Packaging structure and packaging method for improving parallel sealing and welding yield

Abstract

The invention discloses a packaging structure and a packaging method for improving the parallel sealing and welding yield, and the structure comprises a pedestal, a sealing ring is installed on the pedestal, a cover plate is installed on the sealing ring, a plane sealing surface is arranged on the sealing ring, a plurality of longitudinal sealing surfaces are arranged on the lower end surface of the cover plate, and one ends, far away from the sealing ring, of the plurality of longitudinal sealing surfaces are all connected to the plane sealing surface. A welding grid is jointly defined by the two adjacent longitudinal sealing-in faces and the two adjacent plane sealing-in faces, a first-stage sealing-in welding layer and a second-stage sealing-in welding layer are arranged between the longitudinal sealing-in faces and the plane sealing-in faces respectively, and the first-stage sealing-in welding layer and the second-stage sealing-in welding layer are jointly used for enhancing the sealing-in sealing performance of the cover plate and the sealing-in ring. The problem of air leakage of a product caused by poor welding between welding spots during first sealing welding is solved, and the sealing performance of the product is enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical device packaging, and in particular to a packaging structure and a packaging method for improving the finished product rate of parallel seam welding. Background Art

[0002] Under the dual influence of market economic growth and policy support, the semiconductor industry in our country has developed rapidly. Parallel seam welding technology is a key technology in the field of electronic device packaging, and is mainly applied to the sealing processes of electronic products such as ceramic chip packaging and metal cavity packaging. Parallel seam welding belongs to a kind of resistance welding process in the electronic device packaging process. Its principle is that the electrode wheel contacts the edge of the metal cover of the electronic component, and the electrode wheel instantaneously discharges a large current to melt the cover metal at the contact point. The melted metal is used as a solder to weld the cover to the welding ring on the part base. At the same time, the electrode wheel rolls to the next position and discharges again, thus forming one solder bead after another. Multiple solder beads are connected to complete the sealing of the entire electronic device.

[0003] In the prior art, the Chinese patent document with publication number CN118478078A discloses a clamping and fixing device for parallel seam welding, including a fixture base. A limiting groove is provided at the center of the upper surface of the fixture base; a spring array is provided in the limiting groove, and the spring array includes a plurality of springs evenly distributed; a block fixing hole row is provided at the edge of the limiting groove; the block fixing hole row is composed of a plurality of first screw holes arranged in parallel, and the interval length between the centers of every two adjacent first screw holes is L>0; a positioning block and a limiting wrench are also fixed on the upper surface of the fixture base. The device proposed by the present utility model ensures the stable clamping of the leaded pin housing through the positioning block and the limiting wrench. The springs provided at the bottom of the limiting groove can compensate for the unevenness of the base caused by the processing error of the leaded pin housing, ensuring sufficient contact between the electrode wheel and the cover, and improving the welding consistency by improving the clamping device. However, it still cannot completely solve the problem of solder bead connection defects.

[0004] Since the connection between a single solder bead and adjacent solder beads is likely to be loose, it may lead to insufficient sealing of the contact surface between the welding points, resulting in air leakage of the overall structure. Summary of the Invention

[0005] To solve the above technical problems, the present invention provides a packaging structure and a packaging method for improving the finished product rate of parallel seam welding.

[0006] The present invention is achieved through the following technical solutions.

[0007] An encapsulation structure for improving the finished product rate of parallel sealing welding provided by the present invention includes a base, a sealing ring is installed on the base, a cover plate is installed on the sealing ring, a planar sealing surface is provided on the sealing ring, and a plurality of longitudinal sealing surfaces are provided on the lower end surface of the cover plate. One ends of the plurality of longitudinal sealing surfaces far away from the sealing ring are all connected to the planar sealing surface. A welding grid is jointly formed between two adjacent longitudinal sealing surfaces and the planar sealing surface. A primary sealing welding layer and a secondary sealing welding layer are respectively provided between the longitudinal sealing surface and the planar sealing surface. The primary sealing welding layer and the secondary sealing welding layer are jointly used to enhance the sealing tightness between the cover plate and the sealing ring.

[0008] Preferably, the welding area of the secondary sealing welding layer is larger than that of the primary sealing welding layer.

[0009] Preferably, the longitudinal sealing surface is integrally formed with the cover plate.

[0010] Preferably, the cover plate is made of ferroalloy material.

[0011] Preferably, the longitudinal sealing surface is made of ferroalloy material.

[0012] Preferably, the planar sealing surface is made of ferroalloy material.

[0013] Preferably, the surface of the sealing ring is provided with a gold plating layer.

