Electroplating device for processing integrated circuit board

Abstract

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing machinery and relates to an electroplating device for processing integrated circuit boards. Background Art

[0002] Circuit board electroplating is the process of depositing a metal film on the surface of a circuit board through the principle of electrolysis to enhance its conductivity, corrosion resistance, mechanical properties, etc. The electroplating process usually includes steps such as cleaning, activation, copper plating, and tin plating. The metals used include copper, nickel, gold, etc.

[0003] A Chinese patent with publication number CN114481246B discloses a circuit board electroplating device in a low-oxygen environment, including a trough body, an outer wall on one side of the trough body is connected to a cover plate by a hinge, a first partition is welded between the inner walls on both sides of the trough body, a plating trough is arranged between the first partition and the trough body, a cylinder three is hinged between the cover plate and the trough body, an outer wall on one side of the trough body is connected to a vacuum pump by bolts, an air inlet of the vacuum pump is connected to the trough body by a pipe, a sealing ring is arranged on the top outer wall of the trough body, a third partition is welded between the inner walls on both sides of the trough body, and a moving shell is slidably connected to the trough body on one side of the third partition.

[0004] In the above prior art, after grinding the circuit board, grinding debris will remain on the circuit board. If electroplating is performed directly without cleaning, the subsequent electroplating quality will be affected. In addition, after the electroplating is completed, the wet electroplating liquid will remain on the circuit board, affecting the subsequent assembly and welding process.

[0005] In order to solve the above problems, the present invention provides an electroplating device for processing integrated circuit boards. Summary of the invention

[0006] In order to solve the problems existing in the background technology, the present invention provides an electroplating device for processing integrated circuit boards.

[0007] In order to achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: an electroplating device for processing integrated circuit boards, comprising a tank body, a protective cover is horizontally slidably installed in the tank body, a drilling assembly is rotatably installed on the protective cover, and a first driving assembly for driving the drilling assembly to rotate is installed between the protective cover and the drilling assembly;

[0008] A second partition plate arranged vertically is fixedly installed in the groove body, a first partition plate arranged vertically is fixedly installed in the groove body between the second partition plate and the protective cover, a hole for making way for the drilling hole is provided on the first partition plate, and a grinding assembly is installed between the first partition plate and the second partition plate;

[0009] A collecting bucket for collecting drilling cuttings is detachably mounted below the protective cover and the first partition;

[0010] Air holes are formed in the side wall of the groove body between the first partition plate and the protective cover;

[0011] A U-shaped frame is horizontally and slidably installed on the groove body. A clamping assembly is vertically and slidably installed on the U-shaped frame. A drying assembly is installed below the U-shaped frame. An electroplating assembly is installed at one end of the groove body away from the protective cover.

[0012] Preferably, a first electric push rod is fixedly installed on the groove body. The telescopic shaft of the first electric push rod is parallel to the moving direction of the protective cover. The telescopic end of the first electric push rod penetrates through the side wall of the groove body and is fixedly connected to the side wall of the protective cover. Two slide rods parallel to the axis of the first electric push rod are fixedly installed on the protective cover. The two slide rods are respectively arranged on both sides of the first electric push rod. The slide rods are slidably connected to the groove body.

[0013] Preferably, the drilling assembly includes: a connecting shaft, and the connecting shaft is rotatably connected to the protective cover;

[0014] A drill bit. A micro motor is fixedly installed at one end of the connecting shaft. The output shaft of the micro motor is provided with a drill bit. The drill bit is connected to the output shaft of the micro motor through a fastening screw;

[0015] The first driving assembly includes: a rack, and the rack is fixedly installed on the bottom wall of the groove body. The rack is located inside the protective cover. A slot for the rack to pass through is formed in the side wall of the protective cover;

[0016] A first gear. A connecting block is fixedly installed on the inner wall of the protective cover. The axis of the first gear is arranged horizontally. The first gear is rotatably connected to the connecting block. The axis of the first gear is perpendicular to the moving direction of the protective cover. The first gear meshes with the rack;

[0017] A second bevel gear. The second bevel gear is fixedly installed at the end of the connecting shaft away from the drill bit. A first bevel gear is fixedly installed on the first gear. The second bevel gear meshes with the first bevel gear.

[0018] Preferably, the grinding assembly includes: grinding rollers. Two grinding rollers are provided. The two grinding rollers are arranged in parallel. The axes of the two grinding rollers are on the same horizontal plane. The axes of the grinding rollers are perpendicular to the moving direction of the protective cover. The grinding rollers are rotatably connected to the groove body;

[0019] Second gears. Two second gears are provided. The two second gears respectively correspond to the grinding rollers one by one. The second gears are respectively fixedly installed at one end of the corresponding grinding rollers. The two second gears mesh with each other. The second gears are embedded in the side wall of the groove body;

[0020] A third motor, the third motor is fixedly installed on the side wall of the trough body, and the output shaft of the third motor penetrates through the side wall of the trough body and is fixedly connected to one of the grinding rollers.

