Electric control device and air conditioner outdoor unit

Abstract

The invention discloses an electric control device and an air conditioner outdoor unit, the electric control device comprises a box body, a circuit board, a radiator, a plurality of power devices and a fixing component, and the circuit board is installed on the box body. The radiator is installed on the box body and located on one side of the circuit board. Each power device comprises a body and a pin which are connected, the pins of the power devices are connected to the circuit board, and the bodies of the power devices are sequentially arranged in the extending direction of the edge of one side of the circuit board, located on the outer side of the edge of the circuit board and in heat conduction contact with the radiator. The fixing member is connected to the radiator and abuts against the bodies of the plurality of power devices so as to tightly press the bodies of the plurality of power devices on the radiator. According to the technical scheme, efficient heat dissipation of the power device can be realized, the influence of heat accumulation on working stability is avoided, the overall operation reliability is improved, the spatial layout of the device is optimized, and the manufacturability of the electric control device is improved.

Description

Technical Field

[0001] This application relates to the field of electrical control technology, and in particular to an electrical control device and an outdoor unit of an air conditioner. Background Technology

[0002] In related technologies, the outdoor unit of an air conditioner contains an electronic control device, the core of which includes power devices. These power devices generate energy losses during operation, which are released as heat, causing their temperature to rise. The reliability of these power devices is closely related to their own temperature; when the temperature exceeds their specified upper limit, they will be damaged due to overheating. If the heat generated by the power devices cannot be dissipated in time, the internal temperature of the electronic control device will become too high. This will not only affect the normal operation of the power devices but also directly impact the stability and lifespan of the entire electronic control device.

[0003] However, the electronic control devices in the related technologies have shortcomings in heat dissipation design, which makes it easy for heat to accumulate inside and the heat dissipation effect is poor. Summary of the Invention

[0004] This application provides an electronic control device and an outdoor air conditioning unit, which can achieve efficient heat dissipation of power devices, avoid affecting the working stability due to heat accumulation, improve the overall operational reliability, and optimize the spatial layout of devices to improve the manufacturability of the electronic control device.

[0005] In a first aspect, embodiments of this application provide an electronic control device, which includes: Box body; Circuit board, mounted on the housing; A heat sink is mounted on the housing and located on one side of the circuit board; A plurality of power devices, each power device comprising a connected body and pins, wherein the pins of the plurality of power devices are all connected to the circuit board, and the bodies of the plurality of power devices are arranged sequentially along the extension direction of one side edge of the circuit board, located on the outer edge of the circuit board, and in thermally conductive contact with the heat sink; and A fixing member is connected to the heat sink and presses against the bodies of the plurality of power devices to press the bodies of the plurality of power devices tightly against the heat sink.

[0006] In some embodiments, the fixing member includes a thermally conductive strip and a plurality of heat dissipation fins. The thermally conductive strip is detachably connected to the heat sink and presses against the bodies of a plurality of power devices. The plurality of heat dissipation fins are spaced apart and connected to the thermally conductive strip.

[0007] In some embodiments, the body has a first connection hole, and the heat sink has a second connection hole corresponding to the first connection hole; The electronic control device also includes fasteners that pass through the first connection hole and the second connection hole to press the body of the power device tightly against the heat sink.

[0008] In some embodiments, the pin is bent and has a first end and a second end, the first end being connected to the circuit board, the second end being bent away from the edge of the circuit board and extending to the outer edge of the circuit board, and the body being connected to the second end.

[0009] In some embodiments, a low-voltage component is also included, which is connected to the same surface of the circuit board as the first end.

[0010] In some embodiments, the housing is recessed to form a groove, the circuit board is embedded in the groove, and the housing is also provided with an opening that passes through two opposing surfaces, the opening being located on one side of the groove; The radiator is connected to the surface of the housing facing away from the groove and is at least partially exposed in the opening. The main body passes through the opening and is fitted to the radiator.

[0011] In some embodiments, the housing is provided with an elastic buckle on the groove sidewall, the elastic buckle being used to engage with the edge of the circuit board; And / or, the box body is provided with a positioning post on the bottom wall of the groove, the positioning post is provided with a threaded hole, the circuit board is provided with a screw through hole corresponding to the threaded hole, and the circuit board is fixed in the groove by a screw passing through the screw through hole and threadedly engaging with the threaded hole.

