Welding device for PCB

Abstract

The invention relates to the technical field of circuit board welding equipment, and discloses a PCB welding device which comprises a conveying mechanism, a wave soldering mechanism and a fixing mechanism, the conveying mechanism comprises a conveying assembly and a bearing part, and the fixing mechanism comprises a pin fixing assembly and a board fixing assembly; the plate fixing assembly comprises a downward pressing piece and a downward pressing driving piece, the downward pressing piece is arranged on the bearing piece in an up-down moving mode, and the downward pressing driving piece can drive the downward pressing piece to move downwards; the pin fixing assembly comprises an extrusion air bag, the extrusion air bag is arranged above the wave-soldering mechanism, when the PCB is conveyed to the position above the wave-soldering mechanism, the extrusion air bag is located above the PCB, and the extrusion air bag can downwards extrude components inserted in the PCB. When the welding device for the PCB is used, components and the PCB are fixed through the pin fixing assembly and the board fixing assembly, the pins and the PCB can be prevented from moving when being impacted upwards by the wave crest of welding fluid, and poor welding is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board welding equipment, and specifically relates to a welding device for PCB boards. Background Art

[0002] The Chinese name of the PCB board is the printed circuit board, which is the support body of electronic components and the carrier for the electrical connection of electronic components. During the production process of the PCB board, it is necessary to weld the pins of the components inserted on the PCB board to the pads of the PCB board. In the prior art, wave soldering is usually used to weld the pins to the pads of the PCB board.

[0003] A Chinese patent with the authorization announcement number CN219852522U discloses a wave soldering machine, which includes a feeding mechanism, a flux spraying mechanism, a preheating mechanism, a welding mechanism, and a cooling mechanism. The feeding mechanism includes two conveyor belts for driving the circuit board to move. Fixed clamps are equidistantly arranged in an array on the outer side of the conveyor belt. A hook-shaped part is arranged at the bottom of the fixed clamp. The two ends of the circuit board are respectively placed on the hook-shaped parts on both sides. The fixed clamps on both sides work together, and the hook-shaped parts hold the two ends of the circuit board, and the conveyor belt drives the circuit board to move into the equipment. The flux spraying mechanism includes a spraying box and a movable cavity. The movable cavity is arranged on one side of the spraying box, and the top of the movable cavity is an open structure. A driving motor and a movable frame are arranged inside the spraying box, and a spray head is arranged inside the movable cavity. The welding mechanism includes a solder bath and a turbulence pump. Heaters are arranged around the outside of the solder bath. The turbulence pump is arranged inside the solder bath, and a turbulence spray head is arranged on the top of the solder bath. The preheating mechanism includes a horizontally arranged preheating plate, and the cooling mechanism includes a cooling fan.

[0004] When the above wave soldering machine is in use, the circuit board with the electronic components inserted is placed between the conveyor belts, and the hook-shaped parts at the ends of the fixed brackets hold the two ends of the circuit board. The conveyor belt drives the circuit board to move into the equipment. After the first infrared sensor detects the entry of the circuit board, each mechanism is started in sequence. The driving motor drives the movable frame to reciprocate. The spray head atomizes and sprays the flux mixed with high-pressure air. While moving with the movable frame, the flux is evenly sprayed on the bottom of the circuit board. After spraying, it is heated by the preheating plate and then enters the welding part. The turbulence pump pumps the pre-melted solder stored in the solder bath to the turbulence spray head for spraying, forming wave peaks and wave valleys arranged at intervals. When the circuit board moves above the turbulence spray head, it contacts the wave peaks of the solder for welding, and then the circuit board is cooled by the cooling fan.

[0005] The problems existing in the above wave soldering machine during use are as follows: The circuit board with electronic components inserted is placed on the hook-shaped part of the fixed clamp between the two conveyor belts. When the circuit board is conveyed past the turbulator nozzle of the soldering mechanism, the solder wave peak impacts the bottom of the circuit board upwards, and the solder wave peak contacts the pins of the electronic components and the circuit board to achieve soldering between the two. When the solder wave peak impacts the bottom of the circuit board upwards, it may cause the circuit board to move upwards, and it may also cause the pins to move upwards relative to the circuit board, thereby resulting in poor soldering. Summary of the Invention

[0006] The present invention provides a soldering device for a PCB board, aiming to solve the problem in the prior art that when the solder wave peak of the wave soldering machine impacts the bottom of the circuit board upwards during use, it may cause the circuit board to move upwards, and it may also cause the pins to move upwards relative to the circuit board, thereby resulting in poor soldering.

[0007] The soldering device for a PCB board of the present invention includes a conveying mechanism and a wave soldering mechanism. The conveying mechanism includes a conveying component and a carrier for carrying the PCB board. The conveying component can drive the carrier to move the PCB board. The wave soldering mechanism is arranged on the moving path of the PCB board, and the wave soldering mechanism can perform wave soldering on the passing PCB board. It further includes a fixing mechanism, and the fixing mechanism includes a pin fixing component and a board fixing component; the board fixing component includes a pressing member and a pressing driving member. The pressing member is arranged on the carrier to move up and down, and the pressing driving member can drive the pressing member to move downwards to press the PCB board tightly on the carrier; the pin fixing component includes an extrusion airbag, and the extrusion airbag is arranged above the wave soldering mechanism. When the PCB board is conveyed above the wave soldering mechanism, the extrusion airbag is located above the PCB board, and the extrusion airbag can extrude the components inserted on the PCB board downwards to press the components tightly on the PCB board.

[0008] The beneficial effects are as follows: When the soldering device for a PCB board of the present invention is in use, first place the PCB board with components inserted on the carrier. The conveying component drives the carrier to move the PCB board from back to front. During the conveying process of the PCB board, the pressing driving member of the board fixing component drives the pressing member to move downwards to press the PCB board tightly on the carrier. When the PCB board is conveyed above the wave soldering mechanism, the extrusion airbag extrudes the components inserted on the PCB board downwards to press the components tightly on the PCB board. When the soldering device for a PCB board of the present invention is in use, the components and the PCB board are fixed by the pin fixing component and the board fixing component, which can prevent the pins and the PCB board from moving when being impacted upwards by the solder wave peak, and prevent poor soldering from occurring.