[0021] Preferably, the U-shaped frame includes two vertical rods and a cross bar, and the two vertical rods are respectively fixed at both ends of the cross bar;

[0022] A guide rod with an axis parallel to the moving direction of the protective cover is fixedly installed on the side wall of the trough body, and the lower ends of the vertical rods of the U-shaped frame are slidably connected to the guide rod;

[0023] Above the guide rod, a first screw rod parallel to the axis of the guide rod is provided, and the first screw rod is threadedly connected to the trough body;

[0024] A first motor is fixedly installed at one end of the trough body, and the output shaft of the first motor is fixedly connected to the first screw rod.

[0025] Preferably, a sliding plate is vertically slidably installed on the vertical rod of the U-shaped frame, and a second driving component for driving the sliding plate to move up and down is installed between the sliding plate and the U-shaped frame;

[0026] The second driving component includes: two second screw rods, the two second screw rods are arranged in parallel, the second screw rods are arranged in parallel with the vertical rods of the U-shaped frame, and the second screw rods are fixedly connected to the corresponding vertical rods of the U-shaped frame;

[0027] The sliding plate is threadedly connected to the second screw rod;

[0028] A second motor, the second motor is fixedly installed on the cross bar of the U-shaped frame, and the output shaft of the second motor is fixedly connected to one of the second screw rods; the second motor is connected to the other second screw rod through a belt transmission component.

[0029] Preferably, two sets of clamping components are provided, and the clamping components are installed on the sliding plate; the clamping components include: clamping plates, the clamping plates are located below the sliding plate, a second electric push rod is fixedly installed on the sliding plate, the clamping plates are two, the two clamping plates are arranged in parallel, one of the clamping plates is fixed on the lower side wall of the sliding plate, and the other clamping plate is fixedly connected to the output rod of the second electric push rod.

[0030] Preferably, a fixed shell is fixedly installed at each end of the U-shaped frame, a hair dryer is fixedly installed on the side wall of the fixed shell, the fixed shell is located on both sides of the clamping component, and the air outlet of the hair dryer faces the clamping component.

[0031] Preferably, the electroplating assembly includes: an electroplating tank, which is fixedly arranged in the tank body with its opening facing upward;

[0032] a cover plate, which is slidably connected to the electroplating tank; the cover plate includes a horizontal plate and two vertical plates, the two vertical plates are respectively fixed at both ends of the horizontal plate, the two vertical plates are respectively located on the upper and lower sides of the horizontal plate, and the height of the upper vertical plate is higher than the height of the fixed shell;

[0033] a reset structure, which is installed between the cover plate and the side wall of the tank body;

[0034] The reset structure includes: a fixing plate, which is fixedly installed on the tank body, and the fixing plate is located at one end of the tank body away from the protective cover;

[0035] a first spring, a relief groove is formed on the fixing plate, the vertical plate of the cover plate is slidably connected to the relief groove, the first spring is fixedly installed in the relief groove of the fixing plate, one end of the first spring is fixed on the side wall of the relief groove, and the other end of the first spring is fixed on the vertical plate of the cover plate;

[0036] a connecting plate, which is vertically slidably connected to the upper side wall of the fixing plate, the lower end of the connecting plate penetrates through the upper side wall of the relief groove and is located in the relief groove, a bevel block is fixedly installed at the lower end of the connecting plate, one end of the bevel block close to the cover plate is provided with a bevel, and a clamping groove matched with the bevel block is formed on the cover plate;

[0037] a second spring, which is fixed between the connecting plate and the fixing plate.

[0038] Preferably, a cleaning assembly is installed on one side of the grinding assembly;

[0039] The cleaning assembly includes: a liquid storage tank, which is fixed on the tank body; a liquid filling port communicated with the inner cavity of the liquid storage tank is arranged above the liquid storage tank;

[0040] a rectangular frame, which is fixedly installed below the cleaning assembly, a horizontal nozzle is formed on the rectangular frame, and a liquid discharge port is formed on the bottom wall of the tank body corresponding to the rectangular frame;

[0041] a connecting pipe, which connects the liquid storage tank and the rectangular frame, and a water pump is installed on the connecting pipe.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. When the protective cover moves to drill holes in the position of the circuit board, its drill bit will rotate through the first driving unit. During the rotation process, the drill bit is cleaned through the air holes.

[0044] 2. During the grinding process, the generated debris will fall into the collection hopper through the opening under the tank for unified collection. Along with the movement of the protective cover, the protective cover can also push the debris above the tank into the collection hopper for unified collection, preventing the accumulation of debris above the tank and avoiding the need for subsequent manual cleaning.

[0045] 3. By setting up a drying component, the drying effect of the circuit board after cleaning and electroplating can be ensured, making the surface of the dried circuit board cleaner and flatter, which is beneficial for subsequent assembly and soldering work.

