Motherboard assembly and server

Abstract

The application discloses a mainboard assembly and a server, and relates to the technical field of server mainboards, comprising a mainboard, a cold plate and at least one terminal. According to the scheme, the cold plate is used to simultaneously dissipate heat from the processor and the memory card, and the linear distance between the terminal and the processor is limited to 4-5.5 inches, thereby shortening the signal route length of the terminal and the processor, making the terminal closer to the processor, reducing signal transmission loss, and improving signal transmission integrity. In addition, the connector does not interfere with the cold plate during normal plugging, so that the stroke space size of the connector does not need to be additionally reserved, thereby avoiding the increase of the size of the mainboard assembly and ensuring the compactness of the mainboard assembly. Therefore, the application can solve the technical problem that the mainboard assembly is difficult to balance compactness and improve signal integrity, and meet the heat dissipation requirements of the memory board and the processor while achieving the technical effects of improving the compactness and signal integrity of the mainboard assembly.

Description

Technical Field

[0001] This application relates to the field of server motherboard technology, and in particular to a motherboard component and a server. Background Technology

[0002] Liquid-cooled servers dissipate heat by directly contacting the memory modules with a memory cold plate, while simultaneously cooling the CPU (Central Processing Unit) via a central processing unit cold plate. To improve the compactness of the motherboard components, the memory modules and connector interfaces are placed on opposite sides adjacent to the CPU, and the memory cold plate, connected to the CPU cold plate, is led from the connector interface side to the memory modules. Furthermore, with the iterative upgrades of high-speed serial computer expansion bus standards (PCIe, Peripheral Component Interconnect Express), such as PCIe 6.0, transmission rates have reached 64GT / s and above, placing extremely high demands on signal integrity.

[0003] In related technologies, the length of the MCIO connector (Mini Cool Edge I / O) and CPU signal pin traces is typically shortened to optimize the PCIe signal path and improve signal integrity. Specifically, the MCIO connector is designed with an angled shape, such as a 90° bend, extending from under the cold plate to a position close to the CPU. However, the angled connector design requires an additional 25mm of insertion / removal travel space under the cold plate, increasing the overall size of the motherboard assembly. Furthermore, the angled structure increases manufacturing complexity and cannot completely eliminate signal loss, making it difficult to balance compactness and improved signal integrity in the motherboard assembly. Summary of the Invention

[0004] This application provides a motherboard assembly and server to at least solve the problem in the related art where the MCIO connector is designed in the form of a bend, such as a 90° bend, and extends from under the cold plate to a position close to the CPU, which increases the overall size of the motherboard assembly. At the same time, the bend structure of the connector increases the manufacturing complexity and cannot completely eliminate signal loss, making it difficult for the motherboard assembly to achieve both compactness and improved signal integrity.

[0005] This application provides a motherboard component, including:

[0006] The motherboard has a mounting surface for mounting a processor and memory modules, and the mounting surface also has a connection area;

[0007] A cold plate, disposed on the side of the processor away from the motherboard and in contact with the memory module, the orthographic projection of the cold plate on the motherboard covering the area where the processor is located, and at least partially extending into the connection area; and

[0008] At least one terminal block is located in the connection area and electrically connected to the processor, and a connector extends in a direction away from the motherboard. The distance between the terminal block and the processor is L, which satisfies 4 inches ≤ L ≤ 5.5 inches. The connector is used for connector plugging and unplugging, and its extension direction does not overlap with the cold plate.

[0009] This application also provides a server that includes the motherboard component described above.

[0010] This application enables simultaneous heat dissipation for both the processor and memory modules using a cold plate, while limiting the linear distance between the connectors and the processor to between 4 and 5.5 inches. Compared to related technologies, this shortens the signal path length between the connectors and the processor, allowing the connectors to be closer to the processor, reducing signal transmission loss, and improving signal transmission integrity. Furthermore, the connectors are configured such that their extension direction does not overlap with the cold plate. This prevents interference between the connectors and the cold plate during normal insertion and removal, eliminating the need for additional connector travel space and thus avoiding an increase in motherboard component size, ensuring motherboard component compactness. In addition, extending the cold plate to the position directly opposite the connection area increases the cold plate's area, improving its heat dissipation capacity. Moreover, the cold plate and connectors share the space directly opposite the connection area, without occupying additional space to expand the cold plate area, thus improving space utilization.

[0011] Therefore, this application can solve the technical problem that motherboard components are difficult to balance compactness and signal integrity, thereby achieving the technical effect of improving the compactness and signal integrity of motherboard components while meeting the heat dissipation requirements of memory boards and processors. Attached Figure Description

[0012] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of a motherboard assembly provided in one embodiment of this application;

[0014] Figure 2 for Figure 1 A schematic diagram of the processor cold plate and memory cold plate;

[0015] Figure 3 for Figure 1 A schematic diagram showing the motherboard components without memory modules.

[0016] Figure 4 A partial cross-sectional view of a motherboard assembly provided in another embodiment of this application;

[0017] Figure 5 for Figure 4 A cross-sectional view of the fourth terminal block.

[0018] The above figures include the following reference numerals:

[0019] 1. Motherboard; 11. Mounting surface; 12. Connection area; 2. Processor; 3. Memory module; 4. Cold plate; 41. Processor cold plate; 41a. Accommodation gap; 411. Connection side wall; 42. Memory cold plate; 421. Arc segment; 421a. Clearance position; 422. Working section; 5. Terminal block; 51. Connector; 51a. Plug slot; 52. First terminal block; 53. Second terminal block; 54. Fourth terminal block; 55. First side wall; 56. Second side wall; 6. Connector; 7. Power supply VR. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0021] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] It should be noted that during high-speed signal transmission, signal loss becomes a key bottleneck restricting further improvements in PCIe performance. Signal loss manifests in at least two aspects: first, conductor loss, due to the skin effect, high-frequency signals propagate on the conductor surface, the effective cross-sectional area decreases, resistance increases, leading to signal energy attenuation; second, dielectric loss, the insulating dielectric in the signal transmission path absorbs some signal energy, especially at high frequencies, where dielectric loss is more pronounced.

