Apparatus and method for processing a substrate in an evacuum treatment space

Abstract

The invention relates to a device and a method for processing, in particular nanoimprinting, a substrate (13) in a local and fluid-tight processing space (14).

Description

Field of the Invention

[0001] The present invention relates to a method and an apparatus for processing a substrate. In particular, the present invention relates to a method and an apparatus for imprinting, in particular nanoimprinting, a substrate with improved alignment. Background Art

[0002] In some processing methods in the prior art, it is advantageous to process a substrate in a vacuum. For this purpose, the entire apparatus or at least the corresponding module usually has to be evacuated. Here, the long evacuation process is particularly disadvantageous because the productivity decreases due to frequent and long evacuations. Here, it is usually necessary to process the substrate in a vacuum in order to prevent imprinting errors, in particular air bubbles.

[0003] Here, the present invention particularly relates to a method and an apparatus for UV-NIL imprinting, in which structures, in particular nanostructures, can be produced using a soft nanostructured stamp, in particular a flexible thin-film stamp.

[0004] Nanoimprint lithography (NIL) is a molding method in which microstructures and / or nanostructures are molded from a stamp into a curable material, such as an imprint resist. Here, the molding of a large number of nanostructure systems can be achieved.

[0005] In principle, a distinction is made between a hot-embossing (thermal imprinting) NIL method and a UV-based NIL method. In UV-NIL, the stamp is pressed onto the flowable imprint resist at room temperature. Due to the viscosity of the photoresist, the intermediate spaces of the stamp are completely filled with the photoresist by capillary action. The UV glue crosslinks into a stable polymer (cures) upon exposure to UV radiation.

[0006] Structuring with a soft polymer stamp has several advantages compared to a hard stamp. The reasons are the easy production of the stamp, the efficient imprinting process, the very good surface properties of the corresponding stamp material, the low cost, the reproducibility of the imprinted product, and in particular the feasibility of the elastic deformation of the stamp during demolding.

[0007] The production of high-precision nanostructures over a large area can be carried out by a rolling method (SmartNIL) without a vacuum. A method and an apparatus are described in WO2014 / 037044A1, in which a microstructure stamp and / or a nanostructure stamp, in particular a flexibly configured thin-film stamp and a frame, are used. In addition, the structure of the thin-film stamp from WO2014 / 037044A1 must be pressed into the imprint material using an imprint element, in particular a rigid imprint roller.

[0008] In the published document WO2015 / 161868A1, a prestress is applied to the nanostructured stamp before contact. The prestress is achieved by deforming the nanostructured stamp by means of a deformation tool. Therefore, positioning errors and further imprinting errors can deteriorate the imprinting result.

[0009] The device from WO2015 / 161868A1 is also capable of operating in a vacuum, where the entire device must be evacuated. Here, the imprinting stamp is not a flexible, soft film stamp that is tensioned at the film frame, but a hard polymer stamp. Summary of the Invention

[0010] Therefore, the object of the present invention is to at least partially eliminate, in particular completely eliminate, the disadvantages listed in the prior art. In particular, the object of the present invention is to provide an improved method and an improved device for processing a substrate, in particular for imprinting.

[0011] This object is achieved by the features of the independent claims. Advantageous refinements of the present invention are given in the dependent claims. All combinations of at least two features described in the description, claims and / or drawings fall within the scope of the present invention. Within the stated value ranges, the values within the mentioned limits should also be regarded as limit values and disclosed and can be protected in any combination.

[0012] Therefore, the present invention relates to a method for processing a substrate, in particular for nanoimprinting, which method has at least the following steps: a) providing a substrate receiving device for receiving the substrate; b) providing a device for processing the substrate; c) constructing a local and fluid-tight processing space between the substrate receiving device and the device; d) evacuating the processing space; and e) processing the substrate, wherein the evacuation in step d) is carried out after the construction of the processing space in step c).

[0013] Here, instead of a substrate, a stack of substrates can also be processed. In the following, the method and device will be described in connection with a substrate, but a stack of substrates can also be processed correspondingly. The processing can also include processing the substrate on both sides, where a multiple or triple stack arrangement can be used. Therefore, for example, the substrate can be imprinted on both sides.

[0014] Therefore, advantageously, a processing space that is locally or significantly smaller than the space around the device can be constructed. Here, the processing space is at least partially formed or sealed by the device and the substrate receiving device. In other words, a spatially defined processing space can be constructed around the substrate. Due to the small volume, the processing space can be evacuated particularly quickly and efficiently.

[0015] The evacuation is carried out by means of evacuation tools arranged at the substrate receiving device and / or the device, so that the processing space can be evacuated after the processing space is constructed. Here, the substrate is arranged in the processing space. Here, the processing is carried out in the processing space, wherein at least part of the processing space is evacuated.

[0016] In a preferred embodiment of the method for carrying out the processing, it is provided that the construction of the processing space is carried out by the approach of the substrate receiving device and the device, wherein the device and the substrate receiving device are aligned with each other before the approach.

[0017] Here, during the alignment and / or approach, the substrate receiving device and the device are aligned with each other in such a way that optimal processing and optimal processing results can be achieved. In particular, precise alignment is necessary for the imprinting or bonding process. Since the substrate receiving device and the device are aligned with each other, the substrate can also be advantageously precisely aligned or arranged.

[0018] The substrate is preferably fixed in the substrate receiving device by means of fixing elements. Here, the approach and alignment are preferably carried out by an actuator or other tool for alignment or approach. The alignment and approach in step c) can also be carried out in a different order. It can be envisaged here that the alignment is carried out first and then the approach of the substrate receiving device and the device is carried out. After the approach and the construction of the processing space, the substrate or the processing tool can additionally be aligned. It can also be envisaged to carry out the approach and alignment in parallel.

[0019] By the approach of the substrate receiving device and the device, a local and fluid-tight processing space is achieved around the substrate. This processing space can be evacuated and is at least partly constructed between the two receiving devices. Here, the processing space can also be partly constituted by a seal, which is preferably arranged at least at the substrate receiving device. Here, a part of the substrate receiving device or the device can also constitute the seal respectively. A sealing ring is preferably used to seal or construct the processing space.

[0020] Since the alignment and approach are carried out before the evacuation, local evacuation can then be advantageously carried out, wherein alignment errors are prevented. In addition, it is advantageously possible to evacuate only the local processing space. Therefore, it is not necessary to evacuate the device or the entire module. In this way, the substrate can be processed particularly quickly and efficiently.

[0021] In a preferred embodiment of the method for carrying out the processing, it is provided that the construction of the processing space is carried out by a controllable sealing tool. In other words, the above-mentioned approach for constructing the processing space is not carried out, but the processing space is sealed by the sealing tool of the processing space. Here, the substrate can be loaded from the side, for example, so that the structural form of the device can be designed to be particularly small. Therefore, it is advantageously only necessary to evacuate a small space, so that the processing time can be reduced.

[0022] In a preferred embodiment of the method for carrying out a treatment, it is provided that the device has a flexible film stamp for treating a substrate, in particular for imprinting, and that, when treating the substrate, a fluid-tight flushing space between the device and the film stamp is flushed in order to bend the film stamp, wherein the treatment space and the flushing space are fluidically separated from one another by the film stamp. In other words, two different pressure regions are constructed in the device, which two pressure regions are fluidically separated from one another by the film stamp, so that the film stamp can be deformed in a targeted manner by the pressure difference for imprinting and demolding. Here, the flushing space is flushed with fluid by a flushing tool which can simultaneously be configured as a vacuum tool, so that the film stamp bends or kinks in the direction of the substrate. The imprinting force and the deformation of the film stamp can advantageously be set by the pressure difference. In addition, the demolding after the treatment or imprinting can advantageously be carried out or supported economically by reducing the pressure difference. Here, the pressure in the treatment space can also be adapted accordingly.

[0023] Here, the flushing space is at least partly first constructed by flushing with fluid by means of the flushing tool, since the film stamp abuts directly against a section of the device and / or the film frame. However, it is also conceivable that a part of the flushing space is constructed based on the design of the film frame or the device and that the flushing space is further enlarged by flushing. Here, the film stamp seals the flushing space from the treatment space. In this way, a particularly economical and error-free imprinting, in particular nanoimprinting, can be achieved.

[0024] In a preferred embodiment of the method for carrying out a treatment, it is provided that the pressure difference between the pressure in the treatment space and the pressure in the flushing space is set between 0 mbar and 800 mbar, preferably between 100 mbar and 600 mbar, more preferably between 200 mbar and 600 mbar, for carrying out a treatment, in particular for imprinting. In other words, the pressure present in the treatment space and the pressure present in the flushing space are adjusted such that the desired imprinting force and the deformation of the film stamp are caused. The pressure difference in the predefined range has proven to be particularly advantageous in tests.

[0025] In a preferred embodiment of the method for carrying out a treatment, it is provided that the substrate is aligned relative to the treatment tool of the device in the constructed treatment space. The treatment tool can be, for example, an imprinting tool, a bonding or debonding tool or other treatment tools, wherein an exact relative alignment with the substrate is advantageous. Since the substrate is aligned relative to the treatment tool of the device during alignment, a particularly precise alignment can be achieved before evacuation. Here, an indirect alignment of the substrate with the treatment tool can also be envisaged by means of a substrate receiving device or the alignment of the device, wherein alignment marks are preferably used.

[0026] In a preferred embodiment of the method for performing processing, it is provided that the alignment of the substrate is carried out under normal pressure. In other words, evacuation is carried out only after the substrate has been aligned and the processing space has been configured. Here, the normal pressure is the pressure that exists in the device under normal circumstances. If the device loads the substrate under ambient pressure, it particularly refers to the existing atmospheric pressure. Here, the approach is also carried out under normal pressure. In this way, the method for performing processing can be carried out particularly efficiently. In addition, the alignment can be carried out particularly precisely under normal pressure.

[0027] In a preferred embodiment of the method for performing processing, it is provided that the substrate is released during the processing in step e). Then, during the processing in the evacuated processing space, the substrate can interact freely with the processing tool. In this way, particularly good processing results can be achieved in the imprinting process, for example.

[0028] In a preferred embodiment of the method for performing processing, it is provided that the processing in step e) includes complete contact of the substrate with the thin film stamp. Thus, in the evacuated processing space, the substrate is imprinted or contacted using the imprinting stamp. For example, the glue previously applied to the imprinting stamp can be received in the structure on the substrate, preferably a nanostructure, or a specific structure can be imprinted into the substrate. Here, the imprinting stamp is flexible and can be applied particularly freely to the substrate, so that the imprinting can be carried out particularly precisely and freely in the evacuated processing space. Here, the substrate and the imprinting stamp are completely pressed against each other, so that a full-surface imprinting can be achieved.