[0046] 4. When the electroplating operation of the circuit board is in progress, the cover plate will automatically open. After the electroplating operation of the circuit board, the cover plate will automatically seal the electroplating tank, covering the upper part of the electroplating tank automatically without manual control, thus preventing dust and impurities from falling into the tank and affecting the coating quality, and improving the convenience during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is the front view axonometric structural schematic diagram of the present invention;

[0048] Figure 2 is the front view sectional structural schematic diagram of the present invention;

[0049] Figure 3 is the present invention Figure 2 partial enlarged view at A in;

[0050] Figure 4 is the rear view axonometric structural schematic diagram of the present invention;

[0051] Figure 5 is the partial sectional structural schematic diagram of the installation of the first driving component and the protective cover of the present invention;

[0052] Figure 6 is the present invention Figure 5 partial enlarged view at B in;

[0053] Figure 7 is the structural schematic diagram of the installation between the rectangular frame and the liquid storage tank of the present invention;

[0054] Figure 8 is the structural schematic diagram of the protective cover of the present invention;

[0055] Figure 9 is the sectional structural schematic diagram of the connection between the guide roller and the tank of the present invention;

[0056] Figure 10 is the sectional structural schematic diagram of the connection between the connecting shaft and the protective cover of the present invention;

[0057] Figure 11 is the exploded view of the connection between the connecting shaft and the drill bit of the present invention;

[0058] Figure 12 It is a schematic structural diagram of the installation of the U-shaped frame and the clamping assembly of the present invention;

[0059] Figure 13 It is a schematic cross-sectional structural diagram of the connection between the U-shaped frame and the clamping assembly of the present invention;

[0060] Figure 14 It is a schematic structural diagram of the connection between the cover plate and the electroplating tank of the present invention;

[0061] Figure 15 It is a schematic cross-sectional structural diagram of the cover plate opening the opening of the electroplating tank of the present invention.

[0062] In the figure: 1, tank body; 2, slide bar; 3, first electric push rod; 4, protective cover; 5, first partition board; 6, first motor; 7, first screw rod; 8, guide rod; 9, guide plate; 10, collection hopper; 11, U-shaped frame; 12, second motor; 13, cover plate; 14, fixing plate; 15, first spring; 16, connecting plate; 17, fixed shell; 18, second screw rod; 19, second electric push rod; 20, clamping plate; 21, grinding roller; 22, first bevel gear; 23, first gear; 24, rack; 25, connecting shaft; 26, rectangular frame; 27, second partition board; 28, liquid discharge port; 29, electroplating tank; 30, sliding plate; 31, second spring; 32, inclined plane block; 33, third motor; 34, liquid storage tank; 35, liquid filling port; 36, water pump; 37, connecting block; 38, second bevel gear; 39, slotted opening; 40, spray head; 41, connecting pipe; 42, second gear; 43, fastening screw; 44, hair dryer; 45, belt transmission assembly; 46, card slot; 47, drill bit. Specific embodiments

[0063] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0064] As Figures 1-15 shown, the technical solution adopted by the present invention is as follows: An electroplating device for integrated circuit board processing. It includes a tank body 1. The protective cover 4 is horizontally and slidably installed in the tank body 1.

[0065] Specifically, a first electric push rod 3 is fixedly installed on the groove body 1. The telescopic shaft of the first electric push rod 3 is parallel to the moving direction of the protective cover 4. The telescopic end of the first electric push rod 3 penetrates through the side wall of the groove body 1 and is fixedly connected to the side wall of the protective cover 4. Two slide rods 2 parallel to the axis of the first electric push rod 3 are fixedly installed on the protective cover 4. The two slide rods 2 are respectively arranged on both sides of the first electric push rod 3, and the slide rods 2 are slidably connected to the groove body 1.

[0066] When the first electric push rod 3 is started, the telescopic movement of the first electric push rod 3 will drive the protective cover 4 to reciprocate in the groove body 1.

[0067] A drilling assembly is rotatably installed on the protective cover 4. A first driving assembly for driving the drilling assembly to rotate is installed between the protective cover 4 and the drilling assembly. Air holes are provided on the side wall of the groove body 1 between the first partition 5 and the protective cover 4. The air holes are not shown in the drawings. The air holes can be provided according to the position of the drilling assembly.

[0068] The drilling assembly is used for drilling the circuit board. When the protective cover 4 reciprocates, the drilling assembly is driven to rotate by the first driving assembly. During the rotation of the drilling assembly, gas can be blown into the air holes, and the gas blows towards the drilling assembly to clean the drill chips on the drilling assembly.

[0069] Specifically, the drilling assembly includes: a connecting shaft 25 and a drill bit 47.

[0070] Among them, the connecting shaft 25 is rotatably connected to the protective cover 4.

[0071] One end of the connecting shaft 25 is fixedly installed with a micro motor, and a drill bit 47 is installed on the output shaft of the micro motor. The drill bit 47 is connected to the output shaft of the micro motor through a fastening screw 43. The micro motor is used to provide power for the drill bit 47. Connecting with the micro motor through the fastening screw 43 facilitates replacing drill bits 47 of different specifications. The first driving assembly is connected to the connecting shaft 25. The first driving assembly drives the drill bit 47 to rotate through the connecting shaft 25. The air holes blow and clean the drill chips on the drill bit 47.

[0072] Furthermore, the first driving assembly includes: a rack 24, a first gear 23, and a second bevel gear 38.

[0073] Among them: The rack 24 is fixedly installed on the bottom wall of the groove body 1. The rack 24 is located inside the protective cover 4. A slot 39 for the rack 24 to pass through is provided on the side wall of the protective cover 4. The provision of the slot 39 enables the rack 24 not to interfere with the movement of the protective cover 4 when the protective cover 4 moves.

[0074] A connecting block 37 is fixedly installed on the inner wall of the protective cover 4. The axis of the first gear 23 is arranged horizontally. The first gear 23 is rotatably connected to the connecting block 37. The axis of the first gear 23 is perpendicular to the moving direction of the protective cover 4, and the first gear 23 meshes with the rack 24.