[0024] Therefore, shortening the trace length between the MCIO connector and the CPU signal pins can reduce signal loss caused by conductor loss and dielectric loss, thereby optimizing the PCIe signal path and improving signal integrity.

[0025] Based on the above principles, please refer to Figure 1 and Figure 2 This application provides a motherboard assembly, including a motherboard 1, a cold plate 4, and at least one terminal block 5; the motherboard 1 has a mounting surface 11 on which a processor 2 and a memory module 3 are mounted, and the mounting surface 11 also has a connection area 12; the cold plate 4 is located on the side of the processor 2 away from the motherboard 1 and contacts the memory module 3, the orthographic projection of the cold plate 4 on the motherboard 1 covers the area where the processor 2 is located, and extends at least partially to the connection area 12; at least one terminal block 5 is located in the connection area 12 and is electrically connected to the processor 2, and has a connector 51 extending in a direction away from the motherboard 1, the distance between the terminal block 5 and the processor 2 is L, which satisfies 4 inches ≤ L ≤ 5.5 inches, the connector 51 is used for the insertion and removal of a connector 6, and its extension direction does not overlap with the cold plate 4.

[0026] In this application, the cold plate 4 can simultaneously dissipate heat from both the processor 2 and the memory module 3, and the straight-line distance between the terminal block 5 and the processor 2 is limited to between 4 and 5.5 inches. Compared with related technologies, this shortens the signal path length between the terminal block 5 and the processor 2, allowing the terminal block 5 to be closer to the processor 2, reducing signal transmission loss and improving signal transmission integrity. Furthermore, the connector 51 of the terminal block 5 is configured such that its extension direction does not overlap with the cold plate 4. Thus, the connector 6 will not interfere with the cold plate 4 during normal insertion and removal from the terminal block 5, eliminating the need for additional travel space for the connector 6, thereby avoiding an increase in the size of the motherboard assembly and ensuring its compactness. In addition, extending the cold plate 4 to a position directly opposite the connection area 12 increases the area of ​​the cold plate 4, improving its heat dissipation capacity; furthermore, the cold plate 4 and the terminal block 5 share the space directly opposite the connection area 12, without occupying additional space to expand the area of ​​the cold plate 4, thus improving space utilization.

[0027] Therefore, this application can solve the technical problem that motherboard components are difficult to balance compactness and signal integrity, thereby achieving the technical effect of improving the compactness and signal integrity of motherboard components while meeting the heat dissipation requirements of memory boards and processors.

[0028] It should be understood that, in this design, the extension direction of connector 51 refers to the direction from the initial contact between connector 6 and terminal 5 until connector 6 is fully pressed into terminal 5. That is, the extension direction of connector 51 is the same as the insertion direction of connector 6 after it contacts terminal 5. Furthermore, the extension of connector 51 away from motherboard 1 means that connector 51 can be inclined relative to motherboard 1 or perpendicular to motherboard 1.

[0029] It should be noted that, in another embodiment, the extension direction of the connector 51 coincides with the insertion / removal direction of the connector 6, and the connector 51 is configured such that the connector 6 is offset from the cold plate 4 during the insertion / removal stroke. The insertion / removal direction refers to the direction of movement of the connector 6 from initial contact with the terminal 5 to complete pressing against the terminal 5; correspondingly, the insertion / removal stroke refers to the travel distance of the connector 6 from initial contact with the terminal 5 to complete pressing against the terminal 5. In this embodiment, the extension direction of the connector 51 can intersect with the cold plate 4, but a certain gap between the cold plate 4 and the main board 1 still needs to be increased to meet the dimensional requirements of the insertion / removal stroke of the connector 6, while also ensuring the ease of insertion and removal of the connector 6. Therefore, in this embodiment, even if the connector 51 is tilted relative to the main board 1, compared to the scheme where the extension direction of the connector 51 is offset from the cold plate 4, there is a problem of inconvenience in inserting and removing the connector 6.

[0030] In addition, it should be noted that the connector 51 can be configured as a slot, a plug post or a plug plate, and the mating part of the connector 6 is configured to correspond to the connector 51.

[0031] In one embodiment, the memory module 3 and the connection area 12 are located on opposite sides of the processor 2. The cold plate 4 includes a processor cold plate 41 and a memory cold plate 42. The processor cold plate 41 is located on the side of the processor 2 away from the motherboard 1. The memory cold plate 42 is connected to the side of the processor cold plate 41 adjacent to the connection area 12, and has at least one set of sequentially alternating arc-shaped segments 421 and working segments 422 along the direction away from the processor cold plate 41. The arc-shaped segments 421 bend towards the memory module 3, and the working segments 422 extend towards the memory module 3 and contact the memory module 3. The terminal block 5 is located on the side of the arc-shaped segments 421 away from the processor cold plate 41. Specifically, the pins of the processor 2 are arranged in the connection area 12, and the terminal block 5 is electrically connected to the pins of the processor 2.

[0032] In this embodiment, since the memory cold plate 42 has an arc-shaped segment 421 that bends towards the memory module 3 in the connection area 12, a clearance position 421a is formed on the side of the arc-shaped segment 421 away from the processor 2. When the terminal 5 is placed in the clearance position 421a, the path length between the terminal 5 and the processor 2 is shortened, thereby allowing the connector 6 connected to the terminal 5 to be closer to the processor 2, reducing signal transmission loss and improving signal transmission integrity. At the same time, since the arc-shaped segment 421 avoids the terminal 5, the connector 6 can be directly plugged into and unplugged from the terminal 5 without the need for additional travel space for the connector 6, thus avoiding increasing the size of the motherboard assembly and ensuring the compactness of the motherboard assembly.

