Welding positioning device and platinum resistor chip pin arc welding direct connection process method

Abstract

The embodiment of the invention provides a welding positioning device and a platinum resistor chip pin arc welding direct connection process method, and the welding positioning device can place a chip pin in a limiting through hole of the welding positioning device; the to-be-welded multi-core wire is inserted into the limiting through hole in the direction of the chip pin, tight lap joint of the chip pin and the to-be-welded multi-core wire can be achieved under the guidance of the limiting through hole, after the metal wire is wound around the lap joint structure, the lap joint structure is heated so that the lap joint structure can be fused into a whole, and the welding quality is improved. The multi-core lead and the platinum resistor chip pin can be tightly overlapped and stranded, and can be fully fused, so that the welding quality and stability of the platinum resistor chip pin and the multi-core lead are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the field of electronic components, in particular to a welding positioning device and a process method for arc welding and direct connection of a platinum resistance chip pin. BACKGROUND

[0002] The platinum resistance chip pin and the multi-core copper wire fusion welding process are widely used. In the traditional process method, the platinum resistance chip pin is overlapped with the multi-core copper wire by hand, the overlapping alignment, the heating position and direction are judged by visual observation, the overlapping fit effect is estimated by experience, and the multi-core copper wire is randomly stranded. In mass production, the above-mentioned disadvantages of the scheme make the quality of the platinum resistance chip pin and the multi-core copper wire direct connection joint uneven, which is specifically manifested as follows: Poor quality consistency and low pass rate: the subjective difference of manual operation leads to significant fluctuations in the quality of the platinum resistance chip pin and the multi-core copper wire direct connection joint, the performance of the joints in batches and within the same batch is greatly different, and the one-time welding pass rate is generally low, which greatly increases the rework cost and production cycle; frequent appearance defects: due to the deviation of the overlapping alignment and the imbalance of the heating direction, it is easy to produce appearance defects such as uneven fusion joint forming size (such as joint diameter deviation exceeding 0.2 mm), joint axis inclination (such as inclination angle exceeding 5°) and the like, which directly affects the compatibility of the subsequent assembly of the components, and even causes assembly interference; Incomplete structure connection: when the overlapping surface is not fully fitted, the "surface paste fusion" phenomenon (i.e. only the platinum resistance chip pin and the multi-core copper wire are in contact and fused on the surface, and the internal single-core copper wire does not form effective metallurgical bonding with the pin) is easily formed, which causes incomplete fusion of part of the multi-core copper wire and inconsistent length of the platinum resistance chip pin after welding (such as deviation exceeding 0.3 mm), affecting the electrical parameter stability of the components; Insufficient mechanical properties and long-term reliability: the multi-core copper wire is loosely stranded, and the internal porosity is high, so that the pores cannot be completely eliminated during welding, resulting in the formation of dense honeycomb-like cavities inside the fusion joint; on the one hand, the cavities will weaken the structural strength of the joint, making the tensile strength of the joint too low (such as less than 15 N), which cannot meet the mechanical reliability requirements under vibration, impact and other working conditions; on the other hand, the cavities will increase the contact resistance of the joint, accelerate the electrochemical corrosion rate, cause the electrical signal transmission stability of the direct connection joint to decrease during long-term use, the connection performance attenuates with the use time, and significantly shortens the service life of the components.

[0003] The existing platinum resistance chip pin and multi-core copper wire fusion welding process has strong manual dependence and inaccurate process control, and the quality defects caused thereby have become a key bottleneck restricting the large-scale and high-quality production of platinum resistance chip components, and an optimized process scheme is urgently needed to realize precise control, ensure quality and stability. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0005] The application provides a welding positioning device and a platinum resistance chip pin arc welding direct connection process method, which can realize close lapping and stranding of the platinum resistance chip pin and the multi-core wire, and ensure sufficient fusion, thereby improving the quality and stability of the welding of the platinum resistance chip pin and the multi-core wire.

