Chamfering equipment and method

Abstract

The invention relates to the field of wafer processing, in particular to chamfering equipment and a chamfering method, and the chamfering equipment comprises a chamfering mechanism, the chamfering mechanism comprises a first grinding wheel, a second grinding wheel, a third grinding wheel and a fourth grinding wheel, the first grinding wheel is provided with a transversely arranged first rotating shaft, and the first grinding wheel can rotate around the first rotating shaft; the first grinding wheel is used for grinding the edge of the wafer; the carrier mechanism is located on one side of the chamfering mechanism, and the carrier mechanism comprises a base; the rotary table is used for bearing the wafer and driving the wafer to rotate, so that the shaft side of the wafer is in contact with the first grinding wheel to realize chamfering; and the blocking mechanism comprises a nozzle, the nozzle is located between the rotary table and the first grinding wheel, the nozzle is connected to the base, and the nozzle is used for facing the lower surface of the wafer to form an air screen for isolating the rotary table from the first grinding wheel. The technical problem that the production efficiency and the production quality of the chamfering equipment are low is solved, and the technical effect of improving the production efficiency and the production quality of the chamfering equipment is achieved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a chamfering device and method. Background Art

[0002] Wafer chamfering equipment is a key equipment in semiconductor manufacturing, which is used to accurately chamfer the edge of the wafer. The chamfering process is designed to remove burrs and damage on the edge of the wafer to improve the mechanical strength of the wafer and the yield rate of subsequent processing.

[0003] In the prior art, during the chamfering process of conventional wafer chamfering equipment, the wafer is placed on a turntable, and the turntable drives the wafer to rotate, so that the entire circumference of the wafer and the grinding wheel are in contact and grinding, thereby completing the chamfering of the entire circumference of the wafer; however, during the contact and grinding process between the wafer and the grinding wheel, a large amount of fine debris will be generated. Due to the high-speed rotation and grinding force, these debris are often randomly splashed onto the surface of the turntable or the tiny gap between the turntable and the wafer; the attachment of debris not only increases the difficulty of cleaning the turntable, but more importantly, the debris embedded in the gap between the wafer and the turntable can easily scratch the lower surface of the wafer during subsequent processing, causing wafer damage; reducing the stability and service life of the equipment, thereby increasing maintenance costs and downtime, and greatly reducing the production efficiency and production quality of the chamfering equipment.

[0004] Therefore, the technical problem of the prior art is that the production efficiency of the chamfering equipment is low. Summary of the invention

[0005] The present application provides a chamfering device and method, which solves the technical problems of low production efficiency and production quality of the chamfering device, and achieves the technical effect of improving the production efficiency and production quality of the chamfering device.

[0006] On the one hand, the present application provides a chamfering device, which adopts the following technical solution: A chamfering device comprises: a chamfering mechanism, the chamfering mechanism comprising: a first grinding wheel, the first grinding wheel having a first rotating shaft arranged transversely, the first grinding wheel being able to rotate around the first rotating shaft; the first grinding wheel being used to grind the edge of a wafer; a carrier mechanism, the carrier mechanism being located at one side of the chamfering mechanism, the carrier mechanism comprising: a base; a turntable, the turntable being rotatably connected to the base, the turntable having a vertically arranged axial direction and being able to rotate around the vertically arranged axial direction, the turntable having an adsorption function, the turntable being used to carry a wafer and drive the wafer to rotate so that the axial side of the wafer contacts the first grinding wheel to achieve chamfering; wherein a first contact area is formed when the wafer contacts the first grinding wheel, the chamfering mechanism being able to move relative to the carrier mechanism to adjust the formation position of the first contact area at the edge of the wafer; and a barrier mechanism, the barrier mechanism comprising: a nozzle, the nozzle being located between the turntable and the first grinding wheel, the nozzle being connected to the base, the nozzle being used to face the lower surface of the wafer to form an air screen that isolates the turntable and the first grinding wheel.

[0007] In this way, a barrier mechanism is provided between the first grinding wheel and the turntable, and the barrier mechanism is used to spray air toward the lower surface of the wafer, so that an air screen for isolating debris is formed between the turntable and the first grinding wheel. Due to the formation of the air screen, debris formed by grinding the wafer with the first grinding wheel is prevented from splashing onto the lower surface of the wafer and between the wafer and the turntable, thereby protecting the wafer from contamination and damage.

[0008] Preferably, the jetting direction of the nozzle is inclined toward one side of the first grinding wheel so that the air screen is inclined upward.

[0009] With this arrangement, the spray direction of the nozzle is inclined toward one side of the first grinding wheel, forming an upwardly inclined air screen, which not only enhances the isolation effect of the air screen, but also better guides the discharge of debris, reduces the retention of debris on the lower surface of the wafer, and further protects the wafer from damage.

[0010] Preferably, the chamfering mechanism further comprises: a second grinding wheel, wherein the second grinding wheel has a second rotating shaft arranged transversely, and the second grinding wheel can rotate around the second rotating shaft; the second grinding wheel is located below the first grinding wheel, a working space is formed between the second grinding wheel and the first grinding wheel, and the wafer is located in the working space and is in contact with the first grinding wheel and the second grinding wheel for grinding to chamfer; the wafer is in contact with the second grinding wheel to form a second contact area, and the chamfering mechanism can move relative to the carrier mechanism to adjust the formation position of the second contact area at the edge of the wafer; Wherein, the first grinding wheel and the second grinding wheel are not in the same vertical space.

