Chip bonding auxiliary track positioning device

Abstract

The invention relates to a chip bonding auxiliary track positioning device, and relates to the technical field of chip processing, the chip bonding auxiliary track positioning device comprises a guide box body, auxiliary grooves are formed in the guide box body, auxiliary supporting bases are slidably arranged in the auxiliary grooves, the height of the auxiliary supporting bases is adjustable, the number of the auxiliary grooves is two, and the movement directions of the adjacent auxiliary supporting bases are opposite. When one auxiliary supporting base moves downwards to carry out chip bonding, the other auxiliary supporting base moves upwards until the auxiliary supporting base is moved out of the auxiliary groove, so that a chip bonding product on the auxiliary supporting base can be moved out of the auxiliary groove, and the chip bonding quality is improved while blanking is conveniently realized. According to the auxiliary supporting base, the other set of chip bonding semi-finished products can be conveniently placed on the auxiliary supporting base, the vacancy time of chip bonding can be effectively shortened in the process, the efficiency of the chip bonding process is ensured, and the chip production efficiency is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, and in particular to a chip bonding auxiliary trajectory positioning device. Background Art

[0002] Chip bonding is the process of fixing the chip on the packaging substrate, that is, sticking the chip to the substrate through an adhesive to ensure the mechanical connection and heat conduction between the chip and the substrate. For example, in the patent document with application number 202321127495.5, an auxiliary device for microfluidic glass chip bonding is disclosed, and it is specifically disclosed that the positioning function of the chip is achieved by sliding four sliders on the inner wall of the slide groove, and it can be suitable for chips of different sizes.

[0003] In the above technical solution, the chips need to go through loading, processing and unloading before the second group of chips can be bonded. The processing process is relatively cumbersome, and there is a lot of idle time in a process. The process is complicated and the production efficiency is low. Summary of the invention

[0004] The object of the present invention is to provide a chip bonding auxiliary track positioning device.

[0005] The technical problem solved by the present invention is to solve the problem that idle time exists in the chip bonding process in the prior art, resulting in low chip bonding efficiency.

[0006] The present invention can be implemented through the following technical scheme: a chip bonding auxiliary trajectory positioning device, including a guide box, an auxiliary groove is opened on the guide box, and an auxiliary support base is slidably arranged inside the auxiliary groove for supporting the chip bonding semi-finished product, the height of the auxiliary support base is adjustable, and two groups of auxiliary grooves are arranged, and the movement directions of adjacent auxiliary support bases are opposite.

[0007] A further technical improvement of the present invention is that a fixed substrate is fixed inside the auxiliary groove, and an auxiliary sliding rod is fixed on the side of the auxiliary support base away from the chip bonding semi-finished product support surface, the auxiliary sliding rod passes through the fixed substrate, and an auxiliary spring is fixed between the fixed substrate and the auxiliary support base.

[0008] A further technical improvement of the present invention is that an intermediate turntable is provided to guide the internal rotation of the box body, rotating balance bars are symmetrically provided on both sides of the intermediate turntable, and the rotating balance bar and the auxiliary sliding bar are slidingly hinged.

[0009] A further technical improvement of the present invention is that: an articulated slide groove is provided on the rotating balance rod, and an articulated slide rod is slidably arranged inside the articulated slide groove, and the articulated slide rod is rotatably connected to the auxiliary slide rod.

[0010] A further technical improvement of the present invention is that a side matching plate is fixed to the end of the rotating balance rod, and an upper limit plate and a lower limit plate for matching with the side matching plate are fixed inside the guide box.

[0011] A further technical improvement of the present invention is that a distance sensing metal is fixed to the bottom of the rotating balance rod, and a distance pushing telescopic rod is fixedly installed on the bottom of the guide box, a distance base is fixedly installed on the end of the distance pushing telescopic rod, and a distance sensor for matching with the distance sensing metal is arranged on the distance base.

[0012] A further technical improvement of the present invention is that a limit adjustment plate for detecting the flatness of the bottom surface of the chip is arranged on the auxiliary support base, and the limit adjustment plate is slidably connected to the auxiliary support base.

