Packaging device

Abstract

The invention provides a packaging device, which comprises a packaging body, a circuit board, a first bonding layer and a metal sheet, and is characterized in that the packaging body is provided with a plurality of solder ball structures; the circuit board is electrically connected with the packaging body through a plurality of solder ball structures; the first bonding layer is located between the packaging body and the circuit board and is used for bonding the packaging body and the circuit board; the metal sheet is arranged on one side, deviating from the packaging body, of the circuit board and corresponds to the packaging body; a plurality of first air guide holes penetrating through the circuit board are formed in the area, corresponding to the first bonding layer, of the circuit board; the metal sheet is provided with a plurality of second gas guide holes corresponding to at least part of the first gas guide holes, and specifically, the first gas guide holes and the second gas guide holes which are correspondingly arranged can discharge gas in the first bonding layer, so that the situation that the reliability of the device is reduced due to the fact that glue easily generates bubbles in the device is avoided; and short circuit of the PCB can be caused.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to a packaging device. Background Art

[0002] BGA (Ball Grid Array) devices are made of array solder balls at the bottom of the package substrate as the I / O end of the circuit to connect with the printed circuit board (PCB). This packaging method is a surface mounting technology. Considering the risk of the package and the PCB board falling off during transportation and installation, it is necessary to fill the bottom of the package with glue to fix the device.

[0003] In the related art, in order to facilitate the welding of the package body and the PCB board and enhance the stability of the device, some reinforcement structures are added to reinforce the device.

[0004] However, since the bottom filling glue is done after the component is mounted, the glue is likely to produce many bubbles inside the device, which will lead to a decrease in device reliability and cause a short circuit on the PCB. Summary of the invention

[0005] The present application provides a packaging device that can solve the problem that glue easily generates bubbles inside the device, resulting in reduced device reliability and causing PCB short circuits.

[0006] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide a packaging device, comprising:

[0007] A package body, wherein the package body has a plurality of solder ball structures;

[0008] A circuit board, electrically connected to the package body through a plurality of solder ball structures;

[0009] A first bonding layer, located between the package body and the circuit board, and used for bonding the package body and the circuit board;

[0010] A metal sheet, arranged on a side of the circuit board away from the package body and corresponding to the package body;

[0011] Among them, a region of the circuit board corresponding to the first adhesive layer is provided with a plurality of first air guide holes penetrating the circuit board; and a plurality of second air guide holes are provided on the metal sheet corresponding to at least part of the first air guide holes.

[0012] In one embodiment, a plurality of the first air guide holes and a plurality of the second air guide holes are evenly arranged.

[0013] In one embodiment, in the first direction, projections of the plurality of first air guide holes and the plurality of solder ball structures on the same projection plane do not overlap; and / or

[0014] In the first direction, projections of a plurality of the second air guide holes and a plurality of the solder ball structures on the same projection plane do not overlap;

[0015] The first direction is the direction from the package body to the circuit board.

[0016] In one embodiment, the size of the metal sheet is greater than or equal to the size of the package body;

[0017] Furthermore, in the first direction, the projection of the metal sheet completely covers the projection of the package body.

[0018] In one embodiment, the packaging device further includes a second bonding layer, which is located between the circuit board and the metal sheet and is used to bond the metal sheet to the circuit board;

[0019] The metal sheet includes a first area and a second area; in a first direction, a projection of the first area overlaps with a projection of the package body on the same projection plane; the second area is the remaining area of ​​the metal sheet excluding the first area;

[0020] Among them, a plurality of the second air guide holes are located in the first area, and a plurality of third air guide holes are also opened in the second area.

[0021] In one embodiment, the circuit board includes a substrate and a circuit layer located on the surface of the substrate close to the package body, and the circuit layer is electrically connected to the package body through a plurality of solder ball structures; a plurality of the first air guide holes are opened on the substrate and penetrate the substrate.

[0022] In one embodiment, the circuit board includes a substrate and a circuit layer located on a surface of the substrate away from the package body, a region of the substrate corresponding to the package body is provided with a plurality of conductive holes penetrating the substrate, and the circuit layer is electrically connected to a plurality of solder ball structures through the plurality of conductive holes, and further electrically connected to the package body;

[0023] Among them, the plurality of first air guide holes include a plurality of the conductive holes.