[0011] In this arrangement, a second grinding wheel is added on the basis of the first grinding wheel to form two upper and lower grinding positions, which improves the chamfering efficiency and quality. At the same time, the second grinding wheel and the first grinding wheel are not in the same vertical space, and can grind the edge of the wafer at all angles, avoiding mutual interference and ensuring the stable operation of the equipment. Among them, it can be understood that the first grinding wheel and the second grinding wheel are centrally symmetrical compared to the position of the wafer, so that the force of the first grinding wheel on the wafer and the force of the second grinding wheel on the wafer offset each other, which is beneficial to uniform force during wafer grinding and improves the quality of wafer chamfering.

[0012] Preferably, a plurality of the nozzles are provided, and the plurality of the nozzles are arranged in a straight line, a projection length of the plurality of the nozzles on the wafer is L1, an arrangement length of the plurality of the nozzles is L2, and L1<L2.

[0013] With such an arrangement, multiple nozzles are arranged in a straight line, and the arrangement length L2 is greater than the projection length L1 of the nozzle on the wafer, so that the nozzles can cover a wider area of ​​the lower surface of the wafer, thereby more effectively isolating the debris generated during the grinding process of the lower surface of the wafer.

[0014] Preferably, two ends of the arrangement of the nozzles are respectively located outside the projection of the nozzles on the wafer.

[0015] In this arrangement, the nozzle projected outside the wafer is used to blow air upward. Since the arrangement length of the nozzle exceeds the outside of the wafer, the nozzle passes upward over the edge of the wafer. Due to the Bernoulli effect, an airflow is formed outward above the wafer, which can drive the debris above the wafer to move and discharge it. Furthermore, under the rotation of the wafer, the wafer drives the debris to move, further improving the debris removal effect, that is, the debris can move upward with the nozzle and will not be retained on the wafer to prevent damage to the wafer.

[0016] Preferably, the projection of the nozzle on the edge of the wafer is defined to have a first position and a second position, and the rotation direction of the wafer is from the first position to the second position; A collecting mechanism is disposed above the second position, and is used to collect debris located on the upper surface of the wafer.

[0017] With this arrangement, the airflow formed by the Bernoulli principle drives the debris on the upper surface of the wafer. At the same time, the rotation of the wafer itself further drives the debris on the upper surface of the wafer to move, move upward with the airflow formed by the nozzle, and are collected by the collection mechanism, thereby achieving efficient processing of the debris.

[0018] Preferably, the nozzle projected outside the wafer forms an air flow channel upward, and the nozzle supplies air into the air flow channel to drive the debris; the collection mechanism includes: The electrostatic component is arranged in the airflow channel and has static electricity to absorb debris in the airflow.

[0019] With such an arrangement, flying debris can be captured through the electrostatic effect, thereby improving the accuracy of debris capture, and the electrostatic structure is simple and low in cost.

[0020] Preferably, the distance between the nozzle and the lower surface of the wafer is between 0.5 cm and 1.0 cm.

[0021] With this arrangement, the distance between the nozzle and the wafer is controlled within an effective range, which is conducive to the nozzle acting accurately and directionally on the lower surface of the wafer, preventing air flow turbulence, and is conducive to improving the lower surface isolation effect and debris removal effect.

[0022] Preferably, the chamfering mechanism also includes a driving assembly, which is provided with two groups, and the two groups of driving assemblies are respectively connected to and act on the first grinding wheel and the second grinding wheel, so that the first grinding wheel and the second grinding wheel can move in a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0023] In this way, the drive assembly enables the first grinding wheel and the second grinding wheel to move in three mutually perpendicular directions, thereby achieving precise adjustment of the chamfer position of the wafer edge. This design improves the chamfering accuracy and flexibility, and meets the chamfering requirements of wafers of different sizes and shapes.

[0024] Preferably, the nozzle is movably connected to the base, and the barrier assembly further comprises: An elastic member is connected between the nozzle and the base. The elastic member can drive the nozzle to float up or sink through elastic potential energy. A force-bearing area is formed between the elastic member and the base. A pressure sensor is provided on the force-bearing area. The pressure sensor is used to obtain the force condition of the elastic member.

[0025] This setting allows the nozzle to float up and down according to actual conditions to adapt to wafers at different heights or positions; at the same time, the setting of the pressure sensor can monitor the force conditions of the elastic parts in real time, providing strong support for the precise adjustment of the grinding wheel position.

[0026] Preferably, the base has a bracket for supporting the nozzle; the elastic member is an elastic rod, the first end of the elastic rod is connected to the nozzle, the second end of the elastic rod is connected to the bracket, the force area is formed between the second end of the elastic rod and the bracket, and the pressure sensor is arranged between the elastic rod and the bracket.

[0027] Such arrangement, by specifically describing the connection method of the elastic member as an elastic rod, a bracket and a pressure sensor, realizes precise control and monitoring of the nozzle floating state, improves the stability and reliability of the equipment, and ensures the stable improvement of the chamfering quality.

[0028] Preferably, the base has a nozzle-guiding sleeve; the elastic member is a spring, the spring is arranged in the sleeve, the first end of the spring is connected to the nozzle, the second end of the spring is connected to the base, the force area is formed between the second end of the spring and the base, and the pressure sensor is arranged between the spring and the base.

[0029] With this arrangement, nozzle floating and force monitoring are achieved through a combination of a spring and a sleeve. This design can also achieve real-time monitoring of the nozzle's up and down floating and force conditions, providing strong support for precise adjustment of the grinding wheel position. At the same time, the combination of a spring and a sleeve also has the advantages of simple structure and easy maintenance.

