A batched high-consistency optical fiber sensing network laying process method and device

Abstract

The application discloses a batch high-consistency optical fiber sensing network laying process method and device, and designs and manufactures a positioning mold for the trend of the optical fiber in the sensing unit of the optical fiber sensing network; the positioning mold is spliced, laid and fixed on the surface of a monitored object where the optical fiber sensing network needs to be laid; solid adhesives are put into the sticking positions of each measuring point reserved in the adjacent two positioning molds; the optical fiber is wound through each measuring point; a force transmission plug is put above each measuring point; then vacuum is drawn, heating is performed to the solidification temperature of the solid adhesive, and after the solidification temperature is kept for more than half an hour, the temperature is lowered to room temperature, and solidification is completed; after the solidification is completed, the vacuum is removed, the force transmission plug and the positioning mold are sequentially removed, and the whole laying process is completed. Through the positioning mold design, the accurate positioning of each optical fiber sensing section in the deployment process is ensured, the batch laying of the sensor is realized, and the laying efficiency is greatly improved.

Description

Technical Field

[0001] This invention belongs to the field of structural intelligence technology, and in particular relates to a process and apparatus for mass production of highly consistent fiber optic sensor networks. Background Technology

[0002] In modern engineering practice, structural health monitoring (SHM) has become a key means to ensure infrastructure safety, prevent catastrophic accidents, and optimize maintenance plans. By deploying a large number of sensors on structures, real-time and continuous monitoring of structural performance can be achieved, enabling the timely detection of minor damage and abnormal changes. This provides a scientific basis for structural maintenance and repair, and data support for structural design optimization. The importance of large-scale sensor network deployment, as a core component of structural health monitoring, is self-evident.

[0003] Current sensor network deployment methods primarily target traditional quasi-distributed fiber optic sensors or resistance strain gauges. Since sensor networks typically contain only tens or a few hundred measurement points, a point-by-point deployment method is used, where sensors are sequentially laid out at each measurement point. However, with the development of distributed fiber optic sensors, the spatial resolution of sensors is continuously improving, and the number of reusable sensors on an optical fiber is increasing exponentially (reaching tens of thousands), making it possible to achieve ultra-high spatial resolution structural health monitoring. Distributed fiber optic sensor networks have emerged to meet this need, but they also present significant challenges to the deployment process. Using the aforementioned point-based sensor deployment method has obvious drawbacks:

[0004] 1) The laying efficiency is low, requiring a large amount of manpower;

[0005] 2) Achieving consistency in the installation of all measuring points is quite difficult, and it is hard to control the strain transfer rate of each sensing segment. Such sensor networks often require data from various sensing points to perform mutual calculations to achieve real-time damage location, shape monitoring, external load monitoring, and other state variables of the structure. Poor installation consistency can easily amplify measurement errors.

[0006] Based on the aforementioned technical bottlenecks, this invention designs a method for mass production and high consistency fiber optic sensor network deployment. By applying positioning molds, solid adhesives, force-transmitting plugs, and vacuum bag compression, the deployment efficiency and consistency are significantly improved, enabling rapid deployment of sensor networks and supporting accurate measurement of large-scale, high-density physical fields. Summary of the Invention

[0007] The purpose of this invention is to address the shortcomings of existing technologies by providing a process and apparatus for mass production of highly consistent fiber optic sensor networks.

[0008] The objective of this invention is achieved through the following technical solution:

[0009] In a first aspect, the present invention provides a process apparatus for mass production of highly consistent fiber optic sensor networks, the apparatus comprising: a positioning mold, a solid adhesive, a force transmission plug, a vacuum pumping device, and a heating device;

[0010] The positioning mold is used to ensure the accurate positioning of each fiber optic sensing unit and the consistency of the pasting area size during the deployment process.

[0011] The solid adhesive is used to bond the optical fiber and the monitored object;

[0012] The force-transmitting plug is used to ensure that pressure is transmitted to the optical fiber;

[0013] The vacuum equipment is used to create a vacuum, ensuring the consistency of the pressure field at each measuring point during the curing process;

[0014] The heating device is used to heat the solid adhesive to its curing temperature.

