Wafer sucking and flattening structure, sucking and flattening method and wafer detection device

Abstract

The invention provides a wafer sucking and flattening structure and method and a wafer detection device.The sucking and flattening structure comprises a bottom plate, a bearing plate, a lifting and rotating module, a sucking and flattening module and a setting module, the bearing plate is used for bearing a wafer, the lifting and rotating module comprises a rotating mechanism and a lifting mechanism, the rotating mechanism is used for bearing the wafer, and the lifting mechanism is used for lifting the wafer; the flat suction module can suck the wafer and move back and forth in the first direction so as to suck the wafer to be flat on the bearing plate, the flatness of the wafer can be guaranteed, pre-alignment positioning, code scanning and other operations can be conveniently carried out on the wafer, and the wafer alignment efficiency is improved. A first setting mechanism, a second setting mechanism, a third setting mechanism and a fourth setting mechanism of the setting module are arranged around the bearing plate and are respectively arranged on the periphery of the bearing plate, and the setting module can move along the side close to the center of the bearing plate so as to set and center a wafer on the bearing plate, so that the position of the wafer can be effectively corrected, and the accuracy of alignment of the wafer is improved. And subsequent transportation and detection of the wafer are facilitated.

Description

Technical Field

[0001] The present application relates to the field of wafer detection technology, and in particular to a wafer leveling structure and leveling method, and a wafer detection device. Background Art

[0002] Wafer inspection equipment is an important device used for testing and characterizing semiconductor devices, and can test the performance of integrated circuit devices on wafers. Before the wafer inspection equipment tests the wafer, the wafer needs to be pre-aligned to accurately identify and calibrate the model and position of the wafer to ensure that the wafer inspection equipment can accurately match and test the wafer.

[0003] However, during the wafer manufacturing process, some wafers may warp and deform. During the wafer inspection process, the warped wafers are not conducive to the pre-alignment positioning, code scanning, and subsequent inspection steps. In the related art, conventional wafer inspection devices cannot effectively locate and inspect warped wafers. Summary of the invention

[0004] The purpose of the present application is to provide a wafer leveling structure and a wafer leveling method, and a wafer detection device, so as to solve the technical problem in the related art that conventional wafer detection devices cannot effectively locate and detect warped and deformed wafers.

[0005] In a first aspect, the present application provides a wafer leveling structure, comprising: Base plate; A carrier plate, the carrier plate is disposed on the bottom plate and spaced apart from the bottom plate, and the carrier plate is used to carry wafers; A lifting and rotating module, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module comprises a rotating mechanism and a lifting mechanism, the rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate, the lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to reciprocate along a first direction, the first direction is perpendicular to the bottom plate; A suction leveling module, the suction leveling module is arranged on the bottom plate, the suction leveling module at least partially penetrates the carrier plate and the bottom plate, the suction leveling module is used to carry and level the wafer, and the suction leveling module can reciprocate along the first direction to level the wafer on the carrier plate; and An adjusting module, wherein the adjusting module is arranged on the base plate, and the adjusting module comprises a first adjusting mechanism, a second adjusting mechanism, a third adjusting mechanism and a fourth adjusting mechanism, wherein the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism are arranged around the carrier plate and are respectively arranged around the carrier plate, and the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism can all be used to move along the side close to the center of the carrier plate to adjust the wafer on the carrier plate.

[0006] In the suction leveling structure provided by the present application, the bearing plate is arranged on the bottom plate and is spaced from the bottom plate, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module includes a rotating mechanism and a lifting mechanism, the rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate, and the lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to move back and forth along the first direction. The suction leveling module is arranged on the bottom plate, the suction leveling module at least partially penetrates the bearing plate and the bottom plate, the suction leveling module is used to carry and suck the wafer flat, and the suction leveling module can move back and forth along the first direction to suck the wafer flat on the bearing plate. The setting module is arranged on the bottom plate, and the setting module includes a first setting mechanism, a second setting mechanism, a third setting mechanism and a fourth setting mechanism, the first setting mechanism, the second setting mechanism, the third setting mechanism and the fourth setting mechanism are arranged around the bearing plate and are respectively arranged around the bearing plate, and the first setting mechanism, the second setting mechanism, the third setting mechanism and the fourth setting mechanism can all be used to move along the side close to the center of the bearing plate to set the wafer on the bearing plate. The leveling module can drive the wafer to move in the opposite direction of the first direction so as to place the wafer flat on the carrier plate, thereby ensuring the flatness of the wafer and facilitating pre-alignment positioning, code scanning and other operations on the wafer; the adjustment module can adjust the wafer on the carrier plate to center larger wafers, effectively correct the position of the wafer, and facilitate subsequent steps such as wafer transportation and inspection.

[0007] Wherein, the adjustment module also includes an adjustment drive mechanism, which is connected to the first adjustment mechanism and is used to drive the first adjustment mechanism to move along a second direction and an opposite direction; the adjustment drive mechanism is connected to the second adjustment mechanism and is used to drive the second adjustment mechanism to move along a third direction and an opposite direction; the adjustment drive mechanism is connected to the third adjustment mechanism and is used to drive the third adjustment mechanism to move along the first direction and an opposite direction; the adjustment drive mechanism is connected to the fourth adjustment mechanism and is used to drive the fourth adjustment mechanism to move along the third direction and an opposite direction, wherein the second direction is perpendicular to the third direction, and the second direction and the third direction are both perpendicular to the first direction.

[0008] Wherein, the setting module further includes a fifth setting mechanism and a sixth setting mechanism, the first setting mechanism and the fifth setting mechanism are arranged at intervals along the third direction, and the third setting mechanism and the sixth setting mechanism are arranged at intervals along the third direction; The adjustment module also includes a guide rail assembly, which includes a first guide rail, a second guide rail and a third guide rail, the first guide rail and the third guide rail extend along the second direction and are arranged at intervals, and the second guide rail extends along the third direction; wherein, the first adjustment mechanism and the third adjustment mechanism are slidably connected to the first guide rail, the first adjustment mechanism and the third adjustment mechanism move along the first guide rail toward the second direction and the opposite direction, the fifth adjustment mechanism and the sixth adjustment mechanism are slidably connected to the third guide rail, the fifth adjustment mechanism and the sixth adjustment mechanism move along the second guide rail toward the second direction and the opposite direction, the second adjustment mechanism and the fourth adjustment mechanism are slidably connected to the second guide rail, and the second adjustment mechanism and the fourth adjustment mechanism move along the second guide rail toward the third direction and the opposite direction.

[0009] Wherein, the setting drive mechanism comprises a setting drive motor and a conveyor belt assembly, and the setting drive motor is connected to the conveyor belt assembly and is used to drive the conveyor belt assembly to move; The conveyor belt assembly comprises an outer conveyor belt and an inner conveyor belt, the outer conveyor belt is connected to the inner conveyor belt, and the conveying directions of the outer conveyor belt and the inner conveyor belt are opposite; The inner conveyor belt comprises a first conveyor portion, a second conveyor portion and a third conveyor portion connected in sequence, the outer conveyor belt comprises a fourth conveyor portion, a fifth conveyor portion and a sixth conveyor portion connected in sequence, the first conveyor portion and the fourth conveyor portion are correspondingly arranged and move in opposite directions, the second conveyor portion and the fifth conveyor portion are correspondingly arranged and move in opposite directions, the third conveyor portion and the sixth conveyor portion are correspondingly arranged and move in opposite directions, the first conveyor portion, the third conveyor portion, the fourth conveyor portion and the sixth conveyor portion extend along the second direction, and the second conveyor portion and the fifth conveyor portion extend along the third direction; The first adjusting mechanism is connected to the first conveying part, the third adjusting mechanism is connected to the fourth conveying part, and the moving directions of the first adjusting mechanism and the third adjusting mechanism are opposite; the second adjusting mechanism is connected to the second conveying part, the fourth adjusting mechanism is connected to the fifth conveying part, and the moving directions of the second adjusting mechanism and the fourth adjusting mechanism are opposite; the fifth adjusting mechanism is connected to the third conveying part, the sixth adjusting mechanism is connected to the sixth conveying part, and the moving directions of the fifth adjusting mechanism and the sixth adjusting mechanism are opposite.

[0010] Wherein, the setting module includes a retracted state and an open state. When the setting module is in the retracted state, the setting drive motor rotates clockwise, the inner conveyor belt moves counterclockwise, the outer conveyor belt moves clockwise, the first conveying part drives the first setting mechanism to move in the second direction, the second conveying part drives the second setting mechanism to move in the opposite direction of the third direction, the third conveying part drives the sixth setting mechanism to move in the opposite direction of the second direction, the fourth conveying part drives the third setting mechanism to move in the opposite direction of the second direction, the fifth conveying part drives the fourth setting mechanism to move in the third direction; the sixth conveying part drives the fifth setting mechanism to move in the second direction; When the adjustment module is in an open state, the adjustment drive motor rotates counterclockwise, the inner conveyor belt moves clockwise, the outer conveyor belt moves counterclockwise, the first conveying part drives the first adjustment mechanism to move in the opposite direction of the second direction, the second conveying part drives the second adjustment mechanism to move in the third direction, the third conveying part drives the sixth adjustment mechanism to move in the second direction, the fourth conveying part drives the third adjustment mechanism to move in the second direction, the fifth conveying part drives the fourth adjustment mechanism to move in the opposite direction of the third direction; the sixth conveying part drives the fifth adjustment mechanism to move in the opposite direction of the second direction.

[0011] Wherein, the first setting mechanism comprises a first connecting member, a first pressing plate, a first adjusting block, a second adjusting block, a first guide rod and a second guide rod, the first connecting member is connected to the first guide rail, the first pressing plate is respectively connected to the first connecting member and the first conveying part, the first adjusting block and the second adjusting block are arranged on the first connecting member, and the first adjusting block and the second adjusting block are arranged in sequence along the third direction, the first guide rod is arranged on the first adjusting block, the second guide rod is arranged on the second adjusting block, and the first guide rod and the second guide rod are used to abut and limit the wafer; The first adjusting block and the second adjusting block are provided with a first waist-shaped hole, and the first adjusting block and the second adjusting block are fixedly connected through the first waist-shaped hole and the first connecting member.

[0012] The first guide rod includes a main body, an arc-shaped transition portion and an extension portion. The radial dimension of the extension portion is larger than that of the main body, and the radial dimension of the arc-shaped transition portion gradually increases from the main body to the extension portion.

[0013] Wherein, the suction leveling module comprises a first suction leveling mechanism and a second suction leveling mechanism which are arranged at intervals, and the first suction leveling mechanism and the second suction leveling mechanism are arranged on a side of the bottom plate away from the carrying plate; The first suction mechanism comprises a first lifting cylinder, a first fixing assembly, a first suction piece and a second suction piece, wherein the first lifting cylinder is used to drive the first fixing assembly to move along the first direction, the first suction piece and the second suction piece are arranged at two ends of the first fixing assembly, and the first suction piece and the second suction piece penetrate the bottom plate and the carrying plate, and the first suction piece and the second suction piece are used to absorb the wafer; The second leveling mechanism includes a second lifting cylinder, a second fixed assembly, a third leveling member and a fourth leveling member. The second lifting cylinder is used to drive the second fixed assembly to move along the first direction. The third leveling member and the fourth leveling member are arranged at both ends of the second fixed assembly, and the third leveling member and the fourth leveling member pass through the bottom plate and the supporting plate. The third leveling member and the fourth leveling member are used to absorb the wafer.

[0014] The rotating mechanism comprises a rotating assembly and a suction cup assembly, wherein the rotating assembly is arranged on a side of the bottom plate away from the carrying plate, the rotating assembly is used to drive the suction cup assembly to rotate, the suction cup assembly extends along the first direction and penetrates the bottom plate and the carrying plate, and the suction cup assembly is used to carry and adsorb the wafer; The suction cup assembly includes a suction cup seat, a suction cup body and multiple suction cups. The suction cup seat and the suction cup body are connected to form an air suction channel connecting the multiple suction cups. The suction cup body is provided with multiple receiving grooves, and the multiple receiving grooves are used to place the suction cups. In the first direction, the height of the suction cup is higher than the height of the suction cup body, so as to adsorb the wafer tightly against the suction cup body.