[0013] A further technical improvement of the present invention is that an adjustment motor is fixedly installed inside the auxiliary support base, an adjustment turntable is provided at the output end of the adjustment motor, a fixed support rod is fixed on the adjustment turntable, and the fixed support rod is rotatably connected to the rotating connecting rod, and the rotating connecting rod is rotatably connected to the limit adjustment plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. When the present application is in use, the support and guiding positioning of the chip bonding semi-finished product is achieved by utilizing the auxiliary grooves and the auxiliary supporting bases. At the same time, the auxiliary grooves in the present application are provided with two groups, and the movement directions of adjacent auxiliary supporting bases are opposite. Therefore, when one of the auxiliary supporting bases moves downward for chip bonding, the other auxiliary supporting base moves upward until the auxiliary supporting base is moved out of the auxiliary groove, so that the chip bonding finished product on the auxiliary supporting base can be moved out of the auxiliary groove, which is convenient for unloading and placing another group of chip bonding semi-finished products on the auxiliary supporting base. In this process, the idle time of chip bonding can be effectively reduced, ensuring the efficiency of the chip bonding process and the efficiency of chip production.

[0015] 2. In the present application, a balance measuring device is used to detect the balance of the rotating balance bar in normal times. When the balance measuring device detects that the balance of the rotating balance bar fails, further sensing of the distance sensor and the distance sensing metal is started. After the detection is completed, the distance is pushed by the telescopic rod to control the distance base to move longitudinally until the distance base contacts the rotating balance bar, thereby providing stable support for the rotating balance bar and replacing the auxiliary spring at the same time. This process can ensure the balance of the rotating balance bar and the accuracy of chip bonding.

[0016] 3. In the process of bonding the chip bonding semi-finished product, the present application uses the start-up of the adjustment motor at any time to control the adjustment turntable to rotate, thereby driving the fixed support rod to rotate, pulling the rotating connecting rod, and driving the limit adjustment plate to slide on the auxiliary support base. The distance sensing device is used to determine whether the bottom surface of the chip bonding semi-finished product is close to the auxiliary support base, thereby detecting the quality of the chip bonding finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the position of the auxiliary support base of the present invention; Figure 2 It is a schematic diagram of the position of the detection mechanism of the present invention; Figure 3 It is a schematic diagram of the structure of the detection mechanism of the present invention; Figure 4 It is a schematic diagram of the movement of the limit adjustment plate of the present invention.

[0019] In the figure: 1. guide box; 2. side matching plate; 3. lower limit plate; 4. distance sensor; 5. distance base; 6. distance pushing telescopic rod; 7. limit bottom plate; 8. installation cavity; 9. balance meter; 10. distance sensing metal; 11. hinged slide; 12. fixed base plate; 13. auxiliary slide bar; 14. auxiliary spring; 15. auxiliary groove; 16. rotating balance bar; 17. middle turntable; 18. auxiliary support base; 19. hinged slide bar; 20. upper limit plate; 21. detection mechanism; 22. limit adjustment plate; 23. limit slide; 24. first hinge seat; 25. fixed mounting seat; 26. adjustment motor; 27. adjustment turntable; 28. fixed support rod; 29. ​​rotating connecting rod; 30. support plate. DETAILED DESCRIPTION

[0020] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0021] See also Figure 1-4 As shown, a chip bonding auxiliary trajectory positioning device includes a guide box 1, on which two auxiliary grooves 15 are arranged for realizing the chip limiting function, that is, when in use, the two auxiliary grooves 15 can realize two chip bonding processes, when the first auxiliary groove 15 is guiding chip bonding, the other auxiliary groove 15 can realize the unloading function of the finished product and the loading function of the semi-finished product, thereby reducing the time loss in the chip bonding process and ensuring the efficiency of chip bonding.

[0022] Specifically, an auxiliary support base 18 is slidably arranged inside the auxiliary groove 15, and the auxiliary support base 18 is used to directly support the chip bonding semi-finished product, and an auxiliary slide bar 13 is fixedly installed on the side of the auxiliary support base 18 away from the chip detection semi-finished product, and the auxiliary slide bar 13 slides through the fixed substrate 12, and the fixed substrate 12 is fixedly installed at the bottom of the auxiliary groove 15, and an auxiliary spring 14 is fixedly installed between the auxiliary support base 18 and the fixed substrate 12. When in use, the chip bonding semi-finished product is placed on the auxiliary support base 18, and when the external pressure presses down the auxiliary support base 18, the chip bonding semi-finished product enters the auxiliary groove 15, and the auxiliary groove 15 is used to limit the position of the chip bonding semi-finished product until the auxiliary spring 14 is pressed down to the bottom, so as to realize the bonding function of the chip, and then the rebound function of the auxiliary spring 14 and the auxiliary slide bar 13 are used to move longitudinally under the action of external force, so that the auxiliary support base 18 is moved out from the auxiliary groove 15, so as to facilitate direct unloading of the chip bonding product.