[0014] On the other hand, the present invention also provides an encapsulation method for improving the finished product rate of parallel sealing welding, including the following steps:

[0015] S1: Place the cover plate on the sealing ring, and the cover plate is welded to the sealing ring through the planar sealing surface and the longitudinal sealing surface;

[0016] S2: For the first sealing welding, make the electrode wheel contact the edge of the cover plate. At this time, a first sealing welding point is formed at the contact position between the electrode wheel and the cover plate. Through the instantaneous discharge of the electrode wheel, the temperature at the contact position between the electrode wheel and the cover plate rises. When the temperature range at the contact point between the electrode wheel and the cover plate reaches 1400°C - 1600°C, the material at this position is melted to form a welding bead, and the cover plate and the sealing ring are sealed and welded together;

[0017] S3: Roll the electrode wheel along the edge of the cover plate to the next position, repeat the discharge process, form a new welding bead and weld it to the sealing ring, weld the new welding bead to the previous welding bead, repeat this action to form the first welding line, and finally form the primary sealing welding layer;

[0018] S4: Secondary sealing welding. The electrode wheel makes point contact with another position on the edge of the cover plate. At this time, the contact position between the electrode wheel and the cover plate forms a second sealing weld point. Through the instantaneous discharge of the electrode wheel, the temperature at the contact position between the electrode wheel and the cover plate rises. When the temperature range at the contact point between the electrode wheel and the cover plate reaches 1400°C to 1600°C, the material at this position is melted to form a solder bead, connecting the cover plate and the sealing ring.

[0019] S5: Then roll the electrode wheel along the edge of the cover plate to the next position, repeat the discharging process, form a new solder bead and weld it to the sealing ring. The new solder bead is welded to the previous solder bead. Repeat this action to form the second welding line, and finally form the secondary sealing welding layer.

[0020] Preferably, the area of the second sealing weld point is larger than that of the first sealing weld point.

[0021] The beneficial effects of the present invention are as follows: The cover plate and the sealing ring are subjected to two sealing weldings. Each time, the electrode wheel contacts the cover plate at a different angle, so that the sizes of the solder joints formed by the two sealing weldings are different. The area of the secondary sealing welding is larger than that of the first sealing welding. The solder joints formed by the secondary sealing welding are used to cover the contact surface between the solder joints formed by the first sealing welding again, solving the problem of air leakage of the product caused by poor welding between the solder joints during the first sealing welding, strengthening the sealing performance of the product, thereby improving the finished product rate of parallel sealing welding of electronic products and achieving the purpose of high reliability of parallel sealing welding of electronic products. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of the present invention;

[0023] Figure 2 is a schematic structural diagram of the present invention mainly for showing the primary sealing welding layer;

[0024] Figure 3 is a schematic structural diagram of the present invention mainly for showing the primary sealing welding layer and the secondary sealing welding layer;

[0025] In the figure: 1 - base; 2 - sealing ring; 3 - cover plate; 4 - longitudinal sealing surface; 5 - planar sealing surface; 6 - primary sealing welding layer; 7 - secondary sealing welding layer; 8 - electrode wheel. Detailed Embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] It should be noted that all the directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In this embodiment, referring to Figure 1 and Figure 2 , it includes a base 1, a sealing ring 2 is installed on the base 1, a cover plate 3 is connected to the sealing ring 2, a planar sealing surface 5 is provided on the sealing ring 2, a plurality of longitudinal sealing surfaces 4 are provided on the lower end surface of the cover plate 3, and one end of each of the plurality of longitudinal sealing surfaces 4 far from the sealing ring 2 is connected to the planar sealing surface 5. A welding grid is jointly formed between two adjacent longitudinal sealing surfaces 4 and the planar sealing surface 5.

[0029] In this embodiment, referring to Figure 1 , Figure 2 and Figure 3 , a primary sealing welding layer 6 and a secondary sealing welding layer 7 are respectively provided between the longitudinal sealing surface 4 and the planar sealing surface 5. The welding area of the secondary sealing welding layer 7 is larger than that of the primary sealing welding layer 6. The primary sealing welding layer 6 and the secondary sealing welding layer 7 are jointly used to enhance the sealing tightness between the cover plate 3 and the sealing ring 2.

