AME plate, composite plate, laminated plate and preparation method thereof

Abstract

The invention belongs to the field of electronic manufacturing, and relates to an AME plate, a composite plate, a laminated plate and a preparation method thereof.The AME plate is manufactured through the 3D printing technology and comprises a base plate, a first boss, a second boss and a third boss, the first boss, the second boss and the third boss are arranged on the base plate, and the base plate is provided with an exhaust hole and a centering positioning part; a first conductive connecting part is arranged on the bottom surface of the substrate, and a second conductive connecting part is arranged on the top surface of the substrate; the composite board is formed by bonding an AME board and a PCB, the laminated board is formed by laminating and bonding a plurality of composite boards, and the AME boards of two adjacent composite boards are connected through a conducting ring. The AME plate with the thickness of 0.6 mm is obtained through printing, the pressure resistance can reach 40.3 kilovolts, and the pressure resistance level of the AME plate is obviously superior to that of a plate with the same thickness in a traditional process.

Description

Technical Field

[0001] The present invention belongs to the field of electronic manufacturing, and relates to an AME board, a composite board, a laminated board and a preparation method thereof. Background Art

[0002] In the field of electronic manufacturing, as a key component of complex electronic devices, the manufacturing process of multi-layer circuit boards has been continuously evolving. The manufacturing of traditional multi-layer circuit PCB boards usually adopts a pressing forming process. However, this process has a significant problem: during the pressing process, gaps are inevitably generated around the circuits. These gaps have an extremely adverse effect on the voltage withstand performance of the circuit board, severely limiting the performance and reliability of traditional PCB boards in high-voltage application scenarios.

[0003] Existing 3D printing devices have limitations in printing thickness, with the maximum printing thickness being only 3 mm. This far from meets the requirements of some electronic devices for thicker multi-layer circuit boards. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide an AME board, a composite board, a laminated board that solve problems such as easy generation of gaps in traditional pressing processes, limited 3D printing thickness, and easy generation of bubbles in bonding, as well as a method for compounding and laminating the AME board and the PCB board.

[0005] Through long-term exploration and attempts, as well as multiple experiments and efforts, and continuous reform and innovation, the inventors provide a technical solution for solving the above technical problems. The present invention provides an AME board, which is made by 3D printing technology and includes a substrate, a first boss provided on the substrate, a second boss provided on the first boss, and a third boss provided on the second boss. The side corner of the substrate and the first boss is rounded, the edge of the second boss is beveled, the corner between the second boss and the first boss is rounded, the substrate is provided with exhaust holes and centering positioning parts, the bottom surface of the substrate is provided with a first conductive connection part, and the top surface is provided with a second conductive connection part.

[0006] Compared with the prior art, the beneficial effects of the present invention are as follows: Through the specially designed AME board structure, the present invention effectively solves the problem of air bubbles generated during the bonding of traditional 3D printing boards and PCB boards, improving the stability and success rate of single boards after bonding. At the same time, through the treatment of rounded corners and chamfered corners, the epoxy resin glue can flow better, ensuring no gaps after bonding and enhancing the pressure resistance of the boards. In addition, the exhaust holes and centering positioning parts on the AME board further ensure the reliability and accuracy of bonding, enabling the flatness of the prepared composite board and the resistance of the conductive connection area to be precisely controlled. In terms of pressure resistance, the AME board with a thickness of 0.6 mm printed by the present invention can withstand a voltage of 40.3 kV, significantly superior to the pressure resistance level of boards with the same thickness under traditional processes (less than 10 kV), thus providing a more efficient and stable solution for the manufacture of multi-layer circuit boards of electronic devices.

[0007] Based on the above technical solutions, the present invention can be further improved as follows: Further: the height of the third boss is 23 μm, the number of exhaust holes is 8, and the number of centering positioning parts is 4 and they are in the same plane as the substrate.