[0075] The second bevel gear 38 is fixedly installed at one end of the connecting shaft 25 away from the drill bit 47. A first bevel gear 22 is fixedly installed on the gear shaft of the first gear 23. The second bevel gear 38 meshes with the first bevel gear 22.

[0076] When the protective cover 4 moves, under the meshing action of the first gear 23 and the rack 24, the rack 24 causes the first gear 23 to rotate. The rotation of the first gear 23 drives the connecting shaft 25 to rotate through the meshing of the first bevel gear 22 and the second bevel gear 38. The rotation of the connecting shaft 25 drives the drilling assembly to rotate together. In this way, the air holes can clean the circumference of the drilling assembly.

[0077] A vertically arranged second partition 27 is fixedly installed in the tank body 1. A vertical first partition 5 is fixedly installed in the tank body 1 between the second partition 27 and the protective cover 4. A relief hole for the drilling is opened on the first partition 5.

[0078] During drilling, the circuit board abuts against the first partition 5, so that stable drilling can be achieved. The arrangement of the relief hole prevents the drill bit 47 from drilling into the first partition 5.

[0079] A grinding assembly is installed between the first partition 5 and the second partition 27.

[0080] Specifically, the grinding assembly includes: a grinding roller 21, a second gear 42 and a fastening screw 43.

[0081] Among them: two grinding rollers 21 are provided. The two grinding rollers 21 are arranged in parallel, and the axes of the two grinding rollers 21 are on the same horizontal plane. The axis of the grinding roller 21 is perpendicular to the moving direction of the protective cover 4. The grinding roller 21 is rotatably connected to the tank body 1.

[0082] Two second gears 42 are provided. The two second gears 42 correspond to the grinding rollers 21 one by one. The second gears 42 are respectively fixedly installed at one end of the corresponding grinding rollers 21. The two second gears 42 mesh with each other, and the second gears 42 are embedded in the side wall of the tank body 1.

[0083] The third motor 33 is fixedly installed on the side wall of the tank body 1. The output shaft of the third motor 33 penetrates the side wall of the tank body 1 and is fixedly connected to one of the grinding rollers 21.

[0084] Start the third motor 33. The third motor 33 drives the two grinding rollers 21 to rotate in opposite directions through the meshing of two second gears 42. The circuit board after drilling is placed between the two grinding rollers 21, and the grinding rollers 21 grind the drilling positions of the circuit board to remove burrs.

[0085] A cleaning component is installed on one side of the grinding component.

[0086] The cleaning component includes: a liquid storage tank 34, a rectangular frame 26, and a connecting pipe 41.

[0087] Among them, the liquid storage tank 34 is fixed on the tank body 1. A liquid filling port 35 communicating with the inner cavity of the liquid storage tank 34 is arranged above the liquid storage tank 34.

[0088] The rectangular frame 26 is fixedly installed below the cleaning component. A horizontal spray head 40 is provided on the rectangular frame 26. A liquid discharge port 28 is provided on the bottom wall of the tank body 1 corresponding to the rectangular frame 26.

[0089] The connecting pipe 41 connects the liquid storage tank 34 and the rectangular frame 26, and a water pump 36 is installed on the connecting pipe 41.

[0090] When the surface of the circuit board needs to be cleaned subsequently, the circuit board is moved to the position of the rectangular frame 26, and the circuit board moves downward to the middle cavity position of the rectangular frame 26. Start the water pump 36 to pump out the liquid in the liquid storage tank 34 and spray it through the spray head 40 provided on the rectangular frame 26, so that both the front and back sides of the circuit board are cleaned during the downward movement. Water washing can ensure that the surface of the circuit board is clean without impurities, providing a good environment for electroplating.

[0091] A collection hopper 10 for collecting drill chips is detachably installed below the protective cover 4 and the first partition 5.

[0092] Specifically, two guide plates 9 are fixedly installed at the lower end of the tank body 1, and the guide plates 9 are L-shaped. The collection hopper 10 is snap-fitted and slidably installed between the two guide plates 9. The bottom wall of the tank body 1 between the collection hopper 10 and the grinding component and the drilling component is removed.

[0093] Pull out the collection hopper 10 so that the collection hopper 10 can be easily removed. It is convenient to pour out the debris in the collection hopper 10.

[0094] A U-shaped frame 11 is horizontally slidably installed on the tank body 1, and a clamping component is vertically slidably installed on the U-shaped frame 11. The clamping component is used to clamp the circuit board. The horizontal sliding of the U-shaped frame 11 and the vertical sliding of the clamping component can transfer the circuit board to different workstations to perform different process treatments.

[0095] Specifically, the U-shaped frame 11 includes two vertical rods and a cross rod, and the two vertical rods are respectively fixed at both ends of the cross rod. A guide rod 8 with an axis parallel to the moving direction of the protective cover 4 is fixedly installed on the side wall of the groove body 1. The lower ends of the vertical rods of the U-shaped frame 11 are slidably connected to the guide rod 8. Above the guide rod 8, a first screw rod 7 parallel to the axis of the guide rod 8 is arranged, and the first screw rod 7 is threadedly connected to the groove body 1. A first motor 6 is fixedly installed at one end of the groove body 1, and the output shaft of the first motor 6 is fixedly connected to the first screw rod 7.

