Semiconductor equipment framework high-precision assembling and welding equipment and tool clamp

Abstract

The invention discloses semiconductor equipment framework high-precision assembling and welding equipment and a tool clamp, and relates to the technical field of semiconductor framework welding, the semiconductor equipment framework high-precision assembling and welding equipment comprises a base, a support is assembled at the top end of the base, a laser welding device is assembled on the support through an electric push rod, and a rail is assembled in the base; and a clamping assembly is assembled in the track in a sliding manner. The semiconductor equipment framework is firstly clamped through the framework clamp, then the sliding block is controlled to move through rotation of the threaded rod, the connecting plate is pushed to move upwards along with movement of the moving roller of the sliding block on the special-shaped plate, the connecting plate is made to be matched with the height of the laser welding device, and after primary welding is conducted, the sliding block moves in the reverse direction, so that the welding efficiency is improved. And when the push rod pushes the rectangular rod, the first elastic telescopic rod rotates, so that the direction is changed, the sliding block is moved again, the semiconductor equipment framework with the moved direction is moved to the position below the laser welding device for secondary welding, and rapid and efficient welding operation is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor skeleton welding technology, and in particular to high-precision assembly and welding equipment and tooling fixtures for semiconductor equipment skeletons. Background Technology

[0002] After decades of development, semiconductor lasers have become increasingly well-known and applied in various fields. With a photoelectric conversion efficiency exceeding 60%, far surpassing other similar products, semiconductor lasers offer advantages such as low energy consumption, minimal heat accumulation, long lifespan, good collimation, and long illumination distance. As an emerging technology, their applications are becoming increasingly widespread. The various advantages of semiconductor lasers have led to their growing importance in various sectors of society. Welding high-power semiconductor lasers is one of the most crucial processes in the entire manufacturing process. Precise welding equipment is a prerequisite and guarantee for high-quality welding and a vital foundation for subsequent packaging. Only with good welding results can high-power semiconductor lasers exhibit excellent performance in packaging, testing, aging, and other stages, significantly improving key indicators such as product reliability, robustness, and lifespan. However, currently, only equipment for welding semiconductor laser chips is available; equipment for welding the casing to the heat sink is lacking. This results in low welding efficiency and poor welding quality, affecting product usability.

[0003] The invention patent with announcement number CN116174955A discloses an optical communication semiconductor laser welding device with heat dissipation function, including a welding chamber, a housing, a heat dissipation component inside the housing, a fan on the housing, and several buttons inside the mounting base, the buttons being electrically connected to a motor; a control component, which is slidably connected to the support and movably abuts against the buttons, the control component adjusting the fan speed by pressing the buttons at different positions; and a lifting component, which is slidably and sealed to the inner wall of the housing, hot air driving the lifting component to move, the lifting component being used to drive the control component to move.

[0004] The aforementioned prior art uses conventional fixtures to fix the semiconductor device frame, followed by welding. However, welding generally requires two welding operations. After the first welding, the angle needs to be adjusted for a second welding, which leads to low welding efficiency. Summary of the Invention

