A method and related equipment for line scanning and marking on IC carrier boards

Abstract

This application relates to the field of semiconductor manufacturing technology, and in particular to a method and related equipment for line scanning marking of IC carrier boards. The method includes: if the motherboard does not meet preset inspection requirements, performing defect inspection on the IC carrier board based on initial inspection points and a first inspection rule; if a defective IC carrier board is detected, acquiring target coordinates and marking the defective IC carrier board based on the target coordinates; if marking is completed, continuing defect inspection on the remaining IC carrier boards based on the first inspection rule; if the motherboard meets the preset inspection requirements, performing defect inspection on all IC carrier boards one by one based on a second inspection rule; if a defective IC carrier board is detected, acquiring and saving the target coordinates; if all IC carrier boards have been inspected, sending all target coordinates to a marking laser head; and controlling the marking laser head to mark the defective IC carrier board based on all target coordinates. This application helps improve the efficiency of line scanning inspection of motherboards.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a method and related equipment for line scanning and marking on IC substrates. Background Technology

[0002] In the semiconductor packaging field, IC substrates serve as a crucial carrier connecting chips and printed circuit boards, and their quality directly impacts the performance and reliability of electronic products. Therefore, the manufacturing process of IC substrates requires defect detection. Defective IC substrates are then locally irradiated with high-energy-density lasers, causing the surface material to vaporize or undergo a color-changing chemical reaction, leaving a permanent mark for subsequent screening and processing. Currently, as semiconductor manufacturing technology advances towards higher precision and miniaturization, defect detection and marking of IC substrates face numerous challenges.

[0003] Currently, the mainstream IC substrate testing methods in the industry still generally adopt fixed testing procedures, which lack the ability to adapt to differences in substrate quality. They cannot better select more suitable testing methods according to the actual situation of different IC substrates, which can easily lead to problems such as low testing efficiency or insufficient testing accuracy. Summary of the Invention

[0004] To improve the adaptability of the detection method to the quality differences of IC carrier boards, and to select a more suitable detection method for line scanning detection of IC carrier boards, thereby improving detection efficiency, this application provides a line scanning marking method and related equipment for IC carrier boards.

[0005] Firstly, this application provides a method for line scanning and marking on an IC carrier board, which adopts the following technical solution: A method for line scanning and marking on an IC carrier board includes: Determine whether the motherboard meets the preset testing requirements; If the motherboard does not meet the preset detection requirements, then the IC carrier board is subjected to defect detection based on the initial detection points and the first detection rule; If a defective IC carrier board is detected, the target coordinates of the defective IC carrier board on the motherboard are obtained; The target coordinates are sent to the marking laser head, and the defective IC carrier board is marked based on the target coordinates; If marking is completed, then based on the first detection rule, continue to perform defect detection on the remaining IC carrier boards; If the motherboard meets the preset testing requirements, then based on the second testing rule, defect testing is performed on all the IC carrier boards one by one; If a defective IC carrier board is detected, the target coordinates of the defective IC carrier board on the motherboard are obtained and saved. Determine whether all IC carrier boards have been tested; If all the IC carrier boards have been inspected, then all the target coordinates are sent to the marking laser head; Based on all the target coordinates, the marking laser head is controlled to mark the defective IC carrier board.

[0006] By adopting the above technical solution, when the motherboard does not meet the preset detection requirements, defect detection is performed on the IC carrier board according to the first detection rule. That is, whenever a defective IC carrier board is detected, the target coordinates of the defective IC carrier board are obtained, and the defective IC carrier board is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier board is continued. When the motherboard meets the preset detection requirements, defect detection is performed on all IC carrier boards one by one according to the second detection rule. When a defective IC carrier board is detected, the target coordinates are sent to the marking laser head. Only after all IC carrier boards on the motherboard have been detected is the defective IC carrier board marked.

[0007] By classifying motherboards according to preset testing requirements, the testing strategy can be dynamically switched according to the actual situation of the IC carrier board. This helps to improve the adaptability of IC carrier board quality differences, and thus helps to improve testing efficiency while maintaining high testing accuracy.