[0009] Preferably, the conveying assembly includes a mounting frame, a first conveyor belt, a first driving wheel, a first driven wheel, a second conveyor belt, a second driving wheel, and a second driven wheel. The first driving wheel, the first driven wheel, the second driving wheel, and the second driven wheel are all rotatably arranged on the mounting frame with their rotation axes vertically disposed. The first conveyor belt is wound around the first driving wheel and the first driven wheel, and the second conveyor belt is wound around the second driving wheel and the second driven wheel. The first conveyor belt and the second conveyor belt are arranged in parallel at intervals on the same horizontal plane, and a conveying channel for the PCB board is formed between the first conveyor belt and the second conveyor belt. A plurality of the bearing members are provided on both the first conveyor belt and the second conveyor belt. The bearing members on the first conveyor belt are arranged at intervals along the length direction of the first conveyor belt, and the bearing members on the second conveyor belt are arranged at intervals along the length direction of the second conveyor belt. The bearing members on the first conveyor belt and the bearing members on the second conveyor belt correspond to each other in the direction perpendicular to the conveying direction.

[0010] Preferably, the board fixing assembly further includes a horizontal pressing member and a pressing driving member. The horizontal pressing member is movably arranged on the bearing member horizontally and perpendicular to the conveying direction. The pressing driving member can drive the horizontal pressing member to move horizontally and perpendicular to the conveying direction, and press the PCB board placed on the bearing member to clamp and fix the PCB board on the bearing member.

[0011] The beneficial effect is that the two sides of the PCB board are supported and placed on the bearing members of the first conveyor belt and the second conveyor belt, and then the pressing driving members on the bearing members of the first conveyor belt and the second conveyor belt drive the horizontal pressing members to approach each other, so as to clamp and fix the PCB board on the bearing member, further improving the fixing effect of the PCB board.

[0012] Preferably, the bearing member is an L-shaped plate structure. The upper end of the bearing member is fixedly arranged on the conveyor belt. A cross plate is also fixedly arranged on the bearing member, and a vertical plate is fixedly arranged at the bottom of the cross plate. A sliding hole is formed in the vertical plate. The horizontal pressing member includes a horizontal elastic telescopic rod, a horizontal elastic member, and a pressing plate. The horizontal elastic telescopic rod is slidably arranged in the sliding hole horizontally and perpendicular to the conveying direction. The pressing plate is fixedly arranged at the end of the horizontal elastic telescopic rod close to the bearing member. The two ends of the horizontal elastic member are respectively connected to the pressing plate and the vertical plate. The pressing plate is used to press the PCB board placed on the bearing member. A first avoidance hole for avoiding the pressing plate is formed in the bearing member. The pressing member includes a vertical elastic telescopic rod, a vertical elastic member, a pressing block, and a connecting rod. The connecting rod slides up and down on the pressing plate. The pressing block is fixedly arranged at the lower end of the connecting rod, and the pressing block is located on the side of the pressing plate away from the horizontal elastic member. The two ends of the vertical elastic member are respectively connected to the pressing plate and the connecting rod. The lower end of the vertical elastic telescopic rod is fixedly arranged on the connecting rod.

[0013] Preferably, the pressing driving member is in a strip plate structure. There are two pressing driving members which are respectively located below the first conveyor belt and the second conveyor belt. The pressing driving members are fixedly arranged on the mounting frame. The length direction of the pressing driving member is consistent with the length direction of the first conveyor belt. The pressing driving member has a horizontal extrusion portion protruding towards the middle position between the first conveyor belt and the second conveyor belt. The cross-section of the horizontal extrusion portion is trapezoidal. There are transition inclined surfaces at both ends of the horizontal extrusion portion in the length direction. When the bearing member moves through the transition inclined surface, the transition inclined surface can extrude the horizontal elastic telescopic rod to drive the pressing plate to move towards the middle position between the first conveyor belt and the second conveyor belt, so as to press the PCB board placed on the bearing member.

[0014] The beneficial effect is that: during the process that the conveying assembly drives the bearing member to move the PCB board from back to front, the bearing member will pass through the transition inclined surface. The transition inclined surface extrudes the horizontal elastic telescopic rod and drives the pressing plate to move towards the middle position between the first conveyor belt and the second conveyor belt. The pressing plates on both sides clamp and fix the PCB board on the bearing member. The setting of the pressing driving member can convert the conveying power of the conveying assembly into the power for driving the pressing plate to clamp the PCB board, so that there is no need to additionally set a separate power source, reducing the equipment cost.

[0015] Preferably, the downward pressing driving member is in a strip plate structure. There are two downward pressing driving members which are respectively located below the first conveyor belt and the second conveyor belt. The downward pressing driving members are fixedly arranged on the upper surface of the pressing driving member. The length direction of the downward pressing driving member is consistent with the length direction of the first conveyor belt. The downward pressing driving member has a vertical extrusion portion protruding downwards. The cross-section of the vertical extrusion portion is trapezoidal. There are downward pressing inclined surfaces at both ends of the vertical extrusion portion in the length direction. When the bearing member moves through the downward pressing inclined surface, the downward pressing inclined surface can extrude the vertical elastic telescopic rod to drive the downward pressing block to move downwards, so as to press the PCB board on the bearing member.

[0016] The beneficial effect is that: during the process that the conveying assembly drives the bearing member to move the PCB board from back to front, the bearing member will pass through the downward pressing inclined surface. The downward pressing inclined surface extrudes the vertical elastic telescopic rod and drives the downward pressing block to move downwards, so as to press the PCB board on the bearing member. The setting of the downward pressing driving member can convert the conveying power of the conveying assembly into the power for driving the downward pressing block to move downwards, so that there is no need to additionally set a separate power source, reducing the equipment cost.

