Processing method of ridge waveguide frequency sweep antenna and ridge waveguide frequency sweep antenna
By decomposing the processing process of the waveguide cavity and using the low-temperature solder paste welding method, the high cost and low accuracy of processing ridges and grooves in the ridge waveguide scanning antenna cavity are solved, and the production efficiency and pass rate are improved.
Patent Information
- Application Number
- CN202510333503.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2025-06-17
AI Technical Summary
The cost of machining ridges and grooves in the cavity of the ridge wave guide scanning antenna is high and the processing accuracy is difficult to control, resulting in low production efficiency and pass rate.
Through the processing process of decomposing the waveguide cavity, the waveguide cavity bottom plate, frame, ridge plate, positioning partition plate, top plate and plug are first formed, and the low-temperature solder paste is used for welding to form a ridge waveguide scanning antenna.
This method reduces the difficulty of cavity processing, improves production efficiency and pass rate, and reduces processing costs.
Smart Images
Figure CN120165242A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of antenna structures, and more particularly, to a processing method for a ridge waveguide frequency scanning antenna and a ridge waveguide frequency scanning antenna. Background Art
[0002] A ridge waveguide frequency scanning antenna is an antenna that uses a ridge waveguide structure to achieve frequency scanning. It realizes the frequency scanning of electromagnetic waves by changing the geometric structure or electromagnetic characteristics of the waveguide. Its main function is to achieve electronic scanning of the beam in radar and communication systems, improve the target search and tracking efficiency, and increase the communication coverage range and flexibility. The working principle of the ridge waveguide frequency scanning antenna is based on the frequency selectivity of the ridge waveguide and the radiation characteristics of the waveguide slots. By adjusting the parameters of the ridge waveguide and the arrangement of the slots, the directional radiation and frequency scanning of electromagnetic waves are realized.
[0003] The ridge of the ridge waveguide frequency scanning antenna is located between the upper and lower metal plates. The processing cost of machining the ridge and grooves in the cavity is relatively high, and it is difficult to control deformation and machining accuracy. Summary of the Invention
[0004] The present disclosure provides a processing method for a ridge waveguide frequency scanning antenna and a ridge waveguide frequency scanning antenna, which can reduce the processing difficulty of the cavity of the ridge waveguide frequency scanning antenna, improve production efficiency, and improve the qualification rate.
[0005] According to one aspect of the present disclosure, there is provided a processing method for a ridge waveguide frequency scanning antenna, including:
[0006] Processing to form a waveguide cavity bottom plate, a waveguide cavity surrounding frame, a waveguide cavity ridge plate, a waveguide cavity positioning partition, a waveguide cavity top plate, and a plug;
[0007] Coating a low-temperature solder paste on the upper surface of the waveguide cavity bottom plate;
[0008] Installing the waveguide cavity surrounding frame on the waveguide cavity bottom plate, and the waveguide cavity surrounding frame surrounds the four sides of the waveguide cavity bottom plate to form a waveguide cavity space;
[0009] Installing the waveguide cavity ridge plate and the waveguide cavity positioning partition in the waveguide cavity space. The waveguide cavity ridge plate and the waveguide cavity positioning partition both extend along a first direction, and the waveguide cavity ridge plate and the waveguide cavity positioning partition are alternately arranged in an array along a second direction. The waveguide cavity surrounding frame and the waveguide cavity ridge plate at the two opposite ends of the waveguide cavity space in the second direction are adjacent; the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the waveguide cavity bottom plate;
[0010] Coating a low-temperature solder paste between the top of the waveguide cavity surrounding frame, the waveguide cavity ridge plate, the waveguide cavity positioning partition, and the waveguide cavity top plate;
[0011] Install the top plate of the waveguide cavity on the top of the waveguide cavity enclosure, the ridge plate of the waveguide cavity and the positioning partition of the waveguide cavity, and install two plugs on both sides of the second direction of the bottom plate of the waveguide cavity to form a pre-welding assembly;
[0012] Weld the pre-welding assembly to form a ridge waveguide frequency-scanning antenna.
[0013] In an exemplary embodiment of the present disclosure, applying a low-temperature solder paste between the top of the waveguide cavity enclosure, the ridge plate of the waveguide cavity, the positioning partition of the waveguide cavity and the top plate of the waveguide cavity includes:
[0014] Generate a first tooling grid according to the top shapes of the waveguide cavity enclosure, the ridge plate of the waveguide cavity, and the positioning partition of the waveguide cavity. The first tooling grid has a first hollowed-out part that matches the top of the waveguide cavity enclosure, the top of the ridge plate of the waveguide cavity, and the top of the positioning partition of the waveguide cavity;
[0015] Align the first tooling grid with the bottom surface of the top plate of the waveguide cavity, and apply a low-temperature solder paste on the side of the first tooling grid away from the top plate of the waveguide cavity.
[0016] In an exemplary embodiment of the present disclosure, applying a low-temperature solder paste on the upper surface of the bottom plate of the waveguide cavity includes:
[0017] Generate a second tooling grid according to the layout of the ridge plates of the waveguide cavity. The second tooling grid has a second hollowed-out part that matches the bottom of the ridge plates of the waveguide cavity;
[0018] Align the second tooling grid with the upper surface of the bottom plate of the waveguide cavity, and apply a low-temperature solder paste on the side of the second tooling grid away from the bottom plate of the waveguide cavity.
[0019] In an exemplary embodiment of the present disclosure, the upper surface of the bottom plate of the waveguide cavity has waveguide cavity protrusions arranged in an array along the first direction and the second direction. The second tooling grid has square holes that match the waveguide cavity protrusions. When the second tooling grid is aligned with the upper surface of the bottom plate of the waveguide cavity, the second tooling grid is sleeved on the upper surface of the bottom plate of the waveguide cavity through the square holes; when applying a low-temperature solder paste on the side of the second tooling grid away from the bottom plate of the waveguide cavity, the low-temperature solder paste does not contact the waveguide cavity protrusions.
[0020] In an exemplary embodiment of the present disclosure, installing the ridge plate of the waveguide cavity and the positioning partition of the waveguide cavity in the waveguide cavity space includes:
[0021] Start assembling from the waveguide cavity enclosure at one end of the second direction, install the ridge plate of the waveguide cavity on the waveguide cavity enclosure. The first partition of the ridge plate of the waveguide cavity matches the first stop on the waveguide cavity enclosure, and the first vertical plate of the ridge plate of the waveguide cavity matches the ridge plate installation groove on the top surface of the bottom plate of the waveguide cavity;
[0022] Install the waveguide cavity positioning partition on the side of the assembled waveguide cavity ridge plate away from the waveguide cavity enclosure. The side of the first partition away from the waveguide cavity enclosure matches the rabbet of the ridge plate of the waveguide cavity positioning partition.