[0024] In one embodiment, a region of the substrate corresponding to the first bonding layer is further provided with a plurality of through holes penetrating the substrate, and the plurality of through holes are spaced apart from the plurality of conductive holes;

[0025] The plurality of first air guide holes further include a plurality of through holes.

[0026] In one embodiment, the circuit board includes a multi-layer substrate stacked and a circuit layer located on at least part of the substrate, two adjacent circuit layers are insulated by at least one substrate, and a plurality of conductive holes penetrating the substrate are opened in regions of the plurality of substrates corresponding to the package body, and the circuit layers located at different layers are electrically connected to a plurality of solder ball structures through the conductive holes on the plurality of substrates, and further electrically connected to the package body;

[0027] Among them, the plurality of conductive holes on each layer of the substrate include a plurality of first conductive holes, and the plurality of first conductive holes on different layers are arranged in one-to-one correspondence; and the plurality of first air conducting holes include a plurality of first conductive holes.

[0028] In one embodiment, a region of each layer of the substrate corresponding to the first bonding layer is further provided with a plurality of through holes penetrating the substrate, and the plurality of through holes on each layer of the substrate are arranged at intervals from the plurality of conductive holes; the through holes on the substrates on different layers are arranged in one-to-one correspondence;

[0029] The plurality of first air guide holes further include a plurality of through holes.

[0030] The beneficial effects of the present application are different from those of the prior art. The packaging device provided by the present application includes a packaging body, a circuit board, a first bonding layer and a metal sheet, wherein the packaging body has a plurality of solder ball structures; the circuit board is electrically connected to the packaging body through the plurality of solder ball structures; the first bonding layer is located between the packaging body and the circuit board, and is used to bond the packaging body and the circuit board; the metal sheet is arranged on the side of the circuit board away from the packaging body; wherein, a plurality of first air guide holes penetrating the circuit board are provided in an area of ​​the circuit board corresponding to the first bonding layer; the metal sheet is provided with a plurality of second air guide holes corresponding to at least part of the first air guide holes, and specifically, the plurality of correspondingly arranged first air guide holes and second air guide holes can discharge the gas in the first bonding layer, thereby preventing the glue from easily generating bubbles inside the device, resulting in reduced device reliability, and causing problems such as short circuit of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0032] Figure 1 A schematic structural diagram of an embodiment of a packaging device provided by the present application;

[0033] Figure 2 A schematic structural diagram of another embodiment of the packaging device provided by the present application;

[0034] Figure 3 A schematic structural diagram of another embodiment of the packaging device provided by the present application;

[0035] Figure 4 A schematic structural diagram of another embodiment of the packaging device provided by the present application;

[0036] Figure 5 A schematic structural diagram of another embodiment of the packaging device provided in the present application. Specific implementation methods

[0038] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0039] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] See also Figure 1-5 , Figure 1A schematic structural diagram of an embodiment of a packaging device provided by the present application; Figure 2 A schematic structural diagram of another embodiment of the packaging device provided by the present application; Figure 3 A schematic structural diagram of another embodiment of the packaging device provided by the present application; Figure 4 A schematic structural diagram of another embodiment of the packaging device provided by the present application; Figure 5 A schematic structural diagram of another embodiment of the packaging device provided in the present application.

[0042] Specifically, the present application provides a packaging device 100 , which includes a packaging body 10 , a circuit board 20 , a first adhesive layer 30 , and a metal sheet 40 .

[0043] In the embodiment of the present application, the package 10 is a BGA device, which can be used for integrated circuits such as microprocessors, graphics processors, memory chips, and other complex electronic devices that require high-density pin arrangements. In the BGA device, the bottom of the device is not a traditional pin, but has a plurality of solder ball structures 11 for use as an interface.

[0044] The circuit board 20 is electrically connected to the package body 10 via a plurality of solder ball structures 11 , so that signal transmission is achieved between the circuit board 20 and the package body 10 .

[0045] In this application, "several" refers to one or more, and the specific design can be based on actual conditions.