[0017] Preferably, the pin fixing assembly further includes a rotation driving member for driving the extrusion airbag to rotate. The extrusion airbag is in a cylindrical structure with a hollow interior. The rotating shaft of the rotation driving member is coaxially fixedly connected to the extrusion airbag. The rotation axis of the extrusion airbag is perpendicular to the conveying direction.

[0018] The beneficial effects are as follows: When the PCB board is conveyed above the wave soldering mechanism, the extrusion airbag presses down on the components inserted on the PCB board, and the rotation driving member drives the extrusion airbag to rotate, so that the linear velocity of the rotation of the extrusion airbag is the same as the conveying speed of the PCB board, which can prevent the extrusion airbag from generating frictional resistance to the components.

[0019] Preferably, the pin fixing assembly further includes an air supply pipe and an air charging and discharging member for inflating or extracting the gas in the extrusion airbag. The air supply pipe is fixedly arranged on the mounting bracket. One end of the air supply pipe is communicated with the air charging and discharging member, and the other end is communicated with the inside of the extrusion airbag. The air supply pipe is coaxially arranged with the extrusion airbag, and the extrusion airbag is rotatably connected to the air supply pipe.

[0020] The beneficial effects are as follows: When the PCB board is conveyed above the wave of the soldering fluid, the air charging and discharging member can inflate the extrusion airbag, so that the extrusion airbag presses down on the components inserted on the PCB board and presses the components tightly on the PCB board. When the PCB board leaves above the wave of the soldering fluid, the air charging and discharging member extracts the gas in the extrusion airbag, so that the extrusion airbag shrinks and the extrusion airbag moves away from the wave of the soldering fluid.

[0021] Preferably, the wave soldering mechanism includes a solder tank, and a soldering fluid oxide layer scraping mechanism is arranged on the top of the solder tank. The soldering fluid oxide layer scraping mechanism includes a mounting plate, a scraping plate and a reset elastic member. The mounting plate is fixedly arranged on the solder tank. A horizontal chute and an inclined chute are formed on the mounting plate. The horizontal chute extends along the conveying direction, and the inclined chute is located at the front end of the horizontal chute. The inclined chute is inclined with the rear end higher than the front end, and the rear end of the inclined chute is communicated with the front end of the horizontal chute. The scraping plate is slidably arranged in the horizontal chute and the inclined chute. One end of the reset elastic member is fixed on the mounting plate, and the other end is fixed on the scraping plate. When the reset elastic member is in the natural state, the scraping plate is located in the horizontal chute and behind the wave of the soldering fluid generated by the wave soldering mechanism. When the PCB board is conveyed, it can push forward against the scraping plate. When the scraping plate passes through the wave of the soldering fluid, it can scrape off the oxide layer formed on the wave of the soldering fluid. When the scraping plate moves to the front end of the inclined chute, the scraping plate is located below the PCB board, and the PCB board no longer pushes against the scraping plate.

[0022] The beneficial effects are as follows: When the PCB board is conveyed, it can push forward against the scraping plate. When the scraping plate passes through the wave of the soldering fluid, it can scrape off the oxide layer formed on the wave of the soldering fluid, thereby preventing the oxide layer from affecting the welding quality.

[0023] Preferably, a proximity switch is further arranged on the mounting plate. When the PCB board is conveyed above the wave of the soldering fluid, the proximity switch emits an inflation signal, and the air charging and discharging member inflates the extrusion airbag; when the PCB board leaves above the wave of the soldering fluid, the proximity switch emits an air extraction signal, and the air charging and discharging member extracts the gas in the extrusion airbag.

[0024] The beneficial effects of the present invention are as follows: When the soldering device for PCB boards of the present invention is in use, the component pins and the PCB board are fixed by the pin fixing component and the board fixing component, which can prevent the pins and the PCB board from moving when subjected to the upward impact of the solder wave peak, and prevent poor soldering. In addition, when the PCB board is conveyed above the wave soldering mechanism, the extrusion airbag presses down on the components inserted on the PCB board, and the rotation driving member drives the extrusion airbag to rotate, so that the linear velocity of the rotation of the extrusion airbag is the same as the conveying speed of the PCB board, which can prevent the extrusion airbag from generating frictional resistance to the components. When the PCB board is conveyed, it can move forward against the scraper, and when the scraper passes through the solder wave peak, it can scrape off the oxide layer formed on the solder wave peak, thereby preventing the oxide layer from affecting the soldering quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic three-dimensional structure diagram when the soldering device for PCB boards of the present invention is in use.

[0026] Figure 2 is a schematic three-dimensional structure diagram of the carrier and the fixing mechanism of the soldering device for PCB boards of the present invention.

[0027] Figure 3 is Figure 2 the front view of the structure in

[0028] Figure 4 is Figure 2 the right view of the structure in

[0029] Figure 5 is Figure 4 the sectional view taken along the line A-A of the structure in

[0030] Figure 6 is Figure 5 the enlarged view of the structure at B in

[0031] Figure 7 is a schematic three-dimensional structure diagram of the carrier of the soldering device for PCB boards of the present invention.

[0032] Figure 8 is Figure 7 the right view of the structure in

[0033] Figure 9 is Figure 7 the front view of the structure in

[0034] Figure 10 is a schematic three-dimensional structure diagram of the fixing mechanism of the soldering device for PCB boards of the present invention.

[0035] Figure 11 is Figure 10 the top view of the structure in

[0036] Figure 12Yes Figure 10 Front view of the middle structure.

[0037] Figure 13 Schematic three-dimensional structure diagram of the downward pressing driving part and the top pressing driving part of the soldering device for the PCB board of the present invention.