[0005] The purpose of this invention is to solve the problem that in the prior art, semiconductor device frames are fixed by conventional fixtures and then welded. However, welding usually requires two welding operations, and the angle needs to be adjusted for a second welding after the first welding, which leads to low welding efficiency. Therefore, this invention proposes a high-precision assembly and welding device and tooling fixture for semiconductor device frames.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A high-precision assembly and welding fixture for a semiconductor device skeleton includes a base, a support is mounted on the top of the base, a laser welder is mounted on the support via an electric push rod, a track is mounted inside the base, and a clamping assembly is slidably mounted inside the track. The clamping assembly includes two irregularly shaped plates fixed to the upper surface of the track, an L-shaped rod fixed to the end of the upper surface of the track, and a slider slidably connected inside the track. The upper surface of the slider is rotatably connected to an elastic telescopic rod one. The top of the elastic telescopic rod one is fixed to a connecting plate. The upper surface of the connecting plate is equipped with four skeleton clamps arranged in a circular array. The bottom of the connecting plate is rotatably connected to rollers through four support rods. Four rectangular rods are fixed to the outside of the elastic telescopic rod one. A push rod is hinged to the bottom of the L-shaped rod. An elastic telescopic rod two is embedded inside the L-shaped rod. The side of the push rod is connected to the elastic telescopic rod two. This application uses a clamping assembly to hold and assist the rotation of a semiconductor device frame. First, the semiconductor device frame is clamped by a frame fixture. Then, the movement of the slider is controlled by the rotation of the threaded rod. As the slider moves, the rollers move on the irregular plate, which in turn pushes the connecting plate upward to adapt it to the height of the laser welder. After the initial welding, the slider moves in the opposite direction until the push rod pushes the rectangular rod, causing the elastic telescopic rod to rotate and change its orientation. This causes the slider to move again, moving the semiconductor device frame under the laser welder for secondary welding, thus achieving a fast and efficient welding operation.

[0007] Preferably, a threaded rod is rotatably connected through the interior of the base, the end of the threaded rod is connected to a motor, and the threaded rod is threadedly connected to a slider.

[0008] Preferably, the upper surface of the slider is fixed with four elastic telescopic buckles, and the outer side of the elastic telescopic rod has four slots that are adapted to the elastic telescopic buckles.

[0009] Preferably, a baffle is fixed in the middle of the bottom of the slider, U-shaped plates are fixed on both sides of the bottom of the slider, and two symmetrically arranged limiting blocks are fixed on the outer side of the track.

[0010] Preferably, the outer side of the track is fitted with a light-shielding component for shielding against laser contamination.

[0011] Preferably, the light-shielding assembly includes two light-shielding plates, which are symmetrically hinged to both sides of the track. Multiple soft rubber light-shielding strips are fitted to the front end of each light-shielding plate. A transverse through-groove is formed at the top of each light-shielding plate, and an arc-shaped groove is formed at the back of the light-shielding plate. This application uses a light-shielding assembly to block laser beams. As the slider moves, two U-shaped plates fixed to its sides squeeze the two light-shielding plates to rotate, thus blocking the clamping assembly. To prevent the light-shielding plates from affecting the clamping assembly, multiple soft rubber light-shielding strips are used in conjunction to perform the light-shielding operation.

[0012] Preferably, the side of the U-shaped plate closest to the light-shielding plate has an arc-shaped structure, the light-shielding plate is in contact with the limiting block, and an arc-shaped friction rod is fixed to the outer side of the back plate of the light-shielding plate.

[0013] Preferably, the track is internally equipped with a dust removal component for removing dust adhering to the frame joints.

[0014] Preferably, the dust removal assembly includes a second baffle fixed inside the track. A multi-stage air pressure pipe is fixed to one side of the second baffle, and a pipe is fixed to the other end of the second baffle. The multi-stage air pressure pipe is connected to the pipe, and a spring is fitted between the multi-stage air pressure pipe and the second baffle. A pipe joint is fitted at the top of the pipe, and a rotary joint is rotatably connected to the right side of the pipe joint. A nozzle is fitted on the side of the rotary joint. This application removes dust adhering to the connection points of semiconductor device frames by setting a dust removal assembly. As the slider moves, the first baffle at its bottom squeezes the multi-stage air pressure pipe, forcing the gas inside into the pipe. Then, under the delivery of the pipe joint and the rotary nozzle, the gas is sprayed out through the nozzle to clean the dust adhering to the connection points of the semiconductor device frame. Simultaneously, the movement of the arc-shaped friction rod pushes the rotary joint to rotate under the action of friction, causing the nozzle on its side to rotate accordingly, increasing the range of air jet cleaning.

[0015] A high-precision assembly and welding device for semiconductor equipment skeletons uses a high-precision assembly and welding fixture for semiconductor equipment skeletons to clamp and position the semiconductor equipment skeletons.