[0029] In a preferred embodiment of the method for performing the treatment, it is provided that in the treatment in step e), after complete contact with the substrate, the thin-film stamp is at least partially released so that the thin-film stamp can relax at the substrate. Thus, in a local and evacuated treatment space, the flexible thin-film stamp is at least partially lifted or moved after complete contact, so that particularly free relaxation of the thin-film stamp at the substrate can be achieved. For this purpose, the thin-film stamp is preferably deformed or released by a flushing tool. Here, the flushing tool is particularly arranged on the back side of the thin-film stamp facing away from the substrate, so that a slight overpressure is generated relative to the pressure usually present in the evacuated treatment space during flushing with fluid, causing the thin-film stamp to be released from the fixing surface. Here, the thin-film stamp does not have to abut against the thin-film receiving device. Preferably, the entire treatment space is not filled by the flushing tool, but only a small overpressure for releasing the thin-film stamp is generated in the region of the back side of the thin-film stamp. In this way, particularly precise and economical imprinting can be carried out in the treatment space. In this embodiment of the method for performing the treatment and imprinting, it is provided that there are two pressure zones and these two pressure zones are separated by the thin-film stamp. Here, the treatment space is particularly fluidically separated from the rest of the treatment space by the thin-film stamp itself in the region of the back side of the thin-film stamp. The first pressure zone is defined by the configuration of the evacuable treatment space. The second pressure zone is located in the region of the back side of the thin-film stamp (flushing zone). This second pressure zone can be filled by the flushing tool.

[0030] In a preferred embodiment of the method for performing the treatment, it is provided that the thin-film frame for receiving the thin-film stamp continues to be fixed above or at the device. The thin-film stamp is preferably fixed or unfolded at the thin-film frame. Thus, the thin-film frame can be fixed to the thin-film receiving device independently of the thin-film stamp and advantageously remains fixed during release or flushing. In this way, the thin-film stamp remains fixed at the frame in the preferred imprinting position, where the thin-film stamp can nevertheless abut particularly well against the substrate. In other words, when the frame is continuously fixed, the thin-film stamp can relax particularly well at the substrate.

[0031] In a preferred embodiment of the method for performing the treatment, it is provided that the flushing tool also additionally increases the pressure in the flushing space during the treatment, so that the imprinting force for imprinting the substrate can be set. Here, it is particularly preferred that the pressure in the treatment space remains constant. Thus, the thin-film stamp can contact the substrate or imprint it particularly evenly and economically. Thus, the thin-film stamp can relax at the substrate. During the imprinting process, the filling of the structure of the thin-film stamp by capillary forces is additionally supported by the (slight) back-side overpressure in the flushing space.

[0032] In a preferred embodiment of the method for performing processing, it is provided that the pressure difference between the pressure in the processing space and the pressure in the flushing space is used to demold the thin film stamp from the substrate. Here, the pressure in the processing space is preferably kept constant. In other words, by reducing the pressure in the flushing space or evacuating, the thin film stamp can be advantageously pulled back from the imprint material.

[0033] In a preferred embodiment of the method for performing processing, it is provided that the device is arranged such that the control for imprinting and demolding is automatically performed by adjusting the pressures in the processing space and the flushing space. During imprinting and demolding, the pressure difference occurring between the two pressure zones is used to generate an external force acting on the thin film stamp.

[0034] Furthermore, the invention relates to a device for processing a substrate, which device at least has: i) a substrate receiving device for receiving the substrate, ii) a device for processing the substrate, iii) a tool for constructing a local and fluid-tight processing space between the substrate receiving device and the device, iv) a vacuuming tool for evacuating the processing space, and v) a processing tool for processing the substrate.

[0035] The above advantages and features of the method for processing a substrate similarly and correspondingly apply to the device. The device is preferably arranged such that the evacuation of the constructable processing space can only be performed by the vacuuming tool after alignment. Here, the processing space is at least partially, preferably completely, arranged between the substrate receiving device and the device.

[0036] The processing tool is at least partially arranged in the processing space or can act on the substrate in the processing space. Here, the processing space is evacuated during processing. The processing tool can in particular be a tool for imprinting, a tool for bonding or debonding, and a tool for laser processing or other tools. Furthermore, the processing tool can also at least partially form a sealing tool. In this way, particularly efficient processing of the substrate can be achieved in the processing space.

[0037] Here, the device is preferably constructed such that the substrate can be released. Thus, the device allows for particularly precise alignment and processing of the substrate in the processing space. Therefore, the device is suitable for efficiently and precisely processing the substrate or a stack of substrates in a vacuum, particularly suitable for nanoimprinting the substrate.

[0038] In a preferred embodiment of the device for processing a substrate, it is provided that the tool is a proximity tool for approaching the substrate receiving device and the device. In other words, the processing space can be advantageously and quickly and directly constructed by the relative movement of the device and / or the substrate receiving device. In this way, a local processing space can be advantageously constructed between the two components.

[0039] In a preferred embodiment of a device for processing a substrate, it is provided that the device additionally has an alignment tool for aligning the substrate receiving device and the device with each other, wherein the alignment tool is arranged such that the substrate receiving device and the device can be aligned with each other before and / or during the action of the proximity tool. Here, the alignment can also include adjustment. In this way, the processing space can be precisely configured. In addition, the alignment of the substrate with the processing tool can advantageously be carried out simultaneously by the alignment tool. After the processing space is configured, fine alignment of the substrate can additionally be carried out if necessary.

[0040] Here, during alignment and / or proximity, the substrate receiving device and the device are aligned with each other such that optimal processing and optimal processing results can be achieved. In particular, precise alignment is necessary for an imprinting process or a bonding process. By aligning the substrate receiving device with the device with each other, the substrate can also be precisely aligned or arranged advantageously.

[0041] The substrate is preferably fixed in the substrate receiving device by fixing elements. Here, the proximity and alignment are carried out, for example, by an actuator. The alignment and proximity can also be carried out in a different order. It is also conceivable that the alignment is first carried out and then the proximity of the substrate receiving device and the device is carried out. Alignment can additionally be carried out after the proximity and the configuration of the processing space. It is also conceivable that the proximity and alignment are carried out in parallel.

[0042] By the proximity of the substrate receiving device and the device, a local and fluid-tight processing space is realized around the substrate. This processing space can be evacuated and is at least partially configured between the two receiving devices. Here, the processing space can be configured by a seal, preferably mounted at least at the substrate receiving device. Here, a part of the substrate receiving device or the device can also form the seal respectively. A sealing ring is preferably used for sealing or configuring the processing space. If the seal is configured at the substrate receiving device and the device, it preferably relates to the corresponding sealing element.

[0043] Since the alignment and proximity are carried out before the evacuation, the evacuation can advantageously be carried out thereafter, wherein alignment errors are prevented. In addition, it is advantageously possible to evacuate only the local processing space. Therefore, it is not necessary to evacuate the device or the entire module. In this way, particularly fast and efficient processing of the substrate can be achieved.

[0044] In a preferred embodiment of a device for processing a substrate, it is provided that the substrate receiving device and the device have corresponding sealing tools, wherein the approaching tool is arranged such that after the action of the approaching tool, a processing space is formed between the substrate receiving device and the device by the corresponding sealing tools. In other words, a part of the processing space is formed by the sealing tools. The sealing tools can be configured such that, for example, they can be joined to each other at multiple locations, and thus the substrate can advantageously be aligned with the processing tool simultaneously in this way. Therefore, it is advantageously possible to form the processing space at different positions of the device and the substrate receiving device.

[0045] In a preferred embodiment of a device for processing a substrate, it is provided that the tool is a controllable sealing tool for forming a processing space between the substrate receiving device and the device. Thus, there is no direct approach of the device and the substrate receiving device. Instead, the space between the device and the substrate receiving device is sealed by the sealing tool and thus the processing space is formed. In this way, it is possible to advantageously form the processing space quickly and efficiently. In addition, the alignment of the substrate receiving device and the device with each other can be omitted or pre - carried out.

[0046] In a preferred embodiment of a device for processing a substrate, it is provided that the substrate receiving device and the device are integrally formed. Thus, a particularly compact structural form of the device can be achieved. In addition, by the one - piece implementation, the alignment of the substrate with respect to the processing tool can also be omitted, or when loading the device with the substrate, the alignment is preferably achieved by pushing the substrate from the side of the substrate receiving device or parallel to the receiving surface of the substrate receiving device. Therefore, positioning errors are prevented and a processing space with a particularly small volume is provided for efficiently forming a vacuum.

[0047] In a preferred embodiment of a device for processing a substrate, it is provided that the processing tool has a flexible film stamper for imprinting the substrate, especially for nano - imprinting. Here, the flexible film stamper is suitable for use in the device. The film stamper can be provided in a film frame. Particularly preferably, the film stamper forms part of the outer edge of the processing space.

[0048] In a preferred embodiment of a device for processing a substrate, it is provided that the device additionally has a flushing tool for constructing a fluid-tight flushing space between the device and the thin-film stamp, wherein the flushing space is fluidically separated from the processing space by the thin-film stamp, and wherein the thin-film stamp is deformed in a targeted manner by the flushing tool. The flushing tool is, for example, a valve through which the flushing space can be filled or evacuated. In other words, a pressure can be set on the side of the thin-film stamp facing away from the processing space by means of a corresponding fluid volume, so that the thin-film stamp can be deformed in a targeted manner or bent in the direction of the substrate. Here, the flushing space is at least partially constructed by the thin-film stamp. Here, the device itself or also partially the thin-film frame can likewise delimit the flushing space. Here, the thin-film stamp can first abut against the device or the thin-film frame with the side facing away from the processing space, so that the flushing space is only constructed until fluid is introduced by means of the flushing tool. It is also conceivable that a part of the flushing space is already provided by the geometry of the device and / or the thin-film frame. In this case, the flushing space is enlarged by the flushing tool, wherein the thin-film stamp is deformed in the direction of the substrate. In this way, a particularly economical and error-free imprinting can be achieved.

[0049] In a preferred embodiment of a device for processing a substrate, it is provided that the device is set up such that the pressure difference between the processing space and the flushing space can be set between 0 mbar and 800 mbar, preferably between 100 mbar and 600 mbar, more preferably between 200 mbar and 600 mbar. In other words, the pressure difference is set in a predefined range in order to set the deformation and the imprinting force in a targeted manner. Here, the pressure difference is preferably adjusted by the flushing tool according to the constant pressure in the processing space. In this way, the imprinting process can be advantageously initiated by the flushing tool.

[0050] In a preferred embodiment of a device for processing a substrate, it is provided that the flushing tool is simultaneously a vacuum tool, so that the thin-film stamp can be demolded from the substrate by evacuating the flushing space. In other words, by evacuating the flushing space by means of the flushing tool, the imprinting force can be reduced or the deformation during imprinting can be reduced. In this way, the demolding of the thin-film stamp from the substrate or from the imprinting material provided on the substrate can be advantageously carried out in an economical manner after imprinting.