[0033] It should be noted that in this embodiment, the extension direction of the connector 51 can be set perpendicular to the motherboard 1, or the extension direction of the connector 51 can be set at an angle relative to the motherboard 1. Preferably, in this solution, the extension direction of the connector 51 is set perpendicular to the motherboard 1. Specifically, by using the arc segment 421 to avoid the terminal block 5, the signal length can be optimized to approximately 4.6 inches.

[0034] It should be understood that in actual production, this application can adjust the arc bending angle and path of the memory cold plate 42 according to the mating position of the connector 6, so that the arc segment 421 of the memory cold plate 42 avoids the layout area of ​​the connector 6, thereby shortening the signal path. The specific steps are as follows: First, place the required connector 6 close to the processor 2. This position is the limit of design and production. After placing it, adjust the position of the memory cold plate 42 to avoid the position of the connector 6, so that the positions of the two just meet the requirements.

[0035] Thus, when multiple terminals 5 are installed in the connection area 12, at least the signal transmission path between the terminal 5 located in the avoidance position 421a and the processor 2 can be guaranteed to meet the requirements, thereby improving the signal transmission integrity between the connector 6 and the processor 2.

[0036] It should be noted that in the relevant technology, based on the spatial layout and heat dissipation requirements of the components on the motherboard assembly, the connection area 12 and the memory module 3 are placed on opposite sides adjacent to the processor 2. Simultaneously, the memory cold plate 42 is connected to the processor cold plate 41, avoiding the need for additional cold plate brackets that would occupy space. The memory cold plate 42 is led from the side of the processor cold plate 41 closest to the connection area 12 to the memory module 3, preventing the memory cold plate 42 from occupying the installation space of the memory module 3. Furthermore, the wiring terminal 5 for the connector 6 is placed in the connection area 12. In this way, the remaining space in the connection area 12, excluding the memory cold plate 42, is fully utilized, preventing the wiring terminal 5 from occupying additional space on other sides of the processor 2, satisfying the spatial layout requirements of the motherboard components, while also meeting the heat dissipation requirements of the memory module 3 and the processor 2, and ensuring the compactness of the motherboard assembly.

[0037] Furthermore, it should be understood that the number of terminals 5 can be set to one or more. In this solution, multiple terminals 5 are provided, and at least one terminal 5 is placed in the clearance position 421a, while the positions of the other terminals 5 can be flexibly adjusted as needed.

[0038] Similarly, one or more sets of arc-shaped segments 421 and working segments 422 can be provided. In this scheme, multiple sets of arc-shaped segments 421 and working segments 422 are provided, and the multiple sets of arc-shaped segments 421 and working segments 422 are arranged alternately in a direction away from the processor cold plate 41. At least one terminal block 5 is provided at the avoidance position 421a of each arc-shaped segment 421 to improve flexibility.

[0039] It should be noted that the processor 2 described above can be configured as at least one of a central processing unit (CPU), a graphics processing unit (GPU), a neural network processing unit (NPU), a deep learning processing unit (DPU), and a tensor processing unit (TPU). Specifically, in this embodiment, the processor 2 is a central processing unit (CPU), and the connector 6 that mates with the terminal block 5 is an MCIO connector.

[0040] Furthermore, it should be noted that the terminal block 5 and the pins of the processor 2 can be electrically connected via an external conductor or via a conductor pre-installed on the motherboard 1. Specifically, in this solution, the terminal block 5 and the processor 2 are electrically connected via a conductor pre-installed on the motherboard 1. The mounting surface 11 of the motherboard 1 refers to the front side of the motherboard 1, i.e., the side with components and interfaces, and has a slot for installing the CPU. The slot is located slightly above the center. During installation, the CPU should be gently placed into the slot to avoid bending the pins, and secured with locking clips. The specific structure and principle of the motherboard 1 are existing technologies and will not be elaborated upon here.

[0041] Furthermore, in the above embodiment, the memory cold plate 42 is connected to the side of the processor cold plate 41 adjacent to the connection area 12, which means that the connection between the memory cold plate 42 and the processor cold plate 41 is located on the side of the processor cold plate 41 closer to the connection area 12.

[0042] In one embodiment, there are two sets of memory modules 3, and each set of memory modules 3 is located on both sides adjacent to the processor 2 with the connection area 12; there are two sets of memory cold plates 42, and the two sets of memory cold plates 42 correspond to the two sets of memory modules 3 respectively. The arc segment 421 of each set bends toward the corresponding memory module 3, and the arc opening faces the processor cold plate 41, and guides the connected working segment 422 to point to the corresponding memory module 3. Each arc segment 421 has a terminal 5 on the side away from the processor cold plate 41.

[0043] In this embodiment, a set of memory modules 3 is provided at each of the opposite ends of the connection area 12, and two sets of memory cooling plates 42 are provided corresponding to the two sets of memory modules 3, that is, the two sets of memory cooling plates 42 are arranged one-to-one with the two sets of memory modules 3. In this way, more clearance positions 421a can be formed in the connection area 12 to lay more wiring terminals 5 that meet the signal transmission requirements, and to meet the spatial layout rationality of the motherboard components, ensuring the compactness of the motherboard components. It should be understood that multiple memory modules 3 are provided in each group, and the multiple memory modules 3 in the same group are arranged sequentially along the layout direction of the processor 2 and the memory modules 3.

