Heat dissipation structure and electronic equipment
By combining liquid cooling plate components and connecting components, and employing different connection forms and heat dissipation modes, the high temperature problem of heat-generating devices in electronic equipment is solved, achieving effective heat dissipation and enhanced compatibility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-28
- Publication Date
- 2026-04-10
AI Technical Summary
High temperatures in heat-generating components of electronic devices can lead to device damage, and existing technologies struggle to effectively dissipate heat.
By combining liquid cooling plate components and connecting components, and changing the connection form, heat dissipation of heat-generating devices can be effectively achieved. This includes different connection methods for the first and second liquid cooling plates, forming different heat dissipation modes and enhancing heat dissipation area and compatibility.
It achieves effective heat dissipation in electronic devices, increases the compatibility and scalability of the heat dissipation structure, and improves heat dissipation efficiency and space utilization.
Smart Images
Figure CN121843076A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology
[0002] Currently, with the development of electronic devices, the number of heat-generating components in these devices is increasing. These components may include transformers, inductors, and other similar devices. As these components are applied in different power environments, the heat generated per unit time is also increasing, resulting in a greater overall heat generation within the electronic device. The high temperatures generated by these heat-generating components can affect the operation of the electronic device and even cause damage. Therefore, how to effectively dissipate heat from electronic devices has become a crucial issue that needs to be addressed. Summary of the Invention
[0003] This application provides a heat dissipation structure and electronic device that can change the connection form of the liquid cooling plate assembly to effectively dissipate heat from heat-generating devices.
[0004] In a first aspect, a heat dissipation structure is provided, comprising a liquid-cooled plate assembly and a connecting assembly. The liquid-cooled plate assembly includes a first liquid-cooled plate and a second liquid-cooled plate, both having liquid channels for providing a flow path for cooling liquid. The connecting assembly is used to fix the first liquid-cooled plate and the second liquid-cooled plate in a corresponding connection configuration. When a first heating device is disposed between the first liquid-cooled plate and the second liquid-cooled plate, or when the first heating device is disposed on one side of the first liquid-cooled plate or one side of the second liquid-cooled plate, the first liquid-cooled plate and / or the second liquid-cooled plate are thermally conductively connected to the first heating device. The cooling liquid in the liquid channels of the first liquid-cooled plate and / or the second liquid-cooled plate exchanges heat with the first heating device to remove the heat dissipated by the first heating device.
[0005] In one possible implementation, the heat dissipation structure has a first heat dissipation mode and a second heat dissipation mode, and the connection configuration of the first liquid cooling plate and the second liquid cooling plate includes a first connection configuration and a second connection configuration. Specifically, when the first liquid cooling plate and the second liquid cooling plate are in the first connection configuration, the heat dissipation structure is in the first heat dissipation mode; when the first liquid cooling plate and the second liquid cooling plate are in the second connection configuration, the heat dissipation structure is in the second heat dissipation mode.
[0006] In one possible implementation, the first liquid cooling plate has a first connecting portion and a second connecting portion, and the second liquid cooling plate has a third connecting portion and a fourth connecting portion. When the connecting assembly is connected to the first connecting portion and the third connecting portion, the connecting assembly fixes the first liquid cooling plate and the second liquid cooling plate in a first connection configuration, and the first heating element is disposed between the first liquid cooling plate and the second liquid cooling plate. When the connecting assembly is connected to the second connecting portion and the fourth connecting portion, the connecting assembly fixes the first liquid cooling plate and the second liquid cooling plate in a second connection configuration, and the first heating element is disposed on one side of the first liquid cooling plate or one side of the second liquid cooling plate.
[0007] In one possible implementation, when the first liquid cooling plate and the second liquid cooling plate are in the first connection configuration, the first liquid cooling plate and the second liquid cooling plate are spaced apart and disposed opposite to each other, such that the first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate. When the first liquid cooling plate and the second liquid cooling plate are in the second connection configuration, the first liquid cooling plate and the second liquid cooling plate are adjacent to each other and disposed parallel to each other, such that the first heating device is disposed on one side of the first liquid cooling plate or one side of the second liquid cooling plate.
[0008] In one possible implementation, the connecting assembly includes a first connector and a second connector. The first connector has a first connection port and a second connection port, the second connector has a third connection port and a fourth connection port, the third connector has a fifth connection port and a sixth connection port, and the fourth connector has a seventh connection port and an eighth connection port. When the first connector is connected to all four connection ports (first, second, fifth, and sixth), the first liquid cooling plate and the second liquid cooling plate are in the first connection configuration. When the connector is connected to all four connection ports (third, fourth, seventh, and eighth), the first liquid cooling plate and the second liquid cooling plate are in the second connection configuration.
[0009] In one possible implementation, the liquid cooling plate assembly further includes a connecting pipe, the two ends of which are fixedly connected to the first liquid cooling plate and the second liquid cooling plate, respectively. The connecting pipe has a connecting flow channel for connecting the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.
