Wafer manipulator

Abstract

The wafer manipulator comprises a base part and a limiting part, the limiting part is installed on the base part and used for keeping a wafer, the face, facing the wafer, of the base part is a base face, and a hydrophobic structure is arranged on the base face. The hydrophobic structure is arranged on the base surface of the wafer manipulator, so that the completeness of a liquid film on the back surface of a wafer in contact with the base surface in the transmission process is kept, and marks generated on the back surface of the wafer due to damage of the liquid film are improved and even eliminated.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a wafer robot. Background Art

[0002] In the wet process of wafers, for example, in the single-wafer cleaning process of wafers, wafer transfer equipment is used to transfer wafers between different process modules. Wafer manipulators are important components of wafer transfer equipment and are used to hold wafers during the transfer process.

[0003] like Figure 1 and Figure 2 As shown, Figure 1 Shown is a top view schematic diagram of a wafer robot holding a wafer in the prior art. Figure 2 Display as Figure 1 Schematic diagram of a wafer robot in FIG. The wafer robot includes a main body 10 and a limiting component 201, a limiting component 202, and a pushing component 30. In the process of holding the wafer 50, usually only the pushing component 30, the limiting component 201, and the limiting component 202 of the wafer robot are in contact with the periphery of the wafer 50, and the main body 10 of the wafer robot does not directly contact the wafer 50.

[0004] However, in some process flows, for protection, for example, when transferring from a scrubbing chamber to a cleaning chamber, the wafer surface is generally covered with a wet liquid film. Figure 3 and Figure 4 , Figure 3 The figure shows the relationship between the main body of the wafer robot and the liquid film on the back of the wafer in the prior art. Figure 4 The result diagram of the wafer back mark in the prior art derived by the measuring equipment is shown. Due to the effect of gravity, when the wafer robot is holding the wafer 50, the liquid film 40 on the back of the wafer 50 will inevitably contact the wafer robot body 10. Since both the wafer 50 and the wafer robot body 10 are hydrophilic, an attraction will be formed between the liquid film 40, causing the liquid film 40 to be stretched up and down in the vertical direction, resulting in the local thinning or even disappearance of the liquid film, such as the formation of holes in the area 60, thereby destroying its integrity. In the area covered by the wafer 50, especially at the edge of the wafer robot body 10, the liquid film 40 on the back of the wafer 50 will be damaged due to contact with the wafer robot body 10, and the damaged area of ​​the liquid film 40 will be exposed to the air and dried, thereby forming an imprint 70, which will affect the cleaning effect of the wafer 50 and reduce the product yield. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a wafer robot that can protect the integrity of the liquid film on the back of the wafer during the wafer transmission process, thereby improving or even eliminating the marks on the back of the wafer caused by the destruction of the liquid film.

[0006] To solve the above technical problems, the present invention provides a wafer robot, comprising: a base and a limiting part; the limiting part is installed on the base for holding the wafer; the surface of the base facing the wafer is the base surface, and a hydrophobic structure is arranged on the base surface.

[0007] Furthermore, the hydrophobic structure covers the entire area of ​​the base surface.

[0008] Furthermore, the hydrophobic structure covers a first area of ​​the base surface, and the first area includes an area where the limiting portion is not installed.

[0009] The hydrophobic structure covers a second area of ​​the base surface, and the second area includes an area covered by a projection of the wafer on the base surface.

[0010] The hydrophobic structure covers a third area of ​​the base surface, and the third area includes an area where the limiting portion is not installed in the area covered by the projection of the wafer on the base surface.

[0011] Furthermore, the surface of the limiting portion is provided with the hydrophobic structure.

[0012] Furthermore, the hydrophobic structure is a hydrophobic coating.

[0013] Furthermore, the hydrophobic structure is a hydrophobic material that is separable from the base surface. Preferably, the hydrophobic structure is a hydrophobic tape.

[0014] Furthermore, the hydrophobic structure is polytetrafluoroethylene or perfluoroalkyl compound.

[0015] As described above, the present invention provides a wafer robot having the following beneficial effects:

[0016] 1) By setting a hydrophobic structure on the base surface of the wafer manipulator, the integrity of the liquid film on the back of the wafer in contact with the base surface of the wafer manipulator is maintained during the transmission process, thereby improving or even eliminating the mark on the back of the wafer caused by the destruction of the liquid film;

[0017] 2) A hydrophobic structure is set on the wafer robot, which has low modification cost and a wide range of application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a top view schematic diagram of a wafer robot holding a wafer in the prior art;

[0019] Figure 2 Display as Figure 1 A three-dimensional schematic diagram of a wafer robot in FIG.

