Chip test system with floating assembly
By introducing floating components and damping parts into the chip test system, absorbing the energy of external low-frequency vibration, the problem of testing accuracy and reliability of traditional systems in low-frequency vibration environments is solved, and higher testing accuracy and safety are achieved.
Patent Information
- Application Number
- CN202411909954.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-03-21
AI Technical Summary
Traditional chip test systems are difficult to maintain the accuracy and reliability of test data in low-frequency vibration environments, resulting in unstable signal transmission, poor chip contact with test fixtures, and additional acoustic noise interference.
A chip test system with floating components is designed, which performs pressing and releasing movements in a vertical direction under external vibration to reduce the impact of vibration on the test. The system includes a test device for the circuit substrate and a floating assembly that absorbs vibration energy through damping members such as elastic silicone and ensures movement within a safe range through a limiting assembly.
It effectively reduces the energy transfer of external vibration to the test device, ensures that the chip test is carried out in a stable environment, significantly improves the test accuracy, and prevents potential damage and test interference caused by hard contact.
Smart Images
Figure CN119667444A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure belongs to the field of chip testing, and in particular relates to a chip testing system with a floating component. Background Art
[0002] In the field of chip testing, precise environmental control is crucial, especially for devices such as acoustic chips that are extremely sensitive to vibration. External vibrations can cause distortion of test data, affecting the accuracy and reliability of test results. Low-frequency vibrations (such as below 500Hz) are particularly prone to interfere with the test process due to their large amplitude and long period, causing measurement errors or equipment misjudgment.
[0003] Specifically, vibration can cause many problems in traditional chip testing systems in terms of chip testing: first, vibration can cause unstable signal transmission, and any slight physical change may cause signal attenuation or distortion; second, vibration can easily cause poor contact between the chip and the test fixture, further affecting the test accuracy; in addition, for devices that are extremely sensitive to vibration, such as acoustic chips, vibration is also very likely to introduce additional acoustic noise, thereby affecting the test results.
[0004] Therefore, there is an urgent need to develop a new solution to suppress the impact of external vibrations, especially low-frequency vibrations, on chip testing. Summary of the invention
[0005] In order to solve the above technical problems, the present disclosure discloses a chip testing system with a floating component, wherein the system comprises:
[0006] floating components, and
[0007] A test device having a circuit substrate,
[0008] in,
[0009] The testing device is used to form an electrical connection with the chip to be tested through the circuit substrate to perform chip testing;
[0010] The floating assembly is used to perform compression and release movements in a vertical direction under the action of external vibrations, so as to suppress the influence of external vibrations on chip testing.
[0011] Preferably,
[0012] The testing device and the floating assembly have a relative spatial positional relationship in the vertical direction.
[0013] Preferably,
[0014] The floating assembly at least includes a first floating assembly and a second floating assembly, wherein:
[0015] The first floating assembly is located directly below one end of the test device,
[0016] The second floating assembly is located directly below the other end of the testing device.
[0017] Preferably,
[0018] In the horizontal direction, one side of the first floating component and / or the second floating component has a limiting component, wherein:
[0019] The limiting component limits the movement of the floating component in the vertical direction.
[0020] Preferably,
[0021] The limiting assembly includes a positioning pin and a positioning hole, wherein:
[0022] A positioning pin, which is used to move up and down in the positioning hole along with the movement of the floating assembly under the action of external vibration;
[0023] The positioning hole has a lowest point, which is used to constrain the lowest point of the floating assembly moving in the vertical direction.
[0024] Preferably,
[0025] The limit assembly also includes a stop height limit screw, wherein:
[0026] The stop height limiting screw is used to constrain the highest point of the floating component's movement in the vertical direction.
[0027] Preferably,
[0028] The floating assembly further comprises a third floating assembly, wherein:
[0029] The third floating assembly is located directly below the middle position of the testing device.
