Multi-functional maintenance method and device after large-warping packaging ball mounting furnace

Abstract

The invention relates to a multifunctional maintenance method and device behind a large-warping packaging ball mounting furnace, and the method comprises the steps: 1, clamping and fixing a substrate, and moving a rotating frame to a position above a target test solder ball; step 2, performing ball pushing action on the target test solder ball; step 3, performing a ball pulling action on the target test solder ball; 4, if the test does not reach the standard, removing the target test solder ball; and step 5, carrying out a ball mounting action. The invention discloses a multifunctional overhauling device behind a large-warping packaging ball mounting furnace. The multifunctional overhauling device comprises a workbench, a rotating frame, a clamping seat, a ball pushing module, a ball pulling module, a ball removing module and a laser ball mounting module, the ball pushing module, the ball pulling module, the ball removing module and the laser ball mounting module are located at the bottom of the rotary disc. The method has the advantages that the push-pull force test of the solder ball is carried out, the abnormities of ball removal and laser ball mounting are repaired, the risk caused by manual ball removal is reduced, the chip performance and yield are improved, and the chip scrapping risk is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a multifunctional post-furnace maintenance method and device for large warpage packaging. Background Art

[0002] With the rapid development of electronic technology, the demand for higher density, smaller size, higher integration and higher performance packaging has brought new challenges to the semiconductor manufacturing industry, which has also prompted the continuous breakthrough and development of advanced packaging technology; at the same time, with the support of emerging industries such as artificial intelligence, autonomous driving, 5G networks, and the Internet of Things, the demand for 2.5D / 3D packaging has become increasingly strong; currently, product packaging sizes are getting larger and larger, and changes in stress cause product warping to become larger and larger; the difficulty of operating large-size, small-pitch products has also come with it; especially after package ball reflow, the abnormal phenomena of solder ball missing and solder ball bridging have also increased accordingly, and multiple reflow soldering must be performed after the abnormality is repaired.

[0003] Since multiple reflows will cause product stress to change again, resulting in poor ball implant quality and unpredictable internal damage to the chip, large package products usually limit the number of reflows of the package, causing many products with abnormal solder balls to be scrapped, affecting production yield.

[0004] Therefore, it is necessary to design a ball planting detection and repair device for large warpage package substrates to solve the problem of abnormal repair after the ball planting furnace. Summary of the invention

[0005] The purpose of the present invention is to provide a multifunctional maintenance method and device for large warpage package after ball implantation furnace, which integrates ball removal and laser ball implantation, and quickly and efficiently solves the problem of repairing abnormalities of large-size package after ball implantation furnace.

[0006] A first aspect of the present invention provides a multifunctional post-warpage inspection method for a large warpage package ball implantation furnace, comprising the following steps:

[0007] Step 1: Clamp and fix the substrate, and move the rotating frame to the top of the target test solder ball;

[0008] Step 2: Adjust the ball-pushing module of the rotating frame to the position directly above the target test solder ball, and push the target test solder ball;

[0009] Step 3: Adjust the ball pulling module of the rotating frame to the top of the target test solder ball, and pull the target test solder ball out;

[0010] Step 4: Determine the test results of the ball pushing module and the ball pulling module. If the test does not meet the standard, adjust the ball removal module to the top of the target test solder ball and remove the target test solder ball;

[0011] Step 5: Adjust the laser ball implantation module to the position directly above the target repair location and perform the ball implantation operation.

[0012] Based on the above-mentioned multifunctional maintenance method after the large warpage package ball planting furnace, the second aspect of the present invention provides a multifunctional maintenance device after the large warpage package ball planting furnace, which runs the above-mentioned multifunctional maintenance method after the large warpage package ball planting furnace, and specifically includes a workbench, a rotating frame, a clamping seat, a ball pushing module, a ball pulling module, a ball removing module, and a laser ball planting module;

[0013] The workbench and the clamping seat are used to clamp and fix the substrate in step 1;

[0014] The rotating frame is used for rotating and adjusting the corresponding modules in steps 2-5;

[0015] The ball pushing module is used for the ball pushing test of the target test solder ball in step 2;

[0016] The ball extraction module is used for the ball extraction test of the target test solder ball in step 3;

[0017] The ball removal module is used for removing solder balls that do not meet the test standards in step 4;

[0018] The laser ball implantation module is used for the ball implantation repair in step 5;

[0019] The workbench is provided with a plurality of control modules;

[0020] The clamping seat is located on the workbench, and comprises a base, a fixed clamping block, a movable clamping block, and a position adjusting member. The fixed clamping block and the movable clamping block are located on the base, and the opposite surfaces of the fixed clamping block and the movable clamping block are provided with material placing blocks; the position adjusting member is connected to the movable clamping block;

[0021] The rotating frame is located above the workbench, the rotating frame is provided with a moving assembly, the rotating frame is connected with a turntable, the ball pushing module, the ball pulling module, the ball removing module, and the laser ball planting module are located at the bottom of the turntable;

[0022] The ball pushing module includes a ball pushing driving assembly, a push knife, and a ball pushing sensor. The push knife is connected to the rotating frame through the ball pushing driving assembly, and the push knife is provided with a ball pushing sensor.