[0016] Compared with the prior art, the present invention has the following advantages: 1. This application uses a clamping assembly to clamp and assist in the rotation of a semiconductor device skeleton. First, the semiconductor device skeleton is clamped by a skeleton clamp. Then, the movement of the threaded rod controls the movement of the slider. As the slider moves, the rollers move on the irregular plate, which in turn pushes the connecting plate upward to adapt it to the height of the laser welder. After the initial welding, the slider moves in the opposite direction until the push rod pushes the rectangular rod, causing the elastic telescopic rod to rotate and change its orientation. This causes the slider to move again, moving the semiconductor device skeleton to the bottom of the laser welder for secondary welding, thus achieving a fast and efficient welding operation.

[0017] 2. This application uses a light-shielding component to block laser beams. As the slider moves, the two U-shaped plates fixed on its side will squeeze the two light-shielding plates to rotate, thus blocking the clamping component. In order to prevent the light-shielding plates from affecting the clamping component, multiple soft rubber light-shielding strips are set to work together to block the light.

[0018] 3. This application removes dust adhering to the connection of the semiconductor device frame by setting up a dust removal component. As the slider moves, the baffle at its bottom squeezes the multi-stage air pressure pipe, forcing the gas inside into the pipe. Then, under the delivery of the pipe joint and the rotating nozzle, the gas is sprayed out through the nozzle to clean the dust adhering to the connection of the semiconductor device frame. At the same time, by moving the arc-shaped friction rod, the rotating joint is pushed to rotate under the action of friction, so that the nozzle on its side rotates accordingly, increasing the range of air jet cleaning. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the overall structure of the present invention. Figure 3 ; Figure 4 This is a partial structural diagram of the present invention; Figure 5 This is a schematic diagram of the clamping assembly of the present invention; Figure 6 This is a partial structural diagram of the clamping component of the present invention. Figure 1 ; Figure 7 This is a partial structural diagram of the clamping component of the present invention. Figure 2 ; Figure 8 This is a schematic diagram of the structure of the light-shielding component of the present invention. Figure 1 ; Figure 9 This is a schematic diagram of the structure of the light-shielding component of the present invention. Figure 2 ; Figure 10 This is a schematic diagram of the structure of the dust removal component of the present invention; Figure 11 This is a partial structural schematic diagram of the dust removal component of the present invention.