[0038] Figure 14 Schematic partial three-dimensional structure diagram showing the carrier on the first conveyor belt moving to the transition slope.

[0039] Figure 15 Yes Figure 14 Top view of the middle structure.

[0040] Figure 16 Yes Figure 15 Enlarged view of the structure at C in [Figure number].

[0041] Figure 17 Yes Figure 14 Front view of the middle structure.

[0042] Figure 18 Yes Figure 17 Enlarged view of the structure at D in [Figure number].

[0043] Figure 19 Schematic three-dimensional structure diagram of the wave soldering mechanism and the solder oxide layer scraping mechanism of the soldering device for the PCB board of the present invention.

[0044] Figure 20 Yes Figure 19 Exploded view of the middle structure.

[0045] Reference numerals: 11. Mounting bracket; 12. First conveyor belt; 13. First driving wheel; 14. First driven wheel; 15. Second conveyor belt; 16. Second driving wheel; 17. Second driven wheel; 18. Carrier; 181. First avoidance hole; 19. U-shaped fixing plate; 191. Horizontal plate; 192. Vertical plate; 193. Second avoidance hole; 194. Sliding groove; 195. Sliding seat; 2. Flux spraying mechanism; 3. Preheating mechanism; 4. Wave soldering mechanism; 41. Solder box; 5. Cooling mechanism; 6. Pin fixing assembly; 61. Extrusion airbag; 62. Rotating driving member; 63. Air supply pipe; 711. Vertical elastic telescopic rod; 7111. First vertical rod; 7112. Second vertical rod; 7113. Vertical spring; 712. Vertical elastic member; 713. Pressing block; 714. Connecting rod; 72. Pressing driving member; 721. Vertical pressing part; 722. Pressing inclined surface; 731. Horizontal elastic telescopic rod; 7311. First horizontal rod; 7312. Second horizontal rod; 7313. Horizontal spring; 732. Horizontal elastic member; 733. Top pressing plate; 7331. Vertical sliding hole; 734. Support plate; 74. Top pressing driving member; 741. Axial hole; 742. Horizontal pressing part; 743. Transition inclined surface; 75. Fixed column; 81. Mounting plate; 811. Guide sliding groove; 8111. Horizontal sliding groove; 8112. Inclined groove; 82. Scraper; 83. Reset elastic member; 84. Sliding plate; 85. Support rod; 86. Stop rod; 87. Fixed rod; 88. Roller; 89. Sliding column; 9. PCB board. Detailed implementation manners

[0046] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

[0047] As Figures 1 - 20 shown, the soldering device for PCB board of the present invention includes a conveying mechanism, a flux spraying mechanism 2, a preheating mechanism 3, a wave soldering mechanism 4, a cooling mechanism 5, a fixing mechanism and a solder oxide layer scraping mechanism. The conveying mechanism includes a conveying assembly and a carrier 18 for carrying the PCB board 9. The conveying assembly can drive the carrier 18 to move the PCB board 9. The flux spraying mechanism 2, the preheating mechanism 3, the wave soldering mechanism 4 and the cooling mechanism 5 are arranged in sequence from the back to the front on the moving path of the PCB board 9. The flux spraying mechanism 2 can spray flux on the passing PCB board 9. The preheating mechanism 3 is used to preheat the passing PCB board 9 for easy soldering. The wave soldering mechanism 4 can generate a solder wave peak to perform wave soldering on the passing PCB board 9. The cooling mechanism 5 can quickly cool the soldered PCB board 9. The flux spraying mechanism 2, the preheating mechanism 3, the wave soldering mechanism 4 and the cooling mechanism 5 are all prior arts, so their structures and working principles will not be described in detail.

[0048] As Figure 1 shown, the conveying assembly includes a mounting frame 11, a first conveyor belt 12, a first driving wheel 13, a first driven wheel 14, a first motor (not shown in the figure), a second conveyor belt 15, a second driving wheel 16, a second driven wheel 17 and a second motor (not shown in the figure). The output shaft of the first motor is coaxially and fixedly connected to the first driving wheel 13, and the output shaft of the second motor is coaxially and fixedly connected to the second driving wheel 16. The first driving wheel 13, the first driven wheel 14, the second driving wheel 16 and the second driven wheel 17 are all rotatably arranged on the mounting frame 11 through rotating shafts. The rotation axes of the first driving wheel 13, the first driven wheel 14, the second driving wheel 16 and the second driven wheel 17 are vertically arranged. The first conveyor belt 12 is wound around the first driving wheel 13 and the first driven wheel 14, and the second conveyor belt 15 is wound around the second driving wheel 16 and the second driven wheel 17. The first conveyor belt 12 and the second conveyor belt 15 are arranged in parallel and spaced apart on the same horizontal plane, and a conveying channel for the PCB board 9 is formed between the first conveyor belt 12 and the second conveyor belt 15. A plurality of bearing members 18 are provided on both the first conveyor belt 12 and the second conveyor belt 15. The bearing members 18 on the first conveyor belt 12 are evenly spaced along the length direction of the first conveyor belt 12, and the bearing members 18 on the second conveyor belt 15 are evenly spaced along the length direction of the second conveyor belt 15. The bearing members 18 on the first conveyor belt 12 and the bearing members 18 on the second conveyor belt 15 are symmetrically arranged in the direction perpendicular to the conveying direction.