[0015] In a second aspect, the present application provides a suction leveling method, which is applied to the suction leveling structure, and the suction leveling method comprises: Controlling the lifting and rotating module to move from a first position to a second position along a first direction for adsorbing and carrying the wafer; Controlling the lifting and rotating module to move to a third position in the opposite direction of the first direction; Controlling the suction and leveling module to move along the first direction to a first suction and leveling position to absorb the wafer on the lifting and rotating module; Controlling the lifting and rotating module to move to the first position in the opposite direction of the first direction after the wafer is adsorbed by the leveling module; Controlling the suction leveling module to move from the first suction leveling position to a second suction leveling position in the opposite direction of the first direction, so as to make the wafer suction level on the carrier plate; Controlling the code scanning device to scan the wafer after the wafer is sucked flat on the carrier plate; Controlling the setting mechanism of the setting module to move to a first setting position along the side close to the lifting and rotating module; Control the suction and leveling module to release the wafer after the setting mechanism moves to the first setting position; The setting mechanism of the setting module is controlled to move to the second setting position for setting the wafer.

[0016] In a third aspect, the present application provides a wafer inspection device, including a transport structure and the suction and leveling structure, wherein the transport structure is used to transport the wafer to the suction and leveling structure or to remove the wafer on the suction and leveling structure.

[0017] In the wafer detection device provided by the present application, the carrier plate is arranged on the bottom plate and is spaced from the bottom plate, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module includes a rotating mechanism and a lifting mechanism, the rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate, the lifting mechanism is used to carry the rotating mechanism, and drive the rotating mechanism to move back and forth along the first direction. The suction and leveling module is arranged on the bottom plate, the suction and leveling module at least partially penetrates the carrier plate and the bottom plate, the suction and leveling module is used to carry and suck the wafer flat, and the suction and leveling module can move back and forth along the first direction to suck the wafer flat on the carrier plate. The setting module is arranged on the bottom plate, the setting module includes a first setting mechanism, a second setting mechanism, a third setting mechanism and a fourth setting mechanism, the first setting mechanism, the second setting mechanism, the third setting mechanism and the fourth setting mechanism are arranged around the carrier plate and are respectively arranged around the carrier plate, and the first setting mechanism, the second setting mechanism, the third setting mechanism and the fourth setting mechanism can all be used to move along the side close to the center of the carrier plate to set the wafer on the carrier plate. The leveling module can drive the wafer to move in the opposite direction of the first direction so as to place the wafer flat on the carrier plate, thereby ensuring the flatness of the wafer and facilitating pre-alignment positioning, code scanning and other operations on the wafer; the adjustment module can adjust the wafer on the carrier plate to center larger wafers, effectively correct the position of the wafer, and facilitate subsequent steps such as wafer transportation and inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Figure 1 It is a structural schematic diagram of a wafer detection device provided in an embodiment of the present application; Figure 2 It is a structural schematic diagram of a suction leveling structure provided in an embodiment of the present application; Figure 3 It is a structural schematic diagram of a suction and leveling structure provided in an embodiment of the present application with a bearing plate removed; Figure 4 It is a schematic diagram of a top view of a suction and leveling structure provided in an embodiment of the present application; Figure 5 It is a structural schematic diagram of a lifting and rotating module provided in an embodiment of the present application; Figure 6 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 1 ; Figure 7 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 2 ; Figure 8 This is a schematic diagram of a structure in which a lifting and rotating module is in a third position and a suction and leveling module is in a first suction and leveling position provided in an embodiment of the present application. Figure 1 ; Fig. 9 This is a schematic diagram of a structure in which a lifting and rotating module is in a third position and a suction and leveling module is in a first suction and leveling position provided in an embodiment of the present application. Figure 2 ; Fig.10 It is a structural schematic diagram of a setting drive mechanism and a guide rail assembly provided in an embodiment of the present application; Fig.11 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 1 ; Fig.12 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 2 ; Fig.13 This is a schematic diagram of a structure of a setting module in an initial position provided by an embodiment of the present application; Fig.14 It is a structural schematic diagram of a setting module in a retracted state provided by an embodiment of the present application; Fig.15 It is a structural schematic diagram of a setting module in a final setting position provided by an embodiment of the present application; Fig.16 It is a structural schematic diagram of a setting module in an open state provided by an embodiment of the present application; Fig.17 It is a schematic diagram of the structure of a square wafer provided in an embodiment of the present application; Fig.18 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 3 ; Fig.19 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 4 ; Fig. 20 is a structural schematic diagram of a first guide rod provided in an embodiment of the present application; Fig.21 yes Fig.18 A magnified schematic diagram of the middle A area; Fig. 22 It is a structural schematic diagram of a setting module for setting a large-size wafer provided in an embodiment of the present application; Fig.23 It is a structural schematic diagram of a setting module for setting a small-size wafer provided in an embodiment of the present application; Fig.24 It is a structural schematic diagram of a suction leveling module provided in an embodiment of the present application; Fig.25 It is a structural schematic diagram of a rotating mechanism provided in an embodiment of the present application; Fig.26 It is a structural schematic diagram of a suction cup assembly provided in an embodiment of the present application; Fig. 27 It is a flow chart of a suction leveling method provided in an embodiment of the present application.

[0019] Description of labels: Wafer detection device 1000, suction and leveling structure 100, bottom plate 10, first through hole 11, carrier plate 20, second through hole 21, lifting and rotating module 30, lifting mechanism 31, lifting and fixing plate 311, lifting motor 312, lifting guide rail 313, sliding seat 314, lifting sensor sheet 315, first position detector 316, second position detector 317, rotating mechanism 32, rotating assembly 321, suction cup assembly 322, suction cup seat 3221, suction cup body 3222, suction cup 3223, suction module 40, first suction mechanism 41, first lifting cylinder 411, first fixing assembly 412, first suction member 413, second suction member 414, second Suction leveling mechanism 42, second lifting cylinder 421, second fixing assembly 422, third suction leveling member 423, fourth suction leveling member 424, setting module 50, first setting mechanism 51, first connecting member 511, first pressing plate 512, first adjusting block 513, second adjusting block 514, first guide rod 515, main body 5151, arc-shaped transition portion 5152, extension portion 5153, second guide rod 516, second setting mechanism 52, second connecting member 521, second pressing plate 522, third adjusting block 523, third guide rod 524, fourth guide rod 525, third setting mechanism 53, third connecting member 531, third pressing plate 532, fourth adjusting block 533, fifth adjusting block 534, the fifth guide rod 535, the sixth guide rod 536, the fourth setting mechanism 54, the fourth connecting member 541, the fourth pressure plate 542, the sixth adjustment block 543, the seventh guide rod 544, the eighth guide rod 545, the fifth setting mechanism 55, the fifth connecting member 551, the fifth pressure plate 552, the seventh adjustment block 553, the eighth adjustment block 554, the ninth guide rod 555, the tenth guide rod 556, the sixth setting mechanism 56, the sixth connecting member 561, the sixth pressure plate 562, the ninth adjustment block 563, the tenth adjustment block 564, the eleventh guide rod 565, the twelfth guide rod 566, the setting induction sheet 567, the setting drive mechanism 60, the setting drive motor 61, the conveyor belt assembly 62, Outer conveyor belt 621, first conveyor part 6211, second conveyor part 6212, third conveyor part 6213, inner conveyor belt 622, fourth conveyor part 6221, fifth conveyor part 6222, sixth conveyor part 6223, first conveyor wheel 623, second conveyor wheel 624, third conveyor wheel 625, fourth conveyor wheel 626, first tensioning wheel 627, second tensioning wheel 628, tensioning block 629, first guide rail 71, second guide rail 72, third guide rail 73, mounting slide rail 81, first sensor 82, second sensor 83, transport structure 200, code scanning device 300, first side 91, second side 92, third side 93, fourth side 94, wafer detector 95. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0022] In this specification, for the sake of convenience, the words and phrases indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the orientation of the constituent elements being described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the circumstances.

[0023] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the meanings of the above terms in this disclosure can be understood according to the circumstances.

[0024] Wafer inspection equipment is an important device used for testing and characterizing semiconductor devices, and can test the performance of integrated circuit devices on the wafer.

[0025] The wafer inspection device usually includes components such as a material box, a transport structure, a test bench and a probe. The material box is used to store wafers. During the operation of the wafer inspection device, the transport structure is used to take out the wafer to be tested from the material box and transport the wafer to the test bench for testing. The transport structure can also remove the tested wafer from the test bench and put the tested wafer back into the material box. Among them, the transport structure includes but is not limited to a manipulator structure. The test bench is used to carry the wafer and perform testing. The probe is set above the test bench and is used to contact the wafer to test the electrical properties of the wafer.

[0026] However, there are many types of wafers at present, and a set of wafer inspection equipment usually needs to be able to test multiple types of wafers, and the position of the wafers stored in the material box is often offset. Therefore, before the wafer inspection device tests the wafer, the wafer needs to be pre-aligned to accurately identify and calibrate the model and position of the wafer to ensure that the wafer inspection device can accurately match and test the wafer.

[0027] However, during the wafer manufacturing process, some wafers may warp and deform. During the wafer inspection process, the warped wafers are not conducive to the pre-alignment positioning, code scanning, and subsequent inspection steps. In the related art, conventional wafer inspection devices cannot effectively locate and inspect warped wafers.

[0028] In view of this, to solve the above problems, please refer to Figures 1 to 5 , Figure 1 is a schematic structural diagram of a wafer inspection device provided in an embodiment of the present application, Figure 2 It is a structural schematic diagram of a suction leveling structure provided in an embodiment of the present application. Figure 3 This is a schematic diagram of a structure in which a suction and leveling structure is provided in an embodiment of the present application and a bearing plate is removed. Figure 4 It is a schematic diagram of a top view of a suction and leveling structure provided in an embodiment of the present application. Figure 5 It is a structural schematic diagram of a lifting and rotating module provided in an embodiment of the present application.

[0029] The present application provides a wafer leveling structure 100 to solve the technical problem in the related art that conventional wafer detection devices cannot effectively locate and detect warped and deformed wafers.

[0030] The suction and leveling structure 100 includes a base plate 10, a carrier plate 20, a lifting and rotating module 30, a suction and leveling module 40 and a leveling module 50. The carrier plate 20 is arranged on the base plate 10 and is spaced apart from the base plate 10. The carrier plate 20 is used to carry a wafer. The lifting and rotating module 30 is arranged on the base plate 10. The lifting and rotating module 30 includes a rotating mechanism 32 and a lifting mechanism 31. The rotating mechanism 32 is used to carry the wafer and drive the wafer to rotate relative to the base plate 10. The lifting mechanism 31 is used to carry the rotating mechanism 32 and drive the rotating mechanism 32 to reciprocate along a first direction D1. The first direction D1 is perpendicular to the base plate 10. The suction module 40 is disposed on the base plate 10 , and at least partially penetrates the carrier plate 20 and the base plate 10 . The suction module 40 is used to carry and suck the wafer flat. The suction module 40 can reciprocate along the first direction D1 to suck the wafer flat on the carrier plate 20 . The adjusting module 50 is arranged on the base plate 10, and the adjusting module 50 includes a first adjusting mechanism 51, a second adjusting mechanism 52, a third adjusting mechanism 53 and a fourth adjusting mechanism 54. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are arranged around the carrier plate 20 and are respectively arranged on the four sides of the carrier plate 20. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to adjust the wafer on the carrier plate 20.