[0006] In a first aspect, the embodiments of the application provide a welding positioning device for welding of a platinum resistance chip, the platinum resistance chip comprising a chip body and a chip pin, characterized in that the welding positioning device comprises: a first pin positioning block provided with a positioning groove, a horn-shaped channel and a first channel, the positioning groove being used for fixing the chip body, the horn-shaped channel being in communication with the positioning groove and the first channel and being arranged at a certain angle with the positioning groove, the horn-shaped channel being used for changing the shape of the chip pin to lead the chip pin out to the first channel, and the first channel being used for limiting the chip pin; a second pin positioning block provided with a second channel corresponding to the first channel, the second channel being used for limiting the chip pin; and a positioning pressing block provided with a third channel corresponding to the first channel and the second channel, the positioning pressing block being used for combining with the intermediate assembly to form the welding positioning device, and the third channel being used for forming a limiting through hole together with the first channel and the second channel, the limiting through hole being used for accommodating the chip pin and a multi-core wire to be welded.

[0007] The welding positioning device according to the first aspect of the application has at least the following beneficial effects: The welding positioning device of the first aspect embodiment of the present application can preliminarily fix the chip body through the positioning groove in the first pin positioning block, and then change the shape of the chip pin based on the horn-shaped channel to lead the chip pin to the first channel; the second pin positioning block can be combined with the first pin positioning block into an intermediate assembly to complete the fixation of the chip body, and then combined with the positioning pressing block to form a completed welding positioning device, so that the chip pin can be finally placed in the limiting through hole formed by the first channel, the second channel and the third channel; by inserting the to-be-welded multi-core wire into the limiting through hole along the direction of the chip pin, the chip pin and the to-be-welded multi-core wire can be tightly overlapped under the guidance of the limiting through hole, and the overlapped structure formed by the chip pin and the to-be-welded multi-core wire can be fixed at a fixed position above the welding positioning device to facilitate the welding process; therefore, the welding positioning device of the first aspect embodiment of the present application can realize the tight overlap of the multi-core wire and the platinum resistance chip pin and ensure sufficient fusion, thereby improving the quality and stability of the welding of the platinum resistance chip pin and the multi-core wire.

[0008] In an embodiment, the first channel and the second channel each include a first port and a second port, the axial section of the first channel and the second channel is a quarter of a sector with an arc surface located inside the cavity of the first channel and the second channel, and the cavity of the first channel and the second channel gradually converges from the first port to the second port; the third channel includes a third port and a fourth port, the axial section of the third channel is a half of a sector with an arc surface located inside the cavity of the third channel, and the cavity of the third channel gradually converges from the third port to the fourth port; the first port is located on one side of the lower surface of the first pin positioning block or the second pin positioning block, the second port is located on one side of the upper surface of the first pin positioning block or the second pin positioning block, the third port is located on one side of the lower surface of the positioning pressing block, the fourth port is located on one side of the upper surface of the positioning pressing block, and the cavity of the limiting through hole formed by the first channel, the second channel and the third channel is funnel-shaped.

[0009] In an embodiment, the upper surfaces of the first pin positioning block and the second pin positioning block are respectively provided with a first positioning groove and a second positioning groove, and the upper surface of the positioning pressing block is provided with a third positioning groove; the first positioning groove, the second positioning groove and the third positioning groove together form a welding positioning groove located on the upper surface of the welding positioning device; the welding positioning groove is annular, and the opening of the limiting through hole located on the upper surface of the welding positioning device is arranged at the center of the welding positioning groove; the welding positioning groove is used for positioning the arc welding torch head.

[0010] In a second aspect, the present application provides a platinum resistance chip pin arc welding direct connection process method, which is applied to the welding positioning device in the first aspect embodiment and includes the following steps: The chip body is installed in the positioning groove of the first pin positioning block, and the chip pins are clamped in the trumpet-shaped channel to lead out the chip pins from the first channel; the first pin positioning block and the second pin positioning block are butted to form an intermediate assembly, and the chip pins are led out from the semi-open cavity formed by the first channel and the second channel; the positioning pressing block is installed on the intermediate assembly to obtain a soldering positioning device, the chip pins are arranged in the limiting through hole, and the chip pins are led out from the opening of the limiting through hole on the upper surface of the soldering positioning device; the to-be-soldered multi-core wire is inserted from the opening of the limiting through hole on the lower surface of the soldering positioning device, and the to-be-soldered multi-core wire is led out from the opening of the limiting through hole on the upper surface of the soldering positioning device to form a lap joint structure formed by the chip pins and the to-be-soldered multi-core wire through the same direction lap joint above the limiting through hole; after the lap joint structure is wound by a metal wire, the lap joint structure is heated to make the lap joint structure integrated; the soldering positioning device is disassembled, and the platinum resistance chip after soldering is taken out.