[0008] Compared with the prior art, the beneficial effects of adopting the above further technical solutions are: By setting the height of the third boss to 23 μm, the present invention precisely controls the flatness of the top surface of the AME board, enabling the top surface to achieve ultra-high flatness accuracy after processing and meeting the stringent requirements of thick multi-layer circuit board lamination bonding. The number of exhaust holes is set to 8, and through optimized layout, it can more effectively discharge air during the glue filling process, minimizing air bubble residues to the greatest extent, thereby ensuring the uniformity and density of the bonding layer. The co-planar design of the 4 centering positioning parts with the substrate can closely fit the inner wall of the counterbore on the PCB board, achieving high-precision centering of the AME board and the PCB board, and ensuring their concentricity and bonding strength. The comprehensive application of these improvements not only improves the bonding quality, reduces the scrap rate, but also enhances the electrical performance and mechanical stability of the product, providing a better solution for the high-performance and high-reliability requirements of electronic devices.

[0009] Based on the above technical solutions, the present invention can be further improved as follows: Further: capacitors are provided inside the AME board, the capacitors include multiple layers of electrodes, the thickness of a single layer of electrode is 15 - 20 μm, the dielectric thickness is 30 - 35 μm, and the dielectric constant is 2.6 - 3.

[0010] Preferably, the capacitor includes 50 layers of circuits, the unilateral electrode area is 78.5 mm 2 , the thickness is 17 μm, the dielectric thickness is 33 μm, and the dielectric constant is 2.8.

[0011] Compared with the prior art, the beneficial effects of adopting the above further technical solution are as follows: By arranging capacitors with multiple layers of circuits inside the AME board, especially controlling the single-layer electrode thickness of the capacitor to be 15 - 20 μm, the dielectric thickness to be 30 - 35 μm, and the dielectric constant to be optimized to 2.6 - 3, it enables the capacitor to achieve more efficient space utilization and better electrical characteristics while ensuring good electrical performance. Further optimized to 50 layers of circuits, with a unilateral electrode area of 78.5 mm², a thickness of 17 μm, a dielectric thickness of 33 μm, and a dielectric constant of 2.8, it can more precisely match the requirements of specific electronic devices and provide more stable capacitance performance. This structural design not only improves the electrical performance of the AME board but also enhances its reliability in complex application scenarios such as high frequency and high voltage, providing strong support for the miniaturization and high performance of electronic devices.

[0012] Based on the above technical solution, the present invention can also be improved as follows: Furthermore: The AME board is made by inkjet printing, photocuring, and high-temperature sintering using dielectric material ink and conductive material ink.

[0013] Compared with the prior art, the beneficial effects of adopting the above further technical solution are as follows: The present invention realizes high-precision forming of the AME board structure, while ensuring its good electrical performance and mechanical strength, effectively improving production efficiency and product quality.

[0014] The present invention also provides a composite board, which is formed by bonding the AME board and the PCB board. The PCB board is provided with through holes and sink rings, and the inner wall of the sink ring is provided with a second electrode connection part; the AME board is bonded to the second electrode connection part on the PCB board through a silver paste via a first electrode connection part, the centering and positioning part of the AME board contacts the inner wall of the sink ring on the PCB board, and the first boss, the second boss, and the third boss are located inside the through holes.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: In the present invention, a composite board is formed by bonding an AME board and a PCB board. By utilizing the special outer shape structure of the AME board and the close contact between the centering and positioning part and the inner wall of the sunken ring of the PCB board, high-precision centering and bonding are achieved, effectively solving the problem of air bubbles existing in the traditional bonding process and improving the stability and reliability of bonding. At the same time, the first boss, the second boss, and the third boss of the AME board are located within the through holes of the PCB board, which not only ensures the tight fit between the two but also enhances the overall structural strength of the composite board. The first electrode connection part of the AME board is connected to the second electrode connection part of the PCB board through silver paste, ensuring good electrical connection performance, thereby improving the application effect and reliability of the composite board in electronic devices and meeting the requirements of modern electronic devices for high-performance multi-layer circuit boards.