[0030] Preferably,
[0031] The floating assembly includes an upper fixing plate and a lower fixing plate, and,
[0032] A damping member is located between the upper fixing plate and the lower fixing plate.
[0033] Preferably,
[0034] The damping element comprises elastic silica gel.
[0035] Preferably,
[0036] The chip to be tested is an acoustic chip,
[0037] The external vibration is a low-frequency vibration below 500 Hz.
[0038] The present disclosure has the following beneficial effects:
[0039] Through the inventive concept of floating isolation, the present disclosure can effectively reduce the energy transmitted to the test device by external vibration, ensure that the chip test is carried out in a stable and quiet environment, and thus significantly improve the test accuracy. In addition, a reasonable limit design further prevents floating from exceeding the safe range, avoids the impact and potential damage caused by hard contact, and avoids the impact of hard contact on the test. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] Figure 1 This is a schematic diagram of the chip testing system in one embodiment of the present disclosure;
[0041] Figure 2 is a schematic diagram of a floating assembly in another embodiment of the present disclosure;
[0042] Figure 3 is a schematic diagram of a limit assembly in another embodiment of the present disclosure;
[0043] Figure 4 is a schematic diagram of a positioning pin and a positioning hole in another embodiment of the present disclosure;
[0044] FIG. 5( a ) and FIG. 5( b ) are schematic diagrams of a chip testing system including an upper cover and a testing chamber in another embodiment of the present disclosure;
[0045] Figure 6 This is a schematic diagram of a chip testing system for an acoustic chip in another embodiment of the present disclosure. DETAILED DESCRIPTION
[0046] In order to make those skilled in the art understand the technical solutions disclosed in the present disclosure, the following will be combined with the embodiments and related appended Figures 1 to 6 , the technical solutions of various embodiments are described, and the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Mentioning "embodiment" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It will be understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0047] The use of cross-hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same figure numbers represent the same components.
[0048] When a component is referred to as being "on" or "over," "connected to," or "coupled to" another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component, there are no intervening components. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, etc., with or without intervening components.
[0049] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "down," "over," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would subsequently be positioned "over" the other components or features. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.
[0050] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values and / or the values provided that will be recognized by those of ordinary skill in the art.
[0051] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments / methods or examples. In addition, those skilled in the art may combine and combine the different embodiments / methods or examples described in this specification and the features of the different embodiments / methods or examples, unless they are contradictory.
[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0053] See also Figure 1 In one embodiment, taking acoustic chip testing as an example, the present disclosure discloses a chip testing system with a floating component, wherein the system includes:
[0054] A floating assembly, comprising at least first to third floating assemblies, and
[0055] A test device having a circuit substrate,
[0056] in,
[0057] The testing device is used to form an electrical connection with the chip to be tested through the circuit substrate to perform chip testing;
[0058] The floating assembly is used to perform compression and release movements in a vertical direction under the action of external vibration to suppress the influence of external vibration on chip testing;
[0059] and,
[0060] The first floating assembly is located directly below one end of the test device,
[0061] The second floating assembly is located directly below the other end of the test device.
[0062] The third floating assembly is located directly below the middle position of the testing device.
[0063] Preferably, in another embodiment,
[0064] The testing device and the floating assembly have a relative spatial position relationship in the vertical direction.
[0065] When the floating assembly moves in the vertical direction under the action of external vibration, the testing device moves up and down accordingly.
[0066] See also Figure 2 and Figure 3 In another embodiment, the present disclosure exemplarily discloses the structure of the floating assembly and the limiting assembly itself. Exemplarily, in the horizontal direction, one side of the first floating assembly and / or the second floating assembly has a limiting assembly, wherein the limiting assembly limits the movement of the floating assembly in the vertical direction. Preferably, the limiting assembly is located on the outside of the corresponding floating assembly, that is, on the side relatively far away from the test device.
[0067] like Figure 2 As shown,
[0068] The floating assembly includes an upper fixing plate and a lower fixing plate, and,
[0069] a damping member located between the upper fixing plate and the lower fixing plate;
[0070] Exemplarily, the upper fixing plate and the lower fixing plate are rigid fixing plates.