[0020] In the diagram: 100, base; 200, bracket; 300, electric actuator; 400, laser welder; 500, track; 600, threaded rod; 700. Clamping assembly; 701. Irregularly shaped plate; 702. L-shaped rod; 703. Slider; 704. Elastic telescopic rod one; 705. Connecting plate; 706. Frame clamp; 707. Roller; 708. Rectangular rod; 709. Elastic telescopic buckle; 710. Baffle one; 711. Push rod; 712. Elastic telescopic rod two; 800. Light-shielding component; 801. Light-shielding plate; 802. U-shaped plate; 803. Horizontal through groove; 804. Soft rubber light-shielding strip; 805. Arc groove; 806. Limiting block; 900. Dust removal assembly; 901. Arc-shaped friction rod; 902. Second baffle; 903. Multi-stage air pressure pipe; 904. Pipe; 905. Pipe joint; 906. Rotary joint; 907. Nozzle; 908. Spring. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0022] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Example 1, refer to Figure 1-7 A high-precision assembly and welding equipment and tooling fixture for semiconductor equipment skeleton, including a base 100, a bracket 200 mounted on the top of the base 100, a laser welder 400 mounted on the bracket 200 via an electric push rod 300, a track 500 mounted inside the base 100, and a clamping assembly 700 slidably mounted inside the track 500. The clamping assembly 700 includes two irregularly shaped plates 701 fixed to the upper surface of the track 500, an L-shaped rod 702 fixed to the end of the upper surface of the track 500, and a slider 703 slidably connected inside the track 500. An elastic telescopic rod 704 is rotatably connected to the upper surface of the slider 703. A connecting plate 705 is fixed to the top of the elastic telescopic rod 704. Four skeleton clamps 706 arranged in a circular array are mounted on the upper surface of the connecting plate 705. Rollers 707 are rotatably connected to the bottom of the connecting plate 705 via four support rods. Four rectangular rods 708 are fixed to the outer side of the elastic telescopic rod 704. A push rod 711 is hinged to the bottom of the L-shaped rod 702. An elastic telescopic rod 712 is embedded inside the L-shaped rod 702. The side of the push rod 711 is connected to the elastic telescopic rod 712. A threaded rod 600 is rotatably connected through the interior of the base 100. The end of the threaded rod 600 is connected to a motor. 00 is threadedly connected to slider 703. During the movement, roller 707 rolls on the irregular plate 701, thereby pushing connecting plate 705 upward. At this time, elastic telescopic rod 704 is pulled up. Through the rise of connecting plate 705, the skeleton clamp 706 is pushed to a height that matches the laser welder 400. Four elastic telescopic buckles 709 are fixed on the upper surface of slider 703. Four slots that match the elastic telescopic buckles 709 are opened on the outer side of elastic telescopic rod 704. Each time elastic telescopic rod 704 is pushed and rotates, the four slots will lock into the corresponding elastic telescopic buckles 709 in sequence, ensuring that the rotation angle of elastic telescopic rod 704 is 90 degrees each time. A baffle 710 is fixed in the middle of the bottom of slider 703. U-shaped plates 802 are fixed on both sides of the bottom of slider 703. Two symmetrically arranged limit blocks 806 are fixed on the outer side of track 500. The semiconductor device skeleton is clamped and rotated by a clamping assembly 700. First, the semiconductor device skeleton is clamped by the skeleton clamp 706. Then, the movement of the slider 703 is controlled by the rotation of the threaded rod 600. As the slider 703 moves, the roller 707 moves on the irregular plate 701, which in turn pushes the connecting plate 705 upward to adapt it to the height of the laser welder 400. After the initial welding, the slider 703 moves in the opposite direction until the push rod 711 pushes the rectangular rod 708, causing the elastic telescopic rod 704 to rotate, thereby changing its orientation. The slider 703 moves again, moving the semiconductor device skeleton to below the laser welder 400 for secondary welding, thus achieving a fast and efficient welding operation.

[0024] The specific working principle of this invention is as follows: First, four semiconductor device frames are clamped in four frame fixtures 706 respectively. Then, the motor connected to the threaded rod 600 is started, causing the threaded rod 600 to rotate. At this time, under the action of the rotation of the threaded rod 600, the slider 703 moves. Figure 1In this state, it moves from left to right. During the movement, the roller 707 rolls on the irregular plate 701, thereby pushing the connecting plate 705 upward. At this time, the elastic telescopic rod 704 is pulled up. Through the rise of the connecting plate 705, the skeleton clamp 706 is pushed to a height that matches the laser welder 400. Then, the laser welder 400 performs the first horizontal welding. After the first welding is completed. The motor on the outside of the threaded rod 600 rotates in the opposite direction, controlling the threaded rod 600 to rotate in the opposite direction, causing the slider 703 to slide in the opposite direction. During the sliding process, the connecting plate 705 and the skeleton clamp 706 move downward under the action of the rebound force of the elastic telescopic rod 704. As the slider 703 moves, the rectangular rod 708 on the side of the elastic telescopic rod 704 is pushed by the push rod 711 and drives the elastic telescopic rod 704 to rotate 90 degrees. Then, the motor rotates in the forward direction again, causing the threaded rod 600 to rotate in the forward direction, driving the slider 703 to move. Since the push rod 711 is hinged to the L-shaped rod 702, the push rod 711 will not push the rectangular rod 708 after the slider 703 moves at this time. At this point, the slider 703 continues to move and moves again to the height that matches the laser welder 400, and then performs secondary welding to complete the welding operation on the semiconductor equipment bracket.