[0044] Specifically, in this design, the arc-shaped segments 421 and working segments 422 of each memory cold plate 42 are alternately arranged in two sets. Eight terminals 5 are provided between the two sets of memory cold plates 42, and one terminal 5 is located at the clearance position 421a formed by the arc-shaped segments 421. One terminal 5 is located on the side of each working segment 422 away from the processor 2. This divides the terminals 5 into two groups, corresponding to the two sets of memory cold plates 42, and a voltage regulator (Voltage Regulator, VR) is provided between the two groups of terminals 5. Furthermore, in this embodiment, the processor 2 is rectangular. Two sets of memory modules 3 are placed on opposite sides of the processor 2, and the connection area 12 is located between the two sets of memory modules 3.

[0045] In one embodiment, both the memory cold plate 42 and the processor cold plate 41 have refrigerant channels, and the refrigerant channels of each memory cold plate 42 extend from the arc-shaped section 421 near the processor cold plate 41 to the working section 422 away from the processor cold plate 41, and are connected to the refrigerant channels of the processor cold plate 41; wherein, each memory cold plate 42 has a connection port in the working section 422 away from the processor cold plate 41, and the two connection ports are used to connect a refrigerant source.

[0046] In this embodiment, the refrigerant channel of the memory cold plate 42 is connected to the refrigerant channel of the processor 2, and the refrigerant circulates between the memory cold plate 42 and the processor cold plate 41 through the connection port of the two sets of memory cold plates 42, thereby simplifying the cold plate structure. In addition, refrigerant flows in both the arc-shaped section 421 and the working section 422 in this solution, so that the arc-shaped section 421, which is away from the processor 2, can also contact the memory module 3 and dissipate heat from the memory module 3.

[0047] It should be noted that the coolant for the processor cold plate 41 and the memory cold plate 42 can be either water-based or fluorinated liquid. Water-based coolants include aqueous solutions of ethylene glycol, propylene glycol, or deionized water. Fluorinated liquids, on the other hand, improve heat dissipation efficiency through phase change heat absorption.

[0048] It should be understood that one of the two connection ports mentioned above serves as the refrigerant output port, and the other as the refrigerant source input port. Furthermore, the refrigerant source is typically pumped through pipelines; its specific structure and operating principle are existing technologies and will not be elaborated upon here.

[0049] It should be noted that the memory cold plate 42 and the processor cold plate 41 can be connected by overlapping, soldering or other means.

[0050] In one embodiment, the memory cold plate 42 is integrally connected with the processor cold plate 41.

[0051] In this embodiment, the memory cold plate 42 and the processor cold plate 41 can be integrated on the same metal substrate. Heat conduction is achieved through thermal pads or heat spreaders, and the coolant circulates in a unified flow channel, making the coolant flow channels of the memory cold plate 42 and the processor cold plate 41 continuous. This reduces the piping connections between independent cold plates, lowers the risk of leakage, and reduces maintenance complexity. Furthermore, the memory module 3 and the CPU cold plate share the same cooling medium, improving heat exchange efficiency and avoiding localized hot spots caused by independent heat dissipation of the memory module 3 and the CPU. Simultaneously, the bottom of the cold plate can also dissipate heat from motherboard components such as the power supply VR7, achieving a balanced heat distribution.

[0052] In one embodiment, multiple sets of arc-shaped segments 421 and working segments 422 are provided, and the multiple sets of arc-shaped segments 421 and working segments 422 are arranged alternately in sequence. At least one arc-shaped segment 421 is located in the connection area 12 and has a terminal block 5 on the side away from the processor cold plate 41.

[0053] In this embodiment, multiple sets of arc-shaped segments 421 and working segments 422 are arranged alternately to form more clearance positions 421a, thereby shortening the route length between the corresponding terminal block 5 and the CPU, improving the space utilization of the motherboard 1, and improving the signal transmission integrity at the corresponding positions. Simultaneously, at least one arc-shaped segment 421 is provided in the connection area 12, and the clearance position 421a formed by the arc-shaped segment 421 in the connection area 12 is closest to the processor 2, resulting in better signal integrity for the connector 6 connected there.

[0054] Furthermore, the alternating arc-shaped sections 421 and the working section 422 are integrally connected to reduce the risk of refrigerant leakage and ensure stable refrigerant circulation. Specifically, as mentioned above, in this case, two sets of arc-shaped sections 421 and working sections 422 are arranged alternately.

[0055] It should be noted that in this design, the multiple sets of arc-shaped segments 421 all bend and extend along the layout direction of the processor 2 and the memory module 3. Furthermore, the arc-shaped segments 421 of the subsequent sets are located on the side of the working segment 422 of the preceding sets away from the processor 2, preventing the arc-shaped segments 421 from extending into the area where the memory module 3 is located. This ensures that the avoidance position 421a is formed close to the pins of the processor 2, while also ensuring sufficient space for the memory module 3. In addition, this effectively prevents cross-interference between the signal transmission paths of the connector 6 and the signal transmission paths of the memory module 3.

[0056] Meanwhile, the width of the arc segment 421 and working segment 422 of the preceding group is greater than the width of the arc segment 421 and working segment 422 of the subsequent group, ensuring the connection strength of the memory cold plate 42.

[0057] It should be understood that "preceding" and "following" in the above-mentioned "subsequent group" refer to the direction closer to and farther from the processor cold plate 41. Specifically, the group closer to the processor cold plate 41 is the "presequent group," and the group farther from the processor cold plate 41 is the "subsequent group."

[0058] In one embodiment, the arc-shaped segment 421 near the processor cold plate 41 is directly connected to the processor cold plate 41 and is located in the connection area 12.

[0059] In this embodiment, the arc-shaped segment 421 adjacent to the processor cold plate 41 is directly connected to the processor cold plate 41, avoiding the additional reserved part of the memory cold plate 42 from being connected to the processor cold plate and occupying the space of the connection area 12, and further reducing the distance between the avoidance position 421a and the CPU, thereby shortening the route length between the terminal 5 and the CPU.