[0011] According to the platinum resistance chip pin arc soldering direct connection process method provided by the second aspect of the embodiment of the present application, at least the following beneficial effects are achieved: By forming the lap joint structure formed by the chip pins and the to-be-soldered multi-core wire through the same direction lap joint above the limiting through hole, and heating the lap joint structure after winding the lap joint structure by a metal wire to make the lap joint structure integrated, the close lap joint and stranding of the multi-core wire and the platinum resistance chip pins can be realized, and sufficient fusion is ensured, so that the quality and stability of the soldering of the platinum resistance chip pins and the multi-core wire are improved.

[0012] Other features and advantages of the present application will be set forth in the following description of the application, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application. The objects and other advantages of the present application can be achieved and obtained by the specific embodiments particularly pointed out in the specification, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0013] The accompanying drawings are used to provide a further understanding of the technical solutions of the present application, and constitute a part of the specification, and are used to explain the technical solutions of the present application together with the embodiments of the present application, and do not constitute a limitation on the technical solutions of the present application.

[0014] Figure 1 is a structural schematic diagram of the first pin positioning block in an embodiment of the present application; Figure 2 is a structural schematic diagram of the second pin positioning block in an embodiment of the present application; Figure 3 is a cross-sectional schematic diagram of the first pin positioning block provided by a specific example of the present application; Figure 4 is a structural schematic diagram of the positioning pressing block in an embodiment of the present application; Figure 5 is a sectional view of a welding positioning device provided by one specific example of the present application; Figure 6 is a partial view of a welding positioning device provided by one specific example of the present application; Figure 7 is a schematic view of steps of a platinum resistance chip pin arc welding direct connection process method provided by one embodiment of the present application; Figure 8 is Figure 7 is a specific schematic view of step S500 in

[0015] Reference signs: first pin positioning block 100, positioning groove 110, horn-shaped channel 120, first channel 130, first positioning slot 140, first port 150, second port 160, second pin positioning block 200, second channel 210, second positioning slot 220, positioning pressing block 300, third channel 310, third positioning slot 320, third port 330, fourth port 340, welding positioning device 400, limiting through hole 410, welding positioning slot 420, lap joint structure 500, metal wire 510. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the present disclosure, and these embodiments are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0017] The embodiments of the present application will be further described below in combination with the drawings.

[0018] Reference is made to Figure 1 , Figure 1 is a structural schematic view of the first pin positioning block 100 in one embodiment of the present application, in which Figure 1 In the example, the first pin positioning block 100 is provided with the positioning groove 110, the horn-shaped channel 120 and the first channel 130.

[0019] Specifically, the positioning groove 110 is used for fixing the chip body, the horn-shaped channel 120 is simultaneously communicated with the positioning groove 110 and the first channel 130 and is arranged at a certain angle with the positioning groove 110, the horn-shaped channel 120 is used for changing the shape of the chip pin to lead the chip pin out to the first channel 130, and the first channel 130 is used for limiting the chip pin.

[0020] Reference is made to Figure 2 , Figure 2 is a structural schematic view of the second pin positioning block 200 in one embodiment of the present application, in which Figure 2In the example, the second pin positioning block 200 is provided with a second channel 210 corresponding to the first channel 130, and the second channel 210 is used to limit the chip pin.

[0021] It is understood that the first channel 130 and the second channel 210 are respectively disposed on the side of the first pin positioning block 100 and the second pin positioning block 200. The chip body can be fixed by the side of the first pin positioning block 100 with the first channel 130 being connected to the side of the second pin positioning block 200 with the second channel 210. When the first pin positioning block 100 and the second pin positioning block 200 are assembled separately, the intermediate assembly formed is used to fix the chip body and to lead out the chip pins and confine them in the channel formed by the first channel 130 and the second channel 210.

[0022] Specifically, refer to Figure 3 , Figure 3 This is a cross-sectional schematic diagram of the first pin positioning block 100 provided in a specific example of the present invention. Figure 3 In the example, the chip pins first pass through the horn-shaped channel 120, then through the first channel 130, and finally emerge from the top of the intermediate assembly.

[0023] Therefore, it can be understood that when the first pin positioning block 100 and the second pin positioning block 200 are assembled separately, the resulting intermediate assembly is used to fix the chip body and to lead out the chip pins and confine them to one side of the channel formed by the first channel 130 and the second channel 210.