[0010] In one possible implementation, the connecting flow channel includes a first flow channel and a second flow channel, and the liquid flow channel of the first liquid cooling plate includes a third flow channel and a fourth flow channel. The first flow channel connects the third flow channel with the liquid flow channel of the second liquid cooling plate, and the second flow channel connects the fourth flow channel with the liquid flow channel of the second liquid cooling plate. The first liquid cooling plate has an inlet and an outlet. The inlet is connected to the third flow channel, and the outlet is connected to the fourth flow channel. The third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel are sequentially connected between the inlet and the outlet. The inlet is for the cooling liquid to flow into, and the outlet is for the cooling liquid to flow out, such that the cooling liquid flowing in from the inlet flows sequentially through the third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel before flowing out from the outlet.
[0011] In one possible implementation, the connecting channels include a first channel and a second channel, the liquid channels of the first liquid cooling plate include a third channel and a fourth channel, the liquid channels of the second liquid cooling plate include a fifth channel and a sixth channel, the first channel is used to connect the third channel and the fifth channel, and the second channel is used to connect the fourth channel and the sixth channel. The first liquid cooling plate has a water inlet, and the second liquid cooling plate has a water outlet. The water inlet is connected to the third and fourth flow channels, and the water outlet is connected to the fifth and sixth flow channels. The third, first, and fifth flow channels are sequentially connected between the water inlet and the water outlet, and the fourth, second, and sixth flow channels are sequentially connected between the water inlet and the water outlet. The water inlet is used for the cooling liquid to flow in, and the water outlet is used for the cooling liquid to flow out, so that the cooling liquid flowing in from the water inlet flows sequentially through the third, first, and fifth flow channels and then flows out from the water outlet, and the cooling liquid flowing in from the water inlet flows sequentially through the fourth, second, and sixth flow channels and then flows out from the water outlet.
[0012] In one possible implementation, the heat dissipation structure further includes an anti-reverse device connected to the inlet and / or the outlet. The anti-reverse device is used to control the inlet to disconnect from the third flow channel and / or control the outlet to disconnect from the fourth flow channel when it detects that the flow direction of the cooling liquid in the inlet and / or the outlet is opposite to a preset flow direction.
[0013] Secondly, an electronic device is also provided, comprising a first heat-generating device and a heat dissipation structure. The heat dissipation structure is at least used to dissipate heat from the first heat-generating device. The heat dissipation structure includes a liquid-cooled plate assembly and a connecting assembly. The liquid-cooled plate assembly includes a first liquid-cooled plate and a second liquid-cooled plate, both having liquid channels for providing a flow path for cooling liquid. The connecting assembly is used to fix the first liquid-cooled plate and the second liquid-cooled plate in a corresponding connection configuration. Wherein, when the first heat-generating device is disposed between the first liquid-cooled plate and the second liquid-cooled plate, or when the first heat-generating device is disposed on one side of the first liquid-cooled plate or one side of the second liquid-cooled plate, the first liquid-cooled plate and / or the second liquid-cooled plate are thermally conductively connected to the first heat-generating device, and the cooling liquid in the liquid channels of the first liquid-cooled plate and / or the second liquid-cooled plate exchanges heat with the first heat-generating device to remove the heat dissipated by the first heat-generating device.
[0014] The heat dissipation structure and electronic device of this application, by configuring a liquid cooling plate assembly including two liquid cooling plates and configuring a connecting component to fix the two liquid cooling plates in a corresponding connection mode, can change the connection mode of the liquid cooling plate assembly, thereby enabling the liquid cooling plate assembly to effectively dissipate heat from heat-generating devices, increasing the application scenarios of the liquid cooling plate assembly, and having high compatibility and scalability. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.
[0016] Figure 1 This is a schematic diagram from a first perspective of a heat dissipation structure in a first connection configuration in some embodiments of this application.
[0017] Figure 2 This is a schematic diagram from a second perspective of a heat dissipation structure in a first connection configuration in some embodiments of this application.
[0018] Figure 3 This is a schematic diagram from a first perspective of a heat dissipation structure in a second connection configuration in some embodiments of this application.
[0019] Figure 4 This is a schematic diagram of the flow channel of the heat dissipation structure in some embodiments of this application.
[0020] Figure 5 This is another flow path diagram of the heat dissipation structure in some embodiments of this application.
[0021] Figure 6This is a schematic diagram of an electronic device in some embodiments of this application.
[0022] Explanation of reference numerals in the attached drawings: 10, heat dissipation structure; 100, liquid cooling plate assembly; 110, first liquid cooling plate; 131, third flow channel; 132, fourth flow channel; 120, second liquid cooling plate; 141, fifth flow channel; 142, sixth flow channel; 111, water inlet; 112, water outlet; 200, connecting assembly; 210, first connector; 220, second connector; 300, connecting pipe; 330, connecting flow channel; 331, first flow channel; 332, second flow channel; 20, first heating element; 30, second heating element; 1, electronic equipment. Detailed Implementation
[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0024] In the description of the embodiments of this application, it should be noted that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0025] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0026] In the description of the embodiments of this application, it should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.
[0027] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.
