FPCA product dispensing method and FPCA product

Abstract

The invention relates to an FPCA (Flexible Principal Component Analysis) product dispensing method and an FPCA product. The method comprises the following steps: assembling a flexible circuit board and an assembly element by adopting a surface mounting technology to obtain an FPCA product; carrying out preheating treatment on the FPCA product, and then carrying out dispensing treatment on the FPCA product; and performing high-temperature curing treatment on the dispensed FPCA product. The technical problems that in the prior art, high-temperature curing is directly carried out after dispensing filling is carried out between the switch key and the flexible plate, the phenomenon of glue splashing can occur, the flexible plate can be polluted, and the product quality is affected can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a FPCA product dispensing method and a FPCA product. Background Art

[0002] As the demand for functional integration of flexible electronic products increases, the functions of mobile phone buttons are also increasing, such as power on, power off, forced restart, screenshot, etc. From the early DOME (metal dome conductive film) buttons to the current convex switch buttons, the welding strength of FPCA (Flexible Printed Circuit Assembly) has been increased, and the welding terminals of the switch buttons will be glued at the same time, so that the bottom of the switch button and the flexible board are more closely combined, reducing the impact of the gap between the parts and the flexible board on the life of the switch button. In traditional technology, the switch button and the flexible board are directly cured at high temperature after the glue is filled, but due to the influence of the part structure, a small amount of gas will remain in the part slot during the glue dispensing process and be wrapped by glue. During high-temperature curing, glue splashing will occur, resulting in contamination of the flexible board and affecting product quality. Summary of the invention

[0003] The present invention provides a FPCA product dispensing method and a FPCA product, which can solve the technical problem in the traditional technology that high-temperature curing is directly performed after dispensing and filling between a switch button and a flexible board, resulting in glue splashing, contamination of the flexible board and affecting product quality.

[0004] In order to solve the above technical problems, the present invention provides a FPCA product dispensing method, comprising:

[0005] Surface mount technology is used to assemble flexible circuit boards and assembly components to obtain FPCA products;

[0006] Preheat the FPCA product and then perform glue dispensing on the FPCA product;

[0007] The FPCA product after dispensing is subjected to high temperature curing treatment.

[0008] Optionally, the preheating of the FPCA product comprises:

[0009] Place the FPCA product into a preheating device;

[0010] The FPCA product is preheated by the preheating device so that the surface temperature of the FPCA product reaches the preset heating temperature.

[0011] Optionally, preheating the FPCA product by a preheating device comprises:

[0012] The FPCA product is preheated by the preheating device so that the temperature of the FPCA product gradually rises, and the heating rate is less than the preset rate, and the peak temperature of the preheating does not exceed the maximum peak temperature.

[0013] Optionally, the preheating device comprises a heating seat mechanism, and a heating cover mechanism connected to the heating seat mechanism;

[0014] The heating seat mechanism comprises a heating base, a base heat-insulating shell arranged on the heating base, a first heating element arranged on the base heat-insulating shell, and a first heating plate connected to the first heating element;

[0015] The heating cover mechanism includes a heating cover body hinged on the heating base, a cover body insulation shell arranged on the heating cover body, a second heating element arranged on the cover body insulation shell, and a second heating plate connected to the second heating element, and a heating cavity for preheating FPCA products is formed between the second heating plate and the first heating plate.

[0016] Optionally, placing the FPCA product into a preheating device comprises:

[0017] The FPCA product is placed above the first heating plate of the heating seat mechanism of the preheating device, and the heating cover mechanism is covered so that the FPCA product is located in the heating cavity between the first heating plate and the second heating plate of the heating cover mechanism.

[0018] Optionally, the dispensing process of the FPCA product includes:

[0019] Perform temperature detection on the preheated FPCA product to determine whether the surface temperature of the FPCA product is lower than the preset dispensing temperature;

[0020] When the surface temperature of the FPCA product is lower than the preset dispensing temperature, the flexible circuit board and assembly components of the FPCA product are dispensed with glue by the dispensing machine.

[0021] Optionally, the temperature detection of the preheated FPCA product includes:

[0022] After the FPCA product is preheated by the preheating device, the FPCA product is taken out from the preheating device;

[0023] The temperature of the preheated FPCA product is detected by a temperature sensor.

[0024] Optionally, the temperature sensor includes a first infrared temperature sensor arranged in the dispensing machine, and / or a second infrared temperature sensor arranged outside the dispensing machine.