[0071] In another embodiment,
[0072] The damping element includes elastic silicone. Exemplarily, the damping element is made of high-performance elastic silicone.
[0073] For example, Figure 2 As shown,
[0074] The damping element is in the shape of a truncated cone.
[0075] The upper fixed plate is a circular plate, and the diameter of the circular plate is the same as the diameter of the upper surface of the truncated cone-shaped damping member.
[0076] The lower fixing plate has two ears, wherein:
[0077] Each ear is equipped with a fixing hole.
[0078] The main body of the lower fixing plate is located between the two ears, and the outer diameter of the main body of the lower fixing plate is greater than the diameter of the lower surface of the truncated cone-shaped damping member.
[0079] In another embodiment,
[0080] The floating assembly also includes a longitudinal rod located on the upper fixed plate, wherein
[0081] The longitudinal rod is located at the geometric centroid of the upper fixed plate.
[0082] More preferably, in another embodiment,
[0083] The bottom end of the longitudinal rod is connected to the upper fixed plate.
[0084] A 1-shaped groove is provided at the top of the longitudinal rod.
[0085] For this embodiment, the 1-shaped groove has a linear guiding function to ensure the directionality and stability of the movement. Specifically, when the floating assembly moves up and down, the 1-shaped groove allows the test device to move only in the vertical direction to prevent any rotation or tilt. It should be noted that the limit assembly and the 1-shaped groove work together to ensure that the test device can accurately return to the initial position.
[0086] Combination Figure 2 and Figure 3 , exemplary,
[0087] In the first floating assembly, the longitudinal rod passes through the upper plate of the limit assembly and is connected with the test device above the first floating assembly through the I-shaped groove at the top of the longitudinal rod (for example, a guide is provided at the bottom of the test device, and the guide is connected with the I-shaped groove), wherein:
[0088] The upper plate of the limit assembly is pressed on the upper fixed plate of the first floating assembly.
[0089] and,
[0090] The first floating assembly is fixed on the lower plate of the limiting assembly through the fixing holes on the lower fixing plate.
[0091] It can be understood that the lower plate of the limit assembly can be further fixed on a base. For example, the base is a base of a test chamber, and the chip testing system disclosed in the present disclosure is arranged in the test chamber, and the test chamber has an upper cover. In other words, the chip test is performed in a test chamber having an upper cover and a portion below the upper cover.
[0092] Further integration Figure 1 It can be seen that due to Figure 1 The limiting assembly corresponding to the third floating assembly of the example is simpler than the limiting assembly of the first floating assembly. Due to the limitation of its installation conditions, the limiting assembly of the third floating assembly only includes an upper plate and a lower plate. Figure 3 The limiting assembly of the first floating assembly is more complicated, and includes: an upper plate, a lower plate, a positioning pin, a positioning hole and a stop height limiting screw, wherein:
[0093] A positioning pin, which is used to move up and down in the positioning hole along with the movement of the floating assembly under the action of external vibration;
[0094] The positioning hole has a lowest point, which is used to constrain the lowest point of the floating component moving in the vertical direction;
[0095] The stop height limiting screw is used to constrain the highest point of the floating component's vertical movement.
[0096] In another embodiment,
[0097] The chip to be tested is an acoustic chip,
[0098] The external vibration is a low-frequency vibration below 500 Hz.
[0099] In another embodiment, see Figure 4 ,in,
[0100] Figure 5 (a) shows the initial positioning state, in which the test device can automatically pick up and place materials and position them accurately.
[0101] FIG5( b ) illustrates the test state, in which, as the floating assembly moves downward, the upper plate and the positioning pin of the limit assembly also move downward accordingly; illustratively, the positioning pin moves downward by 2.5 mm in the positioning hole, and it is assumed that the positioning pin is in a floating state at this time and does not contact the bottom of the positioning hole.