[0012] In some embodiments, the heat sink includes a substrate and a heat sink connected to the substrate, a limiting groove is recessed on the surface of the housing facing away from the groove, the substrate is embedded in the limiting groove, and the heat sink extends in a direction facing away from the groove. The bottom of the limiting groove is connected to the through-hole, and the body passes through the through-hole and makes thermal contact with the surface of the substrate away from the heat sink.

[0013] In some embodiments, the electronic control device is applied to an outdoor unit of an air conditioner, and the circuit board is provided with a frequency conversion circuit and a main control circuit. The frequency conversion circuit and / or the main control circuit includes the power device. The frequency conversion circuit is used to realize the frequency conversion of electrical energy, and the main control circuit is used to control the working state of the frequency conversion circuit.

[0014] Secondly, embodiments of this application provide an outdoor unit for an air conditioner, characterized in that it includes: An outer casing, wherein a partition is provided inside the outer casing, the partition dividing the space inside the outer casing into a fan chamber and a compression chamber, the fan chamber being equipped with a fan impeller, and the compression chamber being equipped with a compressor; and The electronic control device described above is mounted on the partition and electrically connected to the compressor, and is at least partially located within the fan cavity.

[0015] In some embodiments, the partition has a clearance notch that extends through both opposite surfaces, the radiator of the electronic control device passes through the clearance notch and extends into the fan cavity, and the airflow in the fan cavity can flow through the radiator.

[0016] In some embodiments, the partition is provided with one of a buckle and a buckle hole, and the housing of the electronic control device is provided with the other of a buckle and a buckle hole. The buckle engages with the buckle hole to fix the electronic control device to the partition.

[0017] Based on the above embodiments, by placing the power device body on the outer edge of the circuit board and making thermal contact with the heat sink, and since the heat sink is located on one side of the circuit board, its position is independent of the circuit board's mounting space. This allows the power device body to be freed from the confines of the compact area between the circuit board and other components, enabling it to directly form an efficient heat transfer path with the heat sink. This optimizes the heat dissipation path of the power device, improves heat dissipation efficiency, and allows the heat generated by the power device to be dissipated in a timely manner through the heat sink. This effectively controls the temperature of the power device, preventing damage due to overheating, ensuring the normal operation of the power device, and contributing to improved operational stability and extended service life of the electronic control device. Simultaneously, the side-mounted layout of the heat sink provides more space for the power device body, avoiding the space constraints of the power device being sandwiched between the circuit board and the heat sink. This allows the power device body to be distributed in the open space above the heat sink, reducing the likelihood of heat accumulation and further improving the heat dissipation effect.

[0018] In addition, by fixing the bodies of multiple power devices in a unified manner through fixing components, the tedious operation of fixing each power device individually is avoided, which improves assembly efficiency. At the same time, the pressing action of the fixing components can ensure that the body of each power device maintains a stable thermal contact with the heat sink, avoiding poor contact due to assembly gaps or vibration that would affect the heat dissipation effect. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the electronic control device of this application; Figure 2 This is a schematic diagram of the circuit board and heat sink of the electronic control device of this application; Figure 3 This is a schematic diagram of the exploded structure of the electronic control device of this application; Figure 4 This is a schematic diagram of the structure of the housing of the electronic control device of this application; Figure 5 This is a structural schematic diagram of the housing of the electronic control device of this application from another perspective; Figure 6 This is a schematic diagram of the assembled structure of the electrical control device and the partition plate of this application; Figure 7 This is a structural diagram of the electrical control device and partition before assembly.