[0030] It can be understood that when the force on the pressure sensor increases, it indicates that the nozzle is pressed down, and the reason for the nozzle being pressed down is that the position of the grinding mechanism (the first grinding wheel and the second grinding wheel) is lower than the wafer, and the first grinding wheel presses down the wafer, resulting in a smaller distance between the wafer and the nozzle. In this way, the first grinding wheel located on the upper part of the wafer and the wafer are over-ground; the second grinding wheel located on the lower part of the wafer and the wafer are under-ground; when the force on the pressure sensor decreases, it indicates that the nozzle floats, and the reason for the nozzle floating is that the position of the grinding mechanism (the first grinding wheel and the second grinding wheel) is higher than the wafer, and the second grinding wheel pushes the wafer, resulting in a larger distance between the wafer and the nozzle. In this way, the first grinding wheel located on the upper part of the wafer and the wafer are under-ground; the second grinding wheel located on the lower part of the wafer and the wafer are over-ground; the force on the pressure sensor is obtained, and the wafer is analyzed to be higher or lower, and the position of the first grinding wheel and the second grinding wheel can be adjusted accordingly to match the position of the wafer with the first grinding wheel and the second grinding wheel to prevent insufficient or excessive grinding.

[0031] On the other hand, the present application provides a chamfering method, which adopts the following technical solution: A chamfering method, applied to the chamfering equipment, comprises: making the nozzle spray air toward the lower surface of the wafer, forming an air screen between the turntable and the first grinding wheel and / or the second grinding wheel to prevent grinding debris from flying into between the lower surface of the wafer and the turntable.

[0032] With such arrangement, the chamfering method forms an air screen by spraying air toward the lower surface of the wafer through the nozzle, thereby effectively isolating the grinding debris from contaminating the lower surface of the wafer and the turntable.

[0033] Preferably, the nozzle is movably connected to the base, and the barrier assembly further comprises: an elastic member, the elastic member is connected between the nozzle and the base, the elastic member can drive the nozzle to float up or sink down through elastic potential energy, a force-bearing area is formed between the elastic member and the base, a pressure sensor is arranged on the force-bearing area, and the pressure sensor is used to obtain the force condition of the elastic member; The first grinding wheel and the second grinding wheel are driven to float or sink based on the force applied to the elastic member so that the upper and lower forces on the edge of the wafer are balanced.

[0034] This setting can monitor and precisely adjust the nozzle floating state and force in real time. It ensures that the wafer edge is balanced in force up and down during the chamfering process, further improving the chamfering accuracy and stability. At the same time, it also helps to detect and handle equipment failures in a timely manner, improving the reliability and service life of the equipment.

[0035] It can be understood that when the force on the pressure sensor increases, it indicates that the nozzle is pressed down, and the reason for the nozzle being pressed down is that the position of the grinding mechanism (the first grinding wheel and the second grinding wheel) is lower than the wafer, and the first grinding wheel presses down the wafer, resulting in a smaller distance between the wafer and the nozzle. In this way, the first grinding wheel located on the upper part of the wafer and the wafer are over-ground; the second grinding wheel located on the lower part of the wafer and the wafer are under-ground; when the force on the pressure sensor decreases, it indicates that the nozzle floats, and the reason for the nozzle floating is that the position of the grinding mechanism (the first grinding wheel and the second grinding wheel) is higher than the wafer, and the second grinding wheel pushes the wafer, resulting in a larger distance between the wafer and the nozzle. In this way, the first grinding wheel located on the upper part of the wafer and the wafer are under-ground; the second grinding wheel located on the lower part of the wafer and the wafer are over-ground; the force on the pressure sensor is obtained, and the wafer is analyzed to be higher or lower, and the position of the first grinding wheel and the second grinding wheel can be adjusted accordingly to match the position of the wafer with the first grinding wheel and the second grinding wheel to prevent insufficient or excessive grinding.

[0036] In summary, the present application includes at least one of the following beneficial technical effects: The chamfering equipment proposed in the present application is provided with a barrier mechanism between the first grinding wheel and the turntable. The barrier mechanism is used to blow air toward the lower surface of the wafer so as to form an air screen for isolating debris between the turntable and the first grinding wheel. Due to the formation of the air screen, debris formed by grinding the wafer with the first grinding wheel is prevented from splashing onto the lower surface of the wafer and between the wafer and the turntable, thereby protecting the wafer from contamination and damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the first type of the spacing mechanism in the chamfering device described in the present application; Figure 2 This is a first schematic diagram of the chamfering process described in this application; Figure 3 is a second schematic diagram of the chamfering process described in the present application; Figure 4 is a schematic diagram of a grinding wheel of the chamfering device described in the present application; Figure 5 It is a second schematic diagram of the barrier mechanism in the chamfering device described in the present application; Figure 6 is a schematic diagram of a nozzle of the chamfering device described in the present application; Figure 7 is a schematic diagram of the operation of the nozzle of the chamfering device described in the present application; Figure 8 is a three-dimensional diagram of the nozzle operation of the chamfering device described in the present application; Fig. 9 This is a first schematic diagram of nozzle feedback of the chamfering device described in this application; Fig.10 This is a second schematic diagram of the nozzle feedback of the chamfering device described in this application.