[0031] The suction and leveling structure 100 may be, but is not limited to, used in a wafer detection device 1000, and performs suction and leveling and leveling on the wafer so that the wafer can perform corresponding positioning, scanning, and subsequent detection steps. It should be noted that when the suction and leveling structure 100 is applied to the wafer detection device 1000, the transportation structure 200 of the wafer detection device 1000 can be used to first transport the wafer from the material box to the suction and leveling structure 100, and the suction and leveling structure 100 then performs corresponding suction and leveling operations on the wafer. In addition, after the wafer is subjected to suction and leveling operations, the transportation structure 200 can also move the wafer out of the suction and leveling structure 100, and this application does not impose any restrictions on this.

[0032] Specifically, the suction and leveling structure 100 includes a bottom plate 10, and the bottom plate 10 can be used to support the carrier plate 20, the lifting and rotating module 30, the suction and leveling module 40, the leveling module 50 and other structural parts. It should be noted that the bottom plate 10 includes but is not limited to being a part of the frame of the wafer detection device 1000 or being fixed on the frame of the wafer detection device 1000, and this application does not limit this.

[0033] The carrier plate 20 is disposed on the bottom plate 10 and is spaced apart from the bottom plate 10. Specifically, the carrier plate 20 is fixed to the bottom plate 10 through a plurality of support columns and is spaced apart from the bottom plate 10. The carrier plate 20 is used to carry the wafer. The carrier plate 20 and the bottom plate 10 are spaced apart to form a receiving gap, and the receiving gap can be used to receive part of the lifting and rotating module 30, part of the leveling module 40, and part of the setting module 50.

[0034] The lifting and rotating module 30 is fixed on the bottom plate 10, and the lifting and rotating module 30 is fixedly connected to the side of the bottom plate 10 away from the carrying plate 20. Specifically, the lifting and rotating module 30 includes a lifting mechanism 31 and a rotating mechanism 32, the lifting mechanism 31 is fixed to the side of the bottom plate 10 away from the carrying plate 20, the rotating mechanism 32 is fixed on the lifting mechanism 31, the lifting mechanism 31 is used to carry the rotating mechanism 32, and the lifting mechanism 31 can drive the rotating mechanism 32 to reciprocate along the first direction D1.

[0035] The rotating mechanism 32 is used to carry the wafer, and the rotating module can be used to drive the wafer to rotate around the axis of the rotating module to adjust the circumferential position of the wafer, so as to facilitate the pre-alignment positioning, code scanning, and subsequent detection steps of the wafer. Specifically, the rotating mechanism 32 passes through the bottom plate 10 and the carrier plate 20, and the rotating mechanism 32 can be used to expose the carrier plate 20 and receive the wafer above the carrier plate 20.

[0036] Further, in this embodiment, the bottom plate 10 is provided with a first via hole 11, and the first via hole 11 can be used to pass the rotating module, and the carrier plate 20 is provided with a second via hole 21, and the second via hole 21 is arranged corresponding to the first via hole 11, that is, the second via hole 21 coincides with the second via hole 21 in the first direction D1, and the second via hole 21 can also be used to pass the rotating module. In other words, the rotating module passes through the bottom plate 10 and the carrier plate 20 through the first via hole 11 and the second via hole 21 in sequence, and carries the wafer on the carrier plate 20 through the second via hole 21. It should be noted that the radial dimension of the wafer is larger than the radial dimension of the second via hole 21, so that the wafer can be placed on the carrier plate 20 without falling from the second via hole 21, and the radial dimensions of the second via hole 21 and the first via hole 11 are larger than the radial dimensions of the rotating module, so that the rotating module can carry the wafer on the carrier plate 20 through the first via hole 11 and the second via hole 21.

[0037] The suction and leveling structure 100 provided in the present application also includes the suction and leveling module 40, and the suction and leveling module 40 at least partially penetrates the carrier plate 20 and the bottom plate 10, and the suction and leveling module 40 can reciprocate along the first direction D1. Specifically, the suction and leveling module 40 can move along the first direction D1 to the top of the carrier plate 20 to carry and level the wafer, and the suction and leveling module 40 can also drive the wafer to move in the opposite direction of the first direction D1, so as to place the wafer flat on the carrier plate 20, which can ensure the flatness of the wafer and facilitate the pre-alignment positioning, code scanning and other operations of the wafer.

[0038] The suction and leveling structure 100 provided in the present application also includes the leveling module 50, and the first leveling mechanism 51, the second leveling mechanism 52, the third leveling mechanism 53 and the fourth leveling mechanism 54 of the leveling module 50 are all arranged on the base plate 10, and the first leveling mechanism 51, the second leveling mechanism 52, the third leveling mechanism 53 and the fourth leveling mechanism 54 are arranged around the carrier plate 20 and are respectively arranged around the carrier plate 20, and the first leveling mechanism 51, the second leveling mechanism 52, the third leveling mechanism 53 and the fourth leveling mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to level the wafer on the carrier plate 20, so as to center the larger wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transportation and detection of the wafer.

[0039] Furthermore, if Figure 4 As shown, in the present embodiment, the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are arranged around the supporting plate 20 in a clockwise direction, and the first adjusting mechanism 51 and the third adjusting mechanism 53 are arranged relatively at intervals, and the second adjusting mechanism 52 and the fourth adjusting mechanism 54 are arranged relatively at intervals.

[0040] In the suction and leveling structure 100 provided in the present application, the carrier plate 20 is arranged on the bottom plate 10 and is spaced apart from the bottom plate 10, the lifting and rotating module 30 is arranged on the bottom plate 10, and the lifting and rotating module 30 includes the rotating mechanism 32 and the lifting mechanism 31, the rotating mechanism 32 is used to carry the wafer and drive the wafer to rotate relative to the bottom plate 10, and the lifting mechanism 31 is used to carry the rotating mechanism 32 and drive the rotating mechanism 32 to reciprocate along the first direction D1. The suction and leveling module 40 is arranged on the bottom plate 10, and the suction and leveling module 40 at least partially penetrates the carrier plate 20 and the bottom plate 10, and the suction and leveling module 40 is used to carry and suck and level the wafer, and the suction and leveling module 40 can reciprocate along the first direction D1 to suck and level the wafer on the carrier plate 20. The adjusting module 50 is arranged on the base plate 10, and the adjusting module 50 includes a first adjusting mechanism 51, a second adjusting mechanism 52, a third adjusting mechanism 53 and a fourth adjusting mechanism 54. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are arranged around the carrier plate 20 and are respectively arranged on the four sides of the carrier plate 20. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to adjust the wafer on the carrier plate 20. The leveling module 40 can drive the wafer to move in the opposite direction of the first direction D1, so as to place the wafer flat on the carrier plate 20, thereby ensuring the flatness of the wafer and facilitating pre-alignment positioning, code scanning and other operations on the wafer; the adjustment module 50 can adjust the wafer on the carrier plate 20 to center the large-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transportation and inspection of the wafer.

[0041] It should be noted that, in this embodiment, during the process of the wafer inspection device 1000 inspecting the wafer, when the transport structure 200 transports the wafer to the suction and leveling structure 100, the overall working process of the suction and leveling structure 100 is as follows.

[0042] First, the lifting and rotating module 30 moves from the first position to the second position along the first direction D1. The lifting and rotating module 30 is used to absorb and carry the wafer. Figure 6 and Figure 7 As shown, Figure 6 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 1 , Figure 7 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 2 .

[0043] Specifically, the lifting mechanism 31 of the lifting and rotating module 30 moves along the first direction D1 and drives the rotating mechanism 32 to move, so that the rotating mechanism 32 on the lifting mechanism 31 can move to the bottom of the wafer and receive and adsorb the wafer.

[0044] For further information, please refer to Figure 5 In this embodiment, the lifting mechanism 31 includes a lifting fixed plate 311, a lifting motor 312, a lifting guide rail 313 and a sliding seat 314. The lifting fixed plate 311 is arranged on the side of the bottom plate 10 away from the carrying plate 20. The lifting guide rail 313 is extended along the first direction D1 and arranged on the lifting fixed plate 311. The sliding seat 314 is arranged on the lifting guide rail 313 and can reciprocate along the first direction D1 relative to the lifting guide rail 313. The output shaft of the lifting motor 312 is connected to the sliding seat 314 and drives the sliding seat 314 to reciprocate along the first direction D1. In addition, the rotating mechanism 32 is arranged on the sliding seat 314 and moves back and forth along the first direction D1 following the sliding seat 314.

[0045] The first position and the second position of the lifting and rotating module 30 include but are not limited to the first position and the second position of the sliding seat 314 or the rotating mechanism 32, and the lifting and rotating module 30 moves from the first position to the second position along the first direction D1, including but not limited to the sliding seat 314 or the rotating mechanism 32 moving from the first position to the second position along the first direction D1. Further, the sliding seat 314 is provided with a lifting sensor sheet 315, and the lifting sensor sheet 315 can move along the first direction D1 with the sliding seat 314, and the lifting fixed plate 311 is provided with a first position detector 316 and a second position detector 317 at intervals. When the lifting and rotating module 30 is in the first position, the sliding seat 314 is in the first position, and the lifting sensor sheet 315 on the sliding seat 314 corresponds to and triggers the detection of the first position detector 316, and the first position detector 316 outputs a corresponding detection signal to the controller so that the controller can perform subsequent control or prompt the user that the position of the rotating mechanism 32 is the first position at this time. When the sliding seat 314 and the rotating mechanism 32 of the lifting and rotating module 30 move from the first position to the second position along the first direction D1, the lifting and rotating sensor plate 315 on the sliding seat 314 corresponds to and triggers the detection of the second position detector 317, and the second position detector 317 outputs a corresponding detection signal to the controller so that the controller can perform subsequent control or prompt the user that the position of the rotating mechanism 32 is the second position at this time.

[0046] Second, the lifting and rotating module 30 moves to a third position along the opposite direction of the first direction D1.

[0047] Among them, the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, including but not limited to representing the third position of the sliding seat 314 or the rotating mechanism 32, and the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, including but not limited to representing the sliding seat 314 or the rotating mechanism 32 moves to the third position in the opposite direction of the first direction D1.

[0048] It should be noted that when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 is 4mm-6mm. Optionally, when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 can be 4.1mm, or 4.2mm, or 4.5mm, or 4.8mm, or 5.0mm, or 5.3mm, or 5.4mm, or 5.7mm, or 5.9mm, or 6mm, or other values ​​within 4mm-6mm.

[0049] The rotating mechanism 32 moves to the third position in the opposite direction of the first direction D1 to drive the wafer carried on the rotating mechanism 32 to move in the opposite direction of the first direction D1, so as to shorten the distance between the wafer and the supporting plate 20, thereby facilitating the subsequent leveling mechanism to rise and absorb the wafer.

[0050] It should be noted that, in the present embodiment, the first direction D1 is a vertically upward direction, and the opposite direction of the first direction D1 is a vertically downward direction, which is not limited in the present application.

[0051] Third, the suction module 40 moves along the first direction D1 to the first suction position, and the suction module 40 is used to suck the wafer on the lifting and rotating module 30. Specifically, the suction module 40 rises along the first direction D1 and abuts against the wafer, so that the suction module 40 can suck the wafer. Figure 8 and Fig. 9 As shown, Figure 8 This is a schematic diagram of a structure in which a lifting and rotating module is in a third position and a suction and leveling module is in a first suction and leveling position provided in an embodiment of the present application. Figure 1 , Fig. 9 This is a schematic diagram of a structure in which a lifting and rotating module is in a third position and a suction and leveling module is in a first suction and leveling position provided in an embodiment of the present application. Figure 2 .

[0052] Fourth, the suction leveling module 40 moves from the first suction leveling position to a second suction leveling position along the opposite direction of the first direction D1 to suction level the wafer on the carrier plate 20 .