[0023] Install the waveguide cavity ridge plate and the waveguide cavity positioning partition in sequence along the second direction.
[0024] In an exemplary embodiment of the present disclosure, installing the waveguide cavity ridge plate and the waveguide cavity positioning partition in the waveguide cavity space includes:
[0025] Assemble the waveguide cavity ridge plate and the waveguide cavity positioning partition into one body in sequence and alternately along the second direction. The first partition of the waveguide cavity ridge plate matches the rabbet of the ridge plate of the adjacent waveguide cavity positioning partition to form a waveguide cavity assembly.
[0026] Install the entire waveguide cavity assembly into the waveguide cavity space. The first partitions at both ends of the waveguide cavity assembly in the second direction match the first rabbets on the waveguide cavity enclosure, and each waveguide cavity ridge plate matches the ridge plate installation groove on the top surface of the waveguide cavity bottom plate.
[0027] In an exemplary embodiment of the present disclosure, the waveguide cavity enclosure includes a first enclosure provided at opposite ends in the first direction and a second enclosure provided at opposite ends in the second direction. The first enclosure and the second enclosure are connected end to end in sequence to enclose the waveguide cavity space. Installing the waveguide cavity enclosure on the waveguide cavity bottom plate includes:
[0028] Install the first enclosure on one side of the waveguide cavity bottom plate in the first direction. The first enclosure is threadedly connected to the waveguide cavity bottom plate.
[0029] Install the two second enclosures on both sides of the waveguide cavity bottom plate in the second direction respectively. The two second enclosures are threadedly connected to the opposite ends of the first enclosure in the second direction respectively.
[0030] Install the other first enclosure on the other side of the waveguide cavity bottom plate in the first direction and threadedly connect it to the two second enclosures and the waveguide cavity bottom plate.
[0031] In an exemplary embodiment of the present disclosure, before installing the two plugs on both sides of the waveguide cavity bottom plate in the second direction, the processing method of the ridged waveguide frequency-scanning antenna further includes:
[0032] Apply low-temperature solder paste between the top surface of the plug, the bottom surface of the waveguide cavity enclosure, and the bottom surface of the waveguide cavity ridge plate adjacent to the waveguide cavity enclosure.
[0033] According to another aspect of the present disclosure, there is provided a ridged waveguide frequency-scanning antenna, including a waveguide cavity bottom plate, a waveguide cavity enclosure, a waveguide cavity ridge plate, a waveguide cavity positioning partition, a waveguide cavity top plate, and plugs.
[0034] The waveguide cavity enclosure surrounds the periphery of the waveguide cavity bottom plate to form a waveguide cavity space; the waveguide cavity ridge plate and the waveguide cavity positioning partition both extend in the first direction, and the waveguide cavity ridge plate and the waveguide cavity positioning partition are alternately arranged in an array in the second direction, and the waveguide cavity enclosures at the two opposite ends in the second direction of the waveguide cavity space are adjacent to the waveguide cavity ridge plate;
[0035] The waveguide cavity ridge plate has a first partition, and the waveguide cavity ridge plate matches the ridge plate stop of the adjacent waveguide cavity positioning partition through the first partition, and the waveguide cavity ridge plate matches the first stop on the adjacent waveguide cavity enclosure through the first partition; the waveguide cavity ridge plate matches the ridge plate installation groove on the top surface of the waveguide cavity bottom plate;
[0036] The waveguide cavity top plate is arranged on the top of the waveguide cavity enclosure, the waveguide cavity ridge plate and the waveguide cavity positioning partition. The waveguide cavity top plate has a plurality of radiation slots extending in the second direction and arranged in an array in the first and second directions, and the radiation slots penetrate through the waveguide cavity top plate; two plugs are installed on both sides of the waveguide cavity bottom plate in the second direction;
[0037] Multiple mutually independent chamber channels are formed in the ridge waveguide frequency scanning antenna in an array along the first direction and extending in the second direction. The plug has a plurality of feeding ports along the first direction, and the feeding ports correspond to the chamber channels one by one, so that electromagnetic waves are input from the feeding port of one plug, pass through a chamber channel, are coupled to free space through the radiation slot, and the remaining energy is absorbed by the absorption load of the other plug;
[0038] The radiation slots correspond to the chamber channels one by one along the first direction, and the radiation slots correspond to the first partitions one by one along the second direction, so that the electromagnetic waves in the chamber channels enter and exit through the radiation slots; the first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are parallel to the waveguide cavity bottom plate.
[0039] In an exemplary embodiment of the present disclosure, weld seams are formed between the waveguide cavity bottom plate and each waveguide cavity ridge plate; weld seams are formed between each waveguide cavity ridge plate, the waveguide cavity positioning partition, the waveguide cavity enclosure and the waveguide cavity top plate; weld seams are formed between the top surface of the plug and the bottom surface of the waveguide cavity enclosure and the bottom surface of the waveguide cavity ridge plate adjacent to the waveguide cavity enclosure.
[0040] The processing method of the ridge waveguide frequency scanning antenna of the present disclosure can be used to process the ridge waveguide frequency scanning antenna provided above. First, the waveguide cavity enclosure is surrounded to form a waveguide cavity space, then the waveguide cavity ridge plate and the waveguide cavity positioning partition are installed in the waveguide cavity space, and the waveguide cavity top plate is buckled to form the cavity of the ridge waveguide frequency scanning antenna. By reasonably dividing the waveguide cavity according to the positions of each ridge and then respectively assembling the waveguide cavity ridge plate and the waveguide cavity positioning partition, the processing difficulty of the cavity can be reduced, the production efficiency can be improved, and the qualification rate can be improved.
[0041] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the present disclosure. Brief Description of the Drawings
[0042] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.
[0043] Figure 1 Schematic diagram of an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0044] Figure 2 Schematic diagram of an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure after removing the top plate of the waveguide cavity and part of the enclosure of the waveguide cavity.