[0049] As Figure 2 、 Figures 7 - 9 shown, the bearing member 18 is an L-shaped plate structure. The upper end of the bearing member 18 is fixedly arranged on the conveyor belt. Specifically, a U-shaped fixing plate 19 is fixedly arranged at the upper end of the bearing member 18, and the U-shaped fixing plate 19 is fixed on the conveyor belt. A first avoidance hole 181 is formed in the bearing member 18. A cross plate 191 is also fixedly arranged on the bearing member 18. A vertical plate 192 is fixedly arranged at the bottom of the cross plate 191. A sliding hole extending horizontally and perpendicular to the conveying direction is formed in the vertical plate 192. A second avoidance hole 193 extending horizontally and perpendicular to the conveying direction is formed in the cross plate 191. Two sliding grooves 194 extending horizontally and perpendicular to the conveying direction are also formed on the upper surface of the cross plate 191, and the two sliding grooves 194 are respectively located on both sides of the second avoidance hole 193. A sliding seat 195 is slidably arranged on the cross plate 191 in the direction horizontally and perpendicular to the conveying direction. The bottom of the sliding seat 195 is slidably arranged in the two sliding grooves 194, and a through hole penetrating up and down is formed on the upper surface of the sliding seat 195.

[0050] As Figures 1 - 6As shown, the fixing mechanism can fix the PCB board 9 on the carrier 18, and can also fix the components inserted on the PCB board 9 on the PCB board 9, thereby preventing the pins of the PCB board 9 and the components from moving. The fixing mechanism includes a pin fixing component 6 and a board fixing component. The board fixing component includes a pressing member, a pressing driving member 72, a horizontal pressing member and a pressing driving member 74. The pressing member is arranged on the carrier 18 to move up and down, and the pressing driving member 72 can drive the pressing member to move downward to press the PCB board 9 tightly on the carrier 18. The horizontal pressing member is arranged on the carrier 18 to move horizontally and perpendicular to the conveying direction, and the pressing driving member 74 can drive the horizontal pressing member to move horizontally and perpendicular to the conveying direction, and press the PCB board 9 placed on the carrier 18 to clamp and fix the PCB board 9 on the carrier 18.

[0051] As Figures 2 - 12 shown, the horizontal pressing member includes a horizontal elastic telescopic rod 731, a horizontal elastic member 732 and a pressing plate 733. The horizontal elastic telescopic rod 731 includes a first horizontal rod 7311, a second horizontal rod 7312 and a horizontal spring 7313. The elastic coefficient of the horizontal spring 7313 is greater than that of the horizontal elastic member 732. One end of the first horizontal rod 7311 is slidably inserted into the second horizontal rod 7312, the horizontal spring 7313 is sleeved on the first horizontal rod 7311, one end of the horizontal spring 7313 is fixed to the first horizontal rod 7311, and the other end is fixed to the second horizontal rod 7312. The second horizontal rod 7312 is arranged to slide horizontally and perpendicular to the conveying direction in a sliding hole, and the pressing plate 733 is fixedly arranged at one end of the second horizontal rod 7312 close to the carrier 18. The horizontal elastic member 732 is a spring, the horizontal elastic member 732 is sleeved on the second horizontal rod 7312, and both ends of the horizontal elastic member 732 are fixedly connected to the pressing plate 733 and the vertical plate 192 respectively. When the first horizontal rod 7311 is squeezed, it can drive the horizontal spring 7313, the second horizontal rod 7312 and the pressing plate 733 to move towards the PCB board 9 on the carrier 18, and the pressing plate 733 is used to press the PCB board 9 placed on the carrier 18.

[0052] As Figures 2 - 12As shown in the figure, the pressing member includes a vertical elastic telescopic rod 711, a vertical elastic member 712, a pressing block 713 and a connecting rod 714. The vertical elastic telescopic rod 711 includes a first vertical rod 7111, a second vertical rod 7112 and a vertical spring 7113. The elastic coefficient of the vertical spring 7113 is greater than that of the vertical elastic member 712. One end of the first vertical rod 7111 is slidably inserted into the second vertical rod 7112, the vertical spring 7113 is sleeved on the first vertical rod 7111, one end of the vertical spring 7113 is fixed to the first vertical rod 7111, and the other end is fixed to the second vertical rod 7112. The second vertical rod 7112 is slidably inserted up and down into the through hole of the sliding seat 195, and the lower end of the second vertical rod 7112 is fixed to the connecting rod 714. A vertically extending vertical sliding hole 7331 is formed in the top pressing plate 733. The connecting rod 714 is an L-shaped rod, and the connecting rod 714 is slidably arranged up and down in the vertical sliding hole 7331 of the top pressing plate 733. The pressing block 713 is fixed to the lower end of the connecting rod 714, and the pressing block 713 is located on the side of the top pressing plate 733 away from the horizontal elastic member 732. A support plate 734 is also fixedly arranged on the top pressing plate 733. The vertical elastic member 712 is a spring, and both ends of the vertical elastic member 712 are fixedly connected to the support plate 734 and the connecting rod 714 respectively. When the first vertical rod 7111 is squeezed downward, it can drive the vertical spring 7113, the second vertical rod 7112, the connecting rod 714 and the pressing block 713 to move downward, and press and fix the PCB board 9 on the carrier 18.

[0053] As Figure 1 , Figures 13 - 18 shown in the figure, the top pressing driving member 74 is a strip-shaped plate structure. There are two top pressing driving members 74, which are respectively located below the first conveyor belt 12 and the second conveyor belt 15. The length direction of the top pressing driving member 74 is the same as the length direction of the first conveyor belt 12, and the two top pressing driving members 74 are symmetrically arranged in the direction perpendicular to the conveying direction. Fixed columns 75 are fixedly arranged at both ends of the top pressing driving member 74, and the lower ends of the fixed columns 75 are fixed on the mounting frame 11. Axial holes 741 are also formed at both ends of the top pressing driving member 74. The first driving wheel 13, the first driven wheel 14, the second driving wheel 16 and the second driven wheel 17 are respectively rotatably arranged in the four axial holes 741 of the two top pressing driving members 74 through rotating shafts. The top pressing driving member 74 has a horizontal pressing portion 742 protruding toward the middle position between the first conveyor belt 12 and the second conveyor belt 15. The cross section of the horizontal pressing portion 742 is trapezoidal, and transition inclined surfaces 743 are provided at both ends in the length direction of the horizontal pressing portion 742. When the carrier 18 moves past the transition inclined surface 743, the transition inclined surface 743 can squeeze the first horizontal rod 7311 to drive the top pressing plate 733 to move toward the middle position between the first conveyor belt 12 and the second conveyor belt 15, so as to top press the PCB board 9 placed on the carrier 18. The top pressing plates 733 on the first conveyor belt 12 and the second conveyor belt 15 approach each other to clamp and fix the PCB board 9 on the carrier 18.