[0025] Optionally, when the FPCA product is subjected to a dispensing process, the time from completing preheating of the FPCA product to placing the FPCA product into the dispensing machine does not exceed the maximum cooling time.

[0026] In addition, the present invention also provides a FPCA product, which is manufactured by the FPCA product dispensing method as described above.

[0027] The beneficial effects brought about by the technical solution provided by the present invention include:

[0028] After the flexible circuit board and assembly components are assembled to obtain the FPCA product, and before the FPCA product is glued, the FPCA product is preheated first, which can discharge the gas in the gap between the flexible circuit board and the assembly component, and can also discharge the gas attached to the surface of the assembly component. Therefore, after the FPCA product is preheated, when the FPCA product is glued, the gas wrapped in the glue can be reduced; moreover, when the preheated FPCA product is glued, the FPCA product with a higher temperature can also promote the flow of glue, so that the gas on the surface of the FPCA product can be quickly discharged, which can further avoid the gas being wrapped in the glue. In this way, when the FPCA product after glue is subsequently cured at high temperature, there will be no glue splashing, and the flexible circuit board and FPCA product will not be contaminated, thus ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 It is a schematic diagram of the steps of the FPCA product dispensing method according to an embodiment of the present invention;

[0031] Figure 2 Detailed flowchart of step S200 in the FPCA product dispensing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the conventional technology, the gap between the switch button and the flexible board is directly cured at high temperature after the glue is dispensed and filled. However, due to the structure of the parts, a small amount of gas will remain in the groove of the parts and be wrapped by the glue during the dispensing process. During the high-temperature curing, glue splashing will occur, resulting in contamination of the flexible board and affecting the product quality. In order to solve the above problems, the present invention proposes a dispensing method for FPCA products.

[0034] like Figure 1 As shown, the FPCA product dispensing method proposed by the present invention may specifically include the following steps:

[0035] S100, assemble the flexible circuit board and assembly components using surface mount technology to obtain FPCA products;

[0036] S200, preheating the FPCA product, and then performing glue dispensing on the FPCA product;

[0037] S300, high temperature curing treatment is performed on the FPCA product after dispensing.

[0038] After the flexible circuit board and assembly components are assembled to obtain the FPCA product, and before the FPCA product is glued, the FPCA product is preheated first, which can discharge the gas in the gap between the flexible circuit board and the assembly component, and can also discharge the gas attached to the surface of the assembly component. Therefore, after the FPCA product is preheated, when the FPCA product is glued, the gas wrapped in the glue can be reduced; moreover, when the preheated FPCA product is glued, the FPCA product with a higher temperature can also promote the flow of glue, so that the gas on the surface of the FPCA product can be quickly discharged, which can further avoid the gas being wrapped in the glue. In this way, when the FPCA product after glue is subsequently cured at high temperature, there will be no glue splashing, and the flexible circuit board and FPCA product will not be contaminated, thus ensuring product quality.

[0039] In addition, in step S100, the flexible circuit board and the assembly components are assembled using surface mount technology to obtain an FPCA product, which may further include the following steps:

[0040] The flexible circuit board is baked, the assembly components are printed and mounted by SMT (Surface Mounted Technology) on the flexible circuit board, the printed flexible circuit board and the assembly components are subjected to SPI (Solder Paste Inspection), the flexible circuit board and the assembly components are punched, the flexible circuit board and the assembly components are subjected to AOI (Automatic Optic Inspection), and the flexible circuit board and the assembly components are reflow cured to obtain FPCA products.

[0041] In addition, if Figure 2 As shown, in step S200, the FPCA product is preheated, which may further include the following steps:

[0042] S210, placing the FPCA product into a preheating device;

[0043] After the flexible circuit board and assembly components are printed and mounted using surface mount technology to obtain FPCA products, manual or automatic conveying equipment can be used to transfer the FPCA products to the preheating equipment.

[0044] S220, preheating the FPCA product by a preheating device so that the surface temperature of the FPCA product reaches a preset heating temperature.

[0045] After the FPCA product is transferred to the preheating device, the FPCA product can be heated by the preheating device so that the surface temperature of the FPCA product reaches the preset heating temperature. In this embodiment, the preset heating temperature can be 110-125°C, that is, the FPCA product can be heated so that its surface temperature slightly exceeds the preset dispensing temperature. In addition, the preset heating temperature can also be 100-110°C.