[0045] Figure 3 Schematic diagram of the bottom plate of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0046] Figure 4 Partial top view of the assembly of the enclosure of the waveguide cavity, the ridge plate of the waveguide cavity, and the positioning partition of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0047] Figure 5 Schematic diagram of the ridge plate of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0048] Figure 6 Partial schematic diagram of the ridge plate of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0049] Figure 7 Schematic diagram of the radiation slot on the top plate of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0050] Figure 8 Schematic diagram of the positioning partition of the waveguide cavity in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0051] Figure 9 Schematic diagram of the first hollowed-out portion in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0052] Figure 10 Schematic diagram of the second hollowed-out portion in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0053] Figure 11Schematic diagram of a plug in an exemplary embodiment of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0054] Figure 12 Flow chart of the processing method of the ridge waveguide frequency-scanning antenna of the present disclosure.
[0055] Description of reference numerals:
[0056] 1. Bottom plate of waveguide cavity; 11. Protrusion of waveguide cavity; 12. Installation groove for ridge plate; 2. Enclosure of waveguide cavity body; 21. First enclosure; 22. Second enclosure; 23. First rabbet; 24. Second rabbet; 3. Ridge plate of waveguide cavity; 31. First partition; 32. First vertical plate; 33. First ridge plate; 4. Positioning partition of waveguide cavity; 41. Rabbet for ridge plate; 42. Choke groove; 5. Top plate of waveguide cavity; 51. Radiation slot; 6. Plug; 61. First coupling block; 62. Second coupling block; 63. Connecting plate. Detailed implementation manners
[0057] Now, example embodiments will be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.
[0058] Unless otherwise specified or stated, the technical terms or scientific terms used in this disclosure should have the ordinary meanings understood by those of ordinary skill in the art to which this disclosure pertains. The terms "a", "one", "the", "said" and "at least one" are used to denote the existence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second" are only used as labels and do not limit the quantity or importance or order of their objects.
[0059] When it is stated in this disclosure that "Part A is provided on Part B", it can mean that Part A is directly connected to Part B in contact, or that Part A is provided on Part C and Part C is provided on Part B.
[0060] In the description of the present disclosure, it should be understood that the orientation or positional relationships indicated by terms such as "inner / outer", "upper / lower", "top / bottom", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present disclosure. It should be understood that these directional terms are relative concepts, and they can change accordingly with the change of the orientation in which the components are placed in the drawings.
[0061] The ridge of the ridge waveguide frequency-scanning antenna is located between the upper and lower metal plates. The processing cost of machining the ridge and the groove in the cavity is relatively high, and it is difficult to control deformation and machining accuracy. For example, referring to Figure 1 a ridge waveguide frequency-scanning antenna shown, for the convenience of understanding, a structure of the ridge waveguide frequency-scanning antenna is provided.
[0062] The present disclosure provides a ridge waveguide frequency-scanning antenna, including a waveguide cavity bottom plate 1, a waveguide cavity surrounding frame 2, a waveguide cavity ridge plate 3, a waveguide cavity positioning partition 4, a waveguide cavity top plate 5 and a plug 6. Referring to Figure 1 the overall schematic diagram of the ridge waveguide frequency-scanning antenna shown; Figure 2 the schematic diagram of the ridge waveguide frequency-scanning antenna after removing the waveguide cavity top plate 5 and part of the waveguide cavity surrounding frame 2 shown; Figure 3 the schematic diagram of the waveguide cavity bottom plate 1 shown; Figure 4 the partial top view of the assembly of the waveguide cavity surrounding frame 2, the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 shown; Figure 5 the overall schematic diagram of the waveguide cavity ridge plate 3 shown; Figure 6 the partial schematic diagram of the waveguide cavity ridge plate 3 shown; Figure 7 the schematic diagram of the radiation slot 51 on the waveguide cavity top plate 5 shown; Figure 8 the overall schematic diagram of the waveguide cavity positioning partition 4 shown. For the convenience of description, the waveguide cavity top plate 5 is taken as "upper", the waveguide cavity bottom plate 1 is taken as "lower", and two orthogonal directions in the plane parallel to the waveguide cavity top plate 5 and the waveguide cavity bottom plate 1 are defined as the first direction X and the second direction Y respectively. The waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 extend along the first direction X and are alternately arranged in an array along the second direction Y.
[0063] Specifically, referring to Figure 1 、 Figure 2As shown, the waveguide cavity enclosure 2 surrounds the periphery of the waveguide cavity bottom plate 1 to form a waveguide cavity space. The waveguide cavity ridge plates 3 and the waveguide cavity positioning partition plates 4 are arranged alternately in the Y direction. The waveguide cavity enclosure 2 at the relatively two ends in the Y direction of the waveguide cavity space is adjacent to the waveguide cavity ridge plates 3. Exemplarily, 32 waveguide cavity ridge plates 3 are installed in the waveguide cavity space. Correspondingly, 31 waveguide cavity positioning partition plates 4 are installed in the waveguide cavity space and are respectively installed between adjacent waveguide cavity ridge plates 3 one by one.
[0064] Refer to Figure 2 、 Figure 4 、 Figure 5 、 Figure 6 As shown, the waveguide cavity ridge plate 3 has a first partition plate 31. The waveguide cavity ridge plate 3 is matched with the ridge plate stop 41 of the adjacent waveguide cavity positioning partition plate 4 through the first partition plate 31, and the waveguide cavity ridge plate 3 is matched with the first stop 23 on the adjacent waveguide cavity enclosure 2 through the first partition plate 31; the waveguide cavity ridge plate 3 is matched with the ridge plate installation groove 12 on the top surface of the waveguide cavity bottom plate 1. By matching the waveguide cavity ridge plate 3 with the first stop 23 and the ridge plate installation groove 12, the waveguide cavity ridge plate 3 can be accurately fixed on the waveguide cavity enclosure 2 and the waveguide cavity bottom plate 1.
[0065] The waveguide cavity top plate 5 is arranged at the uppermost part of the ridge waveguide frequency scanning antenna. Specifically, refer to Figure 1 、 Figure 2 As shown, the waveguide cavity top plate 5 is arranged on the top of the waveguide cavity enclosure 2, the waveguide cavity ridge plates 3 and the waveguide cavity positioning partition plates 4. Refer to Figure 1 、 Figure 7 As shown, the waveguide cavity top plate 5 has a plurality of radiation slots 51 extending in the Y direction and arranged in an array in the X direction and the Y direction. The radiation slots 51 penetrate the waveguide cavity top plate 5. Two plugs 6 are installed on both sides of the waveguide cavity bottom plate 1 in the Y direction. The plugs 6 are in an "L" shape. The top surface of the plugs 6 is in contact with the bottom surface of the waveguide cavity enclosure 2 in the X direction and the Y direction and the outermost waveguide cavity ridge plates 3 in the Y direction, and the plugs 6 are also in contact with the bottom surface of the waveguide cavity bottom plate 1.