[0025] Example 2, refer to Figure 1-9 Based on Embodiment 1, a light-shielding component 800 for shielding laser contamination is installed on the outer side of the track 500. The light-shielding component 800 includes a light-shielding plate 801. Two light-shielding plates 801 are provided and symmetrically hinged on both sides of the track 500. Multiple soft rubber light-shielding strips 804 are installed at the front end of the light-shielding plate 801. A transverse through groove 803 is provided at the top of the light-shielding plate 801. In order to ensure that the light-shielding plate 801 does not affect the welding operation of the laser welder 400, the transverse through groove 803 is provided at its top to accommodate the movement of the laser welder 400. An arc-shaped groove 805 is provided at the back plate of the light-shielding plate 801. The side of the U-shaped plate 802 near the light-shielding plate 801 has an arc structure. The light-shielding plate 801 contacts the limiting block 806. An arc-shaped friction rod 901 is fixed on the outer side of the back plate of the light-shielding plate 801. The laser beam is blocked by setting up a light-shielding component 800. As the slider 703 moves, the two U-shaped plates 802 fixed on its side will squeeze the two light-shielding plates 801 to rotate, blocking the clamping component 700. In order to prevent the light-shielding plates 801 from affecting the clamping component 700, multiple soft rubber light-shielding strips 804 are set up to cooperate in the light-shielding operation.

[0026] The specific working principle of this invention is as follows: Based on the first embodiment, as the slider 703 moves, the U-shaped plates 802 fixed on both sides of its bottom will push the light shield 801 to rotate, thus blocking the entire clamping assembly 700. In order to prevent the light shield 801 from affecting the clamping assembly 700, multiple soft rubber light shielding strips 804 are set to cooperate in the light shielding operation. At the same time, in order to ensure that the light shield 801 does not affect the welding operation of the laser welder 400, a transverse through groove 803 is opened on its top to accommodate the movement of the laser welder 400.

[0027] Example 3, refer to Figure 1-11 Based on Embodiment 1, the track 500 is equipped with a dust removal component 900 for removing dust adhering to the frame connection. The dust removal component 900 includes a second baffle 902, which is fixed inside the track 500. A multi-stage air pressure pipe 903 is fixed to one side of the second baffle 902, and a pipe 904 is fixed to the other end of the second baffle 902. The multi-stage air pressure pipe 903 is connected to the pipe 904. A spring 908 is installed between the multi-stage air pressure pipe 903 and the second baffle 902. A pipe joint 905 is installed at the top of the pipe 904. A rotary joint 906 is rotatably connected to the right side of the pipe joint 905. A nozzle 907 is installed on the side of the rotary joint 906. An annular groove is opened on the surface of the rotary joint 906, which is in contact with the arc-shaped friction rod 901. Therefore, by moving the arc-shaped friction rod 901, the rotary joint 906 is pushed to rotate under the action of friction. The dust removal component 900 removes dust adhering to the connection of the semiconductor device frame. As the slider 703 moves, the baffle 710 at its bottom squeezes the multi-stage air pressure pipe 903, forcing the gas inside into the pipe 904. Then, under the conveying of the pipe joint 905 and the rotary joint 906, the gas is sprayed out through the nozzle 907 to clean the dust adhering to the connection of the semiconductor device frame. At the same time, the movement of the arc-shaped friction rod 901 pushes the rotary joint 906 to rotate under the action of friction, causing the nozzle 907 on its side to rotate as well, increasing the range of air jet cleaning.

[0028] The specific working principle of this invention is as follows: As the slider 703 moves, the baffle 710 at its bottom will squeeze the multi-stage air pressure pipe 903, squeezing the gas inside into the pipe 904. Then, under the conveying of the pipe joint 905 and the rotary joint 906, the gas is sprayed out through the nozzle 907 to clean the dust attached to the connection of the semiconductor device skeleton. At the same time, as the light shield 801 rotates and closes, the arc-shaped friction rod 901 fixed on its side moves. Through the movement of the arc-shaped friction rod 901, the rotary joint 906 is pushed to rotate under the action of friction, so that the nozzle 907 on its side rotates accordingly, increasing the range of air jet cleaning.