[0024] Reference Figure 4 , Figure 4 This is a schematic diagram of the positioning block 300 in one embodiment of the present invention. Figure 4 In the example, the positioning block 300 is provided with a third channel 310 corresponding to the first channel 130 and the second channel 210. The positioning block 300 is used to combine with the intermediate assembly to form a welding positioning device 400. The third channel 310 is used to form a limiting through hole 410 together with the first channel 130 and the second channel 210. The limiting through hole 410 is used to accommodate chip pins and multi-core wires to be welded.

[0025] Specifically, the first channel 130 and the second channel 210 each include a first port 150 and a second port 160, the axial section of the first channel 130 and the second channel 210 is a quarter of a sector with an arc surface located inside the cavity of the first channel 130 and the second channel 210, and the cavity of the first channel 130 and the second channel 210 gradually converges from the first port 150 to the second port 160; the third channel 310 includes a third port 330 and a fourth port 340, the axial section of the third channel 310 is a half of a sector with an arc surface located inside the cavity of the third channel 310, and the cavity of the third channel 310 gradually converges from the third port 330 to the fourth port 340; the first port 150 is located on one side of the lower surface of the first pin positioning block 100 or the second pin positioning block 200, the second port 160 is located on one side of the upper surface of the first pin positioning block 100 or the second pin positioning block 200, the third port 330 is located on one side of the lower surface of the positioning pressure block 300, and the fourth port 340 is located on one side of the upper surface of the positioning pressure block 300; the cavity of the limiting through hole 410 formed by the first channel 130, the second channel 210 and the third channel 310 is funnel-shaped.

[0026] Specifically, the upper surfaces of the first pin positioning block 100 and the second pin positioning block 200 are respectively provided with a first positioning groove 140 and a second positioning groove 220, and the upper surface of the positioning pressure block 300 is provided with a third positioning groove 320; the first positioning groove 140, the second positioning groove 220 and the third positioning groove 320 together form a welding positioning groove 420 located on the upper surface of the welding positioning device 400; the welding positioning groove 420 is annular, the opening of the limiting through hole 410 located on the upper surface of the welding positioning device 400 is arranged at the center of the welding positioning groove 420, and the welding positioning groove 420 is used for realizing the positioning of the arc welding gun head.

[0027] In a specific example, the platinum resistance chip has a chip body and two chip pins, and in the case that the platinum resistance chip is fixed to the intermediate assembly, the corresponding first pin positioning block 100 is provided with two first channels 130, the corresponding second pin positioning block 200 is provided with two second channels 210, the two chip pins are respectively located on the two sides of the intermediate assembly, and the positioning pressure block 300 is provided with two corresponding pressure blocks, one side of each of the two corresponding pressure blocks provided with a third channel 310 is respectively attached to one side of the intermediate assembly having an open cavity composed of the first channel 130 and the second channel 210 for installation, thereby forming a complete welding positioning device 400.

[0028] Referring to Figure 5 , Figure 5 is a cross-sectional schematic view of the welding positioning device 400 provided by the specific example of the present application, in combination with Figure 5It can be understood that the cavity of the limiting through hole 410 is funnel-shaped, and the funnel-shaped cavity of the limiting through hole 410 gradually converges from the lower part to the upper part of the welding positioning device 400. The to-be-welded multi-core wire is inserted from the bottom of the limiting through hole 410 and passes out from the top of the limiting through hole 410, and at the same time, the chip pin also passes out from the top of the limiting through hole 410. Therefore, the to-be-welded multi-core wire and the chip pin are overlapped in the same direction, and under the guidance of the funnel-shaped limiting cavity, the to-be-welded multi-core wire and the chip pin can be tightly pressed into a strand, thereby improving the stability of contact and the subsequent welding quality.

[0029] It can be understood that after the metal part inside the to-be-welded multi-core wire is exposed, the exposed part is tightly overlapped and pressed into a strand with the chip pin.

[0030] Referring to Figure 6 , Figure 6 is a partial schematic view of the welding positioning device 400 provided by an embodiment of the present application, in which Figure 6 In the example, the chip pin and the to-be-welded multi-core wire pass out of the opening of the limiting through hole 410 of the welding positioning device 400 on the upper surface of the welding positioning device 400, and form an overlapping structure 500 above the limiting through hole 410, which is formed by the chip pin and the to-be-welded multi-core wire overlapped in the same direction. After the overlapping structure 500 is wound with a metal wire 510, the overlapping structure 500 is heated to fuse the overlapping structure 500 into one, which can realize the tight overlapping and strand formation of the multi-core wire and the platinum resistance chip pin, and ensure sufficient fusion, thereby improving the quality and stability of the welding of the platinum resistance chip pin and the multi-core wire.