[0053] Specifically, the suction leveling module 40 moves to the second suction leveling position in the opposite direction of the first direction D1 to place the wafer on the carrier plate 20. At this time, the suction leveling module 40 absorbs the four sides of the wafer, and then flattens the wafer relative to the carrier plate 20, so as to realize suction leveling of the wafer on the carrier plate 20. It should be noted that suction leveling of the wafer on the carrier plate 20, in other words, means flattening the wafer relative to the carrier plate 20, and in other words, means making the wafer as parallel as possible to the carrier plate 20, so as to improve the flatness of the wafer surface, and then facilitate the subsequent scanning device 300 to scan the pattern on the wafer to identify the type and size of the wafer and other characteristics.

[0054] Fifth, after the adjusting mechanism of the adjusting module 50 (including the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53, and the fourth adjusting mechanism 54) moves to the first adjusting position along the side close to the lifting and rotating module 30, the leveling module 40 releases the wafer, and the adjusting mechanism of the adjusting module 50 moves to the second adjusting position for adjusting the wafer.

[0055] After the adjusting mechanism of the adjusting module 50 moves to the first adjusting position along the side close to the lifting and rotating module 30, the leveling module 40 releases the wafer. Part of the structure of the adjusting mechanism can be used to prevent a large amount of warping around the wafer. The specific anti-warping structure is described in detail later, and this application does not impose any restrictions on this.

[0056] It should be noted that, in the present embodiment, the adjusting mechanism of the adjusting module 50 moves to the first adjusting position along the side close to the lifting and rotating module 30. In other words, the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 of the adjusting module 50 all move along the side close to the center of the supporting plate 20, and move to the point where the distance between the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 and the wafer is 3mm-5mm. In other words, the first adjusting position is the position where the distance between the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 and the wafer is 3mm-5mm. Optionally, the first setting position can be that the distance between the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53 and the fourth setting mechanism 54 and the wafer is 3mm, or 3.1mm, or 3.3mm, or 3.5mm, or 3.8mm, or 4.0mm, or 4.2mm, or 4.4mm, or 4.6mm, or 4.7mm, or 4.9mm, or other values ​​within 3mm-5mm.

[0057] After the suction and leveling module 40 releases the wafer, the adjustment mechanism of the adjustment module 50 moves to the second adjustment position and adjusts the wafer, so as to avoid the suction and leveling module 40 adsorbing the wafer and preventing the wafer from being adjusted when the adjustment mechanism adjusts the wafer.

[0058] It should be noted that, in the present embodiment, the adjusting mechanism of the adjusting module 50 moves to the second adjusting position along the side close to the lifting and rotating module 30. In other words, the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 of the adjusting module 50 all move along the side close to the center of the supporting plate 20, and move until the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 abut against the wafer. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are respectively arranged around the wafer and abut against the wafer to limit the wafer to the adjusting space formed by the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 to achieve the adjustment of the wafer.

[0059] Please refer to Figures 2 to 9In one embodiment, the setting module 50 further includes a setting drive mechanism 60. The setting drive mechanism 60 is used to drive the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53 and the fourth setting mechanism 54 to move along the side close to the center of the carrier plate 20. Optionally, the specific structure of the setting drive mechanism 60 will be described in detail later, and the present application does not limit this.

[0060] Specifically, the setting drive mechanism 60 is connected to the first setting mechanism 51, and is used to drive the first setting mechanism 51 to move along the second direction D2 (the second direction D2 is as shown in FIG. Figure 4 The first adjusting mechanism 51 moves along the second direction D2 to move along the side close to the center of the carrier plate 20, and the first adjusting mechanism 51 moves along the opposite direction of the second direction D2 to move along the side away from the center of the carrier plate 20.

[0061] The setting drive mechanism 60 is connected to the second setting mechanism 52, and is used to drive the second setting mechanism 52 to move along the third direction D3 (the third direction D3 is as shown in FIG. Figure 4 The movement of the second adjusting mechanism 52 along the third direction D3 is to move along the side close to the center of the carrier plate 20, and the movement of the second adjusting mechanism 52 along the opposite direction of the third direction D3 is to move along the side away from the center of the carrier plate 20.

[0062] The setting drive mechanism 60 is connected to the third setting mechanism 53, and is used to drive the third setting mechanism 53 to move along the second direction D2 and the opposite direction thereof. The movement of the third setting mechanism 53 in the opposite direction of the second direction D2 is to move along the side close to the center of the carrier plate 20, and the movement of the third setting mechanism 53 in the second direction D2 is to move along the side away from the center of the carrier plate 20.

[0063] The adjustment drive mechanism 60 is connected to the fourth adjustment mechanism 54, and is used to drive the fourth adjustment mechanism 54 to move along the third direction D3 and the opposite direction thereof, wherein the movement of the fourth adjustment mechanism 54 along the opposite direction of the third direction D3 is to move along the side close to the center of the supporting plate 20, and the movement of the fourth adjustment mechanism 54 along the third direction D3 is to move along the side away from the center of the supporting plate 20.

[0064] It should be further explained that, in this embodiment, the second direction D2 is perpendicular to the third direction D3, and the second direction D2 and the third direction D3 are both perpendicular to the first direction D1.

[0065] Furthermore, in one embodiment, the adjustment module 50 also includes a fifth adjustment mechanism 55 and a sixth adjustment mechanism 56, the first adjustment mechanism 51 and the fifth adjustment mechanism 55 are arranged at intervals along the third direction D3, and the third adjustment mechanism 53 and the sixth adjustment mechanism 56 are arranged at intervals along the third direction D3.

[0066] It should be noted that the fifth adjusting mechanism 55 and the first adjusting mechanism 51 have the same moving direction. In other words, when the first adjusting mechanism 51 moves along the side close to the center of the carrier plate 20 (the second direction D2) to adjust the wafer, the fifth adjusting mechanism 55 also moves along the side close to the center of the carrier plate 20 (the second direction D2) to adjust the wafer. The first adjusting mechanism 51 and the fifth adjusting mechanism 55 can be used to adjust the opposite ends of one side of the wafer, which can further avoid the phenomenon of tilting of one side of the wafer, so as to improve the accuracy and stability of the adjustment module 50 for the wafer.

[0067] The third adjusting mechanism 53 and the sixth adjusting mechanism 56 have the same moving direction. In other words, when the third adjusting mechanism 53 moves along the side close to the center of the carrier plate 20 (the opposite direction of the second direction D2) to adjust the wafer, the sixth adjusting mechanism 56 also moves along the side close to the center of the carrier plate 20 (the opposite direction of the second direction D2) to adjust the wafer. The third adjusting mechanism 53 and the sixth adjusting mechanism 56 can be used to adjust the opposite ends of the other side of the wafer, which can further avoid the other side of the wafer from tilting, etc., so as to improve the accuracy and stability of the adjustment module 50 for the wafer.

[0068] Please refer to Figures 10 to 12 , Fig.10 is a structural schematic diagram of a setting drive mechanism and a guide rail assembly provided in an embodiment of the present application, Fig.11 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 1 , Fig.12 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 2 .

[0069] The adjustment module 50 further includes a guide rail assembly, which includes a first guide rail 71, a second guide rail 72, and a third guide rail 73. The first guide rail 71 and the third guide rail 73 extend along the second direction D2 and are arranged at intervals along the third direction D3. The second guide rail 72 extends along the third direction D3. Further, as shown in the figure, the first guide rail 71, the second guide rail 72, and the third guide rail 73 are arranged in sequence along the clockwise direction.

[0070] Among them, the first adjusting mechanism 51 and the third adjusting mechanism 53 are slidably connected to the first guide rail 71, and the first adjusting mechanism 51 and the third adjusting mechanism 53 are slidably connected to the two ends of the first guide rail 71 respectively, and the first adjusting mechanism 51 and the third adjusting mechanism 53 are used to move along the first guide rail 71 toward the second direction D2 and the opposite direction.

[0071] The fifth adjusting mechanism 55 and the sixth adjusting mechanism 56 are slidably connected to the third guide rail 73, and the fifth adjusting mechanism 55 and the sixth adjusting mechanism 56 are slidably connected to the two ends of the third guide rail 73 respectively, and the fifth adjusting mechanism 55 and the sixth adjusting mechanism 56 are used to move along the second guide rail 72 toward the second direction D2 and the opposite direction.

[0072] The second adjusting mechanism 52 and the fourth adjusting mechanism 54 are slidably connected to the second guide rail 72, and the second adjusting mechanism 52 and the fourth adjusting mechanism 54 are slidably connected to the two ends of the second guide rail 72 respectively, and the second adjusting mechanism 52 and the fourth adjusting mechanism 54 are used to move along the second guide rail 72 toward the third direction D3 and the opposite direction.

[0073] In one embodiment, the setting drive mechanism 60 includes a setting drive motor 61 and a conveyor belt assembly 62, wherein the setting drive motor 61 is connected to the conveyor belt assembly 62 and is used to drive the conveyor belt assembly 62 to move. In this embodiment, the setting drive motor 61 is a rotary motor, and the output shaft of the setting drive motor 61 is connected to the conveyor belt assembly 62 to drive the conveyor belt assembly 62 to transport.

[0074] The conveyor belt assembly 62 includes an outer conveyor belt 621 and an inner conveyor belt 622, wherein the outer conveyor belt 621 and the inner conveyor belt 622 are connected, and the conveying directions of the outer conveyor belt 621 and the inner conveyor belt 622 are opposite. Furthermore, in this embodiment, the inner conveyor belt 622 and the conveyor belt are perpendicular to the bottom plate 10, so that the output shaft of the setting drive motor 61 is inserted between the outer conveyor belt 621 and the inner conveyor belt 622 and connected to the outer conveyor belt 621 and the inner conveyor belt 622 respectively, so as to drive the conveyor belt and the outer conveyor belt 621 to move in opposite directions.

[0075] In this embodiment, the outer conveyor belt 621 and the inner conveyor belt 622 are in a concave shape. Specifically, the outer conveyor belt 621 includes a first conveyor portion 6211, a second conveyor portion 6212 and a third conveyor portion 6213 connected in sequence. Fig.10As shown, in this embodiment, the first conveying part 6211, the second conveying part 6212 and the third conveying part 6213 are sequentially connected in a clockwise direction. The inner conveyor belt 622 includes a fourth conveying part 6221, a fifth conveying part 6222 and a sixth conveying part 6223 which are sequentially connected. Fig.10 As shown, in this embodiment, the fourth conveying part 6221, the fifth conveying part 6222 and the sixth conveying part 6223 are sequentially connected in a clockwise direction.

[0076] Further, in the present embodiment, the first conveying portion 6211, the third conveying portion 6213, the fourth conveying portion 6221, and the sixth conveying portion 6223 extend along the second direction D2, and the second conveying portion 6212 and the fifth conveying portion 6222 extend along the third direction D3, so that the first conveying portion 6211, the second conveying portion 6212, the third conveying portion 6213, the fourth conveying portion 6221, the fifth conveying portion 6222, and the sixth conveying portion 6223 form an inverted "concave" shape, as shown in FIG. Fig.10 shown.

[0077] Further, in this embodiment, the first conveying part 6211 and the fourth conveying part 6221 are correspondingly arranged and move in opposite directions, the second conveying part 6212 and the fifth conveying part 6222 are correspondingly arranged and move in opposite directions, and the third conveying part 6213 and the sixth conveying part 6223 are correspondingly arranged and move in opposite directions.

[0078] Further, in this embodiment, the first setting mechanism 51 is connected to the first conveying part 6211, the third setting mechanism 53 is connected to the fourth conveying part 6221, and the first setting mechanism 51 and the third setting mechanism 53 move in opposite directions. The second setting mechanism 52 is connected to the second conveying part 6212, the fourth setting mechanism 54 is connected to the fifth conveying part 6222, and the second setting mechanism 52 and the fourth setting mechanism 54 move in opposite directions; the fifth setting mechanism 55 is connected to the third conveying part 6213, the sixth setting mechanism 56 is connected to the sixth conveying part 6223, and the fifth setting mechanism 55 and the sixth setting mechanism 56 move in opposite directions.