[0051] The pressure in the region of the back side of the thin-film stamp or in the flushing space is set between 1 mbar and 1500 mbar, preferably between 1100 mbar and 1250 mbar.

[0052] In a preferred embodiment, after alignment, a rough vacuum is set in the processing space between the thin-film stamp and the substrate.

[0053] During evacuation, the pressure in the imprinting space is less than 500 mbar, preferably less than 300 mbar, and most preferably less than 250 mbar.

[0054] In particular, the rough vacuum is preferably set between 300 mbar and 1 mbar, and most preferably between 250 mbar and 100 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing space, during and / or after the (overall) contact between the thin film stamper and the substrate coated with the imprinting material, the pressure in the area (sweeping area) on the back side of the thin film stamper is preferably set between 1100 mbar and 1250 mbar.

[0055] The pressure difference between the processing space and the area (sweeping area) on the back side of the thin film stamper or the sweeping space is also used to demold the thin film stamper from the imprinting material. For this purpose, for example, the pressure in the processing space is set to the normal pressure, while the pressure in the area (sweeping area) on the back side of the thin film stamper is set between 1100 mbar and 1500 mbar.

[0056] In a preferred embodiment of the device for processing a substrate, it is provided that the pressure difference between the processing space and the back side of the thin film stamper is used to actively control imprinting and demolding. Thus, an external force is generated for processing the substrate. The range of the generated force (especially the imprinting force) is preferably between 100 N and 10 kN.

[0057] In a preferred embodiment of the device for processing a substrate, it is provided that the processing space between the substrate receiving device and the device can be configured in the area of the substrate, so that the substrate can be completely arranged within the processing space. In this way, commercially available wafers or other semiconductor components can be processed efficiently in the processing space.

[0058] In an embodiment of the device for processing a substrate, it is provided that the processing tool includes a tool for bonding, preferably for bonding a flexible substrate and / or a thin film substrate fixed on a thin film frame. In this way, through the flexible bonding and contact during bonding, particularly efficient processing of the substrate in the processing space can be achieved. Electronic and / or optical structural elements, especially chips (English: die), applied on the thin (carrier) substrate can be bonded (English: chip-to-wafer bonding) to a second substrate, especially a wafer, for example.

[0059] In a preferred embodiment of a device for processing a substrate, it is provided that the processing tool includes an imprinting tool for imprinting the substrate, preferably a flexible imprinting mold. Here, the device is suitable for performing particularly precise and efficient imprinting in a vacuum. Here, the flexible imprinting mold is a soft mold. Here, the imprinting mold itself can have structures transferred to or molded on the substrate. In addition, the flexible imprinting mold can also apply glue or other materials to the substrate. In particular, imprinting with the imprinting tool can be performed particularly precisely and efficiently in a vacuum. Here, the imprinting tool and / or the substrate particularly preferably have microstructures or nanostructures, so that particularly small structures can be advantageously produced or imprinted.

[0060] In a preferred embodiment of a device for processing a substrate, it is provided that the device is a thin film mold receiving device, and wherein the imprinting tool includes a thin film mold. This thin film mold receiving device is particularly suitable for being used as a mechanism in the device, because the received thin film mold can perform the structuring of the substrate particularly precisely in a evacuated processing space or imprinting space.

[0061] In a preferred embodiment of a device for processing a substrate, it is provided that the thin film mold receiving device has a frame for receiving the thin film mold that can be fixed at the thin film receiving device. Here, the frame receives the thin film mold and is preferably fixed at the thin film receiving device by the fixing tool of the thin film receiving device. Thus, an advantageous indirect and flexible arrangement of the thin film mold at the thin film receiving device can be predetermined. In this way, particularly good processing results or imprinting results can be achieved. In addition, in the case of substrate release, the substrate can abut particularly well against the thin film mold in the position for imprinting. Here, the substrate is preferably fixed to the thin film mold fastened in the frame by capillary forces.

[0062] In a preferred embodiment of a device for processing a substrate, it is provided that the thin film mold can be at least partially released in the processing space by a flushing tool. In other words, at least one flushing tool is present in the region of the fixing surface of the thin film receiving device on the back side of the thin film mold, and this flushing tool can achieve partial filling of the processing space during processing or imprinting. Thus, the thin film mold fixed in the frame can advantageously be at least partially released. Thus, the thin film mold can be lifted and thus released on the back side of the thin film mold by targeted filling, so that particularly good abutment or relaxation can be performed on the substrate in the processing space. Here, the processing space in the region of the back side of the thin film mold is particularly fluidically separated from the rest of the processing space by the thin film mold itself. During flushing with the flushing tool, the frame is particularly preferably kept fixed, so that the position of the thin film mold relative to the substrate can be advantageously predetermined.

[0063] In a preferred embodiment of a device for processing a substrate, it is provided that the processing space is at least partially formed by a frame. In other words, the frame represents the boundary of the processing space. Here, it is particularly preferred that the sealing tool is at least partially formed by the frame. In this way, a locally and fluid-tight processing space can be provided particularly easily.

[0064] In a preferred embodiment of a device for processing a substrate, it is provided that the sealing tool is arranged at the substrate receiving device and / or the film receiving device such that the frame can be completely arranged within the processing space. In other words, the sealing tool is arranged outside the receiving device, in particular in the peripheral region of the receiving device. Thus, a particularly advantageous arrangement of the frame and the film stamp can be achieved completely within the processing space.

[0065] A particularly important aspect is that nanoimprinting with very precise overlay alignment can be achieved by the method and device for performing the processing. Here, it is advantageously possible to control the contact between the substrate and the stamp as well as possible. In particular, the filling characteristics of nanostructures with small residual layers can be optimally achieved using a flexible stamp that can relax on the substrate. In particular, a controlled contact or imprint can be achieved despite the soft and flexible imprinting tool.

[0066] In the context of the concept, first the stamp is fixed and aligned, then a vacuum is introduced between the substrate and the stamp to prevent air bubbles, and then contact is established by controllably bending the substrate and / or the stamp and / or initiating an imprinting wave. The method or approach can achieve efficient nanoimprinting in a vacuum by precisely controlling the surface contact of the flexible stamp.

[0067] In addition, particularly precise control can be achieved during the contact of the stamp and the substrate, wherein the stiffness of the substrate simultaneously allows for a high-precision alignment relative to each other.

[0068] An advantage of the method and device also lies particularly in not having to dispense with the flexible stamp.

[0069] In addition, it is not necessary to load and adjust the entire receiving device in a vacuum. Thus, despite the vacuum, faster contact and thus a higher throughput can be achieved compared to the case of SmartNIL (WO2014 / 037044A1).

[0070] Particularly important aspects are that imprinting is carried out in a vacuum using a flexible film stamp, wherein the alignment of the stamp with the substrate is carried out under normal pressure, and wherein, in the case of sufficient proximity of the receiving devices, an imprinting space that can be locally evacuated is generated between the upper receiving device and the lower receiving device, which enables simplified contact and imprinting in a vacuum, and wherein the contact between the substrate and the film stamp is established by controllably bending the substrate and / or the film stamp and initiating an imprinting wave. Thus, with the film stamp, nanoimprinting with very precise overlapping alignment and without air bubbles can be achieved.

[0071] In the following, the terms stamp, film stamp, imprinting stamp and nanostructure stamp are used synonymously. Furthermore, structuring and imprinting hereinafter refer to the generation of microstructures and / or nanostructures.

[0072] A further important aspect is the contact, wherein first only a partial area is contacted by the prestress of the substrate and / or the film stamp, and subsequently automatic contact of the contact surface is caused, and wherein preferably the entire substrate surface is imprinted in a vacuum with a thin, flexible film stamp in an imprinting space locally delimited by a seal, without repeating the above steps.

[0073] A further particularly important aspect is that the alignment of the substrate and the film stamp is first carried out under normal pressure. Only after the upper receiving device and the lower receiving device are sufficiently close and by contact via the seal, a locally delimited imprinting space that is actively evacuated is generated. Here, the substrate and the film stamp are first fixed and aligned, and then a vacuum is introduced between the substrate and the film stamp in the imprinting space to prevent air bubbles, and subsequently contact is established between the substrate to be imprinted and the film stamp by controllably bending the substrate and initiating an imprinting wave.

[0074] In particular, an actuator is used to start the imprinting front at the center. By the propagation of the imprinting front, the structured imprint surface in a curable material, in particular a resist, is pressed onto the substrate and the structure of the film stamp is replicated. The process can preferably be used for imprinting the first layer or the second layer in combination with fine alignment (SmartView alignment).

[0075] Coating of the stamp and / or the substrate can be selectively carried out in an independent module separately from the imprinting process.

[0076] The main advantages are that alignment is carried out under ambient pressure, and then a substrate coated over its entire area can be contacted and imprinted defectlessly in a vacuum. Thereby, positioning errors that occur due to the movement of the substrate, especially in an evacuable environment, are eliminated. Compared to systems in which the entire imprinting module has to be evacuated, relatively rapid evacuation can be achieved through the locally delimited imprinting space.

[0077] A membrane frame or other impression retainer with a frame is used for imprinting with a flexible stamp in a vacuum. The frame can also be used to define a vacuum zone or an evacuable imprinting space. In a preferred embodiment, only a (rough) vacuum is set between the membrane stamp and the substrate in the imprinting space, so that it is not necessary to evacuate the entire imprinting module.

[0078] Before imprinting, the substrate and the stamp are aligned with each other as precisely as possible. Here, the alignment is usually carried out by alignment marks.

[0079] The basic system can in particular be provided by the EVG SmartView system, where there is no need to observe between the substrate and the membrane stamp, since the membrane stamp is preferably mostly transparent. Thus, the alignment is advantageously not blocked by the membrane stamp, since the alignment optics can be seen through the membrane stamp.

[0080] The imprinting device consists in particular of a stamp receiving device and a device for receiving a nanostructured stamp. The nanostructured stamp, in particular the membrane stamp, is preferably tensioned in a membrane frame.

[0081] According to an advantageous embodiment, a detection device ensures the precise alignment of the substrate and the membrane stamp in such a way that the detection device detects the relative position transmitted to the control unit, which then causes the substrate and the membrane stamp to be aligned with each other.

[0082] The system preferably has a system for non-contact wedge error compensation between the parallel-aligned membrane stamp and the substrate, as described in detail and referenced in WO2012 / 028166A1.

[0083] A major challenge during imprinting lies in the imprinting process itself, i.e., during the initiation of the imprinting wave from the point-like central contact until the contact surfaces of the substrate and the membrane stamp are fully in contact. Here, the alignment relative to each other can also change significantly compared to the previous alignment. For nanoimprinting with a very precise overlapping alignment, it is necessary to control the contact between the substrate and the membrane stamp as well as possible. The placement / contact of the substrate and the membrane stamp is particularly critical, because errors can occur here, and the errors can accumulate.