[0015] Secondly, the present invention provides a method for mass deployment of highly consistent fiber optic sensor networks, the method being applied to a mass deployment apparatus for highly consistent fiber optic sensor networks, comprising the following steps:

[0016] (1) Design and manufacture positioning molds for the movement of optical fibers in the sensing unit of the optical fiber sensing network;

[0017] (2) Splice and lay the positioning mold on the surface of the monitored object where the fiber optic sensor network needs to be laid;

[0018] (3) Place the solid adhesive into the pre-reserved adhesive positions for each measurement point in the two adjacent positioning molds;

[0019] (4) Wrap the optical fiber around the pasting positions of each measurement point;

[0020] (5) Place the force transmission plug above each measuring point;

[0021] (6) Then use a vacuuming device to create a vacuum. Under vacuum, use a heating device to heat the solid adhesive to its curing temperature and maintain the curing temperature for more than half an hour. Then cool it down to room temperature to complete the curing.

[0022] (7) After curing, remove the vacuum, and remove the force transmission plug and positioning mold in sequence to complete the entire laying process.

[0023] Furthermore, the pasting shape and trend of each measurement point in the fiber optic sensor network are determined by the measurement requirements, system spatial resolution, and strain transmissibility. After determining the pasting range of each measurement point and the trend of the optical fiber in the fiber optic sensor network, the geometry of the positioning mold is designed based on the topology of the fiber optic sensor network. The positioning mold is used to enclose the pasting area of ​​each measurement point. At the same time, the positioning mold is designed on the inside of the corner of each measurement point to realize the bending of the optical fiber in the fiber optic sensor network, thereby realizing the monitoring of physical quantities in different directions within the structure. The contact part between the positioning mold and the optical fiber in the fiber optic sensing unit needs to ensure a tolerance range of 0°-1°.

[0024] Furthermore, by arranging the positioning molds one by one according to the design requirements of the fiber optic sensor network, and embedding them into adjacent positioning molds with positioning pins, the precise positioning and consistency of the pasting area size of each fiber optic sensor unit during deployment can be ensured.

[0025] Furthermore, the elastic modulus of the positioning mold is 1 / 20 to 1 / 30 of the elastic modulus of the monitored object.

[0026] Furthermore, the curing temperature of the solid adhesive is greater than the upper limit of the operating temperature of the monitored object.

[0027] Furthermore, the solid adhesive is a polyolefin thermoplastic film, a polyethersulfone resin thermoplastic film, a polyethylene thermoplastic film, or a thermoplastic polyurethane thermoplastic film.

[0028] Furthermore, the dimensions of the force-transmitting plug in any direction The calculation formula is as follows:

[0029] ;

[0030] in, This indicates the reserved dimensions for the optical fiber in the corresponding direction. This indicates the dimensions of the positioning mold in the corresponding direction. This indicates the coefficient of thermal expansion of the positioning mold. Indicates the coefficient of thermal expansion of the force transmission piston; This indicates the temperature difference between the curing temperature of the solid adhesive and the laying temperature when using the placement mold.

[0031] Furthermore, the prestress of the optical fiber after the entire laying process can be controlled by adjusting the laying temperature during the placement of the positioning mold. The calculation formula is as follows:

[0032] ;

[0033] in, Indicates the solid temperature of the solid adhesive; This indicates the laying temperature when using the laying positioning mold; Indicates the coefficient of thermal expansion of the monitored object; This represents the coefficient of thermal expansion of the optical fiber; This indicates the prestress during optical fiber winding; This represents the elastic modulus of an optical fiber.

[0034] Furthermore, the operating temperature of the coatings on the positioning mold, force transmission plug, and optical fiber all need to be higher than the curing temperature of the solid adhesive; the curing temperature of the solid adhesive needs to be higher than the upper limit of the actual operating temperature of the optical fiber sensor network.

[0035] The beneficial effects of this invention are:

[0036] 1) The positioning mold design ensures the precise positioning of each fiber optic sensing segment during deployment, enabling mass deployment of sensors and significantly improving deployment efficiency.