[0031] In an embodiment, the upper surfaces of the first pin positioning block 100 and the second pin positioning block 200 are respectively provided with a first positioning groove 140 and a second positioning groove 220, and the upper surface of the positioning pressing block 300 is provided with a third positioning groove 320. The first positioning groove 140, the second positioning groove 220 and the third positioning groove 320 jointly form a welding positioning groove 420 located on the upper surface of the welding positioning device 400. The welding positioning groove 420 is annular, and the opening of the limiting through hole 410 located on the upper surface of the welding positioning device 400 is arranged at the center of the welding positioning groove 420. The welding positioning groove 420 is used to realize the positioning of the arc welding gun head.

[0032] Specifically, the welding positioning groove 420 is adapted in size and shape to the arc welding gun mouth, and limits the position of the gun mouth in structure, so that the center of the gun mouth is located at the center position of the overlapping structure 500. When mass production, the welding positioning groove 420 can fix and unify the heating position and direction of the welding gun, and the overlapping structure 500 is located below the center of the gun mouth, so that the overlapping structure 500 is uniformly and symmetrically heated, and finally fused into a spherical shape with consistent formation.

[0033] The apparatus embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, i.e., can be located in one place or can be distributed to multiple units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment.

[0034] Based on the above welding positioning device 400, the following presents various embodiments of the platinum resistance chip pin arc welding direct connection process method of the present application.

[0035] Referring to Figure 7 , Figure 7 is a step schematic diagram of the platinum resistance chip pin arc welding direct connection process method provided by an embodiment of the present application, in Figure 7 In the example, the platinum resistance chip pin arc welding direct connection process method includes the following steps: S100, the chip body is loaded into the positioning groove of the first pin positioning block, and the chip pin is clamped into the horn-shaped channel to lead out the chip pin from the first channel; S200, the first pin positioning block and the second pin positioning block are butted to form an intermediate assembly, and the chip pin is led out from the semi-open cavity formed by the first channel and the second channel; S300, the positioning pressing block is installed on the intermediate assembly to obtain a welding positioning device, the chip pin is arranged in the limiting through hole, and the chip pin is led out from the opening of the limiting through hole on the upper surface of the welding positioning device; S400, the to-be-welded multi-core wire is inserted from the opening of the limiting through hole on the lower surface of the welding positioning device, and the to-be-welded multi-core wire is led out from the opening of the limiting through hole on the upper surface of the welding positioning device to form a lap joint structure above the limiting through hole by the same direction lap joint of the chip pin and the to-be-welded multi-core wire; S500, after the lap joint structure is wound with a metal wire, the lap joint structure is heated to make the lap joint structure integrated; S600, the welding positioning device is disassembled, and the platinum resistance chip after welding is taken out.

[0036] It can be understood that by forming the lap joint structure above the limiting through hole by the same direction lap joint of the chip pin and the to-be-welded multi-core wire, and heating the lap joint structure after winding the lap joint structure with a metal wire to make the lap joint structure integrated, the close lap joint and stranding of the multi-core wire and the platinum resistance chip pin can be realized, and sufficient fusion can be ensured, thereby improving the quality and stability of the welding of the platinum resistance chip pin and the multi-core wire.

[0037] Specifically, the above process is applied to the welding positioning device of the present embodiment, so that the platinum resistance chip pin and the multi-core wire copper wire, i.e., the position of the multi-core wire to be welded, are fixed, the assembly and lapping are consistent, the consistency of the lapping is improved, the defects of the different lengths of the platinum resistance chip pin are eliminated, the first-time yield of the batch production is improved; the multi-core wire copper wire and the platinum resistance chip pin are stranded through the funnel-shaped welding through-hole structure of the chamber, the lapping state of the stranded is consistent, the consistency of the multi-core wire lapping is improved, and the complete fusion of the multi-core wire is ensured. The multi-core wire distribution of the lapping head of the platinum resistance chip pin and the multi-core wire copper wire is tight, the multi-core wires are fully adhered, the number of honeycomb cavities in the fusion joint is reduced, and the long-term reliability of the direct connection joint is improved; the platinum resistance chip pin is wrapped by the copper wire, the surface mounting of the platinum resistance chip pin and the multi-core wire to be welded is eliminated, the pin is completely fused into the multi-core wire, and the long-term reliability of the connection is improved; the position and direction of the welding gun mouth are limited by the structure, the center of the gun mouth is located at the center position of the lapping structure, the appearance size and position state of the batch production direct connection joint are consistent, the problems of the inconsistent appearance of the joint fusion forming size, the position tilt, etc. are solved, and the consistency of the appearance quality level is improved.