[0084] In the critical step of the contact of the aligned contact surfaces of the substrate and the membrane stamp, an ever more precise adjustment accuracy or offset is desired. The alignment error is less than 100 µm, in particular less than 10 µm, preferably less than 1 µm, more preferably less than 100 nm, and most preferably less than 10 nm.

[0085] The contact of the contact surface and the imprinting of the corresponding surface by means of the device are carried out especially at the initial imprinting site. By releasing the substrate and / or the thin film stamp from the receiving surface, nanoimprinting - imprinting of the substrate is carried out using the thin film stamp along an imprinting front that extends from the initial imprinting site to the side edge of the thin film stamp.

[0086] It is also possible to control the speed of the imprinting wave by controllably releasing the substrate and / or the thin film stamp. The fixing elements are preferably divided into zones that can be controlled individually. A vacuum fixing part is preferably used.

[0087] A pin or a pipeline in the central hole (from which an overpressure can be generated between the substrate receiving device and the substrate by the introduced gas) is used to controllably bend the fixed substrate (bending tool and / or curvature changing tool). Other deformation tools such as applying a fluid can be envisaged.

[0088] In a further embodiment, a pin or a pipeline in the central hole (from which an overpressure can be generated between the thin film stamp receiving device and the thin film stamp by the introduced gas) is used to controllably bend the fixed thin film stamp (bending tool and / or curvature changing tool).

[0089] The prestressing and contact at the initial imprinting site are described in detail in WO2015 / 161868A1 and are hereby incorporated by reference. Therefore, a precise description thereof is omitted here.

[0090] In a first embodiment, the substrate is fixed at the upper receiving device and, after contact, is controllably pulled downwards on the one hand by gravity and on the other hand under the influence of a force acting along the imprinting wave and between the substrate and the stamp. Thereby, a radially symmetric imprinting wave is caused, which extends especially from the center to the side edge. The configuration of the imprinting wave is not limited to a radially symmetric imprinting wave. In an alternative embodiment, a linear imprinting wave is desired. For this purpose, contact occurs at the edge of the substrate, and a linear imprinting front propagates away from the edge point.

[0091] In a preferred second embodiment, the substrate is fixed at the lower receiving device. In the case of prestressing and contact at the initial imprinting site, the fixing tool is only used in the edge region of the substrate receiving device. Once the substrate comes into contact with the thin film stamp, the fixing of the substrate coated with the imprinting material is released by interrupting the vacuum. Since the negative pressure at the receiving surface decreases, the release of the substrate can be carried out controllably. The fixing elements are controlled correspondingly. The thin film stamp remains fixed at the stamp receiving device unchanged.

[0092] In a preferred third embodiment, the substrate is fixed at the lower receiving device, and the thin film stamp fixed at the upper receiving device is bent by a deforming tool so that the substrate contacts the thin film stamp. Before starting the imprinting process, the distance between the substrate and the thin film stamp is first reduced to a precisely defined distance. In the imprinting process, the substrate and the thin film stamp are not placed flatly one above the other, but first they are brought into contact with each other at a point, for example the center M of the substrate or the edge point R of the substrate, in such a way that the thin film stamp is slightly pressed against the substrate by the deforming tool and deformed thereby. After releasing the deformed, i.e. bent, thin film stamp (in the direction of the opposing substrate), continuous and uniform imprinting takes place along the imprinting front due to the propagation of a radially symmetric or linear imprinting wave.

[0093] A further independent feature of the proposed invention is that, after the full-surface contact between the thin film stamp and the substrate, the flexible thin film stamp is "released" by means of a slight backside overpressure caused by means of a flushing valve, while the film frame remains fixed. Thus, the thin film stamp can relax on the substrate. Due to the capillary forces, the structure is filled, and due to the flexibility provided at this moment, the thin film stamp can adapt in a manner that conforms to the substrate surface. Thus, high-resolution surface structuring can be carried out. Here, in the case of a constant pressure or vacuum in the processing space, the flushing or pressure increase in the backside region (flushing zone) of the thin film stamp serves to relax the thin film stamp on the substrate, but also serves to apply force evenly during imprinting. During the imprinting process, the filling of the structure of the thin film stamp by capillary forces is additionally supported by means of a (slight) backside overpressure. Thus, the imprinting time is advantageously shortened.

[0094] In order to maintain the alignment accuracy as high as possible, in the first embodiment it is provided that the imprint is cured and demolded externally. After the imprinting process in the alignment and imprinting module, the stack is thus transferred to the unloading station and subsequently, in the curing and release module, the glue is crosslinked by means of electromagnetic radiation, in particular UV light, through the transparent thin film stamp. In the second embodiment, curing and demolding also take place in the imprinting module. Thus, only one module is required for alignment, imprinting, curing and demolding, and thus the process time can be optimized.

[0095] The UV light used is selectively broadband light or is particularly adapted to the photoinitiator used in the imprinting glue. The wavelength range of the curable material is in particular between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm.

[0096] In an alternative embodiment, the imprinting material can also be thermally cured. The thermal curing is carried out between 0 °C and 500 °C, preferably between 50 °C and 450 °C, more preferably between 100 °C and 400 °C, most preferably between 150 °C and 350 °C, and particularly preferably between 200 °C and 300 °C.

[0097] At the end of the method, the film stamp is particularly pulled out of the substrate and the substrate is unloaded. The system preferably has a sensor for force monitoring, which is used to control the demolding step.

[0098] In an exemplary embodiment of a method for processing or imprinting a substrate with a flexible film stamp, in a general embodiment, the method particularly has the following steps preferably in the following order: a) Coating or gluing the substrate by means of an application device, such as a spin coating system, b) Adjusting the substrate and the film stamp under normal pressure by means of an adjustment device, c) Bringing the upper receiving device and / or the lower receiving device closer until a vacuumable imprinting space is constructed by sealing, d) Evacuating / constructing a vacuum in the defined imprinting space between the film stamp and the substrate, e) Imprinting the substrate in a vacuum with the start of the imprinting process and the imprinting wave at the substrate and / or the film stamp by means of an actuator, f) Releasing the substrate fixation, g) Performing a gas purge behind the film stamp for film relaxation and control of the imprinting process, h) UV irradiating the curable material, and i) Demolding the film stamp and the substrate, particularly by evacuating the purge space by means of a purge tool.

[0099] If a device for processing a substrate is disclosed in combination with a tool for bonding, step a) more generally includes possible pre-treatments, such as cleaning, surface activation, imprinting, etc.

[0100] The device for processing is preferably disclosed in combination with the production or imprinting of microstructures and / or nanostructures. The substrate can particularly be fixed to the substrate receiving device with an imprinting material, and the structure stamp can be brought into contact with the imprinting material. Here, the fixation of the substrate can be at least partially cancelled and the imprinting material can be cured, wherein the imprinting material can be demolded from the structure stamp.

[0101] The stamp is particularly preferably an imprint stamp used in imprinting technology. The stamp is preferably configured as a soft stamp for imprinting a substrate. The stamp is preferably constructed in batches with a backplane, where the stamp and the backplane can generally be made of different materials. The use of a plurality of different materials results in the individual or assembled stamps thus produced being referred to as hybrid stamps. Here, the backplane can serve as a reinforcement for the stamp. However, a very flexible backplane that only serves as a carrier for the stamp is preferred.

[0102] The backplane can be, for example, a film or made of glass. The backplane is preferably made of a film. The backplane then particularly has a thickness of less than 1000 µm, preferably less than 500 µm, more preferably less than 250 µm, and most preferably less than 100 µm.

[0103] In a further embodiment, it is provided that the backplane is a very thin and flexible glass plate. The glass plate is particularly thinner than 10 mm, preferably thinner than 5 mm, still preferably thinner than 1 mm, most preferably thinner than 500 µm, particularly preferably thinner than 100 µm, and extremely preferably thinner than 10 µm.

[0104] In particular, technical glass with an adapted coefficient of thermal expansion (CTE) is preferred.

[0105] A film stamp is a special soft stamp that is made of a film and on which a micro-imprint structure and / or a nano-imprint structure is applied. The film and the imprint structure form the soft stamp. Here, a hard stamp is used as the master stamp for producing the soft stamp as the negative mold of the hard stamp. The imprint material for stamp manufacturing is present on the film used as the backplane. After releasing the master stamp from the cured imprint material, the produced stamp preferably remains on the backplane, particularly on the film.

[0106] The soft stamp is particularly made of one of the following materials: • Thermoplastic • Elastomer, and / or • Thermosetting plastic.

[0107] The film stamp is particularly made of at least one of the following materials: • Poly(organo)siloxane (silicone resin), particularly Polyhedral oligomeric silsesquioxane (POSS) and / or Polydimethylsiloxane (PDMS), • Perfluoropolyether (PFPE), and / or • Tetraethyl orthosilicate (TEOS).

[0108] For imprinting in a vacuum using a flexible stamp, it is preferred to use a membrane frame or other stamp holder with a frame. The nanostructure stamp, in particular a membrane stamp, is tensioned in the frame.

[0109] The frame at the membrane stamp enables rapid and easy replacement of the stamp, in particular simplifying the process through feasible automation when replacing the membrane stamp. As the frame, the so-called membrane frame which is industrially standardized and normalized is preferred.

[0110] The membrane stamp with a frame is preferably larger than the substrate. The frame is used to define a local vacuum area or an evacuable imprinting space. In the case where the upper receiving device and the lower receiving device are sufficiently close, in a first embodiment, the annular seal of the substrate receiving device contacts the frame, thereby creating an evacuable imprinting space between the membrane stamp with a frame and the substrate. In a further embodiment, the contact site is located directly behind the frame.

[0111] The membrane stamp is mainly UV transparent. The wavelength range for optical transparency is especially between 100 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm, and most preferably between 250 nm and 450 nm. The membrane stamp can also be transparent for other ranges of electromagnetic radiation. The membrane stamp can especially also be transparent in the infrared range.

[0112] In an independent embodiment, the imprinting material is thermally cured. In this embodiment, the membrane stamp does not have to be transparent to electromagnetic radiation and is especially composed of a metal membrane. The especially flexible membrane stamp is especially composed of at least one of the following materials: • Plastic • Metal • Metal alloy.

[0113] The substrate can have any shape, but is preferably circular. The diameter of the substrate is especially industrially standardized. For wafers, the industrially common diameters are 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, and 18 inches. However, the described embodiment can in principle process any substrate, independent of the diameter of the substrate.

[0114] When aligning the membrane stamp and the substrate, they are aligned relative to each other, especially with the aid of optical tools. The alignment is especially carried out using alignment marks which are located at the membrane stamp and the substrate, where the substrate and the membrane stamp have at least two alignment marks. Thus, a very precise positioning of the membrane stamp relative to the substrate is achieved. The membrane stamp and / or the substrate are transparent to the electromagnetic radiation used for alignment. In particular, the membrane stamp is transparent to the electromagnetic radiation used for alignment.