[0021] Explanation of reference numerals in the attached figures: 100. Electrical control device; 10. Box body; 11. Groove; 111. Elastic buckle; 112. Positioning post; 12. Through-hole; 13. Limiting groove; 14. Buckle; 15. Convection air duct; 20. Circuit board; 21. Screw through hole; 30. Heat sink; 31. Substrate; 311. Second connection hole; 32. Heat sink; 40. Power device; 41. Body; 42. Pin; 50. Fixing component; 51. Thermal conductive strip; 52. Heat sink fins; 60. Fastener; 70. Low voltage component; 200. Partition; 201. Leaving notch; 202. Buckle hole.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0024] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0025] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] In related technologies, the outdoor unit of an air conditioner contains an electronic control device, the core of which includes power devices. These power devices generate energy losses during operation, which are released as heat, causing their temperature to rise. The reliability of these power devices is closely related to their own temperature; when the temperature exceeds their specified upper limit, they will be damaged due to overheating. If the heat generated by the power devices cannot be dissipated in time, the internal temperature of the electronic control device will become too high. This will not only affect the normal operation of the power devices but also directly impact the stability and lifespan of the entire electronic control device.

[0028] However, the electronic control devices in related technologies have shortcomings in heat dissipation design. A typical structure sandwiches the power device between the heat sink and the circuit board: the power device body is attached to the heat sink surface. This design results in defects in heat transfer. Although the heat generated by the power device can be conducted to the heat sink through its body, the enclosed space between the two can easily lead to heat accumulation, forming localized high-temperature areas.

[0029] To resolve the above issues, please refer to [link / reference]. Figures 1 to 3The first aspect of this application discloses an electronic control device 100, which can be applied to equipment requiring power control, such as outdoor units of air conditioners, heat pump water heaters, and industrial frequency converters. This application will illustrate its application in an outdoor unit of an air conditioner as an example. In the embodiments of this application, the electronic control device 100 includes a housing 10, a circuit board 20, a radiator 30, a power device 40, and a fixing member 50.

[0030] Circuit board 20 is mounted on housing 10, and heat sink 30 is mounted on housing 10 and located on one side of circuit board 20. Circuit board 20 can be a PCB (Printed Circuit Board), and the outer contour of housing 10 can be rectangular. The rectangular structure facilitates installation with other components and efficiently utilizes installation space. Housing 10 is made of plastic, featuring good insulation, light weight, and low cost. Using housing 10 as a load-bearing base, components such as circuit board 20 and heat sink 30 can be integrated and assembled on it, achieving unified installation and fixation of all components. Circuit board 20 is equipped with a frequency converter circuit and a main control circuit. The frequency converter circuit is used to realize the frequency conversion of electrical energy, and the main control circuit is used to control the operating state of the frequency converter circuit. Specifically, it can convert the input fixed-frequency AC power into AC power of different frequencies to adapt to the power output requirements under different operating conditions, and change the operating speed and power of the relevant load by adjusting the output frequency. The main control circuit is the core of the entire electronic control device. It can receive control signals from the indoor unit of the air conditioner and operating parameter signals from various sensors (such as temperature sensors, pressure sensors, etc.). After analysis and processing, it sends corresponding control commands to the frequency converter circuit to precisely control the working state of the frequency converter circuit, such as start-up, stop, and frequency adjustment.

[0031] One of the frequency converter circuits and the main control circuit includes multiple power devices 40. These power devices 40 generate heat during operation and can be rectifier bridges, IGBTs (Insulated Gate Bipolar Transistors), MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), etc. Each power device 40 includes a connected body 41 and pins 42. The pins 42 of all power devices 40 are connected to the circuit board 20, and the bodies 41 of the power devices 40 are located on the outer edge of the circuit board 20. The bodies 41 of the power devices 40 are arranged sequentially along one side edge of the circuit board 20 and are all in thermal contact with the heat sink 30. It should be noted that this thermal contact can be direct contact or indirect contact achieved through a thermally conductive medium. This arrangement can accommodate the layout space of the heat sink 30 on one side of the circuit board 20, so that the bodies 41 of multiple power devices 40 are distributed in an orderly manner in the corresponding area of ​​the heat sink 30. It can also dissipate the heat generated by each power device 40 in a timely manner through the heat sink 30, avoiding local heat accumulation due to the concentrated placement of multiple devices. At the same time, it is convenient to achieve batch heat dissipation through the heat sink 30, further improving the overall heat dissipation efficiency.

[0032] The fixing member 50 is detachably connected to the heat sink 30 and presses against the body 41 of the multiple power devices 40 to press the body 41 of the multiple power devices 40 tightly against the heat sink 30.