[0046] Among them, since the circuit board 20 and the package body 10 use surface mounting technology, there is a risk of the package body 10 and the circuit board 20 falling off during transportation and installation, so it is necessary to fill the bottom of the package body 10 with glue to fix it. Therefore, in the embodiment of the present application, the package device 100 also includes a first adhesive layer 30, and the first adhesive layer 30 is located between the package body 10 and the circuit board 20, and is used to bond the package body 10 and the circuit board 20.

[0047] In order to facilitate the welding of the package body 10 and the circuit board 20, a reinforcement structure with good flatness and strong hardness is used for reinforcement. In the embodiment of the present application, a metal sheet 40 is used as a reinforcement structure to reinforce the device, wherein the material of the metal sheet 40 includes but is not limited to metals or alloy materials such as copper, iron, platinum, aluminum, and stainless steel. Specifically, the metal sheet 40 is arranged on the side of the circuit board 20 away from the package body 10, and is arranged corresponding to the package body 10.

[0048] Among them, in the present application, the metal sheet 40 is arranged corresponding to the package body 10, which means that in the first direction of the package body 10 pointing to the circuit board 20, the projections of the package body 10 and the metal sheet 40 overlap in the same projection plane, and the projection of the metal sheet 40 at least covers the projection of the package body 10.

[0049] The packaging device 100 further includes a second adhesive layer 50 . The second adhesive layer 50 is located between the circuit board 20 and the metal sheet 40 and is used to bond the metal sheet 40 to the circuit board 20 .

[0050] However, after the metal sheet 40 is combined with the circuit board 20, due to the poor air permeability of the metal sheet 40, the space inside the reinforced device is relatively closed, which will cause the small bubbles generated by the first bonding layer 30 formed by dispensing to be unable to be discharged. These bubbles will cause the reliability of the device to decrease and may cause problems such as short circuit of the PCB board.

[0051] To solve the above problems, in the embodiments of the present application, see Figure 1-5 , further, a plurality of first air guide holes A1 penetrating the circuit board 20 are opened in the area of ​​the circuit board 20 corresponding to the first adhesive layer 30; and a plurality of second air guide holes A2 corresponding to at least part of the first air guide holes A1 are opened in the metal sheet 40.

[0052] Among them, "a number of second air holes A2 arranged corresponding to at least part of the first air holes A1" in the present application means that a number of second air holes A2 have a connecting area with part or all of the first air holes A1, so that fluid (gas, liquid, etc.) can flow between the first air holes A1 and the second air holes A2 to form an exhaust channel.

[0053] Among them, the second air guide holes A2 and the first air guide holes A1 can be connected one-to-one or one-to-many. For example, one second air guide hole A2 can be connected to one first air guide hole A1, or the aperture of the second air guide hole A2 can be larger than the aperture of the first air guide hole A1, so that one second air guide hole A2 can be connected to multiple first air guide holes A1 at the same time.

[0054] Specifically, in the embodiment of the present application, a plurality of corresponding first air guide holes A1 and second air guide holes A2 are provided corresponding to the first adhesive layer 30. The first air guide holes A1 and the second air guide holes A2 cooperate to form an exhaust channel that can discharge the gas in the first adhesive layer 30 and the second adhesive layer 50, thereby preventing the first adhesive layer 30 and the second adhesive layer 50 from easily generating bubbles, thereby avoiding problems such as a decrease in device reliability and causing a short circuit in the PCB board.

[0055] In one embodiment, a plurality of first air guide holes A1 and a plurality of second air guide holes A2 are evenly arranged. Specifically, the first air guide holes A1 on the circuit board 20 are evenly arranged, and the second air guide holes A2 on the metal sheet 40 are evenly arranged, so as to avoid the bubbles generated in the local area of ​​the first adhesive layer 30 from being unable to be discharged due to uneven distribution of the exhaust channel, thereby facilitating the improvement of the exhaust effect of the first adhesive layer 30.

[0056] In one embodiment, see Figure 1-Figure 5 As shown in any figure, in the first direction, the projections of the first air guide holes A1 and the solder ball structures 11 on the same projection plane do not overlap, that is, the first air guide holes A1 and the solder ball structures 11 on the circuit board 20 are staggered.