[0066] Multiple independent chamber channels are formed in the ridge waveguide frequency scanning antenna, which are arranged in an array in the X direction and extend in the Y direction. Each waveguide cavity ridge plate 3 corresponds to a chamber channel, and the waveguide cavity positioning partition plates 4 separate the chamber channels. The plug 6 has a plurality of feed ports in the X direction. The feed ports correspond to the chamber channels one by one, that is, to each antenna channel, so that electromagnetic waves are input from the feed port of one plug 6, pass through the waveguide structure in a chamber channel, and the energy is coupled from the radiation slot 51 to free space, and the less remaining energy is absorbed by the absorption load matched with the other plug 6.
[0067] Specifically, the radiation slots 51 correspond to the respective chamber channels in the X direction, and the radiation slots 51 correspond to the first partition plates 31 in the Y direction, so that the electromagnetic waves in the respective chamber channels can enter and exit through the radiation slots 51. For each chamber channel in the X direction, there is a row of radiation slots 51 arrayed in the X direction; between every two adjacent first partition plates 31 of each waveguide cavity ridge plate 3, there is a corresponding radiation slot 51. The radiation slot 51 can be a counterbore structure, as shown in reference Figure 7 shown. Exemplarily, the depth of the radiation slot 51, i.e., the thickness of the waveguide cavity top plate 5, is 1 mm, and the depth of the countersunk head is 0.5 mm. The electromagnetic wave is input into the chamber channel corresponding to the coupling hole in the ridge waveguide frequency-scanning antenna from any one of the feed ports of the plug 6 on one side. The electromagnetic wave passes through the chamber channel in a snake-like manner around each first ridge plate 33 in the chamber channel. During this process, the electromagnetic wave can be coupled from the radiation slot 51 to free space, and the remaining energy is absorbed by the absorption load matched with the plug 6 at the other end.
[0068] During the frequency scanning process of the ridge waveguide frequency-scanning antenna, the electromagnetic wave propagates along the waveguide structure formed in the ridge waveguide cavity. The amplitude of the wave attenuates towards the load, and the electromagnetic energy in the waveguide is coupled to free space through the radiation slot 51. By adjusting the amplitude-phase relationship of each antenna channel, the beam is scanned, thereby achieving frequency scanning. The ridge waveguide frequency-scanning antenna of the present disclosure is positioned by the ridge plate stop 41 on the waveguide cavity positioning partition 4, the first stop 23 on the waveguide cavity frame 2, and the first partition plate 31 on the waveguide cavity ridge plate 3. On the one hand, it can reduce the processing and assembly difficulty, making it easier to ensure the dimensional accuracy and tolerance requirements; on the other hand, the turning point of the sunken structure of the stop can also block the propagation of electromagnetic waves. Even if there are small gaps at the joints matched with the stop, the electromagnetic waves cannot pass through the stop and enter another chamber channel, thereby further ensuring the isolation degree between the respective chamber channels.
[0069] Next, in combination with the accompanying drawings and the above structure of the ridge waveguide frequency-scanning antenna, the processing method of the ridge waveguide frequency-scanning antenna provided by the present disclosure will be further described.
[0070] The processing accuracy requirements of the ridge waveguide frequency-scanning antenna are very high. For example, the dimensional accuracy and geometric tolerance of the chamber channels and radiation slots 51 of a certain ridge waveguide frequency-scanning antenna need to be controlled within 0.02 mm, and the surface roughness requirement of the inner surface of the cavity is above Ra1.6. Since the size of the ridge waveguide cavity is small and the depth is deep, the tool cannot process it.
[0071] One processing method in the related art is to use a wire threading machine to process wire threading holes in each cavity, and a total of more than a thousand wire threading holes need to be drilled; then, slow wire cutting is used to process each ridge in the cavity, and finally, electric discharge machining is used to process the groove on the side of the ridge. After processing, each component is silver-plated, and then the cover plate, cavity, and plug are welded. However, when drilling wire threading holes in deep cavities, black hard slag is easily generated on the inner wall of the holes. When slow wire cutting the cavity, the black hard slag will affect the discharge, resulting in poor processing accuracy. Moreover, the time cycle of these two special processing methods, slow wire cutting and electric discharge machining, is too long, the cost is too high, and the processing economy is too poor.
[0072] In view of the above problems, the present disclosure provides a processing method for a ridge waveguide frequency scanning antenna, referring to Figure 12 as shown, including steps S1000 to S7000:
[0073] Step S1000: Process and form a waveguide cavity bottom plate 1, a waveguide cavity surrounding frame 2, a waveguide cavity ridge plate 3, a waveguide cavity positioning partition 4, a waveguide cavity top plate 5, and a plug 6.
[0074] Step S2000: Coat a low-temperature solder paste on the upper surface of the waveguide cavity bottom plate 1.
[0075] Step S3000: Install the waveguide cavity surrounding frame 2 on the waveguide cavity bottom plate 1. The waveguide cavity surrounding frame 2 surrounds the four sides of the waveguide cavity bottom plate 1 to form a waveguide cavity space.
[0076] Step S4000: Install the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 in the waveguide cavity space. Both the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 extend along a first direction, and the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 are alternately arranged in an array along a second direction. The waveguide cavity surrounding frame 2 and the waveguide cavity ridge plate 3 at opposite ends of the waveguide cavity space in the second direction are adjacent; the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the waveguide cavity bottom plate 1.
[0077] Step S5000: Coat a low-temperature solder paste between the top of the waveguide cavity surrounding frame 2, the waveguide cavity ridge plate 3, the waveguide cavity positioning partition 4, and the waveguide cavity top plate 5.
[0078] Step S6000: Install the waveguide cavity top plate 5 on the top of the waveguide cavity surrounding frame 2, the waveguide cavity ridge plate 3, and the waveguide cavity positioning partition 4, and install two plugs 6 on both sides of the waveguide cavity bottom plate 1 in the second direction to form a pre-welding assembly.
[0079] Step S7000: Weld the pre-welding assembly to form a ridge waveguide frequency scanning antenna.