[0102] In another embodiment, taking the chip to be tested as an acoustic chip as an example, further combining FIG. 5 (a), FIG. 5 (b) and Figure 6 The chip testing system with floating components is described in more detail as follows, wherein:
[0103] FIG5 (a) and FIG5 (b) respectively illustrate the states of the chip testing system including the upper cover and the testing chamber before and after the upper cover is closed;
[0104] See also Figure 6 ,in,
[0105] In order to test the acoustic chip, in the test chamber of the chip testing system,
[0106] The test chamber includes a base below, a sealing layer and a foam sponge, wherein:
[0107] The base at the bottom may be a concave structure, the bases on the left and right sides thereof are connected to the first floating assembly and the second floating assembly and their respective corresponding limit assemblies, and the base at the middle position is connected to the third floating assembly, wherein the lower plate of each limit assembly is fixedly connected to the upper surface of the corresponding base;
[0108] The sealing layer and the foam sponge can be arranged on the left and right sides of the test chamber;
[0109] It can be found that, typically, the test chamber can be a symmetrical structure;
[0110] See also Figure 6 , for a test device in a test chamber, comprising:
[0111] Located above the upper plate of the limiting assembly and matched with the 1-shaped grooves of the longitudinal rods of the first to third floating assemblies: a lower microphone frame and an upper frame, wherein:
[0112] The lower microphone frame is located below the upper frame of the test device;
[0113] A fixing block is provided at each of the left and right ends of the lower microphone frame, which is used to fix the two handles via the upper frame;
[0114] Between the left and right ends, the lower microphone frame is also provided with a plurality of microphone fixing seats, which are used to set a plurality of microphones; it can be understood that the microphone is preferably an acoustic standard microphone for testing the acoustic chip;
[0115] The test transmission line, such as the DSUB transmission line of the test machine, passes under the lower microphone frame;
[0116] From the bottom microphone frame upward, there are: the fixing block, the upper frame, the circuit substrate, the sound cavity fixing plate and the small speaker. It can be understood that the small speaker and the microphone are both used to test the acoustic chip.
[0117] In another embodiment,
[0118] The floating assembly is a strong damping assembly, so that when the vibration is not completely ended, the chip testing system can quickly dissipate the vibration energy through the damping element, so that the chip testing system can quickly restore stability. This means that the floating assembly can start to move upward when the vibration is weakened but not completely ended.
[0119] Preferably, when using elastic silicone as a damping member of a floating assembly, select an elastic silicone material with an appropriate hardness grade and refer to the stress-strain curve provided by the manufacturer to ensure that it provides the required stiffness within the working range.
[0120] Preferably, within the working range, an appropriate amount of pre-compression is selected so that the elastic silicone operates in a relatively linear region.
[0121] In another embodiment,
[0122] Floating components are subject to the following constraints:
[0123] a. When vibrating, the floating assembly moves up and down in the vertical direction, so that the chip testing system can dissipate the energy of the vibration;
[0124] b. The chip test system including the floating assembly and the test device has a natural frequency far away from the frequency of the external vibration to avoid resonance. Among them, the chip test system including the floating assembly and the test device refers to the chip test system formed by all components participating in the up and down movement including the floating assembly and the test device. Preferably, the natural frequency is much smaller than the frequency of the external vibration. Among them, the inventors found that for low-frequency seismic isolation in the field of chip testing (such as vibrations below 500 Hz), selecting a lower natural frequency (for example, a few hertz to tens of hertz), that is, a low-frequency seismic isolation design, can more effectively isolate external vibrations. This is because relative to external vibrations, the relative low-frequency seismic isolation system has a better attenuation effect on the relative high-frequency vibration, while the high-frequency seismic isolation design idea is not suitable for the isolation of external low-frequency vibrations. High-frequency seismic isolation has a poor isolation effect on external low-frequency vibrations, and high-frequency seismic isolation requires greater stiffness, which not only has a poor effect but also increases complexity and cost compared to low-frequency seismic isolation design.