[0054] As Figure 1 、 Figures 13 - 18 shown, the downward pressing driving member 72 is in a strip plate-like structure. There are two downward pressing driving members 72, which are respectively located below the first conveyor belt 12 and the second conveyor belt 15. The downward pressing driving member 72 is fixedly arranged on the upper surface of the top pressing driving member 74. The length direction of the downward pressing driving member 72 is the same as the length direction of the first conveyor belt 12. The two downward pressing driving members 72 are symmetrically arranged in the direction perpendicular to the conveying direction. The downward pressing driving member 72 has a vertical extrusion portion 721 protruding downward. The cross-section of the vertical extrusion portion 721 is trapezoidal. Both ends of the vertical extrusion portion 721 in the length direction have downward pressing inclined surfaces 722. When the bearing member 18 moves past the downward pressing inclined surface 722, the downward pressing inclined surface 722 can downwardly extrude the first vertical rod 7111 to drive the downward pressing block 713 to move downward, so as to press the PCB board 9 tightly on the bearing member 18.

[0055] As Figure 1 shown, the pin fixing assembly 6 includes an extrusion airbag 61, a rotation driving member 62, an air supply pipe 63 and an air charging and discharging member (not shown in the figure). The extrusion airbag 61 is arranged above the wave soldering mechanism 4. The extrusion airbag 61 is in a cylindrical structure with a hollow interior. The rotation driving member 62 is used to drive the extrusion airbag 61 to rotate. The rotation driving member 62 is fixedly arranged on the mounting bracket 11. The rotation driving member 62 is a motor. The rotating shaft of the rotation driving member 62 is coaxially and fixedly connected to the extrusion airbag 61. The rotation axis of the extrusion airbag 61 is perpendicular to the conveying direction. The air supply pipe 63 is fixedly arranged on the mounting bracket 11. One end of the air supply pipe 63 is communicated with the air charging and discharging member, and the other end is communicated with the interior of the extrusion airbag 61. The air supply pipe 63 is coaxially arranged with the extrusion airbag 61. The extrusion airbag 61 is rotatably connected to the air supply pipe 63. The air charging and discharging member is used to inflate the extrusion airbag 61 or extract the gas in the extrusion airbag 61. When the PCB board 9 is conveyed above the wave soldering mechanism 4, the extrusion airbag 61 is located above the PCB board 9, and the inflated extrusion airbag 61 can downwardly extrude the components inserted on the PCB board 9 to press the components tightly on the PCB board 9.

[0056] As Figure 19 and Figure 20As shown, the wave soldering mechanism 4 includes a solder tank 41, and a solder liquid oxide layer scraping mechanism is arranged on the top of the solder tank 41. The solder liquid oxide layer scraping mechanism includes a mounting plate 81, a scraping plate 82, a reset elastic member 83, a sliding plate 84, a support rod 85, a stop rod 86 and a fixed rod 87. Two mounting plates 81 are arranged in parallel at intervals, and the two mounting plates 81 are symmetrically and fixedly arranged on the top of the two side walls of the solder tank 41 respectively. Two guiding sliding grooves 811 are arranged at intervals in the front-back direction along the conveying direction on the mounting plate 81. The guiding sliding groove 811 includes a horizontal sliding groove 8111 and an inclined groove 8112. The horizontal sliding groove 8111 extends along the conveying direction. The inclined groove 8112 is located at the front end of the horizontal sliding groove 8111. The inclined groove 8112 is inclined with the rear end higher than the front end. The rear end of the inclined groove 8112 is communicated with the front end of the horizontal sliding groove 8111.

[0057] As Figure 19 and Figure 20 shown, two sliding plates 84 are arranged in parallel at intervals. The two ends of the scraping plate 82 are respectively fixedly connected to the two sliding plates 84. The length direction of the scraping plate 82 is horizontally arranged and perpendicular to the conveying direction. The two ends of the support rod 85 are respectively fixedly connected to the two sliding plates 84. The support rod 85 is arranged in parallel with the scraping plate 82. Two stop rods 86 are arranged at intervals along the length direction of the support rod 85, and the two stop rods 86 protrude upwards. Two fixed rods 87 are arranged at intervals along the length direction of the scraping plate 82, and the two fixed rods 87 protrude upwards. Rollers 88 are rotatably arranged at the upper ends of the stop rod 86 and the fixed rod 87. The rotation axis of the roller 88 is horizontally arranged and perpendicular to the conveying direction. The rollers 88 arranged on the stop rod 86 and the fixed rod 87 are on the same horizontal plane. Sliding columns 89 are respectively fixedly arranged at the front and rear ends of the sliding plate 84. The sliding columns 89 are located on the opposite sides of the two sliding plates 84. The sliding columns 89 are cylindrical structures. The two sliding plates 84 are respectively slidably arranged in the guiding sliding grooves 811 of the two mounting plates 81 through the sliding columns 89. The sliding column 89 at the rear end of the sliding plate 84 is slidably arranged in the guiding sliding groove 811 at the rear of the mounting plate 81, and the sliding column 89 at the front end of the sliding plate 84 is slidably arranged in the guiding sliding groove 811 at the front of the mounting plate 81.