[0037] 2) By using positioning molds, solid adhesives and force-transmitting plugs, the consistency of the bonding of each sensing segment in the sensing array is greatly improved, which in turn can improve the accuracy of algorithms that need to perform mutual calculations on the data measured by the sensing network (such as damage location algorithms based on structural strain field data, structural shape inversion algorithms, external load inversion algorithms, etc.). Attached Figure Description

[0038] Figure 1 A flowchart of a process for laying out a batch of highly consistent fiber optic sensor networks.

[0039] Figure 2 This is a schematic diagram of each structure in Example 1;

[0040] Figure 3 This is a flowchart of a batch high-consistency fiber optic sensor network deployment process in Example 1;

[0041] Figure 4 These are cross-sectional views of the various structures after installation in Example 1;

[0042] In the diagram, 1-positioning mold; 2-object to be monitored; 3-solid adhesive; 4-optical fiber; 5-force transmission plug; 7-contact part; 8-positioning hole. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention.

[0044] This invention provides a process apparatus for mass production of highly consistent fiber optic sensor networks. The apparatus includes: a positioning mold, a solid adhesive, a force-transmitting plug, a vacuum pump, and a heating device.

[0045] The positioning mold is used to ensure the accurate positioning of each fiber optic sensing unit and the consistency of the pasting area size during the deployment process.

[0046] The solid adhesive is used to bond the optical fiber and the monitored object. The properties of the solid adhesive at room temperature can ensure the consistency of the amount of solid adhesive used at each measurement point.

[0047] The force-transmitting plug is used to ensure that pressure is transmitted to the optical fiber;

[0048] The vacuum equipment is used to create a vacuum, ensuring the consistency of the pressure field at each measuring point during the curing process;

[0049] The heating device is used to heat the solid adhesive to its curing temperature.

[0050] like Figure 1 As shown, this invention provides a method for mass deployment of highly consistent fiber optic sensor networks, comprising the following steps:

[0051] (1) Design and manufacture positioning molds for the movement of optical fibers in the sensing unit of the optical fiber sensing network;

[0052] (2) Splice and lay the positioning mold on the surface of the monitored object where the fiber optic sensor network needs to be laid;

[0053] (3) Place the solid adhesive into the pre-reserved adhesive positions for each measurement point in the two adjacent positioning molds;

[0054] (4) Wrap the optical fiber around the pasting positions of each measurement point;

[0055] (5) Place the force transmission plug above each measuring point;

[0056] (6) Then use a vacuuming device to create a vacuum. Under vacuum, use a heating device to heat the solid adhesive to its curing temperature and maintain the curing temperature for more than half an hour. Then cool it down to room temperature to complete the curing.

[0057] (7) After curing, remove the vacuum, and remove the force transmission plug and positioning mold in sequence to complete the entire laying process.

[0058] Example 2: As Figure 2 , Figure 3 and Figure 4 As shown, this invention provides a method for mass deployment of highly consistent fiber optic sensor networks, comprising the following steps:

[0059] (1) Design and manufacture a positioning mold for the optical fiber trend in the sensing unit of the optical fiber sensing network; clean the positioning mold 1 with an ultrasonic cleaner and apply a release agent to its surface after it is dried.

[0060] (2) The positioning mold 1 is spliced, laid and fixed on the surface of the monitored object 2 where the fiber optic sensor network needs to be laid; after the positioning mold 1 is laid on the surface of the monitored object 2, the positioning bolt is placed to fix the positional relationship between the two adjacent positioning molds 1, and then the edge of the positioning mold 1 is fixed with tape, and a vacuum is drawn so that the positioning mold 1 is adsorbed on the surface of the monitored object 2 and then the positioning bolt is removed.

[0061] (3) Place the solid adhesive 3 into the bonding positions of each measurement point reserved in the two adjacent positioning molds 1.

[0062] (4) Wrap the optical fiber 4 around the pasting position of each measurement point. In this invention, the optical fiber is used as a sensor.

[0063] (5) Insert the force transmission plug 5 above each measuring point;

[0064] (6) Then the entire tooling (positioning mold 1, solid adhesive 3, optical fiber 4, force transmission plug 5 and monitored object 2) is vacuumed using a vacuum pump.