[0060] In one embodiment, the length of the working segment 422 is greater than the length of the arc segment 421; multiple terminals 5 are provided, including at least one first terminal 52 and a second terminal 53. The at least one first terminal 52 is located in the connection area 12 and is disposed near the arc segment 421 and is located on the side of the arc segment 421 away from the processor cold plate 41. The second terminal 53 is close to the working segment 422 and is located on the side of the working segment 422 away from the processor cold plate 41.

[0061] In this embodiment, the first terminal 52 is located at the clearance position 421a of the arc segment 421, shortening the path length between the connector 6 connected to the first terminal 52 and the CPU, making it suitable for high-transmission-rate scenarios. The second terminal 53 is located on the side of the working segment 422 away from the processor 2, relatively increasing the path length between the connector 6 connected to the second terminal 53 and the CPU, making it suitable for low-transmission-rate scenarios, fully utilizing the motherboard 1 space, and improving transmission flexibility. Furthermore, due to the larger length of the working segment 422, when the second terminal 53 is adjacent to the working segment 422, it can indirectly dissipate heat through the working segment 422.

[0062] It should be understood that when the distance between terminal 5 and memory cold plate 42 is large, the signal transmission path between connector 6 and CPU will be increased. Conversely, when the distance between terminal 5 and memory cold plate 42 is too small, the risk of crosstalk or mechanical damage caused by physical contact between connector 6 and memory cold plate 42 will increase.

[0063] In one embodiment, the distance between the first terminal 52 and the adjacent arc segment 421 is d1, satisfying 0.5 mm ≤ d1 ≤ 1 mm; and / or, the distance between the second terminal 53 and the adjacent working segment 422 is d2, satisfying 0.5 mm ≤ d2 ≤ 1 mm.

[0064] In this embodiment, a distance of 0.5 mm to 1 mm is reserved between the terminal block 5 and the memory cold plate 42 to avoid interference between the memory cold plate 42 and the connector 6, which could lead to an excessively small bending radius of the signal cable of the connector 6, causing crosstalk or mechanical stress damage. This also avoids excessively lengthening the transmission path between the terminal block 5 and the CPU, reducing the adverse impact on signal transmission integrity. Specifically, in this solution, a distance of 0.7 mm is preferably reserved between the terminal block 5 and the memory cold plate 42.

[0065] It should be understood that if the radius of the arc of the arc segment 421 is too large, it will increase the distance between the avoidance position 421a and the CPU; while if the radius of the arc of the arc segment 421 is too small, it will cause stress concentration in the arc segment 421, increasing the risk of refrigerant leakage.

[0066] In one embodiment, the radius of the arc of the arc segment 421 is r, which satisfies 10 mm ≤ r ≤ 20 mm.

[0067] In this embodiment, the radius of the arc segment 421 is controlled between 10 mm and 20 mm to both shorten the signal transmission path between the terminal 5 and the CPU and improve the mechanical strength of the arc segment 421, thus avoiding stress concentration that could lead to cracks in the arc segment 421. Specifically, in this solution, the radius of the arc segment 421 is preferably 15 mm.

[0068] In one embodiment, the working segment 422 extends along the layout direction of the processor 2 and the memory module 3, and extends to contact the memory module 3.

[0069] In this embodiment, the working segment 422 extends directly toward the memory module 3, and the side of the working segment 422 furthest from the terminal 5 contacts the memory module 3. This increases the number and area of ​​contact between the working segment 422 and the memory module 3, improving the heat dissipation efficiency of the memory module 3. Simultaneously, the linear arrangement of the working segment 422 reduces the space occupied by the memory cold plate 42 on the motherboard 1, improving the compactness of the components. It should be noted that in the attached... Figure 3 In the example, the layout direction of processor 2 and memory module 3 is shown as F1, and the layout direction of processor 2 and connection area 12 is shown as F2.

[0070] It should be understood that when the arc angle of the arc segment 421 is too large, it will occupy too much space, while when the arc angle of the arc segment 421 is too small, the clearance space will be insufficient to install the terminal block 5 and connector 6.

[0071] In one embodiment, the arc angle of the arc segment 421 is α, which satisfies 60°≤α≤90°.

[0072] In this embodiment, the arc angle of the arc segment 421 is controlled between 60° and 90°, which balances reducing the space occupied by the motherboard 1 and meeting the space requirements of the wiring terminals 5. Specifically, in this solution, the arc angle of the arc segment 421 is preferably set to 60°.

[0073] In one embodiment, the side wall of the processor cold plate 41 adjacent to the connection area 12 is a connection side wall 411; the memory cold plate 42 is connected to the connection side wall 411 and is located at the end of the connection side wall 411 near the memory module 3.

[0074] In this embodiment, the connection between the memory cold plate 42 and the connecting sidewall 411 is located at the end of the connecting sidewall 411 near the connecting strip, further reducing the space occupied by the memory cold plate 42 in the connecting area 12. Specifically, in this solution, the arc-shaped segment 421 near the processor cold plate 41 is connected to the end of the connecting sidewall 411 near the memory strip 3, avoiding a gap between the right side of the arc-shaped segment 421 and the processor cold plate 41, improving the connection strength between the two, and thus reducing the risk of breakage between the arc-shaped segment 421 and the processor cold plate 41.

[0075] It should be understood that the arrangement of the memory cold plate 42 to avoid the connection area 12 allows for more high-speed signal interfaces to be accommodated in the connection area 12 of the motherboard 1, thereby improving the server's expansion capabilities.

[0076] In another embodiment, please refer to Figure 4The cold plate 4 and the motherboard 1 are spaced apart to form a receiving gap 41a, which is used to accommodate the processor 2 and has an opening on the side near the connection area 12; at least one terminal 5 is provided in the receiving gap 41a and is located on the side of the receiving gap 41a near the connection area 12, and the connector 51 is inclined from the end near the motherboard 1 to the end away from the motherboard 1 toward the connection area 12.

