Method for preventing heat dissipation piece of printed circuit board from being adhered and printed circuit board

Abstract

The invention relates to the field of printed circuit boards, and discloses a method for preventing a heat dissipation piece of a printed circuit board from being adhered and the printed circuit board, and the method for preventing the heat dissipation piece of the printed circuit board from being adhered comprises the steps: providing a laminated board and a heat dissipation piece, the laminated board comprises at least two sub-boards and a connecting layer located between the two adjacent sub-boards, the heat dissipation piece comprises a first part and a second part which are connected with each other, the first part is located inside the laminated plate, the second part is located outside the laminated plate, the arrangement direction of the first part and the second part is perpendicular to the arrangement direction of the daughter board and the connecting layer, and the second part is wrapped with a protective sleeve; the laminated board is pressed, so that the connecting layer is melted and then solidified, and the daughter board, the heat dissipation piece and the solidified connecting layer are connected; and removing the protective sleeve. The method for preventing the embedded copper block of the printed circuit board from adhering and the printed circuit board provided by the invention are used for preventing the surface of the heat dissipation piece exposed out of the printed circuit board from adhering.

Description

Technical Field

[0001] This application relates to the field of printed circuit boards, and more particularly to a method for preventing adhesive from sticking to the heat sink of a printed circuit board and a printed circuit board. Background Technology

[0002] With the development of the communications field, more and more printed circuit board (PCB) products in this field need to use heat sinks such as embedded copper blocks for heat dissipation. To save space, current PCBs mainly use two types of embedded heat sinks: through-type and non-through-type. Non-through-type embedded heat sinks typically employ a design where part of the heat sink is embedded within the PCB, while another part is exposed for heat dissipation. This design avoids contact with external components to prevent short circuits caused by solder joints.

[0003] Since the heat sinks exposed on the printed circuit board need to be surface-treated later, it is necessary to prevent the adhesive formed by the prepreg and other connecting layers from flowing onto the surface of the heat sinks exposed on the printed circuit board during the initial lamination process, so as to avoid adhesive sticking to the surface of the heat sinks exposed on the printed circuit board. Summary of the Invention

[0004] This application provides a method and a printed circuit board for preventing adhesive from adhering to the embedded copper blocks of a printed circuit board, thereby avoiding adhesive adhering to the surface of the heat sink components exposed on the printed circuit board.

[0005] In a first aspect, embodiments of this application provide a method for preventing adhesive from sticking to heat sink components of a printed circuit board, comprising: A laminated plate and a heat sink are provided. The laminated plate includes at least two sub-plates and a connecting layer between two adjacent sub-plates. The heat sink includes a first part and a second part connected to each other. The first part is located inside the laminated plate, and the second part is located outside the laminated plate. The arrangement direction of the first part and the second part is perpendicular to the arrangement direction of the sub-plates and the connecting layer. The second part is covered with a protective sleeve. The laminated plates are pressed together so that the connecting layer melts and solidifies, and the sub-plate, the heat sink, and the solidified connecting layer are connected together; Remove the protective cover.

[0006] In some embodiments, the protective sleeve is made of heat-shrink adhesive; the method for preventing the heat sink of the printed circuit board from sticking with adhesive before pressing the laminated boards further includes: The protective sleeve is fitted onto the second part; The protective sleeve is heated so that it fits into the second part.

[0007] In some embodiments, removing the protective cover includes: A recess is machined into the protective sleeve, and the recess penetrates the protective sleeve; The protective sleeve is peeled off from the second part through the recessed portion.

[0008] In some embodiments, the sidewall of the laminate is disposed opposite to a portion of the inner wall of the recess.

[0009] In some embodiments, the protective sleeve is higher than the surface of the laminate; before pressing the laminate, the method for preventing the heat sink of the printed circuit board from sticking further includes: stacking a support plate on the laminate, the surface of the support plate facing away from the laminate being higher than the protective sleeve. When the laminated plates are pressed together, the support plate and the support plate are pressed together from the side of the support plate away from the laminated plates; After the laminated plates are pressed together, the support plate is removed.

[0010] In some embodiments, when the support plate is stacked on the laminate, a buffer layer is provided between the laminate and the support plate; when the support plate is removed, the buffer layer is removed.