[0038] Explanation of the reference numerals: 100, chamfering mechanism; 110, first grinding wheel; 120, second grinding wheel; 200, carrier mechanism; 210, base; 220, turntable; 230, bracket; 240, sleeve; 250, force-bearing area; 300, barrier mechanism; 310, nozzle; 311, air screen; 320, elastic member; 321, elastic rod; 322, spring; 330, pressure sensor; 340, first position; 350, second position; 400, wafer; 410, first contact area; 420, second contact area; 500, debris; 600, collecting mechanism. DETAILED DESCRIPTION

[0039] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0040] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] The embodiments of the present application provide a chamfering device and a chamfering method, which solve the technical problems of low production efficiency and production quality of the chamfering device, and achieve the technical effect of improving the production efficiency and production quality of the chamfering device.

[0042] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0043] Wafer 400 chamfering equipment plays a vital role in the field of semiconductor manufacturing. Its working principle is to fix the wafer 400 on the rotating turntable 220 and use a grinding wheel to perform fine chamfering on the edge of the wafer 400. This process is not only for beautifying the appearance of the wafer 400, but more importantly, it plays a vital role in improving the edge quality of the wafer 400, reducing chip damage caused by mechanical stress, optimizing the contact area during the packaging process, and ensuring the stability and reliability of the wafer 400.

[0044] Traditional wafer 400 chamfering equipment uses a turntable 220 to rotate and drive the wafer 400, so that the entire circumference of the wafer 400 is in contact with the grinding wheel for grinding, thereby achieving chamfering. However, this process faces a series of challenges in actual operation, especially the management of debris 500. During the contact grinding process between the wafer 400 and the grinding wheel, a large amount of fine debris 500 will be generated. These debris 500 will randomly splash and adhere to the surface of the turntable 220, and even penetrate into the tiny gap between the turntable 220 and the wafer 400. The random sputtering and adhesion of the debris 500 not only increases the difficulty of subsequent cleaning of the turntable 220, but more importantly, the debris 500 embedded in the gap between the wafer 400 and the turntable 220 can easily scratch the lower surface of the wafer 400 during subsequent processing, causing damage to the wafer 400, thereby affecting the yield and quality of the chip.

[0045] In addition, the adhesion of debris 500 may also have a negative impact on the equipment stability of the chamfering equipment; long-term accumulation of debris 500 may cause wear and contamination of equipment components, reducing the overall performance and life of the equipment; this not only increases the maintenance cost of the equipment, but may also lead to frequent downtime, thereby greatly reducing the production efficiency of the chamfering equipment.

[0046] The prior art wafer 400 chamfering equipment has obvious deficiencies in the management of debris 500 , and it is urgent to develop a new chamfering equipment that can effectively solve the sputtering and adhesion problems of the debris 500 , so as to improve the processing quality and production efficiency of the wafer 400 chamfering.

[0047] Furthermore, during the chamfering process of wafer 400, there is a problem that cannot be ignored: the equipment lacks the ability to obtain the status and position information of wafer 400 in real time; the relative position accuracy between wafer 400 and the grinding wheel is extremely high, and any slight deviation may lead to serious consequences; but the reality is that this high-precision requirement is often difficult to guarantee due to various factors such as mechanical equipment installation errors, visual judgment errors, and mechanical jitter; however, these problems can often only be discovered after the entire chamfering process is completed, through inspection of the processed wafer 400 or other subsequent detection methods.

[0048] When the relative position between the wafer 400 and the grinding wheel is misaligned, a series of problems will follow; for example, when the position of the grinding wheel is slightly higher or lower than the preset correct position compared to the wafer 400, the chamfering operation will continue to be performed due to the limitation of system accuracy; it can be understood that the reason for the error in the relative position between the wafer 400 and the grinding wheel is: insufficient driving accuracy of the grinding wheel, etc., resulting in an incorrect position of the grinding wheel (the wafer 400 is adsorbed and fixed by the turntable 220, and the position of the wafer 400 generally remains unchanged). When the upper grinding wheel (the first grinding wheel 110) and the lower grinding wheel (the second grinding wheel 120) are lower than the position of the wafer 400, the force between the grinding wheel (the first grinding wheel 110) above the wafer 400 and the wafer 400 is relatively large. Since the wafer 400 has a certain toughness, the grinding wheel (the first grinding wheel 110) above the wafer 400 When the upper grinding wheel (first grinding wheel 110) and the lower grinding wheel (second grinding wheel 120) are positioned above the wafer 400, the force between the grinding wheel (second grinding wheel 120) below the wafer 400 and the wafer 400 is relatively large. Since the wafer 400 has a certain toughness, the lower grinding wheel (second grinding wheel 120) pushes the edge of the wafer 400 up to a certain extent. At this time, the lower edge of the wafer 400 is over-ground and the upper edge of the wafer 400 is under-ground. Such uneven grinding will not only affect the appearance quality of the wafer 400, but more importantly, it will cause the performance of the wafer 400 to deteriorate, seriously affecting the quality and yield rate of the product.

[0049] The present application proposes a chamfering device, which can improve production efficiency and production quality; it is intended to efficiently and accurately chamfer the edge of a wafer 400 while preventing grinding debris 500 from contaminating the wafer 400 and the device; and by matching the position between the wafer 400 and the two grinding wheels, insufficient or excessive grinding is prevented.