[0023] Therefore, an intermediate turntable 17 is rotatably installed inside the guide box 1, and rotating balance bars 16 are symmetrically fixed on both sides of the intermediate turntable 17. An articulated slot 11 is provided on the rotating balance bar 16, and an articulated slide bar 19 is slidably arranged inside the articulated slot 11. The articulated slide bar 19 is rotatably connected to the auxiliary slide bar 13. Therefore, when external force is applied to cause the auxiliary support base 18 to move downward, the articulated slide bar 19 will slide inside the articulated slot 11. At this time, the intermediate turntable 17 rotates, and the rotating balance bar 16 rotates. At this time, the auxiliary slide bar 13 at the other end is lifted up until the auxiliary support base 18 drives the bonded product to move out of the auxiliary slot 15, so as to realize the automatic unloading of bonded products and the automatic loading of bonded semi-finished products.

[0024] In order to limit the position of the rotating balance bar 16, an upper limit plate 20 and a lower limit plate 3 are arranged inside the guide box 1, wherein the upper limit plate 20 and the lower limit plate 3 are respectively arranged on the upper and lower sides of the side matching plate 2, and the side matching plates 2 are respectively fixed at both ends of the rotating balance bar 16, that is, the side matching plates 2 are respectively matched with the upper limit plate 20 and the lower limit plate 3.

[0025] In order to achieve the stability of the initial position of the rotating balance bar 16, a limiting bottom plate 7 is fixedly installed at the bottom of the guide box 1, a distance pushing telescopic rod 6 is fixedly installed on the limiting bottom plate 7, and a distance base 5 is fixed at the end of the distance pushing telescopic rod 6, a distance sensor 4 is fixedly installed on the distance base 5, and a balance measuring device 9 is fixed at the bottom of the rotating balance bar 16. The distance sensing between the distance sensor 4 and the distance sensing metal 10 is used to determine whether the two ends of the rotating balance bar 16 are in a horizontal state, so that the corresponding auxiliary spring 14 can be replaced according to the balance degree of the rotating balance bar 16 to ensure the stability of production on both sides.

[0026] Furthermore, a balance measuring device 9 is fixedly installed at the bottom of the rotating balance pole 16, and the balance measuring device 9 is used to detect the balance of the rotating balance pole 16 in normal times. When the balance measuring device 9 detects that the balance of the rotating balance pole 16 fails, the distance sensor 4 and the distance sensing metal 10 are started for further sensing, and after the detection is completed, the distance is pushed by the telescopic rod 6 to control the distance base 5 to move longitudinally until the distance base 5 contacts the rotating balance pole 16, so as to stably support the rotating balance pole 16, and at the same time replace the auxiliary spring 14, so as to facilitate the replacement of the auxiliary spring 14.

[0027] A detection mechanism 21 for detecting whether the surface of the chip semi-finished product is flat is arranged on the auxiliary support base 18, wherein the detection mechanism 21 includes an adjustment motor 26, wherein the adjustment motor 26 is fixedly installed inside the auxiliary support base 18, and an adjustment turntable 27 is fixedly installed at the output end of the adjustment motor 26, and a fixed mounting seat 25 is fixedly installed on the adjustment turntable 27, and the fixed mounting seat 25 is rotatably connected to the rotating connecting rod 29 through the fixed support rod 28, and the rotating connecting rod 29 is rotatably installed on the limit adjustment plate 22, and the limit adjustment plate 22 and the auxiliary support base 18 are slidably connected, and the upper surface of the limit adjustment plate 22 and the auxiliary support base 18 A distance sensing device is fixed on the limit adjustment plate 22, that is, when in use, when the chip bonding semi-finished product is placed on the auxiliary support base 18, the chip bonding semi-finished product is pressed against the auxiliary support base 18 by applying external pressure. During the chip bonding process, the adjustment motor 26 can be started at any time to control the adjustment dial 27 to rotate, thereby driving the fixed support rod 28 to rotate, pulling the rotating connecting rod 29, and driving the limit adjustment plate 22 to slide on the auxiliary support base 18. The distance sensing device is used to determine whether the bottom surface of the chip bonding semi-finished product is tightly attached to the auxiliary support base 18, thereby detecting the quality of the chip bonding product.

[0028] The rotating connecting rod 29 is rotatably mounted on the limit adjustment plate 22 through the first hinge seat 24, and the support plate 30 is fixedly mounted on the auxiliary support base 18. At the same time, the auxiliary support base 18 is provided with a limit sliding groove 23 for realizing the sliding of the limit adjustment plate 22.