[0008] Optionally, determining whether the motherboard meets the preset detection requirements includes: Obtain batch information for the target IC carrier board; Based on the batch information, determine whether the target IC carrier board is a new batch carrier board; If the target IC carrier is not a carrier in the new batch, then the average number of defects per motherboard corresponding to the IC carrier in the current batch is obtained based on the batch information. If the average number of defects exceeds the first quantity threshold, then the motherboard is determined to meet the preset detection requirements; If the average number of defects does not exceed the first quantity threshold, then the motherboard is determined not to meet the preset detection requirements.

[0009] Optionally, after determining whether the target IC carrier board is from a new batch based on the batch information, the method further includes: Obtain the first rated number of IC carrier boards corresponding to a single motherboard; Based on the batch information, obtain the number of motherboards in the current batch; Based on the first rated quantity and the current batch motherboard quantity, the target quantity of the IC carrier board is obtained; Obtain the total number of defects and determine whether the total number of defects is equal to the target number; If the total number of defects equals the target number, then the number of defects detected on the motherboard is obtained; If the number of detected samples is less than the second quantity threshold, then the motherboard is determined to meet the preset detection requirements.

[0010] Optionally, controlling the marking laser head to mark the defective IC carrier based on all the target coordinates includes: Based on all the target coordinates, obtain the possible movement paths; Based on the available movement paths, obtain the target movement path; Based on the target movement path, the marking laser head is controlled to mark the defective IC carrier board.

[0011] Optionally, obtaining the target movement path based on the optional movement path includes: Obtain the distribution heat map corresponding to the mother plate; The heat map is divided into several grid regions; Calculate the grid density for each of the different grid regions; Based on the aforementioned grid density, construct a density matrix; The density matrix is ​​input into a preset target algorithm, and the target movement path is output.

[0012] Optional, also includes: Obtain the target number of defects for the defective IC carrier boards corresponding to different motherboards, and send the target number of defects to the unloading suction gripper; The different motherboards are classified based on the number of target defects, and classification results are generated; Based on the classification results, the feeding gripper is controlled to separate the motherboard into individual components.

[0013] Optionally, after obtaining the target number of defects in the corresponding defective IC carrier boards on different motherboards and sending the target number of defects to the unloading gripper, the method further includes: If the number of target defects is not obtained, then the number of times the motherboard has been inspected is obtained; If the number of tests is greater than 1, the motherboard is marked as a motherboard to be manually reviewed. Obtain the number of master boards awaiting manual review; Based on the quantity to be reviewed and the quantity of motherboards in the current batch, the proportion to be reviewed is obtained; If the proportion to be reviewed does not exceed the third quantity threshold, the motherboard to be manually reviewed is re-inspected based on the target detection scheme, and the number of target defects is re-acquired. If the proportion to be reviewed exceeds the third quantity threshold, the current batch of motherboards will be re-inspected based on the target detection scheme, and the number of target defects will be re-acquired.

[0014] Secondly, this application also discloses an IC carrier board line scanning and marking system, which adopts the following technical solution: An IC carrier board line scanning and marking system includes: The first judgment module is used to determine whether the motherboard meets the preset detection requirements; If the motherboard does not meet the preset detection requirements, the first detection module is used to perform defect detection on the IC carrier board based on the initial detection points and the first detection rules. If a defective IC carrier board is detected, the first acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard. The first marking module is used to send the target coordinates to the marking laser head and mark the defective IC carrier board based on the target coordinates; If the marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC carrier boards based on the first detection rule. If the motherboard meets the preset testing requirements, the second testing module is used to perform defect testing on all the IC carrier boards one by one based on the second testing rules. If a defective IC carrier board is detected, the second acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard and save the target coordinates. The second judgment module is used to determine whether the IC carrier board has been completely detected. The coordinate sending module is used to send all the target coordinates to the marking laser head after all the IC carrier boards have been detected. The second marking module is used to control the marking laser head to mark the defective IC carrier board based on all the target coordinates.

[0015] By adopting the above technical solution, when the motherboard does not meet the preset detection requirements, defect detection is performed on the IC carrier board according to the first detection rule. That is, whenever a defective IC carrier board is detected, the target coordinates of the defective IC carrier board are obtained, and the defective IC carrier board is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier board is continued. When the motherboard meets the preset detection requirements, defect detection is performed on all IC carrier boards one by one according to the second detection rule. When a defective IC carrier board is detected, the target coordinates are sent to the marking laser head. Only after all IC carrier boards on the motherboard have been detected is the defective IC carrier board marked.