[0050] like Figure 1 As shown, the chamfering equipment of the present application includes a chamfering mechanism 100, a carrier mechanism 200 and a barrier mechanism 300. The chamfering mechanism 100 is used to contact with the wafer 400 to complete the chamfering grinding of the wafer 400; the carrier mechanism 200 is used to carry the wafer 400; the barrier mechanism 300 is arranged between the chamfering mechanism 100 and the carrier mechanism 200, and is used to isolate the chamfering mechanism 100 and the carrier mechanism 200 (specifically, the gap between the turntable 220 and the wafer 400) to prevent debris 500 from splashing.

[0051] The chamfering mechanism 100 is used to contact the wafer 400 to complete the chamfering grinding of the wafer 400. Figure 1-3As shown, the chamfering mechanism 100 is the core structure for grinding the wafer 400. The chamfering mechanism 100 includes a first grinding wheel 110, a second grinding wheel 120 and a driving assembly. The first grinding wheel 110 has a first rotating shaft arranged transversely, and can rotate around the first rotating shaft, and is used to grind the edge of the wafer 400. The second grinding wheel 120 also has a second rotating shaft arranged transversely, and can rotate around the second rotating shaft, and is located below the first grinding wheel 110. A working space is formed between the first grinding wheel 110 and the second grinding wheel 120, and the wafer 400 is located in the working space and is in contact with the two grinding wheels for grinding to be chamfered. Figure 4 As shown, the first grinding wheel 110 and the second grinding wheel 120 are not in the same vertical space, avoiding mutual interference and ensuring the stable operation of the equipment. The first grinding wheel 110 is responsible for grinding the edge of the upper surface of the wafer 400. On the wafer 400, the wafer 400 and the first grinding wheel 110 are in contact to form a first contact area 410, and the wafer 400 located on the first contact area 410 is subjected to grinding; the second grinding wheel 120 is responsible for grinding the edge of the lower surface of the wafer 400. On the wafer 400, the wafer 400 and the second grinding wheel 120 are in contact to form a second contact area 420, and the wafer 400 located on the second contact area 420 is subjected to grinding.

[0052] In other embodiments, the chamfering device may be provided with only one grinding wheel, namely, the first grinding wheel 110. By moving the first grinding wheel 110, the edge of the wafer 400 may also be ground and chamfered, which will not be described again here.

[0053] In order to achieve precise adjustment of the chamfer position of the edge of the wafer 400, the chamfering mechanism 100 further includes a driving assembly (the driving assembly is not shown); the driving assembly is provided with two groups, which are respectively connected to and act on the first grinding wheel 110 and the second grinding wheel 120, such as Figure 2 , 3 As shown, the two grinding wheels can move in the first direction, the second direction and the third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other; the chamfering accuracy and flexibility are improved; generally, the first direction and the second direction are respectively the X direction and the Y direction on the horizontal plane, and the third direction is the Z direction in the vertical direction. In this way, the positions of the first contact area 410 and the second contact area 420 on the wafer 400 can be adjusted by the driving component. In other words, the edge grinding position of the wafer 400 can be adjusted to complete the grinding of various angle positions of the upper edge and the lower edge of the wafer 400.

[0054] It is worth noting that the self-rotation drive of the first grinding wheel 110 and the second grinding wheel 120 can be realized by means of a motor, and the motor is connected and installed on the driving assembly to drive the first grinding wheel 110 (the second grinding wheel 120) to rotate. Under the drive of the driving assembly, the motor moves with the first grinding wheel 110 (the second grinding wheel 120). Furthermore, the first grinding wheel 110 and the second grinding wheel 120 are centrally symmetrical relative to the position of the wafer 400. It should be noted that the first grinding wheel 110 and the second grinding wheel 120 need to be symmetrically controlled to move, so that the force of the first grinding wheel 110 on the wafer 400 and the force of the second grinding wheel 120 on the wafer 400 offset each other, which is conducive to uniform force on the wafer 400 during grinding and improves the quality of the chamfering of the wafer 400.

[0055] The carrier mechanism 200 is used to carry the wafer 400. The carrier mechanism 200 is located on one side of the chamfering mechanism 100 and is used to carry and drive the wafer 400 to rotate. Figure 1 As shown, the carrier mechanism 200 includes a base 210 and a turntable 220; the turntable 220 is rotatably connected to the base 210, has a vertically arranged axial direction, and can rotate around the axial direction; the turntable 220 has an adsorption function to adsorb the wafer 400 to prevent the wafer 400 from falling off or shifting during the grinding process. It can be understood that the drive method of the turntable 220 can adopt a motor, a gear assembly, etc., to complete the rotation of the turntable 220 around the axis; the top of the turntable 220 has an adsorption hole, and a pipeline is opened inside the turntable 220 and an external negative pressure source is connected. The negative pressure formed inside the turntable 220 can adsorb the wafer 400 placed on the top of the turntable 220. In one embodiment, the top of the turntable 220 is a plane to keep the wafer 400 to be processed horizontal.

[0056] The barrier mechanism 300 is disposed between the chamfering mechanism 100 and the carrier mechanism 200 to isolate the chamfering mechanism 100 and the carrier mechanism 200 (specifically, the gap between the turntable 220 and the wafer 400) to prevent debris 500 from splashing. Figure 1 As shown, the barrier mechanism 300 can form an air screen 311 between the turntable 220 and the first grinding wheel 110 (and the second grinding wheel 120) to isolate the grinding debris 500; the barrier mechanism 300 includes a nozzle 310, which is located between the turntable 220 and the first grinding wheel 110 and connected to the base 210; the nozzle 310 is used to spray air toward the lower surface of the wafer 400 to form the air screen 311; as shown Figure 5 As shown, in order to enhance the isolation effect of the gas screen 311, the spray direction of the nozzle 310 is inclined toward one side of the first grinding wheel 110 to form an upwardly inclined gas screen 311; in this way, not only can the debris 500 be better guided to be discharged and the debris 500 can be reduced from being retained on the lower surface of the wafer 400, but the wafer 400 can also be further protected from damage.