[0029] When the present invention is in use, the chip bonding semi-finished product is first placed on one of the auxiliary support bases 18, and then the bonding pressure is applied externally to make the chip bonding semi-finished product enter the auxiliary groove 15, so that the chip bonding semi-finished product slides downward in the auxiliary groove 15, and the auxiliary spring 14 is squeezed at this time. At the same time, the hinged slide bar 19 slides inside the hinged slide groove 11, so that the rotating balance bar 16 rotates to a certain extent until the chip bonding semi-finished product is pressurized. At the same time, the other side of the rotating balance bar 16 rotates, so that the auxiliary slide bar 13 on the other side moves upward, and the auxiliary support base 18 is pushed out of the auxiliary groove 15, and the chip bonding finished product on the auxiliary support base 18 is directly unloaded, and the chip bonding efficiency can be guaranteed at this time; In this process, a corresponding mechanism for detecting the balance state of the rotating balance bar 16 is also included, that is, the balance measuring device 9 is used to detect the balance degree of the rotating balance bar 16 in normal times. When the balance measuring device 9 detects that the balance of the rotating balance bar 16 fails, the distance sensor 4 and the distance sensing metal 10 are further sensed, and after the detection is completed, the distance pushing telescopic rod 6 is used to control the distance base 5 to move longitudinally until the distance base 5 contacts the rotating balance bar 16, so as to stably support the rotating balance bar 16, and at the same time replace the auxiliary spring 14, so as to facilitate the replacement of the auxiliary spring 14; During the bonding process of the chip bonding semi-finished product, the adjustment motor 26 can be started at any time to control the adjustment turntable 27 to rotate, thereby driving the fixed support rod 28 to rotate, pulling the rotating connecting rod 29, and driving the limit adjustment plate 22 to slide on the auxiliary support base 18. The distance sensing device is used to determine whether the bottom surface of the chip bonding semi-finished product is tightly attached to the auxiliary support base 18, thereby detecting the quality of the chip bonding product.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chip bonding auxiliary track positioning device, comprising a guide box (1), characterized in that: The guide box (1) is provided with an auxiliary groove (15), and an auxiliary support base (18) for supporting the chip bonding semi-finished product is slidably arranged inside the auxiliary groove (15), the height of the auxiliary support base (18) is adjustable, and two groups of the auxiliary grooves (15) are provided, and the movement directions of adjacent auxiliary support bases (18) are opposite.

2. A chip bonding auxiliary trajectory positioning device according to claim 1, characterized in that: A fixed base plate (12) is fixed inside the auxiliary groove (15), and an auxiliary slide bar (13) is fixed on a side of the auxiliary support base (18) away from the chip bonding semi-finished product support surface, the auxiliary slide bar (13) passes through the fixed base plate (12), and an auxiliary spring (14) is fixed between the fixed base plate (12) and the auxiliary support base (18).

3. A chip bonding auxiliary trajectory positioning device according to claim 2, characterized in that: An intermediate rotating disk (17) is rotatably arranged inside the guide box (1), rotating balance bars (16) are symmetrically arranged on both sides of the intermediate rotating disk (17), and the rotating balance bars (16) and the auxiliary sliding bars (13) are slidably hinged.

4. A chip bonding auxiliary trajectory positioning device according to claim 3, characterized in that: A hinged slide groove (11) is provided on the rotating balance rod (16), and a hinged slide rod (19) is slidably arranged inside the hinged slide groove (11), and the hinged slide rod (19) is rotationally connected to the auxiliary slide rod (13).

5. The chip bonding auxiliary trajectory positioning device according to claim 3, characterized in that: A side matching plate (2) is fixed to the end of the rotating balance rod (16), and an upper limit plate (20) and a lower limit plate (3) for respectively matching with the side matching plate (2) are fixed inside the guide box (1).

6. The chip bonding auxiliary trajectory positioning device according to claim 3, characterized in that: A distance sensing metal (10) is fixed to the bottom of the rotating balance rod (16), and a distance pushing telescopic rod (6) is fixedly installed on the bottom of the guide box (1), a distance base (5) is fixedly installed on the end of the distance pushing telescopic rod (6), and a distance sensor (4) for matching with the distance sensing metal (10) is provided on the distance base (5).

7. The chip bonding auxiliary trajectory positioning device according to claim 1, characterized in that: The auxiliary support base (18) is provided with a limit adjustment plate (22) for detecting the flatness of the bottom surface of the chip, and the limit adjustment plate (22) and the auxiliary support base (18) are slidably connected.

8. The chip bonding auxiliary trajectory positioning device according to claim 7, characterized in that: An adjustment motor (26) is fixedly installed inside the auxiliary support base (18); an adjustment turntable (27) is provided at the output end of the adjustment motor (26); a fixed support rod (28) is fixed on the adjustment turntable (27); the fixed support rod (28) is rotatably connected to a rotatable connecting rod (29); and the rotatable connecting rod (29) is rotatably connected to a limit adjustment plate (22).

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