[0011] In some embodiments, when the support plate is stacked on the laminate, an isolation membrane is provided between the buffer layer and the laminate.

[0012] In some embodiments, the sub-plate and the connecting layer are fixed by a first rivet; when the support plate is stacked on the laminate, at least one of the sub-plate and the connecting layer is fixed to the support plate by a second rivet, the second rivet and the first rivet being spaced apart.

[0013] In some embodiments, the sub-board has a first window on the side facing the connecting layer, the connecting layer has a second window that penetrates the connecting layer, and a portion of the first part is located within the first window and a portion of the first part is located within the second window.

[0014] Secondly, embodiments of this application provide a printed circuit board, which is manufactured by the method described in the first aspect for preventing the heat sink of the printed circuit board from sticking with adhesive.

[0015] The method for preventing adhesive adhesion to heat sinks on printed circuit boards provided in this application has the following advantages: Since the laminate includes at least two sub-boards and a connecting layer between two adjacent sub-boards, and the heat sink includes a first part and a second part connected to each other, the first part is located inside the laminate, the second part is located outside the laminate, and the arrangement direction of the first part and the second part is perpendicular to the arrangement direction of the sub-boards and the connecting layer, and the second part is covered with a protective sleeve, during the process of pressing the laminate together so that the connecting layer melts and solidifies, and the sub-boards, heat sinks, and the solidified connecting layer are connected, the protective sleeve can prevent the excess adhesive formed by the connecting layer from adhering to the second part, thereby preventing adhesive adhesion to the surface of the second part after the protective sleeve is removed.

[0016] The advantages of the printed circuit board provided in this application compared to the prior art can be seen in the description of the advantages of the method for preventing adhesive adhesion of heat sink components on the printed circuit board provided in this application compared to the prior art, which will not be repeated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart of a method for preventing adhesive from adhering to the embedded copper blocks of a printed circuit board in one embodiment of this application; Figure 2 This is a structural schematic diagram of one of the laminates, heat sinks, and protective sleeves in this application; Figure 3 Is Figure 2 A schematic diagram showing a protective sleeve fitted onto the second part of the heat sink; Figure 4 Yes Figure 3 The diagram shows the protective sleeve being heated and the laminated plates being pressed together. Figure 5 It is to remove Figure 4 A schematic diagram of the protective sleeve shown; Figure 6 This is a schematic diagram of the structure of the laminate, heat sink, protective sleeve, support plate and buffer layer in another embodiment of this application; Figure 7 Is Figure 6 A schematic diagram showing a protective sleeve fitted onto the second part of the heat sink; Figure 8 Yes Figure 7 The diagram shows the protective sleeve being heated. Figure 9 yes Figure 8 The diagram shows the laminated plates being pressed together and recesses being machined into the protective sleeve. Figure 10 It is to remove Figure 9 A schematic diagram of the protective sleeve shown; Figure 11 It is to remove Figure 10 A schematic diagram of the support plate and buffer layer is shown; Figure 12 This is a structural diagram of one of the panels in this application.

[0019] The markings in the diagram mean: 100. Panel; 101. Unit panel; 10. Sub-board; 20. Connecting layer; 21. Excess adhesive; 30. Heat sink; 31. Part 1; 32. Part 2; 40. Protective cover; 41. Recess; 50. Support plate; 60. Buffer layer. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0024] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0025] With the development of the communications field, more and more printed circuit board (PCB) products in this field need to use heat sinks such as embedded copper blocks for heat dissipation. To save space, current PCBs mainly use two types of embedded heat sinks: through-type and non-through-type. Non-through-type embedded heat sinks typically employ a design where part of the heat sink is embedded within the PCB, while another part is exposed for heat dissipation. This design avoids contact with external components to prevent short circuits caused by solder joints.

[0026] Since the heat sinks exposed on the printed circuit board need to be surface-treated later, it is necessary to prevent the adhesive formed by the prepreg and other connecting layers from flowing onto the surface of the heat sinks exposed on the printed circuit board during the initial lamination process, so as to avoid adhesive sticking to the surface of the heat sinks exposed on the printed circuit board.