[0030] By contacting the edge of the cover plate 3 with the electrode wheel 8 and the electrode wheel 8 discharging instantaneously, the temperature at the contact position between the electrode wheel 8 and the cover plate 3 rises, and the material at this position of the cover plate 3 is melted to form welding beads. The welding beads are filled and solidified into the welding grid to realize the welding between the cover plate 3 and the sealing ring 2. By rolling the electrode wheel 8, the electrode wheel 8 moves to the next position at the edge of the cover plate 3, and the discharging process is repeated to form new welding beads filled and solidified into the welding grid. The new welding beads are welded together with the previous welding bead, and this action is repeated to form a welding line, and finally the primary sealing welding layer 6 is formed;

[0031] During secondary sealing, the electrode wheel 8 is contacted with another position point at the edge of the cover plate 3. By reducing the contact inclination angle between the electrode wheel 8 and the cover plate 3, the discharging contact area is expanded, so as to form larger welding beads. The above operation steps are repeated to obtain the secondary sealing welding layer 7. The large welding beads formed by secondary sealing cover the welds between the small welding beads formed by the first sealing. The secondary sealing welding layer 7 covers the primary sealing welding layer 6, strengthens the sealed connection between the cover plate 3 and the sealing ring 2, increases the welding surface path, improves the welding yield, and increases the reliability of parallel sealing welding;

[0032] The welding grid facilitates the positioning of the contact points between the electrode wheel 8 and the cover plate 3, making the distribution between the welding beads more uniform, so that the sealing tightness of the primary sealing welding layer 6 and the secondary sealing welding layer 7 is stronger.

[0033] In this embodiment, with reference to Figure 1 and Figure 2 , the longitudinal sealing surface 4 and the cover plate 3 are integrally formed. The cover plate 3 is made of ferroalloy material, and the longitudinal sealing surface 4 is also made of ferroalloy material, which facilitates high-frequency instantaneous discharge of the electrode wheel 8 on the cover plate 3 to generate high temperature, so that the cover plate 3 forms welding beads to be welded with the longitudinal sealing surface 4, which helps to strengthen the welding tightness between them and reduce the possibility of air leakage at the sealing position.

[0034] In this embodiment, the planar sealing surface 5 is made of ferroalloy material to enhance the welding fusion with the planar sealing surface 5 and the welding beads, and further enhance the tightness at the sealing position.

[0035] In this embodiment, the surface of the sealing ring 2 is provided with a gold plating layer, which helps to quickly realize the welding of the planar sealing surface 5 and the sealing ring 2, making the connection between the two more stable.

[0036] The preferred embodiment of the present invention also provides a packaging method for improving the finished product rate of parallel sealing welding, including the following detailed steps:

[0037] S1: Place the cover plate 3 on the sealing ring 2, weld the planar sealing surface 5 on the sealing ring 2, and form a plurality of longitudinal sealing surfaces 4 on the cover plate 3 by integral molding. The longitudinal sealing surfaces 4 are welded to the planar sealing surface 5 by welding, so that the plurality of longitudinal sealing surfaces 4 and the planar sealing surface 5 jointly form a plurality of welding grids.

[0038] S2: Contact the electrode wheel 8 with the edge of the cover plate 3, and control the contact area of the electrode wheel 8 on the cover plate 3 by adjusting the contact inclination angle between the electrode wheel 8 and the cover plate 3; when the contact inclination angle of the electrode wheel 8 is larger, the contact area between the electrode wheel 8 and the cover plate 3 is smaller.

[0039] S3: For the first sealing welding, contact the electrode wheel 8 with the cover plate 3 to form the first sealing welding point. At this time, there is a contact inclination angle between the electrode wheel 8 and the cover plate 3. Through instantaneous discharge of the electrode wheel 8, when the temperature at the contact point between the electrode wheel 8 and the cover plate 3 rises to 1400°C - 1600°C, the material at this position is melted to form welding beads, and the cover plate 3 and the sealing ring 2 are sealed and welded together.

[0040] S4: Then roll the electrode wheel 8 along the edge of the cover plate 3 to the next position, repeat the discharge process, form new welding beads to be welded with the sealing ring 2, and the new welding beads are welded to the previous welding bead. Repeat this action to form the first welding line, and finally form the first-level sealing welding layer 6.

[0041] S5: Secondary sealing welding. The electrode wheel 8 makes point contact with another position on the edge of the cover plate 3 to form a second sealing weld point. At this time, by reducing the contact inclination angle between the electrode wheel 8 and the cover plate 3 in the first sealing welding, the contact area between the electrode wheel 8 and the cover plate 3 becomes larger, thereby forming a larger weld bead. The area of the second sealing weld point is larger than that of the first sealing weld point. Through the instantaneous discharge of the electrode wheel 8, when the temperature at the contact point between the electrode wheel 8 and the cover plate 3 rises to 1400°C - 1600°C, the material at this position is melted to form a weld bead, which is used to connect the cover plate 3 and the sealing ring 2 together again. The weld bead formed by the secondary sealing welding covers the weld bead formed by the first sealing welding again, making the welding between the cover plate 3 and the sealing ring 2 tighter.