[0028] Please refer to the following: Figure 1 , Figure 2 , Figure 1 This is a schematic diagram from a first perspective of a heat dissipation structure in a first connection configuration in some embodiments of this application. Figure 2 This is a schematic diagram from a second perspective of a heat dissipation structure in a first connection configuration in some embodiments of this application. For example... Figure 1 , Figure 2 As shown, this application provides a heat dissipation structure 10, which includes a liquid cooling plate assembly 100 and a connecting assembly 200. The liquid cooling plate assembly 100 includes a first liquid cooling plate 110 and a second liquid cooling plate 120, both of which have liquid flow channels for providing a flow path for the cooling liquid. The connecting assembly 200 is used to fix the first liquid cooling plate 110 and the second liquid cooling plate 120 together in a corresponding connection configuration. When the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, or when the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 are thermally connected to the first heating element 20, and the cooling liquid in the liquid flow channel of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20.
[0029] Therefore, the heat dissipation structure 10 described above in this application, by configuring the liquid cooling plate assembly 100 to include two liquid cooling plates and configuring the connecting component 200 to fix the two liquid cooling plates in a corresponding connection mode, can change the connection mode of the liquid cooling plate assembly 100, thereby enabling the liquid cooling plate assembly 100 to effectively dissipate heat from the heat-generating device, increasing the application scenarios of the liquid cooling plate assembly 100, and having high compatibility and expandability.
[0030] When the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20. When the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20.
[0031] The cooling liquid can be water or other cooling liquids, and this application is not limited to this.
[0032] The first liquid cooling plate 110 and the second liquid cooling plate 120 can be processed by aluminum extrusion molding, and the water channel is integrally formed, which is more convenient and simpler than other water channel processing methods.
[0033] Please refer to the following: Figure 3 , Figure 3 This is a schematic diagram from a first perspective of a heat dissipation structure in a second connection configuration in some embodiments of this application. For example... Figure 1 , Figure 2 , Figure 3 As shown, the heat dissipation structure 10 has a first heat dissipation mode and a second heat dissipation mode, and the connection configuration of the first liquid cooling plate 110 and the second liquid cooling plate 120 includes a first connection configuration and a second connection configuration. Specifically, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection configuration, the heat dissipation structure 10 is in the first heat dissipation mode; when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection configuration, the heat dissipation structure 10 is in the second heat dissipation mode.
[0034] Therefore, the heat dissipation structure 10 described above in this application can provide different connection forms of the liquid cooling plate assembly 100 for different heat dissipation modes, thereby providing a larger heat dissipation area under the volume constraints of the electronic device 1, so as to achieve a better heat dissipation effect for the heat-generating device.
[0035] like Figure 1 , Figure 2 , Figure 3As shown, the first liquid cooling plate 110 has a first connecting portion and a second connecting portion, and the second liquid cooling plate 120 has a third connecting portion and a fourth connecting portion. When the connecting assembly 200 is connected to the first connecting portion and the third connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a first connection state, and the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the connecting assembly 200 is connected to the second connecting portion and the fourth connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a second connection state, and the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120.
[0036] Therefore, in this application, when the connecting component 200 is connected to different connecting parts, the liquid cooling plate assembly 100 is in the corresponding connection mode of the heat dissipation structure 10.
[0037] like Figure 1 , Figure 2 , Figure 3 As shown, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection state, the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and arranged opposite to each other, so that the first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection state, the first liquid cooling plate 110 and the second liquid cooling plate 120 are adjacent and arranged parallel to each other, so that the first heating device 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120.
[0038] Therefore, the heat dissipation structure 10 described above in this application, in such a way... Figure 1 , Figure 2 When the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and opposite to each other, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are stacked and parallel, the first heating element 20 can be disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, which can increase the heat dissipation contact area of the first heating element 20 and improve the utilization rate of heat dissipation space. And as shown in... Figure 3 When the first liquid cooling plate 110 and the second liquid cooling plate 120 are arranged adjacent to each other and in parallel, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are arranged side by side and in parallel, the first heating device 20 can be arranged on one side of the first liquid cooling plate 110 or on one side of the second liquid cooling plate 120, which can provide better heat dissipation function according to the type of the first heating device 20, for example when the volume of the first heating device 20 is large.
[0039] Among them, such as Figure 2As shown, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection state, the second heating device 30 may also be disposed on the side of the first liquid cooling plate 110 away from the second liquid cooling plate 120, and / or on the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110.
[0040] When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection state, the first heating device 20 can also be disposed on one side of the first liquid cooling plate 110 and one side of the second liquid cooling plate 120. The first heating device 20 can also be disposed on the other side of the first liquid cooling plate 110 or the other side of the second liquid cooling plate 120.
[0041] Therefore, the heat dissipation structure 10 described above in this application allows for the placement of heat-generating devices on both sides of the two liquid cooling plates, greatly increasing the placement area of the first heat-generating device 20.
[0042] like Figure 1 , Figure 2 , Figure 3 As shown, the connecting assembly 200 includes a first connector 210 and a second connector 220. The first connecting portion has a first connection port and a second connection port, the second connecting portion has a third connection port and a fourth connection port, the third connecting portion has a fifth connection port and a sixth connection port, and the fourth connecting portion has a seventh connection port and an eighth connection port. When the first connector 210 is connected to all four connection ports (first, second, fifth, and sixth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a first connection state; when the connector is connected to all four connection ports (third, fourth, seventh, and eighth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a second connection state.