[0079] It should be noted that, in the present embodiment, the outer conveyor belt 621 is located on the side away from the center of the carrier plate 20 relative to the inner conveyor belt 622, and the guide rail assembly is located on the side close to the center of the carrier plate 20 relative to the inner conveyor belt 622. In other words, the first conveyor portion 6211, the fourth conveyor portion 6221, and the first guide rail 71 are sequentially arranged along the direction close to the center of the carrier plate 20, the second conveyor portion 6212, the fifth conveyor portion 6222, and the second guide rail 72 are sequentially arranged along the direction close to the center of the carrier plate 20, and the third conveyor portion 6213, the sixth conveyor portion 6223, and the third guide rail 73 are sequentially arranged along the direction close to the center of the carrier plate 20.

[0080] Further, in the present embodiment, the conveyor belt assembly 62 also includes a first transmission wheel 623, a second transmission wheel 624, a third transmission wheel 625, a fourth transmission wheel 626, a first tensioning wheel 627 and a second tensioning wheel 628, the first transmission wheel 623 is connected to the output shaft of the setting drive motor 61, the first transmission wheel 623, the second transmission wheel 624, the third transmission wheel 625 and the fourth transmission wheel 626 are respectively arranged at the four ends of the carrying plate 20, the second transmission wheel 624 is respectively connected to the second transmission part 6212 and the third transmission part 6213, the third transmission wheel 625 is respectively connected to the first transmission part 6211 and the second transmission part 6212, the fourth transmission wheel 626 is arranged between the first transmission part 6211 and the fourth transmission part 6221, the second tensioning wheel 628 is respectively connected to the fourth transmission part 6221 and the fifth transmission part 6222, and the first tensioning wheel 627 is respectively connected to the fifth transmission part 6222 and the sixth transmission part 6223.

[0081] Furthermore, in this embodiment, the conveyor belt assembly 62 also includes a tensioning block 629, the fourth conveying wheel 626 is arranged on the tensioning block 629, the tensioning block 629 is connected to the supporting plate 20 through a waist-shaped groove, and the tensioning block 629 can be fine-tuned along the second direction D2 or the opposite direction of the second direction D2 to tension the outer conveyor belt 621 and the inner conveyor belt 622 of the conveyor belt assembly 62.

[0082] Please refer to Figures 10 to 16 , Fig.13 is a structural schematic diagram of a setting module in an initial position provided by an embodiment of the present application, Fig.14 is a structural schematic diagram of a setting module in a retracted state provided by an embodiment of the present application, Fig.15 is a structural schematic diagram of a setting module in a final setting position provided by an embodiment of the present application, Fig.16It is a structural schematic diagram of a setting module in an open state provided by an embodiment of the present application.

[0083] In one embodiment, the adjustment module includes an initial position and a final adjustment position, and the adjustment module 50 includes a retracted state and an open state. Specifically, when the adjustment module 50 is in the retracted state, the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55, and the sixth adjustment mechanism 56 of the adjustment module 50 all move along the side close to the center of the carrier plate 20; when the adjustment module 50 is in the open state, the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55, and the sixth adjustment mechanism 56 of the adjustment module 50 all move along the side away from the center of the carrier plate 20.

[0084] For further information, please refer to Fig.10 and Fig.14 When the setting module 50 is in the retracted state, the setting drive motor 61 rotates clockwise, in other words, the output shaft of the setting drive motor 61 rotates clockwise. The inner conveyor belt 622 moves counterclockwise, and the outer conveyor belt 621 moves clockwise. The first conveying portion 6211 drives the first setting mechanism 51 to move along the second direction D2, the second conveying portion 6212 drives the second setting mechanism 52 to move in the opposite direction of the third direction D3, the third conveying portion 6213 drives the sixth setting mechanism 56 to move in the opposite direction of the second direction D2, the fourth conveying portion 6221 drives the third setting mechanism 53 to move in the opposite direction of the second direction D2, the fifth conveying portion 6222 drives the fourth setting mechanism 54 to move along the third direction D3, and the sixth conveying portion 6223 drives the fifth setting mechanism 55 to move along the second direction D2.

[0085] Please refer to Fig.10 and Fig.16When the setting module 50 is in the open state, the setting drive motor 61 rotates counterclockwise, in other words, the output shaft of the setting drive motor 61 rotates counterclockwise. The inner conveyor belt 622 moves clockwise, and the outer conveyor belt 621 moves counterclockwise. The first conveying part 6211 drives the first setting mechanism 51 to move in the opposite direction of the second direction D2, the second conveying part 6212 drives the second setting mechanism 52 to move in the third direction D3, the third conveying part 6213 drives the sixth setting mechanism 56 to move in the second direction D2, the fourth conveying part 6221 drives the third setting mechanism 53 to move in the second direction D2, the fifth conveying part 6222 drives the fourth setting mechanism 54 to move in the opposite direction of the third direction D3, and the sixth conveying part 6223 drives the fifth setting mechanism 55 to move in the opposite direction of the second direction D2.

[0086] It should be noted that, in the present embodiment, when the adjustment module 50 is in a retracted state, the adjustment drive mechanism 60 can drive the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55 and the sixth adjustment mechanism 56 to move synchronously along the side close to the center of the supporting plate 20; when the adjustment module 50 is in an extended state, the adjustment drive mechanism 60 can drive the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55 and the sixth adjustment mechanism 56 to move synchronously along the side away from the center of the supporting plate 20.

[0087] It should be noted that for ease of description, please refer to Figures 1 to 17 , Fig.17 It is a structural schematic diagram of a square wafer provided in an embodiment of the present application. When the wafer is a square wafer, the four sides of the wafer are named as the first side 91, the second side 92, the third side 93 and the fourth side 94 of the wafer, respectively, and the first side 91, the second side 92, the third side 93 and the fourth side 94 are arranged in sequence in a clockwise direction. The first adjusting mechanism 51 and the fifth adjusting mechanism 55 are used to abut the first side 91 of the wafer, the second adjusting mechanism 52 is used to abut the second side 92 of the wafer, the third adjusting mechanism 53 and the sixth adjusting mechanism 56 are used to abut the third side 93 of the wafer, and the fourth adjusting mechanism 54 is used to abut the fourth side 94 of the wafer.

[0088] Please refer to Fig.11 and Fig.12 , Fig.18 and Fig.19 , Fig.18This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 3 , Fig.19 This is a partial structural diagram of a setting module provided in the embodiment of the present application. Figure 4 .

[0089] In one embodiment, the first adjusting mechanism 51 includes a first connecting member 511, a first pressure plate 512, a first adjusting block 513, a second adjusting block 514, a first guide rod 515 and a second guide rod 516, the first connecting member 511 is connected to the first guide rail 71, the first pressure plate 512 is respectively connected to the first connecting member 511 and the first conveying part 6211, the first adjusting block 513 and the second adjusting block 514 are arranged on the first connecting member 511, and the first adjusting block 513 and the second adjusting block 514 are arranged in sequence along the third direction D3, the first guide rod 515 is arranged on the first adjusting block 513, the second guide rod 516 is arranged on the second adjusting block 514, and the first guide rod 515 and the second guide rod 516 are used to abut and limit the wafer.

[0090] Specifically, in this embodiment, the first connecting member 511 is arranged on the first guide rail 71 and extends in the opposite direction of the second direction D2, the first pressure plate 512 extends in the opposite direction of the third direction D3 and is connected to the first conveying part 6211, and the first conveying part 6211 drives the first connecting member 511 to move in the second direction D2 or in the opposite direction of the second direction D2 through the first pressure plate 512.

[0091] The first adjustment block 513 and the second adjustment block 514 are arranged on the first connecting member 511, and the first adjustment block 513 and the second adjustment block 514 are provided with a first waist-shaped hole, and the first adjustment block 513 and the second adjustment block 514 are fixedly connected to the first connecting member 511 through the first waist-shaped hole. The first waist-shaped hole is extended along the second direction D2, and the first adjustment block 513 and the second adjustment block 514 can be fine-tuned and moved relative to the first connecting member 511 along the second direction D2 and the opposite direction through the first waist-shaped hole, so that the first guide rod 515 on the first adjustment block 513 and the second guide rod 516 on the second adjustment block 514 can effectively abut and adjust the first edge 91 of the wafer.

[0092] The first guide rod 515 and the second guide rod 516 are used to abut and limit the first edge 91 of the wafer. Fig. 20 , Fig. 20: is a schematic diagram of the structure of a first guide rod provided in an embodiment of the present application. Further, in one embodiment, the first guide rod 515 includes a main body 5151, an arc-shaped transition portion 5152 and an extension portion 5153, the radial dimension of the extension portion 5153 is larger than the main body 5151, and the radial dimension of the arc-shaped transition portion 5152 gradually increases from the main body 5151 to the extension portion 5153.

[0093] The radial dimension of the extension portion 5153 is larger than that of the main body portion 5151, and the extension portion 5153 can be used to limit the large warping of the first edge 91 of the wafer, so as to achieve the adjustment of the wafer of the opposite piece. In addition, the radial dimension of the arc-shaped transition portion 5152 gradually increases from the main body portion 5151 to the extension portion 5153, and the arc-shaped transition portion 5152 can be used to buffer the warping of the first edge 91 of the wafer, so as to avoid the problem of the edge of the wafer directly hitting the extension portion 5153 and causing damage when the edge of the wafer is warped, thereby improving the safety and reliability of the adjustment module 50 in adjusting the wafer.

[0094] It should be noted that, in the present embodiment, the shape of the second guide rod 516 is similar to the shape of the first guide rod 515 , which will not be elaborated herein and should not be construed as a limitation to the present application.

[0095] Please refer to Fig.11 and Fig.12 , Fig.18 and Fig.19 In one embodiment, the second adjusting mechanism 52 includes a second connecting member 521, a second pressure plate 522, a third adjustment block 523, a third guide rod 524 and a fourth guide rod 525, the second connecting member 521 is connected to the second guide rail 72, the second pressure plate 522 is respectively connected to the second connecting member 521 and the second conveying part 6212, the third adjustment block 523 is arranged on the second connecting member 521, the third guide rod 524 and the fourth guide rod 525 are arranged on the third adjustment block 523 at intervals along the second direction D2, and the third guide rod 524 and the fourth guide rod 525 are used to abut and limit the second edge 92 of the wafer.

[0096] The second connecting member 521 is arranged on the second guide rail 72. Specifically, in the present embodiment, the second pressing plate 522 includes a bending portion, which passes over the fourth conveying portion 6221 and connects the second conveying portion 6212, so that the second conveying portion 6212 drives the second connecting member 521 to move along the third direction D3 or in the opposite direction of the third direction D3 through the second pressing plate 522. Further, the second connecting member 521 includes a first connecting portion and a second connecting portion which are vertically connected, the first connecting portion connects the second guide rail 72 and extends in the opposite direction of the second direction D2, the second connecting portion extends in the opposite direction of the third direction D3, the third adjusting block 523 is arranged on the end of the second connecting portion away from the first connecting portion, the third guide rod 524 and the fourth guide rod 525 are arranged on the third adjusting block 523 and are used to abut the second edge 92 of the wafer.

[0097] The third adjustment block 523 is disposed on the second connecting member 521, and the third adjustment block 523 is provided with a second waist-shaped hole, and the third adjustment block 523 is fixedly connected to the second connecting member 521 through the second waist-shaped hole. The second waist-shaped hole is extended along the third direction D3, and the third adjustment block 523 can be fine-tuned relative to the second connecting member 521 along the third direction D3 and the opposite direction through the second waist-shaped hole, so that the third guide rod 524 and the fourth guide rod 525 on the third adjustment block 523 can effectively abut and adjust the second side 92 of the wafer.