[0023] The ball pulling module includes a ball pulling drive assembly, a clamping claw, and a ball pulling sensor. The clamping claw is connected to the rotating frame through the ball pulling drive assembly, and the clamping claw is provided with a ball pulling sensor.

[0024] The ball removal module comprises a heating head and a ball suction head, and the heating head and the ball suction head are arranged side by side below the turntable;

[0025] The laser ball implantation module comprises a solder ball box and a laser injection component, and the solder ball box is connected to the laser injection component.

[0026] As a further improvement of the invention, a sliding block is provided at the bottom of the movable clamping block, a guide groove is provided at the base, and the sliding block is located in the guide groove.

[0027] As a further improvement of the invention, the fixed clamping block is provided with a clamping pressure sensor.

[0028] Furthermore, protective pads are provided on the opposite surfaces of the fixed clamping block and the movable clamping block.

[0029] The key point of the present invention is to move the rotating frame to the target inspection position through the moving assembly, and then rotate the turntable to rotate the ball pushing module and the ball pulling module to the target inspection position in turn, and perform push and pull tests on the solder balls respectively; if abnormal solder balls are detected, the ball removal module and the laser ball planting module are rotated to the target position in turn, and the ball removal and ball planting operations are performed in turn.

[0030] Compared with the prior art, the multifunctional maintenance method and device for large warpage package ball implantation furnace of the present invention has the following advantages:

[0031] The product is tested for push-pull force after soldering, and the abnormal solder balls of large-size and large-warping packaged products after the furnace are removed and laser ball implantation is repaired, reducing the risks brought by manual ball removal, improving chip performance and yield, and avoiding the risk of chip scrapping. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the multifunctional maintenance method and device for large warpage package ball planting furnace of the present invention;

[0033] Figure 2 It is a connection diagram of the ball pushing module, ball pulling module, ball removing module, and laser ball implanting module;

[0034] Figure 3 It is a cross-sectional view of the clamping seat;

[0035] Figure 4 This is a connection diagram of the ball pushing module, ball pulling module, ball removing module, and laser ball implanting module. DETAILED DESCRIPTION

[0036] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0037] A first aspect of the present invention provides a multifunctional post-warpage inspection method for a large warpage package ball implantation furnace, comprising the following steps:

[0038] Step 1: Clamp and fix the substrate 4, and move the rotating frame 2 to the top of the target test solder ball;

[0039] Step 2: Adjust the ball-pushing module 5 of the rotating frame 2 to be directly above the target test solder ball, and push the target test solder ball;

[0040] Step 3: Adjust the ball pulling module 6 of the rotating frame 2 to be directly above the target test solder ball, and pull the target test solder ball;

[0041] Step 4: Determine the test results of the ball pushing module 5 and the ball pulling module 6. If the test results do not meet the standards, adjust the ball removing module 7 to be directly above the target test solder ball and remove the target test solder ball;

[0042] Step 5: Adjust the laser ball implanting module 8 to be directly above the target repair position and perform the ball implanting operation.

[0043] Based on the above-mentioned multifunctional overhaul method after the large warpage package ball planting furnace, the second aspect of the present invention provides a multifunctional overhaul device after the large warpage package ball planting furnace, which runs the above-mentioned multifunctional overhaul method after the large warpage package ball planting furnace, specifically including a workbench 1, a rotating frame 2, a clamping seat 3, a ball pushing module 5, a ball pulling module 6, a ball removing module 7, and a laser ball planting module 8;

[0044] The workbench 1 and the clamping seat 3 are used to clamp and fix the substrate 4 in step 1;

[0045] Rotating frame 2, used for rotating and adjusting the corresponding modules in steps 2-5;

[0046] Ball pushing module 5, used for the ball pushing test of the target test solder ball in step 2;

[0047] Ball extraction module 6, used for the ball extraction test of the target test solder ball in step 3;

[0048] The ball removal module 7 is used for removing the solder balls that do not meet the test standards in step 4;

[0049] Laser ball implantation module 8, used for ball implantation repair in step 5;

[0050] The workbench 1 is provided with a number of control modules 11;

[0051] The clamping seat 3 is located on the workbench 1. Figure 3 As shown, the clamping seat 3 includes a base 31, a fixed clamping block 32, a movable clamping block 33, and a positioning member 34. The fixed clamping block 32 and the movable clamping block 33 are located on the base 31, and the opposite surfaces of the fixed clamping block 32 and the movable clamping block 33 are provided with a placing block 39;

[0052] The substrate 4 is placed between the fixed clamping block 32 and the movable clamping block 33 , and the placing block 39 supports the substrate 4 so that a certain gap is maintained between the substrate 4 and the base 31 to avoid excessive contact area between the substrate 4 and the base 31 , which may cause wear of the substrate 4 .