[0057] It is understandable that if the solder ball structure 11 is arranged corresponding to the first air guide hole A1, it is easy to cause the solder ball structure 11 arranged corresponding to the first air guide hole A1 to have a cold solder joint during the bonding process, thereby affecting the product yield. Specifically, the first air guide hole A1 and the solder ball structure 11 are arranged in a staggered manner, which can avoid the first air guide hole A1 on the circuit board 20 causing a cold solder joint when the solder ball structure 11 is electrically connected to the circuit board 20 (bonding).

[0058] In one embodiment, see Figure 1-Figure 5 As shown in any figure, in the first direction, the projections of the second air guide holes A2 and the solder ball structures 11 on the same projection plane do not overlap, that is, the second air guide holes A2 and the solder ball structures 11 on the metal sheet 40 are staggered.

[0059] It is understandable that if the solder ball structure 11 is arranged corresponding to the second air guide hole A2, it is easy to cause the support surface of the solder ball structure 11 arranged corresponding to the second air guide hole A2 to be uneven when the component is connected to the circuit board 20, thereby causing a cold solder joint during the connection, thereby affecting the product yield. Specifically, the second air guide hole A2 is arranged in a staggered manner with the solder ball structure 11, which can avoid a cold solder joint when the solder ball structure 11 is electrically connected to the circuit board 20.

[0060] In one embodiment, see Figure 1-Figure 5 As shown in any figure, in the first direction, the projections of the plurality of first air guide holes A1 and the plurality of solder ball structures 11 on the same projection plane do not overlap, and the projections of the plurality of second air guide holes A2 and the plurality of solder ball structures 11 on the same projection plane do not overlap. Specifically, the first air guide holes A1 on the circuit board 20 and the solder ball structures 11 are staggered, and the second air guide holes A2 on the metal sheet 40 and the solder ball structures 11 are staggered, so that cold solder joints can be avoided when the solder ball structures 11 and the circuit board 20 are electrically connected.

[0061] In order to ensure the reinforcing effect of the metal sheet 40 on the package 10 and the flatness during punching, in one embodiment, the size of the metal sheet 40 is greater than or equal to the size of the package 10, and in the first direction, the projection of the metal sheet 40 completely covers the projection of the package 10.

[0062] In one embodiment, see Figure 2The metal sheet 40 includes a first area 41 and a second area 42; in the first direction, the projection of the first area 41 overlaps with the projection of the package body 10 on the same projection plane; the second area 42 is the remaining area of ​​the metal sheet 40 excluding the first area 41; wherein, a plurality of second air guide holes A2 are located in the first area 41.

[0063] Furthermore, a plurality of third air guide holes A3 are provided on the second region 42. Specifically, the third air guide holes A3 can discharge the gas in the second adhesive layer 50 corresponding to the second region 42, thereby avoiding the generation of bubbles in the second adhesive layer 50 corresponding to the second region 42, thereby avoiding the delamination of the circuit board 20 and the metal sheet 40 due to the bubbles, thereby avoiding the problem of reduced device reliability.

[0064] In one embodiment, see Figure 3 or Figure 4 The circuit board 20 is a single-layer circuit board, and the circuit board 20 includes a substrate 21 and a circuit layer 22 located on a surface of the substrate 21, wherein the substrate 21 serves as a bearing plane for the circuit layer 22, and the circuit layer 22 is electrically connected to the package body 10 through a plurality of solder ball structures 11.

[0065] Among them, see Figure 3 The circuit layer 22 can be arranged close to the surface of the package body 10, or refer to Figure 4 The circuit layer 22 is disposed away from the surface of the package body 10 , which is not limited here.

[0066] Among them, see Figure 3 When the circuit layer 22 is disposed close to the surface of the package body 10 , a plurality of first air guide holes A1 penetrating the substrate 21 are specially provided on the substrate 21 to form an exhaust channel with a plurality of second air guide holes A2 on the metal sheet 40 .

[0067] Among them, see Figure 4 When the circuit layer 22 is arranged away from the surface of the package body 10, a plurality of conductive holes A4 penetrating the substrate 21 are opened in the area of ​​the substrate 21 corresponding to the first adhesive layer 30. The circuit layer 22 is electrically connected to the plurality of solder ball structures 11 through the plurality of conductive holes A4, and further electrically connected to the package body 10.