[0033] Based on the above embodiments, by placing the body 41 of the power device 40 on the outer edge of the circuit board 20 and making thermal contact with the heat sink 30, and since the heat sink 30 is located on one side of the circuit board 20, its position is independent of the mounting space of the circuit board 20. This allows the body 41 of the power device 40 to be free from the constraints of the compact area between the circuit board 20 and other components, enabling it to directly form an efficient heat transfer path with the heat sink 30. This optimizes the heat dissipation path of the power device 40, improves heat dissipation efficiency, and allows the heat generated by the power device 40 to be dissipated in a timely manner through the heat sink 30. This effectively controls the temperature of the power device 40, preventing it from being damaged due to overheating, ensuring the normal operation of the power device 40, and contributing to improving the working stability of the electronic control device 100 and extending its service life. At the same time, the side-mounted layout of the heat sink 30 provides more space for the body 41 of the power device 40, avoiding the space restriction of the power device 40 being sandwiched between the circuit board 20 and the heat sink 30. This allows the body 41 of the power device 40 to be distributed in the open space above the heat sink 30, making the spatial layout of the device less prone to heat accumulation problems, further improving the heat dissipation effect.

[0034] In addition, the fixing component 50 can uniformly fix the bodies 41 of multiple power devices 40, avoiding the tedious operation of fixing each power device 40 individually, thus improving assembly efficiency. At the same time, the pressing action of the fixing component 50 can ensure that the body 41 of each power device 40 maintains a stable thermal contact with the heat sink 30, avoiding poor contact due to assembly gaps or vibration that could affect the heat dissipation effect.

[0035] Please see Figures 1 to 3 In some embodiments, the fixing member 50 includes a thermally conductive pressure strip 51 and multiple heat dissipation fins 52. The thermally conductive pressure strip 51 is detachably connected to the heat sink 30 and presses against the bodies 41 of multiple power devices 40. The multiple heat dissipation fins 52 are spaced apart on the thermally conductive pressure strip 51. The heat dissipation fins 52 and the thermally conductive pressure strip 51 are an integral structure, for example, manufactured using an integral molding process. This structural design reduces heat transfer loss at the connection point, allowing heat from the thermally conductive pressure strip 51 to be more efficiently conducted to the heat dissipation fins 52, thereby accelerating heat dissipation. Simultaneously, the integral structure also enhances the overall structural strength of the fixing member 50, preventing loose connections from affecting heat dissipation and fixing effects, and simplifies the manufacturing process. The thermally conductive pressure strip 51 is connected to the heat sink 30 via a detachable connection. This detachable connection facilitates the installation, maintenance, or replacement of the power devices 40, balancing structural stability and operational convenience. The detachable connection can be achieved using screw connections or snap-fit ​​methods, balancing connection stability and ease of assembly / disassembly. The heat-conducting pressure strip 51 can be made of metal materials such as copper and aluminum, which have good thermal conductivity. While pressing and fixing the power device 40 body 41, it can also assist the power device 40 in heat dissipation through its own thermal conductivity. The spaced heat dissipation fins 52 can increase the heat dissipation area and accelerate the dissipation of heat on the heat-conducting pressure strip 51. This makes the fixing component 50 not only have a fixing function, but also work with the main heat sink 30 to improve the overall heat dissipation efficiency and further optimize the heat dissipation effect of multiple power devices 40.

[0036] Furthermore, the heat dissipation fins 52 can extend in multiple directions to adapt to different spatial layouts. In one embodiment, multiple heat dissipation fins 52 extend along the thermally conductive strip 51 in a direction away from the power device 40 body 41. This avoids spatial interference with the power device 40 or other components while ensuring sufficient exposure to external airflow. The spaced arrangement further increases the heat dissipation area and accelerates the dissipation of heat on the thermally conductive strip 51.

[0037] Optionally, the body 41 has a first connecting hole, and the heat sink 30 has a second connecting hole 311 corresponding to the first connecting hole. The electronic control device 100 also includes a fastener 60, which passes through the first connecting hole and the second connecting hole 311 to press the body 41 of the power device 40 tightly against the heat sink 30. The first connecting hole and the second connecting hole 311 can be threaded holes, and the fastener 60 can be a screw. This direct connection method using the fastener 60 allows the body 41 of a single power device 40 to form a tight thermally conductive contact with the heat sink 30, ensuring a stable and reliable heat dissipation path. This method is suitable for scenarios with high requirements for fixing strength and heat dissipation efficiency, providing another feasible solution for fixing and dissipating the power device 40.