[0115] The substrate, the thin-film printing mold frame, and the printing mold backplane are fixed by at least one fixing element and a corresponding receiving device. The fixing element can be connected and disconnected. The fixing element is preferably: - A vacuum fixing part, especially having individually controllable vacuum tracks and / or a plurality of vacuum tracks (vacuum segments) connected to each other respectively - A mechanical fixing part, especially a clamp, - An electrical fixing part, especially an electrostatic fixing part and / or a magnetic fixing part, - An adhesion fixing part.

[0116] Here, the fixing element for the substrate, the thin-film printing mold frame, and the thin-film printing mold backplane is preferably a vacuum fixing part. At least one fixing element can be especially electronically controlled.

[0117] The vacuum fixing part preferably consists of a plurality of vacuum tracks that appear at the fixing surface of the receiving device. The vacuum tracks can be preferably individually controlled.

[0118] In a preferred embodiment, some vacuum tracks are combined into vacuum track segments, and these vacuum track segments can be individually controlled, so they can be evacuated or filled. However, each vacuum segment is independent of other vacuum segments. Therefore, a feasible solution for constructing individually controllable vacuum segments is provided.

[0119] These individually controllable vacuum tracks or vacuum segments are used in the fixing surface of the thin-film printing receiving device, so as to respectively: • The thin-film printing mold frame, • The outer region of the backplane without a structured part, and / or • The printing area of the backplane with a structured part Define separated fixing elements or fixing areas for improved control of the imprinting process.

[0120] The vacuum segments for fixing the substrate at the substrate receiving device are preferably circularly designed. Thus, a targeted, radially symmetric fixing especially guided from the inside to the outside and / or the release of the substrate from the substrate receiving device can be achieved. Alternatively, a linearly executed fixing of the substrate and / or the thin-film printing mold and / or its release from the receiving device can also be achieved.

[0121] In a first embodiment of the film stamp receiving device and / or the substrate receiving device, a pin or a pipeline in the central hole (from which the introduced gas can generate an overpressure between the fixed surface of the substrate receiving device and the substrate) is used to controllably bend the fixed film stamp and / or the substrate. Here, the film stamp or the substrate is fixedly held in a ring shape in the edge region.

[0122] In a second embodiment of the film stamp and / or substrate receiving device, the internal vacuum segments used as vacuum fixing parts can be switched in such a way that a gas and / or a gas mixture can be pumped into the intermediate space between the fixed surface of the receiving device and the back side of the film stamp or the substrate through the internal vacuum segments for controllably bending the film stamp and / or the substrate fixed at the edge. After the switching, at least one fixing element can then be used as a bending tool at the same time. By designing the vacuum zone or the vacuum segments, the active control of the pressure zone is achieved as a bending tool for imprinting.

[0123] The selection of the introduced process gas as a gas and / or a gas mixture can have an additional influence on the processing of the substrate (imprinting, stamping, bonding). For example, deionized gas can be used to prevent electrostatic charging or slightly moistened helium (He) or nitrogen (N2) can be used to adjust the humidity.

[0124] An important advantage of the device is that the alignment or adjustment of the substrate and the film stamp is carried out with high precision under normal pressure, and then a defect-free and simplified imprinting can be achieved in a vacuum by constructing a locally, spatially defined and evacuated imprinting space.

[0125] The film stamp frame can also be used to define a vacuum zone or an evacuable imprinting space.

[0126] Here, the defined area or the processing space is sealed by means of a seal, in particular one or more annular seals between the upper receiving device and the lower receiving device.

[0127] In a preferred embodiment, one or more annular seals are located at the substrate receiving device.

[0128] The evacuable imprinting space is generated by the approach of the upper receiving device and the lower receiving device until an evacuable imprinting space is formed by sealing after the contact between the stamp receiving device and the substrate receiving device provided with one or more annular seals. In a preferred embodiment, the seal is located behind the film stamp frame so that the entire film stamp frame is within the imprinting space.

[0129] In the region of the imprinting space, preferably in the substrate receiving device, there is a vacuum inlet opening for actively evacuating the imprinting space. According to an embodiment of the invention, the inlet opening is an installed vacuum hole or a similar vacuum element, by means of which the imprinting space can be evacuated in a controlled manner.

[0130] In a preferred embodiment, a rough vacuum is set only between the thin film stamp and the substrate in a locally defined imprinting space.

[0131] A particular advantage of the embodiment and the process is that it is not necessary to evacuate the entire device or the entire imprinting module. Therefore, the evacuation of the imprinting space is only carried out when vacuum is required. Since the space to be evacuated is smaller, a simplified imprinting in vacuum can be achieved.

[0132] In particular, the alignment and adjustment of the substrate and the thin film stamp are first carried out under normal pressure. Subsequently, for defect-free imprinting, the imprinting process is only carried out after the evacuation of the imprinting space.

[0133] After the imprinting process, the substrate and the thin film stamp preferably come into full-surface contact. After the full-surface contact between the thin film stamp and the substrate, the flexible thin film stamp can be lifted by a slight overpressure caused by means of a flushing valve. The flushing valve is preferably located in the outer region of the back plate or the film. This outer region does not have a structure and is not part of the stamp surface. During this time, the thin film stamp frame remains fixed at the stamp receiving device, so that the thin film stamp can relax on the substrate. The structure is filled by capillary forces, and the thin film stamp can adapt to the substrate surface by means of the flexibility provided at this moment. Therefore, high-resolution surface structuring can be carried out.

[0134] The stamp receiving device in particular has at least one flushing valve for lifting the thin film stamp from the fixed surface of the receiving device on the back side. The at least one flushing valve is preferably a fluid element through which a gas and / or a gas mixture can flow out in order to generate an overpressure between the fixed surface of the stamp receiving device and the thin film stamp. The flushing valve is preferably located in the outer region of the back plate or the film. This outer region does not have a structure and is not part of the stamp surface.

[0135] In a first embodiment, the vacuum fixing part for the thin film stamp frame and for the regions of the back plate with and without structure is separated from the fluid element (lifting element) for the overpressure used to lift the thin film stamp.

[0136] In a second embodiment, the individual fixing elements, in particular the vacuum fixing parts for the outer regions of the unstructured back plate, can be switched and supplied with overpressure. Therefore, when required, the individual fixing elements can simultaneously be used as lifting elements and thus relax the thin film.

[0137] In a preferred embodiment of the method for alignment and imprinting, it is provided that the flushing or pressure increase in the area on the back side of the film stamp (flushing area) serves to relax the film stamp at the substrate, but at the same time also serves to apply force evenly during imprinting. During the imprinting process, the filling of the structure of the film stamp by capillary forces is additionally supported by a (slight) overpressure on the back side.

[0138] In a preferred embodiment of the method for alignment and imprinting, it is provided that the pressure difference between the processing space and the area on the back side of the film stamp (flushing area) also serves to release the film stamp from the imprinting material.

[0139] In a preferred embodiment of the method for alignment and imprinting, it is provided that the pressure zones are actively controlled by setting and regulating the pressure in the processing space and the flushing area respectively for imprinting and release. Thus, the pressure difference occurring between the two pressure zones serves to generate an external force acting on the film stamp during imprinting and release.

[0140] The dimensions of the individual nanostructures of the imprinting tool or the imprinting pattern of the film stamp preferably lie in the micrometer and / or nanometer range. The dimensions of the individual nanostructures of the imprinting tool, in particular of the flexible film stamp, are less than 1000 µm, preferably less than 10 µm, more preferably less than 100 nm, and most preferably less than 10 nm.

[0141] The detection device, in particular the alignment optics, can be moved individually with a precision better than 1 mm, preferably better than 100 µm, more preferably better than 10 µm, still more preferably better than 1 µm, yet still more preferably better than 100 nm, most preferably better than 10 nm, and particularly preferably better than 1 nm.

[0142] In a preferred embodiment, after the alignment is completed, a rough vacuum is set only in the locally defined imprinting space (processing space) between the film stamp and the substrate.

[0143] During evacuation, the pressure in the imprinting space is less than 500 mbar, preferably less than 300 mbar, and most preferably less than 250 mbar. In particular, the rough vacuum is preferably set between 300 mbar and 1 mbar, and most preferably between 250 mbar and 100 mbar.

[0144] The pressure in the region (scavenging zone) on the back side of the thin film stamp is preferably set between 1 mbar and 1500 mbar. In a preferred embodiment, in addition to the rough vacuum in the processing space, during and / or after the (overall) contact between the thin film stamp and the substrate coated with the imprint material, the pressure in the region (scavenging zone) on the back side of the thin film stamp is preferably set between 1100 mbar and 1250 mbar.

[0145] The pressure difference between the processing space and the region (scavenging zone) on the back side of the thin film stamp is also used to demold the thin film stamp from the imprint material. For this purpose, the pressure in the processing space is set, for example, to normal pressure, while the pressure in the region (scavenging zone) on the back side of the thin film stamp is set between 1100 mbar and 1500 mbar.

[0146] In a preferred embodiment of the device for processing a substrate, it is provided that the pressure difference between the processing space and the back side of the thin film stamp is used to actively control imprinting and demolding. Thus, an external force for processing the substrate is generated. The range of the generated force preferably lies between 100 N and 10 kN.

[0147] The UV light used is selectively broadband light or is particularly adapted to the photoinitiator used in the imprinting resin. The wavelength range of the curable material lies in particular between 50 nm and 1000 nm, preferably between 150 nm and 500 nm, more preferably between 200 nm and 450 nm. Description of the Drawings

[0148] Further advantages, features and details of the present invention result from the following description of the preferred embodiments and from the drawings. These drawings schematically: Figure 1a show a cross-sectional view of the device of the first embodiment in a first method step, Figure 1b show a cross-sectional view of the device of the first embodiment in a second method step, Figure 1c show a cross-sectional view of the device of the first embodiment in a third method step, Figure 1d show a cross-sectional view of the device of the first embodiment in a fourth method step, Figure 1e show a cross-sectional view of the device of the first embodiment in a fifth method step, Figure 2a show a cross-sectional view of the device of the second embodiment in a first method step, Figure 2b show a cross-sectional view of the device of the second embodiment in a second method step, Figure 2c A cross-sectional view of the device of the second embodiment in the third method step is shown, Figure 2d A cross-sectional view of the device of the second embodiment in the fourth method step is shown, Figure 2e A cross-sectional view of the device of the second embodiment in the fifth method step is shown, Figure 2f A cross-sectional view of the device of the second embodiment in the sixth method step is shown, Figure 2g A cross-sectional view of the device of the second embodiment having a substrate-stamp-stack in the exposure and demolding module in the first method step is shown, Figure 2h A cross-sectional view of the device of the second embodiment having a substrate-stamp-stack in the exposure and demolding module in the second method step is shown, Figure 2i A cross-sectional view of the device of the second embodiment having a substrate-stamp-stack in the exposure and demolding module in the third method step is shown, Figure 2j A cross-sectional view of the device of the second embodiment having a substrate-stamp-stack in the exposure and demolding module in the fourth method step is shown, Figure 3a A cross-sectional view of the device of the third embodiment in the first method step is shown, the device having a loaded substrate and a thin film stamp with a thin film frame, Figure 3b A cross-sectional view of the device of the third embodiment in the second method step is shown, Figure 3c A cross-sectional view of the device of the third embodiment in the third method step is shown.