[0027] In view of this, this application provides a method and a printed circuit board for preventing adhesive from adhering to the embedded copper blocks of a printed circuit board. Since the laminate includes at least two sub-boards and a connecting layer located between two adjacent sub-boards, and the heat sink includes a first part and a second part connected to each other, the first part is located inside the laminate, the second part is located outside the laminate, and the arrangement direction of the first part and the second part is perpendicular to the arrangement direction of the sub-boards and the connecting layer, and the second part is covered with a protective sleeve, during the process of pressing the laminate together so that the connecting layer melts and solidifies, and the sub-boards, heat sink, and solidified connecting layer are connected, the protective sleeve can prevent the excess adhesive formed by the connecting layer from adhering to the second part, thereby preventing adhesive from adhering to the surface of the second part after the protective sleeve is removed.

[0028] Please refer to Figures 1 to 5 In a first aspect, embodiments of this application provide a method for preventing adhesive from sticking to the heat sink 30 of a printed circuit board, comprising: S100: Provides a laminated plate and a heat sink 30. The laminated plate includes at least two sub-plates 10 and a connecting layer 20 located between two adjacent sub-plates 10. The heat sink 30 includes a first part 31 and a second part 32 connected to each other. The first part 31 is located inside the laminated plate, and the second part 32 is located outside the laminated plate. The arrangement direction of the first part 31 and the second part 32 is perpendicular to the arrangement direction of the sub-plates 10 and the connecting layer 20. A protective sleeve 40 is wrapped around the second part 32.

[0029] Both the first part 31 and the second part 32 can be regular or irregular in shape. For example, the first part 31 can be L-shaped, and the second part 32 can be stepped. The first part 31 can be connected to the sub-board 10, which can be a copper-clad laminate, a fiber optic board, a multilayer board, or copper foil, etc. The connecting layer 20 can include resin and glass fiber. For example, the connecting layer 20 can be a prepreg. The second part 32 is located on one side of the laminate. The heat sink 30 can be made of copper or aluminum, etc. The protective sleeve 40 can be made of metal, high-temperature resistant film, or other materials, etc.

[0030] S200: The laminated plates are pressed together so that the connecting layer 20 melts and solidifies, and the sub-plate 10, heat sink 30 and the solidified connecting layer 20 are connected.

[0031] A high-speed press can be used to press the laminated boards together. Since the second part 32 is wrapped with a protective sleeve 40, the excess adhesive 21 formed by the connecting layer 20 will adhere to the protective sleeve 40 instead of directly adhering to the surface of the second part 32, thereby avoiding adhesive adhesion to the surface of the second part 32.

[0032] S300: Remove the protective cover 40.

[0033] The protective cover 40 can be removed by machine or manually.

[0034] As can be seen from the above, the method for preventing adhesive from adhering to the heat sink 30 of the printed circuit board provided in this application embodiment is effective because the laminate includes at least two sub-boards 10 and a connecting layer 20 located between two adjacent sub-boards 10. The heat sink 30 includes a first part 31 and a second part 32 connected to each other. The first part 31 is located inside the laminate, and the second part 32 is located outside the laminate. The arrangement direction of the first part 31 and the second part 32 is perpendicular to the arrangement direction of the sub-boards 10 and the connecting layer 20. The second part 32 is covered with a protective sleeve 40. Therefore, during the process of pressing the laminate together so that the connecting layer 20 melts and solidifies, and connecting the sub-boards 10, the heat sink 30, and the solidified connecting layer 20, the protective sleeve 40 can prevent the excess adhesive 21 formed by the connecting layer 20 from adhering to the second part 32. Thus, after removing the protective sleeve 40, adhesive from the surface of the second part 32 can be avoided.

[0035] It is understandable that even if the second part 32 is irregularly shaped, for example, the second part 32 has a certain curvature and is not on the same plane, it cannot be directly exposed by the depth control screw-on method, nor can it be directly exposed by applying adhesive tape and then peeling off the tape. However, the method of preventing the heat sink 30 of the printed circuit board from sticking with adhesive provided in the embodiments of this application can also expose the second part 32 after removing the protective cover 40. It can easily remove the excess adhesive, the method is simple, and it can be completed without high-cost depth control screw-on machines or laser engraving equipment. It does not require high costs or complicated operating procedures, will not increase costs, and has no negative impact on quality, production efficiency, etc. It does not require additional equipment and does not affect production efficiency.