[0016] By classifying motherboards according to preset testing requirements, the testing strategy can be dynamically switched according to the actual situation of the IC carrier board. This helps to improve the adaptability of IC carrier board quality differences, and thus helps to improve testing efficiency while maintaining high testing accuracy.

[0017] Thirdly, the computer device provided in this application adopts the following technical solution: A smart terminal includes a memory and a processor, wherein the memory stores a computer program that can run on the processor, and when the processor loads the computer program, it executes the method of the first aspect.

[0018] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a memory for loading and execution by a processor. Thus, a smart terminal is made based on the memory and the processor, making it convenient for users to use.

[0019] Fourthly, the computer-readable storage medium provided in this application adopts the following technical solution: A computer-readable storage medium storing a computer program that, when loaded by a processor, executes the method of the first aspect.

[0020] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a computer-readable storage medium for loading and execution by a processor. The computer-readable storage medium facilitates the reading and storage of the computer program.

[0021] In summary, this application includes the following beneficial technical effects: By classifying motherboards according to preset testing requirements, the testing strategy can be dynamically switched according to the actual situation of the IC carrier board. This helps to improve the adaptability of IC carrier board quality differences, and thus helps to improve testing efficiency while maintaining high testing accuracy. Attached Figure Description

[0022] Figure 1This is a main flowchart of an IC carrier board line scanning and marking method according to an embodiment of this application; Figure 2 This is a flowchart of steps S201 to S205; Figure 3 This is a flowchart of steps S301 to S306; Figure 4 This is a flowchart of steps S401 to S403; Figure 5 This is a flowchart of steps S501 to S505; Figure 6 This is a flowchart of steps S601 to S603; Figure 7 This is a flowchart of steps S701 to S706; Figure 8 This is a module diagram of an IC carrier board line scanning and marking system according to an embodiment of this application.

[0023] Explanation of reference numerals in the attached figures: 1. First judgment module; 2. First detection module; 3. First acquisition module; 4. First marking module; 5. Second detection module; 6. Second acquisition module; 7. Second judgment module; 8. Coordinate sending module; 9. Second marking module. Detailed Implementation

[0024] Firstly, this application discloses a method for marking lines on an IC carrier board.

[0025] Reference Figure 1 A method for line scanning and marking on an IC carrier board, comprising steps S101 to S110: Step S101: Determine whether the motherboard meets the preset detection requirements.

[0026] Specifically, in this embodiment, the motherboard is a collection of all IC carrier boards. One motherboard contains several IC carrier boards of the same model. The preset testing requirements are the standards set in advance to distinguish the testing methods.

[0027] Step S102: If the motherboard does not meet the preset detection requirements, then perform defect detection on the IC carrier board based on the initial detection points and the first detection rule.

[0028] Specifically, the initial detection point is the first point to be detected. In this embodiment, the IC carrier boards on the motherboard can be defectively detected in a specified order, such as from left to right or from right to left. If the detection is from left to right, the first IC carrier board on the left corresponding to the motherboard is taken as the initial detection point. The first detection rule is a pre-set first type of detection rule, which means that when a defective IC carrier board is detected, the defective IC carrier board is immediately marked.

[0029] Step S103: If a defective IC carrier is detected, obtain the target coordinates of the defective IC carrier on the motherboard.

[0030] Specifically, in this embodiment, target coordinates refer to a set of coordinate values ​​on the motherboard used to uniquely identify the specific location of the defective IC carrier board. They are usually represented by a two-dimensional coordinate system, including X-axis and Y-axis coordinates. In this embodiment, a fixed corner of the motherboard (such as the upper left corner or the lower left corner) is generally used as the reference point of the coordinate system.

[0031] Step S104: Send the target coordinates to the marking laser head and mark the defective IC carrier board based on the target coordinates.

[0032] Specifically, in this embodiment, after the target coordinates are sent to the marking laser head, the station is controlled to move so that the target coordinates move to the position of the marking laser head.

[0033] Step S105: If marking is completed, continue to perform defect detection on the remaining IC substrates based on the first detection rule.

[0034] Specifically, in this embodiment, after marking is completed, the control line scanning station moves to below the line scanning camera to continue detecting whether there are defects on the next IC carrier board.

[0035] Step S106: If the motherboard meets the preset testing requirements, then based on the second testing rule, perform defect testing on all IC carrier boards one by one.