[0065] (7) The entire tooling is heated to the curing temperature of the solid adhesive 3 by vacuuming equipment under vacuum (in this embodiment, polyolefin thermoplastic is used as solid adhesive, and the curing temperature of the polyolefin thermoplastic is 155°C), and then cooled to room temperature after 1 hour to complete the curing.

[0066] (8) After curing, remove the vacuum and remove all the force transmission plugs 5 and positioning molds 1 in sequence to complete the entire laying process.

[0067] Based on the topology of the fiber optic sensor network, the structural material parameters of the monitored object, and the curing temperature of the solid adhesive, a positioning mold is designed. The precise positioning and consistent bonding area size of each fiber optic sensor segment during deployment are ensured through the assembly of these positioning molds. A force-transmitting plug is designed based on the topology, material parameters, and curing temperature of the solid adhesive. A solid adhesive is selected based on the structural operating temperature of the monitored object 2, the fiber optic coating, and the structural compatibility of the monitored object 2. The consistency of the bonding thickness of each fiber optic sensor segment is ensured through the use of the solid adhesive and the force-transmitting plug. Precise control of the fiber optic prestress after molding is achieved by controlling the laying environment and the fiber optic condition. The consistency of the pressure field at each measurement point during bonding is ensured through the use of a vacuum method, thereby ensuring the consistency of the bonding thickness at each measurement point and the distance between the fiber optic cable and the monitored object.

[0068] When designing the positioning mold 1, since the pasting area is enclosed by two adjacent positioning molds, it is necessary to design positioning holes 8 and additionally design and manufacture positioning bolts to ensure the consistency of the relative positions between different positioning mold components. In this embodiment, a square positioning hole 8 with a side length of 5mm and a chamfer radius of 1mm is reserved at the center position of each unit of each positioning mold 1, and a positioning bolt is customized.

[0069] The elastic modulus of the designed positioning mold 1 is 1 / 20 to 1 / 30 of the elastic modulus of the monitored object 2. In this embodiment, the elastic modulus of the material used for the positioning mold 1 is 3 GPa and the Poisson's ratio is 0.4, while the elastic modulus of the monitored object 2 (alloy material) is 79 GPa and the Poisson's ratio is 0.33.

[0070] In this embodiment, polyolefin thermoplastic film is used as solid adhesive 3, which is solid at room temperature and has a melting point of 155°C. The solid adhesive 3 is cut into 10mm and the positioning mold is 18mm.

[0071] The solid adhesive is a polyolefin thermoplastic film, a polyethersulfone resin thermoplastic film, a polyethylene thermoplastic film, or a thermoplastic polyurethane thermoplastic film.

[0072] The dimension of the force-transmitting piston in any direction The calculation formula is as follows:

[0073] ;

[0074] in, This indicates the reserved dimensions for the optical fiber in the corresponding direction. This indicates the dimensions of the positioning mold in the corresponding direction. This indicates the coefficient of thermal expansion of the positioning mold. Indicates the coefficient of thermal expansion of the force transmission piston; This indicates the temperature difference between the curing temperature of the solid adhesive and the laying temperature when using the placement mold.

[0075] like Figure 2 As shown, the force transmission plug 5 is designed and fabricated according to the geometric dimensions of each measuring point. When using solid adhesive 3 for bonding, the size design of the force transmission plug 5 needs to ensure that the positioning mold 1 and the force transmission plug 5 fit perfectly at the corresponding curing temperature of the thermoplastic adhesive 3. In this embodiment, the length of the bonding area on the positioning mold 1 is... Hekuan Taking 10mm and 8mm respectively, the reserved dimensions of the optical fiber include both length and width directions. The coefficient of thermal expansion of the force transmission plug 5. 120 10 -5 / ℃, coefficient of thermal expansion of positioning mold 1 The coefficient of thermal expansion is much smaller than that of the power transmission piston 5. Therefore, the coefficient of thermal expansion of positioning mold 1 is negligible. The value is 0 in the formula. This item is 0. The laying temperature during the placement mold laying is 20°C; in this embodiment, polyolefin thermoplastic is used as a solid adhesive, and the curing temperature of the polyolefin thermoplastic is 155°C; therefore This represents the temperature difference between the curing temperature of the solid adhesive and the laying temperature when using the placement mold. The temperature is 155-20=135℃; therefore, the length of the force transmission piston 5 can be calculated. Hekuan The thicknesses are 8.490mm and 6.792mm respectively, and the calculation formulas are as follows:

[0076] ;

[0077] .