[0036] Please refer to Figures 1 to 5 As a possible implementation method, the protective sleeve 40 is made of heat-shrink adhesive; methods to prevent the heat sink 30 of the printed circuit board from sticking with adhesive before laminating the laminated boards also include: First, a protective cover 40 is fitted onto the second part 32.

[0037] The protective sleeve 40 may be larger than the second part 32. For example, the protective sleeve 40 may be 1mm-2mm larger and 2mm longer than the second part 32.

[0038] Next, the protective cover 40 is heated so that it fits into the second part 32.

[0039] The protective sleeve 40 can be blown by a hot melt machine so that the protective sleeve 40 tightly wraps the second part 32, and the previously reserved 2mm serves as a barrier to adhesive at the front end of the second part 32.

[0040] By adopting the above solution, the protective sleeve 40 can be prevented from completely covering the second part 32 due to its irregular shape, and the excess adhesive 21 formed by the connecting layer 20 can be better prevented from sticking to the second part 32.

[0041] It should be noted that the heat shrink adhesive can be modified silicone heat shrink adhesive, fluororubber heat shrink adhesive, polyvinylidene fluoride heat shrink adhesive, and radiation crosslinked polyolefin modified high temperature adhesive, etc. It can withstand high temperatures of 200℃-300℃ without melting, and can shrink within 100℃. It will not have a tight bond with the heat sink 30 and other metals, and can be easily removed under subsequent physical disassembly.

[0042] Please refer to Figures 6 to 11 In some embodiments, removing the protective cover 40 includes: First, a recess 41 is machined into the protective sleeve 40, and the recess 41 penetrates the protective sleeve 40.

[0043] The recessed portion 41 can be machined on the protective sleeve 40 by milling.

[0044] Next, the protective sleeve 40 is peeled off from the second part 32 from the recessed part 41.

[0045] By adopting the above solution, the protective cover 40 can be easily peeled off from the second part 32, thereby exposing the second part 32 that needs to be exposed.

[0046] It is understandable that the recess 41 can be a hole or a groove, etc.

[0047] When machining the recess 41 into the protective sleeve 40, the excess adhesive around the protective sleeve 40 can be removed by milling, facilitating subsequent peeling off of the protective sleeve 40. For example, please refer to [reference needed]. Figure 9 The milled plate material protrudes 0.5mm from the right end (front end) of the second part 32, and 0.2mm from the top and bottom.

[0048] Optionally, the sidewall of the laminated plate is disposed opposite to a portion of the inner wall of the recess 41.

[0049] This design makes it easier to process the recessed portion 41 and facilitates the peeling of the protective sleeve 40 from the second part 32 from the recessed portion 41.

[0050] As a possible implementation, the protective sleeve 40 is higher than the surface of the laminate; a method to prevent the heat sink 30 of the printed circuit board from sticking before the laminate is pressed also includes: stacking a support plate 50 on the laminate, the support plate 50 being higher than the surface of the laminate away from the protective sleeve 40.

[0051] When pressing the laminated plates, the support plate 50 is pressed against the support plate 50 from the side of the support plate 50 away from the laminated plates.

[0052] After the laminated plates are pressed together, the support plate 50 is removed.

[0053] By adopting the above solution, it is possible to avoid damaging the second part 32 and the protective sleeve 40 wrapped around the second part 32 when pressing the laminated plate.

[0054] It should be noted that the thickness of the second part 32 and the second part 32 can be the same or different. The process of removing the support plate 50 is a capping process. Before the capping process, the designed holes and positioning holes for subsequent milling can be drilled on the laminate. The support plate 50 can be provided with a clearance window to accommodate the protective sleeve 40 and the second part 32 wrapped by the protective sleeve 40, which are higher than the surface of the laminate.

[0055] Optionally, when the support plate 50 is stacked on the laminate, a buffer layer 60 is provided between the laminate and the support plate 50; when the support plate 50 is removed, the buffer layer 60 is removed.