[0077] Specifically, a receiving gap 41a is formed between the processor cold plate 41 and the motherboard 1; multiple terminals 5 are provided, including at least one third terminal and a fourth terminal 54. The at least one third terminal is located in the connection area 12 and is positioned near the arc segment 421 and on the side of the arc segment 421 away from the processor cold plate 41. The fourth terminal 54 is located in the receiving gap 41a and is positioned on the side of the receiving gap 41a near the connection area 12. The fourth terminal 54 and its connector 51 are inclined towards the connection area 12 from the end near the motherboard 1 to the end away from the motherboard 1.

[0078] In this embodiment, the fourth terminal 54 is installed at an angle below the processor cold plate 41, reducing the insertion / removal travel to 10 mm. This allows for installation below the cold plate, overcoming the limitation that the MCIO connector 6 cannot be placed below the cold plate due to space constraints during insertion / removal. Specifically, in this embodiment, the distance between the connector 6 and the cold plate is set to 16 mm to meet the cable insertion / removal travel requirements. This further shortens the signal transmission path length between the connector 6 and the CPU.

[0079] Specifically, by tilting the connector 51 of terminal 5 as described above, the signal length can be optimized to approximately 4.2 inches. It should be understood that in this design, the tilting direction of terminal 5 and connector 51 is the same.

[0080] Specifically, multiple fourth terminal blocks 54 can be installed in the accommodating gap 41a below the cold plate to accommodate multiple MCIO connectors and enhance the expansion capabilities of the motherboard 1. When multiple fourth terminal blocks 54 are provided, their arrangement direction is parallel to the arrangement direction of the processor 2 and the memory module 3. That is, in this embodiment, the accommodating gap 41a between the processor cold plate 41 and the motherboard 1 simultaneously accommodates the processor 2 and multiple fourth terminal blocks 54, further freeing up installation space below the cold plate.

[0081] It should be noted that the aforementioned third terminal is equivalent to the first terminal 52, both referring to the terminal installed in the clearance position 421a. The specific designations of third terminal and first terminal 52 here are for ease of description. Furthermore, the second terminal 53 refers to the terminal located on the side of the working section 422 away from the memory module 3, and the fourth terminal 54 refers to the terminal located below the processor cold plate 41 and installed at an angle. All four terminals—first terminal 52, second terminal 53, third terminal, and fourth terminal 54—are electrically connected to the pins of the processor 2.

[0082] It should be understood that when the fourth terminal 54 is used alone to shorten the transmission path length between connector 6 and CPU, the design concept of shortening the transmission path length by avoiding position 421a is not adopted, and a through cold plate is used to improve the versatility of the structure.

[0083] In addition, in complex layout scenarios, the curved segment 421 of the memory cold plate 42 can be bent and the fourth terminal 54 can be tilted at the same time to realize the design of the side-insertion connector 6, further shortening the signal path and realizing a compact layout of multiple MCIO connectors.

[0084] It should be noted that the fourth terminal 54 and the corresponding connector 6 can be connected by plugging and unplugging through the socket and post, or by the slot and the connector board.

[0085] In one embodiment, the connector 51 is a plug groove 51a provided on the terminal block 5. The plug groove 51a has a first sidewall 55 away from the processor 2 and a second sidewall 56 close to the processor 2. The height of the first sidewall 55 is less than the height of the second sidewall 56. Specifically, the fourth terminal block 54 has a plug groove 51a.

[0086] For ease of description, the sidewall of the connector 51a furthest from the CPU is defined as the first sidewall 55, and the sidewall of the connector 51a closest to the CPU is defined as the second sidewall 56. In this embodiment, the first sidewall 55 is set to be lower than the second sidewall 56. Thus, when the connector 6's plug plate is inserted into the connector 51a, the side of the connector 6 furthest from the CPU is connected to the CPU pin via the first sidewall 55, and the side of the connector 6 closest to the CPU is connected to the CPU pin via the second sidewall 56.

[0087] Specifically, please refer to Figure 5This design results in the right side of the connector slot 51a being longer than the left. In actual operation, because the right side of the connector 6 in related technologies is closer to the CPU, the trace length from the CPU signal to the connector 6 is shorter, and the length from the left side of the connector 6 to the CPU is 0.2-0.5 inches longer than the right side. Therefore, in this embodiment, the design of the connector slot 51a having a longer right side and a shorter left side can compensate for the problem of the shorter trace length on the right side and the longer trace length on the left side of the connector 6 in related technologies, thereby ensuring a small difference in the transmission rates of a set of signals' RX (receive) and TX (transmit).

[0088] In one embodiment, the size of the insertion slot 51a in the direction of the processor 2 and the memory module 3 is l, and the size of the connection area 12 in the direction of the processor 2 is w, satisfying l≥w.

[0089] It should be noted that in this embodiment, the side with the insertion slot 51a having a length of l and the side with a length of w having a width is arranged along the direction of the processor 2 and the memory module 3, so as to make full use of the space below the processor cold plate 41, improve space utilization, and make the motherboard assembly more compact.

[0090] In one embodiment, the fourth terminal 54 extends in its inclined direction and intersects the edge of the processor cold plate 41 near the connection area 12.

[0091] In this embodiment, the fourth terminal 54 is tilted upwards as described above, so that the connector 6 can move from the edge of the processor cold plate 41 toward the fourth terminal 54. This ensures that the fourth terminal 54 is located below the processor cold plate 41, shortening the signal transmission distance, and also allows for a compact arrangement of the motherboard components. Furthermore, it prevents the fourth terminal 54 from being installed too deeply in the accommodating gap 41a, facilitating the insertion and removal of the connector 6. It should be noted that, based on the above embodiment with the fourth terminal 54 tilted, the interface of the server casing corresponding to the fourth terminal 54 is also tilted, improving connection reliability.