[0046] Moreover, the preheating device may include a heating seat mechanism and a heating cover mechanism connected to the heating seat mechanism, and the FPCA product may be placed between the heating seat mechanism and the heating cover mechanism to heat the FPCA product.

[0047] Further, the heating seat mechanism may include a heating base, a base insulation shell disposed on the heating base, a first heating element disposed on the base insulation shell, and a first heating plate connected to the first heating element. Moreover, the heating cover mechanism may include a heating cover body hinged on the heating base, a cover insulation shell disposed on the heating cover body, a second heating element disposed on the cover insulation shell, and a second heating plate connected to the second heating element, wherein a heating cavity for preheating the FPCA product is formed between the second heating plate and the first heating plate.

[0048] Moreover, by rotating the heating cover body of the heating cover mechanism upward, the heating cover mechanism can be separated from the heating seat mechanism to open the heating chamber, so as to facilitate placing the FPCA product on the heating rack above the first heating plate of the heating seat mechanism; by rotating the heating cover body of the heating cover mechanism downward, the heating cover mechanism and the heating seat mechanism can be closed to seal the heating chamber, so as to facilitate heating the FPCA product in the heating chamber. In addition, a temperature detection structure is provided in the heating chamber of the heating seat mechanism, so as to monitor the temperature of the FPCA product in real time.

[0049] Furthermore, in step S100, placing the FPCA product in a preheating device may further include the following steps:

[0050] The FPCA product is placed above the first heating plate of the heating seat mechanism of the preheating device, and the heating cover mechanism is covered so that the FPCA product is located in the heating cavity between the first heating plate and the second heating plate of the heating cover mechanism.

[0051] The first heating element can heat the first heating plate, and the second heating element can heat the second heating plate, so that the heating chamber can be heated from both sides by the first heating plate and the second heating plate, and the FPCA product placed in the heating chamber can be heated. In addition, a heating rack can be provided between the first heating plate and the second heating plate, and the FPCA product can be placed on the heating rack, so as to heat the FPCA product from both sides.

[0052] Moreover, in step S220, preheating the FPCA product by a preheating device may further include the following steps:

[0053] The FPCA product is preheated by the preheating device so that the temperature of the FPCA product gradually rises, and the heating rate is less than the preset rate, and the peak temperature of the preheating does not exceed the maximum peak temperature.

[0054] When preheating the FPCA product, it is necessary to control the heating rate of the FPCA product to avoid damaging the FPCA product due to excessive heating. Moreover, the preset heating rate can be 2°C / S; the maximum peak temperature can be 110-125°C, or 100-110°C, which can be determined according to the preset heating temperature of the FPCA product. Specifically, when the FPCA product is preheated by the preheating equipment, the FPCA product can be gradually heated, and the heating rate is less than 2°C / S, and the peak temperature of the preheating is 110-125°C, or 100-110°C.

[0055] In addition, in step S200, the FPCA product is subjected to a dispensing process, which may further include the following steps:

[0056] S230, performing temperature detection on the preheated FPCA product to determine whether the surface temperature of the FPCA product is less than a preset dispensing temperature;

[0057] S240, when the surface temperature of the FPCA product is lower than the preset dispensing temperature, the flexible circuit board and assembly components of the FPCA product are subjected to dispensing treatment by the dispensing machine;

[0058] S250, when the surface temperature of the FPCA product is greater than the preset dispensing temperature, wait until the surface temperature of the FPCA product drops below the preset dispensing temperature, and then use the dispensing machine to dispense glue on the flexible circuit board and assembly components of the FPCA product.

[0059] After the preheating of the FPCA product is completed, the heated FPCA product can be transferred to the dispensing machine for dispensing. The dispensing process can realize the bottom filling between the flexible circuit board and the assembly components on the FPCA product (the material of the bottom filling glue is usually epoxy glue, and the epoxy glue is sprayed on the edge of the component by the principle of capillary action to allow the glue to penetrate to the bottom of the switch), and then heated to cure (thermal curing), which can effectively improve the mechanical strength of the solder joints of the FPCA product, thereby increasing the service life of the FPCA product.