[0096] When the first motor 6 is started, the first motor 6 drives the first screw rod 7 to rotate. Since the first screw rod 7 is threadedly connected to the U-shaped frame 11, the first screw rod 7 will drive the U-shaped frame 11 to move along the axis direction of the guide rod 8.

[0097] A sliding plate 30 is vertically slidably installed on the vertical rod of the U-shaped frame 11. A second driving assembly for driving the sliding plate 30 to move up and down is installed between the sliding plate 30 and the U-shaped frame 11.

[0098] Specifically, the second driving assembly includes: a second screw rod 18 and a second motor 12.

[0099] Wherein, two second screw rods 18 are provided. The two second screw rods 18 are arranged in parallel. The second screw rods 18 are arranged in parallel with the vertical rods of the U-shaped frame 11. The second screw rods 18 are fixedly connected to the corresponding vertical rods of the U-shaped frame 11. The sliding plate 30 is threadedly connected to the second screw rods 18.

[0100] The second motor 12 is fixedly installed on the cross rod of the U-shaped frame 11, and the output shaft of the second motor 12 is fixedly connected to one of the second screw rods 18. The second motor 12 is connected to the other second screw rod 18 through a belt transmission assembly 45.

[0101] When the second motor 12 is started, the second motor 12 drives the two second screw rods 18 to rotate synchronously through the belt transmission assembly 45. The second screw rods 18 drive the sliding plate 30 to move up and down.

[0102] Two sets of clamping assemblies are provided. The clamping assemblies are installed on the sliding plate 30. Specifically, the clamping assembly includes a clamping plate 20. The clamping plate 20 is located below the sliding plate 30. A second electric push rod 19 is fixedly installed on the sliding plate 30. Two clamping plates 20 are provided, and the two clamping plates 20 are arranged in parallel. One of the clamping plates 20 is fixed on the lower side wall of the sliding plate 30, and the other clamping plate 20 is fixedly connected to the output rod of the second electric push rod 19.

[0103] Place the circuit board between the two clamping plates 20. Start the second electric push rod 19 to shorten it, and the two clamping plates 20 will clamp the circuit board.

[0104] A drying component is installed below the U-shaped frame 11.

[0105] Specifically, the drying component includes two fixed shells 17. The two fixed shells 17 are respectively fixedly installed at both ends of the U-shaped frame 11. A hair dryer 44 is fixedly installed on the side wall of the fixed shell 17. The fixed shell 17 is located on both sides of the clamping component, and the air outlet of the hair dryer 44 faces the circuit board inside the clamping component.

[0106] An electroplating component is installed at one end of the tank body 1 far from the protective cover 4.

[0107] Specifically, the electroplating component includes: an electroplating tank 29, a cover plate 13 and a reset structure.

[0108] Among them: the electroplating tank 29 is fixedly installed in the tank body 1 with the opening facing upward.

[0109] The cover plate 13 is slidably connected to the electroplating tank 29. The cover plate 13 includes a horizontal plate and two vertical plates. The two vertical plates are respectively fixed at both ends of the horizontal plate, and the two vertical plates are respectively located on the upper and lower sides of the horizontal plate. The height of the upper vertical plate is higher than the height of the fixed shell 17.

[0110] The reset structure is installed between the cover plate 13 and the side wall of the tank body 1.

[0111] Furthermore, the reset structure includes: a fixing plate 14, a first spring 15, a connecting plate 16 and a second spring 31.

[0112] Among them: the fixing plate 14 is fixedly installed on the tank body 1. The fixing plate 14 is located at one end of the tank body 1 far from the protective cover 4.

[0113] A relief groove is opened on the fixing plate 14. The vertical plate of the cover plate 13 is slidably connected to the relief groove. The first spring 15 is fixedly installed in the relief groove of the fixing plate 14. One end of the first spring 15 is fixed to the side wall of the relief groove, and the other end of the first spring 15 is fixed to the vertical plate of the cover plate 13.

[0114] The connecting plate 16 is vertically slidably connected to the upper side wall of the fixing plate 14. The lower end of the connecting plate 16 passes through the upper side wall of the relief groove and is located in the relief groove. A bevel block 32 is fixedly installed at the lower end of the connecting plate 16. One end of the bevel block 32 close to the cover plate 13 is provided with a bevel, and a clamping groove 46 cooperating with the bevel block 32 is opened on the cover plate 13.

[0115] The second spring 31 is fixed between the connecting plate 16 and the fixing plate 14.

[0116] When electroplating the circuit board, the U-shaped frame 11 is moved towards the side close to the electroplating tank 29. The fixed shell 17 on the U-shaped frame 11 will first contact the cover plate 13. During the continuous movement of the U-shaped frame 11, the fixed shell 17 will continuously squeeze the cover plate 13, so that a relative displacement occurs between the cover plate 13 and the electroplating tank 29, and the cover plate 13 is moved from the electroplating tank 29 to one side. This facilitates the circuit board to enter the electroplating tank 29 for electroplating treatment. During the process of the cover plate 13 moving to open the electroplating tank 29, the first spring 15 is compressed and deformed. When the cover plate 13 completely opens the electroplating tank 29, the connecting plate 16 is placed into the card slot 46 to prevent the cover plate 13 from rebounding. When the fixed shell 17 is separated from the cover plate 13, the connecting plate 16 is pulled out upwards, and the limit of the inclined block 32 on the cover plate 13 can be released. Under the elastic force of the first spring 15, the cover plate 13 moves reversely to reset and covers the electroplating tank 29.