[0038] In an embodiment, the arc welding process for connecting the platinum resistance chip pin and the multi-core wire includes the following steps: S700, peeling the multi-core wire to be welded to expose the metal inside the multi-core wire to be welded.

[0039] It can be understood that the part of the multi-core wire to be welded that is led out of the opening of the limiting through hole on the upper surface of the welding positioning device is the exposed metal part after peeling.

[0040] It can be understood that the chip pin and the multi-core wire to be welded are guided by the funnel-shaped cavity of the limiting through hole to achieve the tight joint of the chip pin and the multi-core wire to be welded into a strand in the lapping structure.

[0041] Referring to Figure 8 , Figure 8 is Figure 7 a specific diagram of step S500 in Figure 8 , in the example, step S500 includes: S510, using copper wire to wrap the lapping structure in a spiral manner; S520, fixing the arc welding gun head to the welding positioning groove; S530, using the arc welding gun head to heat the lapping structure, so that the lapping structure and the copper wire wrapped around the lapping structure in a spiral manner are melted together and combined into one after cooling.

[0042] It can be understood that the multi-core wire to be welded and the chip pin are overlapped to form an overlapping structure, and the overlapping structure is wrapped by copper wires to enhance the tightness of the multi-core wire distribution; thereby reducing the gap between the core wires and reducing the voids in the multi-core wire fusion joint, and at the same time, the copper wires wrap the chip pin, and during arc welding, the wrapped copper wires are melted and combined with the chip pin, ensuring that the chip pin is completely melted into the multi-core wire, and improving the connection reliability of the connection joint.

[0043] Specifically, the copper wire is wrapped around the overlapping structure and the chip pin below the overlapping structure in a spiral manner, ensuring that the chip pin is completely melted into the multi-core wire to be welded, thereby further improving the connection reliability.

[0044] Specifically, after the overlapping structure and the copper wire wrapped around the overlapping structure are fused, the fusion portion is spherical, and the spherical fusion portion based on the arc welding method can further improve the welding quality and improve the connection stability.

[0045] In an embodiment, the platinum resistance chip pin arc welding direct connection process method further comprises the steps of: S800, placing the welding positioning device on a preset placement rack, the placement rack being used to fasten the welding positioning device to avoid disintegration of the welding positioning device during welding.

[0046] Specifically, the placement rack abuts against the side surface of the welding positioning device to fix the welding positioning device.

[0047] Those skilled in the art can understand that all or some of the steps in the method disclosed above can be implemented as software, firmware, hardware and appropriate combinations thereof.

[0048] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A solder positioning device for soldering of a platinum resistance chip, the platinum resistance chip comprising a chip body and a chip pin, characterized in that, The welding positioning device includes: The first pin positioning block is provided with a positioning groove, a horn-shaped channel and a first channel. The positioning groove is used to fix the chip body. The horn-shaped channel is connected to both the positioning groove and the first channel and is set at a certain angle to the positioning groove. The horn-shaped channel is used to change the shape of the chip pin to lead the chip pin out to the first channel. The first channel is used to limit the chip pin. The second pin positioning block is provided with a second channel corresponding to the first channel. The second channel is used to limit the chip pin. When the first pin positioning block and the second pin positioning block are assembled separately, the intermediate assembly formed is used to fix the chip body and lead out the chip pin and limit it in the channel formed by the first channel and the second channel. The positioning block has a third channel corresponding to the first channel and the second channel. The positioning block is used to combine with the intermediate assembly to form the welding positioning device. The third channel is used to form a limiting through hole together with the first channel and the second channel. The limiting through hole is used to accommodate the chip pins and the multi-core wires to be welded.

