces, and the second water outlet is located on the other of the two side surfaces.

19. The projection device according to claim 11, characterized in that: The projection device also includes a casing, at least one air intake fan and at least one exhaust fan. The liquid cooling module, the lighting module, the light valve module, the at least one air intake fan and the at least one exhaust fan are located in the casing. The casing includes at least one air inlet and at least one air outlet. The at least one air intake fan and the at least one exhaust fan are used to form an airflow. The heat dissipation component is located on the path of the airflow and is used to perform heat exchange with the airflow. The airflow enters the casing from the at least one air inlet and leaves the casing from the at least one air outlet.

20. The projection device according to claim 19, characterized in that: The heat dissipation component is located between the at least one air inlet and the at least one air intake fan.

21. The projection device according to claim 11, characterized in that: The projection device further comprises a power module and a casing. The casing has a bottom. In the direction of gravity, the power module is located between the lens module and the bottom.

22. The projection device according to claim 11, characterized in that: The projection device further includes a casing having a bottom. In the gravity direction, a second space is formed between the first cooling unit, the second cooling unit and the bottom, and part of the second pipeline is arranged in the second space.

Citation Information

Patent Citations

  • Laser projection equipment

    CN112034667A

  • Projection device and water tank

    CN113391505A

  • Heat dissipation system and projection device

    CN113741126A

  • Waterproof liquid cooling heat dissipation system of projector

    CN116699928A

  • Light source device and video display device

    JP2016057609A