[0078] thermal expansion coefficient of monitored object 2 For 20 10 -6 / ℃, thermal expansion coefficient of optical fiber 4 5 10 -7 / ℃, pre-strain within fiber 4 during fiber winding The elastic modulus of fiber 4 is 100 με. The prestress of the optical fiber is 1.913 GPa, which is 70 GPa.

[0079] The design principles of each tooling in the embodiments are summarized as follows:

[0080] In the design of positioning mold 1, the geometric shape of positioning mold 1 needs to consider the pasting range of each measuring point in the fiber optic sensor network and the trend of the fiber to determine the shape of the mold. The pasting shape and trend of each measuring point in the fiber optic sensor network are determined by the measurement requirements, system spatial resolution, and strain transmissibility. After determining the pasting range of each measuring point and the trend of the fiber optic sensor network, the geometry of the positioning mold is designed based on the topology of the fiber optic sensor network. The positioning mold is used to enclose the pasting area of ​​each measuring point. At the same time, the positioning mold is designed on the inside of the corner of each measuring point to realize the bending of the fiber in the fiber optic sensor network, thereby realizing the monitoring of physical quantities in different directions within the structure. By arranging the positioning molds one by one according to the design requirements of the fiber optic sensor network, and embedding adjacent positioning molds with positioning pins, the accurate positioning and consistency of the pasting area size of each fiber optic sensing unit during deployment can be ensured. The pasting area is a rectangle with a length and width of 10mm and 8mm, respectively. The contact part 7 between the positioning mold 1 and the fiber in the fiber optic sensing unit needs to ensure a tolerance range of 0°-1°. The selection of the material for the positioning mold 1 needs to take into account the elastic modulus and the working temperature; the elastic modulus of the positioning mold is 1 / 20 to 1 / 30 of the elastic modulus of the object being monitored; the working temperature of the positioning mold needs to be higher than the curing temperature of the solid adhesive.

[0081] In the design of the solid adhesive 3, the selection of the solid adhesive material needs to consider the compatibility between the optical fiber coating layer and the monitored object, as well as the operating temperature of the monitored object. The solid adhesive allows for control over the consistency of the adhesive dosage at each measurement point within the bonding range, thereby ensuring the consistency of the geometry at each bonding location. Thermoplastic film can be used as the solid adhesive; its solid state at room temperature facilitates achieving a highly consistent adhesive dosage at each sensing location. Simultaneously, the curing temperature of the solid adhesive must be higher than the upper limit of the monitored object's operating temperature, and the thermoplastic film used must be compatible with the optical fiber polymer cladding and the structural materials of the monitored object. For metal-polymer interfaces, materials such as polyolefin thermoplastic film, polyethersulfone resin thermoplastic film, and polyethylene thermoplastic film can be used as the solid adhesive; for fiber-reinforced resin-based composite materials, materials such as thermoplastic polyurethane thermoplastic film can be used. Simply cut the solid adhesive to the required size and place it in the mold at the pre-reserved positions of each measurement point; the curing temperature of the solid adhesive must be higher than the upper limit of the monitored object's operating temperature.

[0082] In the design of the force transmission plug 5, it is necessary to consider the thermal expansion coefficients of the positioning mold 1, the solid adhesive 3 and the force transmission plug 5 itself, as well as the required measurement range of each measurement point in the fiber optic sensor network.

[0083] In the design of prestressing for optical fibers, the thermal expansion coefficient of optical fiber 4 needs to be considered. The coefficient of thermal expansion of the monitored object 2 Curing temperature of solid adhesive 3 Laying temperature when laying positioning mold The thermal expansion coefficient of optical fiber Prestress during fiber winding Through formula The prestress of the optical fiber after the entire laying process can be obtained. .