[0149] Identical components or components with the same function are denoted by the same reference numerals in the drawings. For clarity, the size relationships may not be accurately represented. Detailed Description

[0150] In Figures 1a to 1e is shown a method for performing a process as an imprinting process in an alignment and imprinting module in the first embodiment, similar to a fusion bonding of a lower thin film stamp and an upper substrate. As in Figures 2a to 2jAs shown in the second embodiment in [reference], the arrangement can also be conceived as being reversed, typically with the thin film stamp on top and the substrate below. Here, the device for performing the processing is exemplary represented in the figure by an imprinting device. The device for performing the processing can also be, for example, a laser operating device, a gluing device, a bonding or debonding device. Then, a local processing space can be correspondingly constructed around the substrate between the device or the elements of the device and the substrate receiving device.

[0151] The main advantage of the device is that, first, the alignment and approaching of the substrate and the device or the thin film stamp are performed with high adjustment accuracy under normal pressure, and then a defect-free and simplified imprinting can be achieved in a spatially defined and evacuable imprinting space in a vacuum.

[0152] Figure 1a The receiving devices 1 and 2 of the device for receiving the substrate 13 and the thin film stamp 12 with the thin film frame 9 are shown. The substrate receiving device 1 includes a central opening for guiding an actuator 8 or an actuator device (not shown) through. In this first exemplary embodiment, the imprinting process (nanoimprinting process) is initiated by the actuator 8 in the center of the substrate. The actuator 8 can have different shapes or embodiments. Instead of an actuator-pin or pin as the actuator 8, pressure can also be applied with fluid or gas as an alternative. According to Figure 1a , the opening for the actuator 8 can have different sizes and shapes.

[0153] In Figure 1a , the thin film stamp 12 with the thin film frame 9 has already been received at the thin film stamp receiving device 2. The fixation of the thin film frame 9 is carried out by the fixing element 11 and by vacuum track segments distributed in the fixing surface of the receiving device 2, which fix the defined areas (not shown) on the back side of the thin film. Figure 1a The substrate receiving device 1 with the loaded substrate 13 is also shown. The substrate 13 is fixed by vacuum or negative pressure via the vacuum tracks 6. In a preferred embodiment according to Figure 1a , some of the vacuum tracks 6 are combined into vacuum track segments, which can be individually controlled and thus can be evacuated or filled.

[0154] According to Figure 1a , the substrate receiving device 1 includes a seal, in particular a sealing ring 7, in order to form a spatially defined and sealed imprinting space 14 after contact with the lower thin film stamp receiving device 2. Since the stamp, in particular the thin film stamp 12 with the frame 9, is usually larger than the substrate 13, the loading or gluing of the stamp is preferably carried out outside the substrate area.

[0155] In according to Figure 1bIn the next method step, after alignment or adjustment and approaching until the upper receiving device and the lower receiving devices 1, 2 come into contact at the sealing section 7, an imprint space 14 is formed. The imprint space 14 is evacuated via the vacuum line 5 in the substrate receiving device 1. In accordance with Figure 1b The frame 9 is used to define a local vacuum zone or an evacuable imprint space 14. As an alternative, sealing can also be achieved after the frame 9.

[0156] In accordance with Figure 1c In the next method step, after the imprint space 14 has been completely evacuated and thus a vacuum has been introduced between the substrate 13 and the film stamp 12, the film stamp 12 and the substrate 13 come into contact as point-like as possible in some areas. Figure 1c The contact shown in is effected by concentrically deforming the substrate 13 by means of the pressure exerted, in particular in the center of the substrate 13, by the actuator 8. Here, the substrate 13 is held fixed in a ring shape in the edge region. The substrate 13 is bent in a controlled manner until it comes into contact with the film stamp 12 and is then released, and after complete release, it comes into contact with the film stamp 12 over its entire area. Here, the vacuum prevents possible air bubbles.

[0157] Instead of the pin as the actuator 8 in the central hole of the substrate receiving device, a line through which the introduced gas can generate an overpressure between the fixed surface of the substrate receiving device and the substrate 13 can also be used to controllably bend the fixed substrate 13.

[0158] The vacuum fixing for the substrate 13 preferably consists of a plurality of vacuum tracks 6 present at the fixed surface of the substrate receiving device. In a preferred embodiment, some of the vacuum tracks 6 are combined into individually controllable vacuum track segments. The vacuum segments for fixing the substrate at the substrate receiving device are preferably designed circularly. Thus, after contact, it is possible to achieve a controlled, radially symmetric release of the substrate 13 from the substrate receiving device, in particular from the inside outwards.

[0159] Figure 1d The completed imprint wave is shown, where the imprint front has reached the edge of the substrate 13. The substrate 13 and the film stamp 12 are in almost full-area contact and the substrate 13 is no longer fixed to the upper substrate receiving device. If required, the actuator 8 can first remain in contact with the substrate and / or move back into the central hole.

[0160] In accordance with Figures 1a to 1eThe film impression receiving device 2 has additional valves or gas lines, in particular at least one flushing valve 10, which is used to lift the film impression 12 from the fixed surface of the film impression receiving device 2 on the back side. At least one flushing valve 10 is preferably a fluid element through which gas and / or gas mixture can flow out in order to generate overpressure between the fixed surface of the impression receiving device and the film impression 12. The flushing valve is preferably located in the back plate of the film impression 12 or in the outer region of the film. This outer region does not have a structure and is not part of the impression surface.

[0161] According to Figure 1e , after the full-surface contact between the film impression 12 and the substrate 13, the flexible film impression 12 is "released" by the overpressure between the outer fixed surface of the film impression receiving device and the film impression 12. At the same time, the film impression frame 9 remains fixed at the film impression receiving device, so that the film impression 12 can relax on the substrate. The structure is filled by capillary force, and the film impression 12 can be adapted to the substrate surface by the flexibility provided at this moment. The pressure difference from the ambient pressure can be used as an additional external force to improve the filling characteristics.

[0162] In order to keep the alignment accuracy as high as possible, it is stipulated that the external imprint curing and demolding are carried out in the second module of the device. As an alternative, such a structure can also be conceived, but it will make the structure significantly more complex and lead to unwanted temperature input.

[0163] Figures 2a to 2j The process steps in the second embodiment of the device and method are shown.

[0164] The device particularly has a module group, which has a common working space that can be enclosed relative to the ambient atmosphere as required. The device particularly consists of at least two modules. According to Figures 2a to 2f , alignment and imprinting are carried out in the first module. According to Figures 2g to 2j , curing and demolding are particularly carried out in the second module. Glue application can be carried out separately from the imprinting process in an independent module.

[0165] In the first method step, the substrate 13` and the film impression 12` are loaded and received and fixed at the corresponding receiving devices 1`, 2`.

[0166] Figure 2a The receiving devices 1` and 2` of the device for receiving the substrate 13` and the film impression 12` with a film back plate and a film frame 9` are shown. In this second embodiment, the film impression 12` is above at the film impression receiving device 2`, and the substrate 13` is below at the substrate receiving device 1`.

[0167] InFigure 2a In Figure 2a , the film stamp 12` with a backplate and a film frame 9` has been received at the film stamp receiving device 2`. The film frame 9` is fixed by fixing elements 11` and by vacuum track segments distributed in the fixing surface of the receiving device 2`, and these vacuum track segments fix defined areas (not shown) on the back side of the film. In particular, the structured stamp area and the unstructured area of the (film) backplate are divided into different vacuum track segments.

[0168] In Figure 2a Figure 2a , the substrate 13` has been placed on the loading pins 17 of the substrate receiving device 1`.

[0169] Figure 2b Shown is the substrate 13` after being received at the receiving surface of the receiving body 3` of the substrate receiving device 1`, where loading is performed from above. The substrate 13` is fixed by vacuum or negative pressure via the vacuum tracks 6`. In a preferred embodiment, some of the vacuum tracks 6` are combined into vacuum track segments, and these vacuum track segments can be individually controlled and thus can be evacuated or filled (not shown).

[0170] If the substrate 13` is located at the lower receiving device as shown in the embodiment according to Figures 2a to 2j Figures 2a to 2j , then as an alternative or additional solution to the vacuum fixing, a mechanical fixing for the substrate 13` can be achieved in another embodiment.

[0171] The coating or gluing of the substrate 13` with an imprinting material (imprinting glue) can be selectively performed in an independent module separately from the imprinting process, or can be performed after the substrate 13` is fixed in the alignment and imprinting module. The present invention can be used in combination with established industrial gluing methods, such as, for example, the spin coating method. Thus, the gluing of the substrate is fast, defect-free, full-surface, particle-free, and standardized, which also brings throughput advantages in the imprinting step. In a first embodiment, the substrate 13` is coated with the imprinting material before loading. In another embodiment, the substrate 13` is coated with an application device (not shown) only after being loaded and fixed.

[0172] In the second method step according to Figure 2c Figure 2c , the film stamp 12` is aligned relative to the substrate 13`, in particular using an optical auxiliary tool 15. The film stamp 12` and the substrate 13` approach each other relatively.

[0173] In a preferred embodiment, it is provided that the substrate 13` and / or the substrate receiving device 1` can move with at least three degrees of freedom, preferably with at least four degrees of freedom, more preferably with at least five degrees of freedom, and most preferably with all six degrees of freedom.

[0174] In the second method step according to Figures 2a to 2fIn the alignment and imprinting module, the adjustment units 16 for the substrate 13` and the thin-film stamp 12` are respectively located especially at the upper and lower sides. The corresponding receiving devices 1`, 2` are located on each adjustment unit. Each receiving device 1`, 2` has especially six degrees of freedom, namely three degrees of freedom of translation along the X, Y, and Z directions and three degrees of freedom of rotation around the X, Y, and Z axes. The translational degrees of freedom are used for the displacement of the receiving devices 1`, 2` and thus the substrate 13` or the thin-film stamp 12` in the X-Y plane spanned by the X and Y directions and the approach of the substrate 13` and the thin-film stamp 12` towards each other along the Z direction. The rotational feasibility around the X, Y, and Z axes is used to perform wedge error compensation (English: wedge error compensation, WECZ axis 18) and / or the orientation of the substrate and / or the thin-film stamp. The rotation around the X, Y, and Z axes is especially a rotation with a small rotation angle, so it can also be called tilting.

[0175] The Z direction or the Z axis extends as a surface normal perpendicular to the fixed surface of the receiving devices 1, 1`, 1``, 2, 2`, 2`` in the loading position. The X and Y directions or the X and Y axes are perpendicular to each other and parallel to or extend in the fixed surface of the receiving device.