[0080] The processing method of the ridge waveguide frequency-scanning antenna according to the exemplary embodiments of the present disclosure can be used to process the ridge waveguide frequency-scanning antenna provided above. First, the waveguide cavity enclosure 2 is formed into a waveguide cavity space, and then the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 are installed in the waveguide cavity space, and the waveguide cavity top plate 5 is buckled to form the cavity of the ridge waveguide frequency-scanning antenna. By reasonably dividing the waveguide cavity according to the positions of the ridges and then separately assembling the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4, the processing difficulty of the cavity can be reduced, the production efficiency can be improved, and the qualified rate can be increased.
[0081] Exemplarily, in step S1000, the waveguide cavity bottom plate 1, the waveguide cavity enclosure 2, the waveguide cavity ridge plate 3, the waveguide cavity positioning partition 4, the waveguide cavity top plate 5 and the plug 6 are processed. The structures of the respective components can refer to the structure of the ridge waveguide frequency-scanning antenna provided above and Figures 1 to 8 as shown.
[0082] Exemplarily, after step S1000 and before step S2000, the processing method of the ridge waveguide frequency-scanning antenna further includes plating silver on the surfaces of the processed components to increase the weldability.
[0083] In step S2000, applying low-temperature solder paste on the upper surface of the waveguide cavity bottom plate 1 may include step S2100 and step S2200:
[0084] Step S2100: Generate a second tooling grid according to the layout of the waveguide cavity ridge plate 3. The second tooling grid has a second hollow part that matches the bottom of the waveguide cavity ridge plate 3.
[0085] Step S2200: Align the second tooling grid with the upper surface of the waveguide cavity bottom plate 1, and apply low-temperature solder paste on the side of the second tooling grid away from the waveguide cavity bottom plate 1.
[0086] Specifically, apply low-temperature solder paste between the bottom of the first partition 31 of the waveguide cavity ridge plate 3 and the upper surface of the waveguide cavity bottom plate 1 so as to form a weld seam during welding in step S7000. The low-temperature solder paste is a solder paste with a melting point below 150°C. In step S2100, generating the second tooling grid according to the layout of the waveguide cavity ridge plate 3 may be to determine the welding area according to the intervals of the respective waveguide cavity ridge plates 3 and the intervals between adjacent first partitions 31 on the same waveguide cavity ridge plate 3, and generate the second tooling grid according to the welding area.
[0087] The second tooling grid has a second hollow part that matches the area where the low-temperature solder paste is to be applied. The area where the low-temperature solder paste is to be applied refers to Figure 10 as shown. Figure 10The shaded area represents the area where the low-temperature solder paste is to be coated, corresponding to the second hollow part on the second tooling grid. The second tooling grid can be a metal mesh. For example, it can be formed by precisely laser-cutting a metal sheet to form the second hollow part. In step S2200, when coating the low-temperature solder paste on the side of the second tooling grid away from the waveguide cavity bottom plate 1, the low-temperature solder paste is coated from the second hollow part to the top surface of the waveguide cavity bottom plate 1. The part outside the second hollow part is blocked by the second tooling grid, which can improve the accuracy of the position where the low-temperature solder paste is coated.
[0088] In an exemplary embodiment of the present disclosure, as shown in Figure 3 FIG. [not provided], the upper surface of the waveguide cavity bottom plate 1 has waveguide cavity protrusions 11 arranged in an array along the X direction and the Y direction. The second tooling grid has square holes matching the waveguide cavity protrusions 11. In step S2200, when the second tooling grid is aligned with the upper surface of the waveguide cavity bottom plate 1, the second tooling grid is sleeved on the upper surface of the waveguide cavity bottom plate 1 through the square holes; when coating the low-temperature solder paste on the side of the second tooling grid away from the waveguide cavity bottom plate 1, the low-temperature solder paste does not contact the waveguide cavity protrusions 11.
[0089] Among them, the second tooling grid has square through-holes matching the waveguide cavity protrusions 11. The second tooling grid is sleeved on the upper surface of the waveguide cavity bottom plate 1 through the through square holes to achieve positioning and fixing with the waveguide cavity bottom plate 1. The waveguide cavity protrusions 11 are part of the chamber channel. When coating the low-temperature solder paste on the top surface of the waveguide cavity bottom plate 1, the low-temperature solder paste does not contact the waveguide cavity protrusions 11, which can improve the qualified rate of the ridge waveguide frequency-scanning antenna product.
[0090] Exemplarily, as shown in Figure 1 FIG. [not provided], the waveguide cavity enclosure 2 includes a first enclosure 21 provided at opposite ends in the X direction and a second enclosure 22 provided at opposite ends in the Y direction. The first enclosure 21 and the second enclosure 22 are sequentially connected end to end to enclose the waveguide cavity space.
[0091] In step S3000, installing the waveguide cavity enclosure 2 on the waveguide cavity bottom plate 1 may include steps S3100 to S3300.
[0092] Step S3100: Install the first enclosure 21 on one side of the waveguide cavity bottom plate 1 in the first direction, and the first enclosure 21 is threadedly connected to the waveguide cavity bottom plate 1.
[0093] Step S3200: Install the two second enclosures 22 on both sides of the waveguide cavity bottom plate 1 in the second direction respectively, and the two second enclosures 22 are respectively threadedly connected to the opposite ends of the first enclosure 21 in the second direction.
[0094] Step S3300: Install the other first enclosure 21 on the other side of the waveguide cavity bottom plate 1 in the first direction, and threadedly connect it to the two second enclosures 22 and the waveguide cavity bottom plate 1.
[0095] Specifically, referring to Figure 1 as shown, the first surrounding frame 21 is threadedly connected to the bottom plate 1 of the waveguide cavity, and the second surrounding frame 22 is threadedly connected to the first surrounding frame 21. For example, the side surface of the first surrounding frame 21 and the bottom plate 1 of the waveguide cavity are connected by a threaded connector along the X direction; the side surface of the second surrounding frame 22 and the first surrounding frame 21 are connected by a threaded connector along the Y direction.
[0096] In an exemplary embodiment of the present disclosure, in step S4000, installing the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 in the waveguide cavity space may include steps S4100 to S4300:
[0097] Step S4100: Starting from the waveguide cavity surrounding frame 2 at one end in the second direction, install the waveguide cavity ridge plate 3 on the waveguide cavity surrounding frame 2. The first partition 31 of the waveguide cavity ridge plate 3 matches the first stop 23 on the waveguide cavity surrounding frame 2, and the first vertical plate 32 of the waveguide cavity ridge plate 3 matches the ridge plate installation groove 12 on the top surface of the waveguide cavity bottom plate 1.