[0042] S6: Then roll the electrode wheel 8 along the edge of the cover plate 3 to the next position, repeat the discharge process to form a new weld bead welded to the sealing ring. The new weld bead is welded to the previous weld bead. Repeat this action to form a second welding line, and finally form a secondary sealing welding layer 7. The welding area of the secondary sealing welding layer 7 is larger than that of the primary sealing welding layer 6. The secondary sealing welding layer 7 covers the primary sealing welding layer 6, thus solving the problem of product air leakage caused by poor welding between solder joints during the first sealing welding.

[0043] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. An encapsulation structure for improving the finished product rate of parallel seam welding, characterized in that: It includes a base (1), on which a sealing ring (2) is installed, and on the sealing ring (2), a cover plate (3) is installed. The sealing ring (2) is provided with a planar sealing surface (5), and the lower end surface of the cover plate (3) is provided with a plurality of longitudinal sealing surfaces (4). One ends of the plurality of longitudinal sealing surfaces (4) far from the sealing ring (2) are all connected to the planar sealing surface (5). A welding grid is jointly formed between two adjacent longitudinal sealing surfaces (4) and the planar sealing surface (5). An primary sealing welding layer (6) and a secondary sealing welding layer (7) are respectively arranged between the longitudinal sealing surface (4) and the planar sealing surface (5). The primary sealing welding layer (6) and the secondary sealing welding layer (7) are jointly used to enhance the sealing tightness between the cover plate (3) and the sealing ring (2).

2. The encapsulation structure for improving the finished product rate of parallel seam welding according to claim 1, characterized in that: The welding area of the secondary sealing welding layer (7) is larger than that of the primary sealing welding layer (6).

3. The encapsulation structure for improving the finished product rate of parallel seam welding according to claim 1, wherein: The longitudinal sealing surface (4) is integrally formed with the cover plate (3).

4. The packaging structure for improving the finished product rate of parallel seam welding according to claim 1, characterized in that: The cover plate (3) is made of ferroalloy material.

5. The packaging structure for improving the finished product rate of parallel seam welding according to claim 1, characterized in that: The longitudinal sealing surface (4) is made of ferroalloy material.

6. The encapsulation structure for improving the finished product rate of parallel seam welding according to claim 1, wherein: The planar sealing surface (5) is made of ferroalloy material.

7. The packaging structure for improving the finished product rate of parallel seam welding according to claim 1, wherein: The surface of the sealing ring (2) is provided with a gold plating layer.

8. An encapsulation method for improving the finished product rate of parallel seam welding as described in any one of claims 1-7, characterized in that, It includes the following steps: S1: Place the cover plate (3) on the sealing ring (2), and the cover plate (3) is welded to the sealing ring (2) through the planar sealing surface (5) and the longitudinal sealing surface (4). S2: For the first sealing welding, make the electrode wheel (8) contact the edge of the cover plate (3). At this time, a first sealing welding point is formed at the contact position between the electrode wheel (8) and the cover plate (3). Through the instantaneous discharge of the electrode wheel (8), the temperature at the contact position between the electrode wheel (8) and the cover plate (3) rises. When the temperature range at the contact point between the electrode wheel (8) and the cover plate (3) reaches 1400°C - 1600°C, the material at this position is melted to form a welding bead, and the cover plate (3) and the sealing ring (2) are sealingly welded and connected. S3: Roll the electrode wheel (8) along the edge of the cover plate (3) to the next position, repeat the discharging process, form a new welding bead and weld it to the sealing ring (2), and the new welding bead is welded to the previous welding bead. Repeat this action to form the first welding line, and finally form the primary sealing welding layer (6). S4: For the secondary sealing welding, the electrode wheel (8) contacts another position point on the edge of the cover plate (3). At this time, a second sealing welding point is formed at the contact position between the electrode wheel (8) and the cover plate (3). Through the instantaneous discharge of the electrode wheel (8), the temperature at the contact position between the electrode wheel (8) and the cover plate (3) rises. When the temperature range at the contact point between the electrode wheel (8) and the cover plate (3) reaches 1400°C - 1600°C, the material at this position is melted to form a welding bead, and the cover plate (3) and the sealing ring (2) are connected. S5: Then roll the electrode wheel (8) along the edge of the cover plate (3) to the next position, repeat the discharging process, form a new welding bead and weld it to the sealing ring, and the new welding bead is welded to the previous welding bead. Repeat this action to form the second welding line, and finally form the secondary sealing welding layer (7).

9. The encapsulation method for improving the finished product rate of parallel seam welding according to claim 8, characterized in that: The area of the second sealing welding point is larger than that of the first sealing welding point.

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