[0043] Therefore, the heat dissipation structure 10 described above in this application can better fix the connection form of the liquid cooling plate assembly 100 through two connectors, resulting in better structural stability.
[0044] Among them, the first to eighth connection ports can be threaded connection ports, and the first connector 210 and the second connector 220 can be threadedly connected to the corresponding connection ports through threaded fasteners.
[0045] like Figure 1 , Figure 2 , Figure 3As shown, the liquid cooling plate assembly 100 also includes a connecting pipe 300, the two ends of which are fixedly connected to the first liquid cooling plate 110 and the second liquid cooling plate 120, respectively. The connecting pipe 300 has a connecting flow channel 330, which connects the liquid flow channels of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0046] Therefore, the heat dissipation structure 10 described above in this application, by providing connecting pipes and its connecting flow channel 330, can connect the liquid flow channels of the first liquid cooling plate 110 and the second liquid cooling plate 120, thereby forming a complete water circuit system.
[0047] Among them, the connecting pipe 300 is a flexible hose, that is, the connecting pipe 300 is deformable.
[0048] Please see Figure 4 , Figure 4 This is a schematic diagram of the flow channel of the heat dissipation structure in some embodiments of this application. For example... Figure 4 As shown, the connecting channel 330 includes a first channel 331 and a second channel 332, and the liquid channel of the first liquid cooling plate 110 includes a third channel 131 and a fourth channel 132. The first channel 331 is used to connect the third channel 131 with the liquid channel of the second liquid cooling plate 120, and the second channel 332 is used to connect the fourth channel 132 with the liquid channel of the second liquid cooling plate 120. The first liquid cooling plate 110 has an inlet 111 and an outlet 112. The inlet 111 is connected to the third flow channel 131, and the outlet 112 is connected to the fourth flow channel 132. The third flow channel 131, the first flow channel 331, the liquid flow channel of the second liquid cooling plate 120, the second flow channel 332, and the fourth flow channel 132 are sequentially connected between the inlet 111 and the outlet 112. The inlet 111 is used for the inflow of cooling liquid, and the outlet 112 is used for the outflow of cooling liquid, so that the cooling liquid flowing in from the inlet 111 flows sequentially through the third flow channel 131, the first flow channel 331, the liquid flow channel of the second liquid cooling plate 120, the second flow channel 332, and the fourth flow channel 132, and then flows out from the outlet 112.
[0049] Please see Figure 5 , Figure 5 This is another flow path diagram of the heat dissipation structure in some embodiments of this application. For example... Figure 5As shown, the connecting channel 330 includes a first channel 331 and a second channel 332, the liquid channel of the first liquid cooling plate 110 includes a third channel 131 and a fourth channel 132, and the liquid channel of the second liquid cooling plate 120 includes a fifth channel 141 and a sixth channel 142. The first channel 331 is used to connect the third channel 131 and the fifth channel 141, and the second channel 332 is used to connect the fourth channel 132 and the sixth channel 142. The first liquid cooling plate 110 has a water inlet 111, and the second liquid cooling plate 120 has a water outlet 112. The water inlet 111 is connected to the third flow channel 131 and the fourth flow channel 132, and the water outlet 112 is connected to the fifth flow channel 141 and the sixth flow channel 142. The third flow channel 131, the first flow channel 131, and the fifth flow channel 141 are sequentially connected between the water inlet 111 and the water outlet 112, and the fourth flow channel 132, the second flow channel 332, and the sixth flow channel 142 are sequentially connected. A passage is formed between the inlet 111 and the outlet 112. The inlet 111 is used for the inflow of cooling liquid, and the outlet 112 is used for the outflow of cooling liquid. The cooling liquid flowing in from the inlet 111 flows through the third channel 131, the first channel 331, and the fifth channel 141 in sequence, and then flows out from the outlet 112. The cooling liquid flowing in from the inlet 111 flows through the fourth channel 132, the second channel 332, and the sixth channel 142 in sequence, and then flows out from the outlet 112.
[0050] Therefore, the heat dissipation structure 10 described above in this application, by configuring the connecting pipes and the internal flow channels of the two liquid cooling plates, can connect the independent internal flow channels of the connecting pipes and the two liquid cooling plates, reduce the number of external water inlets 111 and outlets 112, and simplify external operation.
[0051] The inlet 111 and outlet 112 are mainly connected by pipes. The internal flow channels can be directly made of aluminum extrusion channels or processed on aluminum extrusion channels. Through secondary processing of the internal water channels of the two liquid cooling plates, the internal flow channels of the two liquid cooling plates can be connected in series and parallel, making the internal flow channel design of the two liquid cooling plates more diverse.
[0052] In some embodiments, the heat dissipation structure 10 further includes an anti-reverse device connected to the inlet 111 and / or the outlet 112. The anti-reverse device is used to control the inlet 111 to disconnect from the third flow channel 131 and / or control the outlet 112 to disconnect from the fourth flow channel 132 when the flow direction of the cooling liquid in the inlet 111 and / or the outlet 112 is detected to be opposite to the preset flow direction.