[0098] The third guide rod 524 and the fourth guide rod 525 can be used to abut the second side 92 of the wafer, and the third guide rod 524 and the fourth guide rod 525 can be used to limit the second side 92 of the wafer from causing a large warping. It should be noted that the shapes of the third guide rod 524 and the fourth guide rod 525 are similar to the shape of the first guide rod 515 mentioned above, and the present application will not repeat them here and should not be understood as a limitation on the present application.

[0099] In one embodiment, the third adjusting mechanism 53 includes a third connecting member 531, a third pressure plate 532, a fourth adjusting block 533, the fifth adjusting block 534, a fifth guide rod 535 and a sixth guide rod 536, the third connecting member 531 is connected to the first guide rail 71, the third pressure plate 532 is respectively connected to the third connecting member 531 and the fourth conveying part 6221, the fourth adjustment block 533 and the fifth adjustment block 534 are arranged on the third pressure plate 532 along the third direction D3, the fifth guide rod 535 is arranged on the fourth adjustment block 533, the sixth guide rod 536 is arranged on the fifth adjustment block 534, and the fifth guide rod 535 and the sixth guide rod 536 are used to abut and limit the third edge 93 of the wafer.

[0100] Specifically, in this embodiment, the third pressing plate 532 extends along the second direction D2, and the fourth conveying portion 6221 drives the third connecting member 531 to move along the second direction D2 or the opposite direction of the second direction D2 on the first guide rail 71 through the third pressing plate 532.

[0101] The fourth adjustment block 533 and the fifth adjustment block 534 are arranged on the third pressing plate 532 along the third direction D3, and the fourth adjustment block 533 and the fifth adjustment block 534 are provided with a third waist-shaped hole, and the fourth adjustment block 533 and the fifth adjustment block 534 are fixedly connected to the third pressing plate 532 through the third waist-shaped hole. The third waist-shaped hole is extended along the second direction D2, and the fourth adjustment block 533 and the fifth adjustment block 534 can be fine-tuned and moved relative to the third pressing plate 532 along the second direction D2 and the opposite direction through the third waist-shaped hole, so that the fifth guide rod 535 on the fourth adjustment block 533 and the sixth guide rod 536 on the fifth adjustment block 534 can effectively abut and adjust the third edge 93 of the wafer.

[0102] The fifth guide rod 535 and the sixth guide rod 536 can be used to abut the third side 93 of the wafer, and the fifth guide rod 535 and the sixth guide rod 536 can be used to limit the third side 93 of the wafer from causing a large warping. It should be noted that the shapes of the fifth guide rod 535 and the sixth guide rod 536 are similar to the shape of the first guide rod 515 mentioned above, and the present application will not repeat them here and it should not be understood as a limitation on the present application.

[0103] In one embodiment, the fourth adjusting mechanism 54 includes a fourth connecting member 541, a fourth pressure plate 542, a sixth adjustment block 543, a seventh guide rod 544 and an eighth guide rod 545, the fourth connecting member 541 is connected to the second guide rail 72, the fourth pressure plate 542 is respectively connected to the fourth connecting member 541 and the fifth conveying part 6222, the sixth adjustment block 543 is arranged on the fourth connecting member 541, the seventh guide rod 544 and the eighth guide rod 545 are arranged on the sixth adjustment block 543 at intervals along the second direction D2, and the seventh guide rod 544 and the eighth guide rod 545 are used to abut and limit the fourth edge 94 of the wafer.

[0104] The fourth connecting member 541 is arranged on the second guide rail 72. Specifically, in the present embodiment, the fifth conveying part 6222 drives the fourth connecting member 541 to move along the third direction D3 or in the opposite direction of the third direction D3 through the fourth pressing plate 542. Further, the fourth connecting member 541 includes a third connecting part and a fourth connecting part which are vertically connected. The third connecting part is connected to the second guide rail 72 and extends in the opposite direction of the second direction D2. The fourth connecting part extends along the third direction D3. The sixth adjusting block 543 is arranged on the end of the fourth connecting part away from the third connecting part. The seventh guide rod 544 and the eighth guide rod 545 are arranged on the sixth adjusting block 543 and are used to abut against the fourth edge 94 of the wafer.

[0105] The sixth adjustment block 543 is disposed on the fourth connecting member 541, and the sixth adjustment block 543 is provided with a fourth waist-shaped hole, and the sixth adjustment block 543 is fixedly connected to the fourth connecting member 541 through the fourth waist-shaped hole. The fourth waist-shaped hole is extended along the third direction D3, and the sixth adjustment block 543 can be fine-tuned relative to the fourth connecting member 541 along the third direction D3 and the opposite direction through the fourth waist-shaped hole, so that the seventh guide rod 544 and the eighth guide rod 545 on the sixth adjustment block 543 can effectively abut and adjust the fourth side 94 of the wafer.

[0106] The seventh guide rod 544 and the eighth guide rod 545 can be used to abut the fourth side 94 of the wafer, and the seventh guide rod 544 and the eighth guide rod 545 can be used to limit the fourth side 94 of the wafer from causing a large warping. It should be noted that the shapes of the seventh guide rod 544 and the eighth guide rod 545 are similar to the shape of the first guide rod 515 mentioned above, and the present application will not repeat them here and it should not be understood as a limitation on the present application.

[0107] In one embodiment, the fifth adjusting mechanism 55 includes a fifth connecting member 551, a fifth pressure plate 552, a seventh adjustment block 553, an eighth adjustment block 554, a ninth guide rod 555 and a tenth guide rod 556, the fifth connecting member 551 is connected to the third guide rail 73, the fifth pressure plate 552 is respectively connected to the fifth connecting member 551 and the sixth conveying part 6223, the seventh adjustment block 553 and the eighth adjustment block 554 are arranged on the fifth connecting member 551, and the seventh adjustment block 553 and the eighth adjustment block 554 are arranged in sequence along the third direction D3, the ninth guide rod 555 is arranged on the seventh adjustment block 553, the tenth guide rod 556 is arranged on the eighth adjustment block 554, and the ninth guide rod 555 and the tenth guide rod 556 are used to abut and limit the first edge 91 of the wafer.

[0108] Specifically, in this embodiment, the fifth connecting member 551 is disposed on the third guide rail 73 and extends in the opposite direction of the second direction D2, and the sixth conveying portion 6223 drives the fifth connecting member 551 to move in the second direction D2 or in the opposite direction of the second direction D2 through the fifth pressure plate 552.

[0109] The seventh adjustment block 553 and the eighth adjustment block 554 are arranged on the fifth connecting member 551, and the seventh adjustment block 553 and the eighth adjustment block 554 are provided with a fifth waist-shaped hole, and the seventh adjustment block 553 and the eighth adjustment block 554 are fixedly connected to the fifth connecting member 551 through the fifth waist-shaped hole. The fifth waist-shaped hole is extended along the second direction D2, and the seventh adjustment block 553 and the eighth adjustment block 554 can be fine-tuned and moved relative to the fifth connecting member 551 along the second direction D2 and the opposite direction through the fifth waist-shaped hole, so that the ninth guide rod 555 on the seventh adjustment block 553 and the tenth guide rod 556 on the eighth adjustment block 554 can effectively abut and adjust the first edge 91 of the wafer.

[0110] The ninth guide rod 555 and the tenth guide rod 556 can be used to abut the first side 91 of the wafer, and the ninth guide rod 555 and the tenth guide rod 556 can be used to limit the first side 91 of the wafer from causing a large warping. It should be noted that the shapes of the ninth guide rod 555 and the tenth guide rod 556 are similar to the shape of the first guide rod 515 mentioned above, and the present application will not repeat them here and should not be understood as a limitation on the present application.

[0111] In one embodiment, the sixth adjusting mechanism 56 includes a sixth connecting member 561, a sixth pressure plate 562, a ninth adjusting block 563, the tenth adjusting block 564, an eleventh guide rod 565 and a twelfth guide rod 566, the sixth connecting member 561 is connected to the third guide rail 73, the sixth pressure plate 562 is respectively connected to the sixth connecting member 561 and the third conveying part 6213, the ninth adjusting block 563 and the tenth adjusting block 564 are arranged on the sixth pressure plate 562 along the third direction D3, the eleventh guide rod 565 is arranged on the ninth adjusting block 563, the twelfth guide rod 566 is arranged on the tenth adjusting block 564, and the eleventh guide rod 565 and the twelfth guide rod 566 are used to abut and limit the fourth edge 94 of the wafer.

[0112] Specifically, in this embodiment, the sixth pressure plate 562 includes a first extension plate and a second extension plate that are perpendicular to each other, the first extension plate extends along the second direction D2, the second extension plate extends along the third direction D3 and crosses the sixth conveying part 6223 and then connects to the third conveying part 6213, and the third conveying part 6213 drives the sixth connecting member 561 to move along the second direction D2 or in the opposite direction of the second direction D2 on the third guide rail 73 through the sixth pressure plate 562.

[0113] The ninth adjustment block 563 and the tenth adjustment block 564 are arranged on the first extension plate of the sixth pressing plate 562 along the third direction D3, and the ninth adjustment block 563 and the tenth adjustment block 564 are provided with a sixth waist-shaped hole, and the ninth adjustment block 563 and the tenth adjustment block 564 are fixedly connected to the sixth pressing plate 562 through the sixth waist-shaped hole. The sixth waist-shaped hole is extended along the third direction D3, and the ninth adjustment block 563 and the tenth adjustment block 564 can be fine-tuned and moved relative to the sixth pressing plate 562 along the second direction D2 and the opposite direction through the sixth waist-shaped hole, so that the eleventh guide rod 565 on the ninth adjustment block 563 and the twelfth guide rod 566 on the tenth adjustment block 564 can effectively abut and adjust the fourth side 94 of the wafer.

[0114] The eleventh guide rod 565 and the twelfth guide rod 566 can be used to abut the fourth side 94 of the wafer, and the eleventh guide rod 565 and the twelfth guide rod 566 can be used to limit the fourth side 94 of the wafer from causing a large warping. It should be noted that the shapes of the eleventh guide rod 565 and the twelfth guide rod 566 are similar to the shape of the first guide rod 515 mentioned above, and the present application will not elaborate on them here and should not be construed as a limitation on the present application.

[0115] Please also refer to Fig.21 , Fig.21 yes Fig.18 An enlarged schematic diagram of area A in the middle. In this embodiment, a sensor assembly is further provided on the carrier plate 20, and the sensor assembly can be used to detect the specific position of the adjustment mechanism of the adjustment module 50 (including the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55, and the sixth adjustment mechanism 56).

[0116] Specifically, the sensor assembly includes a mounting rail 81, a first sensor 82, and a second sensor 83, wherein the first sensor 82 and the second sensor 83 are arranged on the mounting rail 81. In the present embodiment, the sensor assembly is arranged corresponding to the sixth setting mechanism 56, that is, the sixth setting mechanism 56 is provided with a setting sensor sheet 567, and the setting sensor sheet 567 can move along the second direction D2 or the opposite direction of the second direction D2 with the sixth setting mechanism 56. Specifically, in the present embodiment, when the setting sensor sheet 567 is arranged corresponding to the first sensor 82, the setting module 50 is in the initial position at this time, in other words, the setting mechanism of the setting module 50 does not move. When the setting sensor sheet 567 is arranged corresponding to the second sensor 83, the setting module 50 is in the final setting position at this time, in other words, the setting mechanism of the setting module 50 moves to a position where it cannot move along the side close to the lifting and rotating module 30.

[0117] In other embodiments, the sensor assembly may further include a third sensor and a fourth sensor, and the third sensor and the fourth sensor are disposed between the first sensor 82 and the second sensor 83. When the setting sensing piece 567 is disposed corresponding to the third sensor, it means that the setting mechanism of the setting module 50 moves to the first setting position along the side close to the lifting and rotating module 30. When the setting sensing piece 567 is disposed corresponding to the fourth sensor, it means that the setting mechanism of the setting module 50 moves to the second setting position along the side close to the lifting and rotating module 30.