[0092] It should be noted that if the height of the fourth terminal 54 is too high, it will increase the size of the motherboard assembly, while if the height of the fourth terminal 54 is too low, it will cause the connection with the connector 6 to be unstable.

[0093] In one embodiment, the height of the fourth terminal 54 is h1, and the height of the accommodating gap 41a at the location where the fourth terminal 54 is located is h2, satisfying that 6 mm ≤ h1 ≤ 7 mm and 15 mm ≤ h2 ≤ 17 mm.

[0094] In this embodiment, the height of the fourth terminal 54 is controlled to be 6 mm to 7 mm, and the height of the accommodating gap 41a at the location where the fourth terminal 54 is installed is controlled to be 15 mm to 17 mm. This avoids increasing the size of the motherboard assembly while ensuring a stable connection between the fourth terminal 54 and the connector 6. Specifically, in this solution, the height of the fourth terminal 54 is preferably set to 6.5 mm, and the height of the accommodating gap 41a at the location of the fourth terminal 54 is preferably controlled to be 16 mm.

[0095] It should be noted that when the tilt angle of the fourth terminal 54 is too large, the insertion and removal stroke of the connector 6 will still be large, which will not improve the compactness of the motherboard assembly. When the tilt angle of the fourth terminal 54 is too small, space needs to be reserved on the motherboard 1 in the corresponding tilt direction of the fourth terminal 54 to avoid the connector 6, thereby reducing the space utilization of the motherboard 1.

[0096] In one embodiment, the tilt angle of the fourth terminal 54 is β, which satisfies 45°≤β≤70°.

[0097] In this embodiment, the tilt angle of the fourth terminal 54 is controlled between 45° and 70°, which significantly shortens the insertion and removal stroke of the connector 6 and improves the compactness of the motherboard assembly. Simultaneously, it allows for sufficient space between the fourth terminal 54 and the motherboard 1 in the tilt direction, enabling the installation of components of suitable height. These components are located below the fourth terminal 54 and will not interfere with the connector 6, thus improving the space utilization of the motherboard 1. Specifically, in this solution, the tilt angle of the fourth terminal 54 is controlled at 45°.

[0098] Furthermore, this application also provides a server including the motherboard assembly as described above. The specific structure of the motherboard assembly is as described in the above embodiments. Since this server adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0099] In one embodiment, the memory module 3 of the motherboard assembly is located on the side of the working section 422 of the motherboard assembly away from the connection area 12 of the motherboard assembly; the server also includes a mounting part and a cooling fan, the cooling fan and the motherboard 1 of the motherboard assembly are both mounted on the mounting part, and the cooling fan is located on the side of the working section 422 away from the memory module 3, and is used to guide air toward the memory module 3.

[0100] In this embodiment, the cooling fan is positioned on the side of the memory cold plate 42 furthest from the memory module 3. This allows the cooling fan to activate when the overall motherboard temperature is high. In this case, the end of the memory module 3 closest to the working section 422 directly contacts the working section 422 for heat dissipation. Simultaneously, the airflow from the cooling fan first exchanges heat through the memory cold plate 42 before being directed towards the end of the memory module 3 furthest from the cold plate 42, improving the heat dissipation capacity of the memory module 3. Conversely, when the overall motherboard temperature is relatively low, the cooling fan is not activated, and the memory module 3 exchanges heat directly with the working section 422. Furthermore, the processor cold plate 41 and the memory cold plate 42 can also indirectly dissipate heat from components such as the power supply VR7, providing good overall cooling performance.

[0101] It should be noted that, since the memory module 3 in the relevant technology is inserted into the motherboard 1 via a slot, when the memory module 3 is placed on the side of the working section 422 away from the connection area 12, and because the memory cooling plate 42 is arm-shaped and has a certain degree of elastic deformation capability, a certain amount of external force can be applied to move the memory cooling plate 42 away from the installation slot of the memory module 3 before inserting the memory module 3. After the memory module 3 is inserted into place, the memory cooling plate 42 resets and contacts the memory module 3, ensuring the heat dissipation capability of the memory module 3, while not affecting the normal insertion and removal of the memory module 3.

[0102] Furthermore, it should be noted that in this embodiment, the processor cold plate 41 and the memory cold plate 42 are integrally formed and are made of copper or aluminum, combined with an aluminum bracket and stainless steel connectors to enhance durability. Also, the height of the wiring terminal 5 is less than the height of the processor cold plate 41 and the memory cold plate 42.

[0103] It should be understood that the aforementioned mounting part can be configured as a housing, mounting bracket, base, or other form. Specifically, in this solution, the mounting part is configured as a housing, with the motherboard assembly and cooling fan both housed within the housing. The housing also has ventilation openings for airflow and corresponding connection ports for terminal blocks 5.

[0104] The foregoing has provided a detailed description of a motherboard component and server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A motherboard assembly, characterized in that, include: The motherboard (1) has a mounting surface (11) on which a processor (2) and a memory module (3) are installed, and the mounting surface (11) is also provided with a connection area (12). A cold plate (4) is disposed on the side of the processor (2) away from the motherboard (1) and contacts the memory module (3). The orthographic projection of the cold plate (4) on the motherboard (1) covers the area where the processor (2) is located and extends at least partially to the connection area (12). At least one terminal block (5) is provided in the connection area (12) and electrically connected to the processor (2), and a connector (51) extends in a direction away from the motherboard (1). The distance between the terminal block (5) and the processor (2) is L, which satisfies that 4 inches ≤ L ≤ 5.5 inches. The connector (51) is used for the connector (6) to be plugged in and out, and its extension direction does not overlap with the cold plate (4). The cold plate (4) includes a processor cold plate (41) and a memory cold plate (42). The processor cold plate (41) is placed on the side of the processor (2) away from the motherboard (1). The memory cold plate (42) is connected to the side of the processor cold plate (41) adjacent to the connection area (12) and has at least one set of sequentially alternating arc segments (421) and working segments (422) in a direction away from the processor cold plate (41). The arc segments (421) bend toward the memory module (3) and the working segments (422) extend toward the memory module (3) and contact the memory module (3). The terminal block (5) is located on the side of the arc segment (421) away from the processor cold plate (41).