[0038] In some embodiments, when the pins 42 of the power device 40 extend in a straight line, the body 41 of the power device 40 extends to the outer edge of the circuit board 20 by reasonably designing the length of the pins 42, so as to achieve thermal contact between the body 41 and the heat sink 30.

[0039] In other embodiments, the pin 42 is bent, having a first end and a second end. The first end is connected to the circuit board 20, and the second end is bent toward the edge of the circuit board 20 and extends to the outer edge of the circuit board 20. The body 41 is connected to the second end. This bent structure allows the body 41 to naturally lie on the outer edge of the circuit board 20 through the extension of the pin 42, without occupying additional mounting space on the surface of the circuit board 20. At the same time, it reserves a suitable position for the thermally conductive contact between the body 41 and the heat sink 30, avoiding space constraints on the body 41 due to its proximity to the circuit board 20, and further optimizing the layout and heat dissipation conditions of the power device 40. Furthermore, compared to a straight-line arrangement, the bent structure of pin 42 allows for more precise alignment of the body 41 with the pre-defined contact area of ​​the heat sink 30 while keeping it away from the surface of the circuit board 20, ensuring a stable thermal contact between the two. At the same time, the bent design reduces the overall longitudinal overhang length of pin 42, lowering the risk of structural wobbling caused by excessive pin length, improving the stability of power device 40 installation, and allowing for more flexible avoidance of other components on the circuit board 20 within a limited space, avoiding layout interference. This optimizes the heat dissipation path while improving the overall structural compactness and reliability.

[0040] Furthermore, the electronic control device 100 also includes a low-voltage component 70, which is connected to the same surface of the circuit board 20 as the first terminal. The low-voltage component 70 may include integrated circuits (such as microcontrollers and digital signal processors), signal conditioning chips for sensors (such as operational amplifiers), communication modules (such as Bluetooth modules and CAN bus transceivers), and low-power components sensitive to temperature, such as low-power resistors and capacitors. Notably, the first terminal of the pin 42 of the power device 40 and the low-voltage component 70 are both connected to the same surface of the circuit board 20; that is, both the power device 40 and the low-voltage component 70 are located on one side of the circuit board 20. This layout design has significant advantages in manufacturing processes: since all components requiring soldering (including the pin 42 of the power device 40 and the low-voltage component 70) are concentrated on the same side of the circuit board 20, the circuit board 20 only needs to undergo one wave soldering process during production to complete the soldering and fixing of all components, eliminating the need for flipping the board for secondary soldering. This not only simplifies the production process and reduces welding steps, mitigating issues such as board deformation and unstable solder joint quality that can result from repeated welding, but also improves production efficiency, reduces manufacturing costs, and ensures the consistency and reliability of welding for each component. Furthermore, since the body 41 of the power device 40 extends to the outer edge of the circuit board 20 via pins 42 and makes thermal contact with the heat sink 30, its heat-generating area is physically separated from the low-voltage components 70 on the surface of the circuit board 20. This reduces the direct baking of the low-voltage components 70 by the heat generated by the power device 40. The co-location of both facilitates circuit integration via the circuit board 20 and utilizes spatial layout differences to avoid thermal interference, ensuring that the low-voltage components 70 operate in a relatively stable temperature environment, further enhancing the overall circuit reliability of the electronic control device 100.