[0056] This design prevents the support plate from damaging the laminated panels.

[0057] It should be noted that the buffer layer 60 can be set as a semi-cured sheet, etc.

[0058] Optionally, when the support plate 50 is stacked on the laminate, an isolation membrane is provided between the buffer layer 60 and the laminate.

[0059] This configuration makes it easy to remove the support plate 50 and the buffer layer 60.

[0060] It should be noted that the isolation membrane can be set as a covering membrane, etc.

[0061] Optionally, the sub-plate 10 and the connecting layer 20 are fixed by a first rivet; when the support plate 50 is stacked on the laminate, at least one of the sub-plate 10 and the connecting layer 20 is fixed to the support plate 50 by a second rivet, and the second rivet and the first rivet are spaced apart.

[0062] With this configuration, the sub-plate 10, connecting layer 20, and support plate 50 can be relatively fixed by the first rivet and the second rivet.

[0063] It should be noted that the sub-board 10 and the connecting layer 20 can be provided with 8 to 10 first riveting holes, each containing a first rivet. The sub-board 10 and the connecting layer 20 are also provided with 4 to 6 second riveting holes, each containing a second rivet. The first and second rivets on the edge of the board can be removed later using a drill bit 0.6 mm larger than the rivet.

[0064] Optionally, the sub-board 10 has a first window on the side facing the connecting layer 20, and the connecting layer 20 has a second window. The second window penetrates the connecting layer 20, with a portion of the first part 31 located inside the first window and a portion of the first part 31 located inside the second window.

[0065] This configuration makes it easy to place the first part 31 inside the laminate.

[0066] The laminated board can be processed through processes such as material cutting, inner layer patterning, windowing of sub-board 10 and connecting layer 20, and inner layer AOI (Automated Optical Inspection).

[0067] Cutting: refers to the process of cutting large copper-clad laminates into work boards of specified dimensions.

[0068] Inner layer pattern: Based on the engineering data, create the inner layer circuit pattern and the target pattern on the board edge to obtain sub-board 10.

[0069] Sub-plate 10 and connecting layer 20: Following the dimensions of the heat sink 30 to be embedded, the sub-plate 10 and connecting layer 20 are milled to create windows, forming the first window and the second window. The dimensions of the first window and the second window are both 0.2 mm larger than the dimensions of the first part 31. The thickness of the support plate 50, which supports the protruding part of the second part 32, is 0.1 mm to 0.2 mm thicker than the thickness of the protruding part of the second part 32.

[0070] Inner layer AOI inspection: Use AOI to inspect the quality of the inner layer circuitry of daughterboard 10.

[0071] After removing the protective cover 40, the following processes can be carried out: outer layer circuitry, outer layer etching, AOI inspection, solder mask application, lettering, molding and milling, electrical testing, surface treatment, FQC (Final Quality Control), and packaging.

[0072] Outer layer circuitry and outer layer etching: The outer layer circuitry pattern is obtained by producing it in a conventional manner.

[0073] AOI Inspection: AOI is used to inspect the quality of outer layer circuitry.

[0074] Solder resist: Produced using conventional methods to obtain a solder resist layer on the outer pattern.

[0075] Text: Produced using conventional methods, resulting in text markings and high-temperature curing.

[0076] Molding: Produced using conventional methods to obtain the final product shape.

[0077] Electrical testing: By conducting electrical tests, short circuits and open circuits can be detected, preventing problematic boards from being exposed.

[0078] Surface treatment: Produced using conventional methods, a surface treatment layer is obtained in the areas not covered by the solder resist layer.

[0079] FQC: Machine inspection and manual visual inspection are used to further prevent the outflow of abnormal products with short circuits caused by gold penetration.

[0080] Packaging: Pack according to requirements to prepare for delivery.

[0081] Please refer to Figure 12 The method for preventing the heat sink 30 of the printed circuit board from sticking with adhesive provided in this application embodiment can be produced by panel 100, which includes multiple unit boards 101.

[0082] Secondly, embodiments of this application provide a printed circuit board, which is manufactured by a method for preventing the heat sink 30 of the printed circuit board from sticking, as described in the first aspect.