[0068] The conductive hole A4 can be arranged corresponding to the solder ball structure 11 or arranged in a staggered manner. When the conductive hole A4 is arranged corresponding to the solder ball structure 11, the circuit board 20 located on the surface of the substrate 21 away from the package body 10 is electrically connected to the solder ball structure 11 through the conductive hole A4, and then electrically connected to the package body 10. When the conductive hole A4 is arranged in a staggered manner with the solder ball structure 11, the surface of the substrate 21 close to the package body 10 also has a conductive pattern (not shown in the figure), and the circuit board 20 located on the surface of the substrate 21 away from the package body 10 is electrically connected to the conductive pattern through the conductive hole A4, and then electrically connected to the solder ball structure 11 through the conductive pattern, and then electrically connected to the package body 10.

[0069] In one embodiment, the conductive holes A4 are formed by coating a conductive material on the hole wall of the opening, so the conductive holes A4 are hollow structures. Therefore, several conductive holes A4 can also be used as first air holes A1, that is, several first air holes A1 include several conductive holes A4.

[0070] For further information, please see Figure 4 When the circuit layer 22 is disposed away from the surface of the package body 10, a plurality of through holes A5 penetrating the substrate 21 may be provided in the area of ​​the substrate 21 corresponding to the first adhesive layer 30, and the plurality of through holes A5 and the plurality of conductive holes A4 are spaced apart from each other.

[0071] Specifically, the plurality of through holes A5 and the plurality of conductive holes A4 are both used as exhaust channels, thereby improving the exhaust effect of the first adhesive layer 30. That is, the plurality of first air-conducting holes A1 also include the plurality of through holes A5.

[0072] In another embodiment, see Figure 5 The circuit board 20 is a multi-layer circuit board, and the circuit board 20 includes a stacked multi-layer substrate 21 and a circuit layer 22 located on at least a portion of the substrate 21. In this embodiment, the substrate 21 is used as an insulating layer in addition to being a bearing plane for the circuit layer 22. Specifically, compared with a single-layer circuit board, a multi-layer circuit board can be provided with a more complex circuit structure and richer circuit functions.

[0073] Among them, two adjacent circuit layers 22 are insulated by at least one substrate 21. For example, two adjacent circuit layers 22 are separated and insulated by one layer of substrate 21; or two adjacent circuit layers 22 are separated and insulated by two layers of substrate 21; or two adjacent circuit layers 22 are separated and insulated by four layers of substrate 21, etc., which are not limited here.

[0074] Among them, a plurality of conductive holes A4 penetrating the substrates 21 are opened in the regions corresponding to the package body 10 , and the circuit layers 22 located at different layers are electrically connected to the plurality of solder ball structures 11 through the conductive holes A4 on the substrates 21 , and further electrically connected to the package body 10 .

[0075] Among them, the several conductive holes A4 on each layer of the substrate 21 include several first conductive holes A41, and the several first conductive holes A41 on different layers are arranged one by one, so the several first conductive holes A41 can also be used as first air holes A1, that is, the several first air holes A1 include several first conductive holes A41.

[0076] Of course, the plurality of conductive holes A4 on each layer of the substrate 21 may also include a plurality of staggered second conductive holes A42 , and the plurality of second conductive holes A42 are used to connect circuit layers 22 of different layers, or to connect the circuit layer 22 with the solder ball structure 11 .

[0077] Furthermore, a plurality of through holes A5 penetrating the substrate 21 are provided in the region of each substrate 21 corresponding to the first adhesive layer 30, and the plurality of through holes A5 on each substrate 21 are spaced apart from the plurality of conductive holes A4; the through holes A5 on substrates 21 on different layers are arranged one by one.

[0078] Specifically, the plurality of through holes A5 and the plurality of first conductive holes A41 are both used as exhaust channels, thereby improving the exhaust effect of the first adhesive layer 30. That is, the plurality of first conductive holes A1 also include the plurality of through holes A5.