[0041] Please see Figures 3 to 5In some embodiments, the housing 10 is recessed to form a groove 11, and the circuit board 20 is embedded in the groove 11. This structure provides stable mounting positioning for the circuit board 20, while the sidewalls of the groove 11 provide circumferential protection for the circuit board 20, reducing the impact of external collisions on the circuit board 20. The housing 10 also has a through-hole 12 that passes through the two opposing surfaces, and the through-hole 12 is located on one side of the groove 11. The heat sink 30 is connected to the surface of the housing 10 facing away from the groove 11 and is at least partially exposed through the through-hole 12. The body 41 of the power device 40 passes through the through-hole 12 and is fitted to the heat sink 30. This structural design, which enables direct contact between the body 41 and the heat sink 30 via the port 12, eliminates the intermediate heat transfer medium, resulting in a shorter heat transfer path and lower thermal resistance from the body 41 to the heat sink 30. This minimizes heat loss, significantly improves thermal conductivity, and ensures that the heat generated by the power device 40 is quickly absorbed and dissipated by the heat sink 30, further optimizing the heat dissipation effect. At the same time, the port 12 also provides precise positioning guidance for the installation of the body 41, making the fit between the two more tight and stable.

[0042] Furthermore, the housing 10 has an elastic buckle 111 on the side wall of the groove 11, which is used to engage with the edge of the circuit board 20. When the circuit board 20 is inserted into the groove 11, the elastic buckle 111 can engage with the edge of the circuit board 20 through its own elastic deformation, realizing the quick positioning and fixing of the circuit board 20 and the housing 10, simplifying the assembly process; at the same time, the elastic force of the elastic buckle 111 can provide a continuous and stable clamping force for the circuit board 20, which can not only prevent the circuit board 20 from loosening or shaking in the groove 11, but also buffer the impact of external vibration on the circuit board 20, protecting the electronic components (including the pin 42 connection part of the power device 40 and the low-voltage component 70) from mechanical damage, thus taking into account both assembly convenience and structural stability.

[0043] Optionally, the housing 10 has a positioning post 112 on the bottom wall of the groove 11. The positioning post 112 has a threaded hole, and the circuit board 20 has a screw through hole 21 corresponding to the threaded hole. The circuit board 20 is fixed in the groove 11 by screws passing through the screw through hole 21 and threadedly engaging with the threaded hole. During assembly, the positioning post 112 provides support for the circuit board 20, maintaining a certain distance between the circuit board 20 and the bottom wall of the groove 11, avoiding direct contact between the circuit board 20 and the bottom wall of the groove, thus preventing wear or short circuit risks. At the same time, the top surface of the positioning post 112 fits against the back of the circuit board 20, providing stable support for the circuit board 20. Combined with the tightening action of the screws, it can effectively distribute the pressure on the circuit board 20, preventing deformation due to excessive local stress. In addition, the positioning post 112 can also provide pre-positioning guidance for the circuit board 20 by corresponding to the position of the screw through hole 21, ensuring that the screw is accurately aligned with the threaded hole and improving assembly efficiency. This fixing method complements the snap-fit ​​of the elastic buckle 111, and can be flexibly selected according to the requirements of support stability and spacing distance in different scenarios, further optimizing the structural reliability of the electronic control device 100.

[0044] Reference Figure 3 Optionally, the heat sink 30 includes a substrate 31 and heat sink 32 connected to the substrate 31. A limiting groove 13 is recessed on the surface of the housing 10 facing away from the groove 11. The substrate 31 is embedded in the limiting groove 13, and the heat sink 32 extends in the direction facing away from the groove 11. The bottom of the limiting groove 13 connects to the through-hole 12. The body 41 passes through the through-hole 12 and makes thermal contact with the surface of the substrate 31 facing away from the heat sink 32. This limiting groove 13 provides precise installation positioning for the substrate 31 of the heat sink 30, ensuring that the substrate 31 corresponds to the position of the through-hole 12, allowing the body 41 passing through the through-hole 12 to accurately form thermal contact with the substrate 31. Simultaneously, after the substrate 31 is embedded in the limiting groove 13, the groove wall provides circumferential constraint to the heat sink 30, preventing displacement under vibration and ensuring the stability of the heat dissipation contact. The heat sink 32 extends in a direction away from the groove 11, which not only keeps it away from the mounting area of ​​the circuit board 20 and the power device 40 body 41, reducing spatial interference, but also allows it to be more fully exposed to the external air environment. By increasing the contact area with the airflow, the heat dissipation efficiency is improved, allowing the heat absorbed by the substrate 31 to be quickly dissipated through the heat sink 32, further optimizing the overall heat dissipation performance. (Refer to reference) Figure 4 as well as Figure 5Furthermore, the housing 10 is also equipped with a convection duct 15. One end of the convection duct 15 is connected to the wall of the limiting groove 13, and the other end is connected to the side of the housing 10 where the power device 40 is connected. In this way, external airflow can enter from the side of the housing 10 where the power device 40 is connected through the convection duct 15, flow through the substrate 31 and the surrounding area in the limiting groove 13, and then flow out, forming an effective air circulation. When the power device 40 generates heat during operation, the convection duct 15 can accelerate the exchange between the hot air on the side of the housing 10 where the power device 40 is connected and the cold air in the limiting groove 13, so as to remove the heat around the power device 40 in a timely manner, further improving the heat dissipation effect of the entire electronic control device 100 and preventing heat from accumulating locally and affecting the normal operation of the device. Moreover, this duct design makes full use of the structural space of the housing 10 itself, without the need for additional complex ventilation components, simplifying the overall structure while ensuring heat dissipation performance.