[0058] As Figure 19 and Figure 20As shown, the reset elastic member 83 is a spring. One end of the reset elastic member 83 is fixed on the mounting plate 81, and the other end is fixed on the front end of the sliding plate 84. When the reset elastic member 83 is in the natural state, the sliding column 89 is located in the horizontal chute 8111, and the scraper 82 is located behind the solder wave generated by the wave soldering mechanism 4. When the PCB board 9 is conveyed from the back to the front, it can push the stop lever 86 forward to move, thereby driving the scraper 82 forward. When the scraper 82 passes through the solder wave, it can scrape off the oxide layer formed on the solder wave. When the sliding column 89 moves to the front end of the inclined chute 8112, the scraper 82, the sliding plate 84, the support rod 85, the stop lever 86 and the roller 88 synchronously move downward along the inclined chute 8112, so that the roller 88 is located below the PCB board 9 and abuts against the bottom wall of the PCB board 9, and the PCB board 9 no longer pushes the scraper 82 forward.

[0059] A proximity switch (not shown in the figure) is also provided on the mounting plate 81. When the PCB board 9 is conveyed above the solder wave, the proximity switch emits an inflation signal, and the inflation and deflation member inflates the extrusion airbag 61. When the PCB board 9 leaves above the solder wave, the proximity switch emits an air extraction signal, and the inflation and deflation member extracts the gas in the extrusion airbag 61, so that the extrusion airbag 61 shrinks, and the extrusion airbag 61 moves away from the solder wave.

[0060] The implementation principle of the soldering device for PCB boards according to the embodiments of the present invention is as follows: When in use, first place the two sides of the PCB board 9 with components inserted thereon on the carriers 18 of the first conveyor belt 12 and the second conveyor belt 15, and then the first motor and the second motor synchronously drive the first conveyor belt 12 and the second conveyor belt 15 to convey the PCB board 9 from the back to the front. When the carrier 18 passes through the transition inclined surface 743, the transition inclined surface 743 can squeeze the first horizontal rod 7311 to drive the top pressing plate 733 to move towards the middle position between the first conveyor belt 12 and the second conveyor belt 15, thereby pressing the PCB board 9 placed on the carrier 18. The top pressing plates 733 on the first conveyor belt 12 and the second conveyor belt 15 approach each other to clamp and fix the PCB board 9 on the carrier 18. When the carrier 18 moves past the downward pressing inclined surface 722, the downward pressing inclined surface 722 can downwardly squeeze the first vertical rod 7111 to drive the downward pressing block 713 to move downward, thereby pressing the PCB board 9 tightly on the carrier 18. The PCB board 9 continues to be conveyed from the back to the front. The PCB board 9 will push forward against the stop rod 86, thereby driving the scraper 82 to move forward. When the scraper 82 passes through the solder wave peak, the oxide layer formed on the solder wave peak is scraped off. Continuing to convey, when the PCB board 9 is conveyed above the wave soldering mechanism 4, the proximity switch emits an inflation signal, and the air charging and discharging member inflates the extrusion airbag 61. The extrusion airbag 61 downwardly squeezes the components inserted on the PCB board 9 to press the components tightly on the PCB board 9, and the solder wave peak performs wave soldering on the PCB board 9. Continuing to convey, when the PCB board 9 leaves above the solder wave peak, the proximity switch emits an air extraction signal, and the air charging and discharging member extracts the gas in the extrusion airbag 61, so that the extrusion airbag 61 shrinks, and the extrusion airbag 61 moves away from the solder wave peak. When the sliding column 89 moves to the front end of the inclined groove 8112, the scraper 82, the sliding plate 84, the support rod 85, the stop rod 86, and the roller 88 synchronously move downward along the inclined groove 8112, so that the roller 88 is located below the PCB board 9 and abuts against the bottom wall of the PCB board 9, and the PCB board 9 no longer pushes the scraper 82 forward. When the PCB board 9 is no longer above the roller 88, the reset elastic member 83 drives the scraper 82 to reset.

[0061] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A soldering device for a PCB board, comprising a conveying mechanism and a wave soldering mechanism. The conveying mechanism includes a conveying component and a carrier for carrying the PCB board. The conveying component can drive the carrier to move the PCB board. The wave soldering mechanism is arranged on the moving path of the PCB board, and the wave soldering mechanism can perform wave soldering on the passing PCB board, characterized in that, It further includes a fixing mechanism, which includes a pin fixing component and a board fixing component; the board fixing component includes a pressing member and a pressing driving member, the pressing member is arranged on the carrier to move up and down, and the pressing driving member can drive the pressing member to move downward to press the PCB board onto the carrier; the pin fixing component includes an extrusion airbag, the extrusion airbag is arranged above the wave soldering mechanism, when the PCB board is conveyed above the wave soldering mechanism, the extrusion airbag is located above the PCB board, and the extrusion airbag can extrude downward the components inserted on the PCB board to press the components onto the PCB board.

2. The soldering device for PCB boards according to claim 1, characterized in that, The conveying component includes a mounting frame, a first conveyor belt, a first driving wheel, a first driven wheel, a second conveyor belt, a second driving wheel and a second driven wheel. The first driving wheel, the first driven wheel, the second driving wheel and the second driven wheel are all rotatably arranged on the mounting frame and their rotation axes are vertically arranged. The first conveyor belt is wound around the first driving wheel and the first driven wheel, the second conveyor belt is wound around the second driving wheel and the second driven wheel. The first conveyor belt and the second conveyor belt are arranged in parallel at intervals on the same horizontal plane, and a conveying channel for the PCB board is formed between the first conveyor belt and the second conveyor belt; a plurality of the carriers are arranged on both the first conveyor belt and the second conveyor belt. The carriers on the first conveyor belt are arranged at intervals along the length direction of the first conveyor belt, the carriers on the second conveyor belt are arranged at intervals along the length direction of the second conveyor belt, and the carriers on the first conveyor belt and the carriers on the second conveyor belt correspond to each other one by one in the direction perpendicular to the conveying direction.