[0117] The specific usage method of this application is as follows:

[0118] When it is necessary to punch holes in the circuit board, the circuit board is placed between the two clamping plates 20. The second electric push rod 19 is started to make the second electric push rod 19 shorten, so that the two clamping plates 20 clamp the circuit board.

[0119] Subsequently, the first motor 6 is started. The first motor 6 drives the first screw rod 7 to rotate, and the first screw rod 7 drives the U-shaped frame 11 to move towards the direction close to the protective cover 4. When the circuit board is located at the left side position of the first partition plate 5. The first motor 6 is turned off and the second motor 12 is started. The second motor 12 drives the second screw rod 18 to rotate, so that the sliding plate 30 moves downwards. The sliding plate 30 drives the circuit board to move downwards so that the circuit board fits against the left side of the first partition plate 5. During the subsequent hole punching work, the first partition plate 5 can support the circuit board.

[0120] After completing the above work, the hole punching work is started. The first electric push rod 3 is started, and the first electric push rod 3 pushes the protective cover 4 towards the direction close to the first partition plate 5. During the process of the protective cover 4 moving towards the first partition plate 5, under the meshing action of the first gear 23 and the rack 24, the rack 24 makes the first gear 23 rotate. The rotation of the first gear 23 drives the connecting shaft 25 to rotate through the meshing of the first bevel gear 22 and the second bevel gear 38. The rotation of the connecting shaft 25 drives the drilling assembly to rotate together. In this way, the air holes can clean the circumference of the drill bit 47.

[0121] When the drill bit 47 contacts the circuit board, the micro motor is started. The micro motor drives the drill bit 47 to rotate to perform drilling operations on the circuit board.

[0122] The debris generated by drilling will fall into the collection hopper 10 through the opening under the trough body 1 for unified collection, which can prevent the accumulation of debris in the trough body 1 and subsequent manual cleaning is required for use. After drilling is completed, the first electric push rod 3 retracts to move the drill bit 47 away from the circuit board after drilling. During the process of the drill bit 47 moving away from the circuit board, the connecting shaft 25 drives the drill bit 47 to rotate in the reverse direction, and air is still blown into the air holes to clean the debris in the guide groove of the drill bit 47 after drilling is completed.

[0123] When it is necessary to polish the burrs on the surface of the circuit board after drilling, the second motor 12 is started. The second motor 12 drives the sliding plate 30 to move upward, lifting the circuit board after drilling away from the first partition plate 5. Subsequently, the first motor 6 is started. The first motor 6 drives the U-shaped frame 11 to move above the two grinding rollers 21. The third motor 33 is started. The third motor 33 drives the two grinding rollers 21 to rotate. At the same time, the second motor 12 is started. The second motor 12 drives the circuit board to move downward. During the process of the circuit board moving downward, the surface of the circuit board is polished by the grinding rollers 21 to facilitate the removal of the burrs on the surface of the circuit board.

[0124] When the polishing is completed and the surface of the circuit board needs to be cleaned, the first motor 6 is started. The first motor 6 moves the U-shaped frame 11 above the rectangular frame 26. Subsequently, the second motor 12 is started. The second motor 12 drives the circuit board to move downward so that the circuit board is located at the middle position of the rectangular frame 26. When the circuit board moves downward, the water pump 36 is started. The water pump 36 pumps out the liquid in the liquid storage tank 34 and sprays it through the spray head 40 provided on the rectangular frame 26. The front and back sides of the circuit board are cleaned during the downward movement of the circuit board. Water washing can ensure that the surface of the circuit board is clean and free of impurities, providing a good environment for electroplating.

[0125] After the circuit board is cleaned, the second motor 12 is started to move the circuit board upward. During the process of the circuit board moving upward, the hair dryer 44 is started. Since the hair dryer 44 is provided at two places on the left and right sides of the U-shaped frame 11, the remaining moisture on both sides of the circuit board after cleaning is dried by the hair dryer 44. The drying treatment can ensure that there is no moisture residue on the surface of the circuit board, providing a dry surface for electroplating. Avoiding the moisture in the circuit board will quickly turn into water vapor and form bubbles during high-temperature electroplating, affecting the firmness of the welding points and the reliability of electrical connections. The drying treatment can pre-remove this moisture and significantly reduce the risk of welding bubbles.

[0126] Then, the circuit board is electroplated, and the first motor 6 is started, so that the U-shaped frame 11 drives the circuit board to move toward the electroplating box 29. During the movement of the U-shaped frame 11, the fixed shell 17 on the side of the U-shaped frame 11 close to the electroplating box 29 will first contact the cover plate 13. During the continuous movement of the U-shaped frame 11, the fixed shell 17 will continue to squeeze the cover plate 13, so that the cover plate 13 and the electroplating box 29 are relatively displaced, so that the cover plate 13 moves from the electroplating box 29 to one side, so that the opening of the electroplating box 29 is opened.