[0176] In a further embodiment, it is provided that the positioning, fixing, and moving systems of the upper and lower receiving devices 1, 1`, 1``, 2, 2`, 2`` are constructed for at least one degree of freedom by means of a coarse drive and a fine drive.

[0177] In a preferred embodiment, it is provided that the receiving devices 1, 1`, 1``, 2, 2`, 2`` have a central control unit and / or an adjustment unit for controlling and / or adjusting the movement and / or operation, especially the fixing of the substrates 13, 13` and the thin-film stamps 12, 12`, and the position of the receiving devices 1, 1`, 1``, 2, 2`, 2``. In addition, the receiving devices 1, 1`, 1``, 2, 2`, 2`` have at least one sensor (not shown) for measuring influencing factors, especially at least one distance sensor and / or position sensor.

[0178] In accordance with Figure 2cIn the third method step, a locally defined and evacuable embossing space 14' is formed after the receiving devices 1', 2' are sufficiently close. Here, the defined area 14' is sealed by means of seals 7', in particular one or more annular seals between the upper receiving device and the lower receiving devices 1', 2'. The area can be evacuated as required. In a preferred embodiment, one or more annular seals 7' are located at the substrate receiving device 1'. The evacuable embossing space 14' is generated by the approach of the upper receiving device and the lower receiving device until, after the die receiving device 2' comes into contact with the substrate receiving device 1' provided with one or more annular seals 7', the embossing space is formed by sealing. In a preferred embodiment, the seal is located behind the film die frame 9' such that the entire film die frame 9' is located in the embossing space. In an alternative embodiment, the seals 7' can be mounted respectively at both receiving devices or at only one of the receiving devices 1', 2'.

[0179] In the area of the embossing space 14', preferably in the substrate receiving device 1', there is a vacuum inlet opening 5' for the active evacuation of the embossing space 14'. According to a preferred embodiment of the invention, the inlet opening 5' is a mounted vacuum hole or a similar vacuum element by means of which the embossing space 14' can be evacuated in a controlled manner.

[0180] Figure 2c The embossing space 14' constructed by the contact of the upper receiving device and the lower receiving devices 1', 2' at the seal ring 7' after the aligned combination is shown. Before the start of the embossing process, the distance between the substrate 13' and the film die 12' has been reduced to a precisely defined distance.

[0181] Before the evacuation of the embossing space 14' begins, the film die 12' is also aligned relative to the substrate 13' using an optical aid 15. After the evacuation of the embossing space 14', the film die 12' can also be further finely aligned relative to the substrate 13'. Here, before the evacuation of the processing space, in particular an optical aid 15 is used for pre-alignment so that a particularly precise alignment can be advantageously carried out under normal pressure. In addition, after the evacuation of the processing space, the substrate 13' can also be rotated, for example, to compensate for wedge errors. This is particularly carried out by means of the WEC 18.

[0182] In accordance with Figure 2dIn the fourth method step, the imprint material is imprinted by the thin film stamp 12`. An actuator is used here to bend the substrate 13` especially concentrically and convexly and thus to bring the central part of the substrate into contact with the thin film stamp 12` first (not shown). The substrate 13` is held fixed especially at the peripheral edge during deformation by the substrate receiving device 1`.

[0183] In this second embodiment of the substrate receiving device 1`, the internal vacuum segments serving as vacuum fixing parts can be switched in such a way that gas and / or a gas mixture can be pumped through the internal vacuum segments into the intermediate space between the fixing surface of the substrate receiving device 1` and the back side of the substrate for controllably bending the substrate fixed at the edge. Thus, after the switching, at least one central fixing element can simultaneously serve as a bending tool.

[0184] After releasing the deformed, i.e., bent, substrate 13`, continuous and uniform imprinting along the imprint front is carried out by the propagation of the imprint wave.

[0185] According to Figure 2d , the substrate 13` with the imprint material located therebetween and the thin film stamp 12` are fixed together by capillary forces and are in full-surface contact. For this purpose, at least the thin film stamp 12` must have high flexibility. Based on the viscosity of the imprint material, the intermediate space of the thin film stamp 12` is also filled completely with the imprint material by capillary action.

[0186] Another independent feature of the proposed invention is that after the full-surface contact between the thin film stamp 12` and the substrate 13`, the flexible thin film stamp 12` is relaxed by means of a flushing valve 10` with a slight backside overpressure while keeping the film frame 9` fixed. Thus, the thin film stamp 12` can be relaxed on the substrate 13`. Due to the capillary forces, the structure is filled, and due to the flexibility provided at this moment, the thin film stamp 12` can be adapted to the substrate surface. Thus, high-resolution surface structuring can be carried out.

[0187] In the fifth method step, the imprint material is cured. It is provided in order to maintain as high an alignment accuracy as possible that the imprint is cured and demolded externally. According to Figure 2e and Figure 2f , after opening the imprint space, the frame 9` with the thin film stamp stack and the substrate stack is removed from the upper thin film stamp receiving device 2` and transferred to the curing and demolding module.

[0188] According to Figure 2g and Figure 2h, after the imprinting process in the alignment and imprinting module, the film stamp substrate stack is transferred onto an unloading station (not shown), and subsequently, in the curing and releasing module, the imprinting material or glue is crosslinked by means of UV light through the transparent film stamp.

[0189] Similar to the alignment and imprinting module according to Figures 2a to 2f , the curing and releasing module according to Figure 2g has a substrate receiving device 1`` and a film stamp receiving device 2``, the exact description of which is omitted here.

[0190] After fixing the film stamp - substrate - stack at the film stamp receiving device 2`` according to Figure 2g , the receiving devices 1``, 2`` are brought closer until the defined distance according to Figure 2h is reached, for forming a space 14`` delimited by one or more annular seals 7``. The space 14`` is evacuated as required. The UV lamp housing 19 enables the imprinting glue to be irradiated by means of UV light. Here, temperature control is carried out during curing with UV radiation and temperature compensation is carried out as required.

[0191] In the sixth method step, according to Figure 2i and Figure 2j , the film stamp 12` is demolded from the imprinting material. At the end of the method, the film stamp 12` is pulled out from the substrate 13` in particular in the curing and releasing module and the substrate 13` is unloaded. The system preferably has sensors for force monitoring, which are used to control the demolding step.

[0192] According to Figures 2g to 2j , in the curing and releasing module, in particular at the bottom side, there is an adjustment unit 16` for the receiving device 1``. The receiving device 1`` has in particular six degrees of freedom, namely three degrees of freedom of translation along the X, Y and Z directions and three degrees of freedom of rotation about the X, Y and Z axes. The translational degrees of freedom are used for the displacement of the receiving device 1`` and thus of the substrate 13` in the X - Y plane spanned by the X and Y directions and for the movement of the substrate 13` and the film stamp 12` towards each other along the Z direction. The rotational feasibility about the X, Y and Z axes is used for performing wedge error compensation (English: wedge error compensation, WEC Z - axis 18`) and / or for the orientation of the substrate 13` for demolding.

[0193] Figure 2h and Figure 2iReference numeral 5`` designates a line which is selectively used as a vacuum line for evacuating a space 14`` or as a purge valve for purging or building up overpressure in the space 14`` by means of a gas or gas mixture. The evacuation is supported by purging the space 14`` between or around the embossing film 12` and the substrate 13`. Thus, a targeted and additional influence on the demolding can be achieved. Additionally, during demolding, the flexible embossing film 12` can also be relaxed by means of a slight backside overpressure by means of the purge valve 10`` while the film frame 9` remains fixed.

[0194] In Figures 3a to 3c the third embodiment, the apparatus and method for performing the processing are represented as an embossing process, in which the embossing film at the film frame 9` is above and the substrate 13`` is below. In an apparatus according to Figures 3a to 3c , alignment, embossing, curing, and demolding are preferably performed in the same module. The apparatus according to Figures 3a to 3c has a fixed structural form in which the lower part and the upper part of the apparatus, in which the apparatus is integrated, cannot be separated. A substrate receiving device having an adjustment unit 16` with a receiving surface for receiving the substrate 13`` is integrated in the lower part of the apparatus and is designed as space-saving as possible. Thus, it is possible to advantageously construct a processing space 14``` which is as small as possible. The spatially defined and evacuable processing space 14``` around the substrate is delimited by gate valves 20, 20`. The gate valves 20, 20` are used to hermetically close the loading and unloading openings of the processing space and are each constructed in the wall of the processing chamber. Evacuation is performed by an evacuation tool 5`` arranged at the apparatus, so that the processing space 14``` can be evacuated after the gate valves 20, 20` are closed. Here, the substrate 13`` and the embossing film 12`` with the film frame 9` are arranged in the processing space 14```. Here, the processing is performed in the processing space.

[0195] In an exemplary embodiment of the method using the apparatus according to Figures 3a to 3c , steps c) approaching of the upper receiving device and / or the lower receiving device and d) evacuating / building up a vacuum in the defined embossing space between the embossing film and the substrate can be exchanged arbitrarily.

[0196] The lower substrate receiving device preferably approaches the upper embossing film by means of the adjustment unit 16`.

[0197] In Figure 3aIn this case, a film stamp with a backplate together with a film frame 9` has been received at the film stamp receiving device. After being introduced into the device via the gate valves 20, 20`, the receiving is carried out by the film frame loading unit 21. The film frame 9` is fixed by fixing elements 11` and by vacuum track segments distributed in the fixing surface of the receiving device, and these vacuum track segments fix the defined areas (not shown) on the back side of the film. In particular, the structured stamp area and the unstructured area of the (film) backplate are divided into different vacuum track segments. The film stamp is tensioned in the frame, especially in the film frame 9`.

[0198] The substrate can be temporarily stored (not shown) and transferred to the processing chamber onto the substrate loading pin 17` via one of the gate valves 20, 20` by means of an operating device (not shown), such as a robotic arm. Then, the gate valves 20, 20` are closed again. The presence of the two gate valves 20, 20` enables greater flexibility during the process execution. One gate valve can be used, for example, for introducing and removing the substrate 13``, while the second gate valve is used for introducing and removing the film stamp 12`` with the film frame 9`. Some substrates and / or different substrates can be imprinted with the film stamp. The film stamp can be retained in the device according to Figure 3a for multiple imprinting processes.

[0199] Figure 3a The substrate 13`` coated with the imprinting adhesive is shown after being received at the receiving surface of the receiving body of the substrate receiving device, where, after being introduced into the device via the gate valves 20, 20`, it is loaded from above by the loading pin 17`. The substrate 13`` is fixed by vacuum or negative pressure via the vacuum tracks. In a preferred embodiment, some of the vacuum tracks are combined into individually controllable vacuum track segments and can thus be evacuated or filled (not shown). If the substrate 13`` is located at the lower receiving device as shown in the embodiment according to Figure 3a a mechanical fixing part for the substrate 13`` can be realized in an alternative or additional way in another embodiment as an alternative to the vacuum fixing part.