[0016] Based on the above technical solutions, the present invention can also be improved as follows: Furthermore: The height difference between the upper surfaces of the AME board and the PCB board does not exceed 0.1 μm, and the height difference between the lower surfaces of the AME board and the PCB board does not exceed 0.1 μm.

[0017] Compared with the prior art, the beneficial effects of adopting the above further technical solutions are: By precisely controlling the height difference between the upper and lower surfaces of the AME board and the PCB board within 0.1 μm, the flatness and assembly accuracy of the composite board are significantly improved, ensuring the reliability of electrical connection and the stability of signal transmission, thereby enhancing the performance and reliability of electronic devices.

[0018] The present invention also provides a preparation method for the composite board. The AME board and the PCB board are bonded, and it is made by means of glue injection at room temperature, vacuum exhaust, high-temperature curing, and tooling shaping. After bonding, the parallelism between the AME board and the plane of the PCB board is <2 μm, and the resistance of the conductive connection area to the contact point extending from the PCB board is less than 50 milliohms.

[0019] Compared with the prior art, the beneficial effects of the present invention are: The preparation method of the composite board of the present invention effectively eliminates air bubbles in the bonding process through steps such as glue injection at room temperature, vacuum exhaust, high-temperature curing, and tooling shaping, ensures the bonding quality, and improves the production efficiency. At the same time, strictly controlling the parallelism between the AME board and the plane of the PCB board within 2 μm after bonding and the resistance of the conductive connection area being less than 50 milliohms ensures the electrical performance and mechanical stability of the composite board, meeting the manufacturing requirements of high-performance electronic devices.

[0020] The present invention also provides a laminated board, which is formed by laminating and bonding multiple such composite boards, and the AME boards of adjacent two composite boards are connected through conductive rings.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: By laminating and bonding multiple composite plates to form a laminated plate and using a conductive ring to connect the AME plates of adjacent composite plates, the present invention effectively reduces the interlayer resistance and improves the electrical performance of the laminated plate, providing a reliable solution for the thick multi-layer circuit requirements of electronic devices.

[0022] Based on the above technical solution, the present invention can be further improved as follows: Further: The conductive ring is a conductive copper film, the size of the conductive copper film is larger than that of the first conductive connection part and the second conductive connection part, and the thickness is 10 - 60 μm.

[0023] Preferably, the thickness of the conductive copper film is 50 μm.

[0024] Compared with the prior art, the beneficial effects of adopting the above further technical solution are as follows: Using a conductive copper film as the conductive ring, with its size larger than that of the first conductive connection part and the second conductive connection part, a thickness of 10 - 60 μm, preferably 50 μm, can effectively increase the conductive contact area, reduce the contact resistance, improve the conductive performance and connection reliability of the laminated plate, and at the same time enhance its mechanical strength and durability.

[0025] The present invention also provides a method for preparing a laminated plate, comprising the following steps: Prepare a plurality of the above-mentioned composite plates; Bond a conductive copper film to the first conductive connection part of the composite plate; Attach the second conductive connection part of another composite plate to the conductive copper film; Manufacture by means of room-temperature potting, then exhausting air bubbles under vacuum, high-temperature curing, and tooling shaping, and cumulatively bond a plurality of composite plates to form a laminated plate.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: The method for preparing the laminated plate of the present invention realizes stable electrical connection of adjacent composite plates by bonding a conductive copper film to the conductive connection part of the composite plate. Combining steps such as room-temperature potting, vacuum degassing, high-temperature curing, and tooling shaping effectively discharges the interlayer air bubbles, improves the integrity and reliability of the laminated plate. Compared with the prior art, the preparation method of the present invention simplifies the process flow, reduces the production cost, and at the same time improves the electrical performance and mechanical strength of the laminated plate, meeting the high-performance requirements of electronic devices for thick multi-layer circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for the embodiments will be briefly introduced below. It should be understood that the following accompanying drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related accompanying drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 is a front view structural schematic diagram of a preferred embodiment of the AME board of the present invention.