[0036] Specifically, in this embodiment, the second detection rule is a pre-set second type of detection rule. This detection rule means that when a defective IC carrier is detected, the target position of the defective IC carrier is saved first, and the next IC carrier is continued to be detected until all IC carriers are detected. Then, the station is controlled to move to the position of the marking laser head, and finally all defective IC carriers are marked in sequence.

[0037] Step S107: If a defective IC carrier board is detected, obtain the target coordinates of the defective IC carrier board on the motherboard and save the target coordinates.

[0038] Step S108: Determine whether all IC carrier boards have been tested.

[0039] Step S109: If all IC carrier boards have been inspected, send all target coordinates to the marking laser head.

[0040] Step S110: Based on all target coordinates, control the marking laser head to mark the defective IC carrier board.

[0041] The IC carrier board line scanning marking method provided in this embodiment performs defect detection on the IC carrier board according to the first detection rule when the mother board does not meet the preset detection requirements. That is, whenever a defective IC carrier board is detected, the target coordinates of the defective IC carrier board are obtained, and the defective IC carrier board is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier board is continued. When the mother board meets the preset detection requirements, the defect detection of all IC carrier boards is performed one by one according to the second detection rule. When a defective IC carrier board is detected, the target coordinates are sent to the marking laser head. The defective IC carrier board is marked only after all IC carrier boards on the mother board have been detected.

[0042] By classifying motherboards according to preset testing requirements, the testing strategy can be dynamically switched according to the actual situation of the IC carrier board. This helps to improve the adaptability of IC carrier board quality differences, and thus helps to improve testing efficiency while maintaining high testing accuracy.

[0043] Reference Figure 2 In one embodiment of this example, step S101, determining whether the motherboard meets the preset detection requirements, includes steps S201 to S205: Step S201: Obtain batch information of the target IC carrier board.

[0044] Specifically, in this embodiment, the target IC carrier is the IC carrier currently being tested, and the batch information is the information related to the batch corresponding to the target IC carrier, including the number of all IC carriers in this batch, the number of IC carriers contained in the current motherboard, and the model information of the IC carriers in this batch, etc.

[0045] Step S202: Based on batch information, determine whether the target IC carrier board is a new batch carrier board.

[0046] Specifically, in this embodiment, the new batch of carrier boards can be a completely new type of product that is completely different from other IC carrier boards scanned previously, or it can be a product of a different type from the previously tested IC carrier board.

[0047] Step S203: If the target IC carrier is not a new batch of carriers, then obtain the average number of defects per motherboard corresponding to the current batch of IC carriers based on the batch information.

[0048] Specifically, in this embodiment, the average number of defects is the average number of defective IC carriers corresponding to the motherboard of the current batch of IC carriers.

[0049] Step S204: If the average number of defects exceeds the first quantity threshold, the motherboard is determined to meet the preset detection requirements.

[0050] Specifically, in this embodiment, the first quantity threshold is a pre-set criterion for judging whether the average number of defects is too large.

[0051] Step S205: If the average number of defects does not exceed the first quantity threshold, the motherboard is determined to not meet the preset detection requirements.

[0052] The IC carrier board line scan marking method provided in this embodiment first obtains the batch information corresponding to the target IC carrier board, and then determines whether the target IC carrier board is a new batch carrier board based on the batch information. If not, it means that the target IC carrier board and the IC carrier board contained in the previous motherboard are from the same batch. Therefore, the average number of defects of a single motherboard corresponding to the batch carrier board is obtained, and it is determined whether the average number of defects exceeds a first quantity threshold. If it exceeds the threshold, it means that the average number of defects is too large. If the first detection rule is used to perform defect detection on the current batch of IC carrier boards, a lot of time will be wasted. It is more appropriate to use the second inspection rule to perform defect detection on it. Therefore, it is determined that the motherboard meets the preset detection requirements.

[0053] Reference Figure 3 In one embodiment of this example, after determining whether the target IC carrier is a new batch carrier based on batch information in step S202, steps S301 to S306 are further included: Step S301: Obtain the first rated quantity of IC carrier boards corresponding to a single motherboard.

[0054] Specifically, the first rated quantity refers to the rated quantity of IC carrier boards set on each motherboard.

[0055] Step S302: Based on batch information, obtain the number of motherboards in the current batch.

[0056] Specifically, in this embodiment, the number of motherboards in the current batch is the total number of motherboards composed of IC carrier boards in the current batch.