[0125] In another embodiment, for the above constraint condition a,
[0126] Preferably, at the end of the vibration, the floating assembly has not yet moved to the lowest point or has begun to recover upward from the lowest point.
[0127] In another embodiment, in addition to referring to the stress-strain curve provided by the manufacturer as described above to ensure that the damping member, such as elastic silicone, provides the required stiffness within the working range, the stiffness can also be inferred by the following formula: :
[0128] ,
[0129] in,
[0130] Indicates the quality of the chip test system including the floating assembly and the test device,
[0131] represents stiffness,
[0132] represents the desired natural frequency.
[0133] And, to optimize stiffness, in another embodiment,
[0134] The actual stiffness values of elastic silicone with different hardness grades within the expected deformation range are experimentally measured to verify the theoretical calculation results; and / or, by using methods such as modal analysis or swept frequency testing, the natural frequency is actually measured and the choice of elastic silicone is adjusted to achieve the desired effect.
[0135] In another embodiment, for the preferred strong damping system described above, the damping ratio can be selected empirically. Between 0.5 and 0.7 to ensure fast energy dissipation and good reset accuracy. Further, the damping coefficient is calculated by the following formula :
[0136] .
[0137] Furthermore, in order to optimize the damping performance represented by the damping coefficient or the damping ratio, in another embodiment,
[0138] Through free decay test or sweep test, the damping characteristics of the chip test system are measured to ensure that it meets the design requirements; and according to the experimental results, the formula or number of layers of elastic silicone are adjusted to optimize the damping performance.
[0139] In another embodiment, regarding the pre-compression amount of the elastic silicone,
[0140] Selecting an appropriate amount of pre-compression allows the elastic silicone to work in a relatively linear region and reduce the impact of nonlinear behavior. The amount of pre-compression can be determined based on the material's stress-strain curve to ensure that it exhibits near-linear characteristics within the working range. Pre-compression increases the initial stiffness, thereby improving the dynamic response of the chip test system as a floating system.
[0141] And, in order to optimize the pre-compression amount, in another embodiment,
[0142] The actual stiffness and damping characteristics under different pre-compression amounts are experimentally measured to select the optimal pre-compression amount and ensure that the pre-compression amount will not cause material aging or performance degradation during the expected service life of the floating component.
[0143] In another embodiment, the positioning hole mentioned above has a lowest point, which is used to constrain the lowest point of the floating component moving in the vertical direction; and a stop height limiting screw, which is used to constrain the highest point of the floating component moving in the vertical direction, wherein,
[0144] Assume the highest point is By default, the chip test system is stationary at the highest point and the lowest point is , and assume that the maximum energy of each vibration is known to be , then the maximum allowable floating range is calculated by inversely deducing the following formula: :
[0145] ;
[0146] It can be understood that this formula is an ideal situation;
[0147] Further, the highest point is the origin, the lowest point .
[0148] If, by default, the chip test system is stationary at a central position between the highest point and the lowest point, then, , .
[0149] In order to optimize the lowest and highest points, in another embodiment,
[0150] Further, through modal testing or swept frequency testing, the maximum displacement range of the floating system is actually measured to ensure that the limit points are set reasonably to avoid hard contact and excessive deformation.
[0151] In addition, the uncertainty and environmental changes in actual operation can be taken into account, and a certain safety margin can be further increased, such as setting the limit point at Where, An appropriate safety margin can be selected based on experimental or empirical values.
[0152] In another embodiment, considering that the maximum value of the energy of each vibration is known to be In order to ensure that the system can effectively absorb this energy without causing excessive displacement, the energy dissipation capacity should be strong enough so that the residual energy after each vibration As small as possible, e.g. ,in,
[0153] ,
[0154] It represents the energy absorbed and dissipated by the floating component during vibration. The appropriate value can be determined through experiments, or the actual energy dissipation can be determined based on the stress-strain curve.