[0029] Figure 2 is Figure 1 a bottom view structural schematic diagram of.

[0030] Figure 3 is Figure 1 a top view structural schematic diagram of.

[0031] Figure 4 is Figure 1 a three-dimensional structural schematic diagram of.

[0032] Figure 5 is Figure 1 a partial enlarged schematic diagram of I in.

[0033] Figure 6 is a three-dimensional structural schematic diagram of the PCB board in a preferred embodiment of the composite board of the present invention.

[0034] Figure 7 is a three-dimensional structural schematic diagram of the conductive ring in a preferred embodiment of the laminated board of the present invention.

[0035] The marks in the figure are respectively: 100 AME board, 110 substrate, 111 first conductive connection part, 112 exhaust hole, 113 first electrode connection part, 114 centering positioning part, 115 horizontal positioning part, 120 first boss, 130 second boss, 140 third boss, 150 second conductive connection part, 200 PCB board, 210 through hole, 220 counterbore, 221 second electrode connection part, 300 conductive ring. Specific embodiments

[0036] The following will be described in conjunction with the accompanying drawings and a specific embodiment.

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it may not be further defined and explained in subsequent drawings.

[0039] Embodiment 1 Refer to Figures 1 to 5 . The AME board 100 in this embodiment adopts a multi-layer structure design, which specifically includes the following key parts: The substrate 110, which is circular and serves as the basic support structure of the entire AME board 100; the first boss 120 constructed on the substrate 110 by 3D printing technology, which is used to increase the thickness of the board and provide preliminary structural support; the second boss 130 further constructed on the basis of the first boss 120, which provides a platform for the construction of the third boss 140 while increasing the thickness; the third boss 140 formed on the second boss 130, whose height is precisely controlled at 23 μm. This precise height control is crucial for subsequent processing and assembly processes and can ensure the effective combination of the AME board 100 with other components.

[0040] The side corner between the substrate 110 and the first boss 120 is carefully rounded, and the radius of the rounded corner is maintained between 0.2 - 0.5 mm. Such a design helps to guide the flow of epoxy resin glue and avoid the phenomenon of glue accumulation or air bubble entrapment at the corner. The edge of the second boss 130 is beveled, and the angle between the bevel surface and the upper surface of the second boss 130 is strictly controlled at 24°. The design of this angle aims to optimize the flow path of the glue and ensure that the glue can evenly fill each part, thereby enhancing the bonding effect.

[0041] The corner between the second boss 130 and the first boss 120 is also rounded, and the radius of the rounded corner is 9.5 mm, which further promotes the smooth flow of the glue.

[0042] On the substrate 110, there are also eight exhaust holes 112 distributed. The layout of these exhaust holes 112 is optimized to effectively discharge the internal air during the potting process, prevent the generation of bubbles, and ensure the density and reliability of the adhesive layer.

[0043] There are also four centering and positioning parts 114 provided on the substrate 110. These positioning parts are in the same plane as the substrate 110. They play a key role when the AME board 100 is bonded to the PCB board 200. By closely contacting the inner wall of the counterbore 220 on the PCB board 200, it can ensure that the center of the AME board 100 coincides precisely with the center of the through hole 210 on the PCB board 200, thus achieving high-precision alignment and assembly.

[0044] The bottom surface of the substrate 110 is designed with a first conductive connection part 111, and the top surface is provided with a second conductive connection part 150. These two conductive connection parts are the core structures for realizing electrical connection. They are connected to the corresponding electrode connection parts on the PCB board 200 through a specific process, ensuring the connectivity of the circuit and the stability of signal transmission.