[0053] The positioning member 34 is connected to the movable clamping block 33 . The positioning member 34 may be an existing screw transmission member. The movable clamping block 33 may be moved by turning the screw transmission member. The spacing between the fixed clamping block 32 and the movable clamping block 33 may be adjusted according to the size of the clamped substrate 4 .

[0054] The bottom of the movable clamping block 33 is provided with a slider 38, and the base 31 is provided with a guide groove 37, and the slider 38 is located in the guide groove 37. The movable clamping block 33 moves along the guide groove 37 to prevent the movable clamping block 33 from being offset and affecting the clamping effect.

[0055] The fixed clamping block 32 is provided with a clamping pressure sensor 35, which senses the pressure on the fixed clamping block 32 when the substrate 4 is clamped. The clamping pressure sensor 35 is an existing pressure sensor, which converts the sensed pressure signal into an electrical signal and transmits it to the terminal. When the pressure signal sensed by the clamping pressure sensor 35 reaches a preset value, the terminal issues an instruction and sends an alarm signal to promptly remind the operator to prevent the substrate 4 from being overly pressurized and causing edge damage to the substrate 4.

[0056] The opposite surfaces of the fixed clamping block 32 and the movable clamping block 33 are provided with protective pads 36 , which may be existing silicone pads, replacing the two clamping blocks to directly contact the side wall of the substrate 4 , further reducing scratches on the substrate 4 .

[0057] The rotating frame 2 is located above the workbench 1, and is provided with a moving assembly 21. The rotating frame 2 is connected to a turntable 22, and a ball pushing module 5, a ball pulling module 6, a ball removing module 7, and a laser ball planting module 8 are located at the bottom of the turntable 22;

[0058] With the assistance of the existing microscope, by operating the relevant control module 11, the rotating frame 2 is moved to the position requiring maintenance through the moving component 21. The moving component 21 can be an existing bidirectional ball screw component to achieve horizontal left and right forward and backward movement of the rotating frame 2.

[0059] like Figure 4 As shown, the ball pushing module 5 includes a ball pushing driving assembly 51, a push knife 52, and a ball pushing sensor 53. The push knife 52 is connected to the rotating frame 2 through the ball pushing driving assembly 51, and the push knife 52 is provided with a ball pushing sensor 53;

[0060] The ball push drive assembly 51 can be an existing ball screw assembly, and the corresponding control module 11 controls the motor to drive the screw to realize forward and reverse rotation, so that the push knife 52 connected thereto can be raised and lowered according to the program setting. First, the push knife 52 is lowered at the rear position of the target solder ball until the push knife 52 contacts the substrate 4. The push ball sensor 53 senses the pressure signal of the push knife 52 on the substrate 4, and converts the force signal into an electrical signal and transmits it to the terminal. The terminal sends an instruction to the motor according to the preset value, so that the motor changes the driving direction and raises the push knife 52 to a suitable small range of travel to prevent the push knife 52 from rubbing against the surface of the substrate 4 and scratching the substrate 4 when pushing the ball; then, the rotating frame 2 is moved by the moving assembly 21, so as to realize the pushing action of the push knife 52 on the solder ball, thereby realizing the welding force test after the solder ball is welded.

[0061] The ball extraction module 6 includes a ball extraction driving assembly 61, a clamping claw 62, and a ball extraction sensor 63. The clamping claw 62 is connected to the rotating frame 2 through the ball extraction driving assembly 61, and the clamping claw 62 is provided with a ball extraction sensor 63.

[0062] The ball pulling drive assembly 61 can be an existing ball screw assembly, and the corresponding control module 11 controls the motor to drive the screw to realize forward and reverse rotation, so that the clamp 62 connected thereto can be raised and lowered according to the program setting. First, the clamp 62 located above the target solder ball is lowered by the ball pulling drive assembly 61. After the clamp 62 contacts the substrate 4, the ball pulling sensor 63 is an existing pressure sensor, which can sense the pressure signal of the clamp 62 on the substrate 4, convert it into an electrical signal and transmit it to the terminal. The terminal sends an instruction to the motor according to the preset value, so that the motor changes the driving direction. The clamp 62 holds the solder ball during the rising process and completes the ball pulling action, so that the welding force test after the solder ball is welded can be realized. The ball pulling sensor 63 can accurately sense the descending position of the clamp 62 to prevent the clamp 62 from rubbing against the substrate 4 and scratching the substrate 4.