[0029] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-precision mounting jig for semiconductor device skeletons, comprising a base (100), characterized in that, The top end of the base (100) is equipped with a support (200), the support (200) is equipped with a laser welder (400) through an electric push rod (300), the inside of the base (100) is equipped with a track (500), the inside of the track (500) is slidingly equipped with a clamping assembly (700); The clamping assembly (700) comprises two special-shaped plates (701) fixed on the upper surface of the track (500), an L-shaped rod (702) fixed at the end of the upper surface of the track (500), a sliding block (703) slidingly connected in the inside of the track (500), an elastic telescopic rod I (704) rotatably connected to the upper surface of the sliding block (703), a connecting plate (705) fixed to the top end of the elastic telescopic rod I (704), four skeleton clamps (706) arranged in an annular array on the upper surface of the connecting plate (705), a roller (707) rotatably connected to the bottom of the connecting plate (705) through four supporting rods, four rectangular rods (708) fixed to the outer side of the elastic telescopic rod I (704), a push rod (711) hinged to the bottom of the L-shaped rod (702), and an elastic telescopic rod II (712) embedded in the L-shaped rod (702).

2. The semiconductor device skeleton high-precision soldering jig according to claim 1, wherein A threaded rod (600) is rotatably connected through the inside of the base (100), the end of the threaded rod (600) is connected with a motor, and the threaded rod (600) is threadedly connected with the sliding block (703).

3. The semiconductor device skeleton high-precision soldering jig according to claim 1, wherein Four elastic telescopic buckles (709) are fixed to the upper surface of the sliding block (703), and four clamping grooves matched with the elastic telescopic buckles (709) are formed in the outer side of the elastic telescopic rod I (704).

4. The semiconductor device skeleton high-precision soldering jig according to claim 1, wherein A baffle I (710) is fixed to the bottom of the sliding block (703), and U-shaped plates (802) are fixed to the two sides of the bottom of the sliding block (703), and two symmetrically arranged limiting blocks (806) are fixed to the outer side of the track (500).

5. The semiconductor device skeleton high-precision soldering jig according to claim 4, wherein An optical shielding assembly (800) is arranged on the outer side of the track (500) for shielding laser pollution.

6. The semiconductor device skeleton high-precision soldering jig according to claim 5, wherein The optical shielding assembly (800) comprises two symmetrically hinged optical shielding plates (801) on the two sides of the track (500), a plurality of soft optical shielding strips (804) are arranged on the front end of the optical shielding plate (801), a transversely penetrating groove (803) is formed in the top end of the optical shielding plate (801), and an arc-shaped groove (805) is formed in the back plate of the optical shielding plate (801).

7. The semiconductor device skeleton high-precision soldering j ig according to claim 6, wherein The side of the U-shaped plate (802) close to the optical shielding plate (801) is in an arc-shaped structure, the optical shielding plate (801) is in contact with the limiting block (806), and an arc-shaped friction rod (901) is fixed to the outer side of the back plate of the optical shielding plate (801).

8. The semiconductor device skeleton high-precision soldering j ig according to claim 7, wherein A dust removal assembly (900) is arranged in the inside of the track (500) for removing dust attached to the skeleton connection.

9. The semiconductor device skeleton high-precision soldering j ig according to claim 8, wherein The ash cleaning assembly (900) comprises a baffle two (902), the baffle two (902) is fixed inside the track (500), one side of the baffle two (902) is fixed with a multistage air pressure pipe (903), the other end of the baffle two (902) is fixed with a pipeline (904), the multistage air pressure pipe (903) is communicated with the pipeline (904), a spring (908) is assembled between the multistage air pressure pipe (903) and the baffle two (902), the top end of the pipeline (904) is assembled with a pipeline joint (905), the right side of the pipeline joint (905) is rotatably connected with a rotary joint (906), the rotary joint (906) side is assembled with a spray head (907).

10. A high-precision assembly and soldering device for semiconductor equipment skeletons, characterized in that, The semiconductor device skeleton high-precision welding tool clamp is used for clamping and positioning the semiconductor device skeleton.

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