[0053] Therefore, the heat dissipation structure 10 described above in this application, by setting an anti-reverse device, can determine whether the flow direction of the cooling liquid is the same as or opposite to the preset flow direction, and when the flow direction is determined to be opposite, the inlet 111 is disconnected from the third flow channel 131 and / or the outlet 112 is disconnected from the fourth flow channel 132, so as to ensure the safe and stable operation of the heat dissipation structure 10.
[0054] In some embodiments, the anti-reverse device is connected to the inlet 111. The anti-reverse device is used to control the inlet 111 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0055] Therefore, the heat dissipation structure 10 described above in this application, by configuring an anti-reverse device connected to the inlet 111 and controlling the inlet 111 to disconnect from the liquid flow channel, can prevent overheated cooling liquid in the liquid flow channel from being unable to flow out through the outlet 112 when the cooling liquid is reversed or the flow rate of the cooling liquid is low, thereby further affecting the heat dissipation of the heat-generating device and further ensuring the safe and stable operation of the heat dissipation structure 10.
[0056] In some embodiments, the anti-reverse device includes a regulating valve connected to the inlet 111. The regulating valve is used to disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0057] Therefore, the heat dissipation structure 10 described above in this application, by setting an adjustment valve, can not only disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, but also disconnect the connection between the inlet 111 and the liquid flow channel when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0058] The regulating valve can be a lift-type or swing-type check valve. The check valve can be equipped with springs, slow-closing devices, etc., to automatically disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction. It can also automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow rate of the cooling liquid in the inlet 111. Furthermore, when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, it can automatically disconnect the connection between the inlet 111 and the liquid flow channel according to the parameter settings of the spring and slow-closing device. The regulating valve can also be a self-operated regulating valve, such as a flow control valve, which can automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow direction and flow rate of the cooling liquid in the inlet 111 to achieve the above functions.
[0059] In some embodiments, the anti-reverse device further includes a controller and a flow meter. The flow meter is connected to the inlet 111, and the controller is connected to both the regulating valve and the flow meter. The flow meter is used to obtain the flow rate of the cooling liquid in the inlet 111. The controller is used to determine the flow direction and flow rate of the cooling liquid based on the flow rate obtained by the flow meter. When the flow direction of the cooling liquid in the inlet 111 is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, the controller controls the regulating valve to disconnect, thereby breaking the connection between the inlet 111 and the liquid flow channel.
[0060] Therefore, the heat dissipation structure 10 described above in this application, by setting a controller and a flow meter, can accurately determine the flow direction and flow rate of the cooling liquid in an electronically controlled manner, and control the disconnection of the regulating valve when the preset conditions are met, thereby electronically disconnecting the connection between the water inlet 111 and the liquid flow channel.
[0061] When the anti-reverse device also includes a controller, the regulating valve can be an electric shut-off valve, a pneumatic shut-off valve, or an electrically controlled ball valve.
[0062] Specifically, when the flow velocity of the cooling liquid in the inlet 111 obtained by the flow meter is negative, it is determined that the flow direction of the cooling liquid is opposite to the preset direction.
[0063] The controller can be a general-purpose processor such as a central processing unit (CPU), or a digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, discrete gate logic devices, transistor logic devices, or microprocessors such as micro control units (MCUs).
[0064] The controller is also used to continuously acquire the heat generated by the first heating device 20 per unit time, and when the heat generated by the first heating device 20 per unit time is less than the preset heat, control the flow meter to acquire the flow rate of the cooling liquid in the inlet 111.
[0065] The housing structure includes a connected outer shell and a side plate assembly. The outer shell is a cylindrical structure with openings at both ends. The side plate assembly is used to cover the two openings of the cylindrical structure. The outer shell and the side plate assembly are used to cooperate to form a receiving space to accommodate the first heating device 20. The outer shell has a filling port on its side peripheral wall.
[0066] Therefore, the heat dissipation structure 10 described above in this application forms a six-sided enclosure space through the outer shell and side plate assembly. There is only one enclosure space, which can be formed by only the outer shell and side plate assembly. Moreover, the enclosure space can be used for potting heat dissipation, which simplifies the structural design and can effectively save costs.
[0067] Furthermore, the space can be used to house multiple magnetic cores, which can be arranged side by side.
[0068] The portion of the outer casing with a filling port on its side wall is fixedly connected to the liquid cooling plate assembly 100, so that the liquid cooling plate assembly 100 and the heat transfer medium can come into contact and exchange heat through the filling port.
[0069] Therefore, the heat dissipation structure 10 described above in this application enables the liquid cooling plate assembly 100 to contact and exchange heat with the heat-conducting medium inside the shell structure through the potting port.
[0070] In some embodiments, the volume of the shell structure is smaller than the volume of the receiving cavity, and the space outside the shell structure within the receiving cavity is filled with a heat-conducting medium. The heat-conducting medium outside the shell structure and the heat-conducting medium inside the shell structure are thermally connected through a potting port.
[0071] The shell structure can be made of thermally conductive material, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 can also be thermally connected to the first heating device 20 through the shell structure.
[0072] Furthermore, the first heating element 20 is a transformer, which includes a magnetic core and a first winding sleeved on the magnetic core. There are two potting openings, with each end of the first winding extending out of the outer casing through one of the two potting openings.