[0060] Moreover, before transferring the heated FPCA product to the glue dispensing machine for glue dispensing, it is necessary to first detect whether the surface temperature of the FPCA product is lower than the preset glue dispensing temperature to avoid the surface temperature of the FPCA product being too high during glue dispensing and affecting the glue dispensing effect. By controlling the surface temperature of the FPCA product during glue dispensing, it is possible to discharge the gas between the glue and the surface of the assembly component (or / and the flexible circuit board) during glue dispensing, avoid the formation of gas being wrapped in the glue to form bubbles, and fill the gap between the flexible circuit board and the assembly component well to achieve a good glue dispensing effect. Moreover, in this embodiment, the preset glue dispensing temperature can be 100°C, that is, when the FPCA product is glued, its surface temperature needs to be less than 100°C.

[0061] Furthermore, in the above step S230, the temperature detection of the preheated FPCA product may further include the following steps:

[0062] S232. After the FPCA product is preheated by the preheating device, the FPCA product is taken out from the preheating device.

[0063] That is, after completing the preheating of the FPCA product, the heating cover body of the heating cover mechanism can be rotated upward to separate the heating cover mechanism from the heating seat mechanism to open the heating chamber, and then the FPCA product placed on the heating rack above the first heating plate of the heating seat mechanism can be taken out manually or transported out by a conveying device.

[0064] S234, detecting the temperature of the preheated FPCA product by using a temperature sensor.

[0065] Before dispensing the FPCA product, the surface temperature of the FPCA product can be detected by the temperature sensor. In addition, the surface temperature of the FPCA product can be detected by the temperature sensor before the FPCA product is transferred to the dispensing machine; the surface temperature of the FPCA product can also be detected by the temperature sensor before the FPCA product is transferred to the dispensing machine for dispensing.

[0066] Furthermore, the temperature sensor may include a first infrared temperature sensor disposed in the glue dispensing machine, or / and a second infrared temperature sensor disposed outside the glue dispensing machine. That is, before the FPCA product is transferred to the glue dispensing machine for glue dispensing, the surface temperature of the FPCA product is detected by the first infrared temperature sensor disposed in the glue dispensing machine, and when the surface temperature of the FPCA product is lower than the preset glue dispensing temperature, the glue dispensing machine is started to perform glue dispensing on the FPCA product.

[0067] In addition, before the FPCA product is transferred to the dispensing machine, the surface temperature of the FPCA product can be detected by a second infrared temperature sensor provided outside the dispensing machine. When the surface temperature of the FPCA product is lower than the preset dispensing temperature, the FPCA product is transferred to the dispensing machine, and the dispensing machine is started to perform dispensing on the FPCA product.

[0068] In addition, before the FPCA product is transferred to the dispensing machine, the surface temperature of the FPCA product can be detected by a second infrared temperature sensor provided outside the dispensing machine; when the surface temperature of the FPCA product is lower than the preset dispensing temperature, the FPCA product is transferred to the dispensing machine, and the surface temperature of the FPCA product is detected by a first infrared temperature sensor provided in the dispensing machine. When it is confirmed that the surface temperature of the FPCA product is lower than the preset dispensing temperature, the dispensing machine is started to perform dispensing on the FPCA product to avoid misoperation.

[0069] In addition, a cooling rack may be provided between the preheating device and the dispensing machine. After the FPCA product is heated by the preheating device, the FPCA product is transferred to the cooling rack for cooling, and then the FPCA product is transferred to the dispensing machine. A second infrared temperature sensor may be provided on the cooling rack to monitor the surface temperature of the FPCA product being cooled on the cooling rack.

[0070] Moreover, in the above step S200, when the FPCA product is dispensed, the time from completing the preheating of the FPCA product to placing the FPCA product in the dispensing machine does not exceed the maximum cooling time. By controlling the time when the FPCA product is transferred from the preheating device to the dispensing machine, it is possible to avoid excessive cooling of the FPCA product, which may cause the temperature to be too low, and affect the effect of removing gas during the dispensing process, and will not affect the product processing efficiency. In addition, the maximum cooling time can be 7 minutes. For example, when the surface temperature of the FPCA product after preheating is 110-125°C, dispensing can be performed within 3 minutes after heating.

[0071] In addition, when the FPCA product is glued, the welding terminals of the assembly components of the FPCA product can be waterproofed and dustproofed with UV glue (i.e. ultraviolet light curing glue), or UF glue (epoxy resin glue) can be applied through the bottom capillary action of the bottom filling.