[0083] The printed circuit board provided in this application embodiment includes at least two sub-boards 10 and a connecting layer 20 located between two adjacent sub-boards 10. The heat sink 30 includes a first part 31 and a second part 32 connected to each other. The first part 31 is located inside the laminate and the second part 32 is located outside the laminate. The arrangement direction of the first part 31 and the second part 32 is perpendicular to the arrangement direction of the sub-boards 10 and the connecting layer 20. The second part 32 is covered with a protective sleeve 40. Therefore, during the process of pressing the laminate together so that the connecting layer 20 melts and solidifies, and connecting the sub-boards 10, the heat sink 30 and the solidified connecting layer 20 are connected, the protective sleeve 40 can prevent the excess adhesive 21 formed by the connecting layer 20 from sticking to the second part 32. Thus, after removing the protective sleeve 40, the surface of the second part 32 can be prevented from sticking with adhesive.

[0084] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for preventing adhesive from sticking to heat sink components of a printed circuit board, characterized in that, include: A laminated plate and a heat sink are provided. The laminated plate includes at least two sub-plates and a connecting layer between two adjacent sub-plates. The heat sink includes a first part and a second part connected to each other. The first part is located inside the laminated plate, and the second part is located outside the laminated plate. The arrangement direction of the first part and the second part is perpendicular to the arrangement direction of the sub-plates and the connecting layer. The second part is covered with a protective sleeve. The laminated plates are pressed together so that the connecting layer melts and solidifies, and the sub-plate, the heat sink, and the solidified connecting layer are connected together; Remove the protective cover.

2. The method for preventing adhesive adhesion to heat sink components of printed circuit boards according to claim 1, characterized in that, The protective sleeve is made of heat-shrink adhesive; before pressing the laminated boards, the method for preventing the heat sink of the printed circuit board from sticking with adhesive further includes: The protective sleeve is fitted onto the second part; The protective sleeve is heated so that it fits into the second part.

3. The method for preventing adhesive adhesion to heat sink components of printed circuit boards according to claim 1, characterized in that, Removing the protective cover includes: A recess is machined into the protective sleeve, and the recess penetrates the protective sleeve; The protective sleeve is peeled off from the second part through the recessed portion.

4. The method for preventing adhesive adhesion to heat sink components of printed circuit boards according to claim 3, characterized in that, The sidewall of the laminated plate is disposed opposite to a portion of the inner wall of the recess.

5. The method for preventing adhesive adhesion to heat sinks of printed circuit boards according to any one of claims 1 to 4, characterized in that, The protective sleeve is higher than the surface of the laminate; before pressing the laminate, the method for preventing the heat sink of the printed circuit board from sticking to the heat sink further includes: stacking a support plate on the laminate, wherein the surface of the support plate facing away from the laminate is higher than the protective sleeve. When the laminated plates are pressed together, the support plate and the support plate are pressed together from the side of the support plate away from the laminated plates; After the laminated plates are pressed together, the support plate is removed.

6. The method for preventing adhesive adhesion to heat sinks on printed circuit boards according to claim 5, characterized in that, When the support plate is stacked on the laminate, a buffer layer is provided between the laminate and the support plate; when the support plate is removed, the buffer layer is removed.

7. The method for preventing adhesive adhesion to heat sinks on printed circuit boards according to claim 6, characterized in that, When the support plate is stacked on the laminate, an isolation membrane is provided between the buffer layer and the laminate.

8. The method for preventing adhesive from sticking to the heat sink of a printed circuit board according to claim 5, characterized in that, The sub-plate and the connecting layer are fixed by a first rivet; when the support plate is stacked on the laminate, at least one of the sub-plate and the connecting layer is fixed to the support plate by a second rivet, wherein the second rivet and the first rivet are spaced apart.

9. The method for preventing adhesive adhesion to heat sinks of printed circuit boards according to any one of claims 1 to 4, characterized in that, The sub-board has a first window on the side facing the connecting layer, and the connecting layer has a second window that penetrates the connecting layer. Part of the first part is located inside the first window, and part of the first part is located inside the second window.

10. A printed circuit board, characterized in that, The printed circuit board is manufactured by the method for preventing the heat sink of the printed circuit board from sticking as described in any one of claims 1 to 9.

Images