[0084] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A mass production high-consistency fiber sensing network laying process apparatus, characterized in that, The device comprises a positioning mold, a solid adhesive, a force transmission plug, a vacuum extraction device and a heating device; The positioning mold is used to ensure the accurate positioning and consistency of the size of the pasting area of each fiber sensing unit during the deployment process; The solid adhesive is used to bond the fiber and the monitored object; The force transmission plug is used to ensure the pressure transmission to the fiber; The vacuum extraction device is used to extract vacuum and ensure the consistency of the pressure field of each measuring point during the curing process; The heating device is used to heat the solid adhesive to its curing temperature.

2. A mass production high-consistency fiber sensing network laying process method, characterized in that, The method is applied to the batch high-consistency fiber sensing network laying process device of claim 1, comprising the following steps: (1) Design and manufacture a positioning mold according to the trend of the fiber in the sensing unit of the fiber sensing network; (2) Jointly lay and fix the positioning mold on the surface of the monitored object where the fiber sensing network needs to be laid; (3) Put the solid adhesive into the pasting position of each measuring point reserved in the adjacent two positioning molds; (4) Wind the fiber through the pasting position of each measuring point; (5) Put the force transmission plug above each measuring point; (6) Then use the vacuum extraction device to extract vacuum, and under vacuum, use the heating device to heat to the curing temperature of the solid adhesive, and maintain the curing temperature for more than half an hour; then cool to room temperature to complete the curing; (7) After the curing is completed, the vacuum is removed, and the force transmission plug and the positioning mold are sequentially removed, and the whole laying process is completed.

3. A mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The pasting shape and trend of each measuring point in the fiber sensing network are determined by the measurement requirement, system spatial resolution and strain transmission rate. After determining the pasting range of each measuring point and the trend of the fiber in the fiber sensing network, the geometric shape of the positioning mold is designed based on the topological structure of the fiber sensing network, the pasting area of each measuring point is surrounded by using the positioning mold, and the positioning mold is designed inside the corner of each measuring point to realize the bending of the fiber in the fiber sensing network, thereby realizing the monitoring of physical quantities in different directions of the structure; the contact part of the positioning mold and the fiber in the fiber sensing unit needs to ensure that the tolerance range is 0°-1°.

4. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, By arranging the positioning molds one by one according to the design requirements of the fiber sensing network, and embedding adjacent two positioning molds through positioning pins, the accurate positioning and consistency of the size of the pasting area of each fiber sensing unit during the deployment process can be ensured.

5. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The elastic modulus of the positioning mold is 1 / 20-1 / 30 of the elastic modulus of the monitored object.

6. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The curing temperature of the solid adhesive is higher than the upper limit of the working temperature of the monitored object.

7. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The solid adhesive is a polyolefin thermoplastic film, a polyether sulfone resin thermoplastic film, a polyethylene thermoplastic film or a thermoplastic polyurethane thermoplastic film.

8. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The force transmitting plug has a dimension in any direction The calculation formula is as follows: ； wherein, represents the size of the fiber reserve in the corresponding direction, represents the size of the positioning mold in the corresponding direction, represents the thermal expansion coefficient of the positioning mold, represents the thermal expansion coefficient of the force transfer plug; represents the temperature difference between the curing temperature of the solid adhesive and the laying temperature at which the positioning mold is laid.

9. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The pre-stress of the optical fiber after the whole laying process can be controlled by the laying temperature when laying the positioning mold The calculation formula is as follows: ； wherein, represents a solid temperature of the solid adhesive; represents a laying temperature at the time of laying the positioning mold; represents a thermal expansion coefficient of the monitored object; represents a thermal expansion coefficient of the optical fiber; represents a pre-stress at the time of winding the optical fiber; represents a modulus of elasticity of the optical fiber.

10. The mass production high-consistency fiber sensing network laying process method according to claim 2, characterized in that, The working temperature of the positioning mold, the force transmission plug and the coating layer of the fiber all need to be higher than the curing temperature of the solid adhesive; the curing temperature of the solid adhesive needs to be higher than the actual upper limit of the working temperature of the fiber sensing network.

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