[0079] Specifically, in the packaging device 100 provided in the embodiment of the present application, a plurality of correspondingly arranged first air guide holes A1 and second air guide holes A2 are arranged corresponding to the first adhesive layer 30. The first air guide holes A1 and the second air guide holes A2 cooperate to form an exhaust channel that can discharge the gas in the first adhesive layer 30 and the second adhesive layer 50, thereby preventing the first adhesive layer 30 and the second adhesive layer 50 from easily generating bubbles, thereby avoiding problems such as a decrease in device reliability and causing a short circuit in the PCB board.

[0080] The above is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A packaging device, characterized in that: include: A package body, wherein the package body has a plurality of solder ball structures; A circuit board, electrically connected to the package body through a plurality of solder ball structures; A first bonding layer, located between the package body and the circuit board, and used for bonding the package body and the circuit board; A metal sheet, arranged on a side of the circuit board away from the package body and corresponding to the package body; Among them, a region of the circuit board corresponding to the first adhesive layer is provided with a plurality of first air guide holes penetrating the circuit board; and a plurality of second air guide holes are provided on the metal sheet corresponding to at least part of the first air guide holes.

2. The packaged device according to claim 1, characterized in that: A plurality of the first air guide holes and a plurality of the second air guide holes are evenly arranged.

3. The packaged device according to claim 1, characterized in that: In the first direction, projections of the plurality of first air guide holes and the plurality of solder ball structures on the same projection plane do not overlap; and / or In the first direction, projections of a plurality of the second air guide holes and a plurality of the solder ball structures on the same projection plane do not overlap; The first direction is the direction from the package body to the circuit board.

4. The packaged device according to claim 1, characterized in that: The size of the metal sheet is greater than or equal to the size of the package body; Furthermore, in the first direction, the projection of the metal sheet completely covers the projection of the package body.

5. The packaged device according to claim 4, characterized in that: The packaging device further comprises a second bonding layer, which is located between the circuit board and the metal sheet and is used to bond the metal sheet to the circuit board; The metal sheet includes a first area and a second area; in a first direction, a projection of the first area overlaps with a projection of the package body on the same projection plane; the second area is the remaining area of ​​the metal sheet excluding the first area; Among them, a plurality of the second air guide holes are located in the first area, and a plurality of third air guide holes are also opened in the second area.

6. The packaged device according to any one of claims 1 to 5, characterized in that: The circuit board includes a substrate and a circuit layer located on the surface of the substrate close to the package body, and the circuit layer is electrically connected to the package body through a plurality of solder ball structures; a plurality of the first air guide holes are opened on the substrate and penetrate the substrate.

7. The packaged device according to any one of claims 1 to 5, characterized in that: The circuit board comprises a substrate and a circuit layer located on a surface of the substrate away from the package body, a region of the substrate corresponding to the package body is provided with a plurality of conductive holes penetrating the substrate, and the circuit layer is electrically connected to a plurality of solder ball structures through the plurality of conductive holes, and further electrically connected to the package body; Among them, the plurality of first air guide holes include a plurality of the conductive holes.

8. The packaged device according to claim 7, characterized in that: A plurality of through holes penetrating the substrate are also provided in the area of ​​the substrate corresponding to the first bonding layer, and the plurality of through holes are spaced apart from the plurality of conductive holes; The plurality of first air guide holes further include a plurality of through holes.

9. The packaged device according to any one of claims 1 to 5, characterized in that: The circuit board includes a multi-layer substrate stacked in layers and a circuit layer located on at least part of the substrate, two adjacent circuit layers are insulated by at least one substrate, and a plurality of conductive holes penetrating the substrate are opened in regions of the substrate corresponding to the package body, and the circuit layers located at different layers are electrically connected to a plurality of solder ball structures through the conductive holes on the substrates, and further electrically connected to the package body; Among them, the plurality of conductive holes on each layer of the substrate include a plurality of first conductive holes, and the plurality of first conductive holes on different layers are arranged in one-to-one correspondence; and the plurality of first air conducting holes include a plurality of first conductive holes.

10. The packaged device according to claim 9, characterized in that: A plurality of through holes penetrating the substrate are also provided in the region of each layer of the substrate corresponding to the first bonding layer, and the plurality of through holes on each layer of the substrate are arranged at intervals from the plurality of conductive holes; the through holes on the substrates on different layers are arranged in one-to-one correspondence; The plurality of first air guide holes further include a plurality of through holes.

Images