[0057] Step S303: Based on the first rated quantity and the current batch motherboard quantity, obtain the target quantity of IC carrier boards.

[0058] Specifically, in this embodiment, the target quantity is the criterion used to determine whether the number of defective IC carrier boards is excessive. In this embodiment, the target quantity can be set directly according to the actual situation and user needs, or it can be set according to the first rated quantity and the current batch of motherboards. For example, the target quantity is the product of the first rated quantity and the current batch of motherboards multiplied by a certain percentage, such as target quantity = first rated quantity × current batch of motherboards × 5%.

[0059] Step S304: Obtain the total number of defects and determine whether the total number of defects is equal to the target number.

[0060] Specifically, in this embodiment, the total number of defects is the total number of all defective IC carriers detected from the start of the current batch of IC carriers to the current time point.

[0061] Step S305: If the total number of defects equals the target number, then obtain the number of defects detected on the motherboard.

[0062] Specifically, in this embodiment, the number of detected boards refers to the number of motherboards composed of the current batch of IC carrier boards that have already been tested.

[0063] Step S306: If the number of detected items is less than the second quantity threshold, then the motherboard is determined to meet the preset detection requirements.

[0064] Specifically, in this embodiment, the second quantity threshold is a pre-set judgment criterion used to determine whether the detected quantity corresponding to the target quantity is excessive.

[0065] The IC carrier board line scanning marking method provided in this embodiment calculates the target quantity based on the first rated quantity and the current batch of motherboards. When the target quantity equals the total number of defects, the number of motherboards that have been detected is obtained, and it is determined whether the number of detected quantities is less than the second quantity threshold. If it is less, it means that the number of detected quantities is small, that is, the number of defective IC carrier boards corresponding to a single motherboard is large. Therefore, in order to improve the detection efficiency, it is determined that the motherboard meets the preset detection requirements.

[0066] Reference Figure 4 In one embodiment of this example, step S110, which controls the marking laser head to mark the defective IC carrier based on all target coordinates, includes steps S401 to S403: Step S401: Based on all target coordinates, obtain the available movement paths.

[0067] Specifically, in this embodiment, the selectable movement path refers to the movement path that can be selected.

[0068] Step S402: Obtain the target movement path based on the optional movement path.

[0069] Specifically, the target movement path is the final selected movement path. In this embodiment, the target movement path can be the movement path with the shortest movement distance.

[0070] Step S403: Based on the target movement path, control the marking laser head to mark the defective IC carrier board.

[0071] Specifically, in this embodiment, the marking laser head is controlled to mark the defective IC carrier board one by one according to the target movement path.

[0072] The IC carrier board line scanning marking method provided in this embodiment first obtains all available movement paths, then selects the closest target movement path from them, and finally marks the defective IC carrier board sequentially according to the target movement path. This helps to avoid unnecessary movement and thus helps to improve marking efficiency.

[0073] Reference Figure 5 In one embodiment of this example, step S402, based on the optional movement path, obtains the target movement path, including steps S501 to S505: Step S501: Obtain the distribution heat map corresponding to the mother plate.

[0074] Specifically, a heatmap is a visualization tool that uses color depth to intuitively display the density of data distribution in space or region. It is commonly used to present the concentration and distribution patterns of data points in a two-dimensional plane. In this embodiment, it mainly collects the target coordinates of each defective IC carrier board on the motherboard, divides the motherboard plane into several grid regions, and uses different colors (e.g., red for high density and blue for low density) to represent the density of defective IC carrier boards in each region, forming a heat map effect, thus intuitively reflecting the spatial distribution characteristics of defective IC carrier boards on the carrier board. In this embodiment, the darker the color of a region, the more defective IC carrier boards there are in that region, and the more concentrated the marking requirements are.

[0075] Step S502: Divide the thermal distribution map into several grid regions.

[0076] Step S503: Calculate the grid density of different grid regions respectively.

[0077] Specifically, in this embodiment, for each grid cell, the number of target coordinates falling into it and other related indicators can be counted, and these can be used as the density value of the grid.

[0078] Step S504: Construct a density matrix based on the grid density.