[0073] Therefore, the heat dissipation structure 10 described above in this application can also be used for the lead wires at both ends of the first winding to connect with other circuit structures.
[0074] Specifically, by using two filling ports for filling, the internal heat-conducting medium can be made more uniform, and the gaps between the magnetic core and the outer shell, and between the magnetic core and the core tube, can be completely covered and filled by the heat-conducting medium to improve the heat dissipation effect.
[0075] The magnetic core has a ring-shaped cross-section. The side plate assembly includes two side sealing plates, each of which includes a connected side shell and a core tube. Each side shell is used to cover one of the openings of the cylindrical structure, and when the two side shells cover the two openings of the cylindrical structure, the two core tubes extend into the magnetic core in an alternating manner.
[0076] Therefore, the heat dissipation structure 10 described above in this application can cover the two openings of the cylindrical structure by configuring the side shell, and can serve as the second winding of the first heating device 20 by configuring the two core tubes to extend into the magnetic core in an alternating manner.
[0077] The first winding can be the primary winding, and the second winding can be the secondary winding.
[0078] Furthermore, each side shell has a through-hole, each through-hole corresponding to the core tube of the other side shell, and each through-hole is used for the core tube of the other side shell to extend out.
[0079] Therefore, the heat dissipation structure 10 described above in this application can be configured with a through-hole so that the two core tubes extending from the through-hole can be connected to other circuit structures.
[0080] Furthermore, the housing structure also includes two sealing elements, each used to seal the gap between the corresponding through-hole and the core tube.
[0081] Therefore, the heat dissipation structure 10 described above in this application can block the gap between the corresponding through-hole and the core tube by configuring a sealing component, thereby preventing the heat transfer medium from flowing out of the through-hole.
[0082] In some embodiments, the thermally conductive medium can be potting compound or other media, as long as it can achieve the corresponding function.
[0083] In some embodiments, the housing can serve as the center tap of the transformer.
[0084] Furthermore, the outer shell can be manufactured using aluminum extrusion technology, and the side walls of the outer shell can be cut according to the number of internal magnetic cores to obtain the required length of side walls, resulting in high compatibility.
[0085] Furthermore, there are multiple first heating elements 20, and the number of housing structures corresponds to the number of first heating elements 20. At least one housing structure has a different orientation of its filling port than the other housing structures.
[0086] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure to be different from the orientation of the filling port of the other housing structures, thereby further improving the heat dissipation effect.
[0087] Furthermore, there are two first heating elements 20, and the number of housing structures corresponds to the number of first heating elements 20. One housing structure has its filling port facing the first liquid cooling plate 110, and the other housing structure has its filling port facing the second liquid cooling plate 120.
[0088] Furthermore, the number of first heating devices 20 is greater than two, and except for the shell structure with the filling port facing the first liquid cooling plate 110 or the second liquid cooling plate 120, the filling ports of other shell structures face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0089] Therefore, the heat dissipation structure 10 described above in this application controls the flow meter to obtain the flow rate of the cooling liquid in the inlet 111 to be greater than a preset threshold when the operating power is low, and can determine the state of the cooling liquid before the power is increased, so as to ensure the safe and stable operation of the product.
[0090] Specifically, by continuously acquiring the heat generated by the first heating device 20 per unit time, the controller can determine the operating power of the first heating device 20. When the heat generated by the first heating device 20 per unit time is less than the preset heat, it can be determined that the operating power of the first heating device 20 is low. At this time, the controller can control and adjust the flow rate of the cooling liquid in the inlet 111 to obtain the flow rate of the flow meter, which makes it less likely to damage the heating device.
[0091] Furthermore, the controller can continuously obtain the power value of the first heating device 20 to continuously determine the heat generated by the first heating device 20 per unit time.
[0092] The controller can also issue a fault signal when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, so as to remind that the cooling liquid is reversed or the flow rate of the cooling liquid is too low.
[0093] The controller can also be used to control the first heating device 20 to stop working when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0094] Furthermore, the controller can be connected to the first heating device 20 to continuously acquire the heat generated by the first heating device 20 per unit time and control the first heating device 20 to stop working.
[0095] In some embodiments, the heat dissipation structure 10 further includes a housing structure, which is connected to both the first liquid cooling plate 110 and the second liquid cooling plate 120. The first heating device 20 is disposed in the housing structure, such that the first heating device 20 is fixedly disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. The housing structure has a filling port, and the heat dissipation structure 10 further includes a heat-conducting medium, which has at least a fluid form and a solid form. The filling port is used to allow the fluid form of the heat-conducting medium to flow into the housing structure. After the heat-conducting medium solidifies, it encapsulates the first heating device 20 within the housing structure. The first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating device 20 at least through the heat-conducting medium located within the housing structure.
[0096] Therefore, the heat dissipation structure 10 described above in this application, by setting the shell structure, can not only fix the first heating device 20 in the corresponding position, but also conduct heat to the first heating device 20 through the encapsulated heat-conducting medium, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating device 20 at least through the heat-conducting medium located in the shell structure, which can further improve the heat dissipation effect.