[0155] Specifically, in another embodiment,
[0156] The actual damping characteristics of elastic silicone rubber are determined by experimentally measuring the stress-strain curves under different deformation conditions;
[0157] And refer to the material property data provided by the manufacturer to select appropriate material parameters;
[0158] Then, finite element analysis software was used to simulate the dynamic behavior of elastic silicone, considering its nonlinear characteristics and predicting its energy dissipation under different working conditions to achieve simulation;
[0159] Finally, the simulation results are verified by experimental means such as modal testing and frequency sweep testing, and the elastic silicone is adjusted until the best elastic silicone is selected. When adjusting, at least the formula and number of layers of the elastic silicone are adjusted to adjust the performance.
[0160] In another embodiment, when the floating assembly adopts a linear damping element,
[0161] Damping force Proportional to speed,
[0162] ,
[0163] in,
[0164] is the damping coefficient,
[0165] It's time The speed of
[0166] have:
[0167] ,
[0168] Substitution , then:
[0169] .
[0170] Preferably, in another embodiment, assuming that the up and down motion of the floating assembly is a simple harmonic motion, there is:
[0171] ,
[0172] in,
[0173] represents the displacement of the floating component,
[0174] represents the amplitude,
[0175] represents the angular frequency,
[0176] Indicates the phase,
[0177] Speed for:
[0178] ,
[0179] The energy dissipation can be further simplified as:
[0180] ,
[0181] For a complete cycle ,have:
[0182] ,
[0183] Therefore, the above integral result is:
[0184] .
[0185] In another embodiment, when the damping member is made of elastic silicone and the shape of the elastic silicone is assumed to be a truncated cone, for example Figure 2 As shown in the figure, the morphological parameters of elastic silicone can be determined by the following steps:
[0186] According to the desired natural frequency of the chip test system , assuming that the stiffness of the elastic silicone is known , and the elastic modulus of elastic silicone is known to be (Note: This can be obtained from the manufacturer or consult the material manual), there is a simplified model based on experience as follows:
[0187] ,
[0188] in,
[0189] represents the height of the cone,
[0190] represents the average cross-sectional area of the frustum, and:
[0191] ,
[0192] in,
[0193] represents the upper base radius of the cone,
[0194] represents the lower base radius of the cone,
[0195] Thus, we have:
[0196] ;
[0197] Furthermore, by adjusting , and , estimate the stiffness of the elastic silicone The morphological parameters of
[0198] In another embodiment, the optimal morphological parameters of the damping member of the present invention may also be obtained by means of finite element analysis, which includes the following steps:
[0199] Use finite element analysis software to establish a three-dimensional model of the damping component (such as truncated cone-shaped elastic silicone), set boundary conditions and loads, and use the material properties of the elastic silicone as input (such as elastic modulus, Poisson's ratio, density, shear modulus, fitting expression of stress-strain curve, temperature, thermal expansion coefficient, etc., where, in finite element analysis, Poisson's ratio is used to describe the deformation behavior of the material used in the damping component, and the fitting expression of the stress-strain curve is obtained through experiments or information provided by the manufacturer. The fitting expression of the stress-strain curve can be replaced by an appropriate model in the finite element analysis software, such as an appropriate elastic model or a hyperelastic model);
[0200] Considering the nonlinear characteristics or nearly linear characteristics of the working area of the damping element, static analysis and dynamic analysis are performed to predict its stiffness and damping performance under different deformation conditions; static analysis is used to evaluate the stiffness and deformation of the system under static conditions, and dynamic analysis is used to evaluate the response of the system under dynamic loads, including natural frequency and damping characteristics;
[0201] By changing the morphological parameters and comparing the performances of different solutions, the optimal morphological parameters of the damping element described in the present invention are selected.