[0079] Specifically, a density matrix is ​​a tool for quantifying and expressing data density in matrix form, used to structurally describe the numerical distribution characteristics within a spatial region. In this embodiment, the density matrix is ​​a key intermediate link connecting the defect distribution heatmap and the marking path optimization. Its core function is to transform the visualized heat distribution into a computable numerical model. Each element in the matrix corresponds to a region in space (such as a grid in a heatmap), and the element value represents the defect density of that region (such as the number of defective IC carriers per unit area).

[0080] Step S505: Input the density matrix into the preset target algorithm and output the target movement path.

[0081] Specifically, in this embodiment, the preset target algorithm, i.e., the pre-set algorithm, can be a clustering algorithm, such as DBSCAN+TSP. First, based on the density matrix, the DBSCAN algorithm is used to divide the high-density grid into several "defect clusters" (such as cluster A, cluster B), each cluster corresponding to the region where defects are concentrated on the carrier plate; then, the distance between each cluster is calculated, and the processing order of the clusters is determined according to the "proximity principle" (such as processing the cluster closest to the current laser head first); finally, for the defect coordinates within each cluster, the Traveling Salesman Problem (TSP) algorithm is used to calculate the shortest traversal path (such as greedy algorithm, 2-opt optimization).

[0082] The IC carrier board line scan marking method provided in this embodiment first obtains a distribution heat map, then divides the distribution heat map into several grid regions, calculates the grid density of different grid regions, constructs a density matrix based on the grid density, and finally inputs the density matrix into a preset target algorithm and outputs the target movement path.

[0083] Reference Figure 6 In one embodiment of this example, steps S601 to S603 are further included: Step S601: Obtain the target number of defects on the IC carrier corresponding to different motherboards, and send the target number of defects to the unloading pick-and-place.

[0084] Specifically, in this embodiment, the target number of defects refers to the number of defective IC carrier boards on different motherboards.

[0085] Step S602: Classify different motherboards based on the number of target defects and generate classification results.

[0086] Specifically, in this embodiment, different motherboards are classified according to the number of target defects corresponding to the defective IC carrier boards of different motherboards, that is, motherboards with the same number of target defects are classified into one category.

[0087] Step S603: Based on the classification results, control the feeding gripper to separate the motherboards.

[0088] Specifically, in this embodiment, motherboards with the same classification result (same target quantity) are placed in the same feeding bin by a feeding suction gripper.

[0089] The IC carrier board line scanning and marking method provided in this embodiment obtains the target defect number of defective IC carrier boards on different motherboards, classifies the motherboards according to the target defect number, and finally controls the unloading suction gripper to pack the motherboards according to the classification results.

[0090] Reference Figure 7 In one embodiment of this invention, after obtaining the target defect number of the defective IC carrier board corresponding to different motherboards in step S601 and sending the target defect number to the unloading gripper, the method further includes steps S701 to S706: Step S701: If the target number of defects is not obtained, then obtain the number of inspections of the motherboard.

[0091] Specifically, the number of inspections refers to the number of times the motherboard is inspected. In this embodiment, even if there are multiple IC carrier boards on the motherboard and defect inspection is performed on each IC carrier board, the number of inspections on the motherboard can only be counted as one.

[0092] Step S702: If the number of tests is greater than 1, mark the motherboard as a motherboard to be manually reviewed.

[0093] Specifically, if the number of tests is greater than 1, it indicates that the motherboard is a faulty motherboard, for example, due to reasons such as not obtaining the number of target defects, which requires re-verification or re-inspection; in this embodiment, the motherboard to be manually verified is the motherboard waiting for manual verification.

[0094] Step S703: Obtain the number of master boards to be manually reviewed.

[0095] Specifically, in this embodiment, the number to be reviewed is the number of motherboards to be manually reviewed.

[0096] Step S704: Based on the number of boards to be reviewed and the number of motherboards in the current batch, obtain the ratio of boards to be reviewed.

[0097] Specifically, in this embodiment, the ratio to be reviewed is the percentage of the number of motherboards to be manually reviewed relative to the number of motherboards in the current batch. The ratio to be reviewed = number to be reviewed ÷ number of motherboards in the current batch × 100%.

[0098] Step S705: If the proportion to be reviewed does not exceed the third quantity threshold, the motherboard to be manually reviewed is re-inspected based on the target detection scheme, and the number of target defects is re-acquired.

[0099] Specifically, in this embodiment, the third quantity threshold is a pre-set judgment standard used to determine whether the proportion to be reviewed is too large; the target detection scheme is the scheme to finally select to perform line scanning on the IC carrier board.