[0063] The ball removal module 7 includes a heating head 71 and a ball suction head 72, which are arranged in parallel below the turntable 22; first, the heating head 71 is preheated and heated according to the set melting point of the solder ball through the heating module. After the temperature reaches the set temperature, the heating head 71 heats the abnormal solder ball to soften the solder ball until it melts, and the ball suction head 72 uses negative pressure to absorb the molten tin from the substrate 4 without manual intervention, avoiding the risks brought by manual ball removal.

[0064] The laser ball implantation module 8 includes a solder ball box 81 and a laser injection component 82, and the solder ball box 81 and the laser injection component 82 are connected. The solder ball is transported from the solder ball box 81 to the solder ball implantation nozzle of the laser injection component 82. The laser injection component 82 melts the solder ball by emitting a laser, and injects the molten tin onto the pad corresponding to the soldering position of the solder ball, and then cools it, and finally completes the welding and forms the solder ball. Laser ball implantation is a non-contact welding method, which does not require the use of additional flux, achieves instant solidification at low heat, is suitable for single-point solder implantation, and has high precision.

[0065] The present invention provides a multifunctional post-furnace maintenance device for large warpage package ball planting, which moves the rotating frame 2 to the target maintenance position through the moving component 21, and then rotates the turntable 22 to rotate the ball pushing module 5 and the ball pulling module 6 to the target maintenance position in turn, and performs push and pull tests on the solder balls respectively; if abnormal solder balls are detected, the ball removal module 7 and the laser ball planting module 8 are rotated to the target position in turn, and the ball removal and ball planting operations are performed in turn.

[0066] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A multifunctional maintenance method for large warpage package after ball implantation furnace, characterized in that: The steps include: Step 1: Clamp and fix the substrate, and move the rotating frame to the top of the target test solder ball; Step 2: Adjust the ball-pushing module of the rotating frame to the position directly above the target test solder ball, and push the target test solder ball; Step 3: Adjust the ball pulling module of the rotating frame to the top of the target test solder ball, and pull the target test solder ball out; Step 4: Determine the test results of the ball pushing module and the ball pulling module. If the test does not meet the standard, adjust the ball removal module to the top of the target test solder ball and remove the target test solder ball; Step 5: Adjust the laser ball implantation module to the position directly above the target repair location and perform the ball implantation operation.

2. Multifunctional maintenance device after large warpage package ball implantation furnace, characterized in that: The multifunctional maintenance method after running the above-mentioned large warpage package ball implanting furnace specifically includes a workbench, a rotating frame, a material clamping seat, a ball pushing module, a ball pulling module, a ball removing module, and a laser ball implanting module; The workbench and the clamping seat are used to clamp and fix the substrate in step 1; The rotating frame is used for rotating and adjusting the corresponding modules in steps 2-5; The ball pushing module is used for the ball pushing test of the target test solder ball in step 2; The ball extraction module is used for the ball extraction test of the target test solder ball in step 3; The ball removal module is used for removing solder balls that do not meet the test standards in step 4; The laser ball implantation module is used for the ball implantation repair in step 5; The workbench is provided with a plurality of control modules; The clamping seat is located on the workbench, and comprises a base, a fixed clamping block, a movable clamping block, and a position adjusting member. The fixed clamping block and the movable clamping block are located on the base, and the opposite surfaces of the fixed clamping block and the movable clamping block are provided with material placing blocks; the position adjusting member is connected to the movable clamping block; The rotating frame is located above the workbench, the rotating frame is provided with a moving assembly, the rotating frame is connected with a turntable, the ball pushing module, the ball pulling module, the ball removing module, and the laser ball planting module are located at the bottom of the turntable; The ball pushing module includes a ball pushing driving assembly, a push knife, and a ball pushing sensor. The push knife is connected to the rotating frame through the ball pushing driving assembly, and the push knife is provided with a ball pushing sensor. The ball pulling module includes a ball pulling drive assembly, a clamping claw, and a ball pulling sensor. The clamping claw is connected to the rotating frame through the ball pulling drive assembly, and the clamping claw is provided with a ball pulling sensor. The ball removal module comprises a heating head and a ball suction head, and the heating head and the ball suction head are arranged side by side below the turntable; The laser ball implantation module comprises a solder ball box and a laser injection component, and the solder ball box is connected to the laser injection component.

3. The multifunctional maintenance device for large warpage package after ball implantation furnace according to claim 2, characterized in that: A sliding block is provided at the bottom of the movable clamping block, a guide groove is provided at the base, and the sliding block is located in the guide groove.

4. The multifunctional maintenance device for large warpage package after ball implantation furnace according to claim 2, characterized in that: The fixed material clamping block is provided with a material clamping pressure sensor.

5. The multifunctional maintenance device for large warpage package after ball implantation furnace according to claim 2 or 4, characterized in that: The opposite surfaces of the fixed material clamping block and the movable material clamping block are provided with protective pads.

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