2. The welding positioning device of claim 1, wherein: Both the first channel and the second channel include a first port and a second port. The axial cross-section of the first channel and the second channel is a quarter-sector of the arc surface located inside the cavity of the first channel and the second channel. The cavity of the first channel and the second channel has a gradually converging structure from the first port to the second port. The third channel includes a third port and a fourth port. The axial cross-section of the third channel is an arc-shaped half-fan located inside the cavity of the third channel. The cavity of the third channel has a gradually converging structure from the third port to the fourth port. The first port is located on the lower surface of the first pin positioning block or the second pin positioning block, the second port is located on the upper surface of the first pin positioning block or the second pin positioning block, the third port is located on the lower surface of the positioning block, and the fourth port is located on the upper surface of the positioning block. The cavity of the limiting through hole formed by the first channel, the second channel and the third channel is funnel-shaped.

3. The welding positioning device of claim 2, wherein: The first pin positioning block and the second pin positioning block are respectively provided with a first positioning groove and a second positioning groove on their upper surfaces, and the positioning pressure block is provided with a third positioning groove on its upper surface. The first positioning groove, the second positioning groove and the third positioning groove together form a welding positioning groove located on the upper surface of the welding positioning device. The welding positioning groove is annular, and the limiting through hole is located at the center of the welding positioning groove on the upper surface of the welding positioning device. The welding positioning groove is used to position the arc welding gun head.

4. A process for arc welding and direct connecting the pins of a platinum resistance chip, characterized by, The method, applied to the welding positioning device as described in any one of claims 1 to 3, comprises: The chip body is inserted into the positioning groove of the first pin positioning block, and the chip pins are snapped into the horn-shaped channel so that the chip pins are led out from the first channel. The first pin positioning block and the second pin positioning block are docked to form the intermediate assembly, and the chip pins are led out from the semi-open cavity formed by the first channel and the second channel. The positioning block is installed on the intermediate assembly to obtain the welding positioning device. The chip pin is set in the limiting through hole, and the chip pin is led out from the opening of the limiting through hole on the upper surface of the welding positioning device. The multi-core wire to be welded is inserted through the opening of the limiting through hole located on the lower surface of the welding positioning device, and the multi-core wire to be welded is led out through the opening of the limiting through hole located on the upper surface of the welding positioning device, so as to form an overlap structure above the limiting through hole by the chip pin and the multi-core wire to be welded overlapping in the same direction; After the overlapping structure is wrapped with metal wire, the overlapping structure is heated to fuse the overlapping structure into one piece. Disassemble the welding positioning device and remove the platinum resistance chip that has been welded.

5. The platinum resistance chip pin arc weld direct connect process method of claim 4 wherein, Also includes: The multi-core wire to be welded is stripped to expose the internal metal. The portion of the multi-core wire to be welded extending from the opening of the limiting through hole on the upper surface of the welding positioning device is the exposed metal portion after stripping.

6. The platinum resistance chip pin arc weld direct connect process method of claim 4 wherein, The cavity of the limiting through hole is funnel-shaped, and the funnel-shaped cavity of the limiting through hole gradually converges from the bottom to the top of the welding positioning device; The chip pins and the multi-core wires to be soldered are guided by the funnel-shaped cavity of the limiting through hole to achieve tight connection of the chip pins and the multi-core wires to be soldered into one in the overlapping structure.

7. The platinum resistance chip pin arc weld direct connect process method of claim 4 wherein, The upper surface of the welding positioning device is provided with a welding positioning groove for fixing the arc welding gun head; The step of winding the overlapping structure with metal wire and then heating the overlapping structure to fuse it into a single unit includes: The overlapping structure is wound with copper wire in a spiral manner; Fix the arc welding gun head to the welding positioning groove; The overlapping structure is heated using an arc welding torch to melt the overlapping structure and the copper wire wound around it in a spiral manner, and then they are bonded together after cooling.

8. The platinum resistance chip pin arc weld direct connect process method of claim 7 wherein, Also includes: Copper wire is used to simultaneously wind around the overlapping structure and the chip pins below the overlapping structure in a spiral manner.

9. The platinum resistance chip pin arc weld direct connect process method of claim 7 wherein, After the overlapping structure and the copper wire wound around the overlapping structure in a spiral manner are fused together, the fusion point is spherical.

10. The platinum resistance chip pin arc weld direct connect process method of claim 4 wherein, After installing the positioning block onto the intermediate assembly to obtain the welding positioning device, the method further includes: The welding positioning device is placed on a preset placement rack, which is used to secure the welding positioning device and prevent it from disintegrating during the welding process.

Images