[0045] Inside the AME board 100, a high-performance capacitor is integrated. This capacitor adopts a multi-layer electrode structure. The thickness of a single-layer electrode is precisely controlled within the range of 15 - 20 μm. Such a thickness design not only ensures the good conductivity of the electrode but also does not affect the overall performance of the capacitor and the structural layout of the AME board 100 due to excessive increase in thickness. The thickness of the dielectric layer is maintained between 30 - 35 μm. This thickness range can provide sufficient electrical insulation performance and is also conducive to the miniaturization and high performance of the capacitor. The dielectric constant is optimized to the range of 2.6 - 3. This value range of the dielectric constant can ensure a relatively high capacitance value of the capacitor while taking into account its stability and low-loss characteristics under high-frequency signals. More specifically, the capacitor in this embodiment preferably has a 50-layer circuit structure, the unilateral electrode area is set to 78.5 mm², the electrode thickness is 17 μm, the dielectric thickness is 33 μm, and the dielectric constant is 2.8. Such a parameter configuration enables the capacitor to achieve a relatively large capacitance value in a limited space, meeting the requirements of electronic devices for integrated and high-performance electronic components.

[0046] The AME board 100 in this embodiment is fabricated using advanced 3D printing technology, and the raw materials used include dielectric material ink and conductive material ink. During the printing process, first, according to the preset design model, the dielectric material ink and conductive material ink are sprayed onto the substrate 110 in precise proportions and positions using inkjet printing technology, gradually constructing structures such as the first boss 120, the second boss 130, and the third boss 140. Subsequently, the printed preliminary structure is subjected to photocuring treatment. Through ultraviolet irradiation with a specific wavelength, the photosensitive components in the ink undergo a polymerization reaction, thereby achieving the preliminary curing and shaping of the structure.

[0047] The AME board 100 fabricated through the above process performs excellently in various performance indicators. Its voltage withstand performance is particularly prominent. When the thickness of the AME board 100 is 0.6 mm, the voltage withstand value can reach 40.3 kV, which far exceeds the voltage withstand level of the PCB board 200 with the same thickness under traditional processes (the voltage withstand of traditional processes is less than 10 kV). This significant performance advantage enables the AME board 100 in this embodiment to have wide applicability and reliability in high-voltage application scenarios, and can meet the urgent needs of modern electronic devices for high-performance and highly integrated electronic components.

[0048] Embodiment 2 See Figures 1 to 6 The composite board in this embodiment is formed by bonding the AME board 100 described in Embodiment 1 and the PCB board 200.

[0049] See Figure 6 On the PCB board 200, there are through holes 210 and counterbores 220, and a second electrode connection part 221 is provided on the inner wall of the counterbore 220. The AME board 100 is bonded to the second electrode connection part 221 on the PCB board 200 through silver paste via the first electrode connection part 113 on the bottom surface of its substrate 110. At the same time, the centering positioning part 114 of the AME board 100 is in close contact with the inner wall of the counterbore 220 of the PCB board 200, ensuring the precise centering between the AME board 100 and the PCB board 200. In addition, the first boss 120, the second boss 130, and the third boss 140 of the AME board 100 are located within the through holes 210 of the PCB board 200. Such a design makes the overall structure of the composite board more compact and stable. In this embodiment, the height differences between the upper and lower surfaces of the AME board 100 and the PCB board 200 are strictly controlled not to exceed 0.1 μm, thereby ensuring the flatness and consistency of the overall composite board.

[0050] The preparation steps of the composite board are as follows: Select the AME board 100 and the PCB board 200 that meet the design requirements, ensuring that the structural integrity and electrical performance of the AME board 100 meet the standards, and the sizes of the through holes 210 and counterbores 220 of the PCB board 200 are precise.

[0051] Clean the bonding surfaces of the AME board 100 and the PCB board 200 to remove impurities such as oil stains and dust on the surface, so as to improve the bonding reliability.

[0052] Evenly coat silver paste on the first electrode connection part 113 of the AME board 100, and control the coating thickness within 0.05 - 0.1 mm to ensure good electrical conductivity and bonding strength.