[0057] Specifically, Figure 6 As shown, a plurality of nozzles 310 are provided and arranged in a straight line. The projection length of the plurality of nozzles 310 on the wafer 400 is L1, and the arrangement length of the plurality of nozzles 310 is L2, and L1 is smaller than L2; by arranging the plurality of nozzles 310 in a straight line, and the arrangement length L2 is larger than the projection length L1 of the nozzles 310 on the wafer 400, the nozzles 310 can cover a wider area of ​​the lower surface of the wafer 400, thereby more effectively isolating the debris 500 generated during the grinding process of the lower surface of the wafer 400. Further, as Figure 7 , 8 As shown, the two ends of the arrangement of the nozzle 310 are respectively located outside the projection of the nozzle 310 on the wafer 400. In this way, the nozzle 310 projected outside the wafer 400 is used to blow air upward. Since the arrangement length of the nozzle 310 exceeds the outside of the wafer 400, when the nozzle 310 blows air upward through the edge of the wafer 400, according to the Bernoulli effect, the edge of the wafer 400 has a large flow rate to form a negative pressure, and the upper surface of the wafer 400 has a small flow rate to form a positive pressure. Therefore, the air above the wafer 400 forms an airflow toward the outer edge of the wafer 400, which can move the debris 500 above the wafer 400 into the airflow formed by the nozzle 310 and be taken out. At the same time, under the rotation of the wafer 400, the wafer 400 drives the debris 500 to move, further improving the removal effect of the debris 500.

[0058] Among them, Figure 6 , 7 As shown in FIG. 8 , the projection of the nozzle 310 on the edge of the wafer 400 is defined as having a first position 340 and a second position 350, that is, the position where the projection of the straight line where the nozzles 310 are arranged on the wafer 400 and the edge of the wafer 400 intersect is the first position 340 and the second position 350, and the rotation direction of the wafer 400 is from the first position 340 to the second position 350; a collecting mechanism 600 is provided above the second position 350 for collecting debris 500 located on the upper surface of the wafer 400; the collecting mechanism 600 includes an electrostatic component, which is provided in the airflow channel and has static electricity to absorb the debris 500 in the airflow; the flying debris 500 is captured by the electrostatic effect, thereby improving the accuracy of capturing the debris 500.

[0059] It can be understood that, near the second position 350, the nozzle 310 is arranged beyond the edge of the wafer 400, so that the debris 500 on the upper surface of the wafer 400 can be carried out by the airflow formed by the Bernoulli effect; near the first position 340, the nozzle 310 is arranged beyond the edge of the wafer 400, thereby improving the isolation effect of the debris 500 on the upper surface of the wafer 400 and preventing splashing.

[0060] In one embodiment, the distance between the nozzle 310 and the lower surface of the wafer 400 is controlled to be between 0.5 cm and 1.0 cm. This distance range is conducive to the nozzle 310 acting accurately and directionally on the lower surface of the wafer 400, preventing airflow turbulence, improving the lower surface isolation effect and the debris 500 removal effect. It also responds more accurately and quickly to changes in the height position of the wafer 400, which is conducive to more precise adjustment of the grinding mechanism.

[0061] Furthermore, the present application designs the structure of the nozzle 310, and the nozzle 310 can adjust the relative position of the wafer 400 and the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120), which is beneficial to the real-time position matching between the wafer 400 and the first grinding wheel 110 and the second grinding wheel 120, and prevents the upper and lower edges of the wafer 400 from being under-grinded or over-grinded. Specifically, the position adjustment between the wafer 400 and the grinding mechanism is achieved by monitoring the floating and force of the nozzle 310. Specifically, as Fig. 9 , 10 As shown, the barrier mechanism 300 further includes an elastic member 320, and the nozzle 310 is movably connected to the base 210 and connected to the base 210 through the elastic member 320. The elastic member 320 can drive the nozzle 310 to float up or sink down through elastic potential energy. A force-bearing area 250 is formed between the elastic member 320 and the base 210, and a pressure sensor 330 is provided on the force-bearing area 250 for obtaining the force condition of the elastic member 320.

[0062] In one embodiment, Fig. 9 As shown, a bracket 230 is provided on the base 210, and the elastic member 320 is an elastic rod 321, the first end of the elastic rod 321 is connected to the nozzle 310, the second end of the elastic rod 321 is connected to the nail provided on the base 210, and a force area 250 is formed between the second end of the elastic rod 321 and the bracket 230, and a pressure sensor 330 is provided on the force area 250 to obtain the force change of the elastic rod 321. It should be noted that only one elastic rod 321 and bracket 230 are provided, and multiple nozzles 310 can be connected to the elastic member 321 together through a connecting structure; multiple elastic rods 321 and bracket 230 can also be provided, and they are matched with the nozzles 310 in a one-to-one correspondence.