3. The soldering device for PCB boards according to claim 2, characterized in that, The board fixing component further includes a horizontal pressing member and a pressing driving member. The horizontal pressing member is arranged on the carrier to move horizontally and perpendicular to the conveying direction, and the pressing driving member can drive the horizontal pressing member to move horizontally and perpendicular to the conveying direction and press the PCB board placed on the carrier to clamp and fix the PCB board on the carrier.

4. The soldering device for PCB boards according to claim 3, characterized in that, The carrier is an L-shaped plate structure. The upper end of the carrier is fixedly arranged on the conveyor belt. A cross plate is also fixedly arranged on the carrier, and a vertical plate is fixedly arranged at the bottom of the cross plate. A sliding hole is opened on the vertical plate; the horizontal pressing member includes a horizontal elastic telescopic rod, a horizontal elastic member and a pressing plate. The horizontal elastic telescopic rod is slidably arranged in the sliding hole horizontally and perpendicular to the conveying direction. The pressing plate is fixedly arranged at one end of the horizontal elastic telescopic rod close to the carrier. The two ends of the horizontal elastic member are respectively connected to the pressing plate and the vertical plate. The pressing plate is used to press the PCB board placed on the carrier; a first avoidance hole for avoiding the pressing plate is opened on the carrier; the pressing member includes a vertical elastic telescopic rod, a vertical elastic member, a pressing block and a connecting rod. The connecting rod slides up and down on the pressing plate. The pressing block is fixedly arranged at the lower end of the connecting rod, and the pressing block is located on the side of the pressing plate away from the horizontal elastic member. The two ends of the vertical elastic member are respectively connected to the pressing plate and the connecting rod. The lower end of the vertical elastic telescopic rod is fixedly arranged on the connecting rod.

5. The soldering device for PCB boards according to claim 4, characterized in that, The top pressure driving member is in a strip plate-like structure. There are two top pressure driving members, which are respectively located below the first conveyor belt and the second conveyor belt. The top pressure driving member is fixedly arranged on the mounting frame. The length direction of the top pressure driving member is consistent with the length direction of the first conveyor belt. The top pressure driving member has a horizontal extrusion portion protruding towards the middle position between the first conveyor belt and the second conveyor belt. The cross-section of the horizontal extrusion portion is trapezoidal. There are transition inclined surfaces at both ends in the length direction of the horizontal extrusion portion. When the carrier moves through the transition inclined surface, the transition inclined surface can extrude the horizontal elastic telescopic rod to drive the top pressing plate to move towards the middle position between the first conveyor belt and the second conveyor belt, so as to top press the PCB board placed on the carrier.

6. The soldering device for PCB boards according to claim 5, characterized in that, The downward pressure driving member is in a strip plate-like structure. There are two downward pressure driving members, which are respectively located below the first conveyor belt and the second conveyor belt. The downward pressure driving member is fixedly arranged on the upper surface of the top pressure driving member. The length direction of the downward pressure driving member is consistent with the length direction of the first conveyor belt. The downward pressure driving member has a vertical extrusion portion protruding downward. The cross-section of the vertical extrusion portion is trapezoidal. There are downward pressure inclined surfaces at both ends in the length direction of the vertical extrusion portion. When the carrier moves through the downward pressure inclined surface, the downward pressure inclined surface can extrude the vertical elastic telescopic rod to drive the downward pressing block to move downward, so as to press the PCB board tightly on the carrier.

7. The soldering device for PCB boards according to any one of claims 1-6, characterized in that, The pin fixing assembly further includes a rotation driving member for driving the extrusion airbag to rotate. The extrusion airbag is in a cylindrical structure with a hollow interior. The rotating shaft of the rotation driving member is coaxially fixedly connected with the extrusion airbag. The rotation axis of the extrusion airbag is perpendicular to the conveying direction.

8. The soldering device for PCB boards according to claim 7, characterized in that, The pin fixing assembly further includes an air supply pipe and an air charging and discharging member for charging air into the extrusion airbag or extracting the gas in the extrusion airbag. The air supply pipe is fixedly arranged on the mounting frame. One end of the air supply pipe is communicated with the air charging and discharging member, and the other end is communicated with the interior of the extrusion airbag. The air supply pipe is coaxially arranged with the extrusion airbag. The extrusion airbag is rotatably connected to the air supply pipe.

9. The soldering device for PCB boards according to claim 8, characterized in that, The wave soldering mechanism includes a solder tank. A solder liquid oxide layer scraping mechanism is arranged on the top of the solder tank. The solder liquid oxide layer scraping mechanism includes a mounting plate, a scraping plate and a reset elastic member. The mounting plate is fixedly arranged on the solder tank. A horizontal sliding groove and an inclined groove are formed on the mounting plate. The horizontal sliding groove extends along the conveying direction. The inclined groove is located at the front end of the horizontal sliding groove. The inclined groove is inclined with the rear end higher than the front end. The rear end of the inclined groove is communicated with the front end of the horizontal sliding groove. The scraping plate is slidably arranged in the horizontal sliding groove and the inclined groove. One end of the reset elastic member is fixed on the mounting plate, and the other end is fixed on the scraping plate. When the reset elastic member is in a natural state, the scraping plate is located in the horizontal sliding groove and is behind the solder liquid wave peak generated by the wave soldering mechanism. When the PCB board is conveyed, it can push against the scraping plate and move forward. When the scraping plate passes through the solder liquid wave peak, it can scrape off the oxide layer formed on the solder liquid wave peak. When the scraping plate moves to the front end of the inclined groove, the scraping plate is located below the PCB board, and the PCB board no longer pushes against the scraping plate to move.

10. The soldering device for PCB boards according to claim 9, characterized in that, A proximity switch is further arranged on the mounting plate. When the PCB board is conveyed above the solder liquid wave peak, the proximity switch emits an air charging signal, and the air charging and discharging member charges air into the extrusion airbag; when the PCB board leaves above the solder liquid wave peak, the proximity switch emits an air extraction signal, and the air charging and discharging member extracts the gas in the extrusion airbag.

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