[0072] In addition, in this embodiment, the assembly components involved in the above-mentioned FPCA product dispensing method can be switch buttons, and the flexible circuit board can be a switch circuit board. The process is optimized by filling the bottom of the FPCA product of the traditional mobile phone button with glue and performing thermal curing to solve the problem of appearance glue contamination, adding a preheating process before filling the bottom with glue, and preheating the SMT switch button and switch circuit board after assembly, so as to reduce the appearance glue contamination caused by the gas influence of the switch button itself.

[0073] In addition, as required, the assembly components of the FPCA product can be other mounting components, and the flexible circuit board can also be other corresponding circuit boards.

[0074] In addition, the present invention also provides a FPCA product, which is manufactured by the FPCA product dispensing method as described above.

[0075] Through the FPCA product dispensing solution provided by the present invention, the defective rate is reduced from 1.5% to 0.05%, which greatly reduces the product scrap rate, greatly improves product quality, reduces the risk of product market customer complaints, improves customer satisfaction, and eliminates quality risks in advance for the launch of new products. Equivalent consumer electronic products can be quickly promoted in the industry, reducing a large amount of engineering personnel's research and development energy. At the same time, there will be a demand for small SMT reflow (reflow soldering) equipment, while promoting the development of domestic high-temperature heating Reflow equipment manufacturers.

[0076] It should be noted that, in the present invention, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0077] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A FPCA product dispensing method, characterized in that: include: Surface mount technology is used to assemble flexible circuit boards and assembly components to obtain FPCA products; Preheat the FPCA product and then perform glue dispensing on the FPCA product; The FPCA product after dispensing is subjected to high temperature curing treatment.

2. The FPCA product dispensing method according to claim 1, characterized in that: The preheating treatment of the FPCA product comprises: Place the FPCA product into a preheating device; The FPCA product is preheated by the preheating device so that the surface temperature of the FPCA product reaches the preset heating temperature.

3. The FPCA product dispensing method according to claim 2, characterized in that: The preheating of the FPCA product by the preheating device comprises: The FPCA product is preheated by the preheating device so that the temperature of the FPCA product gradually rises, and the heating rate is less than the preset rate, and the peak temperature of the preheating does not exceed the maximum peak temperature.

4. The FPCA product dispensing method according to claim 2, characterized in that: The preheating device comprises a heating seat mechanism, and a heating cover mechanism connected to the heating seat mechanism; The heating seat mechanism comprises a heating base, a base heat-insulating shell arranged on the heating base, a first heating element arranged on the base heat-insulating shell, and a first heating plate connected to the first heating element; The heating cover mechanism includes a heating cover body hinged on the heating base, a cover body insulation shell arranged on the heating cover body, a second heating element arranged on the cover body insulation shell, and a second heating plate connected to the second heating element, and a heating cavity for preheating FPCA products is formed between the second heating plate and the first heating plate.

5. The FPCA product dispensing method according to claim 4, characterized in that: Placing the FPCA product into a preheating device comprises: The FPCA product is placed above the first heating plate of the heating seat mechanism of the preheating device, and the heating cover mechanism is covered so that the FPCA product is located in the heating cavity between the first heating plate and the second heating plate of the heating cover mechanism.

6. The FPCA product dispensing method according to any one of claims 1 to 5, characterized in that: The dispensing process of the FPCA product includes: Perform temperature detection on the preheated FPCA product to determine whether the surface temperature of the FPCA product is lower than the preset dispensing temperature; When the surface temperature of the FPCA product is lower than the preset dispensing temperature, the flexible circuit board and assembly components of the FPCA product are dispensed with glue by the dispensing machine.

7. The FPCA product dispensing method according to claim 6, characterized in that: The temperature detection of the preheated FPCA product includes: After the FPCA product is preheated by the preheating device, the FPCA product is taken out from the preheating device; The temperature of the preheated FPCA product is detected by a temperature sensor.

8. The FPCA product dispensing method according to claim 7, characterized in that: The temperature sensor includes a first infrared temperature sensor arranged in the glue dispensing machine, and / or a second infrared temperature sensor arranged outside the glue dispensing machine.

9. The FPCA product dispensing method according to claim 6, characterized in that: When dispensing the FPCA product, the time from completing the preheating of the FPCA product to placing the FPCA product in the dispensing machine shall not exceed the maximum cooling time.

10. A FPCA product, characterized in that: The FPCA product is manufactured by the FPCA product dispensing method as described in any one of claims 1-9.

Images