[0045] Combined with reference Figure 6 and Figure 7 This application also proposes an outdoor unit for an air conditioner, which includes a housing and an electronic control device 100. A partition 200 is provided inside the housing, dividing the space within the housing into a fan chamber and a compression chamber. The fan chamber contains a fan impeller, and the compression chamber contains a compressor. The specific structure of the electronic control device 100 is as described in the above embodiments. Since this application adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated further here. The electronic control device 100 is installed on the partition 200 and electrically connected to the compressor, and is at least partially located within the fan chamber. By mounting the electronic control device 100 on the partition 200 and partially placing it within the fan cavity, the airflow environment of the fan cavity can be fully utilized. The airflow generated when the impeller is running can directly act on the electronic control device 100 located in the fan cavity, providing it with a natural heat dissipation channel without the need for an additional cooling fan. This simplifies the structure while improving heat dissipation efficiency. At the same time, the partition 200 serves as a mounting carrier, placing the electronic control device 100 in the transition area between the fan cavity and the compression cavity. This facilitates electrical connection with the compressor in the compression cavity via wiring, shortening the wiring distance, and reduces the direct transmission of vibration from the compressor during operation to the electronic control device 100, thus reducing mechanical interference and further ensuring the stable operation of the electronic control device 100.

[0046] In some embodiments, the partition 200 has a clearance notch 201 that extends through the two opposing surfaces. The radiator 30 of the electronic control device 100 passes through the clearance notch 201 and extends into the fan cavity, allowing airflow from the fan cavity to pass through the radiator 30. When the impeller rotates, a flowing airflow is formed within the fan cavity. This airflow can directly pass through the radiator 30 located within the fan cavity, quickly carrying away the heat from the radiator 30 and significantly improving heat dissipation efficiency. The design of the radiator 30 passing through the clearance notch 201 utilizes the airflow resources of the fan cavity while preventing the radiator 30 from completely occupying the fan cavity space, thus balancing heat dissipation effect and space utilization.

[0047] Optionally, the partition 200 is provided with one of a buckle 14 and a snap hole 202, and the housing 10 of the electronic control device is provided with the other of the buckle 14 and the snap hole 202. The buckle 14 and the snap hole 202 engage to fix the electronic control device 100 to the partition 200. This engagement allows for quick assembly and disassembly of the electronic control device 100 and the partition 200 without additional tools, facilitating the inspection or replacement of the electronic control device 100 during later maintenance. Simultaneously, the tight engagement of the buckle 14 and the snap hole 202 ensures the stability of the electronic control device 100 during the operation of the outdoor unit of the air conditioner (especially when the fan and compressor are vibrating), preventing the relative position of the radiator 30 and the airflow in the fan cavity from shifting due to loosening, thus ensuring effective airflow for heat dissipation. Furthermore, to enhance the reliability of the fixation, the housing 10 and the partition 200 can also be additionally fixed with screws. Based on the initial positioning and connection achieved by the snap fastener 14, the screw connection can form a rigid constraint, further improving the overall connection strength, effectively addressing the elastic decay problem of the snap fastener 14 that may occur under long-term vibration environment, ensuring the connection stability between the electronic control device 100 and the partition 200, thereby further ensuring the overall operational reliability of the outdoor unit of the air conditioner.