[0097] The number of first heating elements 20 is multiple, and the number of housing structures corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure differs from the orientation of the filling ports of the other housing structures.
[0098] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure to be different from the orientation of the filling port of the other housing structures, thereby further improving the heat dissipation effect.
[0099] Furthermore, there are two first heating elements 20, and the number of housing structures corresponds to the number of first heating elements 20. One housing structure has its filling port facing the first liquid cooling plate 110, and the other housing structure has its filling port facing the second liquid cooling plate 120.
[0100] Furthermore, the number of first heating devices 20 is greater than two, and except for the shell structure with the filling port facing the first liquid cooling plate 110 or the second liquid cooling plate 120, the filling ports of other shell structures face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0101] In some embodiments, the heat generated by the heating device per unit time can be the heat loss of the heating device. That is, the unit time can be selected according to specific needs to obtain the heat loss of the heating device.
[0102] In some embodiments, the anti-reverse device may be disposed between the liquid flow channel of the first liquid cooling plate 110 and the water inlet 111 to block the connection between the water inlet 111 and the liquid flow channel of the first liquid cooling plate 110 in a timely manner.
[0103] In some embodiments, the heat generated by the second heating device 30 per unit time is less than the heat generated by the first heating device 20 per unit time.
[0104] Therefore, the heat dissipation structure 10 described above in this application can place the first heating device 20 with high heat loss between the two liquid cooling plates, increase the thermal contact area between the first heating device 20 and the liquid cooling plates, improve the heat dissipation effect, effectively control the internal temperature difference of the first heating device 20, make the internal temperature field of the first heating device 20 more uniform, reduce the heat loss of the first heating device 20 to a certain extent, improve the working efficiency of the first heating device 20, and can place the second heating device 30 with lower heat loss outside the two liquid cooling plates, making full use of the heat dissipation contact area of the two liquid cooling plates.
[0105] Furthermore, the side of the first liquid cooling plate 110 facing away from the second liquid cooling plate 120 also has a first mounting portion for mounting the second heating device 30, and / or, the side of the second liquid cooling plate 120 facing away from the first liquid cooling plate 110 also has a second mounting portion for mounting the second heating device 30.
[0106] Therefore, the heat dissipation structure 10 described above in this application can provide multiple positions for mounting the second heat-generating device 30 through the first mounting portion and / or the second mounting portion.
[0107] The heat dissipation structure 10 of this application can change the connection form of the liquid cooling plate assembly 100 through the above structure, thereby enabling the liquid cooling plate assembly 100 to effectively dissipate heat from the heat-generating device, increasing the application scenarios of the liquid cooling plate assembly 100, and having high compatibility and scalability.
[0108] Please see Figure 6 , Figure 6 This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 6 As shown, this application also provides an electronic device 1, which includes a first heat-generating device 20 and a heat dissipation structure 10 as described in any of the foregoing embodiments. The heat dissipation structure 10 is at least used to dissipate heat from the first heat-generating device 20.
[0109] Please refer to it again. Figure 1 .like Figure 1As shown, the heat dissipation structure 10 includes a liquid cooling plate assembly 100 and a connecting assembly 200. The liquid cooling plate assembly 100 includes a first liquid cooling plate 110 and a second liquid cooling plate 120, both of which have liquid flow channels to provide a flow path for the cooling liquid. The connecting assembly 200 is used to fix the first liquid cooling plate 110 and the second liquid cooling plate 120 in a corresponding connection configuration. When the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, or when the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 are thermally conductively connected to the first heating element 20. The cooling liquid in the liquid flow channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat dissipated by the first heating element 20.
[0110] For a more specific description of the heat dissipation structure 10, please refer to the relevant content of the heat dissipation structure 10 in any of the foregoing embodiments, which will not be repeated here.
[0111] In some embodiments, the electronic device 1 may further include a second heating device 30. The first heating device 20 may be an electronic device such as a transformer or inductor, and the second heating device 30 may be an electronic device such as a resistor, transistor, or diode.
[0112] In some embodiments, electronic device 1 may be a medium frequency power supply device, a radio frequency power supply device, or other power supply devices, such as a DC power supply device, an AC power supply device, etc.
[0113] The heat dissipation structure 10 and electronic device 1 of this application can change the connection form of the liquid cooling plate assembly 100 through the above structure, thereby enabling the liquid cooling plate assembly 100 to effectively dissipate heat from heat-generating devices, increasing the application scenarios of the liquid cooling plate assembly 100, and having high compatibility and expandability, so as to improve the product competitiveness of electronic device 1.
[0114] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A heat dissipation structure, characterized in that, include: A liquid cooling plate assembly includes a first liquid cooling plate and a second liquid cooling plate, both of which have liquid flow channels for providing a flow path for cooling liquid. A connecting component is used to fix the first liquid cooling plate and the second liquid cooling plate together in a corresponding connection configuration. Wherein, when the first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate, or when the first heating device is disposed on one side of the first liquid cooling plate or one side of the second liquid cooling plate, the first liquid cooling plate and / or the second liquid cooling plate are thermally connected to the first heating device, and the cooling liquid in the liquid flow channel of the first liquid cooling plate and / or the second liquid cooling plate exchanges heat with the first heating device to remove the heat emitted by the first heating device.