[0200] According to an advantageous embodiment, a detection device, especially with optical devices 15o, 15u, ensures the precise alignment of the substrate 13`` and the film stamp 12`` in such a way that the detection device detects the relative position transmitted to the control unit, and the control unit then causes the substrate and the film stamp to be aligned with each other.

[0201] In the first embodiment, before the evacuation of the imprinting space 14``` starts, the thin-film stamp 12`` is also aligned relative to the substrate 13`` by means of optical auxiliary tools 15o, 15u. After the evacuation of the imprinting space 14```, it is also possible to perform further fine alignment of the thin-film stamp 12`` relative to the substrate 13``. In addition, after the evacuation of the processing space 14```, it is also possible to rotate the substrate 13``, for example, in order to compensate for the wedge error. This wedge error compensation is carried out in particular by means of the WEC 18` (wedge error compensation).

[0202] Before the start of the imprinting process, in the next method step according to Figure 3b the distance between the substrate 13`` and the thin-film stamp 12`` is reduced to a precisely defined distance. Preferably, the lower substrate receiving device approaches the thin-film stamp 12``.

[0203] In the next method step according to Figure 3c the imprinting of the imprinting material is carried out through the thin-film stamp 12``. In a preferred embodiment of the receiving device for the thin-film stamp with a thin-film frame, the internal vacuum segments serving as vacuum fixing parts can be switched in such a way that a gas and / or gas mixture can be pumped through this internal vacuum segment into the intermediate space between the fixing surface of the receiving device for the thin-film stamp with a thin-film frame and the back side of the thin-film stamp for the controlled bending of the thin-film stamp fixed at the edges. Thus, after the switching, at least one central fixing element can be used simultaneously as a bending tool.

[0204] The contact in the device according to Figure 3b preferably takes place after the approach of the lower substrate receiving device, where, due to the prestress of the upper thin-film stamp, first only a partial surface of the thin-film stamp 12`` comes into contact with the substrate 13`` and subsequently causes the automatic contact of the contact surface, and where, without repeating the above steps, preferably the entire substrate surface is imprinted in the imprinting space 14``` with a flexible thin-film stamp in a vacuum.

[0205] After the full-surface contact between the thin-film stamp 12`` and the substrate 13``, according to Figure 3cThe flexible film stamp 12`` is "released" by the overpressure between the external fixing surface of the film stamp receiving device and the film stamp 12``. During this period, the film stamp frame 9` remains fixed at the film stamp receiving device, so that the film stamp 12`` can relax on the substrate 13``. The structure is filled with the imprinting adhesive by capillary force, and the film stamp 12`` can be adapted in a way that it can adapt to the substrate surface by the flexibility provided at this moment. Additionally, the pressure difference from the ambient pressure can be used as an additional external force to improve the filling characteristics. For this purpose, the pressure behind the film stamp 12`` in the film stamp flushing space 23 and the pressure or vacuum in the processing space 14``` are set specifically. The pressure in the processing space 14``` is especially between 1 mbar and 1100 mbar. When evacuating, the pressure in the processing space is less than 500 mbar, preferably less than 300 mbar, most preferably less than 250 mbar. In particular, the rough vacuum is preferably set between 300 mbar and 1 mbar, most preferably between 250 mbar and 100 mbar.

[0206] The pressure at the back side of the film stamp 12`` in the flushing space 23 is especially between 1 mbar and 1500 mbar. The pressure difference (pressure difference from the ambient pressure) between the processing space 14``` and the film stamp flushing space 23 is between 0 mbar and 800 mbar, preferably between 100 mbar and 600 mbar, more preferably between 200 mbar and 600 mbar. A pressure difference of 500 mbar corresponds to a force of, for example, 4.5 kN, which can be used as an additional force in the imprinting process.

[0207] The UV lamp cover 19` enables the imprinting adhesive to be irradiated with UV light. Here, temperature control is carried out during UV radiation curing and temperature compensation is carried out as required. During the UV curing of the imprinting material at the substrate, the film stamp material is preferably at least partially transparent to the wavelength range of the electromagnetic radiation that crosslinks the imprinting material. Here, the optical transparency is especially greater than 20%, preferably greater than 50%, more preferably greater than 80%, most preferably greater than 95%. The film stamp can also be transparent to other regions of the electromagnetic radiation. Other adjacent components of the upper receiving device and the sections of the upper part of the device adjacent to the UV lamp cover 19` are also made of UV- and / or IR-transparent materials.

[0208] In the last method step (not shown), the film stamp 12`` is demolded from the imprinting material. At the end of the method, especially the film stamp 12`` is removed from the substrate 13`` and the substrate 13`` is unloaded. The system preferably has a sensor for force monitoring to control the demolding step. The adjustment unit 16` for the substrate receiving device is located according to Figures 3a to 3cIn the device, especially at the bottom side. The receiving device has especially six degrees of freedom, namely three degrees of freedom of translation along the X, Y, and Z directions and three degrees of freedom of rotation around the X, Y, and Z axes. The translational degrees of freedom are used for the displacement of the receiving device and thus the substrate 13`` within the X-Y plane spanned by the X and Y directions and for the movement of the substrate 13`` and the thin film stamp 12`` towards each other along the Z direction. The feasibility of rotation around the X, Y, and Z axes is used to perform wedge error compensation (English: wedge error compensation, WEC Z-axis 18`) and / or the orientation of the substrate 13`` for demolding.

[0209] List of reference numerals: 1, 1`, 1`` Substrate receiving device, substrate receiving device 2, 2`, 2`` Device for processing, thin film stamp receiving device, thin film stamp receiving device 3, 3` Substrate receiving body, substrate holder 4, 4` Thin film stamp receiving body 5, 5`, 5`` Vacuum tool, vacuum tool, vacuum pipeline 6, 6` One or more fixing elements for the substrate 7, 7` Sealing part, sealing tool 8 Actuator (pin) 9, 9` Frame, stamp frame, thin film frame, thin film frame 10, 10`, 10`` Flushing tool, gas pipeline 11, 11` One or more fixing elements for the thin film frame 12, 12`, 12`` Processing tool, imprinting tool, stamp, imprinting stamp, flexible thin film stamp 13, 13`, 13`` Substrate, substrate stack 14, 14`, 14``, 14``` Processing space, vacuum imprinting space, space 15, 15o, 15u Optical device for alignment 16, 16` Adjustment unit (alignment stage) 17, 17` Substrate loading pin 18, 18` WEC Z-axis (wedge error compensation) 19, 19` UV lamp cover 20, 20` Sealing tool, gate valve, stop slide (gate valve) 21 Loading unit for the thin film stamp with the thin film frame (thin film frame) 22 Operating device, chamber, processing chamber, processing module 23 Developing and scanning space.

Claims

1. A method for processing a substrate (13), in particular for nanoimprinting, the method having at least the following steps: a) providing a substrate receiving device (1, 1`, 1``) for receiving the substrate (13), b) providing a device (2, 2`, 2``, 22) for processing the substrate (13), c) constructing a local and fluid-tight processing space (14, 14`, 14``) between the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``, 22), d) evacuating the processing space (14, 14`, 14``), and e) processing the substrate (13), Among them, wherein step d) of evacuating is carried out after the construction of the processing space (14, 14`, 14``) in step c).

2. The method according to claim 1, wherein, The construction of the processing space (14, 14`, 14``) is carried out by the approach of the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``), wherein the device (2, 2`, 2``) and the substrate receiving device (1, 1`, 1``) are aligned with each other before the approach.

3. The method according to claim 1, wherein, The construction of the processing space (14, 14`, 14``) is carried out by a controllable sealing tool (20, 20`).

4. The method according to any one of claims 1 to 3, wherein The device (2, 2`, 2``, 22) has a flexible film stamp (12``) for processing, in particular imprinting, the substrate (13), and in step e), a fluid-tight flushing space (23) between the device (22) and the film stamp (12``) is flushed to bend the film stamp (12``), wherein the processing space (14, 14`, 14``) and the flushing space (23) are fluid-separated from each other by the film stamp (12, 12`, 12``).

5. The method according to claim 4, wherein, The pressure difference between the pressure in the processing space (14, 14`, 14``) and the pressure in the flushing space (23) is set between 0 mbar and 800 mbar, preferably between 100 mbar and 600 mbar, more preferably between 200 mbar and 600 mbar, for carrying out the processing, in particular the imprinting.

6. A device for processing a substrate (13), the device having at least: i) a substrate receiving device (1, 1`, 1``) for receiving the substrate (13), ii) a device (2, 2`, 2``, 22) for processing the substrate (13), iii) a tool for constructing a local and fluid-tight processing space (14, 14`, 14``) between the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``, 22), iv) a vacuum tool (5, 5`) for evacuating the processing space (14, 14`, 14``), and v) a processing tool (12, 12`, 12``) for processing the substrate.

7. The apparatus according to claim 6, wherein, The tool is an approaching tool for bringing the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``) closer.

8. The apparatus according to claim 7, wherein, The device additionally has an aligning tool for aligning the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``, 22) with each other, wherein the aligning tool is arranged such that the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``) can be aligned with each other before and / or during the action of the approaching tool.

9. The device according to claim 7 or 8, wherein, The substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``, 22) have corresponding sealing tools (7, 7`), wherein the approaching tool is arranged such that after the action of the approaching tool, the corresponding sealing tools (7, 7`) construct the processing space (14, 14`, 14``) between the substrate receiving device (1, 1`, 1``) and the device (2, 2`, 2``).

10. The device according to claim 6, wherein, The tool is a controllable sealing tool (20, 20`) for constructing the processing space (14, 14`, 14``) between the substrate receiving device (1, 1`, 1``) and the device (22).

11. The device according to claim 10, wherein, The substrate receiving device (1, 1`, 1``) and the device (22) are integrally constructed.

12. The apparatus according to at least one of the preceding claims, wherein, The processing tool has a flexible film stamp (12``) for imprinting, in particular nano-imprinting, the substrate (13).

13. The device according to claim 12, wherein, The device additionally has a flushing tool (10, 10`, 10``) for constructing a fluid-tight flushing space (23) between the device (22) and the film stamp (12``), wherein the flushing space (23) is fluidically separated from the processing space (14, 14`, 14``) by the film stamp (12``), and wherein the film stamp (12``) can be deformed in a targeted manner by the flushing tool (10``).

14. The apparatus according to claim 12, wherein, The device is arranged such that the pressure difference between the processing space (14, 14`, 14``) and the flushing space (23) can be set between 0 mbar and 800 mbar, preferably between 100 mbar and 600 mbar, and more preferably between 200 mbar and 600 mbar.

15. The device according to claim 13 or 14, wherein, The flushing tool (10``) is simultaneously a vacuum tool, so that the film stamp (12``) can be demolded from the substrate (13) by evacuating the flushing space (23).

Images