[0020] Figure 3Shown is a diagram showing the relationship between the main body of the wafer robot and the liquid film on the back of the wafer in the prior art;

[0021] Figure 4 A result graph showing the wafer backside imprint condition in the prior art derived for the metrology equipment;

[0022] Figure 5 Shown is a perspective schematic diagram of a wafer robot holding a wafer according to an exemplary embodiment of the present invention;

[0023] Figure 6a and Figure 6b Shown is a schematic side view of a wafer robot limiting portion according to an exemplary embodiment of the present invention;

[0024] Figure 7 A diagram showing the relationship between the base surface, the hydrophobic structure and the liquid film on the back side of the wafer robot according to an exemplary embodiment of the present invention; and

[0025] Figure 8 A graph showing the results derived for the metrology tool for wafer backside imprinting in accordance with an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0028] See also Figure 5 and Figure 7 , Figure 5 It is a perspective schematic diagram showing a wafer robot holding a wafer according to an exemplary embodiment of the present invention, Figure 7 A diagram showing the relationship between the base surface, the hydrophobic structure and the liquid film on the back of the wafer of a wafer robot according to an exemplary embodiment of the present invention is shown. The wafer robot includes a base 1 and a limiter. The base 1 constitutes the main body of the wafer robot, and the limiter is installed on the base 1 for holding the wafer 5. The surface of the base 1 facing the wafer 5 is the base surface 111, and the hydrophobic structure 11 is provided on the base surface 111.

[0029] For the convenience of description, Figure 5 , Figure 6a and Figure 6b Specifically, in this embodiment, the base 1 of the wafer robot is generally a U-shaped plate structure with an opening forward, and the limiting portion includes two limiting portions 21 near the rear end of the base 1 and two limiting portions 22 located at the front end of the base 1. Figure 6a and Figure 6b , Figure 6a 1 is a schematic side view of a wafer robot limiting portion 21 according to an exemplary embodiment of the present invention. Figure 6b Shown is a schematic side view of a wafer robot limiting portion 22 according to an exemplary embodiment of the present invention. The limiting portion 21 includes a bearing surface 211 and a retaining surface 212, and the limiting portion 22 includes a bearing surface 221 and a retaining surface 222. Among them, the bearing surface 211 and the bearing surface 221 are inclined surfaces inclined in the horizontal direction and have a certain slope. The retaining surface 212 extends upward from the rear end of the bearing surface 211, and the retaining surface 222 extends upward from the front end of the bearing surface 221. In this embodiment, the wafer robot further includes a pushing component 3.

[0030] When the wafer 5 is placed on the wafer manipulator, the bearing surface 211 of the limiting part 21 and the bearing surface 221 of the limiting part 22 contact the periphery of the wafer 5 to carry the wafer. Then, the pushing component 3 is driven by a driving component to gradually move forward to approach and push the wafer 5. The front end of the pushing component 3 further includes a flange 31 protruding forward. The flange 31 abuts against the rear periphery of the wafer 5 and pushes the wafer 5, so that the front periphery of the wafer 5 abuts against the holding surface 222 of the limiting part 22. At this time, the rear periphery of the wafer 5 abuts against the flange 31 of the pushing component 3, and the front periphery of the wafer 5 abuts against the holding surface 222 of the limiting part 22, so that the wafer manipulator can clamp the wafer 5.

[0031] like Figure 7 As shown, a hydrophobic structure 11 is provided on the base surface 111 of the wafer robot, and the liquid film 4 on the back of the wafer 5 does not directly contact the base surface 111 of the wafer robot, but directly contacts the hydrophobic structure 11. The liquid film 4 will not be damaged by the base surface 111 of the wafer robot, so the liquid film 4 can maintain integrity. Figure 8 , Figure 8 The result diagram showing the wafer backside imprint condition according to the exemplary embodiment of the present invention derived by the measurement equipment is shown. Since the liquid film 4 can remain intact, no imprint is formed. Figure 4 A mark such as the mark 70 shown.

[0032] It should be understood that the present invention does not specifically limit the specific structure and shape of the wafer robot and the specific structure of the limiting portion, and in other embodiments, the pushing component 3 may not be provided.

[0033] Preferably, the hydrophobic structure 11 covers a first area of ​​the base surface 111, and the first area includes an area where the limiting portion is not installed. Since the liquid film 4 on the back of the wafer 5 does not contact the wafer robot base surface 111 in the area where the limiting portion is installed on the base surface 111, the hydrophobic structure 11 only covers the area where the limiting portion is not installed in this embodiment. This embodiment can reduce the use of hydrophobic materials.