[0048] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0049] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic control device, characterized in that, include: Box body; Circuit board, mounted on the housing; A heat sink is mounted on the housing and located on one side of the circuit board; Multiple power devices, each power device comprising a connected body and pins, the pins of the multiple power devices being connected to the circuit board, the bodies of the multiple power devices being arranged sequentially along the extension direction of one side edge of the circuit board and located outside the edge of the circuit board, and all being in thermal contact with the heat sink; as well as A fixing member is connected to the heat sink and presses against the bodies of the plurality of power devices to press the bodies of the plurality of power devices tightly against the heat sink.

2. The electronic control device as described in claim 1, characterized in that, The fixing component includes a heat-conducting pressure strip and multiple heat dissipation fins. The heat-conducting pressure strip is detachably connected to the heat sink and presses against the bodies of multiple power devices. The multiple heat dissipation fins are spaced apart on the heat-conducting pressure strip.

3. The electronic control device as described in claim 1, characterized in that, The main body has a first connection hole, and the heat sink has a second connection hole corresponding to the first connection hole; The electronic control device also includes fasteners that pass through the first connection hole and the second connection hole to press the body of the power device tightly against the heat sink.

4. The electronic control device as described in claim 1, characterized in that, The pin is bent and has a first end and a second end. The first end is connected to the circuit board, and the second end is bent toward the edge of the circuit board and extends to the outer edge of the circuit board. The body is connected to the second end.

5. The electronic control device as described in claim 4, characterized in that, It also includes low-voltage components, which are connected to the same surface on the circuit board as the first end.

6. The electronic control device as described in any one of claims 1 to 5, characterized in that, The box body is recessed to form a groove, the circuit board is embedded in the groove, and the box body is also provided with an opening that passes through the two opposite surfaces, the opening being located on one side of the groove; The radiator is connected to the surface of the housing facing away from the groove and is at least partially exposed in the opening. The main body passes through the opening and is fitted to the radiator.

7. The electronic control device as described in claim 6, characterized in that, The box body has an elastic buckle on the groove sidewall, which is used to engage with the edge of the circuit board; And / or, the box body is provided with a positioning post on the bottom wall of the groove, the positioning post is provided with a threaded hole, the circuit board is provided with a screw through hole corresponding to the threaded hole, and the circuit board is fixed in the groove by a screw passing through the screw through hole and threadedly engaging with the threaded hole.

8. The electronic control device as described in claim 7, characterized in that, The heat sink includes a substrate and heat sinks connected to the substrate. A limiting groove is formed on the surface of the housing facing away from the groove. The substrate is embedded in the limiting groove, and the heat sinks extend in the direction facing away from the groove. The bottom of the limiting groove is connected to the through-hole, and the body passes through the through-hole and makes thermal contact with the surface of the substrate away from the heat sink.

9. The electronic control device as described in any one of claims 1 to 5, characterized in that, The electronic control device is applied to the outdoor unit of the air conditioner. The circuit board is provided with a frequency conversion circuit and a main control circuit. The frequency conversion circuit and / or the main control circuit includes the power device. The frequency conversion circuit is used to realize the frequency conversion of electrical energy, and the main control circuit is used to control the working state of the frequency conversion circuit.

10. An outdoor unit for an air conditioner, characterized in that, include: The outer casing has a partition inside, which divides the space inside the outer casing into a fan chamber and a compression chamber. The fan chamber is equipped with a fan wheel, and the compression chamber is equipped with a compressor. and The electronic control device according to any one of claims 1 to 9, wherein the electronic control device is installed on the partition and electrically connected to the compressor, and is at least partially located within the fan cavity.

11. The outdoor unit of the air conditioner as described in claim 10, characterized in that, The partition is provided with a clearance notch that runs through the two opposite surfaces. The radiator of the electronic control device passes through the clearance notch and extends into the fan cavity. The airflow in the fan cavity can flow through the radiator.

12. The outdoor unit of the air conditioner as described in claim 11, characterized in that, The partition is provided with one of a buckle and a buckle hole, and the housing of the electronic control device is provided with the other of a buckle and a buckle hole. The buckle and the buckle hole engage to fix the electronic control device to the partition.

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