[0053] Place the AME board 100 above the through hole 210 of the PCB board 200, and through the mechanical alignment device, make the centering and positioning part 114 of the AME board 100 precisely contact the inner wall of the counterbore 220 of the PCB board 200, while ensuring that the height difference between the upper and lower surfaces of the AME board 100 and the PCB board 200 does not exceed 0.1 μm.

[0054] Evenly pour the prepared epoxy resin glue into the gap between the AME board 100 and the PCB board 200 at room temperature to ensure that the glue fully fills all the gaps.

[0055] Place the assembled AME board 100 and PCB board 200 in a vacuum chamber and keep it at a vacuum degree of -0.095 MPa for 15 minutes to discharge the bubbles in the glue and ensure the denseness of the bonding layer.

[0056] Put the composite board after vacuum degassing into a high-temperature furnace and cure it at a temperature of 100 °C for 6 hours to completely cure the glue and form a firm bonding layer.

[0057] Use a four-probe method resistance tester to detect the resistance from the conductive connection area to the contact point extending from the PCB board 200, and ensure that the resistance value is less than 50 mΩ to guarantee the reliability of the electrical connection.

[0058] Select actual samples for testing. The flatness of the composite board reaches 1.2 μm, far better than the design requirement of <2 μm; the resistance of the conductive connection area is 35 mΩ, meeting the design index of less than 50 mΩ. The electrical performance and mechanical stability of the composite board are both excellent, and it can withstand multiple thermal cycle and mechanical vibration tests without the occurrence of bonding layer cracking or electrical connection failure. This indicates that the composite board in this embodiment has good application prospects and reliability in electronic devices.

[0059] Example 3 See Figures 1 to 7 . The laminated board in this embodiment is formed by laminating and bonding multiple composite boards described in Example 2. The AME boards 100 of two adjacent composite boards are connected through a conductive ring 300.

[0060] See Figure 7, the conductive ring 300 is a conductive copper film, which is larger than the first conductive connection part 111 and the second conductive connection part 150, and has a thickness of 10 to 60 μm. The thickness of the conductive copper film is preferably 50 μm. Such a thickness can not only ensure good electrical conductivity but also provide sufficient mechanical strength. The size of the conductive copper film is designed to completely cover the first conductive connection part 111 and the second conductive connection part 150, ensuring the reliability of the electrical connection.

[0061] The preparation steps of the laminated board are as follows: Select multiple qualified composite boards to ensure that the electrical and mechanical properties of each composite board meet the design requirements.

[0062] Precisely attach the conductive copper film to the first conductive connection part 111 of the AME board 100 of a composite board. The attachment of the conductive copper film requires being flat and bubble-free to ensure good contact between the conductive copper film and the first conductive connection part 111.

[0063] Attach the second conductive connection part 150 of the AME board 100 of another composite board to the composite board with the conductive copper film already attached. During the attachment process, use the alignment device to ensure the precise alignment of the conductive connection parts of the two composite boards.

[0064] At room temperature, evenly pour the epoxy resin glue into the gaps between adjacent composite boards to ensure that the glue fully fills all the gaps.

[0065] Place the laminated board after stacking in a vacuum chamber and keep it at a vacuum degree of -0.095 MPa for 20 minutes to effectively discharge the bubbles in the glue and ensure the density of the bonding layer.

[0066] Put the laminated board after vacuum exhaust into a high-temperature furnace and cure it at a temperature of 100 °C for 6 hours to completely cure the glue and form a solid bonding layer.

[0067] Repeat the above steps of attaching the conductive copper film, stacking the composite boards, pouring glue at room temperature, vacuum exhaust, high-temperature curing, and tooling shaping, and gradually accumulate and bond multiple composite boards until the thickness of the laminated board reaches the design requirements.