2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure has a first heat dissipation mode and a second heat dissipation mode, and the connection form of the first liquid cooling plate and the second liquid cooling plate includes a first connection form and a second connection form. Specifically, when the first liquid cooling plate and the second liquid cooling plate are in the first connection state, the heat dissipation structure is in the first heat dissipation mode; when the first liquid cooling plate and the second liquid cooling plate are in the second connection state, the heat dissipation structure is in the second heat dissipation mode.
3. The heat dissipation structure according to claim 2, characterized in that, The first liquid cooling plate has a first connecting portion and a second connecting portion, and the second liquid cooling plate has a third connecting portion and a fourth connecting portion; When the connecting component is connected to the first connecting part and the third connecting part, the connecting component fixes the first liquid cooling plate and the second liquid cooling plate in the first connection state, and the first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate; when the connecting component is connected to the second connecting part and the fourth connecting part, the connecting component fixes the first liquid cooling plate and the second liquid cooling plate in the second connection state, and the first heating device is disposed on one side of the first liquid cooling plate or one side of the second liquid cooling plate.
4. The heat dissipation structure according to claim 3, characterized in that, When the first liquid cooling plate and the second liquid cooling plate are in the first connection state, the first liquid cooling plate and the second liquid cooling plate are spaced apart and arranged opposite to each other, so that the first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate. When the first liquid cooling plate and the second liquid cooling plate are in the second connection state, the first liquid cooling plate and the second liquid cooling plate are arranged adjacent to each other and parallel to each other, so that the first heating device is disposed on one side of the first liquid cooling plate or one side of the second liquid cooling plate.
5. The heat dissipation structure according to claim 3, characterized in that, The connecting component includes a first connector and a second connector. The first connecting part has a first connection port and a second connection port. The second connecting part has a third connection port and a fourth connection port. The third connecting part has a fifth connection port and a sixth connection port. The fourth connecting part has a seventh connection port and an eighth connection port. Specifically, when the first connector is connected to the first connection port, the second connection port, the fifth connection port, and the sixth connection port, the first liquid cooling plate and the second liquid cooling plate are in the first connection state; when the connector is connected to the third connection port, the fourth connection port, the seventh connection port, and the eighth connection port, the first liquid cooling plate and the second liquid cooling plate are in the second connection state.
6. The heat dissipation structure according to claim 1, characterized in that, The liquid cooling plate assembly also includes a connecting pipe, the two ends of which are fixedly connected to the first liquid cooling plate and the second liquid cooling plate, respectively. The connecting pipe has a connecting flow channel, which is used to connect the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.
7. The heat dissipation structure according to claim 6, characterized in that, The connecting flow channel includes a first flow channel and a second flow channel. The liquid flow channel of the first liquid cooling plate includes a third flow channel and a fourth flow channel. The first flow channel is used to connect the third flow channel with the liquid flow channel of the second liquid cooling plate. The second flow channel is used to connect the fourth flow channel with the liquid flow channel of the second liquid cooling plate. The first liquid cooling plate has an inlet and an outlet. The inlet is connected to the third flow channel, and the outlet is connected to the fourth flow channel. The third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel are sequentially connected between the inlet and the outlet. The inlet is used for the cooling liquid to flow in, and the outlet is used for the cooling liquid to flow out, so that the cooling liquid flowing in from the inlet flows sequentially through the third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel before flowing out from the outlet.
8. The heat dissipation structure according to claim 6, characterized in that, The connecting channels include a first channel and a second channel. The liquid channels of the first liquid cooling plate include a third channel and a fourth channel. The liquid channels of the second liquid cooling plate include a fifth channel and a sixth channel. The first channel is used to connect the third channel and the fifth channel. The second channel is used to connect the fourth channel and the sixth channel. The first liquid cooling plate has a water inlet, and the second liquid cooling plate has a water outlet. The water inlet is connected to the third and fourth flow channels, and the water outlet is connected to the fifth and sixth flow channels. The third, first, and fifth flow channels are sequentially connected between the water inlet and the water outlet, and the fourth, second, and sixth flow channels are sequentially connected between the water inlet and the water outlet. The water inlet is used for the cooling liquid to flow in, and the water outlet is used for the cooling liquid to flow out, so that the cooling liquid flowing in from the water inlet flows sequentially through the third, first, and fifth flow channels and then flows out from the water outlet, and the cooling liquid flowing in from the water inlet flows sequentially through the fourth, second, and sixth flow channels and then flows out from the water outlet.
9. The heat dissipation structure according to claim 7 or 8, characterized in that, The heat dissipation structure also includes an anti-reverse device, which is connected to the water inlet and / or the water outlet. The anti-reverse device is used to control the water inlet to disconnect from the third flow channel and / or control the water outlet to disconnect from the fourth flow channel when it detects that the flow direction of the cooling liquid in the water inlet and / or the water outlet is opposite to the preset flow direction.
10. An electronic device, characterized in that, include: First heating element; The heat dissipation structure as described in any one of claims 1-9 is at least used for dissipating heat from the first heat-generating device.