[0098] Step S4200: Install the waveguide cavity positioning partition 4 on the side of the assembled waveguide cavity ridge plate 3 away from the waveguide cavity surrounding frame 2. The side of the first partition 31 away from the waveguide cavity surrounding frame 2 matches the ridge plate stop 41 of the waveguide cavity positioning partition 4.
[0099] Step S4300: Install the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 in sequence along the second direction.
[0100] Specifically, referring to Figure 2 , Figure 4 , Figure 5 , Figure 6 as shown, a possible sequence for installing the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 is to start assembling from the waveguide cavity surrounding frame 2. First, match the waveguide cavity ridge plate 3 closest to the waveguide cavity surrounding frame 2 with the waveguide cavity surrounding frame 2. Insert the first vertical plate 32 of the waveguide cavity ridge plate 3 into the ridge plate installation groove 12 on the upper surface of the waveguide cavity bottom plate 1, and insert one end of the first partition 31 into the first stop 23 on the waveguide cavity surrounding frame 2 to fix the waveguide cavity ridge plate 3. After the waveguide cavity ridge plate 3 closest to the waveguide cavity surrounding frame 2 is installed, install the adjacent waveguide cavity positioning partition 4, and insert the other end of the first partition 31 into the ridge plate stop 41 on the waveguide cavity positioning partition 4 to fix the waveguide cavity positioning partition 4. Then, alternately install the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 in sequence until the last waveguide cavity ridge plate 3 is installed in the waveguide cavity space. The two ends of the first partition 31 of the waveguide cavity ridge plate 3 cooperate with the ridge plate stops 41 on the last waveguide cavity positioning partition 4 and the first stop 23 on the waveguide cavity surrounding frame 2 respectively.
[0101] In another exemplary embodiment of the present disclosure, in step S4000, installing the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 in the waveguide cavity space may include steps S4600 to S4700:
[0102] Step S4600: Assemble the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 alternately in sequence along the second direction to form an integral body. The first partition 31 of the waveguide cavity ridge plate 3 matches the ridge plate stop 41 of the adjacent waveguide cavity positioning partition 4 to form a waveguide cavity assembly;
[0103] Step S4700: Install the entire waveguide cavity assembly into the waveguide cavity space. The first partitions 31 at both ends of the waveguide cavity assembly in the second direction match the first stops 23 on the waveguide cavity enclosure 2, and each waveguide cavity ridge plate 3 matches the ridge plate installation groove 12 on the top surface of the waveguide cavity bottom plate 1.
[0104] Specifically, another possible order of installing the waveguide cavity ridge plate 3 and the waveguide cavity positioning partition 4 is to first assemble all the waveguide cavity ridge plates 3 and the waveguide cavity positioning partitions 4 into an integral body and then install the integral body into the waveguide cavity space. In step S4600, the waveguide cavity ridge plate 3 is positioned and installed by using the ridge plate stops 41 on both sides of the waveguide cavity positioning partition 4 to form a waveguide cavity assembly. In step S4700, the waveguide cavity assembly is fixed by using the first partitions 31 on the waveguide cavity ridge plates 3 at both ends of the waveguide cavity assembly to match the first stops 23 on the waveguide cavity enclosure 2.
[0105] Exemplarily, referring to Figure 2 、 Figure 4 As shown, in addition to the first stop 23 being provided on the second enclosure 22, a second stop 24 is also provided on the inner side of the first enclosure 21. The two ends of the first vertical plate 32 of the waveguide cavity ridge plate 3 in the X direction are also inserted into the second stops 24 of the two first enclosures 21 to fix the waveguide cavity ridge plate 3.
[0106] In step S5000, low-temperature solder paste is applied between the top of the waveguide cavity enclosure 2, the waveguide cavity ridge plate 3, the waveguide cavity positioning partition 4 and the waveguide cavity top plate 5. It may include steps S5100 to S5200.
[0107] Step S5100: Generate a first tooling grid according to the top shapes of the waveguide cavity enclosure 2, the waveguide cavity ridge plate 3, and the waveguide cavity positioning partition 4. The first tooling grid has a first hollowed-out part that matches the top of the waveguide cavity enclosure 2, the top of the waveguide cavity ridge plate 3, and the top of the waveguide cavity positioning partition 4.
[0108] Step S5200: Align the first tooling grid with the bottom surface of the waveguide cavity top plate 5, and apply low-temperature solder paste on the side of the first tooling grid away from the waveguide cavity top plate 5.
[0109] Specifically, low-temperature solder paste is applied between the top of the waveguide cavity enclosure 2, the top of the first partition 31 of the waveguide cavity ridge plate 3, the top of the waveguide cavity positioning partition 4, and the waveguide cavity top plate 5, so as to form a weld seam during the welding in step S7000. In step S5100, a first tooling grid is generated according to the top shapes of the waveguide cavity enclosure 2, the waveguide cavity ridge plate 3, and the waveguide cavity positioning partition 4. It can be determined the area to be welded according to the top size of the waveguide cavity enclosure 2, the spacing between waveguide cavity ridge plates 3, the spacing between adjacent first partitions 31 on the same waveguide cavity ridge plate 3, the top size of the waveguide cavity ridge plate 3, and the top size of the waveguide cavity positioning partition 4, and the first tooling grid is generated according to the area to be welded. Exemplarily, low-temperature solder paste is applied on the top of the waveguide cavity enclosure 2, the top of the first partition 31 of the waveguide cavity ridge plate 3, and the top of the waveguide cavity positioning partition 4. In another exemplary embodiment, low-temperature solder paste can also be applied on the bottom surface of the waveguide cavity top plate 5.
[0110] For example, in step S5100, a first tooling grid is generated according to the area to be welded. The first tooling grid has a first hollowed-out portion that matches the area to be coated with low-temperature solder paste. The area to be coated with low-temperature solder paste is referred to Figure 9 as shown, Figure 9 the shaded area in the figure represents the area to be coated with low-temperature solder paste, corresponding to the first hollowed-out portion on the first tooling grid. The first tooling grid can be a metal mesh. For example, a metal thin plate can be formed with the first hollowed-out portion by precision laser cutting. In step S5200, when applying low-temperature solder paste on the side of the first tooling grid away from the waveguide cavity top plate 5, the low-temperature solder paste is applied from the first hollowed-out portion to the bottom surface of the waveguide cavity top plate 5, and the part outside the first hollowed-out portion is blocked by the first tooling grid, which can improve the accuracy of the position where the low-temperature solder paste is applied. Moreover, applying low-temperature solder paste on the bottom surface of the waveguide cavity top plate 5 can prevent the low-temperature solder paste from falling onto the cavity wall compared with applying low-temperature solder paste on the top of the waveguide cavity enclosure 2, the top of the first partition 31 of the waveguide cavity ridge plate 3, and the top of the waveguide cavity positioning partition 4, and improve the qualified rate of the ridge waveguide frequency-scanning antenna product.