[0034] Preferably, in this embodiment, the hydrophobic structure 11 is a hydrophobic coating applied to the wafer robot base surface 111. It should be understood that the hydrophobic coating can be a known hydrophobic material such as polytetrafluoroethylene or perfluoroalkyl compounds, and the application method includes but is not limited to known coating methods such as spraying, which will not be described in detail here. Preferably, the thickness of the hydrophobic coating can be

[0035] In other embodiments, the hydrophobic structure 11 may also be a hydrophobic material, such as a hydrophobic tape, that is detachable from the base surface 111. By pasting the hydrophobic tape on the base surface 111 of the wafer robot, the cost is low and the processing is convenient, and maintenance and replacement are facilitated.

[0036] In some possible embodiments, for the convenience of processing, the hydrophobic structure 11 may also cover the entire area of ​​the wafer robot base surface 111 .

[0037] In some possible embodiments, the hydrophobic structure 11 covers a second area of ​​the base surface 111, and the second area includes an area covered by the projection of the wafer 5 on the base surface 111. Figure 5 The second area includes the base area under the projection of the wafer 5, and also includes the base area where some of the limiting parts under the projection of the wafer 5 are located, that is, part or all of the area below the carrying surface 211 and the carrying surface 221. Since the projection coverage of the wafer 5 on the base surface 111 of the wafer robot is limited during the process of holding the wafer 5, for example, Figure 5 In the embodiment, the projection of the wafer 5 on the wafer robot base surface 111 does not cover the area behind the self-pushing component 3, and these areas do not contact the back liquid film 4 of the wafer 5, so there is no need to set the hydrophobic structure 11. The second area is smaller than the first area, which can further reduce the use of hydrophobic materials.

[0038] In some possible embodiments, the hydrophobic structure 11 covers a third area of ​​the base surface 111, and the third area includes an area where the limiting portion is not installed in the area covered by the projection of the wafer 5 on the base surface 111. The third area is smaller than the second area, and part or all of the area below the bearing surface 211 and the bearing surface 221 is removed in the second area, which can further reduce the use of hydrophobic materials.

[0039] In some possible embodiments, the surface of the limiting part is provided with a hydrophobic structure 11, for example, a hydrophobic coating is sprayed on the surface of the limiting part, especially on the surface of the limiting part facing the wafer 5. On the one hand, considering the convenience of processing, for example, when spraying the hydrophobic coating, it can be sprayed directly on the base surface 111 of the wafer manipulator on which the limiting part is installed, so that the surface of the limiting part will also be sprayed with a hydrophobic coating; on the other hand, the wafer manipulator is in motion when transmitting the wafer 5 held, and there are some uncertainties in this transmission process. At the parts where the wafer manipulator may contact the back liquid film 4, such as the bearing surface 211 and the bearing surface 221 of the limiting part, there is a probability that the liquid film 4 is destroyed. A hydrophobic structure 11 is provided on the surface of the limiting part, especially on the surface of the limiting part facing the wafer 5, so as to avoid the potential risk of the limiting part destroying the integrity of the liquid film 4 on the back of the wafer 5.

[0040] In this embodiment, a hydrophobic coating is sprayed on the base surface 111 of the wafer manipulator to maintain the integrity of the liquid film 4 on the back side of the wafer 5 in contact with the base surface 111 of the wafer manipulator during the transmission process, thereby improving or even eliminating the mark on the back side of the wafer 5 caused by the destruction of the liquid film 4; a hydrophobic structure 11 is set on the wafer manipulator, the modification cost is low, the modification has a wide range of application, and has excellent technical effects.

[0041] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer robot, characterized in that: include: A base and a limiter; The limiting part is installed on the base and is used to hold the wafer; The surface of the base facing the wafer is a base surface, and a hydrophobic structure is arranged on the base surface.

2. The wafer robot according to claim 1, characterized in that: The hydrophobic structure covers the entire area of ​​the base surface.

3. The wafer robot according to claim 1, characterized in that: The hydrophobic structure covers a first area of ​​the base surface, and the first area includes an area where the limiting portion is not installed.

4. The wafer robot according to claim 1, characterized in that: The hydrophobic structure covers a second area of ​​the base surface, and the second area includes an area covered by a projection of the wafer on the base surface.

5. The wafer robot according to claim 1, characterized in that The hydrophobic structure covers a third area of ​​the base surface, and the third area includes an area where the limiting portion is not installed in the area covered by the projection of the wafer on the base surface.

6. The wafer robot according to any one of claims 1 to 5, characterized in that: The surface of the limiting portion is provided with the hydrophobic structure.

7. The wafer robot according to any one of claims 1 to 5, characterized in that: The hydrophobic structure is a hydrophobic coating.

8. The wafer robot according to any one of claims 1 to 5, characterized in that: The hydrophobic structure is a hydrophobic substance that can be separated from the base surface.

9. The wafer robot according to claim 8, characterized in that: The hydrophobic structure is a hydrophobic tape.

10. The wafer robot according to any one of claims 1 to 5, characterized in that: The hydrophobic structure includes polytetrafluoroethylene or perfluoroalkyl compounds.

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