[0118] It should be noted that, in this embodiment, the sensor assembly is arranged corresponding to the sixth adjustment mechanism 56, but the first adjustment mechanism 51, the second adjustment mechanism 52, the third adjustment mechanism 53, the fourth adjustment mechanism 54, the fifth adjustment mechanism 55, and the sixth adjustment mechanism 56 in the adjustment module 50 are all synchronously expanded or contracted, so the movement positions of all the adjustment mechanisms in the adjustment module 50 can be determined according to the sensing signal of the sensor assembly. Optionally, in other embodiments, the sensor assembly can also be arranged corresponding to the first adjustment mechanism 51, or the second adjustment mechanism 52, or the third adjustment mechanism 53, or the fourth adjustment mechanism 54, or the fifth adjustment mechanism 55, and this application does not limit this.

[0119] Please refer to Figures 2 to 23 , Fig. 22 It is a structural schematic diagram of a setting module for setting a large-size wafer provided in an embodiment of the present application. Fig.23 1 is a schematic diagram of a structure of a setting module for setting a small-sized wafer provided in an embodiment of the present application. In this embodiment, when the shape of the wafer is a square piece, the setting module 50 can be used to set two wafers of different sizes.

[0120] It should be noted that, in the present embodiment, in the first adjusting mechanism 51, the first guide rod 515 is closer to the third adjusting mechanism 53 relative to the second guide rod 516; in the third adjusting mechanism 53, the fifth guide rod 535 is closer to the first adjusting mechanism 51 relative to the sixth guide rod 536; in the fifth adjusting mechanism 55, the tenth guide rod 556 is closer to the sixth adjusting mechanism 56 relative to the ninth guide rod 555; in the sixth adjusting mechanism 56, the twelfth guide rod 566 is closer to the fifth adjusting mechanism 55 relative to the eleventh guide rod 565.

[0121] The first guide rod 515, the fifth guide rod 535, the tenth guide rod 556, and the twelfth guide rod 566 are used to adjust the large-sized wafers, and the second guide rod 516, the sixth guide rod 536, the ninth guide rod 555, and the eleventh guide rod 565 are used to adjust the small-sized wafers.

[0122] Furthermore, in this embodiment, the suction leveling adjustment mechanism further includes a wafer detector 95, and the wafer detector 95 can be used to detect the shape of the wafer. When the shape of the wafer is a square piece, the adjustment module 50 is controlled to be adjusted, and when the shape of the wafer is an original piece, the adjustment module 50 does not need to be controlled to work. The suction leveling adjustment mechanism can be applied to square wafers and original wafers to improve the practicality and versatility of the suction leveling adjustment mechanism.

[0123] Please refer to Fig.24 , Fig.24 1 is a schematic diagram of a suction module provided in an embodiment of the present application. In this embodiment, the suction module 40 includes a first suction mechanism 41 and a second suction mechanism 42 arranged at intervals, and the first suction mechanism 41 and the second suction mechanism 42 are arranged on a side of the bottom plate 10 away from the carrier plate 20.

[0124] The first leveling mechanism 41 includes a first lifting cylinder 411, a first fixing assembly 412, a first leveling piece 413 and a second leveling piece 414. The first lifting cylinder 411 is used to drive the first fixing assembly 412 to move along the first direction D1. The first leveling piece 413 and the second leveling piece 414 are arranged at both ends of the first fixing assembly 412, and the first leveling piece 413 and the second leveling piece 414 pass through the bottom plate 10 and the supporting plate 20. The first leveling piece 413 and the second leveling piece 414 are used to absorb the wafer.

[0125] The second leveling mechanism 42 includes a second lifting cylinder 421, a second fixed component 422, a third leveling member 423 and a fourth leveling member 424. The second lifting cylinder 421 is used to drive the second fixed component 422 to move along the first direction D1. The third leveling member 423 and the fourth leveling member 424 are arranged at both ends of the second fixed component 422, and the third leveling member 423 and the fourth leveling member 424 pass through the bottom plate 10 and the supporting plate 20. The third leveling member 423 and the fourth leveling member 424 are used to absorb the wafer.

[0126] The first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 are respectively arranged around the supporting plate 20. The first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 can respectively absorb the four corners of the wafer to improve the absorption and leveling effect of the wafer.

[0127] It should be noted that, in the present embodiment, the suction cups 3223 of the first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 are corrugated suction cups, and further, in the present embodiment, when the suction module 40 moves to the second suction position, the heights of the first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 along the first direction D1 are slightly higher than the supporting plate 20, so that the first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 can effectively adsorb the wafer and suck the wafer flat on the supporting plate 20.

[0128] Please refer to Figure 2 , Fig.25 and Fig.26 , Fig.25 is a structural schematic diagram of a rotating mechanism provided in an embodiment of the present application, Fig.26 It is a structural schematic diagram of a suction cup assembly provided in an embodiment of the present application.

[0129] In this embodiment, the rotating mechanism 32 includes a rotating component 321 and a suction cup component 322. The rotating component 321 is arranged on the side of the base plate 10 away from the supporting plate 20. The rotating component 321 is used to drive the suction cup component 322 to rotate. The suction cup component 322 extends along the first direction D1 and passes through the base plate 10 and the supporting plate 20. The suction cup component 322 is used to carry and adsorb the wafer.

[0130] The suction cup assembly 322 includes a suction cup seat 3221, a suction cup body 3222 and multiple suction cups 3223. The suction cup seat 3221 and the suction cup body 3222 are connected to form an air suction channel connecting the multiple suction cups 3223. The suction cup body 3222 is provided with multiple receiving grooves, and the multiple receiving grooves are used to place the suction cups 3223. In the first direction D1, the height of the suction cup 3223 is higher than the height of the suction cup body 3222, so as to adsorb the wafer tightly against the suction cup body 3222.

[0131] Furthermore, it should be noted that, in the present embodiment, the plurality of suction cups 3223 of the suction cup assembly 322 are corrugated suction cups, and the height of the plurality of suction cups 3223 is higher than the height of the suction cup body 3222. When the plurality of suction cups 3223 adsorb the wafer, the plurality of suction cups 3223 will slightly move in the opposite direction of the first direction D1 due to the vacuum pressure, so as to fit the lower surface of the wafer to the suction cup body 3222, and to suck the wafer flat on the suction cup body 3222. It should be further noted that, in the present embodiment, when the suction cup 3223 adjustment structure is used to adjust the circular wafer, it is not necessary to control the adjustment module 40 to work, and the adjustment of the wafer can be achieved only by the suction cup assembly 322 of the rotating mechanism 32, and it is not necessary to control the adjustment module 50 to work, and the adjustment of the wafer can be achieved only by the rotation assembly 321 driving the suction cup assembly 322 to rotate.

[0132] Please refer to Figures 1 to 26 The present application also provides a wafer inspection device 1000, which includes a transport structure 200 and the suction and leveling structure 100, wherein the transport structure 200 is used to transport the wafer to the suction and leveling structure 100 or to remove the wafer on the suction and leveling structure 100.

[0133] Furthermore, the wafer inspection device 1000 also includes a code scanning device 300, and the code scanning device 300 is used to scan the wafer to identify the type of the wafer, so as to facilitate subsequent classification, inspection and other operations on the wafer.

[0134] In the wafer inspection device 1000 provided in the present application, the carrier plate 20 is arranged on the bottom plate 10 and is spaced apart from the bottom plate 10, the lifting and rotating module 30 is arranged on the bottom plate 10, and the lifting and rotating module 30 includes the rotating mechanism 32 and the lifting mechanism 31, the rotating mechanism 32 is used to carry the wafer and drive the wafer to rotate relative to the bottom plate 10, and the lifting mechanism 31 is used to carry the rotating mechanism 32 and drive the rotating mechanism 32 to reciprocate along the first direction D1. The suction leveling module 40 is arranged on the bottom plate 10, and the suction leveling module 40 at least partially penetrates the carrier plate 20 and the bottom plate 10, and the suction leveling module 40 is used to carry and suck the wafer flat, and the suction leveling module 40 can reciprocate along the first direction D1 to suck the wafer flat and arrange it on the carrier plate 20. The adjusting module 50 is arranged on the base plate 10, and the adjusting module 50 includes a first adjusting mechanism 51, a second adjusting mechanism 52, a third adjusting mechanism 53 and a fourth adjusting mechanism 54. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are arranged around the carrier plate 20 and are respectively arranged on the four sides of the carrier plate 20. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to adjust the wafer on the carrier plate 20. The leveling module 40 can drive the wafer to move in the opposite direction of the first direction D1, so as to place the wafer flat on the carrier plate 20, thereby ensuring the flatness of the wafer and facilitating pre-alignment positioning, code scanning and other operations on the wafer; the adjustment module 50 can adjust the wafer on the carrier plate 20 to center the large-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transportation and inspection of the wafer.

[0135] Please note that, please refer to Figures 1 to 27 , Fig. 27 It is a flow chart of a suction leveling method provided in an embodiment of the present application.

[0136] The present application also provides a suction leveling method, which is applied to the suction leveling structure 100. The suction leveling method includes steps S100, S200, S300, S400, S500, S600, S700, S800, and S900, and steps S100, S200, S300, S400, S500, S600, S700, S800, and S900 are described in detail as follows.

[0137] S100: Control the lifting and rotating module 30 to move from a first position to a second position along a first direction D1 to absorb and carry the wafer.

[0138] Specifically, the lifting mechanism 31 of the lifting and rotating module 30 moves along the first direction D1 and drives the rotating mechanism 32 to move, so that the rotating mechanism 32 on the lifting mechanism 31 can move to the bottom of the wafer and receive and adsorb the wafer.

[0139] S200: Control the lifting and rotating module 30 to move to a third position in the opposite direction of the first direction D1.

[0140] It should be noted that, when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 is about 5 mm.

[0141] The rotating mechanism 32 moves to the third position in the opposite direction of the first direction D1 to drive the wafer carried on the rotating mechanism 32 to move in the opposite direction of the first direction D1, so as to shorten the distance between the wafer and the supporting plate 20, thereby facilitating the subsequent leveling mechanism to rise and absorb the wafer.

[0142] S300 : Control the suction and leveling module 40 to move along the first direction D1 to a first suction and leveling position to absorb the wafer on the lifting and rotating module 30 .

[0143] Specifically, the suction module 40 rises along the first direction D1 and abuts against the wafer, so that the suction module 40 can absorb the wafer.

[0144] S400 : Control the lifting and rotating module 30 to move to the first position in the opposite direction of the first direction D1 after the leveling module 40 absorbs the wafer.

[0145] Specifically, the lifting and rotating module 30 descends in the opposite direction of the first direction and moves back to the initial position of the lifting and rotating module 30 .

[0146] S500 : Control the suction module 40 to move from the first suction position to a second suction position in the opposite direction of the first direction D1 , so as to suction and level the wafer on the carrier plate 20 .

[0147] Specifically, the suction module 40 moves to the second suction position in the opposite direction of the first direction D1 to place the wafer on the carrier plate 20. At this time, the first suction member 413, the second suction member 414, the third suction member 423, and the fourth suction member 424 of the suction module 40 respectively adsorb the four sides of the wafer, and then flatten the wafer relative to the carrier plate 20 to achieve suction of the wafer on the carrier plate 20. It should be noted that suctioning the wafer on the carrier plate 20, in other words, means flattening the wafer relative to the carrier plate 20, and in other words, means making the wafer as parallel as possible to the carrier plate 20 to improve the flatness of the wafer surface, so as to facilitate the subsequent scanning device 300 to scan the pattern on the wafer to identify the type and size of the wafer.

[0148] S600 : Controlling the code scanning device 300 to scan the wafer after the wafer is sucked flat on the carrier plate 20 .