[0063] In another embodiment, Fig.10As shown, a sleeve 240 is provided on the base 210, and the elastic member 320 is a spring 322, which is located in the sleeve 240, and the first end of the spring 322 is connected to the nozzle 310, and the second end of the spring 322 is connected to the base 210, and a force area 250 is formed between the second end of the spring 322 and the base 210, and a pressure sensor 330 is provided on the force area 250 to obtain the force change of the spring 322. It should be noted that only one spring 322 and sleeve 240 are provided, and multiple nozzles 310 are connected to the spring 322 together through a connecting structure; multiple springs 322 and sleeves can also be provided, and they are matched with the nozzles 310 in a one-to-one correspondence.

[0064] Specifically, when the force on the pressure sensor 330 increases, due to the stable output of the gas source, it indicates that the nozzle 310 is pressed down by the descent of the wafer 400, because the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) is located below the wafer 400, resulting in a smaller spacing between the wafer 400 and the nozzle 310; at this time, the first grinding wheel 110 located on the upper part of the wafer 400 and the wafer 400 are over-ground, while the second grinding wheel 120 located on the lower part of the wafer 400 and the wafer 400 are under-ground; then the following is executed: the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) are driven to rise, and the parameters of the pressure sensor 330 are obtained in real time until the parameters reach a normal range, wherein the normal range refers to the downward force of the first grinding wheel 110 on the wafer 400 and the upward force of the second grinding wheel 120 on the wafer 400 are basically offset, and the normal range is approximately a numerical range floating around the sum of the gravity of the elastic member 320 and the nozzle 310 and the reaction force of the airflow. On the contrary, when the force on the pressure sensor 330 decreases, due to the stable output of the gas source, it indicates that the nozzle 310 is lifted up by the wafer 400 and floats up, because the grinding mechanism is positioned above the wafer 400, resulting in a larger distance between the wafer 400 and the nozzle 310; at this time, the first grinding wheel 110 located on the upper part of the wafer 400 and the wafer 400 is insufficiently ground, while the second grinding wheel 120 located on the lower part of the wafer 400 and the wafer 400 is excessively ground; then the following is executed: driving the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) to descend, and obtaining the parameters of the pressure sensor 330 in real time until the parameters reach the normal range, wherein the normal range refers to the downward force of the first grinding wheel 110 on the wafer 400 and the upward force of the second grinding wheel 120 on the wafer 400 basically offset each other, and the normal range is approximately the numerical range floating around the sum of the gravity of the elastic member 320 and the nozzle 310 and the reaction force of the airflow.

[0065] In this way, by obtaining the force condition of the pressure sensor 330, it is possible to analyze whether the wafer 400 is biased upward or downward, and adjust the positions of the first grinding wheel 110 and the second grinding wheel 120 accordingly to match the position of the wafer 400 with the two grinding wheels to prevent under-grinding or over-grinding.

[0066] The present application also provides a chamfering method, which is applied to the above-mentioned chamfering equipment; the method includes causing the nozzle 310 to spray air toward the lower surface of the wafer 400, forming an air screen 311 between the turntable 220 and the first grinding wheel 110 and / or the second grinding wheel 120, so as to prevent the grinding debris 500 from flying into the space between the lower surface of the wafer 400 and the turntable 220. During the chamfering process, the nozzle 310 continuously sprays air toward the lower surface of the wafer 400, forming a stable air screen 311; at the same time, the wafer 400 rotates under the drive of the turntable 220, and contacts and grinds with the first grinding wheel 110 and the second grinding wheel 120 to chamfer; due to the existence of the air screen 311, the grinding debris 500 is effectively isolated from the lower surface of the wafer 400 and the turntable 220, preventing the debris 500 from contaminating the wafer 400 and the equipment.

[0067] Furthermore, the nozzle 310 is movably connected to the base 210, and the barrier assembly also includes: an elastic member 320, the elastic member 320 is connected between the nozzle 310 and the base 210, the elastic member 320 can drive the nozzle 310 to float up or sink through elastic potential energy, a force area 250 is formed between the elastic member 320 and the base 210, a pressure sensor 330 is provided on the force area 250, and the pressure sensor 330 is used to obtain the force condition of the elastic member 320; based on the force condition of the elastic member 320, the first grinding wheel 110 and the second grinding wheel 120 are driven to float up or sink so that the upper and lower forces on the edge of the wafer 400 are balanced.

[0068] Specifically, when the force on the pressure sensor 330 increases, due to the stable output of the gas source, it indicates that the nozzle 310 is pressed down by the descent of the wafer 400, because the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) is located below the wafer 400, resulting in a smaller spacing between the wafer 400 and the nozzle 310; at this time, the first grinding wheel 110 located on the upper part of the wafer 400 and the wafer 400 are over-ground, while the second grinding wheel 120 located on the lower part of the wafer 400 and the wafer 400 are under-ground; then the following is executed: the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) are driven to rise, and the parameters of the pressure sensor 330 are obtained in real time until the parameters reach a normal range, wherein the normal range refers to the downward force of the first grinding wheel 110 on the wafer 400 and the upward force of the second grinding wheel 120 on the wafer 400 are basically offset, and the normal range is approximately a numerical range floating around the sum of the gravity of the elastic member 320 and the nozzle 310 and the reaction force of the airflow.