[0100] Step S706: If the proportion to be reviewed exceeds the third quantity threshold, the current batch of motherboards will be re-inspected based on the target detection scheme, and the number of target defects will be re-acquired.

[0101] The IC carrier board line scan marking method provided in this embodiment cannot classify the motherboard based on the number of target defects if the number of target defects is not obtained. Therefore, it further obtains the number of inspections of the motherboard. When the number of inspections is greater than 1, it indicates that the motherboard is a faulty carrier board and needs manual review. Therefore, it is directly marked as a motherboard to be manually reviewed. It further obtains the number of motherboards to be reviewed and obtains the ratio of motherboards to be reviewed based on the number of motherboards to be reviewed and the number of motherboards in the current batch. If the ratio of motherboards to be reviewed does not exceed the third quantity threshold, it indicates that the ratio of motherboards to be reviewed is relatively low, that is, the proportion of motherboards to be manually reviewed is low among all motherboards, and the impact on the inspection data corresponding to the motherboards in the current batch is small. Therefore, it is only necessary to re-inspect the motherboards to be manually reviewed and re-obtain the number of target defects corresponding to the motherboards to be manually reviewed. If the ratio of motherboards to be reviewed exceeds the third quantity threshold, it indicates that the ratio of motherboards to be reviewed is relatively high, that is, the proportion of motherboards to be manually reviewed is high among all motherboards, and the impact on the inspection data corresponding to the motherboards in the current batch is large. Therefore, it is necessary to re-inspect the motherboards in the current batch and re-obtain the number of target defects corresponding to the motherboards in the current batch.

[0102] Secondly, this application also discloses an IC carrier board line scanning and marking system.

[0103] Reference Figure 8 An IC carrier board line scanning and marking system, comprising: The first judgment module is used to determine whether the motherboard meets the preset detection requirements; If the motherboard does not meet the preset detection requirements, the first detection module is used to perform defect detection on the IC carrier board based on the initial detection points and the first detection rules. If a defective IC carrier board is detected, the first acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard. The first marking module is used to send the target coordinates to the marking laser head and mark the defective IC carrier board based on the target coordinates; If the marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC carrier boards based on the first detection rule. If the motherboard meets the preset testing requirements, the second testing module is used to perform defect testing on all the IC carrier boards one by one based on the second testing rules. If a defective IC carrier board is detected, the second acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard and save the target coordinates. The second judgment module is used to determine whether the IC carrier board has been completely detected. The coordinate sending module is used to send all the target coordinates to the marking laser head after all the IC carrier boards have been detected. The second marking module is used to control the marking laser head to mark the defective IC carrier board based on all the target coordinates.

[0104] Thirdly, this application discloses a smart terminal, including a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads the computer program, it executes an IC carrier board line scanning and marking method according to the above embodiment.

[0105] Fourthly, embodiments of this application disclose a computer-readable storage medium, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is loaded by a processor, it executes an IC carrier board line scan marking method according to the above embodiments.