[0127] When the circuit board is moved to the Figure 15 After the circuit board is in the position shown, the second motor 12 is started to move the circuit board downward, and the circuit board is immersed in the electroplating box 29 for electroplating. After the electroplating operation is completed, the second motor 12 is started, and the circuit board is moved upward for resetting. During the resetting process, the hair dryer 44 is still started to dry the surface of the circuit board. The surface of the circuit board after drying is cleaner and smoother, which is conducive to subsequent assembly and welding work.

[0128] In the process that the fixed shell 17 pushes the cover plate 13 to move, the first spring 15 is compressed. Figure 15 After the position is reached, the inclined plane block 32 enters the slot 46 to limit the cover plate 13. In this way, the circuit board does not contact the cover plate 13 during the up and down movement of the circuit board above the electroplating box 29, thereby protecting the circuit board.

[0129] When the fixed shell 17 does not contact the cover plate 13, the connecting plate 16 is pulled upward, so that the inclined block 32 releases the limit of the cover plate 13. The cover plate 13 moves through the elastic return of the first spring 15, so that the cover plate 13 automatically covers the top of the electroplating box 29, thereby preventing dust and impurities from falling into the tank and affecting the quality of the coating.

[0130] When adding plating liquid to the plating box 29 later, the slot 46 on the cover 13 can be matched with the inclined block 32 by manual or fixed shell 17, so as to limit the cover 13 for adding liquid. After the addition of liquid is completed, the inclined block 32 can be disengaged from the slot 46 by toggling the connecting plate 16, so as to seal the plating box 29.

[0131] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electroplating device for processing integrated circuit boards, comprising a tank (1), characterized in that: A protective cover (4) is horizontally slidably mounted in the trough body (1), a drilling assembly is rotatably mounted on the protective cover (4), and a first driving assembly for driving the drilling assembly to rotate is mounted between the protective cover (4) and the drilling assembly; A second partition (27) is fixedly installed vertically in the tank body (1); a first partition (5) is fixedly installed vertically in the tank body (1) between the second partition (27) and the protective cover (4); a clearance hole matching the drilled hole is opened on the first partition (5); and a grinding assembly is installed between the first partition (5) and the second partition (27); A collecting bucket (10) for collecting drilling cuttings is detachably mounted below the protective cover (4) and the first partition plate (5); Air holes are provided on the side wall of the tank body (1) between the first partition plate (5) and the protective cover (4); A U-shaped frame (11) is horizontally slidably mounted on the trough body (1), a clamping assembly is vertically slidably mounted on the U-shaped frame (11), a drying assembly is mounted below the U-shaped frame (11), and an electroplating assembly is mounted at one end of the trough body (1) away from the protective cover (4).

2. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: A first electric push rod (3) is fixedly mounted on the trough body (1), the telescopic axis of the first electric push rod (3) is parallel to the moving direction of the protective cover (4), the telescopic end of the first electric push rod (3) passes through the side wall of the trough body (1) and is fixedly connected to the side wall of the protective cover (4), and two sliding rods (2) parallel to the axis of the first electric push rod (3) are fixedly mounted on the protective cover (4), the two sliding rods (2) are respectively arranged on both sides of the first electric push rod (3), and the sliding rod (2) is slidably connected to the trough body (1).

3. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: The drilling assembly comprises: a connecting shaft (25), the connecting shaft (25) being rotatably connected to the protective cover (4); A drill bit (47), a micro motor is fixedly mounted on one end of the connecting shaft (25), a drill bit (47) is mounted on the output shaft of the micro motor, and the drill bit (47) is connected to the output shaft of the micro motor via a fastening screw (43); The first driving assembly comprises: a rack (24), the rack (24) being fixedly mounted on the bottom wall of the trough body (1), the rack (24) being located in the protective cover (4), and a slot (39) for the rack (24) to pass through being formed on the side wall of the protective cover (4); A first gear (23), a connecting block (37) is fixedly mounted on the inner wall of the protective cover (4), the axis of the first gear (23) is arranged in the horizontal direction, the first gear (23) is rotatably connected to the connecting block (37), the axis of the first gear (23) is perpendicular to the moving direction of the protective cover (4), and the first gear (23) is meshed with the rack (24); A second bevel gear (38), wherein the second bevel gear (38) is fixedly mounted on an end of the connecting shaft (25) away from the drill bit (47), a first bevel gear (22) is fixedly mounted on the first gear (23), and the second bevel gear (38) is meshed with the first bevel gear (22).

4. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: The grinding assembly comprises: a grinding roller (21), wherein two grinding rollers (21) are provided, the two grinding rollers (21) are arranged in parallel, the axes of the two grinding rollers (21) are located on the same horizontal plane, the axes of the grinding rollers (21) are perpendicular to the moving direction of the protective cover (4), and the grinding rollers (21) are rotatably connected to the tank body (1); a second gear (42), wherein two second gears (42) are provided, and the two second gears (42) correspond to the grinding rollers (21) one by one, and the second gears (42) are fixedly mounted on one end of the corresponding grinding rollers (21), and the two second gears (42) are meshed with each other, and the second gears (42) are embedded in the side wall of the tank body (1); A third motor (33), the third motor (33) is fixedly mounted on the side wall of the tank body (1), and an output shaft of the third motor (33) passes through the side wall of the tank body (1) and is fixedly connected to one of the grinding rollers (21).

5. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: The U-shaped frame (11) comprises two vertical bars and a horizontal bar, and the two vertical bars are respectively fixed at two ends of the horizontal bar; A guide rod (8) whose axis is parallel to the moving direction of the protective cover (4) is fixedly mounted on the side wall of the trough body (1), and the lower end of the vertical rod of the U-shaped frame (11) is slidably connected to the guide rod (8); A first screw rod (7) parallel to the axis of the guide rod (8) is arranged above the guide rod (8), and the first screw rod (7) is threadedly connected to the trough body (1); A first motor (6) is fixedly mounted on one end of the tank body (1), and an output shaft of the first motor (6) is fixedly connected to the first screw rod (7).

6. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: A sliding plate (30) is vertically slidably mounted on the vertical rod of the U-shaped frame (11), and a second driving component for driving the sliding plate (30) to move up and down is installed between the sliding plate (30) and the U-shaped frame (11); The second driving assembly comprises: a second screw rod (18), wherein the second screw rod (18) is provided in two pieces, the two second screw rods (18) are provided in parallel, the second screw rod (18) is provided in parallel with the vertical rod of the U-shaped frame (11), and the second screw rod (18) is fixedly connected with the vertical rod corresponding to the U-shaped frame (11); The sliding plate (30) is threadedly connected to the second screw rod (18); A second motor (12), wherein the second motor (12) is fixedly mounted on a crossbar of the U-shaped frame (11), and an output shaft of the second motor (12) is fixedly connected to one of the second screw rods (18); the second motor (12) is connected to the other second screw rod (18) via a transmission belt assembly (45).

7. The electroplating device for processing integrated circuit boards according to claim 6, characterized in that: The clamping assembly is provided in two groups, and the clamping assembly is installed on the sliding plate (30); the clamping assembly comprises: a clamping plate (20), the clamping plate (20) is located below the sliding plate (30), and a second electric push rod (19) is fixedly installed on the sliding plate (30), and the clamping plates (20) are provided in two groups, and the two clamping plates (20) are arranged in parallel, one of the clamping plates (20) is fixed on the lower side wall of the sliding plate (30), and the other clamping plate (20) is fixedly connected to the output rod of the second electric push rod (19).

8. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: The drying component comprises two fixed shells (17), the two fixed shells (17) are respectively fixedly mounted on the two ends of the U-shaped frame (11), a blower (44) is fixedly mounted on the side walls of the fixed shells (17), the fixed shells (17) are located on both sides of the clamping component, and an air outlet of the blower (44) faces the clamping component.

9. The electroplating device for processing integrated circuit boards according to claim 8, characterized in that: The electroplating assembly comprises: an electroplating box (29), the electroplating box (29) being fixed in the tank body (1) with its opening facing upward; A cover plate (13), wherein the cover plate (13) is slidably connected to the electroplating box (29); the cover plate (13) comprises a horizontal plate and two vertical plates, wherein the two vertical plates are respectively fixed at two ends of the horizontal plate, and the two vertical plates are respectively located at the upper and lower sides of the horizontal plate, and the height of the vertical plate located at the upper side is higher than the height of the fixed shell (17); A reset structure, the reset structure being installed between the cover plate (13) and the side wall of the tank body (1); The reset structure comprises: a fixing plate (14), the fixing plate (14) being fixedly mounted on the tank body (1), the fixing plate (14) being located at an end of the tank body (1) away from the protective cover (4); A first spring (15), wherein a clearance groove is provided on the fixed plate (14), the vertical plate of the cover plate (13) is slidably connected to the clearance groove, the first spring (15) is fixedly installed in the clearance groove of the fixed plate (14), one end of the first spring (15) is fixed on the side wall of the clearance groove, and the other end of the first spring (15) is fixed on the vertical plate of the cover plate (13); A connecting plate (16), wherein the connecting plate (16) is vertically slidably connected to the upper side wall of the fixing plate (14), the lower end of the connecting plate (16) passes through the upper side wall of the clearance groove and is located in the clearance groove, a slope block (32) is fixedly installed on the lower end of the connecting plate (16), one end of the slope block (32) close to the cover plate (13) is set as a slope, and a slot (46) cooperating with the slope block (32) is opened on the cover plate (13); A second spring (31), wherein the second spring (31) is fixed between the connecting plate (16) and the fixing plate (14).

10. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: A cleaning component is installed on one side of the polishing component; The cleaning assembly comprises: a liquid storage tank (34), the liquid storage tank (34) being fixed on the tank body (1); a liquid filling port (35) communicating with the inner chamber of the liquid storage tank (34) being arranged above the liquid storage tank (34); A rectangular frame (26), the rectangular frame (26) being fixedly mounted below the cleaning assembly, the rectangular frame (26) being provided with a horizontal spray head (40), and a liquid discharge port (28) being provided on the bottom wall of the tank body (1) corresponding to the rectangular frame (26); A connecting pipe (41) connects the liquid storage tank (34) and the rectangular frame (26), and a water pump (36) is installed on the connecting pipe (41).

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