[0069] On the contrary, when the force on the pressure sensor 330 decreases, due to the stable output of the gas source, it indicates that the nozzle 310 is lifted up by the wafer 400 and floats up, because the grinding mechanism is positioned above the wafer 400, resulting in a larger distance between the wafer 400 and the nozzle 310; at this time, the first grinding wheel 110 located on the upper part of the wafer 400 and the wafer 400 is insufficiently ground, while the second grinding wheel 120 located on the lower part of the wafer 400 and the wafer 400 is excessively ground; then the following is executed: driving the grinding mechanism (the first grinding wheel 110 and the second grinding wheel 120) to descend, and obtaining the parameters of the pressure sensor 330 in real time until the parameters reach the normal range, wherein the normal range refers to the downward force of the first grinding wheel 110 on the wafer 400 and the upward force of the second grinding wheel 120 on the wafer 400 basically offset each other, and the normal range is approximately the numerical range floating around the sum of the gravity of the elastic member 320 and the nozzle 310 and the reaction force of the airflow.

[0070] In this way, by obtaining the force condition of the pressure sensor 330, it is possible to analyze whether the wafer 400 is biased upward or downward, and adjust the positions of the first grinding wheel 110 and the second grinding wheel 120 accordingly to match the position of the wafer 400 with the two grinding wheels to prevent under-grinding or over-grinding.

[0071] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0072] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A chamfering device, characterized in that: include: A chamfering mechanism (100), wherein the chamfering mechanism (100) comprises: a first grinding wheel (110), the first grinding wheel (110) having a first rotating shaft arranged transversely, and the first grinding wheel (110) being capable of rotating around the first rotating shaft; the first grinding wheel (110) being used for grinding an edge of a wafer (400); A carrier mechanism (200), the carrier mechanism (200) being located on one side of the chamfering mechanism (100), the carrier mechanism (200) comprising: Base (210); a turntable (220), the turntable (220) being rotatably connected to the base (210), the turntable (220) having a vertically arranged axial direction and being rotatable about the vertically arranged axial direction, the turntable (220) having an adsorption function, the turntable (220) being used to carry a wafer (400) and drive the wafer (400) to rotate, so that the axial side of the wafer (400) contacts the first grinding wheel (110) to achieve chamfering; The wafer (400) contacts the first grinding wheel (110) to form a first contact area (410), and the chamfering mechanism (100) is movable relative to the carrier mechanism (200) to adjust the formation position of the first contact area (410) at the edge of the wafer (400); and A barrier mechanism (300), wherein the barrier mechanism (300) comprises: A nozzle (310), the nozzle (310) being located between the turntable (220) and the first grinding wheel (110), the nozzle (310) being connected to the base (210), and the nozzle (310) being used to face the lower surface of the wafer (400) to form an air screen (311) that isolates the turntable (220) and the first grinding wheel (110).

2. A chamfering device according to claim 1, characterized in that: The spraying direction of the nozzle (310) is inclined toward one side of the first grinding wheel (110), so that the air screen (311) is inclined upward.

3. A chamfering device according to claim 1 or 2, characterized in that: The chamfering mechanism (100) further comprises: a second grinding wheel (120), wherein the second grinding wheel (120) has a second rotating shaft arranged transversely, and the second grinding wheel (120) can rotate around the second rotating shaft; the second grinding wheel (120) is located below the first grinding wheel (110), a working space is formed between the second grinding wheel (120) and the first grinding wheel (110), and the wafer (400) is located in the working space and is in contact with the first grinding wheel (110) and the second grinding wheel (120) for grinding to chamfer; the wafer (400) is in contact with the second grinding wheel (120) to form a second contact area (420), and the chamfering mechanism (100) can move relative to the carrier mechanism (200) to adjust the formation position of the second contact area (420) at the edge of the wafer (400); The first grinding wheel (110) and the second grinding wheel (120) are not in the same vertical space.

4. A chamfering device according to claim 3, characterized in that: A plurality of the nozzles (310) are provided, and the plurality of the nozzles (310) are arranged in a straight line, a projection length of the plurality of the nozzles (310) on the wafer (400) is L1, and an arrangement length of the plurality of the nozzles (310) is L2, where L1<L2.

5. A chamfering device according to claim 4, characterized in that: Both ends of the arrangement of the nozzles (310) are respectively located outside the projection of the nozzles (310) on the wafer (400).

6. A chamfering device according to claim 5, characterized in that: The projection of the nozzle (310) on the edge of the wafer (400) is defined to have a first position (340) and a second position (350), and the rotation direction of the wafer (400) is from the first position (340) to the second position (350); A collection mechanism (600) is provided above the second position (350), and the collection mechanism (600) is used to collect debris (500) located on the upper surface of the wafer (400).

7. A chamfering device according to claim 6, characterized in that: The nozzle (310) projected outside the wafer (400) forms an air flow channel upwards, and the nozzle (310) supplies air into the air flow channel to drive the debris (500); the collection mechanism (600) comprises: An electrostatic component is arranged in the airflow channel, and the electrostatic component has static electricity to absorb debris (500) in the airflow.

8. A chamfering device according to claim 2, characterized in that: The distance between the nozzle (310) and the lower surface of the wafer (400) is between 0.5 cm and 1.0 cm.

9. The chamfering device according to claim 3, characterized in that: The chamfering mechanism (100) further comprises a driving assembly, wherein the driving assembly comprises two groups, and the two groups of driving assemblies are respectively connected to and act on the first grinding wheel (110) and the second grinding wheel (120), so that the first grinding wheel (110) and the second grinding wheel (120) can move in a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

10. A chamfering method, characterized in that: The chamfering device as claimed in any one of claims 1 to 9 comprises: causing the nozzle (310) to spray air toward the lower surface of the wafer (400), forming an air screen (311) between the turntable (220) and the first grinding wheel (110) and / or the second grinding wheel (120) to prevent grinding debris (500) from flying into between the lower surface of the wafer (400) and the turntable (220).

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