[0106] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A method for line scanning and marking on an IC carrier board, characterized in that, include: Determine whether the motherboard meets the preset testing requirements; If the motherboard does not meet the preset detection requirements, then the IC carrier board is subjected to defect detection based on the initial detection points and the first detection rule; If a defective IC carrier board is detected, the target coordinates of the defective IC carrier board on the motherboard are obtained; The target coordinates are sent to the marking laser head, and the defective IC carrier board is marked based on the target coordinates; If marking is completed, then based on the first detection rule, continue to perform defect detection on the remaining IC carrier boards; If the motherboard meets the preset testing requirements, then based on the second testing rule, defect testing is performed on all the IC carrier boards one by one; If a defective IC carrier board is detected, the target coordinates of the defective IC carrier board on the motherboard are obtained and saved. Determine whether all IC carrier boards have been tested; If all the IC carrier boards have been inspected, then all the target coordinates are sent to the marking laser head; Based on all the target coordinates, the marking laser head is controlled to mark the defective IC carrier board; The determination of whether the motherboard meets the preset detection requirements includes: Obtain batch information for the target IC carrier board; Based on the batch information, determine whether the target IC carrier board is a new batch carrier board; If the target IC carrier is not a carrier in the new batch, then the average number of defects per motherboard corresponding to the IC carrier in the current batch is obtained based on the batch information. If the average number of defects exceeds the first quantity threshold, then the motherboard is determined to meet the preset detection requirements; If the average number of defects does not exceed the first quantity threshold, then the motherboard is determined not to meet the preset detection requirements; Obtain the first rated number of IC carrier boards corresponding to a single motherboard; Based on the batch information, obtain the number of motherboards in the current batch; Based on the first rated quantity and the current batch motherboard quantity, the target quantity of the IC carrier board is obtained. The target quantity is the product of the first rated quantity and the current batch motherboard quantity, multiplied by a certain percentage. Obtain the total number of defects and determine whether the total number of defects is equal to the target number; If the total number of defects is equal to the target number, then the number of motherboards that have been inspected is obtained. The number of motherboards that have been inspected is the number of motherboards composed of the current batch of IC carrier boards. If the number of detected samples is less than the second quantity threshold, then the motherboard is determined to meet the preset detection requirements. The step of controlling the marking laser head to mark the defective IC carrier based on all the target coordinates includes: Based on all the target coordinates, obtain the possible movement paths; Based on the available movement paths, obtain the target movement path; Based on the target movement path, control the marking laser head to mark the defective IC carrier board; The step of obtaining the target movement path based on the optional movement path includes: Obtain the distribution heat map corresponding to the motherboard. The distribution heat map refers to the process of collecting the target coordinates of each defective IC carrier on the motherboard, dividing the motherboard plane into several grid regions, and using different colors to represent the density of defective IC carriers in each region. The heat map is divided into several grid regions; Calculate the grid density for each of the different grid regions; Based on the aforementioned grid density, construct a density matrix; The density matrix is ​​input into a preset target algorithm, and the target movement path is output.

2. The IC carrier board line scanning and marking method according to claim 1, characterized in that, Also includes: Obtain the target number of defects for the defective IC carrier boards corresponding to different motherboards, and send the target number of defects to the unloading suction gripper; The different motherboards are classified based on the number of target defects, and classification results are generated; Based on the classification results, the feeding gripper is controlled to separate the motherboard into individual components.

3. The IC carrier board line scanning and marking method according to claim 2, characterized in that, After obtaining the target number of defects in the IC carrier boards corresponding to different motherboards and sending the target number of defects to the unloading gripper, the process further includes: If the number of target defects is not obtained, then the number of times the motherboard has been inspected is obtained; If the number of tests is greater than 1, the motherboard is marked as a motherboard to be manually reviewed. Obtain the number of master boards awaiting manual review; Based on the quantity to be reviewed and the quantity of motherboards in the current batch, the proportion to be reviewed is obtained; If the proportion to be reviewed does not exceed the third quantity threshold, the motherboard to be manually reviewed is re-inspected based on the target detection scheme, and the number of target defects is re-acquired. If the proportion to be reviewed exceeds the third quantity threshold, the current batch of motherboards will be re-inspected based on the target detection scheme, and the number of target defects will be re-acquired.

4. An IC carrier board line scanning and marking system, used to perform the method according to any one of claims 1 to 3, characterized in that, include: The first judgment module is used to determine whether the motherboard meets the preset detection requirements; If the motherboard does not meet the preset detection requirements, the first detection module is used to perform defect detection on the IC carrier board based on the initial detection points and the first detection rules. If a defective IC carrier board is detected, the first acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard. The first marking module is used to send the target coordinates to the marking laser head and mark the defective IC carrier board based on the target coordinates; If the marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC carrier boards based on the first detection rule. If the motherboard meets the preset testing requirements, the second testing module is used to perform defect testing on all the IC carrier boards one by one based on the second testing rules. If a defective IC carrier board is detected, the second acquisition module is used to acquire the target coordinates of the defective IC carrier board on the motherboard and save the target coordinates. The second judgment module is used to determine whether the IC carrier board has been completely detected. The coordinate sending module is used to send all the target coordinates to the marking laser head after all the IC carrier boards have been detected. The second marking module is used to control the marking laser head to mark the defective IC carrier board based on all the target coordinates.

5. A smart terminal, comprising a memory and a processor, characterized in that, The memory is used to store computer programs that can run on the processor, and when the processor loads the computer program, it executes the method of any one of claims 1 to 3.

6. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is loaded by the processor, it executes the method according to any one of claims 1 to 3.

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