[0111] In an exemplary embodiment of the present disclosure, before installing the two plugs 6 on both sides of the second direction of the waveguide cavity bottom plate 1 in step S6000, the processing method of the ridge waveguide frequency-scanning antenna further includes:
[0112] Step S8000: Apply low-temperature solder paste between the top surface of the plug 6 and the bottom surface of the waveguide cavity enclosure 2 and the bottom surface of the waveguide cavity ridge plate 3 adjacent to the waveguide cavity enclosure 2.
[0113] Specifically, the structure of the plug 6 can be referred to Figure 11As shown, the plug 6 may include a first coupling block 61, a second coupling block 62, and a connecting plate 63. Both the first coupling block 61 and the second coupling block 62 are "L"-shaped. Grooves are respectively provided on the adjacent surfaces of the first coupling block 61 and the second coupling block 62, and they jointly form a path for the electromagnetic wave input and output chamber channel. A plurality of coupling holes along the X direction are provided on the bottom surface of the first coupling block 61. In step S8000, it may be to apply low-temperature solder paste on the top surfaces of the first coupling block 61 and the second coupling block 62.
[0114] In an exemplary embodiment of the present disclosure, refer to Figure 8 As shown, a choke groove 42 perpendicular to the rabbet 41 of the ridge plate is provided on the waveguide cavity positioning partition plate 4, which can play a role in impedance matching and suppressing electromagnetic wave leakage.
[0115] The present disclosure also provides a ridge waveguide frequency-scanning antenna, which can be obtained by the processing method of the ridge waveguide frequency-scanning antenna provided by the foregoing present disclosure.
[0116] The structure and beneficial effects of the ridge waveguide frequency-scanning antenna can refer to the description of the foregoing exemplary embodiment and will not be elaborated herein.
[0117] In an exemplary embodiment of the present disclosure, a weld seam is formed between the waveguide cavity bottom plate 1 and each waveguide cavity ridge plate 3; weld seams are formed between each waveguide cavity ridge plate 3, the waveguide cavity positioning partition plate 4, the waveguide cavity enclosure 2, and the waveguide cavity top plate 5; a weld seam is formed between the top surface of the plug 6 and the bottom surface of the waveguide cavity enclosure 2 and the bottom surface of the waveguide cavity ridge plate 3 adjacent to the waveguide cavity enclosure 2.
[0118] Those skilled in the art will readily think of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include the common general knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.
Claims
1. A method for processing a ridge waveguide frequency scanning antenna, characterized in that: include: Processing to form a waveguide cavity bottom plate (1), a waveguide cavity frame (2), a waveguide cavity ridge plate (3), a waveguide cavity positioning baffle (4), a waveguide cavity top plate (5) and a plug (6); Coating low-temperature solder paste on the upper surface of the waveguide cavity bottom plate (1); The waveguide cavity surrounding frame (2) is installed on the waveguide cavity bottom plate (1), and the waveguide cavity surrounding frame (2) surrounds the waveguide cavity bottom plate (1) to form a waveguide cavity space; The waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) are installed in the waveguide cavity space, the waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) both extend along a first direction, the waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) are arranged in an alternating array along a second direction, and the waveguide cavity enclosure frame (2) located at two opposite ends of the waveguide cavity space in the second direction is adjacent to the waveguide cavity ridge plate (3); the first direction is perpendicular to the second direction, and the first direction and the second direction are both parallel to the waveguide cavity bottom plate (1); Applying low-temperature solder paste between the waveguide cavity surrounding frame (2), the waveguide cavity ridge plate (3), the top of the waveguide cavity positioning partition plate (4) and the waveguide cavity top plate (5); The waveguide cavity top plate (5) is installed on the waveguide cavity enclosure frame (2), the waveguide cavity ridge plate (3) and the top of the waveguide cavity positioning baffle (4), and the two plugs (6) are installed on both sides of the waveguide cavity bottom plate (1) in the second direction to form a pre-welding assembly; The pre-welding assembly is welded to form a ridge wave pilot frequency scanning antenna.
2. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: Low-temperature solder paste is applied between the waveguide cavity surrounding frame (2), the waveguide cavity ridge plate (3), the top of the waveguide cavity positioning partition plate (4) and the waveguide cavity top plate (5), comprising: A first tooling grid is generated according to the top shapes of the waveguide cavity frame (2), the waveguide cavity ridge plate (3), and the waveguide cavity positioning baffle (4), wherein the first tooling grid has a first hollow portion matching the top of the waveguide cavity frame (2), the top of the waveguide cavity ridge plate (3), and the top of the waveguide cavity positioning baffle (4); The first tooling grid is aligned with the bottom surface of the waveguide cavity top plate (5), and the low-temperature solder paste is coated on a side of the first tooling grid away from the waveguide cavity top plate (5).
3. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: Coating low-temperature solder paste on the upper surface of the waveguide cavity bottom plate (1) comprises: Generating a second tooling grid according to the layout of the waveguide cavity ridge plate (3), the second tooling grid having a second hollow portion matching the bottom of the waveguide cavity ridge plate (3); The second tooling grid is aligned with the upper surface of the waveguide cavity bottom plate (1), and the low-temperature solder paste is coated on a side of the second tooling grid away from the waveguide cavity bottom plate (1).
4. The method for processing a ridge waveguide frequency scanning antenna according to claim 3, characterized in that: The upper surface of the waveguide cavity bottom plate (1) has waveguide cavity protrusions (11) arranged in an array along the first direction and the second direction, and the second tooling grid has square holes matching the waveguide cavity protrusions (11). When the second tooling grid is aligned with the upper surface of the waveguide cavity bottom plate (1), the second tooling grid is sleeved on the upper surface of the waveguide cavity bottom plate (1) through the square holes; when the low-temperature solder paste is coated on the side of the second tooling grid away from the waveguide cavity bottom plate (1), the low-temperature solder paste does not contact the waveguide cavity protrusions (11).
5. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: The waveguide cavity ridge plate (3) and the waveguide cavity positioning partition plate (4) are installed in the waveguide cavity space, comprising: Assembling starts from the waveguide cavity frame (2) at one end of the second direction, installing the waveguide cavity ridge plate (3) on the waveguide cavity frame (2), the first partition plate (31) of the waveguide cavity ridge plate (3) matches the first stopper (23) on the waveguide cavity frame (2), and the first vertical plate (32) of the waveguide cavity ridge plate (3) matches the ridge plate installation groove (12) on the top surface of the waveguide cavity bottom plate (1); The waveguide cavity positioning baffle (4) is installed on the side of the assembled waveguide cavity ridge plate (3) away from the waveguide cavity surrounding frame (2), and the side of the first baffle (31) away from the waveguide cavity surrounding frame (2) matches with the ridge plate stop (41) of the waveguide cavity positioning baffle (4); The waveguide cavity ridge plate (3) and the waveguide cavity positioning partition plate (4) are installed in sequence along the second direction.
6. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: The waveguide cavity ridge plate (3) and the waveguide cavity positioning partition plate (4) are installed in the waveguide cavity space, comprising: The waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) are sequentially and alternately assembled into one piece along the second direction, and the first baffle plate (31) of the waveguide cavity ridge plate (3) is matched with the ridge plate stop (41) of the adjacent waveguide cavity positioning baffle plate (4) to form a waveguide cavity assembly; The waveguide cavity assembly is installed as a whole into the waveguide cavity space, the first partitions (31) at the two ends of the second direction of the waveguide cavity assembly match the first stoppers (23) on the waveguide cavity surrounding frame (2), and each of the waveguide cavity ridge plates (3) matches the ridge plate mounting groove (12) on the top surface of the waveguide cavity bottom plate (1).
7. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: The waveguide cavity enclosure frame (2) comprises a first enclosure frame (21) arranged at two opposite ends of the first direction and a second enclosure frame (22) arranged at two opposite ends of the second direction, the first enclosure frame (21) and the second enclosure frame (22) being sequentially connected end to end to enclose the waveguide cavity space; The waveguide cavity surrounding frame (2) is mounted on the waveguide cavity bottom plate (1), comprising: The first surrounding frame (21) is installed on one side of the waveguide cavity bottom plate (1) in a first direction, and the first surrounding frame (21) is threadedly connected to the waveguide cavity bottom plate (1); The two second surrounding frames (22) are respectively installed on both sides of the waveguide cavity bottom plate (1) in the second direction, and the two second surrounding frames (22) are respectively threadedly connected to the opposite ends of the first surrounding frame (21) in the second direction; Another of the first surrounding frames (21) is installed on the other side of the waveguide cavity bottom plate (1) in the first direction, and is threadedly connected to the two second surrounding frames (22) and the waveguide cavity bottom plate (1).
8. The method for processing a ridge waveguide frequency scanning antenna according to claim 1, characterized in that: Before installing the two plugs (6) on both sides of the waveguide cavity bottom plate (1) in the second direction, the processing method of the ridge waveguide frequency scanning antenna further includes: Low-temperature solder paste is applied between the top surface of the plug (6), the bottom surface of the waveguide cavity enclosure frame (2), and the bottom surface of the waveguide cavity ridge plate (3) adjacent to the waveguide cavity enclosure frame (2).
9. A ridge wave pilot scanning antenna, characterized in that: It comprises a waveguide cavity bottom plate (1), a waveguide cavity surrounding frame (2), a waveguide cavity ridge plate (3), a waveguide cavity positioning baffle (4), a waveguide cavity top plate (5) and a plug (6); The waveguide cavity enclosure frame (2) surrounds the waveguide cavity bottom plate (1) to form a waveguide cavity space; the waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) both extend along a first direction, the waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle plate (4) are arranged in an alternating array along a second direction, and the waveguide cavity enclosure frame (2) and the waveguide cavity ridge plate (3) located at opposite ends of the waveguide cavity space in the second direction are adjacent to each other; The waveguide cavity ridge plate (3) has a first baffle (31), the waveguide cavity ridge plate (3) matches with a ridge plate stop (41) of an adjacent waveguide cavity positioning baffle (4) through the first baffle (31), and the waveguide cavity ridge plate (3) matches with a first stop (23) on an adjacent waveguide cavity body frame (2) through the first baffle (31); the waveguide cavity ridge plate (3) matches with a ridge plate mounting groove (12) on the top surface of the waveguide cavity bottom plate (1); The waveguide cavity top plate (5) is arranged on the top of the waveguide cavity body frame (2), the waveguide cavity ridge plate (3) and the waveguide cavity positioning baffle (4), the waveguide cavity top plate (5) has a plurality of radiation slots (51) extending along the second direction and arranged in an array in the first direction and the second direction, and the radiation slots (51) pass through the waveguide cavity top plate (5); the two plugs (6) are installed on both sides of the waveguide cavity bottom plate (1) in the second direction; The ridge wave pilot frequency scanning antenna forms a plurality of mutually independent chamber channels arrayed along the first direction and extending along the second direction, the plug (6) has a plurality of feeding ports along the first direction, the feeding ports corresponding to the chamber channels one by one, so that electromagnetic waves are input from a feeding port of the plug (6), pass through a chamber channel, and are coupled to free space through the radiation slot (51), and the remaining energy is absorbed by the absorption load of another plug (6); The radiation slits (51) correspond one-to-one with the chamber channels along the first direction, and the radiation slits (51) correspond one-to-one with the first partition plate (31) along the second direction, so that electromagnetic waves in the chamber channel enter and exit from the radiation slits (51); the first direction is perpendicular to the second direction, and the first direction and the second direction are both parallel to the waveguide cavity bottom plate (1).
10. The ridge wave pilot frequency scanning antenna according to claim 9, characterized in that: A weld is formed between the waveguide cavity bottom plate (1) and each of the waveguide cavity ridge plates (3); a weld is formed between each of the waveguide cavity ridge plates (3), the waveguide cavity positioning baffle (4), the waveguide cavity enclosure frame (2) and the waveguide cavity top plate (5); and a weld is formed between the top surface of the plug (6) and the bottom surface of the waveguide cavity enclosure frame (2) and the bottom surface of the waveguide cavity ridge plate (3) adjacent to the waveguide cavity enclosure frame (2).