[0149] The scanning device 300 scans the pattern on the wafer to identify the type, size and other characteristics of the wafer, so as to facilitate the subsequent specific electrical performance testing of the wafer.

[0150] S700: Control the setting mechanism of the setting module 50 to move to a first setting position along the side close to the lifting and rotating module 30 .

[0151] It should be noted that, in the present embodiment, the adjusting mechanism of the adjusting module 50 moves to the first adjusting position along the side close to the lifting and rotating module 30. In other words, the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 of the adjusting module 50 all move along the side close to the center of the supporting plate 20, and move to a distance between the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 and the wafer of approximately 4 mm.

[0152] S800: Control the leveling module 40 to release the wafer after the setting mechanism moves to the first setting position.

[0153] Among them, after the adjustment mechanism of the adjustment module 50 moves to the first adjustment position along the side close to the lifting and rotating module 30, the leveling module 40 releases the wafer. Part of the structure of the adjustment mechanism can be used to prevent a large degree of warping around the wafer.

[0154] S900: Control the setting mechanism of the setting module 50 to move to the second setting position for setting the wafer.

[0155] The adjusting mechanism of the adjusting module 50 moves to the second adjusting position along the side close to the lifting and rotating module 30. In other words, the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 of the adjusting module 50 all move along the side close to the center of the supporting plate 20, and move until the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 abut the wafer. The first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 are respectively arranged around the wafer and abut the wafer to limit the wafer to the adjusting space formed by the first adjusting mechanism 51, the second adjusting mechanism 52, the third adjusting mechanism 53 and the fourth adjusting mechanism 54 to achieve the adjustment of the wafer.

[0156] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0157] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A wafer leveling structure, characterized in that: include: Base plate; A carrier plate, the carrier plate is disposed on the bottom plate and spaced apart from the bottom plate, and the carrier plate is used to carry wafers; A lifting and rotating module, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module comprises a rotating mechanism and a lifting mechanism, the rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate, the lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to reciprocate along a first direction, the first direction is perpendicular to the bottom plate; A suction leveling module, the suction leveling module is arranged on the bottom plate, the suction leveling module at least partially penetrates the carrier plate and the bottom plate, the suction leveling module is used to carry and level the wafer, and the suction leveling module can reciprocate along the first direction to level the wafer on the carrier plate; as well as An adjusting module, wherein the adjusting module is arranged on the base plate, and the adjusting module comprises a first adjusting mechanism, a second adjusting mechanism, a third adjusting mechanism and a fourth adjusting mechanism, wherein the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism are arranged around the carrier plate and are respectively arranged around the carrier plate, and the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism can all be used to move along the side close to the center of the carrier plate to adjust the wafer on the carrier plate.

2. The suction leveling structure according to claim 1, characterized in that: The adjustment module also includes an adjustment drive mechanism, which is connected to the first adjustment mechanism and is used to drive the first adjustment mechanism to move along a second direction and an opposite direction; the adjustment drive mechanism is connected to the second adjustment mechanism and is used to drive the second adjustment mechanism to move along a third direction and an opposite direction; the adjustment drive mechanism is connected to the third adjustment mechanism and is used to drive the third adjustment mechanism to move along the first direction and an opposite direction; the adjustment drive mechanism is connected to the fourth adjustment mechanism and is used to drive the fourth adjustment mechanism to move along the third direction and an opposite direction, wherein the second direction is perpendicular to the third direction, and the second direction and the third direction are both perpendicular to the first direction.

3. The suction leveling structure according to claim 2, characterized in that: The setting module further includes a fifth setting mechanism and a sixth setting mechanism, wherein the first setting mechanism and the fifth setting mechanism are arranged at intervals along the third direction, and the third setting mechanism and the sixth setting mechanism are arranged at intervals along the third direction; The adjustment module also includes a guide rail assembly, which includes a first guide rail, a second guide rail and a third guide rail, the first guide rail and the third guide rail extend along the second direction and are arranged at intervals, and the second guide rail extends along the third direction; wherein, the first adjustment mechanism and the third adjustment mechanism are slidably connected to the first guide rail, the first adjustment mechanism and the third adjustment mechanism move along the first guide rail toward the second direction and the opposite direction, the fifth adjustment mechanism and the sixth adjustment mechanism are slidably connected to the third guide rail, the fifth adjustment mechanism and the sixth adjustment mechanism move along the second guide rail toward the second direction and the opposite direction, the second adjustment mechanism and the fourth adjustment mechanism are slidably connected to the second guide rail, and the second adjustment mechanism and the fourth adjustment mechanism move along the second guide rail toward the third direction and the opposite direction.

4. The suction leveling structure according to claim 3, characterized in that: The setting drive mechanism comprises a setting drive motor and a conveyor belt assembly, wherein the setting drive motor is connected to the conveyor belt assembly and is used to drive the conveyor belt assembly to move; The conveyor belt assembly comprises an outer conveyor belt and an inner conveyor belt, the outer conveyor belt is connected to the inner conveyor belt, and the conveying directions of the outer conveyor belt and the inner conveyor belt are opposite; The inner conveyor belt comprises a first conveyor portion, a second conveyor portion and a third conveyor portion connected in sequence, the outer conveyor belt comprises a fourth conveyor portion, a fifth conveyor portion and a sixth conveyor portion connected in sequence, the first conveyor portion and the fourth conveyor portion are correspondingly arranged and move in opposite directions, the second conveyor portion and the fifth conveyor portion are correspondingly arranged and move in opposite directions, the third conveyor portion and the sixth conveyor portion are correspondingly arranged and move in opposite directions, the first conveyor portion, the third conveyor portion, the fourth conveyor portion and the sixth conveyor portion extend along the second direction, and the second conveyor portion and the fifth conveyor portion extend along the third direction; The first adjusting mechanism is connected to the first conveying part, the third adjusting mechanism is connected to the fourth conveying part, and the moving directions of the first adjusting mechanism and the third adjusting mechanism are opposite; the second adjusting mechanism is connected to the second conveying part, the fourth adjusting mechanism is connected to the fifth conveying part, and the moving directions of the second adjusting mechanism and the fourth adjusting mechanism are opposite; the fifth adjusting mechanism is connected to the third conveying part, the sixth adjusting mechanism is connected to the sixth conveying part, and the moving directions of the fifth adjusting mechanism and the sixth adjusting mechanism are opposite.

5. The suction leveling structure according to claim 4, characterized in that: The setting module includes a retracted state and an open state. When the setting module is in the retracted state, the setting drive motor rotates clockwise, the inner conveyor belt moves counterclockwise, the outer conveyor belt moves clockwise, the first conveying part drives the first setting mechanism to move in the second direction, the second conveying part drives the second setting mechanism to move in the opposite direction of the third direction, the third conveying part drives the sixth setting mechanism to move in the opposite direction of the second direction, the fourth conveying part drives the third setting mechanism to move in the opposite direction of the second direction, the fifth conveying part drives the fourth setting mechanism to move in the third direction; the sixth conveying part drives the fifth setting mechanism to move in the second direction; When the adjustment module is in an open state, the adjustment drive motor rotates counterclockwise, the inner conveyor belt moves clockwise, the outer conveyor belt moves counterclockwise, the first conveying part drives the first adjustment mechanism to move in the opposite direction of the second direction, the second conveying part drives the second adjustment mechanism to move in the third direction, the third conveying part drives the sixth adjustment mechanism to move in the second direction, the fourth conveying part drives the third adjustment mechanism to move in the second direction, the fifth conveying part drives the fourth adjustment mechanism to move in the opposite direction of the third direction; the sixth conveying part drives the fifth adjustment mechanism to move in the opposite direction of the second direction.

6. The suction leveling structure according to claim 5, characterized in that: The first setting mechanism includes a first connecting member, a first pressing plate, a first adjusting block, a second adjusting block, a first guide rod and a second guide rod, the first connecting member is connected to the first guide rail, the first pressing plate is respectively connected to the first connecting member and the first conveying part, the first adjusting block and the second adjusting block are arranged on the first connecting member, and the first adjusting block and the second adjusting block are arranged in sequence along the third direction, the first guide rod is arranged on the first adjusting block, the second guide rod is arranged on the second adjusting block, and the first guide rod and the second guide rod are used to abut and limit the wafer; The first adjusting block and the second adjusting block are provided with a first waist-shaped hole, and the first adjusting block and the second adjusting block are fixedly connected through the first waist-shaped hole and the first connecting member.

7. The suction leveling structure according to claim 6, characterized in that: The first guide rod includes a main body, an arc-shaped transition portion and an extension portion. The radial dimension of the extension portion is larger than that of the main body, and the radial dimension of the arc-shaped transition portion gradually increases from the main body to the extension portion.

8. The suction leveling structure according to any one of claims 1 to 7, characterized in that: The suction leveling module comprises a first suction leveling mechanism and a second suction leveling mechanism which are arranged at intervals, wherein the first suction leveling mechanism and the second suction leveling mechanism are arranged on a side of the bottom plate away from the carrying plate; The first suction mechanism comprises a first lifting cylinder, a first fixing assembly, a first suction piece and a second suction piece, wherein the first lifting cylinder is used to drive the first fixing assembly to move along the first direction, the first suction piece and the second suction piece are arranged at two ends of the first fixing assembly, and the first suction piece and the second suction piece penetrate the bottom plate and the carrying plate, and the first suction piece and the second suction piece are used to absorb the wafer; The second leveling mechanism includes a second lifting cylinder, a second fixed assembly, a third leveling member and a fourth leveling member. The second lifting cylinder is used to drive the second fixed assembly to move along the first direction. The third leveling member and the fourth leveling member are arranged at both ends of the second fixed assembly, and the third leveling member and the fourth leveling member pass through the bottom plate and the supporting plate. The third leveling member and the fourth leveling member are used to absorb the wafer.

9. The suction leveling structure according to any one of claims 1 to 7, characterized in that: The rotating mechanism comprises a rotating assembly and a suction cup assembly, wherein the rotating assembly is arranged on a side of the bottom plate away from the carrying plate, the rotating assembly is used to drive the suction cup assembly to rotate, the suction cup assembly extends along the first direction and penetrates the bottom plate and the carrying plate, and the suction cup assembly is used to carry and adsorb the wafer; The suction cup assembly includes a suction cup seat, a suction cup body and multiple suction cups. The suction cup seat and the suction cup body are connected to form an air suction channel connecting the multiple suction cups. The suction cup body is provided with multiple receiving grooves, and the multiple receiving grooves are used to place the suction cups. In the first direction, the height of the suction cup is higher than the height of the suction cup body, so as to adsorb the wafer tightly against the suction cup body.

10. A suction leveling method, characterized in that: Applicable to the suction leveling structure according to any one of claims 1 to 9, the suction leveling method comprises: Controlling the lifting and rotating module to move from a first position to a second position along a first direction for adsorbing and carrying the wafer; Controlling the lifting and rotating module to move to a third position in the opposite direction of the first direction; Controlling the suction and leveling module to move along the first direction to a first suction and leveling position to absorb the wafer on the lifting and rotating module; Controlling the lifting and rotating module to move to the first position in the opposite direction of the first direction after the wafer is adsorbed by the leveling module; Controlling the suction leveling module to move from the first suction leveling position to a second suction leveling position in the opposite direction of the first direction, so as to make the wafer suction level on the carrier plate; Controlling the code scanning device to scan the wafer after the wafer is sucked flat on the carrier plate; Controlling the setting mechanism of the setting module to move to a first setting position along the side close to the lifting and rotating module; Control the suction and leveling module to release the wafer after the setting mechanism moves to the first setting position; The setting mechanism of the setting module is controlled to move to a second setting position for setting the wafer.

11. A wafer inspection device, characterized in that: It comprises a transport structure and the suction and leveling structure described in any one of claims 1 to 9, wherein the transport structure is used to transport the wafer to the suction and leveling structure or to remove the wafer on the suction and leveling structure.

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