[0068] The laminated board prepared in this embodiment realizes stable electrical connection and mechanical fixation between multiple composite boards through precise process control and high-quality material selection. After testing, the overall thickness deviation of the laminated board is controlled within ±0.05 mm, and the interlayer resistance is less than 80 mΩ, meeting the high-performance requirements of electronic devices for thick multi-layer circuit boards. After undergoing multiple thermal cycle tests (-40 °C to +125 °C, 1000 cycles), the laminated board does not show phenomena such as interlayer separation or electrical connection failure, demonstrating good environmental adaptability and reliability.

[0069] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0070] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0071] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] In the present invention, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0073] The above are only the preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as a limitation to the present invention. The protection scope of the present invention should be subject to the scope defined by the claims. For those of ordinary skill in the art, without departing from the spirit and scope of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. An AME board, characterized in that: The AME board is made by 3D printing technology, and includes a substrate, a first boss arranged on the substrate, a second boss arranged on the first boss, and a third boss arranged on the second boss. The corners of the sides of the substrate and the first boss are rounded, the edges of the second boss are beveled, and the corners of the second boss and the first boss are rounded. The substrate is provided with exhaust holes and a centering positioning portion. The bottom surface of the substrate is provided with a first conductive connecting portion, and the top surface is provided with a second conductive connecting portion.

2. The AME board according to claim 1, characterized in that The height of the third boss is 23 μm, the number of the exhaust holes is 8, the number of the centering positioning parts is 4 and they are located in the same plane as the substrate.

3. The AME board according to claim 1, characterized in that A capacitor is arranged inside the AME plate, and the capacitor comprises a multi-layer electrode, a single-layer electrode thickness of 15-20 μm, a dielectric thickness of 30-35 μm, and a dielectric constant of 2.6-3.

4. The AME board according to claim 1, characterized in that The AME board is formed by dielectric material ink and conductive material ink through inkjet printing, photocuring and high-temperature sintering.

5. A composite board, characterized in that: The composite board is formed by bonding the AME board described in any one of claims 1 to 4 to a PCB board, the PCB board is provided with a through hole and a sinker ring, and the inner wall of the sinker ring is provided with a second electrode connecting portion; the AME board is bonded to the second electrode connecting portion on the PCB board through the first electrode connecting portion via silver glue, the centering positioning portion of the AME board is in contact with the inner wall of the sinker ring on the PCB board, and the first boss, the second boss, and the third boss are located in the through hole.

6. The composite panel according to claim 5, characterized in that: The height difference between the upper surface of the AME board and the PCB board does not exceed 0.1 μm, and the height difference between the lower surface of the AME board and the PCB board does not exceed 0.1 μm.

7. A method for preparing the composite board according to claim 5 or 6, characterized in that: The AME board described in any one of claims 1 to 4 is bonded to the PCB board, and is manufactured by means of normal temperature glue filling, vacuum exhaust, high temperature curing, and tooling shaping. After bonding, the parallelism between the AME board and the plane of the PCB board is required to be less than 2μm, and the resistance of the contact extending from the conductive connection area to the PCB board is less than 50 milliohms.

8. A laminated plate, characterized in that: The laminated plate is formed by laminating and bonding a plurality of composite plates according to claim 5 or 6, and the AME plates of two adjacent composite plates are connected by a conductive ring.

9. The laminated plate according to claim 8, characterized in that The conductive ring is a conductive copper film, the size of the conductive copper film is larger than the first conductive connecting part and the second conductive connecting part, and the thickness is 10-60 μm.

10. A method for preparing a laminated plate, characterized in that: The following steps are involved: Preparing a plurality of composite panels according to claim 5 or 6; Laminating a conductive copper film on the first conductive connecting portion of the composite board; attaching the second conductive connecting portion of another composite board to the conductive copper film; It is made by pouring glue at room temperature, then removing bubbles under vacuum, curing at high temperature, and shaping the tooling. Multiple composite panels are cumulatively bonded to form a laminated panel.

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