[0202] It can be understood that, for the above-mentioned embodiment, the optimal morphological parameters of the damping member of the present invention are obtained by using finite element analysis software, which can be implemented independently without relying on the estimation described above to meet the stiffness of the elastic silicone. The morphological parameters can also be combined with the stiffness of the elastic silicone mentioned above. The morphological parameters are further optimized by finite element analysis, and the optimal morphological parameters of the damping member described in the present invention are obtained by using finite element analysis software, which is not limited to the material and morphology of the damping member.
[0203] In another embodiment, regardless of whether the damping member is made of elastic silicone, for the truncated cone-shaped damping member, the upper base radius, the lower base radius, and the height can be adjusted according to the following principles, wherein:
[0204] Select an appropriate top base radius to ensure it provides adequate stiffness and stability;
[0205] Choose a larger bottom radius to increase the contact area of the bottom and improve the stability and energy dissipation capacity of the system;
[0206] Select an appropriate height to ensure that the damping element exhibits stable mechanical characteristics within the working range.
[0207] In another embodiment, for a floating assembly using elastic silicone as a damping member, the selection and configuration of the elastic silicone is optimized by the following steps:
[0208] S100: Based on theoretical calculations and / or experiments, preliminary estimates of stiffness, damping ratio, pre-compression, and morphological parameters (such as upper base radius, lower base radius, and dimensional parameters of the truncated cone-shaped elastic silicone) are obtained;
[0209] S200: Through modal testing, frequency sweep testing and free decay testing, under the constraint that the residual energy after each vibration is as close to 0 as possible, the stiffness, damping ratio, pre-compression and dimensional parameters of the morphology are verified and adjusted until the best elastic silicone is selected.
[0210] It can be understood that through the above calculations or experiments, it can be ensured that when the chip testing system is used for acoustic chip testing, the energy transmitted to the testing device by external vibrations of the target frequency (such as external low-frequency vibrations below 500 Hz) can be specifically reduced, ensuring that the chip test is carried out in a stable and quiet environment, thereby significantly improving the test accuracy.
[0211] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. A chip testing system with a floating component, characterized in that: The system comprises: floating components, and A test device having a circuit substrate, in, The testing device is used to form an electrical connection with the chip to be tested through the circuit substrate to perform chip testing; The floating assembly is used to perform compression and release movements in a vertical direction under the action of external vibrations, so as to suppress the influence of external vibrations on chip testing.
2. The chip testing system according to claim 1, characterized in that: Preferred: The testing device and the floating assembly have a relative spatial positional relationship in the vertical direction.
3. The chip testing system according to claim 1, characterized in that: The floating assembly at least includes a first floating assembly and a second floating assembly, wherein: The first floating assembly is located directly below one end of the test device, The second floating assembly is located directly below the other end of the testing device.
4. The chip testing system according to claim 3, characterized in that: In the horizontal direction, one side of the first floating component and / or the second floating component has a limiting component, wherein: The limiting component limits the movement of the floating component in the vertical direction.
5. The chip testing system according to claim 3, characterized in that: The limiting assembly includes a positioning pin and a positioning hole, wherein: A positioning pin, which is used to move up and down in the positioning hole along with the movement of the floating assembly under the action of external vibration; The positioning hole has a lowest point, which is used to constrain the lowest point of the floating assembly moving in the vertical direction.
6. The chip testing system according to claim 3, characterized in that: The limit assembly also includes a stop height limit screw, wherein: The stop height limiting screw is used to constrain the highest point of the floating component's movement in the vertical direction.
7. The chip testing system according to claim 3, characterized in that: The floating assembly further comprises a third floating assembly, wherein: The third floating assembly is located directly below the middle position of the testing device.
8. The chip testing system according to claim 1, characterized in that: The floating assembly includes an upper fixing plate and a lower fixing plate, and, A damping member is located between the upper fixing plate and the lower fixing plate.
9. The chip testing system according to claim 8, characterized in that: The damping element comprises elastic silica gel.
10. The chip testing system according to claim 1, characterized in that: The chip to be tested is an acoustic chip, The external vibration is a low-frequency vibration below 500 Hz.