2. The motherboard assembly according to claim 1, characterized in that, The memory module (3) and the connection area (12) are located on opposite sides of the processor (2).

3. The motherboard assembly according to claim 2, characterized in that, The memory module (3) is provided in two groups, and the memory module (3) in each group is located on both sides adjacent to the processor (2) of the connection area (12); The memory cold plate (42) is provided in two sets, and the two sets of memory cold plates (42) correspond to the two sets of memory modules (3) respectively. The arc segment (421) of each set is bent toward the corresponding memory module (3), and the arc opening is toward the processor cold plate (41), and guides the connected working segment (422) to the corresponding memory module (3). Each arc segment (421) is provided with a terminal (5) on the side away from the processor cold plate (41).

4. The motherboard assembly according to claim 3, characterized in that, Both the memory cold plate (42) and the processor cold plate (41) have refrigerant channels, and the refrigerant channels of each memory cold plate (42) extend from the arc-shaped section (421) near the processor cold plate (41) to the working section (422) away from the processor cold plate (41), and are connected to the refrigerant channels of the processor cold plate (41); Each of the memory cold plates (42) has a connection port in the working section (422) away from the processor cold plate (41), and the two connection ports are used to connect to a refrigerant source.

5. The motherboard assembly according to claim 4, characterized in that, The memory cold plate (42) is integrally connected with the processor cold plate (41).

6. The motherboard assembly according to claim 2, characterized in that, The arc segment (421) and the working segment (422) are provided in multiple groups, and the arc segment (421) and the working segment (422) are arranged alternately in sequence. At least one arc segment (421) is located in the connection area (12) and the wiring terminal (5) is provided on the side away from the processor cold plate (41).

7. The motherboard assembly according to claim 6, characterized in that, The arc segment (421) near the processor cold plate (41) is directly connected to the processor cold plate (41) and is located in the connection area (12).

8. The motherboard assembly according to claim 2, characterized in that, The length of the working segment (422) is greater than the length of the arc segment (421); The terminal block (5) is provided in multiple ways. Each terminal block (5) includes at least one first terminal block (52) and a second terminal block (53). At least one first terminal block (52) is located in the connection area (12) and is located near the arc segment (421) and on the side of the arc segment (421) away from the processor cold plate (41). The second terminal block (53) is located near the working section (422) and on the side of the working section (422) away from the processor cold plate (41).

9. The motherboard assembly according to claim 8, characterized in that, The distance between the first terminal (52) and the adjacent arc segment (421) is d1, satisfying that 0.5 mm ≤ d1 ≤ 1 mm; and / or, The distance between the second terminal (53) and the adjacent working section (422) is d2, which satisfies that 0.5 mm ≤ d2 ≤ 1 mm.

10. The motherboard assembly according to claim 2, characterized in that, The radius of the arc of the arc segment (421) is r, which satisfies 10 mm ≤ r ≤ 20 mm.

11. The motherboard assembly according to claim 2, characterized in that, The working segment (422) extends along the layout direction of the processor (2) and the memory module (3) and extends to contact the memory module (3).

12. The motherboard assembly according to claim 11, characterized in that, The arc angle of the arc segment (421) is α, which satisfies 60°≤α≤90°.

13. The motherboard assembly according to claim 2, characterized in that, The side wall of the processor cold plate (41) adjacent to the connection area (12) is the connection side wall (411). The memory cold plate (42) is connected to the connecting sidewall (411) and is located at one end of the connecting sidewall (411) near the memory module (3).

14. The motherboard assembly according to any one of claims 1-13, characterized in that, The cold plate (4) and the motherboard (1) are spaced apart by a accommodating gap (41a), the accommodating gap (41a) is used to accommodate the processor (2), and has an opening on the side near the connection area (12); At least one of the terminals (5) is disposed within the receiving gap (41a) and located on the side of the receiving gap (41a) near the connection area (12), and the connector (51) is tilted towards the connection area (12) from the end near the motherboard (1) to the end away from the motherboard (1).

15. The motherboard assembly according to claim 14, characterized in that, The connector (51) is a plug slot (51a) provided on the terminal block (5). The plug slot (51a) has a first sidewall (55) away from the processor (2) and a second sidewall (56) close to the processor (2). The height of the first sidewall (55) is less than the height of the second sidewall (56).

16. The motherboard assembly according to claim 15, characterized in that, The size of the insertion slot (51a) in the direction of the processor (2) and the memory module (3) is l, and the size of the connection area (12) in the direction of the processor (2) is w, satisfying l≥w.

17. The motherboard assembly according to claim 14, characterized in that, The extension line of the terminal (5) in its inclined direction intersects the edge of the cold plate (4) near the connection area (12).

18. The motherboard assembly according to claim 14, characterized in that, The height of the terminal block (5) is h1, and the height of the accommodating gap (41a) at the location where the terminal block (5) is located is h2, satisfying that 6 mm ≤ h1 ≤ 7 mm and 15 mm ≤ h2 ≤ 17 mm.

19. The motherboard assembly according to claim 14, characterized in that, The tilt angle of the terminal (5) is β, which satisfies 45°≤β≤70°.

20. A server, characterized in that, Includes the motherboard component as described in any one of claims 1 to 19.

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